Heat plate and electronic device

Abstract

The application discloses a uniform heating plate and electronic equipment, and relates to the technical field of heat dissipation devices, wherein the uniform heating plate comprises a shell and a plurality of capillary structures, a vacuum cavity is formed in the shell, and a heat-conducting fluid is filled in the vacuum cavity; the plurality of capillary structures are arranged in the vacuum cavity; the shell comprises a nonmetal layer and at least one metal layer which are stacked, the shell is provided with a sealing opening, and the nonmetal layer is provided with a avoiding gap corresponding to the sealing opening. The technical scheme provided by the application improves the sealing performance of the uniform heating plate.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to a heat spreader and electronic device. Background Technology

[0002] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. Vapor chambers can be applied to devices such as watches, tablets, wearable devices, power electronic devices, power amplifiers, batteries, and electric vehicles. They achieve rapid temperature equalization through the evaporation and condensation circulation of a working fluid enclosed in a plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0003] During the manufacturing process of a heat spreader, a cavity is typically defined within the outer shell. After a capillary structure is installed within the cavity, the working fluid is injected into the cavity through a pre-reserved injection port. Subsequently, a vacuum is drawn, and the injection port is sealed by welding or other methods to achieve the airtightness of the heat spreader.

[0004] Currently, the outer shell of the heat exchanger is usually made of multiple materials. During the sealing process of the liquid injection port, the multiple materials of the outer shell may melt and form a mixture. When the mixture of different materials solidifies and seals the liquid injection port, it will affect the sealing effect. Summary of the Invention

[0005] The main objective of this invention is to provide a heat spreader and electronic device that improves the sealing performance of the heat spreader.

[0006] To achieve the above objectives, the heat spreader proposed in this embodiment of the invention includes:

[0007] An outer casing having a vacuum chamber formed therein, the vacuum chamber being filled with a heat-conducting fluid; and

[0008] Multiple capillary structures are disposed within the vacuum cavity;

[0009] The outer shell includes a stacked non-metallic layer and at least one metallic layer. The outer shell is provided with a sealing opening, and the non-metallic layer is provided with an avoidance notch corresponding to the sealing opening.

[0010] In one embodiment, the diameter of the clearance notch is 1.0-1.5 times the diameter of the sealing opening.

[0011] In one embodiment, the outer casing is provided with an avoidance mark at the location corresponding to the avoidance notch.

[0012] In one embodiment, the housing includes a metal layer located on the side of the non-metallic layer adjacent to the vacuum cavity.

[0013] In one embodiment, the outer casing includes two metal layers, which are disposed on opposite sides of the non-metallic layer.

[0014] In one embodiment, the heat spreader includes a bent section and a non-bendable section, and the capillary structure contacts the outer shell at both ends along the height direction of the heat spreader, at least at the bent section.

[0015] In one embodiment, the capillary structure includes a plurality of first capillary structures disposed on the bendable section, each first capillary structure including a plurality of interconnected first substructures, and all the first substructures extending along the length direction of the heat spreader.

[0016] In one embodiment, the capillary structure includes a second capillary structure disposed on the inflexible section, the second capillary structure being configured as a mesh structure and connected to the first capillary structure.

[0017] In one embodiment, the first capillary structure has a bending allowance.

[0018] The present invention also proposes an electronic device, including an electronic body and the aforementioned heat spreader, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

[0019] The technical solution of this invention involves setting an outer shell and multiple capillary structures within a heat spreader. A vacuum cavity is formed within the outer shell and filled with a heat-conducting fluid. The multiple capillary structures are disposed within the vacuum cavity. The outer shell comprises stacked non-metallic layers and at least one metallic layer. The outer shell has a sealing opening, and the non-metallic layer has a clearance notch corresponding to the sealing opening. Thus, when the sealing opening is sealed, the possibility of the non-metallic layer melting is reduced, thereby reducing the possibility of forming a mixture of metal and non-metal, increasing the proportion of metallic material in the sealing material at the sealing opening, and thus improving the sealing performance at the sealing opening. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 A side view of an embodiment of the bendable section in the heat spreader provided by the present invention;

[0022] Figure 2 for Figure 1 A front view of an embodiment of the capillary structure in the image;

[0023] Figure 3 This is a top view of one embodiment of a heat spreader;

[0024] Figure 4 A side view of one embodiment of the non-bendable section of a heat spreader;

[0025] Figure 5 for Figure 1 A top view of an embodiment of the capillary structure.

[0026] Explanation of icon numbers:

[0027] 100. Outer shell; 101. Vacuum chamber; 121. Upper shell; 122. Lower shell; 131. Non-metallic layer; 132. Clearance notch; 133. Metallic layer;

[0028] 200. Capillary structure; 210. First capillary structure; 201. First substructure; 211. First end; 212. Second end; 213. Bending allowance; 220. Second capillary structure;

[0029] 310. Bendable section; 320. Non-bendable section;

[0030] 400, Support structure; 410, Support column.

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0034] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0035] A vapor chamber is a highly efficient thermal management component primarily used for heat dissipation and heat conduction. Vapor chambers can be applied to devices such as watches, tablets, wearable devices, power electronic devices, power amplifiers, batteries, and electric vehicles. They achieve rapid temperature equalization through the evaporation and condensation circulation of a working fluid enclosed in a plate-shaped cavity, thereby realizing efficient heat conduction and heat diffusion.

[0036] During the manufacturing process of a heat spreader, a cavity is typically defined within the outer shell. After a capillary structure is installed within the cavity, the working fluid is injected into the cavity through a pre-reserved injection port. Subsequently, a vacuum is drawn, and the injection port is sealed by welding or other methods to achieve the airtightness of the heat spreader.

[0037] Currently, the outer shell of the heat exchanger is usually made of multiple materials. During the sealing process of the liquid injection port, the multiple materials of the outer shell may melt and form a mixture. When the mixture of different materials solidifies and seals the liquid injection port, it will affect the sealing effect.

[0038] This invention proposes a heat spreader.

[0039] Please see Figure 1 In one embodiment of the present invention, the heat spreader includes a shell 100 and a plurality of capillary structures 200. A vacuum cavity 101 is formed inside the shell 100 and the vacuum cavity 101 is filled with a heat-conducting fluid. The plurality of capillary structures 200 are disposed inside the vacuum cavity 101. The shell 100 includes a stacked non-metallic layer 131 and at least one metallic layer 133. The shell 100 is provided with a sealing port, and the non-metallic layer 131 is provided with an avoidance notch 132 corresponding to the sealing port.

[0040] Specifically, the outer casing 100 includes an upper casing 121 and a lower casing 122, which are sealed together to form a vacuum chamber 101. Multiple capillary structures 200 are installed within the vacuum chamber 101. Understandably, the outer surface of the lower casing 122 of the vapor chamber has a heat-conducting area for contact with electronic components, for heat dissipation and conduction of the electronic components. That is, the vapor chamber is an evaporation zone near the heat-conducting area and a condensation zone away from the heat-conducting area.

[0041] When the electronic components generate heat, the heat-conducting fluid evaporates into vapor in the heat-conducting area of ​​the lower shell 122 and diffuses within the vacuum chamber 101. The vapor diffuses to the condensation area, contacts the upper shell 121, releases heat, and condenses back into heat-conducting fluid. The condensed heat-conducting fluid then flows back to the heat-conducting area under the capillary action of the capillary structure 200. The returned heat-conducting fluid can participate in the next cycle of evaporation and condensation.

[0042] Please see Figure 2 In this invention, the heat spreader is configured as a flexible heat spreader, including a bendable section 310 and a non-bendable section 320. It is understandable that, for example, foldable mobile phone products require a bendable heat spreader to achieve better heat dissipation and even heat distribution. The flexible design of the heat spreader expands its applicability.

[0043] It is understood that the heat spreader has a certain height, length, and width, wherein the thickness direction of the heat spreader is also the height direction, which is also the arrangement direction of the upper shell 121 and the lower shell 122; the connection direction of the bendable section 310 and the non-bendable section 320 is also the length direction. In one embodiment, along the length direction of the heat spreader, the heat spreader includes a non-bendable section 320, a bendable section 310, and a non-bendable section 320 connected in sequence. Of course, in other embodiments, the heat spreader may also include a plurality of bendable sections 310 and non-bendable sections 320 arranged in sequence at intervals to adapt to the needs of different electronic components.

[0044] Please see Figure 1 and Figure 2 The capillary structure 200 includes a plurality of first capillary structures 210 disposed in the bendable section 310. In one embodiment, the two ends of the first capillary structures 210 along the height direction of the heat spreader are in contact with the upper shell 121 and the lower shell 122, respectively. Thus, the capillary structure 200 can both return the condensed heat-conducting fluid from the condensation zone to the heat-conducting zone and support the upper shell 121 and the lower shell 122, preventing the upper shell 121 and the lower shell 122 from collapsing or being damaged during the vacuuming process of the vacuum chamber 101. Compared to the prior art, where the capillary structure 200 and the vacuum chamber 101 are arranged along the height direction inside the outer shell 100, the present invention arranges the capillary structure 200 and the vacuum chamber 101 along the length direction, which is beneficial for further reducing the height of the heat spreader, thereby contributing to the thinning of the heat spreader.

[0045] Please see Figures 1 to 3 Taking a heat spreader plate with an inflexible section 320, a bendable section 310, and an inflexible section 320 arranged sequentially along its length as an example, in one embodiment, the first capillary structure 210 extends from one inflexible section 320 to the bendable section 310, and then extends to another inflexible section 320. That is, in this embodiment, whether in the inflexible section 320 or the bendable section 310, both ends of the first capillary structure 210 in the height direction are in contact with the inner sidewall of the upper shell 121 and the inner sidewall of the lower shell 122, respectively. The capillary structure 200 also includes a second capillary structure 220. Along the length of the heat spreader plate, the first capillary structure 210 has a first end 211 and a second end 212. In one embodiment, the second capillary structure 220 is connected to the first end 211 of each first capillary structure 210; or, the second capillary structure 220 is connected to the second end 212 of each first capillary structure 210. Understandably, in a heat spreader, all capillary structures 200 need to be interconnected to ensure the reflux effect of the condensed heat-conducting fluid. Simultaneously, the vacuum chamber 101 also needs to extend and connect along the length of the heat spreader to ensure that the evaporated heat-conducting vapor can diffuse to different locations on the heat spreader, thus guaranteeing its heat homogenization effect. Therefore, by placing the second capillary structure 220 at either the first end 211 or the second end 212 of the first capillary structure 210, the second capillary structure 220 is prevented from obstructing the connection of the vacuum chamber 101 along its length, thereby ensuring the heat homogenization effect of the heat spreader.

[0046] Please see Figure 4 In another embodiment, the first capillary structure 210 is only provided in the inflexible section 320. Only the capillary structure 200 in the bendable section 310 has its two ends in the height direction contacting the upper shell 121 and the lower shell 122, respectively. Specifically, the first capillary structure 210 is provided in the bendable section 310, and in the inflexible section 320, the second capillary structure 220 is laid flat on the inner surface of one of the upper shell 121 and the lower shell 122. That is, the width and length of the second capillary structure 220 are consistent with the width and length of the inflexible section 320, and the height of the second capillary structure 220 is less than the height of the first capillary structure 210. Thus, a vacuum cavity 101 is formed between the second capillary structure 220 and the other of the upper shell 121 and the lower shell 122, allowing steam diffusion in the inflexible section 320 to ensure the heat distribution effect of the heat spreader.

[0047] Meanwhile, a support structure 400 is provided between the second capillary structure 220 and the inner surface of the other of the upper shell 121 and lower shell 122. That is, one end of the support structure 400 contacts the inner surface of the upper shell 121 or lower shell 122, and the other end contacts the second capillary structure 220. In one embodiment, the support structure 400 is fixed to the inner surface of the upper shell 121 or lower shell 122 by welding or bonding, and the other end of the support structure 400 is not connected to the second capillary structure 220. When the heat spreader is evacuated, the support structure 400 and the second capillary structure 220 can come into contact. Of course, in another embodiment, the two ends of the support structure 400 in the height direction can also be connected to the inner surface of the upper shell 121 or lower shell 122 and the second capillary structure 220, respectively. Here, there are no restrictions on the installation method or connection relationship of the support structure 400. Thus, the support structure 400 provides support for the upper shell 121 and lower shell 122 of the inflexible section 320, preventing the upper shell 121 and lower shell 122 from collapsing and being damaged during vacuuming of the heat spreader. In one embodiment, the support structure 400 includes a plurality of support columns 410, which are evenly spaced within the vacuum chamber 101.

[0048] Please see Figure 1 The outer casing 100 includes a stacked non-metallic layer 131 and at least one metallic layer 133. The outer casing 100 is provided with a sealing opening, and the non-metallic layer 131 is provided with an avoidance notch 132 corresponding to the sealing opening.

[0049] It is understood that the outer shell 100 includes a multi-layered structure. In this invention, the outer shell 100 includes a non-metallic layer 131 and at least one metallic layer 133. The non-metallic layer 131 can be a polymer film, such as polyethylene, polyvinyl alcohol, etc., or it can be ceramic, etc. The metallic layer 133 can be copper, aluminum, etc. No specific material is limited for the outer shell 100.

[0050] When sealing points such as the liquid injection port on the heat spreader are achieved through welding or other methods, a portion of the outer shell 100 at the sealing point may melt. In this invention, the non-metallic layer 131 has an avoidance notch 132 at the corresponding sealing point. This reduces the likelihood of the non-metallic layer 131 melting during sealing, thereby reducing the possibility of forming a mixture of metal and non-metal, increasing the proportion of metallic material in the sealing material at the sealing point, and thus improving the sealing performance.

[0051] The technical solution of this invention involves setting a shell 100 and multiple capillary structures 200 within a heat spreader. A vacuum cavity 101 is formed within the shell 100 and filled with a heat-conducting fluid. The multiple capillary structures 200 are disposed within the vacuum cavity 101. The shell 100 includes stacked non-metallic layers 131 and at least one metallic layer 133. The shell 100 has a sealing opening, and the non-metallic layer 131 has a clearance notch 132 corresponding to the sealing opening. Thus, when the sealing opening is sealed, the possibility of the non-metallic layer 131 melting is reduced, thereby reducing the possibility of forming a metal-non-metal mixture. This increases the proportion of metallic material in the sealing material at the sealing opening, thereby improving the sealing performance at the sealing opening.

[0052] In an embodiment of the present invention, the diameter of the clearance notch 132 is 1.0-1.5 times the diameter of the sealing opening. It can be understood that when the diameter of the clearance notch 132 is larger than the diameter of the sealing opening, the possibility of the non-metallic layer 131 being melted can be further reduced, and the sealing performance of the sealing opening can be improved.

[0053] In an embodiment of the present invention, the outer casing 100 is provided with a clearance mark (not shown) corresponding to the clearance notch 132. It is understood that when the outer casing 100 has another metal layer 133 outside the non-metallic layer 131, the clearance notch 132 is located inside the outer casing 100 and thus cannot be observed. In one embodiment, the outer casing 100 is provided with a clearance mark at the location corresponding to the clearance notch 132. This facilitates the identification of the location of the clearance notch 132, thereby facilitating the configuration of different structures of the outer casing 100 and improving the versatility of the outer casing 100. In one embodiment, the clearance mark is configured as a marking protrusion, marking groove, etc.

[0054] In an embodiment of the present invention, the outer shell 100 includes a metal layer 133, which is located on the side of the non-metallic layer 131 near the vacuum cavity 101.

[0055] In one embodiment, the seal between the upper shell 121 and the lower shell 122 of the outer casing 100 can be achieved by sealing the upper shell 121 and the lower shell 122 with additional silver or copper sealant. In another embodiment, the seal of the outer casing 100 can be formed by welding the upper shell 121 and the lower shell 122 using a metal welding process such as seam welding, laser welding, or thermo-pressure diffusion welding, thus eliminating the need for additional materials. Thus, a metal layer 133 is configured in the inner layer of the outer casing 100, specifically on the side closest to the vacuum chamber 101, so that the seal of the outer casing 100 can be achieved by welding the metal layer 133 of the upper and lower shells 122, thereby avoiding the use of additional materials. Furthermore, compared to non-metallic materials, the sealing of the metal layer 133 improves the airtightness of the outer casing 100.

[0056] In an embodiment of the present invention, the outer shell 100 includes two metal layers 133, which are disposed on both sides of the non-metallic layer 131.

[0057] In one embodiment, the outer casing 100 includes a three-layer structure, which is beneficial to the structural strength of the heat spreader. The three-layer structure includes two metal layers 133 and one non-metal layer 131, with the non-metal layer 131 located between the two metal layers 133. Thus, compared to the arrangement of two non-metal layers 131 and one metal layer 133, the sealing of the opening is achieved primarily through the use of metal materials, thereby improving the sealing effect. The specific materials of the two metal layers 133 can be the same or different, and are not limited herein.

[0058] Please see Figure 5 In an embodiment of the present invention, the capillary structure 200 includes a plurality of first capillary structures 210 disposed on the bendable section 310. Each first capillary structure 210 includes a plurality of interconnected first substructures 201, and the plurality of first substructures 201 extend along the length direction of the heat spreader.

[0059] Specifically, the first capillary structure 210 includes a plurality of interconnected first substructures 201, all of which extend along the length direction of the heat spreader. Specifically, the plurality of first substructures 201 are connected to form the first capillary structure 210, thereby improving the structural strength of the first capillary structure 210. Simultaneously, the extension trend of the plurality of first substructures 201 is consistent with the length direction of the heat spreader. Compared to a situation where the extension trend of the plurality of first substructures 201 is consistent with the width direction of the heat spreader, or where the first capillary structure 210 has a mesh structure, this arrangement of the present invention is beneficial for increasing the bending resistance of the first capillary structure 210, thereby improving the bending performance of the heat spreader.

[0060] In one embodiment, at least one first substructure 201 extends along the length direction of the heat spreader, and another first substructure 201 is wrapped around the at least one first substructure 201. Specifically, the extension direction of at least one first substructure 201 is parallel to the length direction of the heat spreader, and the other first substructure 201 is wrapped around the first substructure 201 extending along the length direction. In another embodiment, multiple first substructures 201 are intertwined. In this way, the extension trend of the first substructures 201 is also along the length direction of the heat spreader, which can also improve the bending performance of the first capillary structure 210. In yet another embodiment, multiple first substructures 201 are arranged side by side and bound together. In this way, multiple first substructures 201 are arranged side by side and bound together by connectors such as straps to prevent the multiple first substructures 201 from scattering.

[0061] Please see Figure 5In an embodiment of the present invention, the capillary structure 200 includes a second capillary structure 220 disposed in the non-bendable section 320. The second capillary structure 220 is configured as a mesh structure and is connected to the first capillary structure 210.

[0062] Specifically, taking an example where a non-bendable section 320, a bendable section 310, and a non-bendable section 320 are sequentially provided along the length of the heat spreader. The capillary structure 200 also includes a second capillary structure 220 disposed in the non-bendable section 320. It can be understood that the non-bendable section 320 of the heat spreader also has a capillary structure 200 to allow heat to be transferred between different areas of the heat spreader, thus ensuring the heat spreader's uniform heating effect. The first capillary structure 210 is connected to both second capillary structures 220, allowing the condensed heat-conducting fluid to flow back to the heat-conducting area. More specifically, the second capillary structure 220 and the first capillary structure 210 can be connected through processes such as welding, bonding, or hot pressing.

[0063] In one embodiment, the second capillary structure 220 is configured as a mesh structure. The mesh structure helps to improve the structural strength of the second capillary structure 220, thereby improving the structural strength of the capillary structure 200.

[0064] Please see Figure 2 In an embodiment of the present invention, the first capillary structure 210 is provided with a bending allowance 213.

[0065] In one embodiment, the multiple first capillary structures 210 are arranged in a wavy pattern along the width direction of the heat spreader. Specifically, the multiple first capillary structures 210 are spaced apart from each other so that the vacuum cavities 101 corresponding to the two non-bendable sections 320 can be interconnected, thereby ensuring the diffusion effect after the heat transfer fluid evaporates. The wavy arrangement of the multiple first capillary structures 210 provides a bending allowance 213 for the bending of the first capillary structures 210, which is beneficial to improving the bending performance of the first capillary structures 210, thereby improving the bending performance of the heat spreader.

[0066] In another embodiment, all first capillary structures 210 are inclined at a certain angle to the length direction of the heat spreader. Specifically, in the length direction of the heat spreader, the first capillary structure 210 has a first end 211 and a second end 212 disposed opposite to each other. The first capillary structure 210 is inclined at a certain angle to the length direction of the heat spreader in the direction from the first end 211 to the second end 212. This arrangement results in a longer overall length of the first capillary structure 210 compared to an arrangement where the line connecting the first end 211 and the second end 212 is parallel to the length direction of the heat spreader, allowing for a bending allowance 213 and thus improving the bending performance of the heat spreader. The inclination angle and direction of the first capillary structure 210 are not limited here.

[0067] In another embodiment, the first capillary structures 210 are arranged in a wavy pattern along the height direction of the heat spreader. This wavy arrangement of the first capillary structures 210 in the height direction also provides a bending allowance 213 for bending the first capillary structures 210, which is beneficial for improving the bending performance of the heat spreader.

[0068] In another embodiment, the first capillary structure 210 is provided with bending allowance 213 in both the height and width directions of the heat spreader, thereby further improving the bending performance of the heat spreader.

[0069] The present invention also proposes an electronic device comprising an electronic body and a heat spreader. The specific structure of the heat spreader is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. The heat spreader is installed in the heating area of ​​the electronic body.

[0070] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat spreader, characterized in that, include: The outer shell has a vacuum cavity formed inside it, and the vacuum cavity is filled with a heat-conducting fluid; as well as Multiple capillary structures are disposed within the vacuum cavity; The outer shell includes a stacked non-metallic layer and at least one metallic layer. The outer shell is provided with a sealing opening, and the non-metallic layer is provided with an avoidance notch corresponding to the sealing opening.

2. The heat spreader as described in claim 1, characterized in that, The diameter of the clearance notch is 1.0-1.5 times the diameter of the sealing opening.

3. The heat spreader as described in claim 1, characterized in that, The outer casing has an avoidance mark at the location corresponding to the avoidance notch.

4. The heat spreader as described in claim 1, characterized in that, The outer casing includes a metal layer located on the side of the non-metallic layer near the vacuum cavity.

5. The heat spreader as described in claim 1, characterized in that, The outer casing includes two metal layers, which are disposed on both sides of the non-metallic layer.

6. The heat spreader as described in claim 1, characterized in that, The heat spreader includes a bent section and a non-bendable section, and the capillary structure is in contact with the outer shell at both ends along the height direction of the heat spreader, at least at the bent section.

7. The heat spreader as described in claim 6, characterized in that, The capillary structure includes a plurality of first capillary structures disposed in the bendable section. Each first capillary structure includes a plurality of interconnected first substructures, and all the first substructures extend along the length direction of the heat spreader.

8. The heat spreader as described in claim 7, characterized in that, The capillary structure includes a second capillary structure disposed in the inflexible section, the second capillary structure being configured as a mesh structure and connected to the first capillary structure.

9. The heat spreader as described in claim 7, characterized in that, The first capillary structure has a bending allowance.

10. An electronic device, characterized in that, It includes an electronic body and a heat spreader as described in any one of claims 1 to 9, wherein the heat spreader is mounted on the heating area of ​​the electronic body.

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