Display device

Abstract

The present disclosure provides a display device including a display panel in which a plurality of sub-pixels are disposed, a power management circuit for supplying a driving voltage to the plurality of sub-pixels, a printed circuit board disposed to overlap the power management circuit, and a thermal insulation portion disposed between the printed circuit board and the display panel and overlapping at least a portion of the power management circuit.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2025-0042212, filed on April 1, 2025, with the Korean Intellectual Property Office, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] This disclosure relates to electronic devices having a display, and more specifically, to display devices. Background Technology

[0004] In today's information society, display devices used to present images or visual information to users are becoming increasingly important. The demand for such display devices has led to the rapid development of display technology, resulting in the development and use of various types of display devices such as liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays.

[0005] Among these display devices, organic light-emitting display devices using self-emissive organic light-emitting diodes (OLEDs) exhibit high response speeds and show advantages in contrast, luminous efficiency, brightness, and viewing angle compared to other types of display devices such as liquid crystal displays (LCDs).

[0006] Organic light-emitting display devices can include a structure in which corresponding organic light-emitting diodes (OLEDs) are included in each of a plurality of sub-pixels (SPs) disposed in a display panel. Based on this structure, the organic light-emitting display device can control the brightness of each sub-pixel and display an image by controlling the current flowing through or applied to the organic light-emitting diodes to allow them to emit light.

[0007] Display devices may include various circuits configured to deliver voltage to multiple sub-pixels. The circuits included in the display device can generate heat while supplying current and voltage to the sub-pixels. Such circuits may age with use, and consequently, the lifespan of the circuitry or the display device may be reduced. To address these issues, work has been conducted on heat dissipation or heat management.

[0008] The descriptions provided in the Background section should not be considered prior art simply because they are mentioned in or related to that section. The Background section may include information describing one or more aspects of the subject matter, and the descriptions in this section do not limit this disclosure. Summary of the Invention

[0009] One or more aspects of this disclosure may provide a display device including a heat insulation portion configured to reduce or prevent the passage of heat emitted from a power management circuit.

[0010] One or more aspects of this disclosure can provide a display device including a heat insulation portion, thereby reducing or preventing subpixel degradation or mitigating the degree of subpixel degradation. One or more aspects of this disclosure can provide a display device including a structure in which subpixels are driven such that subpixel degradation is reduced or minimized, thereby enabling them to be driven at low power.

[0011] The aspects, examples, and implementations provided in this disclosure are not limited to the foregoing description, and additional aspects, examples, and implementations provided in this disclosure will become apparent to those skilled in the art from the following description.

[0012] According to one or more exemplary embodiments of the present disclosure, a display device may be provided, the display device comprising: a display panel having a plurality of sub-pixels disposed therein; a power management circuit for supplying one or more driving voltages to the plurality of sub-pixels; a printed circuit board disposed thereover the power management circuit; and a heat insulation portion disposed between the printed circuit board and the display panel and overlapping at least a portion of the power management circuit.

[0013] In one or more aspects, the display device may include a heat insulation portion, and the heat insulation portion may include, for example, a heat dissipation portion, a heat insulation portion, and a shock absorption portion.

[0014] According to one or more aspects of this disclosure, a display device can be provided that can be driven at low power based on a structure that can reduce or minimize the degradation of subpixels.

[0015] The effects or advantages derived from the aspects, examples and implementations described herein are not limited thereto, and additional effects or advantages will become apparent to those skilled in the art from the following description.

[0016] It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this disclosure and are incorporated into and constitute a part of this disclosure, illustrate various aspects of this disclosure and, together with the description, serve to explain the principles of this disclosure. In the drawings: Figure 1 The system configuration of an example display device according to various aspects of this disclosure is illustrated; Figure 2 This is an example front view of a display device in an unbent state according to various aspects of this disclosure; Figure 3 This is an example rear view of a display device in an unbent state according to various aspects of this disclosure; Figure 4 Based on all aspects of this disclosure Figure 3 An enlarged example view of region A; Figure 5 An example viewing surface of a display device according to various aspects of this disclosure is illustrated; Figure 6 Examples of display devices including heat-insulating parts based on various aspects of this disclosure. Figure 3 A magnified view of region A; Figure 7 An example arrangement of a printed circuit board, a heat insulation portion, and an adhesive portion included in a display device according to various aspects of this disclosure is illustrated. Figure 8 This is an example cross-sectional view of a display device in a bent state in an area provided with an adhesive portion, according to various aspects of this disclosure; Figure 9 This is an example cross-sectional view of a display device in a bent state in an area provided with insulation, according to various aspects of this disclosure; Figure 10 Example graphs showing the changes in optical properties of various aspects according to this disclosure over heating time; and Figure 11 This is an example diagram illustrating temperature changes of a display device according to various aspects of this disclosure, depending on the presence or absence of an insulating portion.

[0018] Throughout the accompanying drawings and detailed description, unless otherwise stated, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, the relative dimensions and depictions of these elements may be enlarged. Detailed Implementation

[0019] Exemplary embodiments of this disclosure will now be described in detail, examples of which can be illustrated in the accompanying drawings.

[0020] In the following description, unless otherwise stated, the structures, implementations, methods, and operations described herein are not limited to the specific examples or examples set forth herein, and may be varied as is known in the art. Unless otherwise stated, similar reference numerals always denote similar elements. The names of the corresponding elements used in the following explanations are chosen solely for ease of writing and may therefore differ from the names used in actual products. Furthermore, in the following description of examples or embodiments of this disclosure, detailed descriptions of well-known functions and components incorporated herein will be omitted or may be provided briefly where it is determined that the description may make the subject matter of some embodiments of this disclosure considerably unclear. Terms such as “comprising,” “having,” “including,” “constituting,” “made of,” and “formed from” as used herein are generally intended to allow for the addition of other components, unless these terms are used in conjunction with the term “only.” As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form.

[0021] The advantages and features of this disclosure and its implementation methods will be illustrated by the following exemplary embodiments described with reference to the accompanying drawings. However, this disclosure may be implemented in different forms and should not be construed as limited to the exemplary embodiments described herein. Rather, these exemplary embodiments are provided to make this disclosure thorough and complete enough to assist those skilled in the art in fully understanding its scope. Furthermore, this disclosure is limited only by the scope of the claims.

[0022] Although the terms “first,” “second,” A, B, (a), (b), etc., may be used herein to describe various elements, these elements should not be construed as being limited by these terms, as they are not used to define a particular order or priority. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0023] When referring to the first element as "connected to or linked to" the second element, "contacting" the second element, or "overlapping" with the second element, it should be interpreted as meaning that not only is the first element "directly connected to or linked to" the second element, "directly contacting" the second element, or "directly overlapping" with the second element, but a third element may also be "inserted" between the first and second elements, or the first and second elements may be "connected to or linked to," "contacting," or "overlapping" with each other via a fourth element. Here, the second element may be included in at least one of two or more elements that are "connected to or linked to," "contacting," or "overlapping" with each other.

[0024] When describing positional relationships, such as when using terms like "above," "over," "below," "over," "below," "adjacent," or "closely adjacent" to describe the positional relationship between two components, one or more other components may be located between the two components, unless more restrictive terms such as "closely," "directly," or "tightly" are used. For example, when an element or layer is positioned "above" another element or layer, a third element or layer may be inserted between them. Furthermore, the terms "left," "right," "top," "bottom," "down," "up," "upper," and "lower" indicate any frame of reference.

[0025] When describing temporal relationships, when the temporal order is described as such as "after", "following", "next" and "before", discontinuous situations may be included unless more restrictive terms such as "exactly", "immediately" or "directly" are used.

[0026] Any implementation described as an "example" in this article is not necessarily to be interpreted as being more preferred or advantageous than other implementations.

[0027] Furthermore, when referring to any size, relative size, etc., it should be assumed that the numerical values ​​or corresponding information of a component or feature (e.g., level, range, etc.) include tolerances or error ranges that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even when no relevant description is specified. In addition, the term "may" fully encompasses all the meanings of the term "able to".

[0028] The expressions "first element," "second element," and " / or" "third element" should be understood as one of the first, second, and third elements, or any combination or all combinations of the first, second, and third elements. By way of example, A, B, and / or C can refer to only A; only B; only C; any combination or some combination of A, B, and C; or all of A, B, and C.

[0029] In the following description, various exemplary aspects of the present disclosure are described in detail with reference to the accompanying drawings. Reference numerals for each element in the drawings may exemplify the same element in other drawings, and similar reference numerals may refer to similar elements unless otherwise stated. Even if the same or similar elements are depicted in different drawings, they may be represented by the same reference numerals. Furthermore, for ease of description, the scale, dimensions, size, and thickness of each element shown in the drawings may differ from the actual scale, dimensions, size, and thickness, and therefore, aspects of the present disclosure are not limited to the scale, dimensions, size, and thickness shown in the drawings.

[0030] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein. For example, the terms “component” or “unit” may be applied, for example, to a single circuit or structure, an integrated circuit, a computational block of a circuit device, or any structure configured to perform the described functions, as would be understood by one of ordinary skill in the art.

[0031] Instead, these embodiments may be provided to make this disclosure thorough and complete enough to assist those skilled in the art in fully understanding its scope. Furthermore, this disclosure is limited only by the scope of the claims.

[0032] It will be apparent to those skilled in the art that various modifications and alterations can be made to the display device of this disclosure without departing from the technical concept or scope thereof. Therefore, this disclosure is intended to cover such modifications and alterations, provided they fall within the scope of the appended claims and their equivalents.

[0033] Figure 1 The system configuration of an example display device 100 according to various aspects of this disclosure is illustrated.

[0034] Reference Figure 1 In one or more example embodiments, the display device 100 may include: a display panel 110 having a plurality of gate lines GL and a plurality of data lines DL, and a plurality of sub-pixels SP arranged in a matrix; a gate driving circuit 120 configured to drive the plurality of gate lines GL; a data driving circuit 130 configured to supply data voltage through the plurality of data lines DL; a controller 140 configured to control the gate driving circuit 120 and the data driving circuit 130; and a power management circuit 150.

[0035] The display panel 110 can be configured to display images based on one or more scan signals and one or more light emission control signals sent from the gating drive circuit 120 via multiple gating lines GL and data voltages sent from the data drive circuit 130 via multiple data lines DL.

[0036] In one or more aspects, in an example where the display device 100 is implemented as a liquid crystal display, the display panel 110 may include a liquid crystal layer formed between two substrates and operate in one or more operating modes such as twisted nematic (TN) mode, vertical alignment (VA) mode, in-plane switching (IPS) mode, and / or edge field switching (FFS) mode. In one or more aspects, in an example where the display device 100 is implemented as a self-emissive display device such as an organic light-emitting display, the display panel 110 may be implemented as a top-emitting structure, a bottom-emitting structure, or a bidirectional light-emitting structure.

[0037] The display panel 110 may have a structure in which multiple pixels are arranged in a matrix. Each of the multiple pixels may include a sub-pixel SP configured to emit two or more different colors of light, and for example, include at least two of a white sub-pixel, a red sub-pixel, a green sub-pixel, and / or a blue sub-pixel. Each of the multiple pixels may be defined by one or more data lines DL and one or more gate lines GL.

[0038] A sub-pixel SP may include: at least one thin-film transistor (TFT) formed in the region where a data line DL and at least one gate line GL intersect; a light-emitting element such as an organic light-emitting diode configured to emit light corresponding to a data voltage; and a storage capacitor electrically connected to the light-emitting element and configured to maintain the voltage at a specific level.

[0039] The gating drive circuit 120, which can be controlled by the controller 140, can control the driving timing of multiple sub-pixels SP by sequentially outputting scan signals to multiple gating lines GL provided in the display panel 110.

[0040] For example, the gating drive circuit 120 may include one or more gating drive integrated circuits (GDICs) and may be located in one or more edges of the display panel 110 or only in one edge of the display panel 110, depending on design requirements. In one or more aspects, the gating drive circuit 120 may be implemented as a gating-in-panel (GIP) structure. In this configuration, the gating drive circuit 120 may be located in the bezel area of ​​the display panel 110.

[0041] The data driving circuit 130 can receive image data DATA from the controller 140 and convert the received image data DATA into an analog data voltage. Thereafter, the data driving circuit 130 can output the data voltage to multiple data lines DL according to the timing of the scan signal applied via the gate line GL. Depending on these configurations, each sub-pixel SP connected to the corresponding data line DL can emit light with a brightness corresponding to the data voltage.

[0042] For example, the data driver circuit 130 may include one or more source driver integrated circuits (SDICs). In this example, each source driver integrated circuit (SDIC) may be connected to the bonding pads of the display panel 110 in a tape-on-board (TAB) structure or a chip-on-glass (COG) structure, or may be directly disposed in the display panel 110.

[0043] In one or more aspects, one or more source driver integrated circuits (SDICs) included in the data driver circuitry 130 may be mounted on one or more corresponding source films (SFs). In this configuration, the side of the source film SF on which the source driver integrated circuits (SDICs) are mounted may be electrically connected to the display panel 110. In one or more aspects, one or more corresponding signal lines for electrically connecting one or more source driver integrated circuits (SDICs) and the display panel 110 to each other may be respectively provided in one or more corresponding upper portions of one or more source films SFs.

[0044] In one or more aspects, each source driver integrated circuit (SDIC) can be configured to be integrated into the display panel 110. In one or more aspects, each source driver integrated circuit (SDIC) can be implemented in the display panel 110 using a chip-on-film (COF) structure. In this configuration, each source driver integrated circuit (SDIC) can be mounted on a circuit film and electrically connected to the data line DL of the display panel 110 through the circuit film. One or more source driver integrated circuits (SDICs) can supply corresponding data voltages to the display panel 110.

[0045] The controller 140 can supply various control signals to the gating drive circuit 120 and the data drive circuit 130, and control the operation of the gating drive circuit 120 and the data drive circuit 130. For example, the controller 140 can cause the gating drive circuit 120 to output a scan signal according to a timing set for scanning one or more pixels. In addition, the controller 140 can receive image data from an external device or system (e.g., host system 160) and send the received image data or a data signal corresponding to the received image data to the data drive circuit 130.

[0046] For example, controller 140 can receive various timing signals, including vertical synchronization signal Vsync, horizontal synchronization signal Hsync, data enable signal DE, master clock MCLK, etc., as well as image data from host system 160.

[0047] The host system 160 can be any of the following: television (TV), set-top box, navigation system, personal computer (PC), home theater system, mobile device, wearable device, etc.

[0048] The controller 140 can use various timing signals received from the host system 160 to generate control signals and supply the control signals to the gating drive circuit 120 and the data drive circuit 130.

[0049] For example, controller 140 can supply various gating control signals, including a gating start pulse GSP, a gating clock GCLK, and a gating output enable signal GOE, to control gating drive circuit 120. The gating start pulse GSP can be used to control one or more timings for the start of operation of one or more gating drive integrated circuits GDICs included in gating drive circuit 120. The gating clock GCLK can be a clock signal that is common to one or more gating drive integrated circuits GDICs and is used to control the shift timing of the scan signal. The gating output enable signal GOE can be used to indicate timing information for one or more gating drive integrated circuits GDICs.

[0050] The controller 140 can supply various data control signals, including the source start pulse SSP, the source sampling clock SCLK, and the source output enable signal SOE, to control the data drive circuit 130. The source start pulse SSP can be used to control one or more timings for starting data sampling by one or more source driver integrated circuits (SDICs) included in the data drive circuit 130. The source sampling clock SCLK can be a clock signal used to control one or more timings for sampling data by one or more source driver integrated circuits (SDICs). The source output enable signal SOE can be used to control the output timing of the data drive circuit 130.

[0051] The display device 100 may include a power management circuit 150, which is configured to supply various voltages or currents to the display panel 110, the gating drive circuit 120, the data drive circuit 130, etc., or to control various voltages or currents to be supplied to them.

[0052] The power management circuit 150 can adjust the DC input voltage Vin supplied by the host system 160 and generate the voltage or current required to drive the display panel 110, the gating drive circuit 120, and the data drive circuit 130.

[0053] Furthermore, each sub-pixel SP can be located at the intersection of at least one corresponding gate line GL and a corresponding data line DL, and a light-emitting element such as an organic light-emitting diode (OLED) can be disposed in each sub-pixel SP. In an example where the display device 100 is implemented as an organic light-emitting display device including organic light-emitting elements such as organic light-emitting diodes, the display device 100 may include light-emitting elements disposed in the sub-pixels SP, and an image can be displayed by controlling the current flowing to the light-emitting elements according to the data voltage.

[0054] In one or more aspects, the display device 100 may be a variety of devices such as a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, a plasma display panel (PDP), a light-emitting diode (LED) display, or a quantum dot (QD) light-emitting display.

[0055] Figure 2 This is an example front view of a display device 100 in an unbent state according to various aspects of this disclosure.

[0056] Reference Figure 2 In one or more example embodiments, the display device 100 may include a cover glass CG, a shielding strip ST, at least one shielding cover SC, a power management circuit 150, and a printed circuit board PCB.

[0057] A cover glass CG may cover the display panel 110. The cover glass CG may be located in the upper part of the display device 100. For example, the cover glass CG may be located at the top of the display device 100. According to this configuration, the display panel 110 can be protected from external impacts. The cover glass CG may include a plastic material with properties that allow light transmission, or a material that includes glass or a material that includes glass.

[0058] The shielding strip ST may overlap at least a corresponding portion of at least one of at least one source film, at least one printed circuit board (PCB), or at least one shielding cover (SC). For example, an adhesive or a material including an adhesive may be applied to the rear surface of the shielding strip ST. The shielding strip ST may be attached to other components (e.g., at least one source film, at least one shielding cover SC, etc.) by applying an adhesive or a material including an adhesive to the shielding strip ST.

[0059] The shielding strip ST may include at least one stepped portion and at least one protrusion.

[0060] At least a corresponding portion of at least one protrusion may overlap with at least a corresponding portion of at least one shield SC. According to this configuration, at least one power line connected from at least one shield SC to at least one source film can be protected from external electromagnetic interference.

[0061] For example, two stepped portions can be provided on both sides of the corresponding protrusion. For example, two stepped portions can be formed in the corresponding area where the portion of the shielding strip ST is removed.

[0062] With the stepped portion formed on both sides of the corresponding protrusion, the shielding strip ST can be reduced or minimized from tearing due to the step difference between the printed circuit board (PCB) and at least one shielding cover (SC).

[0063] At least one shield SC may overlap with at least one circuit for driving a display panel 110 disposed on a printed circuit board PCB. For example, at least one shield SC may cover a controller 140. For example, multiple shield SCs may be disposed on the printed circuit board PCB. For example, each of the multiple shield SCs may surround at least one circuit.

[0064] With at least one shield SC covering at least one circuit disposed on a printed circuit board (PCB), the at least one circuit disposed on the PCB can be protected from external shocks, frequency interference, signal interference, electromagnetic interference, etc. In one or more aspects, at least one shield SC can serve as at least one path for dissipating heat emitted from at least one drive circuit on the PCB.

[0065] For example, the controller 140 can be positioned between the printed circuit board (PCB) and at least one shield (SC), thereby protecting the controller 140 from external shocks and electromagnetic interference.

[0066] For example, the power management circuit 150 may be disposed on at least one shield SC. Since the power management circuit 150 supplies voltage or current, it may generate heat. To address this issue, the power management circuit 150 may be disposed on the shield SC, rather than the shield SC surrounding the structure of the power management circuit 150, thereby dissipating the heat from the power management circuit 150.

[0067] Furthermore, since heat is generated from the controller 140, the controller 140 can be located inside another shield SC besides the shield SC located below the power management circuit 150.

[0068] For example, the heat-generating controller 140 and the power management circuit 150 can be configured so that they do not overlap.

[0069] The controller 140, power management circuitry 150, at least one shift register, and multiple capacitors can be mounted on a printed circuit board (PCB). For example, multiple circuits or devices for driving the display panel 110 can be mounted on the PCB.

[0070] Figure 3 This is an example rear view of a display device 100 in an unbent state according to various aspects of this disclosure.

[0071] For example, Figure 3 It can be in Figure 2 An example of the display device 100 in a state of being rotated 180 degrees to the right or left.

[0072] Reference Figure 3The display device 100 may include a cover glass CG, a heat dissipation part GR, at least one adhesive part AD, at least one source film SF, at least one source driver integrated circuit SDIC, at least one ground part GND, and a printed circuit board PCB.

[0073] Below is a list of targets Figure 3 In the discussion of configuration, for ease of description, descriptions may be omitted or only briefly described and referenced. Figure 1 and 2 The characteristics described are the same, essentially the same, or similar.

[0074] The heat dissipation section GR may overlap with the cover glass CG. The heat dissipation section GR may include a thermally conductive material. For example, the heat dissipation section GR may include graphite. According to this configuration, the heat dissipation section GR can disperse or transfer heat generated from the printed circuit board PCB.

[0075] For example, the heat dissipation section GR may include a rigid material. According to this configuration, the heat dissipation section GR can ensure the rigidity of the display device 100.

[0076] When at least one source film SF or printed circuit board PCB is bent, the adhesive portion AD can attach the printed circuit board PCB to one or more other components (e.g., display panel 110, support member, etc.). For example, the adhesive portion AD may include pressure-sensitive adhesive or conductive adhesive. See below. Figure 7 A detailed discussion of the adhesive layer AD is provided.

[0077] At least one source film SF can be bent and placed on the rear surface of the display device 100. With this configuration, the display device 100 can achieve a narrow bezel. See below. Figure 8 A detailed discussion of this configuration is provided.

[0078] At least a portion of the printed circuit board (PCB) may overlap with at least one source film (SF). For example, the PCB may be attached to at least one source film (SF).

[0079] The grounding portion GND can be disposed on the printed circuit board (PCB). The grounding portion GND provides electrical stability. The grounding portion GND can be disposed in an area corresponding to the area where the adhesive portion AD is disposed and has a shape corresponding to the shape of the adhesive portion AD. According to this configuration, when at least one source film SF or the printed circuit board PCB is bent, the grounding portion GND and the adhesive portion AD can be attached to each other.

[0080] Figure 4 Based on all aspects of this disclosure Figure 3 An example enlarged view of region A.

[0081] Reference Figure 4The display device 100 may include a cover glass CG, a support member 400, a heat dissipation part GR, at least one adhesive part AD, at least one source film SF, at least one source driver integrated circuit SDIC, at least one ground part GND, and a printed circuit board PCB.

[0082] Below is a list of targets Figure 4 In the discussion of configuration, for ease of description, descriptions may be omitted or only briefly described and referenced. Figures 1 to 3 The characteristics described are the same, essentially the same, or similar.

[0083] The support member 400 ensures the rigidity of the display device 100. The support member 400 may include copper or stainless steel, or a material including stainless steel.

[0084] As the printed circuit board (PCB) bends toward the rear surface of the display device 100, the PCB and components disposed on the PCB (e.g., controller 140, power management circuit 150, at least one shield SC, and at least one grounding portion GND) can be located on the rear surface of the display device 100.

[0085] As multiple adhesive portions AD, which have a smaller area than the printed circuit board (PCB), are attached to the rear surface of the display device 100 and the PCB, air gaps AG may be formed in areas where adhesive portions AD are not provided.

[0086] Heat generated from components (e.g., controller 140 and power management circuitry 150) located on a printed circuit board (PCB) may be transferred to the air gap AG.

[0087] The heat transferred to the air gap AG may be transferred to multiple sub-pixels SP in the display panel 110.

[0088] When heat is transferred to the sub-pixel SP, it can lead to degradation of optical properties, increased mobility of the thin-film transistors included in the sub-pixel, and deviations in the brightness of the presented image.

[0089] The following reference Figure 5 , Figure 10 and Figure 11 A detailed discussion of this is provided.

[0090] The following section provides a discussion of the viewing surface of the display device 100 when brightness deviation occurs.

[0091] Figure 5 An example viewing surface of a display device 100 according to various aspects of this disclosure is illustrated.

[0092] Reference Figure 5The cover glass CG can be set at the outermost edge of the viewing surface of the display device 100.

[0093] For example, when heat is transferred to the sub-pixels SP disposed in the first region 501, the second region 503 and the third region 505 of the display device 100, these regions 501 to 503 may be areas where the sub-pixels SP have deteriorated due to heat transfer.

[0094] As a result, images with unexpected brightness may be presented in the first region 501, the second region 503, and the third region 505.

[0095] The following provides a discussion of examples of heat insulation components provided in the display device 100 to reduce or prevent subpixel SP degradation.

[0096] Figure 6 Examples of display devices including heat-insulating parts based on various aspects of this disclosure. Figure 3 A magnified view of region A.

[0097] Reference Figure 6 The display device 100 may include a cover glass CG, a support member 400, a heat dissipation part GR, at least one adhesive part AD, at least one source film SF, at least one source driver integrated circuit SDIC, at least one ground part GND, a printed circuit board PCB, and a heat insulation part 600.

[0098] Below is a list of targets Figure 6 In the discussion of configuration, for ease of description, descriptions may be omitted or only briefly described and referenced. Figures 1 to 5 The characteristics described are the same, essentially the same, or similar.

[0099] The heat insulation section 600 can block heat from being transferred to it. For example, when heat generated from the power management circuit 150 is transferred to the heat insulation section 600, the heat insulation section 600 can prevent the transferred heat from being transferred to the display panel 110.

[0100] For example, when at least one source film SF or printed circuit board PCB is bent, the heat insulation portion 600 may overlap with at least a portion of the power management circuit 150 or at least a portion of the controller 140.

[0101] As the heat insulation portion 600 overlaps with at least a portion of the power management circuit 150 or at least a portion of the controller 140, the heat generated from the power management circuit 150 or the controller 140 can be dissipated to the rear surface of the display device 100 instead of being transferred to the multiple sub-pixels SP.

[0102] For example, the insulation portion 600 can be provided at the location where the air gap AG is formed. For example, the insulation portion 600 can be located in an area where heat is highly likely to be transferred.

[0103] For example, the insulation section 600 can be set as follows: Figure 4 At least one of the regions that form one or more air gaps AG.

[0104] For example, multiple insulation sections 600 can be set up Figure 4 The corresponding region formed by multiple air gaps AG in the middle.

[0105] An example of the configuration of the insulation section 600 is discussed below.

[0106] Figure 7 An example arrangement of printed circuit boards (e.g., printed circuit board PCB), heat insulation portions (e.g., heat insulation portion 600), and adhesive portions (e.g., adhesive portion AD) included in a display device 100 according to various aspects of the present disclosure is illustrated.

[0107] Reference Figure 7 The display device 100 may include a printed circuit board PCB, a heat insulation part 600, and an adhesive part AD.

[0108] When the display device 100 is bent, the heat insulation part 600 and the adhesive part AD can overlap with the printed circuit board PCB.

[0109] The adhesive portion AD may be provided on at least one side surface of the heat insulation portion 600.

[0110] The adhesive part AD can be disposed between the display panel 110 and the printed circuit board PCB.

[0111] The adhesive portion AD may include a metal layer 710 and multiple adhesive layers 730.

[0112] Multiple adhesive layers 730 may include adhesive layer PSA attached to the printed circuit board PCB and metal layer 710, and adhesive layer PSA not attached to the printed circuit board PCB but attached to metal layer 710.

[0113] The adhesive layer PSA attached to the printed circuit board (PCB) and the metal layer 710 can be referred to as the first adhesive layer. The adhesive layer PSA that is not attached to the PCB but is attached to the metal layer 710 can be referred to as the second adhesive layer. The second adhesive layer can be disposed between the display panel 110 and the first adhesive layer.

[0114] For example, the adhesive layer PSA may include a voltage-sensitive adhesive (CPSA).

[0115] For example, metal layer 710 may include copper.

[0116] The thickness of the adhesive layer 730 can be greater than the thickness of the metal layer 710. For example, the thickness of the adhesive layer 730 can be 20 times the thickness of the metal layer 710.

[0117] The heat insulation part 600 may include a single-sided adhesive part 700, a heat dissipation part 720, a heat insulation part 740, a double-sided adhesive part 760, and an impact absorption part 780.

[0118] The single-sided adhesive portion 700 can bond the printed circuit board (PCB) and the heat sink 720 together. For example, the single-sided adhesive portion 700 can be a black single-sided adhesive.

[0119] For example, the thickness of the single-sided adhesive portion 700 can be greater than the thickness of the double-sided adhesive portion 760. The thickness of the single-sided adhesive portion 700 can be less than the thickness of each of the heat dissipation portion 720, the heat insulation portion 740, and the impact absorption portion 780.

[0120] The heat sink 720 can be disposed on the printed circuit board (PCB). For example, the heat sink 720 can be attached to the PCB via a single-sided adhesive portion 700.

[0121] The heat sink 720 can transfer heat to one or more other components. The heat sink 720 may include a thermally conductive material. For example, the heat sink 720 may include graphite or a material comprising graphite.

[0122] For example, the thickness of the heat dissipation portion 720 may be greater than the thickness of each of the single-sided adhesive portion 700 and the double-sided adhesive portion 760. The heat dissipation portion 720 may have the same or substantially the same thickness as the impact absorption portion 780. The thickness of the heat dissipation portion 720 may be less than the thickness of the heat insulation portion 740.

[0123] The heat insulation part 740 can be provided on the heat dissipation part 720.

[0124] The heat insulation portion 740 can block heat transfer. For example, when heat generated in the power management circuit 150 is transferred to the heat insulation portion 740, the heat insulation portion 740 can shield the heat, thereby reducing or preventing heat from being transferred to the display panel 110. As a result, the degradation of the sub-pixel SP can be reduced or prevented.

[0125] The thickness of the heat insulation part 740 can be greater than the thickness of each of the single-sided adhesive part 700, the heat dissipation part 720, the double-sided adhesive part 760 and the impact absorption part 780.

[0126] The double-sided adhesive part 760 can be provided on the heat insulation part 740.

[0127] The double-sided adhesive part 760 can attach the heat insulation part 740 and the impact absorption part 780 to each other.

[0128] The thickness of the double-sided adhesive portion 760 can be less than the thickness of each of the single-sided adhesive portion 700, the heat dissipation portion 720, the heat insulation portion 740, and the impact absorption portion 780.

[0129] For example, the impact-absorbing portion 780 may be provided on the heat-insulating portion 740. For example, the impact-absorbing portion 780 may be attached to the heat-insulating portion 740 via the double-sided adhesive portion 760.

[0130] The shock-absorbing section 780 can be used to mitigate external impacts. According to this configuration, damage from external impacts to other components of the display device 100 (e.g., display panel 110, printed circuit board PCB, etc.) can be reduced or minimized. Furthermore, the durability of the heat insulation section 600 can be improved.

[0131] For example, the impact-absorbing part 780 may include polyurethane (PU), a material including polyurethane (PU), etc.

[0132] Figure 8 This is an example cross-sectional view of a display device 100 in a bent state in an area provided with an adhesive portion (e.g., adhesive portion AD) according to various aspects of this disclosure.

[0133] Reference Figure 8 The display device 100 may include a cover glass CG, a first touch sensor layer 800, a second touch sensor layer 820, an optical adhesive OCA, a polarizer POL, a display panel 110, a coating 860, an adhesive layer PSA, a support member 400, a heat dissipation part GR, an adhesive part AD, a printed circuit board PCB, a guide member 940, a controller 140, at least one shield SC, a touch printed circuit board TPCB, a shielding strip ST, a buffer TUF, a gap filler 900, an external force relief member 920, at least one source film SF, at least one source driver integrated circuit SDIC, a reinforcement member SUS, and an insulator INS.

[0134] Below is a list of targets Figure 8 In the discussion of configuration, for ease of description, descriptions may be omitted or only briefly described and referenced. Figures 1 to 7 The characteristics described are the same, essentially the same, or similar.

[0135] The cover glass CG can cover the first touch sensor layer 800, the second touch sensor layer 820, the polarizer POL, and the display panel 110. The cover glass CG can be located in the upper part of the display device 100. For example, the cover glass CG can be located at the top of the display device 100. With this configuration, other components (e.g., the first touch sensor layer 800, the second touch sensor layer 820, the polarizer POL, and the display panel 110) can be protected from external impacts. The cover glass CG can comprise a plastic material with properties that allow light transmission, or a material comprising glass or a material comprising glass.

[0136] A first touch sensor layer 800 may be disposed on a second touch sensor layer 820. The first touch sensor layer 800 may include indium tin oxide (ITO). For example, the first touch sensor layer 800 may be in the form of a double layer of ITO.

[0137] The second touch sensor layer 820 can be disposed on the polarizer POL. For example, the second touch sensor layer 820 can be attached to the polarizer POL via optical adhesive OCA.

[0138] The second touch sensor layer 820 may include indium tin oxide (ITO). For example, the second touch sensor layer 820 may be in the form of a single layer of ITO. The second touch sensor layer 820 may reduce or prevent noise generation in the first touch sensor layer 800.

[0139] Since the first touch sensor layer 800 is in the form of a double layer of indium tin oxide and the second touch sensor layer 820 is in the form of a single layer of indium tin oxide, a dual touch sensor layer structure can be formed in the display device 100.

[0140] The display device 100 can offer advantages such as improved touch recognition accuracy, reduced cost, and optimized power consumption based on a dual-touch sensor layer structure.

[0141] Optical adhesive OCA can attach the second touch sensor layer 820 and the polarizer POL to each other.

[0142] For example, optical adhesives (OCAs) can include materials with transparent and / or adhesive properties. For instance, optical adhesives (OCAs) can protect polarizers (POLs) from external impacts.

[0143] The polarizer POL can be set on the display panel 110.

[0144] The polarizer POL can reduce or prevent external incident light from entering the display panel 110 and being reflected. The polarizer POL can reduce or prevent the reflection of incident light, thereby reducing or preventing the reduction of visibility of the display panel 110.

[0145] The display panel 110 can be mounted on the coating 860.

[0146] For example, the display panel 110 may include a plurality of sub-pixels SP, at least one thin-film transistor for driving the plurality of sub-pixels, and a plurality of insulating layers.

[0147] The coating 860 can be applied to the adhesive portion AD or the heat-dispersing portion GR. The coating 860 can contribute to the rigidity of the display panel 110.

[0148] The adhesive layer PSA can be disposed between different components to attach these components. The adhesive layer PSA may include a pressure-sensitive adhesive.

[0149] For example, the adhesive layer PSA can be disposed between the coating 860 and the heat dispersing portion GR. According to this configuration, the coating 860 and the heat dispersing portion GR can be attached to each other.

[0150] For example, the adhesive layer PSA can be disposed between the shield SC and the touch printed circuit board TPCB. According to this configuration, the shield SC and the touch printed circuit board TPCB can be attached to each other.

[0151] For example, the adhesive layer PSA can be disposed between the source film SF and the reinforcement SUS. According to this configuration, the source film SF and the reinforcement SUS can be attached to each other.

[0152] The heat dissipation section GR can dissipate the heat transferred from the printed circuit board PCB to the rear surface of the display device 100.

[0153] The support member 400 can help to enhance the rigidity of the display panel 110.

[0154] The adhesive part AD can attach the printed circuit board PCB and the support 400 to each other.

[0155] For example, the adhesive portion AD can attach the rear surface of the printed circuit board (PCB) and the support member 400 to each other. With this configuration, since the printed circuit board (PCB) is positioned on the surface facing the viewing surface of the display panel 110, the display device 100 or display panel 110 can achieve the advantage of a narrow bezel.

[0156] For example, the adhesive part AD can attach the ground part GND and the support member 400 to each other. For example, the ground part GND can be provided between the adhesive part AD and the printed circuit board PCB.

[0157] Circuitry for driving the display panel 110, such as capacitors, controller 140, and shift registers, can be mounted on a printed circuit board (PCB).

[0158] The guide 940 can guide the position of the printed circuit board (PCB).

[0159] The controller 140 can be disposed on a printed circuit board (PCB). For example, the controller 140 can overlap with at least a portion of the adhesive portion AD.

[0160] The shield SC can be mounted on the printed circuit board (PCB) so that it surrounds the controller 140. This configuration protects the controller 140 from external electromagnetic interference and shocks.

[0161] The touch printed circuit board (TPCB) can be bent and overlap with the shielding cover (SC). The touch printed circuit board (TPCB) can be electrically connected to the first touch sensor layer 800 and the second touch sensor layer 820. The touch printed circuit board (TPCB) can be electrically connected to a touch controller, which is configured to detect touch input and control operation in response to touch input.

[0162] The shielding strip ST can overlap with at least a portion of the touch printed circuit board (TPCB). This configuration protects at least a portion of the TPCB from electromagnetic interference and external forces.

[0163] The source film SF can overlap with and be electrically connected to the display panel 110. The source film SF can be referred to as a chip on film (COF).

[0164] The source driver integrated circuit (SDIC) can be disposed on the source film SF. The voltage generated by the source driver integrated circuit (SDIC) can be supplied to the display panel 110. The voltage generated by the source driver integrated circuit (SDIC) can be a variable voltage. Furthermore, the voltage generated by the source driver integrated circuit (SDIC) can be a data voltage.

[0165] The source film SF can be electrically connected to the pad portion of the display panel 110. The source film SF can include a flexible material. As the source film SF bends, the display device 100 can exhibit the advantage of allowing for narrow bezels.

[0166] The source film SF can overlap with at least a portion of the printed circuit board PCB. Current and voltage generated from the circuitry of the printed circuit board PCB can be supplied to the display panel 110 through the source film SF. For example, various voltages and / or currents supplied to the display panel 110 from the power management circuitry 150 or the controller 140 can be supplied through the source film SF.

[0167] The shielding strip ST can overlap with the source film SF. The shielding strip ST can protect the source film SF from external electromagnetic interference.

[0168] A gap can be formed between the source film SF and the second touch sensor layer 820 or between the shielding strip ST and the second touch sensor layer 820.

[0169] Due to the gap, an impact may be applied to at least a portion of the source film SF or the second touch sensor layer 820. To reduce or prevent such impacts, a gap filler 900 can be provided in the gap.

[0170] For example, gap filler 900 may include resin or a material comprising resin.

[0171] When the source film SF moves, the source driver integrated circuit SDIC may come into contact with another component, such as the support 400. To reduce or prevent damage to the source driver integrated circuit SDIC due to impact, an external force relief component 920 may be provided.

[0172] The external force relief component 920 may overlap with at least a portion of the support component 400. The external force relief component 920 may overlap with the source driver integrated circuit SDIC.

[0173] The external force relief component 920 may include polyurethane foam PU.

[0174] TUF buffers can include resins. TUF buffers can improve adhesion between components. TUF buffers can reduce or minimize light leakage. TUF buffers can reduce or minimize the penetration of unwanted substances or foreign matter.

[0175] For example, the buffer TUF can be located in the area adjacent to the display panel 110 and the source film SF.

[0176] For example, the buffer TUF can be placed on both sides of the source driver integrated circuit SDIC.

[0177] For example, the buffer TUF can be located in the area adjacent to the guide 940, the printed circuit board PCB, and the source film SF.

[0178] For example, the buffer TUF can be located in the area adjacent to the source film SF, the printed circuit board PCB, and the shielding strip ST.

[0179] The reinforcement SUS can be attached to the source film SF via the adhesive layer PSA. The reinforcement SUS can overlap with the source driver integrated circuit SDIC.

[0180] The SUS (Steel Insulator) protects the source driver integrated circuit (SDIC) from external impacts and contributes to its rigidity. The SUS can be made of stainless steel or a material comprising stainless steel.

[0181] The insulator INS can be placed between the reinforcement SUS and the shielding strip ST.

[0182] Figure 9This is an example cross-sectional view of a display device 100 in a bent state in the area where the heat insulation part 600 is provided, according to various aspects of this disclosure.

[0183] Reference Figure 9 The display device 100 may include a cover glass (e.g., cover glass CG), a first touch sensor layer (e.g., first touch sensor layer 800), a second touch sensor layer (e.g., second touch sensor layer 820), an optical adhesive (e.g., optical adhesive OCA), a polarizer (e.g., polarizer POL), a display panel 110, a coating (e.g., coating 860), an adhesive layer (e.g., adhesive layer PSA), a support member (e.g., support member 400), a heat dissipation section (e.g., heat dissipation section GR), a heat insulation section (e.g., heat insulation section 600), a printed circuit board (e.g., printed circuit board PCB), and a guide. The components include (e.g., guide 940), power management circuitry 150, at least one shield (e.g., at least one shield SC), a touch printed circuit board (e.g., touch printed circuit board TPCB), a shielding strip (e.g., shielding strip ST), a buffer (e.g., buffer TUF), a gap filler (e.g., gap filler 900), a force relief component (e.g., force relief component 920), at least one source film (e.g., at least one source film SF), a source driver integrated circuit (e.g., source driver integrated circuit SDIC), a reinforcement (e.g., reinforcement SUS), and an insulator (e.g., insulator INS).

[0184] Below is a list of targets Figure 9 In the discussion of configuration, for ease of description, descriptions may be omitted or only briefly described and referenced. Figures 1 to 8 The characteristics described are the same, essentially the same, or similar.

[0185] The heat insulation part 600 can be disposed between the heat dissipation part GR and the printed circuit board PCB. For example, the heat insulation part 600 can be disposed between the display panel 110 and the printed circuit board PCB.

[0186] According to this configuration, the heat generated from the circuitry on the printed circuit board (PCB) can be prevented from being transferred to the display panel 110.

[0187] Since heat is not transferred to the display panel 110, the display device 100 or the display panel 110 can have the advantage of reducing or minimizing defects caused by heat transferred to the sub-pixels SP.

[0188] For example, the power management circuit 150 may overlap with at least a portion of the heat insulation section 600. With this configuration, the heat generated by the power management circuit 150 may not be transferred to the display panel 110.

[0189] For example, the power management circuit 150 can be disposed outside the shielding cover SC. For example, the power management circuit 150 can overlap with the shielding cover SC. According to this configuration, the interference of the shielding cover SC with heat dissipation can be reduced or prevented.

[0190] Figure 8 The controller 140 may also overlap with at least a portion of the insulation section 600. With this configuration, the heat generated by the controller 140 may not be transferred to the display panel 110.

[0191] For example, a cooling device can be located in an area adjacent to the power management circuit 150. With this configuration, less heat generated in the power management circuit 150 can be transferred to the display panel 110 and more to the rear of the display device 100.

[0192] Figure 10 This is an example graph showing the change of optical properties of various aspects according to this disclosure with heating time.

[0193] Reference Figure 10 The horizontal axis of the graph represents the heating time, and the vertical axis represents the optical properties. The vertical axis of the graph can be designed so that higher values ​​indicate better optical properties.

[0194] Optical properties may include at least one of brightness, contrast, color accuracy, color reproducibility, viewing angle, reflectivity, transmittance, mobility of the driving transistor including the sub-pixel SP, or angle of incidence.

[0195] At the initial time point t0, heat can be prevented from being transferred to the display panel 110. Therefore, the corresponding optical characteristics can be optimal.

[0196] At the first time point t1 after the initial time point t0, the corresponding thin-film transistor can be at 25 degrees. Therefore, the optical properties may deteriorate or be reduced.

[0197] At a second time point t2, following the first time point t1, the thin-film transistors may be at 60 degrees Celsius. Therefore, the optical properties may further deteriorate or decrease. For example, as time passes from the first time point t1 to the second time point t2, the mobility of the thin-film transistors (e.g., the driving transistors) may increase by 30% as the temperature of the display panel 110 increases.

[0198] As a result, optical properties may deteriorate or decrease. Therefore, the heat generated from the circuitry on the printed circuit board (PCB) may lead to the degradation of the sub-pixel SP and the corresponding optical properties.

[0199] The following section provides a discussion of temperature changes depending on the presence or absence of the insulation 600.

[0200] Figure 11 This is an example diagram showing the temperature change of a display device 100 according to various aspects of this disclosure, depending on the presence or absence of an insulating part (e.g., insulating part 600).

[0201] Reference Figure 11 The first case, CASE 1, can represent an example of a display device 100 without the heat insulation part 600. The second case, CASE 2, can represent an example of a display device 100 with the heat insulation part 600.

[0202] For example, the highest temperature could be the highest temperature of the display panel 110 in either CASE 1 or CASE 2. The lowest temperature could be the lowest temperature of the display panel 110 in either CASE 1 or CASE 2. The temperature variation could be the difference between the highest and lowest temperatures of the display panel 110 in either CASE 1 or CASE 2.

[0203] For example, the temperature of the display device 100 in the first case CASE1 and the temperature of the display device 100 in the second case CASE2 can be expressed as the corresponding temperature value measured under the brightness conditions corresponding to 1000 NIT.

[0204] For example, a temperature distribution map could be a graph that visualizes the distribution of the corresponding temperature values ​​measured in the display panel 110 in each of the first case CASE1 and the second case CASE2.

[0205] Temperature distribution graphs can be included in each of the first case (CASE1) and the second case (CASE2) as visualizations at 2, 5, 10, 20, and 30 minutes after heat transfer to the display panel 110.

[0206] When comparing the temperature distribution diagram representing the first case (CASE1) and the temperature distribution diagram representing the second case (CASE2), it can be seen that the temperature rises and spreads faster in the temperature distribution diagram representing the first case (CASE1) than in the temperature distribution diagram representing the second case (CASE2).

[0207] For example, when heat is transferred to display panel 110 and after 2 minutes, the highest and lowest temperatures in case CASE1 could be 40.1 degrees and 27.5 degrees, respectively. In this example, the temperature change could be 12.6 degrees. The temperature distribution can represent the difference between the highest and lowest temperatures.

[0208] For example, when heat is transferred to the display panel 110 and after 2 minutes, the highest and lowest temperatures in case CASE2 could be 37.2 degrees and 27.5 degrees, respectively. In this example, the temperature change could be 9.7 degrees.

[0209] Therefore, with the insulation part 600 installed, when heat is transferred to the display panel 110 and after 2 minutes, the highest temperature and temperature change of the second case CASE2 can be lower than the highest temperature and temperature change of the first case CASE1.

[0210] For example, when heat is transferred to the display panel 110 and after 5 minutes, the highest and lowest temperatures in the first case CASE1 could be 43.8 degrees and 27.7 degrees, respectively. In this example, the temperature change could be 16.1 degrees.

[0211] For example, when heat is transferred to the display panel 110 and after 5 minutes, the highest and lowest temperatures in case CASE2 could be 41.7 degrees and 27.8 degrees, respectively. In this example, the temperature change could be 13.9 degrees.

[0212] Therefore, with the insulation part 600 installed, when heat is transferred to the display panel 110 and after 5 minutes, the highest temperature and temperature change of the second case CASE2 can be lower than the highest temperature and temperature change of the first case CASE1.

[0213] For example, when heat is transferred to the display panel 110 and 10 minutes have passed, the highest and lowest temperatures in the first case CASE1 could be 45.9 degrees and 27.9 degrees, respectively. In this example, the temperature change could be 18.0 degrees.

[0214] For example, when heat is transferred to the display panel 110 and 10 minutes have passed, the highest and lowest temperatures in case CASE2 could be 44.0 degrees and 28.4 degrees, respectively. In this example, the temperature change could be 15.6 degrees.

[0215] Therefore, with the insulation part 600 installed, when heat is transferred to the display panel 110 and after 20 minutes, the highest temperature and temperature change of the second case CASE2 can be lower than the highest temperature and temperature change of the first case CASE1.

[0216] For example, when heat is transferred to the display panel 110 and 20 minutes have passed, the highest and lowest temperatures in the first case CASE1 could be 47.0 degrees and 28.1 degrees, respectively. In this example, the temperature change could be 18.9 degrees.

[0217] For example, when heat is transferred to the display panel 110 and 20 minutes have passed, the highest and lowest temperatures in case CASE2 could be 44.7 degrees and 28.7 degrees, respectively. In this example, the temperature change could be 16.0 degrees.

[0218] Therefore, with the insulation part 600 installed, when heat is transferred to the display panel 110 and after 20 minutes, the highest temperature and temperature change of the second case CASE2 can be lower than the highest temperature and temperature change of the first case CASE1.

[0219] For example, when heat is transferred to the display panel 110 and 30 minutes have passed, the highest and lowest temperatures in the first case CASE1 could be 47.5 degrees and 28.1 degrees, respectively. In this example, the temperature change could be 19.4 degrees.

[0220] For example, when heat is transferred to the display panel 110 and 30 minutes have passed, the highest and lowest temperatures in case CASE2 could be 45.3 degrees and 28.9 degrees, respectively. In this example, the temperature change could be 16.4 degrees.

[0221] Therefore, with the insulation part 600 installed, when heat is transferred to the display panel 110 and after 30 minutes, the highest temperature and temperature change of the second case CASE2 can be lower than the highest temperature and temperature change of the first case CASE1.

[0222] In particular, the difference in temperature change may tend to increase over time after heat transfer. For example, when heat is transferred to display panel 110 and 20 minutes have passed, the difference between the corresponding temperature changes in the first case CASE1 and the second case CASE2 may be 2.9 degrees. For example, when heat is transferred to display panel 110 and 30 minutes have passed, the difference between the corresponding temperature changes in the first case CASE1 and the second case CASE2 may be 3 degrees.

[0223] Examples, aspects, and embodiments of the display device 100 and display panel 110 described herein can be described as follows.

[0224] According to one or more exemplary embodiments described herein, a display device may be provided, the display device comprising: a display panel having a plurality of sub-pixels disposed therein; a power management circuit for supplying one or more driving voltages to the plurality of sub-pixels; a printed circuit board disposed thereover the power management circuit; and a heat insulation portion disposed between the printed circuit board and the display panel and overlapping at least a portion of the power management circuit.

[0225] In one or more aspects, the thermal insulation portion may include a heat dissipation portion attached to the printed circuit board and consuming heat, a heat insulation portion overlapping with the heat dissipation portion and shielding heat, and an impact absorption portion overlapping with the heat dissipation portion.

[0226] In one or more aspects, the display device may also include an adhesive portion disposed between the display panel and the printed circuit board.

[0227] In one or more aspects, the adhesive portion may be provided on at least one side of the insulation portion.

[0228] In one or more aspects, the display device may also include a controller configured to provide image data to be supplied to the display panel.

[0229] In one or more aspects, at least a portion of the adhesive portion may overlap with the controller.

[0230] In one or more aspects, the adhesive portion may include a first adhesive layer attached to a printed circuit board, a second adhesive layer disposed between a display panel and the first adhesive layer, and a metal layer disposed between the first adhesive layer and the second adhesive layer.

[0231] In one or more aspects, the display device may further include: a controller configured to provide image data to be supplied to a display panel and disposed on a printed circuit board; and a shield for protecting at least a portion of the printed circuit board and the controller.

[0232] In one or more aspects, the display device may also include a shielding strip attached to at least a portion of the shielding cover.

[0233] In one or more aspects, the display device may also include a shield disposed on a printed circuit board.

[0234] In one or more aspects, the shielding may overlap with the power management circuitry.

[0235] In one or more aspects, the display device may also include a shielding strip attached to at least a portion of the shielding cover.

[0236] In one or more aspects, the display device may further include a first touch sensor layer disposed on the display panel and a second touch sensor layer disposed on the first touch sensor layer.

[0237] The above description has been presented to enable any person skilled in the art to make and use the technical concepts of this disclosure, and has been provided in the context of a particular application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to those skilled in the art, and the principles described herein can be applied to other embodiments and applications without departing from the scope of this disclosure. The above description and drawings provide examples of the technical concepts of this disclosure for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concepts of this disclosure.

Claims

1. A display device, the display device comprising: A display panel, wherein multiple sub-pixels are provided; A power management circuit configured to supply at least one driving voltage to the plurality of sub-pixels; A printed circuit board, wherein the printed circuit board overlaps with the power management circuit; as well as A heat insulation portion is disposed between the printed circuit board and the display panel and overlaps with at least a portion of the power management circuit.

2. The display device according to claim 1, wherein, The insulating part includes: A heat dissipation unit is attached to the printed circuit board and dissipates heat. A heat insulation section, which overlaps with the heat dissipation section and shields against heat; and The impact absorption section overlaps with the heat dissipation section.

3. The display device according to claim 1, further comprising: An adhesive portion disposed between the display panel and the printed circuit board. The adhesive portion is disposed on at least one side of the heat insulation portion.

4. The display device according to claim 3, further comprising: A controller configured to provide image data to be supplied to the display panel. At least a portion of the adhesive portion overlaps with the controller.

5. The display device according to claim 3, wherein, The adhesive portion includes: A first adhesive layer is attached to the printed circuit board; A second adhesive layer is disposed between the display panel and the first adhesive layer; and A metal layer is disposed between the first adhesive layer and the second adhesive layer.

6. The display device according to claim 1, further comprising: A controller configured to provide image data to be supplied to the display panel and disposed on the printed circuit board; as well as A shielding cover is provided to protect at least a portion of the printed circuit board and the controller.

7. The display device according to claim 6, further comprising: A shielding strip attached to at least a portion of the shielding cover.

8. The display device according to claim 1, further comprising: A shielding cover is installed on the printed circuit board. The shielding cover overlaps with the power management circuit.

9. The display device according to claim 8, further comprising: A shielding strip attached to at least a portion of the shielding cover.

10. The display device according to claim 1, further comprising: A first touch sensor layer is disposed on the display panel; as well as A second touch sensor layer is disposed on the first touch sensor layer.

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