Heat plate and electronic device

Abstract

The application discloses a kind of vapor chamber and electronic equipment, it is related to heat dissipation device technical field, wherein, vapor chamber includes shell and multiple capillary structures, vacuum cavity is formed in shell, and the vacuum cavity is filled with heat-conducting fluid;Multiple capillary structures are spaced in the vacuum cavity;Wherein, the shell includes the first layer structure and the second layer structure of laminated arrangement, the first layer structure is configured as metal layer, and is located in the second layer structure close to the side of the vacuum cavity, and the density of the second layer structure is less than the first layer structure.The technical scheme provided by the application improves the light and thin of vapor chamber.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to a heat spreader and electronic device. Background Technology

[0002] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. It achieves rapid temperature equalization through the evaporation and condensation circulation of the working fluid within a sealed plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0003] Heat spreaders can be used in devices such as watches, tablets, wearable devices, power electronic devices, power amplifiers, batteries, and electric vehicles. With the increasing demand for miniaturization in these devices, there is a greater need for heat spreaders to be thinner and lighter. Summary of the Invention

[0004] The main objective of this invention is to provide a heat spreader and electronic device that aims to improve the thinness and lightness of the heat spreader.

[0005] To achieve the above objectives, the heat spreader proposed in this embodiment of the invention includes:

[0006] An outer casing having a vacuum chamber formed therein, the vacuum chamber being filled with a heat-conducting fluid; and

[0007] Multiple capillary structures are spaced apart within the vacuum cavity;

[0008] The outer shell includes a first layer structure and a second layer structure stacked together. The first layer structure is configured as a metal layer and is located on the side of the second layer structure close to the vacuum cavity. The density of the second layer structure is less than that of the first layer structure.

[0009] In one embodiment, the second layer structure is configured as a metal layer.

[0010] In one embodiment, the first layer is configured as a copper layer and the second layer is configured as an aluminum layer.

[0011] In one embodiment, the second layer structure is configured as a non-metallic layer.

[0012] In one embodiment, the first layer is configured as a copper layer, and the second layer is configured as a polymer film layer.

[0013] In one embodiment, the outer casing further includes a third layer structure located on the side of the second layer structure opposite to the first layer structure.

[0014] In one embodiment, the third layer may be made of the same or different material as the first layer.

[0015] In one embodiment, the heat spreader includes a bendable section and a non-bendable section, and the capillary structure contacts the outer shell at both ends along the height direction of the heat spreader, at least at the bendable section.

[0016] In one embodiment, the capillary structure has a bending allowance in the bendable section.

[0017] The present invention also proposes an electronic device, including an electronic body and the aforementioned heat spreader, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

[0018] The technical solution of this invention involves setting a first layer and a second layer in the outer shell of a heat spreader. The first layer is configured as a metal layer and is located on the side of the second layer near the vacuum cavity of the heat spreader. The density of the second layer is less than that of the first layer. This has two advantages: First, by configuring the first layer as a metal layer, the seal between the upper and lower shells can be directly achieved through metal welding, eliminating the need for additional sealing materials for the upper and lower shells, thus contributing to the lightweight design of the heat spreader. Second, compared to the prior art where the density of the second layer is greater than that of the metal layer in the first layer, this invention sets the density of the second layer to be less than that of the first layer, thereby improving the thinness and lightness of the heat spreader. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A side view of an embodiment of the heat spreader shell provided by the present invention;

[0021] Figure 2 A side view of one embodiment of a bendable section in a heat spreader;

[0022] Figure 3 for Figure 2 A front view of an embodiment of the capillary structure in the image;

[0023] Figure 4 This is a side view of one embodiment of the non-bendable section in a heat spreader.

[0024] Explanation of icon numbers:

[0025] 100. Outer shell; 101. Vacuum chamber; 111. First layer structure; 112. Second layer structure; 113. Third layer structure; 121. Upper shell; 122. Lower shell;

[0026] 200. Capillary structure; 210. First capillary structure; 211. First end; 212. Second end; 213. Bending allowance; 220. Second capillary structure;

[0027] 310. Bendable section; 320. Non-bendable section;

[0028] 400, Support structure; 410, Support column.

[0029] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0033] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. It achieves rapid temperature equalization through the evaporation and condensation circulation of the working fluid within a sealed plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0034] Heat spreaders can be used in devices such as watches, tablets, wearable devices, power electronic devices, power amplifiers, batteries, and electric vehicles. With the increasing demand for miniaturization in these devices, there is a greater need for heat spreaders to be thinner and lighter.

[0035] This invention proposes a heat spreader.

[0036] Please see Figure 1 and Figure 2 In one embodiment of the present invention, the heat spreader includes a shell 100 and a plurality of capillary structures 200. A vacuum cavity 101 is formed inside the shell 100 and the vacuum cavity 101 is filled with a heat-conducting fluid. The plurality of capillary structures 200 are spaced apart inside the vacuum cavity 101.

[0037] Understandably, the outer casing 100 includes an upper casing 121 and a lower casing 122 that fit together, and the upper casing 121 and lower casing 122 are sealed together to enclose a vacuum chamber 101. The vacuum chamber 101 is filled with a heat-conducting fluid, and multiple capillary structures 200 are spaced apart within the vacuum chamber 101. The outer surface of the lower casing 122 is provided with a heat-conducting area for contact with electronic components. The area of ​​the heat spreader near the heat-conducting area is the evaporation area, and the area of ​​the heat spreader away from the heat-conducting area is the condensation area.

[0038] When the electronic components generate heat, the heat-conducting fluid evaporates into vapor in the heat-conducting area of ​​the lower shell 122 and diffuses within the vacuum chamber 101. The vapor diffuses to the condensation area, contacts the upper shell 121, releases heat, and condenses back into heat-conducting fluid. The condensed heat-conducting fluid then flows back to the heat-conducting area under the capillary action of the capillary structure 200. The returned heat-conducting fluid can participate in the next cycle of evaporation and condensation.

[0039] The outer shell 100 includes a first layer structure 111 and a second layer structure 112 stacked together. The first layer structure 111 is configured as a metal layer and is located on the side of the second layer structure 112 close to the vacuum cavity 101. The density of the second layer structure 112 is less than that of the first layer structure 111.

[0040] Specifically, in this invention, the upper shell 121 and the lower shell 122 are made of the same material, thus simplifying the molding process of the outer shell 100. That is, both the upper shell 121 and the lower shell 122 include a first layer structure 111 and a second layer structure 112 stacked together. In one embodiment, the outer shell 100 includes a first layer structure 111 and a second layer structure 112 stacked together; the two-layer structure facilitates the thinning of the outer shell 100.

[0041] The first layer 111 is configured as a metal layer and is located closer to the vacuum chamber 101. Understandably, in one embodiment, the seal between the upper shell 121 and the lower shell 122 of the outer casing 100 can be achieved by sealing portions of the upper shell 121 and lower shell 122 with additional silver or copper. In another embodiment, the seal of the outer casing 100 can be formed by welding the upper shell 121 and lower shell 122 using a metal welding process such as seam welding, laser welding, or thermo-pressure diffusion welding, thus eliminating the need for additional materials. Therefore, by configuring the first layer 111, which is closer to the vacuum chamber 101, as a metal layer in the inner layer of the outer casing 100, the seal of the outer casing 100 can be achieved by welding the metal layers of the upper and lower shells 122, thereby avoiding the use of additional materials. Furthermore, compared to non-metallic materials, the metal layer improves the sealing performance of the outer casing 100.

[0042] The density of the second layer structure 112 is less than that of the first layer structure 111. Therefore, compared to the fact that the density of the second layer structure 112 is greater than that of the first layer structure 111, the present invention is beneficial to reducing the weight of the outer shell 100, thereby improving the thinness of the heat spreader.

[0043] The technical solution of this invention involves providing a first layer structure 111 and a second layer structure 112 stacked within the outer shell 100 of the heat spreader. The first layer structure 111 is configured as a metal layer and is located on the side of the second layer structure 112 closest to the vacuum cavity 101 of the heat spreader. The density of the second layer structure 112 is less than that of the first layer structure 111. Thus, on the one hand, by configuring the first layer structure 111 as a metal layer, the seal between the upper and lower shells 122 of the outer shell 100 can be directly achieved through a metal welding process, eliminating the need for additional materials for sealing the upper and lower shells 121 and 122, which is beneficial for the lightweight design of the heat spreader. On the other hand, compared to the prior art where the density of the second layer structure 112 is greater than the density of the metal layer of the first layer structure 111, this invention sets the density of the second layer structure 112 to be less than that of the first layer structure 111, thereby improving the thinness and lightness of the heat spreader.

[0044] In an embodiment of the present invention, the second layer structure 112 is configured as a metal layer. Thus, both the second layer structure 112 and the first layer structure 111 are made of metal, which is beneficial to the structural strength of the outer casing 100. In one embodiment, the first layer structure 111 is configured as a copper layer, and the second layer structure 112 is configured as an aluminum layer. It is understood that because the heat sink has good heat dissipation and thermal conductivity, the first layer structure 111 and the second layer structure 112 need to be made of thermally conductive materials. The materials of the first layer structure 111 and the second layer structure 112 can be the same or different. In another embodiment, the first layer structure 111 is configured as a copper layer, and the second layer 112 is configured as a magnesium layer.

[0045] In embodiments of the present invention, the second layer structure 112 is configured as a non-metallic layer. It is understood that most non-metals have a lower density than metals, which further facilitates the thinning of the heat spreader. In one embodiment, the first layer structure 111 is configured as a copper layer, and the second layer structure 112 is configured as a polymer film layer. Specifically, the polymer film material includes, but is not limited to, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinyl alcohol, and polyimide. Of course, in other embodiments, the second layer structure 112 can also be ceramic, glass, etc.

[0046] Please see Figure 2 In an embodiment of the present invention, the outer shell 100 further includes a third layer structure 113, which is located on the side of the second layer structure 112 opposite to the first layer structure 111. Specifically, in one embodiment, the outer shell 100 further includes a third layer structure 113 stacked with the first layer structure 111 and the second layer structure 112. This three-layer structure arrangement is beneficial to the structural strength of the heat spreader. In one embodiment, the third layer structure 113 may be made of the same or different material as the first layer structure 111. That is, the third layer structure 113 may be made of metal or non-metal; the material of the third layer structure 113 will not be described in detail here.

[0047] Please see Figure 2 and Figure 3 In an embodiment of the present invention, the heat spreader includes a bendable section 310 and a non-bendable section 320. The capillary structure 200 is in contact with the outer shell 100 at both ends along the height direction of the heat spreader, at least at the bendable section 310.

[0048] Understandably, the bendable section 310 of the heat spreader increases its applicability. When the outer shell 100 has a three-layer structure, the third layer 113 of the upper shell 121 at the bendable section 310 is etched, thereby reducing the thickness of the bendable section 310 and improving the bending performance of the heat spreader. When the outer shell 100 has a two-layer structure, since the outer shell 100 itself is thinner, the upper shell 121 no longer needs to be etched at the bendable section 310, which also ensures the bending performance of the heat spreader.

[0049] The heat spreader has a certain height, length, and width. The thickness of the heat spreader is also in the height direction, which is the arrangement direction of the first layer structure 111, the second layer structure 112, and the third layer structure 113. The connection direction of the bendable section 310 and the non-bendable section 320 is also in the length direction. Along the height direction of the heat spreader, at least at the bendable section 310, the upper and lower ends of the capillary structure 200 are in contact with the inner sidewalls of the upper shell 121 and the lower shell 122, respectively. In this way, the capillary structure 200 can both return the condensed heat-conducting fluid from the condensation zone to the heat-conducting zone and support the upper shell 121 and the lower shell 122, preventing the upper shell 121 and the lower shell 122 from collapsing or being damaged during the vacuuming process of the vacuum chamber 101. Compared to the prior art, the capillary structure 200 and vacuum cavity 101 are arranged along the height direction inside the outer shell 100. This arrangement helps to further reduce the height of the heat spreader, thereby making the heat spreader thinner and lighter.

[0050] Please see Figure 3 More specifically, the capillary structure 200 includes a plurality of first capillary structures 210 spaced apart along the length of the heat spreader, and at least one second capillary structure 220. All the first capillary structures 210 are connected to each other through the second capillary structure 220, thereby ensuring that the heat-conducting fluid after condensation at each location can flow back to the heat-conducting area, thus ensuring the heat dissipation effect of the heat spreader.

[0051] In one embodiment, along the length of the heat spreader, a non-bendable section 320, a bendable section 310, and another non-bendable section 320 are arranged sequentially. In one embodiment, a first capillary structure 210 extends from one non-bendable section 320 to another. Along the length of the heat spreader, the first capillary structure 210 has a first end 211 and a second end 212 opposite to each other. A second capillary structure 220 is connected to either the first end 211 or the second end 212 of the multiple first capillary structures 210. Specifically, the height of the second capillary structure 220 is equal to that of the first capillary structure 210. When the heat spreader is evacuated, the upper and lower ends of the second capillary structure 220 also come into contact with the inner wall of the upper shell 121 and the inner wall of the lower shell 122, respectively. This helps to improve the supporting strength of the heat spreader and enhance its structural stability.

[0052] Of course, in other embodiments, the height of the second capillary structure 220 can be less than that of the first capillary structure 210. When the heat exchanger is evacuated, one end of the second capillary structure 220 is connected to the first capillary structure 210 along the height direction of the heat exchanger, while the other end is not in contact with the upper shell 121 or the lower shell 122. At this time, the second capillary structure 220 can be connected to any part between the first end 211 and the second end 212 of the first capillary structure 210, which will not affect the connection of the vacuum cavities 101 on both sides of the second capillary structure 220 in the length direction, and will not affect the return flow of the heat-conducting fluid.

[0053] Please see Figure 4 In another embodiment, the first capillary structure 210 is disposed in the bendable section 310 and the non-bendable section 320, and the second capillary structure 220 is laid flat on the inner surface of one of the upper shell 121 and the lower shell 122. A support structure 400 is provided between the inner surface of the other of the upper shell 121 and the lower shell 122 and the second capillary structure 220.

[0054] Specifically, in this embodiment, the length and width of the second capillary structure 220 are equal to the length and width of the non-bendable segment 320, and the height of the second capillary structure 220 is less than the height of the first capillary structure 210. The second capillary structure 220 is disposed between the upper shell 121 and the support structure 400, or between the lower shell 122 and the support structure 400. In one embodiment, the first capillary structure 210 and the second capillary structure 220 are an integral structure, which facilitates the connection of the capillary structures 200.

[0055] In one embodiment, the support structure 400 is located between the inner wall of the upper shell 121 or the lower shell 122 and the second capillary structure 220, and is used to support the vacuum and sealed vacuum cavity 101 to provide flow space for the evaporated heat-conducting vapor. The support structure 400 can be in the form of support columns 410, support mesh, etc., and the material can be ceramic, glass, fiber, metal, polymer, etc., and can be fixed in the vacuum cavity 101 by welding, bonding, etching, 3D printing, etc. In one embodiment, the support structure 400 includes a plurality of support columns 410, which are evenly spaced in the vacuum cavity 101 to provide a more uniform supporting force to the upper and lower shells 122.

[0056] Please see Figure 3 In an embodiment of the present invention, the capillary structure 200 has a bending allowance 213 in the bendable section 310.

[0057] Understandably, to improve the bending performance of the bendable section 310 and extend the service life of the heat spreader, the capillary structure 200 in this invention has a bending allowance 213 in the bendable section 310. In one embodiment, the capillary structure 200 is arranged in a wave-like pattern along the height direction of the heat spreader in the bendable section 310, that is, the first capillary structure 210 has a wave structure. The height of the wave structure, that is, the distance between the upper and lower peaks of the wave structure, is greater than or equal to or less than the height of the capillary structure 200, and is not limited here.

[0058] In one embodiment, the first capillary structure 210 has a wavy structure in the width direction of the heat spreader, thus providing a bending allowance 213 for bending the first capillary structure 210 and improving the bending performance of the heat spreader. In another embodiment, the first capillary structure 210 has a first end 211 and a second end 212 disposed opposite to each other in the length direction of the heat spreader. In the direction from the first end 211 to the second end 212, the first capillary structure 210 is inclined at a certain angle to the length direction of the heat spreader. Thus, compared to the line connecting the first end 211 and the second end 212 being parallel to the length direction of the heat spreader, the overall length of the first capillary structure 210 is longer, providing a bending allowance 213 and thereby improving the bending performance of the heat spreader. The tilt angle and tilt direction of the first capillary structure 210 are not limited here.

[0059] In another embodiment, the first capillary structure 210 is provided with bending allowance 213 in both the height and width directions of the heat spreader, thereby further improving the bending performance of the heat spreader.

[0060] The present invention also proposes an electronic device comprising an electronic body and a heat spreader. The specific structure of the heat spreader is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. The heat spreader is installed in the heating area of ​​the electronic body.

[0061] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat spreader, characterized in that, include: The outer shell has a vacuum cavity formed inside it, and the vacuum cavity is filled with a heat-conducting fluid; as well as Multiple capillary structures are spaced apart within the vacuum cavity; The outer shell includes a first layer structure and a second layer structure stacked together. The first layer structure is configured as a metal layer and is located on the side of the second layer structure close to the vacuum cavity. The density of the second layer structure is less than that of the first layer structure.

2. The heat spreader as described in claim 1, characterized in that, The second layer is configured as a metal layer.

3. The heat spreader as described in claim 2, characterized in that, The first layer is configured as a copper layer, and the second layer is configured as an aluminum layer.

4. The heat spreader as described in claim 1, characterized in that, The second layer is configured as a non-metallic layer.

5. The heat spreader as described in claim 4, characterized in that, The first layer is configured as a copper layer, and the second layer is configured as a polymer film layer.

6. The heat spreader as described in claim 1, characterized in that, The outer shell also includes a third layer structure, which is located on the side of the second layer structure opposite to the first layer structure.

7. The heat spreader as described in claim 6, characterized in that, The third layer may be made of the same or different material as the first layer.

8. The heat spreader as described in claim 1, characterized in that, The heat spreader includes a bendable section and a non-bendable section. The capillary structure is in contact with the outer shell at both ends along the height direction of the heat spreader, at least at the bendable section.

9. The heat spreader as described in claim 8, characterized in that, The capillary structure has a bending allowance in the bendable section.

10. An electronic device, characterized in that, It includes an electronic body and a heat spreader as described in any one of claims 1 to 9, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

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