Heat conduction module and electronic device with the same

Abstract

The application provides a heat conduction module and an electronic device with the same. The electronic device comprises the heat conduction module and a heat dissipation module. The heat conduction module comprises a heat spreader and a plurality of heat pipes. The heat spreader comprises a hollow shell and a plurality of capillary structures. The hollow shell comprises a first outer surface and a second outer surface, the first outer surface is adapted to contact a temperature-controlled component, and the plurality of capillary structures are located in the hollow shell. The heat pipes are arranged on the second outer surface of the hollow shell and correspond to the plurality of capillary structures respectively. The hollow shell comprises a heat source area corresponding to the temperature-controlled component. The maximum heat transfer in the heat source area is less than that of an area other than the heat source area. The heat dissipation module is connected to the plurality of heat pipes of the heat conduction module.

Description

Technical Field

[0001] This invention relates to a thermally conductive module and an electronic device having the module. Background Technology

[0002] With the development of high-performance computing technology, the power consumption of computing devices continues to rise, especially as processors generate a large amount of heat when performing high-load operations. Failure to effectively manage this heat can affect system stability, reduce computing performance, and even shorten the lifespan of the device. Therefore, improving heat dissipation technology to ensure stable system operation over extended periods has become a critical issue.

[0003] Vapor chamber technology enables rapid heat transfer through the phase change mechanism of its internal working fluid. However, existing vapor chamber technologies still have room for improvement in terms of heat conduction efficiency and temperature uniformity. On the other hand, heat pipes, as highly efficient heat transfer elements, can conduct heat from high-temperature areas to distant low-temperature areas for dissipation. However, when dealing with areas of localized high heat flux density, heat pipes alone may not provide sufficient heat dissipation capacity.

[0004] Therefore, in order to fully leverage the advantages of both vapor chambers and heat pipes, developing a novel composite heat transfer structure to improve overall heat dissipation performance and enhance heat conduction uniformity has become a research focus in the industry. Summary of the Invention

[0005] In view of the above, the object of the present invention is to provide a thermally conductive module and an electronic device having the module, which can completely solve the above problems.

[0006] Some embodiments of the present invention provide a heat-conducting module including a vapor chamber and a plurality of heat pipes. The vapor chamber includes a hollow shell and a plurality of capillary structures. The hollow shell includes a first outer surface and a second outer surface. The first outer surface is adapted to contact the controlled object being heated. The plurality of capillary structures are located inside the hollow shell. The plurality of heat pipes are disposed on the second outer surface of the hollow shell and correspond to the plurality of capillary structures respectively. The hollow shell includes a heat source region corresponding to the controlled object being heated; and the maximum heat transfer within the heat source region is less than the maximum heat transfer corresponding to the region outside the heat source region.

[0007] Some embodiments of the present invention provide a heat-conducting module including a vapor chamber and a plurality of heat pipes. The vapor chamber includes a hollow shell and a plurality of capillary structures. The hollow shell includes a first outer surface and a second outer surface, the first outer surface being adapted to contact the controlled object being heated, and the plurality of capillary structures being located within the hollow shell. The plurality of heat pipes are disposed on the second outer surface of the hollow shell and correspond to the plurality of capillary structures respectively. The hollow shell includes a heat source region corresponding to the controlled object being heated. The maximum heat transfer of the plurality of heat pipes corresponding to the heat source region is less than the maximum heat transfer of the plurality of heat pipes corresponding to the region outside the heat source region.

[0008] Some embodiments of the present invention provide an electronic device including the aforementioned thermally conductive module and a heat dissipation module. The heat dissipation module is connected to a plurality of heat pipes in the thermally conductive module.

[0009] In summary, the heat-conducting module and electronic device containing the module provided in some embodiments significantly improve the heat conduction efficiency and temperature uniformity of the vapor chamber and heat pipe combination system, thereby effectively overcoming the technical challenges of heat dissipation from high-density heat sources. Compared with the prior art, the present invention can achieve more efficient thermal management in a more compact space, which helps to improve system stability and extend equipment life. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of the first embodiment of the thermal conductive module of the present invention.

[0011] Figure 2A This is a cross-sectional view of the second embodiment of the thermal conductive module of the present invention.

[0012] Figure 2B This is an exploded perspective view of the second embodiment of the thermal conductive module of the present invention.

[0013] Figure 3A This is a cross-sectional view of the third embodiment of the thermal conductive module of the present invention.

[0014] Figure 3B for Figure 3A A magnified view of a portion of region 3B.

[0015] Figure 4 This is a cross-sectional view of the fourth embodiment of the thermal conductive module of the present invention.

[0016] Figure 5A This is a cross-sectional view of the fifth embodiment of the thermal conductive module of the present invention.

[0017] Figure 5B This is a partial perspective view of the fifth embodiment of the heat-conducting module of the present invention, which shows the perforated plate, heat pipe and partial hollow shell.

[0018] Figure 6A This is a cross-sectional view of the sixth embodiment of the thermal conductive module of the present invention.

[0019] Figure 6B This is an exploded perspective view of the sixth embodiment of the thermal conductive module of the present invention.

[0020] Figure 7 This is a cross-sectional view of the seventh embodiment of the thermal conductive module of the present invention.

[0021] Figure 8A This is a cross-sectional view of the eighth embodiment of the thermal conductive module of the present invention.

[0022] Figure 8B for Figure 8A A magnified view of a portion of region 8B.

[0023] Figure 9 This is a cross-sectional view of the 9th embodiment of the thermal conductive module of the present invention.

[0024] Figure 10 This is a perspective view of an embodiment of the electronic device of the present invention.

[0025] The attached figures are labeled as follows:

[0026] 1: Thermal conductive module

[0027] 2: Heat spreader

[0028] 3: Heat pipe

[0029] 4: Perforated plate

[0030] 5,221: Columnar structure

[0031] 6: Heat dissipation module

[0032] 7: Electronic devices

[0033] 21: Hollow shell

[0034] 22: Capillary structure

[0035] 30: Capillary structure of the tube wall

[0036] 40, 50, 222: Porous sintered layers

[0037] 41: Hole

[0038] 210: Inner surface

[0039] 211: First outer surface

[0040] 212: Second outer surface

[0041] 223: Strip-like structure

[0042] C: Temperature-controlled control

[0043] G: Trench

[0044] Lw: Working fluid

[0045] Zh: Heat source area Detailed Implementation

[0046] Various embodiments are described in detail below. These embodiments are merely illustrative and do not limit the scope of protection intended by the present invention. Furthermore, some elements are omitted in the accompanying drawings of the embodiments to clearly show the technical features of the present invention. Moreover, the same reference numerals will be used to denote the same or similar elements in all the drawings, and the drawings of the present invention are for illustrative purposes only, are not necessarily drawn to scale, and not all details may be shown in the drawings.

[0047] Please see Figure 1 . Figure 1 This is a cross-sectional view of a first embodiment of the heat-conducting module of the present invention. In some embodiments, the heat-conducting module 1 includes a heat spreader 2 and a plurality of heat pipes 3, as shown in the figure. The heat spreader 2 includes a hollow shell 21 and a plurality of capillary structures 22. The hollow shell 21 has a first outer surface 211 and a second outer surface 212. The first outer surface 211 may be a lower surface, and the second outer surface 212 may be an upper surface. In some embodiments, the first outer surface 211 may also be an upper surface, and the second outer surface 212 may be a lower surface. The following description will use the first outer surface 211 as the lower surface and the second outer surface 212 as the upper surface. The first outer surface 211 (lower surface) is used to contact a temperature-controlled device C.

[0048] Multiple capillary structures 22 are located within the hollow shell 21. Multiple heat pipes 3 are disposed on the second outer surface 212 (upper surface) of the hollow shell 21 and correspond to the multiple capillary structures 22 respectively. The hollow shell 21 contains a heat source region Zh. The heat source region Zh corresponds to the temperature control C. The maximum heat transfer capacity (Qmax) within the heat source region Zh is less than the maximum heat transfer capacity of the region outside the heat source region Zh (hereinafter referred to as the non-heat source region). In some embodiments, the capillary force of the multiple capillary structures 22 located within the heat source region Zh is less than the capillary force of the multiple capillary structures 22 located in the non-heat source region.

[0049] In other words, the maximum heat transfer rate in the heat source region Zh and the non-heat source region can be different. In some embodiments, the heat spreader 2 can be provided with capillary structures 22 with different capillary forces in the heat source region Zh and the non-heat source region. For example, capillary structures 22 with different volumes, different types, or different porosities can be provided in the heat source region Zh and the non-heat source region. Figure 1 The embodiment shown achieves different maximum heat transfer rates by setting capillary structures 22 of different volumes in the heat source region Zh and the non-heat source region.

[0050] For example, such as Figure 1 As shown, the capillary structure 22 comprises multiple columnar structures 221. Each columnar structure 221 is covered with a porous sintered layer 222. The outer surface area of ​​the multiple columnar structures 221 located in the heat source region Zh is smaller than that of the multiple columnar structures 221 located in the non-heat source region. That is, the size (diameter) of the multiple columnar structures 221 located in the heat source region Zh is smaller than that of the multiple columnar structures 221 located in the non-heat source region. Therefore, the porous sintered layer 222 covering the columnar structures 221 with smaller outer surface areas has a smaller volume and lower capillary force. Conversely, the porous sintered layer 222 covering the columnar structures 221 with larger outer surface areas has a larger volume and higher capillary force. Thus, the columnar structures 221 with higher capillary force have a larger maximum heat transfer capacity and can conduct more heat energy. Conversely, the columnar structures 221 with lower capillary force have a smaller maximum heat transfer capacity and can conduct relatively less heat energy. Therefore, different volumes of porous sintered layers 222 are coated on the columnar structures 221 in different regions to achieve different maximum heat transfer rates.

[0051] The heat source region Zh directly corresponds to the heated control C. This means the heat spreader 2 is in direct contact with the heated control C, and the heat source region Zh is adjacent to the contact point between the heated control C and the heat spreader 2. Therefore, the heat source region Zh will be heated first, and its temperature is usually higher than that of areas outside the heat source region Zh. However, by setting the maximum heat transfer within the heat source region Zh to be less than the maximum heat transfer within the non-heat source region, the temperature distribution of the heat spreader 2 can be made more uniform. That is, the porous sintered layer 222 covering the columnar structure 221 within the heat source region Zh has a smaller volume, while the porous sintered layer 222 covering the columnar structure 221 in the non-heat source region has a larger volume. In this way, the heat conduction to the heat pipes 3 at different locations on the second outer surface 212 tends to be consistent, thereby improving the overall heat dissipation effect and efficiency.

[0052] In some embodiments, the porous sintered layer 222 may be a sintered metal powder body. In other embodiments, the porous sintered layer 222 may also be replaced by a metal mesh, a grooved structure, a porous fiber structure, or other composite capillary structure. Each columnar structure 221 is directly connected to the upper and lower inner surfaces of the hollow shell 21. Therefore, the columnar structure 221 provides a supporting effect and restrains the hollow shell 21. This prevents the hollow shell 21 from bursting due to the thermal expansion and evaporation of the working fluid Lw. The working fluid Lw may be water, ammonia, methanol, ethanol, acetone, or other suitable fluids.

[0053] Please also refer to Figure 2A and Figure 2B . Figure 2A This is a cross-sectional view of the second embodiment of the thermal conductive module of the present invention. Figure 2BThis is an exploded perspective view of the second embodiment of the heat-conducting module of the present invention. The main difference between the second embodiment and the first embodiment lies in the morphology and configuration of the capillary structures. In the second embodiment, each capillary structure 22 comprises multiple strip structures 223. The strip structures 223 are spaced apart from each other, forming multiple grooves G. These grooves G constitute the capillary structure 22. The aspect ratio of the multiple strip structures 223 located in the heat source region Zh is smaller than the aspect ratio of the multiple strip structures 223 located in the non-heat source region. As a result, the heat source region Zh and the non-heat source region form different maximum heat transfer amounts.

[0054] In some embodiments, a plurality of capillary structures 22 are disposed on an inner surface 210 of the hollow shell 21. The inner surface 210 corresponds to the second outer surface 212. The capillary force of the plurality of capillary structures 22 gradually increases from the heat source region Zh toward the four circumferential sides of the hollow shell 21. This arrangement is intended because the temperature distribution of the heat spreader 2 gradually decreases radially from the heat source region Zh. Therefore, by gradually increasing the capillary force of the plurality of capillary structures 22 from the heat source region Zh toward the four circumferential sides of the hollow shell 21, better temperature uniformity can be achieved. For example, the width-to-depth ratio of the strip structure 223 disposed in the heat source region Zh is small (smaller capillary force), while the width-to-depth ratio of the strip structure 223 disposed in the non-heat source region is large (larger capillary force). In this way, less heat energy can be conducted in the heat source region Zh, and more heat energy can be conducted in the non-heat source region.

[0055] Please see Figure 3A and Figure 3B . Figure 3A This is a cross-sectional view of the third embodiment of the thermal conductive module of the present invention. Figure 3B for Figure 3A A partial enlarged view of region 3B. The difference between the third embodiment and the second embodiment is that the surface of each strip structure 223 is covered with a porous sintered layer 222. The porosity of the porous sintered layer 222 of the multiple strip structures 223 located in the heat source region Zh is greater than the porosity of the porous sintered layer 222 of the multiple strip structures 223 located in the non-heat source region.

[0056] In other words, the third embodiment employs a composite capillary structure 22. This capillary structure 22 includes a groove structure and a sintered metal powder body. Therefore, in some embodiments, the capillary force can be changed by adjusting the aspect ratio of the grooves G formed by the plurality of strip structures 223. Furthermore, the capillary force can also be changed by adjusting the porosity of the porous sintered layer 222. This allows for different maximum heat transfer rates between the heat source region Zh and the non-heat source region.

[0057] To further explain, if a sintered metal powder body is used as the capillary structure 22, the larger the porosity, the larger the pore size in the capillary structure 22. This leads to a weakening of capillary force, affecting the reflux efficiency of the working fluid Lw, thereby reducing the maximum heat transfer. Therefore, in some embodiments, the capillary force of the capillary structure 22 can be adjusted by setting the porosity of the sintered metal powder body.

[0058] Please see Figure 4 . Figure 4 This is a cross-sectional view of the fourth embodiment of the heat-conducting module of the present invention. The difference between the fourth embodiment and the first embodiment is that the maximum heat transfer is adjusted only by changing the porosity of the porous sintered layer 222. Specifically, in this embodiment, each capillary structure 22 includes multiple columnar structures 221. The dimensions of each columnar structure 221 can be the same. The surface of the columnar structure 221 is covered with a porous sintered layer 222. The porosity of the porous sintered layer 222 of the multiple columnar structures 221 located in the heat source region Zh is greater than the porosity of the porous sintered layer 222 of the multiple columnar structures 221 located in the non-heat source region.

[0059] In other words, in this embodiment, different capillary forces are achieved by adjusting only the porosity of the porous sintered layer 222. Furthermore, in other embodiments, the volume (thickness) of the porous sintered layer 222 of the multiple strip structures 223 can also be changed individually. An increase in the volume of the porous sintered layer 222 generally means an increase in the total surface area and number of pores of the capillary structures 22, which enhances capillary forces, improves the reflux efficiency of the working fluid Lw, and thus increases the maximum heat transfer. Additionally, capillary forces and maximum heat transfer can also be altered by adjusting the pore size, distribution, or pore connectivity of the porous sintered layer 222.

[0060] Please also refer to Figure 5A and Figure 5B . Figure 5A This is a cross-sectional view of the fifth embodiment of the thermal conductive module of the present invention. Figure 5B This is a partial perspective view of the fifth embodiment of the heat-conducting module of the present invention, showing the perforated plate, heat pipe, and partial hollow shell. As shown, each capillary structure 22 includes a perforated plate 4. Each perforated plate 4 has multiple holes 41. The hollow portion formed by the multiple holes 41 of the perforated plate 4 located in the heat source region Zh is larger than the hollow portion formed by the multiple holes 41 of the perforated plate 4 located in the non-heat source region. The surface of each perforated plate 4 is covered with a porous sintered layer 40.

[0061] The perforated portion of the perforated plate 4 determines its steam capture capability. Larger or more numerous holes 41 result in a larger perforated portion and a smaller area for steam capture. Therefore, when the perforated plate 4 is paired with a porous sintered layer 40, a smaller area for steam capture also results in a smaller area of ​​the porous sintered layer 40. This leads to a weakened steam capture capability, and consequently, a decrease in capillary force and maximum heat transfer. Conversely, smaller or fewer holes 41 result in a smaller perforated portion and a larger area for steam capture. Therefore, a larger area for steam capture also results in a larger area of ​​the porous sintered layer 40. This leads to an increased steam capture capability, and consequently, a greater capillary force and maximum heat transfer. Therefore, in some embodiments, the capillary force and maximum heat transfer can be altered by adjusting the perforated portion of the perforated plate 4.

[0062] Please also refer to Figure 6A and Figure 6B . Figure 6A This is a cross-sectional view of the sixth embodiment of the thermal conductive module of the present invention. Figure 6B This is an exploded perspective view of the sixth embodiment of the thermal conductive module of the present invention. The main difference between this embodiment and the fifth embodiment is that the perforated plate 4 itself does not have a porous sintered layer 40, but instead has multiple columnar structures 5 on opposite sides of the perforated plate 4, and a porous sintered layer 50 is provided on the columnar structures 5.

[0063] Specifically, as shown in the figure, each capillary structure 22 includes multiple perforated plates 4 and multiple columnar structures 5. The multiple columnar structures 5 are arranged on opposite sides of the perforated plates 4. The surface of each columnar structure 5 is covered with a porous sintered layer 50. Therefore, the perforated plates 4 are responsible for regulating the flow of steam. The porous sintered layer 50 on the multiple columnar structures 5 is responsible for capturing steam, causing it to condense into water and flow back to the bottom of the hollow shell 21.

[0064] The perforated portion formed by the multiple holes 41 of the perforated plate 4 located in the heat source region Zh is relatively large. Therefore, steam can pass through quickly. This results in less steam being captured by the porous sintered layer 50 on the columnar structure 5, and a smaller maximum heat transfer rate. Conversely, as one moves away from the heat source region Zh, the perforated portion formed by the multiple holes 41 of the perforated plate 4 gradually becomes smaller. This results in more steam being captured by the porous sintered layer 50 on the columnar structure 5, and a gradually increasing maximum heat transfer rate.

[0065] Please see Figure 7 . Figure 7 This is a cross-sectional view of the seventh embodiment of the heat-conducting module of the present invention. The main difference between this embodiment and the previous embodiments is that by changing the maximum heat transfer of the heat pipes 3, the temperature distribution of the heat spreader 2 is made more uniform, thereby improving the overall heat dissipation effect and efficiency. In some embodiments, the maximum heat transfer of the multiple heat pipes 3 gradually increases from the heat source region Zh towards the four circumferential sides of the heat spreader 2.

[0066] As shown in the figure, the heat-conducting module 1 includes a heat spreader 2 and multiple heat pipes 3. The heat spreader 2 includes a hollow shell 21 and multiple capillary structures 22. The hollow shell 21 has a first outer surface 211 and a second outer surface 212. The first outer surface 211 is adapted to contact the controlled object C. The multiple capillary structures 22 are located inside the hollow shell 21. The multiple heat pipes 3 are disposed on the second outer surface 212 of the hollow shell 21 and correspond to the multiple capillary structures 22 respectively. The hollow shell 21 contains a heat source region Zh. The heat source region Zh corresponds to the controlled object C. The maximum heat transfer of the multiple heat pipes 3 corresponding to the heat source region Zh is less than the maximum heat transfer of the multiple heat pipes 3 corresponding to the non-heat source region.

[0067] Therefore, in some embodiments, heat pipes 3 with different maximum heat transfer rates can be set according to different regions or locations. This can make the heat conduction of multiple heat pipes 3 more consistent, thereby improving the overall heat dissipation effect and efficiency. The maximum heat transfer rate of heat pipe 3 can be adjusted from aspects such as the material of heat pipe 3, working fluid Lw, capillary structure 22, and size and shape.

[0068] exist Figure 7 In the illustrated embodiment, the maximum heat transfer is controlled by changing the size of the heat pipes 3. Specifically, as shown in the figure, the diameter of the heat pipes 3 corresponding to the heat source region Zh is smaller than the diameter of the heat pipes 3 corresponding to the non-heat source region. The diameter of the heat pipes 3 gradually increases as one moves away from the heat source region Zh. The maximum heat transfer of the heat pipes 3 with smaller diameters is less than that of the heat pipes 3 with larger diameters. Therefore, the maximum heat transfer of the heat pipes 3 corresponding to the heat source region Zh is less than that of the heat pipes 3 corresponding to the non-heat source region.

[0069] Please see Figure 8A and Figure 8B . Figure 8A This is a cross-sectional view of the eighth embodiment of the thermal conductive module of the present invention. Figure 8B for Figure 8A A magnified view of region 8B. The main difference between this embodiment and the previous embodiments is that the maximum heat transfer of heat pipe 3 is adjusted by changing the working fluid Lw inside heat pipe 3. Different working fluids Lw exhibit different maximum heat transfer rates due to their different latent heats. For example, the latent heat of vaporization of water is approximately 2257 kJ / kg (at 100°C), ammonia is approximately 1370 kJ / kg (at -33.34°C), methanol is approximately 1100 kJ / kg (at 64.7°C), ethanol is approximately 846 kJ / kg (at 78.37°C), and acetone is approximately 518 kJ / kg (at 56°C). Therefore, the maximum heat transfer rate of multiple heat pipes 3 can be adjusted by filling them with different working fluids Lw.

[0070] Furthermore, it can be combined with specific capillary structures 22 within the heat spreader 2 to achieve better temperature uniformity. For details, please refer to [link / reference needed]. Figure 8A Multiple capillary structures 22 are disposed on an inner surface 210 of the hollow shell 21. The inner surface 210 corresponds to the second outer surface 212. The capillary force of the multiple capillary structures 22 located in the heat source region Zh is less than the capillary force of the multiple capillary structures 22 located in the non-heat source region.

[0071] Each capillary structure 22 comprises multiple strip structures 223. These strip structures 223 are spaced apart to form multiple grooves G. The aspect ratio of the strip structures 223 located in the heat source region Zh is smaller than that of the strip structures 223 located in the non-heat source region. Therefore, capillary force and maximum heat transfer can be adjusted by changing the aspect ratio of the grooves G.

[0072] Furthermore, capillary force and maximum heat transfer can also be adjusted by changing the porosity of capillary structure 22. Specifically, such as... Figure 8A As shown, the surface of each strip structure 223 is covered with a porous sintered layer 222. The porosity of the porous sintered layer 222 of the multiple strip structures 223 located in the heat source region Zh is greater than that of the porous sintered layer 222 of the multiple strip structures 223 located in the non-heat source region.

[0073] Please see Figure 9 . Figure 9 This is a cross-sectional view of the ninth embodiment of the heat-conducting module of the present invention. The main difference between this embodiment and the previous embodiments is that the maximum heat transfer of the heat pipe 3 is adjusted by changing the capillary force of the capillary structure inside the heat pipe 3. This enables the maximum heat transfer of multiple heat pipes 3 corresponding to the heat source region Zh to be less than the maximum heat transfer of multiple heat pipes 3 corresponding to the non-heat source region.

[0074] Specifically, in this embodiment, each heat pipe 3 includes a pipe wall capillary structure 30. The capillary force of the pipe wall capillary structures 30 in the multiple heat pipes 3 corresponding to the heat source region Zh is less than that in the multiple heat pipes 3 corresponding to the non-heat source region. The capillary force of the pipe wall capillary structures 30 inside the heat pipe 3 can be adjusted by changing parameters such as the pore size, shape and arrangement, material (wetting and contact angle), structural thickness and uniformity of the pipe wall capillary structures 30.

[0075] In addition, it can be combined with a specific capillary structure 22 within the heat spreader 2 to achieve better temperature uniformity. For details, please refer to [link / reference needed]. Figure 9Each capillary structure 22 includes a perforated plate 4. Each perforated plate 4 has multiple holes 41. The perforated portion formed by the multiple holes 41 of the perforated plate 4 located in the heat source region Zh is larger than the perforated portion formed by the multiple holes 41 of the perforated plate 4 located in the non-heat source region. Each perforated plate 4 is coated with a porous sintered layer 40.

[0076] Therefore, the perforated plate 4 with a larger perforation portion has a lower maximum heat transfer due to the smaller total surface area of ​​the porous sintered layer 40. Conversely, the perforated plate 4 with a smaller perforation portion has a higher maximum heat transfer due to the larger total surface area of ​​the porous sintered layer 40. Thus, under the combined capillary forces of the heat pipe 3 and the internal capillary structures (capillary structure 22 and pipe wall capillary structure 30) of the heat spreader 2, the change in maximum heat transfer produced by the combination of the two is more significant, resulting in better temperature uniformity of the heat conduction module 1.

[0077] Please see Figure 10 . Figure 10 This is a perspective view of an embodiment of the electronic device of the present invention. As shown, in some embodiments, the electronic device 7 includes a heat-conducting module 1 and a heat-dissipating module 6. The heat-conducting module 1 can be in any of the forms described in the foregoing embodiments. The heat-dissipating module 6 is connected to a plurality of heat pipes 3 of the heat-conducting module 1. In this embodiment, after the heat-conducting module 1 absorbs heat from the temperature-controlled device C, the heat is conducted to the heat-dissipating module 6 through the heat spreader 2 and the plurality of heat pipes 3, and the heat-dissipating module 6 then dissipates the heat. In some embodiments, the heat-dissipating module 6 can be a water-cooling module, which exchanges heat with the heat pipes 3 through cooling water. In other embodiments, the heat-dissipating module 6 can also be a heat sink combined with a fan.

[0078] In summary, the heat-conducting module 1 and the electronic device 7 containing this module, provided in some embodiments, significantly improve the heat conduction efficiency and temperature uniformity of the combined system of the heat spreader 2 and the heat pipe 3, thereby effectively overcoming the technical challenge of heat dissipation from high-density heat sources. Compared to the prior art, the present invention can achieve more efficient thermal management in a more compact space, which helps to improve system stability and extend equipment life.

[0079] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A thermally conductive module, characterized in that, include: A temperature distribution plate includes a hollow shell and a plurality of capillary structures. The hollow shell includes a first outer surface and a second outer surface. The first outer surface is adapted to contact a temperature-controlled object. The plurality of capillary structures are located inside the hollow shell. as well as Multiple heat pipes are disposed on the second outer surface of the hollow shell and correspond to the multiple capillary structures respectively; The hollow shell includes a heat source region corresponding to the temperature control; and the maximum heat transfer within the heat source region is less than the maximum heat transfer corresponding to the region outside the heat source region.

2. The thermally conductive module as described in claim 1, characterized in that, The capillary force of the multiple capillaries located within the heat source region is less than the capillary force of the multiple capillaries located outside the heat source region.

3. The thermally conductive module as described in claim 2, characterized in that, The plurality of capillary structures are disposed on an inner surface of the hollow shell, the inner surface corresponding to the second outer surface; and the capillary force of the plurality of capillary structures gradually increases from the heat source region toward the four circumferential sides of the hollow shell.

4. The thermally conductive module as described in claim 2, characterized in that, Each capillary structure includes a plurality of strip structures, which are spaced apart to form a plurality of grooves; wherein the aspect ratio of the plurality of strip structures located within the heat source region is smaller than the aspect ratio of the plurality of strip structures located outside the heat source region.

5. The thermally conductive module as described in claim 2, characterized in that, Each capillary structure includes a plurality of strip structures, which are spaced apart to form a plurality of grooves; each strip structure is covered with a porous sintered layer; wherein the porosity of the porous sintered layer of the plurality of strip structures located in the heat source region is greater than the porosity of the porous sintered layer of the plurality of strip structures located outside the heat source region.

6. The thermally conductive module as described in claim 2, characterized in that, Each capillary structure includes a plurality of columnar structures; the surface of each columnar structure is covered with a porous sintered layer; wherein the porosity of the porous sintered layer of the plurality of columnar structures located within the heat source region is greater than the porosity of the porous sintered layer of the plurality of columnar structures located outside the heat source region.

7. The thermally conductive module as described in claim 2, characterized in that, Each capillary structure includes a plurality of columnar structures; the surface of each columnar structure is covered with a porous sintered layer; wherein the outer surface area of ​​the plurality of columnar structures located within the heat source region is smaller than the outer surface area of ​​the plurality of columnar structures located outside the heat source region.

8. The thermally conductive module as described in claim 2, characterized in that, Each capillary structure includes a perforated plate; each perforated plate includes a plurality of holes; wherein a hollow portion formed by the plurality of holes of the perforated plate located within the heat source region is larger than a hollow portion formed by the plurality of holes of the perforated plate located outside the heat source region.

9. The thermally conductive module as described in claim 8, characterized in that, Each perforated plate surface is coated with a porous sintered layer.

10. The thermally conductive module as described in claim 8, characterized in that, Each capillary structure also includes a plurality of columnar structures disposed on corresponding sides of the orifice plate, and each columnar structure is covered with a porous sintered layer.

11. A thermally conductive module, characterized in that, include: A temperature distribution plate includes a hollow shell and a plurality of capillary structures. The hollow shell includes a first outer surface and a second outer surface. The first outer surface is adapted to contact a temperature-controlled object. The plurality of capillary structures are located inside the hollow shell. as well as Multiple heat pipes are disposed on the second outer surface of the hollow shell and correspond to the multiple capillary structures respectively; The hollow shell includes a heat source region corresponding to the temperature control; and the maximum heat transfer of the plurality of heat pipes corresponding to the heat source region is less than the maximum heat transfer of the plurality of heat pipes corresponding to the region outside the heat source region.

12. The thermally conductive module as described in claim 11, characterized in that, The diameter of the plurality of heat pipes corresponding to the heat source area is smaller than the diameter of the plurality of heat pipes corresponding to the area outside the heat source area.

13. The thermally conductive module as described in claim 11, characterized in that, Each heat pipe includes a working fluid; the latent heat of the working fluid in the plurality of heat pipes corresponding to the heat source region is less than the latent heat of the working fluid in the plurality of heat pipes corresponding to the region outside the heat source region.

14. The thermally conductive module as described in claim 11, characterized in that, Each heat pipe includes a capillary structure in its wall; the capillary force of the capillary structure in the wall of the plurality of heat pipes corresponding to the heat source region is less than the capillary force of the capillary structure in the wall of the plurality of heat pipes corresponding to the region outside the heat source region.

15. The thermally conductive module as described in claim 11, characterized in that, The maximum heat transfer of the multiple heat pipes gradually increases from the heat source area toward the four circumferential sides of the vapor chamber.

16. The thermally conductive module as described in claim 11, characterized in that, The plurality of capillary structures are disposed on an inner surface of the hollow shell, the inner surface corresponding to the second outer surface; The capillary force of the multiple capillaries located within the heat source region is less than the capillary force of the multiple capillaries located outside the heat source region.

17. The thermally conductive module as described in claim 16, characterized in that, Each capillary structure includes a plurality of strip structures, which are spaced apart to form a plurality of grooves; wherein the aspect ratio of the plurality of strip structures located within the heat source region is smaller than the aspect ratio of the plurality of strip structures located outside the heat source region.

18. The thermally conductive module as described in claim 16, characterized in that, Each capillary structure includes a plurality of strip structures, which are spaced apart to form a plurality of grooves; each strip structure is covered with a porous sintered layer; wherein the porosity of the porous sintered layer of the plurality of strip structures located in the heat source region is greater than the porosity of the porous sintered layer of the plurality of strip structures located outside the heat source region.

19. The thermally conductive module as described in claim 16, characterized in that, Each capillary structure includes a perforated plate; each perforated plate includes a plurality of holes; wherein a hollow portion formed by the plurality of holes of the perforated plate located within the heat source region is larger than a hollow portion formed by the plurality of holes of the perforated plate located outside the heat source region.

20. An electronic device, characterized in that, include: The thermally conductive module as described in any one of claims 1 to 19; as well as A heat dissipation module, with the plurality of heat pipes connected to the heat conduction module.

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