Heat plate and electronic device

Abstract

The application discloses a vapor chamber and electronic equipment, and relates to the technical field of heat dissipation devices, wherein the vapor chamber comprises a shell and a plurality of capillary structures, the shell comprises an upper shell and a lower shell, the upper shell and the lower shell surround a vacuum cavity, the vacuum cavity is filled with a heat-conducting fluid, and the vapor chamber comprises a bendable section and an unbendable section; the plurality of capillary structures are arranged in the vacuum cavity, and the capillary structures are in contact with the upper shell and the lower shell at least at the bendable section along the height direction of the vapor chamber. The technical scheme provided by the application improves the thinness of the vapor chamber.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to a heat spreader and electronic device. Background Technology

[0002] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. It achieves rapid temperature equalization through the evaporation and condensation circulation of the working fluid within a sealed plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0003] A vapor chamber typically consists of a shell, a wick, and a working fluid. A vacuum chamber is formed within the shell, and both the wick and the working fluid reside within it. The shell is usually made of a material with high thermal conductivity, and the wick is attached to the inner wall of the bottom of the shell. When heat is applied to the bottom of the vapor chamber, the working fluid evaporates, and the vapor rises to the top of the shell. The vapor condenses at the top of the shell, releasing heat. The condensed liquid then flows back to the evaporation surface through the capillary structure of the wick, forming a circulation.

[0004] Currently, most vapor chambers have the liquid wick positioned below the evaporation space within the vacuum chamber, which hinders further thinning of the vapor chamber. Summary of the Invention

[0005] The main objective of this invention is to provide a heat spreader and electronic device that aims to improve the thinness and lightness of the heat spreader.

[0006] To achieve the above objectives, the heat spreader proposed in this embodiment of the invention includes:

[0007] The outer casing includes an upper shell and a lower shell, the upper shell and the lower shell enclosing a vacuum cavity, the vacuum cavity being filled with a heat-conducting fluid; the heat spreader includes a bendable section and a non-bendable section; and

[0008] Multiple capillary structures are disposed within the vacuum cavity, and the capillary structures are in contact with the upper shell and the lower shell at both ends along the height direction of the heat spreader, at least at the bendable section.

[0009] In one embodiment, the capillary structure includes a plurality of spaced-apart first capillary structures and at least one second capillary structure. The first capillary structures extend along the length direction of the heat spreader, and the two ends of the first capillary structure in the height direction are in contact with the upper shell and the lower shell, respectively. The plurality of first capillary structures are connected through the second capillary structure.

[0010] In one embodiment, the first capillary structure extends from one end of the heat spreader to the other end along the length direction of the heat spreader. The first capillary structure has opposing first and second ends, and the second capillary structure is connected to either the first or second end of the first capillary structure.

[0011] In one embodiment, the width of the first capillary structure is D, 0.5mm≤D≤3.0mm; the spacing between adjacent first capillary structures is W, 0.5mm≤W≤3.0mm.

[0012] In one embodiment, the first capillary structure is disposed in the bendable section; in the non-bendable section, the second capillary structure is laid flat on the inner surface of one of the upper shell and the lower shell, and a support structure is provided between the inner surface of the other of the upper shell and the lower shell and the second capillary structure.

[0013] In one embodiment, the support structure includes a plurality of support columns, which are evenly spaced within the vacuum cavity.

[0014] In one embodiment, the first capillary structure has a bending allowance at the bendable section.

[0015] In one embodiment, the second capillary structure and the plurality of first capillary structures are integrally formed.

[0016] In one embodiment, the capillary structure includes, but is not limited to, one or more of a metal mesh structure and a porous structure.

[0017] The present invention also proposes an electronic device, including an electronic body and the aforementioned heat spreader, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

[0018] The technical solution of this invention involves setting an outer shell and multiple capillary structures within a heat spreader. The outer shell comprises a sealed upper shell and a lower shell, with a vacuum cavity enclosing the upper and lower shells. The vacuum cavity is filled with a heat-conducting fluid, and the multiple capillary structures are disposed within the vacuum cavity. The heat spreader includes a bendable section and a non-bendable section. At least at the bendable section, both ends of the capillary structures along the height direction of the heat spreader contact the upper shell and the lower shell, respectively. Thus, compared to the prior art where the vacuum cavity and capillary structures are arranged along the height direction of the heat spreader, this invention arranges the vacuum cavity and capillary structures at least along the length direction of the heat spreader in the bendable section, thereby facilitating the thinning of the heat spreader structure and improving its lightweight and thinness. On the other hand, compared with the existing technology that sets a support structure inside the shell, the upper and lower ends of the capillary structure of the present invention are in contact with the upper shell and the lower shell at least in the bendable section, thereby supporting the upper shell and the lower shell to play a supporting role, avoiding the collapse or damage of the upper shell and the lower shell during the vacuuming process of the vacuum chamber, thus avoiding the use of additional support components, which is conducive to improving the thinness of the heat spreader. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A side view of an embodiment of the bendable section in the heat spreader provided by the present invention;

[0021] Figure 2 A top view of an embodiment of the capillary structure in a heat spreader;

[0022] Figure 3 A top view of another embodiment of the capillary structure in a heat spreader;

[0023] Figure 4 A side view of one embodiment of a non-bendable section in a heat spreader;

[0024] Figure 5 A side view of an embodiment of the capillary structure in a heat spreader;

[0025] Figure 6 A top view of another embodiment of the capillary structure in a heat spreader;

[0026] Figure 7 This is a top view of yet another embodiment of the capillary structure in a heat spreader.

[0027] Explanation of icon numbers:

[0028] 100. Outer shell; 101. Vacuum chamber; 111. First layer structure; 112. Second layer structure; 113. Third layer structure; 121. Upper shell; 122. Lower shell;

[0029] 200. Capillary structure; 210. First capillary structure; 211. First end; 212. Second end; 213. Bending allowance; 220. Second capillary structure;

[0030] 310. Bendable section; 320. Non-bendable section; 400. Support structure; 410. Support column.

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0034] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0035] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. It achieves rapid temperature equalization through the evaporation and condensation circulation of the working fluid within a sealed plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0036] A vapor chamber typically consists of a shell, a wick, and a working fluid. A vacuum chamber is formed within the shell, and both the wick and the working fluid reside within it. The shell is usually made of a material with high thermal conductivity, and the wick is attached to the inner wall of the bottom of the shell. When heat is applied to the bottom of the vapor chamber, the working fluid evaporates, and the vapor rises to the top of the shell. The vapor condenses at the top of the shell, releasing heat. The condensed liquid then flows back to the evaporation surface through the capillary structure of the wick, forming a circulation.

[0037] Currently, most vapor chambers have the liquid wick positioned below the evaporation space within the vacuum chamber, which hinders further thinning of the vapor chamber.

[0038] This invention proposes a heat spreader.

[0039] Please see Figure 1 and Figure 2 In one embodiment of the present invention, the heat spreader includes an outer shell 100 and a plurality of capillary structures 200. The outer shell 100 includes an upper shell 121 and a lower shell 122, which enclose a vacuum cavity 101. The vacuum cavity 101 is filled with a heat-conducting fluid. The heat spreader includes a bendable section 310 and a non-bendable section 320. The plurality of capillary structures 200 are disposed in the vacuum cavity 101. At least at the bendable section 310, both ends of the capillary structures 200 along the height direction of the heat spreader are in contact with the upper shell 121 and the lower shell 122, respectively.

[0040] Specifically, the upper shell 121 and the lower shell 122 are sealed together to form a vacuum chamber 101, and multiple capillary structures 200 are installed within the vacuum chamber 101. Understandably, the outer surface of the lower shell 122 of the vapor chamber is provided with a heat-conducting area for contact with electronic components, to dissipate and conduct heat to the electronic components. That is, the vapor chamber is an evaporation zone near the heat-conducting area and a condensation zone away from the heat-conducting area.

[0041] When the electronic components generate heat, the heat-conducting fluid evaporates into vapor in the heat-conducting area of ​​the lower shell 122 and diffuses within the vacuum chamber 101. The vapor diffuses to the condensation area, contacts the upper shell 121, releases heat, and condenses back into heat-conducting fluid. The condensed heat-conducting fluid then flows back to the heat-conducting area under the capillary action of the capillary structure 200. The returned heat-conducting fluid can participate in the next cycle of evaporation and condensation.

[0042] Understandably, for a vapor chamber to achieve both heat dissipation and heat conduction, its outer shell 100 needs to possess good thermal conductivity. In one embodiment, the upper shell 121 and lower shell 122 have identical structures, which helps improve the molding efficiency of the vapor chamber. In one embodiment, both the upper shell 121 and lower shell 122 include a first layer structure 111 and a second layer structure 112 stacked together. The first layer structure 111 is configured as a metal layer and is located on the side of the second layer structure 112 closest to the vacuum cavity 101. The density of the second layer structure 112 is less than that of the first layer structure 111. Thus, the arrangement of the two layers facilitates the thinning of the outer shell 100. At the same time, the lower density of the second layer structure 112 compared to the first layer structure 111 helps reduce the weight of the outer shell 100, thereby contributing to the thinning and lightening of the vapor chamber. The second layer structure 112 can be a metal layer or a non-metal layer. In one embodiment, the first layer structure 111 is configured as a copper layer, and the second layer structure 112 is configured as an aluminum layer or a polymer film layer.

[0043] In one embodiment, the upper shell 121 and the lower shell 122 further include a third layer structure 113, which is located on the side of the second layer structure 112 opposite to the first layer structure 111. This helps to improve the overall structural strength of the heat spreader. In one embodiment, the third layer structure 113 can be a metallic layer or a non-metallic layer, such as copper, polymer film, ceramic, glass, etc. The material of the third layer structure 113 can be the same as or different from the material of the first layer structure 111. No limitations are placed on the materials of the first layer structure 111, the second layer structure 112, and the third layer structure 113.

[0044] In this invention, the heat spreader is configured as a flexible heat spreader, including a bendable section 310 and a non-bendable section 320. It is understood that, for example, foldable mobile phone products require a bendable heat spreader to achieve better heat dissipation and even heat distribution. The flexible design of the heat spreader expands its applicability.

[0045] It is understood that the heat spreader has a certain height, length, and width, wherein the thickness direction of the heat spreader is also the height direction, which is also the arrangement direction of the upper shell 121 and the lower shell 122; the connection direction of the bendable section 310 and the non-bendable section 320 is also the length direction. In one embodiment, along the length direction of the heat spreader, the heat spreader includes a non-bendable section 320, a bendable section 310, and a non-bendable section 320 connected in sequence. Of course, in other embodiments, the heat spreader may also include a plurality of bendable sections 310 and non-bendable sections 320 arranged in sequence at intervals to adapt to the needs of different electronic components.

[0046] In this invention, along the height direction of the heat spreader, the capillary structure 200 contacts the upper shell 121 and the lower shell 122 at at least both ends of the bendable section 310. Thus, the capillary structure 200 can both redirect the condensed heat-conducting fluid from the condensation zone to the heat-conducting zone and support the upper shell 121 and the lower shell 122, preventing collapse or damage to the upper shell 121 and the lower shell 122 during vacuuming of the vacuum chamber 101. Compared to the prior art where the capillary structure 200 and the vacuum chamber 101 are arranged along the height direction within the outer shell 100, this invention arranges the capillary structure 200 and the vacuum chamber 101 along the length direction, which is beneficial for further reducing the height of the heat spreader, thereby contributing to a thinner and lighter heat spreader.

[0047] The technical solution of this invention involves setting an outer shell 100 and multiple capillary structures 200 within a heat spreader. The outer shell 100 includes an upper shell 121 and a lower shell 122 that are sealed together, with a vacuum cavity 101 formed between the upper shell 121 and the lower shell 122. The vacuum cavity 101 is filled with a heat-conducting fluid, and the multiple capillary structures 200 are disposed within the vacuum cavity 101. The heat spreader includes a bendable section 310 and a non-bendable section 320. The capillary structures 200 are in contact with the upper shell 121 and the lower shell 122 at least at the bendable section 310 along the height direction of the heat spreader. Thus, compared to the prior art where the vacuum cavity 101 and capillary structures 200 are arranged along the height direction of the heat spreader, this invention arranges the vacuum cavity 101 and capillary structures 200 at least along the length direction of the heat spreader in the bendable section 310, thereby facilitating the thinning of the heat spreader structure and improving its lightweight and thinness. On the other hand, compared with the existing technology where a support structure 400 is provided inside the outer shell 100, the upper and lower ends of the capillary structure 200 of the present invention are in contact with the upper shell 121 and the lower shell 122 at least in the bendable section 310, thereby supporting the upper shell 121 and the lower shell 122 to play a supporting role, avoiding the collapse or damage of the upper shell 121 and the lower shell 122 during the vacuuming process of the vacuum chamber 101, thus avoiding the use of additional support members, which is conducive to improving the thinness of the heat spreader.

[0048] Please see Figures 1 to 3 In an embodiment of the present invention, the capillary structure 200 includes a plurality of first capillary structures 210 arranged at intervals and at least one second capillary structure 220. The first capillary structure 210 extends along the length direction of the heat spreader, and the two ends of the first capillary structure 210 in the height direction are in contact with the upper shell 121 and the lower shell 122, respectively. The plurality of first capillary structures 210 are connected through the second capillary structure 220.

[0049] Understandably, after the heat-conducting fluid evaporates upon heating in the heat-conducting zone and diffuses to the condensation zone to condense back into heat-conducting fluid, it needs to flow back to the heat-conducting zone through the capillary force of the capillary structure 200. To ensure the reflux effect of the heat-conducting fluid, all capillary structures 200 within the vacuum cavity 101 must be interconnected. In this invention, the capillary structure 200 includes a plurality of first capillary structures 210 and at least one second capillary structure 220. The plurality of first capillary structures 210 are spaced apart along the width direction of the heat spreader, and all of the plurality of first capillary structures 210 extend along the length direction of the heat spreader. In the height direction of the heat spreader, the upper and lower ends of the plurality of first capillary structures 210 respectively contact the inner sidewall of the upper shell 121 and the inner sidewall of the lower shell 122, so as to provide support for the upper shell 121 and the lower shell 122 simultaneously.

[0050] Multiple first capillary structures 210 are interconnected through second capillary structures 220, as shown in the figures of this invention. Figure 3As shown, there is one second capillary structure 220. Of course, in other embodiments, there can be multiple second capillary structures 220, as long as all the first capillary structures 210 and second capillary structures 220 within the heat spreader are connected. In the embodiment shown in the figures of this invention, the second capillary structure 220 extends along the width direction of the heat spreader. Of course, in other embodiments, the second capillary structure 220 is inclined at a certain angle to the width direction of the heat spreader. As long as the first capillary structures 210 and the second capillary structures 220 can be connected, the heat-conducting fluid generated by condensation in the condensation zone can flow back to the heat-conducting zone.

[0051] Please see Figure 3 In an embodiment of the present invention, the first capillary structure 210 extends from one end of the heat exchange plate to the other end. Along the length direction of the heat exchange plate, the first capillary structure 210 has a first end 211 and a second end 212. The second capillary structure 220 is connected to the first end 211 or the second end 212 of the first capillary structure 210.

[0052] Specifically, in one embodiment, the heat spreader has a non-bendable section 320, a bendable section 310, and another non-bendable section 320 arranged sequentially along its length. A first capillary structure 210 extends from one non-bendable section 320 to the bendable section 310, and then to another non-bendable section 320. That is, in this embodiment, both ends of the first capillary structure 210 in the height direction are in contact with the inner sidewalls of the upper shell 121 and the lower shell 122, respectively, in both the non-bendable section 320 and the bendable section 310. Along the length of the heat spreader, the first capillary structure 210 has opposing first ends 211 and second ends 212. In one embodiment, the second capillary structure 220 is connected to the first end 211 of each first capillary structure 210; in another embodiment, the second capillary structure 220 is connected to the second end 212 of each first capillary structure 210.

[0053] More specifically, along the height direction of the heat spreader, the upper and lower ends of the second capillary structure 220 contact the inner walls of the upper shell 121 and the lower shell 122, respectively, to provide support for the upper shell 121 and the lower shell 122, thereby further improving the structural strength of the heat spreader. It is understandable that in the heat spreader, all capillary structures 200 need to be interconnected to ensure the reflux effect of the condensed heat-conducting fluid; simultaneously, the vacuum cavity 101 also needs to extend and connect along the length of the heat spreader to ensure that the evaporated heat-conducting vapor can diffuse to different locations on the heat spreader, thus ensuring the heat homogenization effect of the heat spreader. Therefore, by placing the second capillary structure 220 at the position of the first end 211 or the second end 212 of the first capillary structure 210, the second capillary structure 220 is prevented from obstructing the connection of the vacuum cavity 101 along its length, thereby ensuring the heat homogenization effect of the heat spreader.

[0054] Please see Figure 3 In an embodiment of the present invention, the width of the first capillary structure 210 is D, 0.5mm≤D≤3.0mm; the spacing between adjacent first capillary structures 210 is W, 0.5mm≤W≤3.0mm.

[0055] Specifically, along the width direction of the heat spreader, the first capillary structure 210 has a certain width D, and there is a certain distance W between adjacent first capillary structures 210. In one embodiment, 0.5mm≤D≤3.0mm and 0.5mm≤W≤3.0mm, which ensures both the reflux effect of the first capillary structure 210 on the condensed heat transfer fluid and provides sufficient support for the upper shell 121 and the lower shell 122. It is worth noting that the width of the first capillary structure 210 and the distance between adjacent first capillary structures 210 can be equal or unequal, and there is no limitation here.

[0056] Please see Figure 4 In an embodiment of the present invention, a first capillary structure 210 is disposed on the bendable section 310; in the non-bendable section 320, a second capillary structure 220 is laid flat on the inner surface of one of the upper shell 121 and the lower shell 122, and a support structure 400 is provided between the inner surface of the other of the upper shell 121 and the lower shell 122 and the second capillary structure 220.

[0057] In one embodiment, only the capillary structure 200 in the bendable section 310 has its two ends in the height direction in contact with the upper shell 121 and the lower shell 122, respectively; the capillary structure 200 in the non-bendable section 320 does not have its two ends in the height direction in contact with the upper shell 121 and the lower shell 122, respectively. Specifically, the first capillary structure 210 is provided in the bendable section 310, and in the non-bendable section 320, the second capillary structure 220 is laid flat on the inner surface of one of the upper shell 121 and the lower shell 122. That is, the width and length of the second capillary structure 220 are the same as the width and length of the non-bendable section 320, and the height of the second capillary structure 220 is less than the height of the first capillary structure 210. Thus, a vacuum cavity 101 is formed between the second capillary structure 220 and the other of the upper shell 121 and the lower shell 122, so that a vacuum cavity 101 is formed in the non-bendable section 320 for vapor diffusion, thereby ensuring the heat uniformity of the heat spreader.

[0058] Meanwhile, a support structure 400 is provided between the second capillary structure 220 and the inner surface of the other of the upper shell 121 and lower shell 122. That is, one end of the support structure 400 contacts the inner surface of the upper shell 121 or lower shell 122, and the other end contacts the second capillary structure 220. In one embodiment, the support structure 400 is fixed to the inner surface of the upper shell 121 or lower shell 122 by welding or bonding, and the other end of the support structure 400 is not connected to the second capillary structure 220. When the heat spreader is evacuated, the support structure 400 and the second capillary structure 220 can come into contact. Of course, in another embodiment, the two ends of the support structure 400 in the height direction can also be connected to the inner surface of the upper shell 121 or lower shell 122 and the second capillary structure 220, respectively. Here, there are no restrictions on the installation method or connection relationship of the support structure 400. Thus, the support structure 400 provides support for the upper shell 121 and lower shell 122 of the inflexible section 320, preventing the upper shell 121 and lower shell 122 from collapsing and being damaged when the heat spreader is vacuumed.

[0059] In an embodiment of the present invention, the support structure 400 includes a plurality of support columns 410, which are evenly spaced within the vacuum cavity 101.

[0060] Specifically, in one embodiment, the support structure 400 includes a plurality of spaced-apart support columns 410. The support columns 410 can be copper columns, graphene with a metal coating, etc., and the specific material of the support columns 410 is not limited here. In one embodiment, the support columns 410 are arranged in a matrix within the vacuum cavity 101, and the arrangement of the support columns 410 is not limited here. Of course, in other embodiments, the support structure 400 can also be configured as a support mesh, support strips, etc.

[0061] Please see Figures 5 to 7 In an embodiment of the present invention, the first capillary structure 210 is provided with a bending allowance 213 at the bendable section 310.

[0062] Understandably, to improve the bending performance of the bendable section 310 and extend the service life of the heat spreader, the first capillary structure 210 has a bending allowance 213 in the bendable section 310. In one embodiment, the first capillary structure 210 is arranged in a wave-like pattern along the height direction of the heat spreader in the bendable section 310. The height of the wave structure, that is, the distance between the upper and lower peaks of the wave structure, is greater than or equal to or less than the distance between the inner walls of the upper shell 121 and the inner walls of the lower shell 122, and is not limited here.

[0063] In another embodiment, the first capillary structure 210 has a wavy structure in the width direction of the heat spreader, thus providing a bending allowance 213 for bending the first capillary structure 210 and improving the bending performance of the heat spreader. In another embodiment, the first capillary structure 210 has a first end 211 and a second end 212 disposed opposite to each other in the length direction of the heat spreader. In the direction from the first end 211 to the second end 212, the first capillary structure 210 is inclined at a certain angle to the length direction of the heat spreader. This makes the overall length of the first capillary structure 210 longer than when the line connecting the first end 211 and the second end 212 is parallel to the length direction of the heat spreader, so as to provide a bending allowance 213 and improve the bending performance of the heat spreader. The tilt angle and tilt direction of the first capillary structure 210 are not limited here.

[0064] In another embodiment, the first capillary structure 210 is provided with bending allowance 213 in both the height and width directions of the heat spreader, thereby further improving the bending performance of the heat spreader.

[0065] In an embodiment of the present invention, the second capillary structure 220 and the plurality of first capillary structures 210 are an integral structure. This integral arrangement of the second capillary structure 220 and the plurality of first capillary structures 210 simplifies the molding of the capillary structure 200 and facilitates the molding of the heat spreader. Of course, in other embodiments, the second capillary structure 220 and the plurality of first capillary structures 210 can also be independent structures, connected to each other by welding, bonding, or hot pressing.

[0066] In embodiments of the present invention, the capillary structure 200 includes, but is not limited to, one or more of a metal mesh structure and a porous structure.

[0067] Specifically, the capillary structure 200 can be one or more of the following: metal (copper, aluminum, steel, etc.), ceramic (alumina, silicon oxide, etc.), composite material (copper-based, aluminum-based composite material, silicon carbide particle-reinforced alumina composite material, etc.), porous material (sintered copper, porous alumina, etc.), polymer (polyimide, polytetrafluoroethylene, etc.). The capillary structure 200 can be fabricated through different processes, such as sintering, copper mesh, etching, etc., to meet the requirements of efficient heat dissipation.

[0068] The present invention also proposes an electronic device comprising an electronic body and a heat spreader. The specific structure of the heat spreader is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. The heat spreader is installed in the heating area of ​​the electronic body.

[0069] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat spreader, characterized in that, include: The outer shell includes an upper shell and a lower shell, the upper shell and the lower shell enclosing a vacuum cavity, the vacuum cavity being filled with a heat-conducting fluid, and the heat spreader including a bendable section and a non-bendable section; as well as Multiple capillary structures are disposed within the vacuum cavity, and the capillary structures are in contact with the upper shell and the lower shell at both ends along the height direction of the heat spreader, at least at the bendable section.

2. The heat spreader as described in claim 1, characterized in that, The capillary structure includes a plurality of spaced-apart first capillary structures and at least one second capillary structure. The first capillary structure extends along the length of the heat spreader and its two ends in the height direction are in contact with the upper shell and the lower shell, respectively. The plurality of first capillary structures are connected through the second capillary structure.

3. The heat spreader as described in claim 2, characterized in that, The first capillary structure extends from one end of the heat spreader to the other end along the length of the heat spreader. The first capillary structure has a first end and a second end opposite to each other. The second capillary structure is connected to the first end or the second end of the first capillary structure.

4. The heat spreader as described in claim 2, characterized in that, The width of the first capillary structure is D, 0.5mm≤D≤3.0mm; the spacing between adjacent first capillary structures is W, 0.5mm≤W≤3.0mm.

5. The heat spreader as described in claim 2, characterized in that, The first capillary structure is disposed in the bendable section; in the non-bendable section, the second capillary structure is laid flat on the inner surface of one of the upper shell and the lower shell, and a support structure is provided between the inner surface of the other of the upper shell and the lower shell and the second capillary structure.

6. The heat spreader as described in claim 5, characterized in that, The support structure includes multiple support columns, which are evenly spaced within the vacuum cavity.

7. The heat spreader as described in claim 2, characterized in that, The first capillary structure has a bending allowance at the bendable section.

8. The heat spreader as described in claim 2, characterized in that, The second capillary structure and the first capillary structure are an integral structure.

9. The heat spreader as described in claim 8, characterized in that, The capillary structure includes, but is not limited to, one or more of the following: metal mesh structure and porous structure.

10. An electronic device, characterized in that, It includes an electronic body and a heat spreader as described in any one of claims 1 to 9, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

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