Extended heat sink with liquid cooling system

Abstract

A hybrid cooling system coupled to a printed circuit board to provide cooling to a component mounted on the printed circuit board, the hybrid cooling system comprising: an extended heat sink coupled to the printed circuit board to form a sealed chamber with the printed circuit board, the extended heat sink having an inner surface and an outer surface; and a contact area on the inner surface of the extended heat sink designed to be in direct physical contact with a top of the component to provide direct contact cooling to the component. The system further comprises a transfer fluid within the sealed chamber and contacting other areas of the component mounted on the printed circuit board to provide liquid cooling to the component.

Description

Technical Field

[0001] This application relates to thermal management systems, and more particularly to an extended heat sink that provides a liquid-cooled extended heat sink integrated with a printed circuit board (PCB) to dissipate heat generated by electronic components. Background Technology

[0002] Central processing units (CPUs), system-on-a-chip (SoCs), graphics processing units (GPUs), tensor processing units (TPUs), neural processing units (NPUs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), power transistors, DC-DC converters, power controllers with integrated switching transistors, triacs, thyristors, diode bridge rectifiers, insulated-gate bipolar transistors (IGBTs), voltage regulators, motor drivers, power factor correction (PFC) circuits, load switches, and other integrated circuits (ICs) generate heat during operation. These components must be adequately cooled to maintain optimal performance and prevent failure.

[0003] In existing technologies, various heat dissipation methods have been employed to absorb and remove heat from ICs and redistribute heat from the hardware.

[0004] Traditionally, cooling methods rely on a combination of radiators and fans, where air is propelled across the radiator to dissipate heat. However, such methods are often insufficient to manage the thermal demands of modern high-performance components.

[0005] One existing technological solution is liquid cooling. In this system, heat is removed not through air, but through the circulation of a liquid such as water or a specialized dielectric fluid. The system typically consists of a substrate attached to a metal cap of the CPU via thermal paste. This substrate forms part of a water block filled with coolant. As the coolant absorbs heat from the substrate, it is transferred through the water block and then directed to a heatsink. At the heatsink, the liquid is exposed to air for cooling, typically using a fan to accelerate the dissipation. The coolant then re-enters the water block, completing the cycle.

[0006] Semiconductor components exhibit a characteristic known as thermal runaway, in which power consumption increases exponentially with increasing temperature. As the die temperature rises, the power required to perform the same computational operation increases, thus exacerbating the thermal load. Without effective heat dissipation, this thermal runaway can escalate, potentially leading to critical temperature levels in the semiconductor system.

[0007] Traditionally, cooling semiconductor dies involves two methods. The first involves heat dissipation through the top surface of the die, where thermal paste bridges the die to a metal heatsink, which is cooled by air or liquid. The second method utilizes a ground pad connected to the package via gold wires, which are linked to a printed circuit board (PCB). This allows some heat to be transferred from the die to the PCB through pins or balls. Although relatively inefficient, even these incremental contributions help mitigate heat in high-performance systems.

[0008] The combined effect of these traditional cooling methods follows the superposition principle, where each thermal gradient—any interface or material transition where a temperature difference exists—helps to reduce the internal temperature of the semiconductor die. However, even using existing conductive cooling techniques, high-performance semiconductor devices typically exhibit internal die temperatures exceeding 100°C in an ambient environment of 30°C.

[0009] To further manage die temperature, many systems include thermal sensors that monitor temperature levels and initiate throttling or other thermal management strategies when the temperature approaches a critical threshold.

[0010] Although immersion cooling has been practiced in the electronics industry for many years, it has several drawbacks because the entire motherboard or sub-assemblies must be submerged in a liquid bath. In such a configuration, interconnects such as wires and cables must be kept out of the liquid, leading to complex and often cumbersome installation. Furthermore, the need for large quantities of liquid makes the system expensive, prone to liquid loss through evaporation, and difficult to manage. Summary of the Invention

[0011] This invention relates to a hybrid cooling system coupled to a printed circuit board (PCB) to provide cooling to components mounted on the PCB. The hybrid cooling system includes: an extended heat sink coupled to the PCB to form a sealed chamber with the PCB, the extended heat sink including a radiator having a skirt extending from the radiator and coupled to the PCB, the extended heat sink having an inner surface and an outer surface; a contact area on the inner surface of the extended heat sink, the contact area being designed to directly physically contact the top of the component to provide direct contact cooling to the component; and a transfer fluid within the sealed chamber and contacting other areas of the component mounted on the PCB to provide liquid cooling to the component. Attached Figure Description

[0012] The invention is illustrated in the accompanying drawings by way of example rather than limitation, wherein the same reference numerals denote similar elements, and wherein:

[0013] Figure 1AThis is a perspective view of an exemplary assembly of an extended heatsink containing two fans on a printed circuit board.

[0014] Figure 1B yes Figure 1A A top view of the system.

[0015] Figure 1C and 1D A close-up of the filler hole used to extend the heat sink and the fastener used to seal the filler hole is shown.

[0016] Figure 1E Another configuration for extending the filler holes of the heat sink is shown.

[0017] Figure 2A An exemplary assembly of an extended heatsink without a fan is shown.

[0018] Figure 2B The panel is shown, in which an exemplary extended heatsink has been removed, but the gasket is in place.

[0019] Figure 3A and 3B The illustration shows the front and rear of an exemplary PCB, with components removed.

[0020] Figure 3C Show Figure 3B A close-up of the X-shaped washer.

[0021] Figures 4A-4B An X-shaped gasket is shown for sealing an extended heatsink to a plate.

[0022] Figure 5A This is an illustration of the top of an exemplary extended heatsink, showing a high thermal conductivity region within the heatsink.

[0023] Figure 5B Show Figure 5A The interior of the extended radiator reveals a highly conductive plug.

[0024] Figure 6 The interior of an exemplary extended heat sink is shown, illustrating a highly conductive region extending throughout the interior.

[0025] Figures 7A-7C Various embodiments for extending the attachment points and attachment point spacing of a heat sink are shown.

[0026] Figure 8A A cross-section of an exemplary system comprising an extended heat sink with hybrid cooling is shown.

[0027] Figure 8B Show Figure 8A The top view of the system shows a subset of the components as transparent.

[0028] Figure 8C and 8D Show Figure 8A The system's cross-section and top view, with secondary cooling flow added.

[0029] Figure 8E Showing an external piezoelectric pump Figure 8A The cross-section and top view of the system.

[0030] Figure 8F The cross-section of the piezoelectric pump and the liquid pipe is shown.

[0031] Figure 9A A cross-section of an exemplary system comprising an extended heat sink with hybrid cooling is shown.

[0032] Figure 9B Show Figure 9A The top view of the system shows a subset of the components as transparent.

[0033] Figure 9C and 9D The location of the liquid tube is shown for the configuration in which the printed circuit board is vertically positioned.

[0034] Figure 10 An exemplary single-sided extended heatsink micro thermal management system is shown.

[0035] Figure 11A An exemplary single-sided extended radiator micro thermal management system with plugs is shown.

[0036] Figure 11B A single-sided miniature thermal management system with plugs is shown, along with multiple fans.

[0037] Figure 12A A multi-component system including plugs is shown.

[0038] Figure 12B-12D Top / bottom views show various configurations of the extended radiator, illustrating the placement of the plugs.

[0039] Figure 13A and 13B An exemplary configuration of a portion of an extended heatsink and its associated plug is shown.

[0040] Figure 14A and 14B An exemplary configuration of a portion of an extended heatsink and its associated plug is shown.

[0041] Figure 15A and 15B An exemplary configuration of a portion of an extended heatsink and its associated plug is shown.

[0042] Figure 16AA cross-section of a micro thermal management system containing in-chip vias for liquid cooling is shown.

[0043] Figure 16B A cross-section of a micro thermal management system containing in-chip vias for liquid cooling is shown.

[0044] Figure 17A The extended radiator is shown, which contains a sensor and a liquid propulsion device within a cavity formed by the extended radiator.

[0045] Figure 17B The diagram shows the configuration of an extended radiator containing a gas bladder within a cavity formed by the extended radiator.

[0046] Figure 17C A gas capsule with a filling hole is shown.

[0047] Figure 17D-17H Various configurations of gas bladders within the extended radiator are shown. Detailed Implementation

[0048] This invention describes a miniature thermal management system comprising an extended heatsink coupled to a printed circuit board. The extended heatsink includes a heatsink portion that mechanically contacts the top of a component to be cooled, and has an extended region or skirt that extends beyond the edge of the component and is coupled to the printed circuit board to create a closed chamber filled with a transfer fluid. The transfer fluid has a high thermal transfer coefficient but is non-conductive (i.e., electrically insulating). The transfer fluid can be a single-phase or two-phase fluid (which transitions from liquid to gas at a known temperature). The miniature thermal management (μTM) system can provide board-level cooling, chip-level cooling, and cooling of one or more components on a printed circuit board. Because the top of the component being cooled is in physical (mechanical) contact with the extended heatsink, the system provides contact-based heatsink-type cooling. Therefore, the system provides a combination of contact-based cooling for the top of the component and fluid-based cooling for other portions of the component on the printed circuit board.

[0049] In various embodiments, gaskets can be used to securely attach the extended heatsink to the printed circuit board to create a leak-proof chamber. In various embodiments, the gasket may be an X-shaped gasket. The gasket can be made of any flexible, deformable material suitable for sealing. In various embodiments, the X-shaped gasket is positioned above a silkscreen layer on the printed circuit board. In various embodiments, the silkscreen layer may be two stacked layers to provide a smooth surface above the traces on the printed circuit board and to provide a liquid barrier.

[0050] The portion of the extended heatsink that contacts the top of the component is called the contact area. The contact area can be made of a high thermal conductivity material, such as copper. Copper is high-purity copper, which is typically too soft for the component but has very high thermal conductivity. In various embodiments, the contact area is a plug inserted into the heatsink. The contact area can be made of a different material than the rest of the heatsink. The use of a plug also allows the system to support components of various heights without requiring a redesign of the extended heatsink. In various embodiments, the contact area of ​​the heatsink can be fins, or other structures that provide physical contact while allowing fluid flow. In various embodiments, the portion of the extended heatsink that contacts the top of the component can have liquid through-holes that allow fluid to pass through a portion of the extended heatsink.

[0051] In various embodiments, sensors may be located within the chamber. The sensors may be pressure sensors and / or temperature sensors. The system may include liquid tubing to propel liquid from a colder region to a hotter region and ensure the propulsion of the transfer fluid. In various embodiments, the system may include a liquid propulsion device, such as a motor, to ensure the transfer fluid circulates around the chamber. In various embodiments, in addition to sensors, the micro thermal management system may also include a gas bladder within the chamber. The gas bladder expands and contracts to facilitate pressure equalization within the chamber. In some embodiments, the gas bladder may have an inlet on the exterior of an extended heat sink, allowing the gas volume within the bladder to be increased or decreased.

[0052] In various embodiments, a micro thermal management system can provide inter-chip liquid cooling by including inter-chip liquid flow orifices beneath the components to provide improved cooling, thereby ensuring that the transfer fluid is in bottom contact with the bottom of one or more components on the printed circuit board. In some embodiments, the system may utilize flow orifices through the integrated circuit package to provide in-chip cooling, allowing the transfer fluid to flow closer to heat sources. In-chip cooling allows the transfer fluid to enter the circuit package. Because the system uses an electrically inert transfer fluid, the transfer fluid is in contact with the chip within the package. In some embodiments, the transfer fluid is in direct contact with the die within the integrated circuit package. Additionally, extended heat sinks can protect components from radiation and other potential sources of damage.

[0053] The following detailed description of embodiments of the present invention refers to the accompanying drawings, in which like reference numerals denote similar elements, and the drawings illustrate specific embodiments for practicing the invention by way of illustration. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Those skilled in the art will understand that other embodiments may be utilized, and logical, mechanical, electrical, functional, and other changes may be made without departing from the scope of the invention. Therefore, the following detailed description should not be considered limiting, and the scope of the invention is defined only by the appended claims.

[0054] Figure 1A This is a perspective view of an extended heatsink assembly including two fans on a printed circuit board. The extended heatsink 120 is attached to the printed circuit board (PCB) 110 to form a sealed chamber. A non-leaking (due to the sealed chamber) transfer fluid is present inside the chamber. In various embodiments, the transfer fluid is filled into the chamber using a filling orifice 127.

[0055] The top of the extended heat sink 120 may have protrusions that increase surface area to enhance heat dissipation. As shown, the protrusions may be ridges extending parallel to each other. The ridges may have a square or rectangular cross-section. Alternatively, the protrusions may be fingers or other elements, as known in the field of heat sinks. In various embodiments, one or more fans 130 are coupled to the top of the extended heat sink 120 for further heat dissipation. The PCB 110 has a plurality of external connectors 140, which are not located within the extended heat sink 120. The connectors 140 may be used to connect components within the extended heat sink to external signals and systems. In various embodiments, the external connectors include outputs for signaling information about the interior of the extended heat sink 120. For example, as shown, temperature sensors and / or pressure sensors within the extended heat sink may output values ​​via the external connectors and / or displays in the displays 140. In various embodiments, the extended heat sink 120 may have a top portion and a bottom portion 125. In this case, liquid may flow through through-holes in the PCB 110, allowing the fluid to circulate between the top portion 123 and the bottom portion 125 of the extended heat sink 120.

[0056] Figure 1B yes Figure 1AThe system is shown in top view. The extended heatsink 120 is attached to the PCB 110 via attachment point 150. The attachment can be a screw, bolt, or rivet. Alternatively, glue or other connectors or attachment mechanisms can be used. If the extended heatsink has a top portion and a bottom portion, the screw can pass through the top portion and enter a threaded hole in the bottom portion of the extended heatsink. The attachment can secure the extended heatsink 120 to the PCB 110 in a liquid-safe manner. In one embodiment, the external connector and / or display 140 includes a display 145 to show the pressure or temperature within the cavity formed by the extended heatsink 120. In some embodiments, the surface of the extended heatsink 120 can be treated in various ways to increase heat dissipation. The body of the extended heatsink can be made of a variety of materials. In various embodiments, instead of the two fans 130 shown, any number of fans, from one to eight or more, can be present. In the illustrated configuration, the PCB 110 also includes a snap-fit ​​connector 160 for attaching the PCB to a socket. This is an optional configuration, and the connector can be on only one side of the PCB. Other types of connectors can be used.

[0057] Figure 1C and 1D A close-up of the filler hole for the extended radiator and the fasteners for sealing the filler hole are shown. The filler hole 127 is sealed to ensure the extended radiator is leak-proof. One way to seal the filler hole 127 is to close the filler hole by using a threaded plug or bolt 180 with a tight-fitting O-ring 190 to provide a liquid barrier. The filler hole 127 can be drilled all the way through the thread. The hole into which the bolt is inserted can include a recessed undulation for the O-ring 190. The hole can be recessed, and the bolt 180 can be a flanged bolt for better sealing of the filler hole 127.

[0058] Figure 1E Another configuration for the filling hole used in the extended radiator is shown. In this configuration, the filling hole 127 is centered, while the filling vent 194 surrounds the filling hole in an annular shape. The filling hole 127 and the filling vent 194 are sealed by a piezoelectric pump (not shown). The pump is attached using an attachment hole 196. The attachment hole is not drilled through, but terminates in the wall of the extended radiator portion 192.

[0059] Figure 2A An example of a fanless, assembled extension heatsink is shown. Extension heatsinks may not include any fans, such as... Figure 2AAs shown. In another embodiment, a fan may be attached to an extended heatsink, and this is an assembly step prior to attaching the fan. The figure shows the bottom 225 of the extended heatsink more clearly. Although the bottom of the extended heatsink is shown as shorter than the top 220, the height of the extended heatsink depends on the height of the components enclosed within the cavity formed by the extended heatsink. In a configuration where components are present on both sides of the PCB 210, the bottom portion 225 of the extended heatsink may be the same height as or higher than the top portion 220.

[0060] Figure 2B An example of a board is shown where the extended heatsink is removed, but the gasket is in place. As can be seen, gasket 250 is located below the extended heatsink to provide a leak-proof connection between the extended heatsink and PCB 210. In various embodiments, the gasket is a standard gasket that is arranged around the attachment point. The gasket can be made of any material that provides a seal to prevent leakage of the fluid passing through the cavity. For example, the gasket can be made of natural rubber (NR), neoprene rubber (CR), nitrile rubber (NBR), EPDM (ethylene propylene diene monomer), silicone rubber, vinylidene fluoride monomer-based material (FKM), butyl rubber (IIR), SBR (styrene-butadiene rubber), or chlorosulfonated polyethylene synthetic rubber (CSM). In various embodiments, the gasket is fitted within a recess in the extended heatsink and onto the top of a screen-printed layer on the printed circuit board to form a liquid-tight seal.

[0061] The purpose of the extended heatsink is to provide miniature thermal management (cooling) to one or more components 260 on PCB 210. Component 260 can be any heat-generating component on PCB 210, such as a central processing unit (CPU), graphics processing unit (GPU), memory, etc. The system can be used with PCBs that support any type of computer system, from servers to gaming devices to dedicated devices, such as those in vehicles or other systems, or quantum computers. The PCB 210 shown contains multiple heat-generating components, including a central component and other components. As shown in this example illustration, there are six screws for attaching the extended heatsink. Also shown in this illustration is a liquid through-hole 240 through which fluid is transferred from the top chamber to the bottom chamber. In various embodiments, besides in Figure 2A In addition to the visible liquid vias seen in the diagram, there are additional liquid vias in PCB 210. The size and location of the liquid vias are exemplary. Typically, the size and location of liquid vias are designed to allow the transfer fluid to circulate through the chamber without interfering with components and traces on the printed circuit board.

[0062] Figure 3A and 3BIllustrations of the front and rear portions of an exemplary PCB 310 are shown, with components removed. Liquid vias 320 are distributed in multiple locations on the PCB 310. The liquid vias 320 are positioned to maximize liquid flow within the chambers of the extended heatsink, thereby increasing heat exchange between the liquid and the inner surface of the extended heatsink. The liquid vias 320 are positioned so as not to interfere with any components or traces on the printed circuit board. Therefore, the liquid vias can be moved based on the PCB layout. Where possible, a closely spaced set of liquid vias exists, as shown here, with only small gaps between the vias. This increases liquid flow without compromising the structural integrity of the PCB. Once attached, the extended heatsink provides further support to the PCB, enabling a greater number of liquid vias without compromising the structural integrity of the PCB. In various embodiments, the liquid vias are metal-plated and coupled to a ground plane in the PCB for further heat dissipation through the ground plane.

[0063] In various embodiments, such as Figure 3A As shown, a silkscreen layer exists on the PCB for marking components and other content on the PCB. Additionally, a silkscreen layer is used around the edge of the extended heatsink to provide silkscreen paths for the gasket. Silkscreen layer 330 provides a liquid seal and engages with the gasket to provide a leak-proof seal extending the heatsink to the PCB 310. In various embodiments, the silkscreen layer providing the liquid seal is a double layer. Because the silkscreen layer is above the traces in the PCB, it is not completely smooth. The double layer provides a smoother sealing surface and ensures that there are no micro-gaps in the silkscreen layer below the gasket. Figure 3B One configuration of the plate is shown, illustrating a through-hole for fluid transfer and an X-shaped gasket. In various embodiments, the gasket is an X-shaped gasket. An X-shaped gasket can replace a round gasket. The X-shaped gasket provides an additional layer of security for leak-proof attachment because it has four separate contact areas. Other types of gasket configurations can also be used.

[0064] Figure 3C Show Figure 3B A close-up of the X-shaped washer. The washer 350 is arranged around the attachment screw hole / attachment screw 360 and around the entire extended heatsink to provide a leak-proof seal. In various embodiments, the X-shaped washer 350 is placed on top of the double-layered screen mesh 330, which provides a smooth surface and some liquid resistance. This close-up shows that traces 370 exist beneath the screen mesh layer 330. By doubling the screen mesh layer, the mesh is horizontal, even though it passes through traces 370 on the PCB. The X-shaped washer provides a better seal because of the X-shaped cross-section (in... Figure 4B (As best seen in the image), there are two layers of seals effectively between each component.

[0065] Figures 4A-4BAn example of an extended heatsink is shown, featuring an X-shaped gasket for sealing the extended heatsink to the plate. Figure 4A This is a simplified cross-sectional view of the extended heat sink and printed circuit board. Component 415 is mounted on PCB 410. An extended heat sink 430 is present, coupled to PCB 410, which includes a contact area portion and an extension area or skirt extending from the heat sink to PCB 410. The heat sink and skirt form an extended heat sink that surrounds and fills a closed chamber filled with fluid 440. The inner surface of the extended heat sink also includes a contact area 435 formed by an internal heat sink connection 437 to the extended heat sink, which contacts the top of component 415 to provide contact-based cooling. The form of the contact area can vary. The contact area can be solid, can contain liquid through-holes, or can have fins or fingers, similar to a heat sink.

[0066] Therefore, the system provides contact-based cooling through the contact area 435 of the extended radiator and liquid cooling through a transfer fluid 440 enclosed within the cavity formed by the extended radiator. In various embodiments, the transfer fluid 440 flows in a convection mode, propelling heat from component 415 to the inner surface of the extended radiator 430. The outer surface of the extended radiator 430 includes fans, fins, and / or other elements to dissipate heat. The rising of hotter material or gas creates a temperature difference between the heated transfer fluid 440 and the cooler surface of the extended radiator 430, causing the transfer fluid to flow within the cavity formed by the extended radiator. In various embodiments, the transfer fluid may have one phase, meaning it remains in liquid form throughout the process. In other embodiments, the transfer fluid may transition between phases, changing from liquid to gas where it is heated above its boiling point, and then changing back to liquid when the gas flows into a region where it is cooled below its boiling point. The boiling point of the transfer fluid can be selected for optimal convective motion. In various embodiments, the boiling point may be 55 degrees Celsius. The boiling point can be selected based on the expected temperature range of the component being cooled. The use of a two-phase transfer fluid can increase the level of convection because the gas rises faster than the heated liquid due to its lower density. In various embodiments, perfluorinated compounds (PFCs) and / or perfluorocarbons can be used as the transfer fluid. In various embodiments, 3M™'s Fluorinert™ electronic fluid can be used as the transfer fluid.

[0067] The extended heatsink 430 is securely fastened to the PCB 410 to ensure that the fluid 440 transferred within the chamber does not leak. In various embodiments, this is achieved by using a double layer of wire mesh 420 beneath the gasket 450. The gasket in various embodiments is an X-shaped gasket containing four protrusions, providing two tight-fit seals on each side, such as... Figure 4B The cross-sectional view is shown.

[0068] Figure 5A An example of the top of an extended heat sink is shown, illustrating a high thermal conductivity region within the body of the extended heat sink. In this configuration, a plug 520 of a high thermal conductivity material is present as part of the body of the extended heat sink. In various embodiments, the plug 520 is copper (copper with high purity, such as a purity greater than 99.5% or 99.9%). In various embodiments, the remainder of the extended heat sink 510 is a material with high rigidity, such as aluminum. In various embodiments, the plug 520 is the portion of the extended heat sink that physically contacts the component to be cooled. Using aluminum and copper plugs combines the structural strength of aluminum with the high thermal conductivity of copper. Although the example shown uses copper and aluminum, the materials used can be different. In various embodiments, the entire extended heat sink can be made of a high thermal conductivity material without a separate plug. In some other embodiments, the entire extended heat sink can be made of a single material, but a plug may be present to allow for adjustment of the height of the contact area.

[0069] Figure 5B Show Figure 5A The interior of the extended heat sink is shown with a highly conductive plug. In this embodiment, the plug base 530 extends beyond the contact area 540. The height of the contact area 540 is designed and sized to fit closely to the component. The contact area 540 directly contacts the component. In various embodiments, a thermally conductive material may be placed between the contact area 540 and the top of the component. The thermally conductive material may be a thermal adhesive, thermal paste, thermal gel, heat, thermal pad, thermal grease, thermal compound, combination of these materials, and / or other materials with high heat flux. This thermal layer is designed to ensure no microgaps in the contact between the component and the contact area 540 and to provide good thermal conductivity and stability. It also allows for some flexibility in the design of the plug base 530, which is sized to physically contact the component without requiring sub-millimeter precision. Although only a single contact area 540 is shown, a single extended heat sink may have multiple plugs, and / or multiple contact areas within a single plug, depending on the components within the extended heat sink, as follows: Figure 12A-12D As shown in the example.

[0070] Figure 6An example of the interior of an extended heatsink is shown, illustrating a highly conductive region extending throughout the interior. In this configuration, instead of a plug extending through the extended heatsink, an insert 620 is present on the top of the extended heatsink 610. The insert includes a contact area 630, or multiple contact areas as described above. In various embodiments, the insert 620 may extend only over a portion of the interior of the extended heatsink. The insert may also extend along the side of the extended heatsink. In various embodiments, there may be two or more inserts 620, thereby covering a portion of the top of the extended heatsink.

[0071] Figures 7A-7C Various configurations of attachment points and their spacing are shown for extending the radiator. The number of attachment points depends on the size of the extended radiator. For smaller extended radiators, such as... Figure 7A As shown, the four attachment points 710 at the four corners may be sufficient. For larger rectangular extended heat sinks, such as Figure 7B As shown, additional attachment points 725 can be positioned between corner attachment points 720. For larger extended heat sinks, such as Figure 7C As shown, additional attachment points 735 can be positioned between attachment points 730. The attachment point spacing 740 is determined by the system based on the height and volume of the liquid in the chamber of the extended radiator. In various embodiments, the system can be configured to minimize the number of attachment points, as long as the attachment points firmly support the extended radiator and provide a leak-proof system.

[0072] Figure 8A A cross-section of one configuration of a system including an extended heat sink with hybrid cooling is shown, while Figure 8B Show Figure 8A The top view of the system shows a subset of the components as transparent.

[0073] The system includes a printed circuit board 870 supporting a support member 840. The printed circuit board includes a plurality of liquid vias 875 that allow a transfer fluid 850 to circulate in a chamber 815 formed by the top and bottom of an extended heat sink 810. In some embodiments, an air gap is present at the top of the chamber 815 to allow the liquid to expand due to heat and / or phase change if the transfer fluid is a two-phase liquid.

[0074] Component 840 is cooled by passing fluid 850 and by contacting contact area 820 of the extended heatsink. In various embodiments, contact area 820 is coupled to component 840 using a thermal connector 830. Thermal connector 830 can be thermal paste, a thermal pad, or another type of connector. In various embodiments, thermal connector 830 is waterproof and will not be damaged by the passed fluid 850. Gasket 860 ensures that the attachment of the extended heatsink to the PCB is seamless and leak-proof. In various embodiments, for example, as... Figure 8B As shown, the gasket surrounds the edge of the PCB, thus defining the shape of the extended heatsink. The closed attachment point 880 is located outside the gasket.

[0075] In various embodiments, a liquid conduit 855 is present in the chamber for drawing cooler liquid from the bottom of the chamber 815 to the component 840. The liquid conduit 855 acts as a siphon and functions due to the heat of the component 840. In various embodiments, the liquid conduit 855 may be positioned below the component 840. In other embodiments, the liquid conduit 855 may be positioned elsewhere to propel liquid from a cooler region to a warmer region within the chamber 815.

[0076] Figure 8C and 8D Show Figure 8A The system is shown in cross-section and top view, with a secondary cooling flow added. In this configuration, an additional secondary cooling flow 890 has been added to the system. The secondary cooling flow utilizes a separate path for the coolant, which is isolated from the transfer fluid 850. The secondary cooling flow 890 exits the extended radiator 810 and is cooled by a cooler (not shown) outside the system. Although the secondary cooling flow 890 is shown as having a circular conduit with a single inlet and a single outlet for the fluid, alternative embodiments may include bends or additional inlet and / or outlet points. The coolant used does not need to be non-conductive and may be water or another liquid.

[0077] Figure 8E Showing an external piezoelectric pump Figure 8A The system is shown in cross-section and top view. In this configuration, a piezoelectric pump 894 is used as a liquid propulsion device to power the flow in the liquid line 892. In one embodiment, the piezoelectric pump 894 includes an inflow area and pushes the transfer fluid through the liquid line 892. This provides cooling to the components and ensures liquid flow.

[0078] Figure 8FA cross-section of the piezoelectric pump and the liquid line is shown. The piezoelectric pump 894 is positioned above the filling orifice for the extended radiator 810. The filling orifice 899 contains a central filling port that serves as the pump outlet. During the filling of the extended radiator 810 with the transfer fluid, the filling orifice 899 is used to add the transfer fluid, and the inlet orifice 896 is a filling vent. When the piezoelectric pump 894 operates, the pump draws the transfer fluid into its chamber through the inlet orifice 896 and ejects the transfer fluid through the liquid line 892. A valve 898 ensures that the transfer fluid enters through the inlet orifice 896 and exits through the liquid line 892. In various embodiments, the inlet orifice 896 is annular. The liquid line 892 may be integrally manufactured with the extended radiator 810 or may be a separate component, such as a conduit.

[0079] Figure 9A A cross-section of an exemplary configuration of a system including an extended heatsink with hybrid cooling is shown, while Figure 9B Show Figure 9A The system is shown in a top view, with a subset of components appearing transparent. In this configuration, components are present on both sides of the PCB 910 within the extended heatsink 920. In this illustration, the extended heatsink does not include plugs. However, a double-sided configuration may also include plugs.

[0080] The component is cooled by the transfer of fluid and by contact with a contact area of ​​an extended heat sink. In various embodiments, the contact area is coupled to the component using a thermal connector 930. In this configuration, the thermal connector is a non-liquid-resistant paste or other material, and therefore a barrier layer 940 is placed around the thermal connector 930 to isolate it from the transfer fluid 950 within the chamber. In some embodiments, the barrier layer 940 is also a thermal connector, such as a thermal adhesive, while the thermal connector layer is a thermal grease or another material with a higher thermal conductivity than the barrier layer. In another embodiment, the barrier layer may not be a thermally conductive material.

[0081] A liquid via 915 in PCB 910 allows fluid to circulate between the top and bottom portions of an extended heatsink. The liquid via is located in an area of ​​PCB 910 where there are no components or traces. In various embodiments, the liquid via 915 is metal-plated to increase thermal conductivity. The liquid via may be connected to a PCB ground plane.

[0082] In various embodiments, the liquid conduit 955 is positioned to draw cooling liquid from a cold location within the chamber of the extended radiator 920 to a hot location adjacent to the component. Liquid movement may be based on the pressure difference between the cold liquid at the bottom and the hot liquid / gas at the top. In various embodiments, a liquid actuator may be used to propel water through the liquid conduit 955. The liquid actuator may be a piezoelectric pump, such as... Figure 8D and 8E As shown.

[0083] Figure 9C and 9D Alternative locations for the liquid conduit in a configuration for vertical positioning of a printed circuit board are shown. In this configuration, in various embodiments, a liquid agitator 970 is used to propel liquid from the bottom of an extended heat sink 920 to a heat-generating component. In various embodiments, the liquid agitator 970 is located within the extended heat sink 920, propelling liquid through a liquid conduit 960. In other embodiments, the liquid agitator 970 may be external to the extended heat sink 920 as shown, and the liquid agitator 970 may provide power to move liquid through the liquid conduit 960. When the liquid agitator 970 is external to the extended heat sink 920, connection can be made through a filling port 980 for filling a chamber with the transfer fluid. The liquid agitator 970 may be a piezoelectric motor. By placing the liquid agitator 970 external to the extended heat sink 920, the liquid agitator 970 can be serviced in situ without opening the extended heat sink. In another configuration, the liquid agitator may be absent, and a pressure differential may be used. The liquid agitator may also be used for... Figures 8A-8D The configuration or other configurations shown.

[0084] Figure 10 A configuration of a single-sided hybrid cooling system is shown. In this configuration, the extended heatsink 1010 has a chamber 1015 with a flat interior rather than a raised contact area. A thermal connector 1020 connects the contact area of ​​the extended heatsink 1010 to a component 1040 on the PCB 1030. The extended heatsink has no bottom portion and therefore no liquid through-hole. A disadvantage of this configuration is that it requires a specific design for each PCB, as the height of the extended heatsink is designed to match the height of the component 1040. Although not shown here, the interior of the extended heatsink can have multiple heights to accommodate the configuration of multiple components on the PCB 1030.

[0085] Figure 11AA single-sided hybrid cooling system with a plug is illustrated. In this configuration, an extended heatsink 1110 on PCB 1130 includes a plug 1120 extending from the interior to the exterior of the extended heatsink 1110. The plug 1120 includes a contact area that may protrude to match the height of component 1140. In various embodiments, the plug 1120 is made of a highly thermally conductive material, such as copper. Alternatively, the plug 1120 may be made of the same material as the extended heatsink 1110. In various embodiments, the plug 1120 has a through-hole 1125 through which transfer fluid within the chamber can pass. The through-hole in the plug consists of one or more holes that allow transfer fluid to pass through. The through-hole 1125 through the plug 1120 facilitates the circulation of the transfer fluid. Although the through-hole 1125 is shown in a single-sided extended heatsink, such a through-hole 1125 can be used in any configuration of an extended heatsink including a plug extending beyond the inner surface of the extended heatsink 1110.

[0086] Figure 11B A configuration of a single-sided hybrid cooling system with plugs is shown, illustrating multiple fans. The fans can be used to increase airflow through the exterior of the extended heatsink 1110 for more efficient cooling. One or more fans 1150 may be coupled to or closely adjacent to the extended heatsink. In various embodiments, the extended heatsink and / or plug 1120 may have fins extending above the top of the extended heatsink 1110. In various embodiments, fans 1150 may be associated with the plugs to increase airflow, particularly on the fins of the plug 1120.

[0087] Figure 12A An exemplary configuration of a multi-component system including plugs is shown. In the illustrated configuration, multiple components reside within an extended heatsink 1210, and the extended heatsink 1210 includes multiple plugs 1220, 1230, and 1240, each plug being associated with component 1225, 1235, and 1245, respectively. It can be seen that the interior of the extended heatsink 1210 has a horizontal surface, but the plugs 1220, 1230, and 1240 have different heights to accommodate the different sizes of components 1225, 1235, and 1245. This allows the system to support contact-based cooling for multiple components of different heights by varying the plug sizes without redesigning the extended heatsink 1210 itself. This type of plug configuration can be used with both single-sided and double-sided extended heatsinks as shown. Although three components are illustrated, those skilled in the art will understand that a single extended heatsink can support any number of components with or without plugs.

[0088] Figure 12B-12D Top / bottom views showing various configurations of the extended radiator, illustrating the placement of the plugs. Figure 12B In the first configuration shown, there are three components in one row, similar to... Figure 12A The configuration shown associates each component with plug 1260. Figure 12C In the configuration, there are four components arranged in a regular pattern, and each component has the same size and an associated plug 1270. Figure 12D In the configuration, there are five plugs 1280, and each plug has a different size based on the size of the corresponding component cooled by the plug. It should be understood that this application is not limited to any particular number of components or plugs of a particular size within the extended heatsink. In various embodiments, the plug size may be designed to cover the entire top of the component and extend beyond the edge of the component. In alternative embodiments, the plug size may be designed to be exactly the same as or smaller than the size of the component. Additionally, these views are top / bottom views because they may show the top or bottom of the extended heatsink.

[0089] Figure 13A and 13B This diagram illustrates a portion of an extended heatsink and one configuration of an associated plug. The extended heatsink portion 1310 shown includes a gap or cutout 1320 for the conductive plug. In some embodiments, the extended heatsink is manufactured as a single piece, and the gap 1320 is cut from the extended heatsink based on the size, location, and configuration of components on the PCB to which the extended heatsink is designed. In various other embodiments, the extended heatsink may be manufactured with the gap 1320, or the gap may be created in another manner. The thermally conductive plug 1330 is designed to have a plug extension 1350 that fits into the gap 1320, and a plug base 1340 located inside the extended heatsink and providing a contact area for the component. The plug base has a height 1370 that matches the component, allowing the thermally conductive plug 1330 to make direct contact with the component. The plug extension 1350 has a height 1360 that matches the thickness of the extended heatsink. In various embodiments, the top of the extended heatsink is flat, and the plug 1330 does not extend beyond the top of the extended heatsink. In some embodiments, the top of the extended heat sink may have fins or other cooling structures, and the plug may have matching fins or other structures. The plug 1330 may be glued to the extended heat sink 1310 using adhesive 1380, or may be attached using another mechanism (e.g., pressure fit).

[0090] Figure 14A and 14BAn alternative configuration of the plug is shown, illustrating a portion of an extended heatsink and an associated plug. The extended heatsink portion 1410 includes a gap 1420. The gap 1420 is shaped to fit the plug 1430. In some embodiments, the sides of the plug are angled to provide a more secure fit into the gap in the extended heatsink 1410. The thermally conductive plug 1430 is designed to have a wider bottom surface that contacts the component and a narrower top surface that extends to the top of the extended heatsink 1410. The plug 1430 is glued to the extended heatsink using adhesive 1440.

[0091] Figure 15A and 15B Another alternative configuration of the plug is shown, illustrating a portion of the extended radiator and the associated plug. Figure 15A A plug 1510 is shown with a plug base 1520, the plug base being a contact area of ​​a component within a cavity formed by an extended heat sink. For example... Figure 15B As shown, the extended heatsink portion 1530 receives a plug. A plug base 1520 extends from the interior 1540 of the extended heatsink. In various embodiments, the plug extension through the extended heatsink 1530 is flush with the exterior 1545 of the extended heatsink. In another configuration, the plug may extend beyond the top of the extended heatsink. In this illustration, both the plug base and the plug extension are circular.

[0092] In the previous example illustrations, shapes included squares, rectangles, cones, and truncated cones. However, the shape of the plug is not limited to these examples. The plug can be any shape suitable for the component it is cooling. In some embodiments, the base and extension of the plug can be different shapes. In some embodiments, the plug may not have separate base and extension, for example, as shown in the example. Figure 14A and 14B As shown. In various embodiments, the system of the present invention can utilize custom plugs for the components being cooled, enabling contact-based cooling within an extended heat sink in addition to liquid cooling.

[0093] Figure 16AA cross-section of a system including in-chip vias for liquid cooling is shown. In this configuration, there is a dual-sided extended heatsink 1630 forming a liquid chamber 1635 to cool a component 1620 on a PCB 1610. The extended heatsink 1630 has a contact area 1625 that contacts the top portion of the component 1620. In addition to contact-based cooling through the contact area 1625, the system also provides liquid cooling to other portions of the component 1620 by filling the chamber formed by the extended heatsink with transfer fluid. In this configuration, the PCB 1610 includes a plurality of inter-chip liquid flow holes 1615 that allow transfer fluid in the chamber 1635 to flow between connection pins below the component 1620. Although a BGA (Ball Grid Array) component 1620 is shown, the connection pins of the component 1620 can be varied. In addition to the top and sides, the inter-chip liquid flow holes 1615 also enable the system to use transfer fluid to cool the connection pins and the bottom of the component 1620. Figure 16A It also shows the external cooling fins 1640.

[0094] Figure 16B A cross-section of one configuration of a system including in-chip vias for liquid cooling is shown. In this configuration, there are dual-sided extended heat sinks 1680 forming a liquid chamber 1685 to cool a component 1670 on a PCB 1650. The extended heat sink 1680 has a contact area 1675 that contacts the top portion of the component 1670. In addition to contact-based cooling through the contact area 1675, the system also provides liquid cooling to other portions of the component 1670 through a transfer fluid within the chamber formed by the extended heat sink. In this configuration, the system includes an in-chip liquid flow via 1695 through the component package. This allows the transfer fluid cooling to be closer to the actual heat source (the working part of the component). Although a BGA (Ball Grid Array) component 1670 is shown, the attachment mechanism of the component 1670 can vary. The in-chip liquid flow via 1695 provides cooling within the component itself. In various embodiments, the system may have an in-chip liquid flow via 1695 but not an inter-chip liquid flow via 1655. Alternatively, in the dual-sided extended heat sink, in-chip cooling can be combined with inter-chip liquid flow holes 1655. Figure 16B It also shows the external cooling fins 1690.

[0095] Figures 17A-17H Various configurations of an extended heat sink with additional objects within the chamber are shown. Such a component may include one or more of a sensor, a gas bladder, and a liquid propulsion unit. Figure 17AAn extended heat sink is shown with a sensor 1710 and a liquid propulsion device 1715 within its chamber. The sensor 1710 can be coupled to the extended heat sink or a printed circuit board. The sensor can be a pressure sensor and / or a temperature sensor. The output of the sensor 1710 can be obtained by a user outside the extended heat sink. For example, a user can be able to monitor the internal temperature of the fluid passing through the component and / or the extended heat sink to ensure the component is at the optimal temperature for processing. The output of the sensor 1710 can be additionally or alternatively used to control the liquid propulsion device or gas bladder, as described below.

[0096] The system may also include one or more liquid propellers 1715 within the extended radiator. The transfer fluid is propelled through the extended radiator because when the transfer fluid is heated, it becomes less dense and thus rises, and when it is cooled by contact with the extended radiator, it descends. This creates convective propulsion of the transfer fluid within the chamber of the extended radiator. However, the liquid propeller 1715 may optionally be added within the chamber of the extended radiator. The liquid propeller 1715 may be, for example, an integrated micropump for actively circulating the transfer fluid, a vibrating motor for generating mechanical stirring within a sealed chamber formed by the extended radiator, a small immersion fan or propeller, a piezoelectric motor, a thermoelectric cooler (TEC) within the extended radiator for generating a temperature gradient to promote fluid movement through thermal circulation, a loudspeaker for generating sound waves, a piezoelectric buzzer for generating ultrasonic vibrations, a piezoelectric diaphragm pump, or another structure for promoting the movement of the transfer fluid. Such a liquid propeller can be used with all configurations of single-sided or double-sided extended radiators and all configurations of the aforementioned flow orifices. In various embodiments, the output of sensor 1710 can be used to regulate liquid propulsion 1715 to dynamically regulate the flow of the transfer fluid.

[0097] Figure 17B The illustration shows an optional addition of a gas bladder 1725 to the chamber of an extended radiator. A relationship exists between temperature, pressure, and volume; as temperature increases, the volume of the transfer fluid, which can be a two-phase fluid, also increases. The gas bladder 1725 is used to regulate pressure, thereby affecting the temperature within the chamber of the extended radiator. In various embodiments, the gas bladder 1725 allows the chamber to be partially filled with the transfer fluid, while the remaining volume is filled by the gas bladder. This also provides a way to release pressure, as the gas is compressed by the transfer fluid (or transfer gas) because of its lower density when the transfer fluid (or transfer gas) expands due to heat. Figure 17B The sensor component 1720 on the PCB is also shown.

[0098] Figure 17CThe diagram shows a configuration of the gas capsule 1730 with a filling orifice 1735. This allows the system to regulate pressure and thus temperature by adjusting the gas volume within the gas capsule 1730, rather than simply compressing an existing volume of gas. This provides even greater flexibility than compressible gas within a capsule. In various embodiments, an automatic filling / emptying system may be present, which can automatically adjust the volume of the gas capsule 1730 based on temperature / pressure data from sensors.

[0099] Figure 17D-17H Various configurations of a gas capsule that can be used are shown. The configuration includes a gas capsule 1740, which is located behind some components 1745, such as... Figure 17E As shown; the gas capsule 1750 is located next to the component, as... Figure 17F As shown; the gas capsule 1760 is located around the component, as Figure 17G As shown; or as multiple separate gas capsules 1770, such as Figure 17H As shown. Other alternative configurations of the gas capsule can be used. Gas filler 1755 can be added to any of the configurations shown to provide external adjustability of the gas capsule via filler hose 1757. In various embodiments, the gas capsule is filled with a highly thermally conductive gas. In various embodiments, the gas capsule is filled with a highly compressible gas that is lighter than the gaseous form of the fluid being transported. In various embodiments, the gas capsule is filled with nitrogen, which is highly compressible and a good thermal conductor.

[0100] In the foregoing description, the invention has been described with reference to specific exemplary embodiments thereof. However, it will be apparent that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention as set forth in the appended claims. Therefore, the description and drawings should be considered illustrative rather than restrictive.

[0101] The claims define the matters to be protected.

[0102] In addition, the following information is provided in various aspects of this specification.

[0103] 1. A hybrid cooling system, comprising:

[0104] A printed circuit board having components mounted thereon;

[0105] An extended heat sink is connected to the printed circuit board and forms a sealed chamber with the printed circuit board, the extended heat sink having an inner surface and an outer surface;

[0106] A contact area, which is a portion of the inner surface of the extended heat sink, directly and physically contacts the top surface of the component; and

[0107] The fluid transferred within the sealed chamber.

[0108] 2. The hybrid cooling system according to technical solution 1 further includes:

[0109] A thermal connector between the contact area and the top surface of the component.

[0110] 3. The hybrid cooling system according to technical solution 2, wherein the thermal connector comprises one of the following: a thermal pad, a thermal grease, and a thermal adhesive.

[0111] 4. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0112] A plug having the contact area, the plug being made of a material having a higher thermal conductivity than the extended heat sink.

[0113] 5. The hybrid cooling system according to claim 4, wherein the plug has a portion extending from the inner surface of the extended heat sink, the portion extending from the extended heat sink including the contact area.

[0114] 6. The hybrid cooling system according to technical solution 4 or technical solution 5, wherein the plug extends along the top inner surface of the extended radiator.

[0115] 7. The hybrid cooling system according to any one of technical solutions 4 to 6 further includes:

[0116] The cutout in the extended radiator for the plug.

[0117] 8. The hybrid cooling system according to any one of technical solutions 4 to 7, wherein the top of the plug is flush with the surface of the extended heat sink of the extended heat sink.

[0118] 9. The hybrid cooling system according to any one of claims 4 to 8, wherein the plug comprises copper and the extended heat sink comprises aluminum.

[0119] 10. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0120] One or more fans are mounted on the exterior of the extended heat sink.

[0121] 11. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0122] Multiple additional components, said multiple additional components on the printed circuit board; and

[0123] Multiple additional contact areas are located inside the extended heat sink, and each additional contact area corresponds to a different additional component among the multiple additional components.

[0124] 12. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0125] An X-shaped gasket is positioned to provide a seal between the extended heat sink and the printed circuit board.

[0126] 13. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0127] A sensor, located within the sealed chamber, is used to sense one or more of the following: pressure and temperature, and the sensor has an output available outside the extended heat sink.

[0128] 14. The hybrid cooling system according to technical solution 13 further includes:

[0129] A gas-filled bladder within the sealed chamber, wherein the bladder is capable of expanding and contracting to promote pressure balance within the sealed chamber.

[0130] 15. The hybrid cooling system according to technical solution 14 further includes:

[0131] The bladder has an inlet on the outside of the extended radiator, allowing the gas inside the bladder to be regulated.

[0132] 16. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0133] Gaskets, the gaskets being arranged to seal the extended heat sink to the printed circuit board; and

[0134] A screen printing layer is arranged to mark components on the printed circuit board and / or provide screen printing paths that are liquid barriers and smooth surfaces above the PCB traces for sealing with the gasket.

[0135] 17. The hybrid cooling system according to technical solution 16, wherein the wire mesh path comprises a double-layer wire mesh material.

[0136] 18. The hybrid cooling system according to any one of the foregoing technical solutions, wherein the extended heat sink is connected to the printed circuit board using a plurality of screws, the number of screws being adapted to the size of the extended heat sink.

[0137] 19. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0138] The extended heat sink includes a dual-sided extended heat sink having a first portion on the top of the printed circuit board and a second portion on the bottom of the printed circuit board; and

[0139] Through-holes in the printed circuit board, the through-holes being used to allow liquid to circulate between the first and second portions of the extended heat sink.

[0140] 20. The hybrid cooling system according to technical solution 19, wherein i) one of the top portion and the bottom portion or ii) both the top portion and the bottom portion are provided with the contact area on the inner surface.

[0141] 21. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0142] A filling orifice, the filling orifice being used to fill the transfer fluid into the chamber formed by the extended heat sink; and

[0143] A seal that securely closes the filling hole to form the sealed chamber.

[0144] 22. The hybrid cooling system according to technical solution 21 further includes:

[0145] Vent holes; and

[0146] A piezoelectric pump, which serves as the seal to cover the filling hole and the vent hole, and which also serves as a liquid propulsion device.

[0147] 23. The hybrid cooling system according to technical solution 22, wherein the piezoelectric pump output includes a liquid pipe for propelling the transfer fluid.

[0148] 24. The hybrid cooling system according to technical solution 21 further includes:

[0149] Bolts and O-rings, which serve as the seals to close the filling hole.

[0150] 25. The hybrid cooling system according to technical solution 24, wherein the bolt is screwed into the recessed bolt hole, the O-ring is assembled into the recessed bolt hole, and the bolt is a flanged bolt.

[0151] 26. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0152] A liquid tube for propelling the transfer fluid from a cooler region in the sealed chamber to the component.

[0153] 27. The hybrid cooling system according to technical solution 26, wherein the liquid pipe is a siphon, and the transfer fluid flows by rising through a hotter material.

[0154] 28. The hybrid cooling system according to technical solution 26, wherein the liquid pipe is powered by a liquid thruster.

[0155] 29. The hybrid cooling system according to technical solution 27, wherein the liquid propulsion unit is located inside the sealed chamber.

[0156] 30. The hybrid cooling system according to claim 27, wherein the liquid propulsion device is located outside the sealed chamber.

[0157] 31. The hybrid cooling system according to claim 30, wherein the liquid propulsion uses filling holes and vent holes in a closed radiator to pump the transfer fluid.

[0158] 32. The hybrid cooling system according to technical solution 26, wherein the liquid propulsion includes one of an integrated micro pump, a vibration motor, an underwater fan, an underwater propeller, a piezoelectric motor, a thermoelectric cooler, a loudspeaker, a piezoelectric buzzer, or a piezoelectric diaphragm pump.

[0159] 33. The hybrid cooling system according to any one of the foregoing technical solutions, wherein the printed circuit board is vertical.

[0160] 34. The hybrid cooling system according to any one of the foregoing technical solutions, wherein the contact area includes a liquid through-hole, allowing the transfer fluid to flow through the liquid through-hole in the contact area.

[0161] 35. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0162] A first plug, the first plug forming the contact area to provide contact cooling to a first component on the printed circuit board; and

[0163] A second plug forms a second contact area to provide contact cooling to a second component on the printed circuit board.

[0164] 36. The hybrid cooling system according to claim 35, wherein the plurality of plugs have different sizes.

[0165] 37. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0166] The enclosed heat sink has a top portion attached to a first side of the printed circuit board and a bottom portion attached to a second side of the printed circuit board.

[0167] 38. The hybrid cooling system according to technical solution 37 further includes:

[0168] A first plug, the first plug forming the contact area to provide contact cooling to a first component on the printed circuit board coupled to the first side of the printed circuit board; and

[0169] A second plug forms a second contact area to provide contact cooling to a second component on the printed circuit board that is coupled to the second side of the printed circuit board.

[0170] 39. The hybrid cooling system according to any one of the foregoing technical solutions further includes:

[0171] The secondary cooling flow through the extended radiator has a coolant different from that of the transfer fluid, used to cool the transfer fluid.

[0172] 40. The hybrid cooling system according to technical solution 39, wherein the coolant is water.

[0173] 41. The hybrid cooling system according to technical solution 39 further includes:

[0174] A cooler for cooling the coolant in the secondary cooling stream, wherein the coolant passes through the extended radiator and returns to the cooler via a path from the cooler.

[0175] 42. The hybrid cooling system according to technical solution 39, wherein the secondary cooling flow passes through the sealed chamber of the extended radiator and surrounds the component.

Claims

1. A hybrid cooling system coupled to a printed circuit board to provide cooling to components mounted on the printed circuit board, the hybrid cooling system comprising: An extended heat sink is coupled to the printed circuit board to form a sealed chamber with the printed circuit board, the extended heat sink including a heat sink having a skirt extending from the heat sink and coupled to the printed circuit board, the extended heat sink having an inner surface and an outer surface; The contact area on the inner surface of the extended heat sink is designed to make direct physical contact with the top of the component to provide direct contact cooling to the component. as well as A transfer fluid is provided within the sealed chamber and in contact with other areas of the component mounted on the printed circuit board to provide liquid cooling to the component.

2. The hybrid cooling system according to claim 1, further comprising: A thermal connector between the contact area and the top of the component, wherein the thermal connector may optionally include one of the following: a thermal pad, thermal grease, and thermal adhesive.

3. The hybrid cooling system according to claim 1, further comprising: The plug forming the contact area is optionally made of a material having a higher thermal conductivity than the extended heat sink.

4. The hybrid cooling system of claim 3, wherein the plug has a portion extending from the inner surface of the extended heat sink, the portion extending from the extended heat sink forming the contact area.

5. The hybrid cooling system of claim 3, wherein the plug extends along the top inner surface of the extended radiator.

6. The hybrid cooling system according to claim 3, further comprising: A cutout for the plug in the extended radiator, and optionally, the top of the plug is flush with the surface of the extended radiator.

7. The hybrid cooling system of claim 3, wherein the plug comprises copper and the extended heat sink comprises aluminum.

8. The hybrid cooling system according to claim 1, further comprising: One or more fans are mounted on the exterior of the extended heat sink.

9. The hybrid cooling system according to claim 1, further comprising: Multiple additional components are located on the printed circuit board. as well as Multiple additional contact areas, inside the extended heat sink, are used for the multiple additional components.

10. The hybrid cooling system according to claim 1, further comprising: An X-shaped gasket is provided between the extended heat sink and the printed circuit board to provide a leak-proof seal.

11. The hybrid cooling system according to claim 1, further comprising: A sensor, located within the sealed chamber, is used to sense one or more of the following: pressure and temperature, and the sensor has an output that can be obtained outside the extended heat sink.

12. The hybrid cooling system according to claim 1, further comprising: A gas-filled bladder within the sealed chamber, wherein the bladder expands and contracts to promote pressure balance within the sealed chamber. The bladder may optionally have an inlet on the exterior of the extended radiator, allowing the gas within the bladder to be regulated.

13. The hybrid cooling system according to claim 1, further comprising: A gasket that seals the extended heat sink to the printed circuit board; A screen printing layer for marking components on the printed circuit board and providing a screen printing path for the gasket, the screen printing path providing a liquid barrier and a smooth surface on the PCB trace for sealing with the gasket, wherein the screen printing path optionally includes two overlay layers for sealing smoothness and trace coverage.

14. The hybrid cooling system of claim 1, wherein the extended heat sink is attached to the printed circuit board using a plurality of screws, and the number of screws is adjusted based on the size of the extended heat sink.

15. The hybrid cooling system according to claim 1, further comprising: The extended heat sink includes a dual-sided extended heat sink having a first portion on the top of the printed circuit board and a second portion on the bottom of the printed circuit board, wherein one or both of the top portion and the bottom portion have the contact area on the inner surface. as well as Through-holes in the printed circuit board, the through-holes being used to allow liquid to circulate between the first and second portions of the extended heat sink.

16. The hybrid cooling system according to claim 1, further comprising: A liquid tube for propelling the transfer fluid from a cooler region in the sealed chamber to the component.

17. The hybrid cooling system of claim 16, wherein the liquid pipe is a siphon and the transfer fluid flows by convection rising from the hotter material.

18. The hybrid cooling system of claim 16, wherein the liquid pipe is powered by a liquid thruster.

19. The hybrid cooling system of claim 18, wherein the liquid propulsion uses filling holes and vent holes in the extended radiator to pump the transfer fluid.

20. The hybrid cooling system of claim 18, wherein the liquid propulsion includes one of an integrated micropump, a vibration motor, an underwater fan, an underwater propeller, a piezoelectric motor, a thermoelectric cooler, a loudspeaker, a piezoelectric buzzer, or a piezoelectric diaphragm pump.

Images