Electronic device

Abstract

An electronic device is provided. The electronic device includes a heat dissipation structure, a first conductive element, and a first electronic component. The first conductive element penetrates the heat dissipation structure. The first electronic component is disposed below the heat dissipation structure and electrically connected to the first conductive element. The heat dissipation structure is configured to provide a heat transport path to the first electronic component that does not pass through the first conductive element.

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] Power management integrated circuits (PMICs) fully utilize system-in-package (SiP) technology, including double-sided molding and 2.5D / 3D ICs, to integrate multiple chips or components into a single package. However, to provide different types of power control and meet the demands of high-speed data communication, bulky passive components may be required. This can increase package size and potentially reduce layout design flexibility. Summary of the Invention

[0003] In some arrangements, an electronic device includes a heat dissipation structure, a first conductive element, and a first electronic component. The first conductive element penetrates the heat dissipation structure. The first electronic component is disposed below the heat dissipation structure and electrically connected to the first conductive element. The heat dissipation structure is configured to provide a heat transfer path to the first electronic component that does not pass through the first conductive element.

[0004] In some arrangements, an electronic device, a first electronic component, a first conductive element, and a first retainer are included. The first electronic component is disposed above a first carrier. The first conductive element is disposed above the first carrier and electrically connected to the first electronic component. The first retainer is disposed above the first carrier and configured to retain the first conductive element. The first retainer includes a fastening profile configured to secure the first conductive element.

[0005] In some arrangements, an electronic device includes a power transmission board, a first electronic component, and a first carrier. The first electronic component is configured to receive power from the power transmission board via a first conductive element. The first carrier is configured to receive signals from the power transmission board via a second conductive element. The lengths of the first conductive element and the second conductive element are different. Attached Figure Description

[0006] Various aspects of the arrangements of this disclosure will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1A Perspective views illustrating some arrangements of electronic devices according to this disclosure.

[0008] Figure 1B Explanation of some arrangements based on this disclosure Figure 1A The image shows an exploded view of the voltage regulation module.

[0009] Figure 2A Description of some arrangements according to this disclosure Figure 1A The cross-sectional view of the electronic device shown in the image is along line A-A'.

[0010] Figure 2B Description of some arrangements according to this disclosure Figure 1A The image shows a cross-sectional view of the electronic device along line B-B'.

[0011] Figure 3A The illustration shows cross-sectional views of some of the heat dissipation structures and interconnects arranged according to this disclosure.

[0012] Figure 3B Explanation of some arrangements based on this disclosure Figure 3A A bottom view of the heat dissipation structure and interconnects.

[0013] Figure 3C Explanation of some arrangements based on this disclosure Figure 3A The image shows a top view of the heat dissipation structure and interconnects.

[0014] Figure 4A A cross-sectional view illustrating some arrangements of interconnects according to this disclosure.

[0015] Figure 4B Explanation of some arrangements based on this disclosure Figure 4A The top view of the interconnects shown in the image.

[0016] Figure 5 A top view illustrating some arrangements of interconnects according to this disclosure.

[0017] Figure 6A A cross-sectional view illustrating some arrangements of interconnects according to this disclosure.

[0018] Figure 6B Explanation of some arrangements based on this disclosure Figure 6A The image shows a cross-sectional view of the connector.

[0019] Figure 6C Explanation of some arrangements based on this disclosure Figure 6A The image shows a cross-sectional view of a conductive element.

[0020] Figure 7 A cross-sectional view illustrating some arrangements of an electronic device according to this disclosure.

[0021] Figure 8 A cross-sectional view illustrating some arrangements of interconnects according to this disclosure. Detailed Implementation

[0022] The following disclosure provides numerous different arrangements or examples for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include arrangements where the first and second features are formed or disposed in direct contact, and may also include arrangements where additional features may be formed or disposed between the first and second features such that the first and second features may not be in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of this disclosure. Such repetition is for the purpose of simplicity and clarity and does not, in itself, prescribe a relationship between the various arrangements and / or configurations discussed.

[0023] Unless otherwise specified, spatial descriptions such as “up,” “down,” “above,” “left,” “right,” “downward,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “lower,” “upper,” “above,” and “below” are relative to the orientation shown in the drawings. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein may be arranged in any spatial orientation or manner, provided that the advantages of the arrangement of this disclosure are not compromised by such arrangement.

[0024] Figure 1A and 1B An exploded view illustrating an electronic device 1a arranged according to some of the present disclosure. Figure 2A and 2B It is based on some arrangements of this disclosure. Figure 1A A cross-sectional view of the electronic device 1a shown in the image.

[0025] like Figure 1A As shown, electronic device 1a may include a voltage regulator module 10, a power delivery board 40, and a heat dissipation structure 50. In some arrangements, the voltage regulator module 10 may be configured to receive power (or a power signal) from the power delivery board 40. For example, the voltage regulator module 10 may include electronic components 20 configured to receive power from the power delivery board 40. In some arrangements, the voltage regulator module 10 may be configured to convert a higher voltage to a lower voltage.

[0026] Please refer to Figure 1B , 2AIn conjunction with 2B, the voltage regulator module 10 may include circuit structures 11 and 12 (or carriers). Each of circuit structures 11 and 12 may be formed as a printed circuit board (PCB), a flexible printed circuit board (FPCB), a lead frame, a combination thereof, or other suitable circuit structures. Circuit structures 11 and 12 may be at different levels (or elevations) or heights along the Z-direction. Each of circuit structures 11 and 12 may include a plurality of metal layers separated from each other by dielectric material layers and interconnected by conductive vias. In some embodiments, each of circuit structures 11 and 12 may be formed of epoxy resin, glass fiber reinforced epoxy resin, epoxy resin with inorganic fillers, ceramic materials, or polymeric materials such as polyimide. Circuit structure 11 may have a surface 11s1 (or a lower surface) and a surface 11s2 (or an upper surface) opposite to surface 11s1. The circuit structure 12 may have a surface 12s1 (or a lower surface) and a surface 12s2 (or an upper surface) opposite to the surface 12s1. The circuit structure 11 may be disposed above the surface 12s2 of the circuit structure 12.

[0027] The voltage regulator module 10 may include an electronic component 20. The electronic component 20 may be disposed on or above surface 11s2 of the circuit structure 11. In some arrangements, the electronic component 20 may act as a first-stage power module (or a first power conversion stage, converter, or electrical converter). In some arrangements, the electronic component 20 may be configured to convert a higher voltage (e.g., 48 V) to a lower voltage (e.g., 12 V). For example, the electronic component 20 may be configured to receive a higher voltage from a power delivery board 40 and transmit a lower voltage to a second-stage power module 30. In some arrangements, the electronic component 20 may include at least one power module (or converter) comprising transistors, diodes, capacitors, inductors, and / or other suitable components. For example, the electronic component 20 may include a circuit structure formed as a PCB, FPCB, or other suitable circuit structure. Active components (e.g., converters, controllers, and / or drivers) and passive components (e.g., capacitors and / or inductors) may be disposed on the circuit structure.

[0028] The voltage regulator module 10 may include a second-stage power module 30. The second-stage power module 30 (or second power conversion stage or converter) may be disposed on or above surface 12s2 of the circuit structure 12. In some arrangements, the second-stage power module 30 may be configured to convert a higher voltage (e.g., 12 V) to a lower voltage (e.g., 8 V, 6 V, 4 V, 2 V, or lower). In some arrangements, the second-stage power module 30 may include electronic components with different thicknesses along the Z-direction. For example, the second-stage power module 30 may include electronic components 32, 34, and 36. Electronic components 32, 34, and 36 may have different thicknesses along the Z-direction.

[0029] Electronic components 32, 34, and 36 may be disposed on or above the surface 12s2 of the circuit structure 12. Electronic components 34 and 36 may be disposed within the space defined by the circuit structures 11 and 12. In some arrangements, electronic component 32 may be disposed within an opening 11o defined by the circuit structure 11. In some arrangements, a portion of electronic component 32 may protrude from the surface 11s2 of the circuit structure 11. In some arrangements, the thickness of electronic component 32 (e.g., its length along the Z direction) may be greater than the thickness of electronic component 20. In some arrangements, each of electronic components 34 and 36 may have a thickness (e.g., its length along the Z direction) less than the thickness of electronic component 20. In some arrangements, the thickness of electronic component 32 may be greater than or equal to 7 mm, such as 7 mm, 8 mm, 9 mm, 10 mm, or greater. In some arrangements, the thickness of electronic component 20 may be in the range between 3 mm and 7 mm, such as 3 mm, 4 mm, 5 mm, 6 mm, or 7 mm. The thickness of electronic components 34 or 36 may be in the range of approximately 1 mm to 5 mm, for example, 1 mm, 2 mm, 3 mm, 4 mm, or 5 mm. Electronic components 32 and 34 (or voltage regulators or converters) may be configured to convert higher voltages (e.g., 12 V) to lower voltages (e.g., 8 V, 6 V, 4 V, 2 V, or lower). Electronic components 32 and 34 may be electrically connected to circuit structure 11. Electronic components 32 and 34 may contain multiple components on a circuit structure (e.g., a PCB). For example, electronic components 32 and 34 may contain transistors, controllers, and passive components. Electronic component 36 may be configured to turn electronic components 32 and / or 34 on or off. For example, electronic component 36 may act as a controller. It should be noted that the second-stage power module 30 may contain more components, such as passive components (e.g., capacitors and / or inductors), active components, and / or other suitable components.

[0030] In some arrangements, electronic device 1a may include interconnect 60a. In some arrangements, interconnect 60a may be configured to transmit power between voltage regulator module 10 and power delivery board 40. In some arrangements, interconnect 60a may include connector 61a, connector 62a, and conductive element 63a.

[0031] In some arrangements, connector 61a may be disposed on or above surface 11s2 of circuit structure 11. In some arrangements, connector 61a may be configured to connect, hold, or accommodate conductive element 63a. For example, connector 61a may define a recess for accommodating a portion of conductive element 63a.

[0032] In some arrangements, connector 62a may be disposed on or below power transmission plate 40. In some arrangements, connector 62a may be configured to connect, retain, or receive conductive element 63a. For example, connector 62a may define a recess for receiving a portion of conductive element 63a.

[0033] In some arrangements, conductive element 63a may be connected between connectors 61a and 62a. Conductive element 63a may be disposed on or above surface 11s2 of circuit structure 11. In some arrangements, conductive element 63a may be configured to transmit power (or power signals) between voltage regulator module 10 and power delivery board 40. For example, conductive element 63a may be configured to transmit a relatively large amount of power (e.g., 48 V) from power delivery board 40 to electronic component 20. In some arrangements, conductive element 63a may be fixed to heat dissipation structure 50. In some arrangements, conductive element 63a may penetrate heat dissipation structure 50. In some arrangements, conductive element 63a may comprise a pogo pin, conductive post, or other suitable conductive element.

[0034] In some arrangements, electronic device 1a may include interconnect 60b. In some arrangements, interconnect 60b may be configured to transmit signals (or data signals) between voltage regulator module 10 and power delivery board 40. In some arrangements, interconnect 60b may include connector 61b, connector 62b, and conductive element 63b.

[0035] In some arrangements, connector 61b may be disposed on or above surface 12s1 of circuit structure 12. In some arrangements, connectors 61a and 61b may be located at different levels (high or low) along the Z direction. In some arrangements, connector 61b may be configured to connect, retain, or receive conductive element 63b. For example, connector 61b may define a recess for receiving a portion of conductive element 63b.

[0036] In some arrangements, connector 62b may be positioned on or below the power transmission plate 40. In some arrangements, connectors 62a and 62b may be located at the same level (or height) along the Z direction. In some arrangements, connector 62b may be configured to connect, retain, or receive conductive element 63b. For example, connector 62b may define a recess for receiving a portion of conductive element 63b.

[0037] In some arrangements, conductive element 63b may be connected between connectors 61b and 62b. Conductive element 63b may be disposed on or above surface 12s2 of circuit structure 12. In some arrangements, conductive element 63b may be configured to transmit signals between voltage regulator module 10 and power delivery board 40. For example, conductive element 63b may be configured to transmit signals from power delivery board 40 to circuit structure 12. In some arrangements, conductive element 63b may be fixed to heat dissipation structure 50. In some arrangements, conductive element 63b may penetrate heat dissipation structure 50. In some arrangements, conductive element 63b may comprise spring pins, conductive posts, or other suitable conductive elements.

[0038] In some arrangements, the power delivery board 40 may be configured to provide a relatively large amount of power (e.g., 48 V) to the voltage regulator module 10. In some arrangements, the power delivery board 40 may be configured to transmit signals (e.g., data signals) to the voltage regulator module 10. In some arrangements, the power delivery board 40 may include a PCB, FPCB, or other suitable circuit structure. One or more electronic components (not shown) may be disposed on or above the power delivery board 40. For example, electronic device 1a may be contained in a power management integrated circuit (PMIC) die on or within the power delivery board 40.

[0039] In some arrangements, a heat dissipation structure 50 may be disposed between the voltage regulator module 10 and the power delivery plate 40. In some arrangements, the heat dissipation structure 50 may be thermally coupled to the voltage regulator module 10. For example, the heat dissipation structure 50 may be configured to transfer heat from the voltage regulator module 10. In some arrangements, the heat dissipation structure 50 may be thermally coupled to the power delivery plate 40. For example, the heat dissipation structure 50 may be configured to transfer heat from the power delivery plate 40. The heat dissipation structure 50 may include a cold plate, which may include a vapor chamber, heat pipes, and / or other suitable elements. The heat dissipation structure 50 may include a thermally conductive material, such as aluminum (Al), copper (Cu), chromium (Cr), tin (Sn), gold (Au), silver (Ag), nickel (Ni), or stainless steel, or mixtures, alloys, or other combinations thereof. The heat dissipation structure 50 may have a surface 50s1 (or a lower surface) and a surface 50s2 (or an upper surface) opposite to surface 50s1. Surface 50s1 may face the voltage regulator module 10. Surface 50s2 can face the power transmission plate 40. For example... Figure 2A and 2B As shown, connectors 61a and 61b can be disposed on or below the surface 50s1 of the heat dissipation structure 50, and connectors 62a and 62b can be disposed on or above the surface 50s1 of the heat dissipation structure 50.

[0040] In some arrangements, the heat dissipation structure 50 may define recesses 50r1 and 50r2. Recess 50r1 may be recessed from the surface 50s1 of the heat dissipation structure 50. Recess 50r2 may be recessed from the surface 50s1 of the heat dissipation structure 50. In some arrangements, recess 50r1 may be configured to accommodate electronic component 20, thereby enhancing heat dissipation performance. In some arrangements, recess 50r2 may be configured to accommodate electronic component 32, thereby enhancing heat dissipation performance. In some arrangements, recesses 50r1 and 50r2 may be spaced apart from each other. In other arrangements, recess 50r1 may be connected to recess 50r2, thereby defining openings for accommodating electronic components 20 and 32. In some arrangements, recesses 50r1 and 50r2 may have the same depth along the Z direction. In some arrangements, recesses 50r1 and 50r2 may have different depths along the Z direction. For example, the depth of recess 50r1 may be greater than the depth of recess 50r2. In some arrangements, the heat dissipation structure 50 may be configured to provide a heat transfer path to the electronic component 20 that does not pass through the conductive element 63a. In some arrangements, the heat dissipation structure 50 may be configured to provide a heat transfer path to the electronic component 20 that does not pass through the circuit structure 11.

[0041] In some arrangements, electronic device 1a may include interconnect 70. In some arrangements, interconnect 70 may be disposed on or above surface 12s2 of circuit structure 12. Interconnect 70 may be disposed in a peripheral region of circuit structure 12. For example, interconnect 70 may surround electronic components 32, 34, and 36. Interconnect 70 may be disposed between circuit structures 11 and 12. In some arrangements, interconnect 70 may be configured to support circuit structure 11. In some arrangements, interconnect 70 may electrically connect circuit structures 11 and 12. In some arrangements, interconnect 70 may be configured to transmit power and / or signals. In some arrangements, interconnect 70 may include spring pins, conductive posts, or other suitable conductive elements. In other arrangements, interconnect 70 may be replaced by an interposer, which may include a substrate (e.g., a silicon substrate or other substrate) and conductive elements in the substrate (e.g., through-silicon vias, TSVs)). In other arrangements, interconnect 70 can be replaced with other conductive components, such as solder material.

[0042] In some arrangements, electronic device 1a may include a thermally conductive layer 71. The thermally conductive layer 71 may be disposed on or above electronic component 20. For example, the thermally conductive layer 71 may be disposed on or above the upper surface of electronic component 20. In other arrangements, the thermally conductive layer 71 may be disposed on the side (or side) of electronic component 20. The thermally conductive layer 71 may be disposed between electronic component 20 and heat dissipation structure 50. The thermally conductive layer 71 may be configured to transfer heat between electronic component 20 and heat dissipation structure 50. In some arrangements, interconnect 70 may include a thermally conductive material, such as thermal interface material (TIM), thermal paste, or other suitable material. In some arrangements, metal particles, such as silver or gold, may be doped into the thermally conductive layer 71. In other arrangements, the thermally conductive layer 71 may be omitted, and electronic component 20 may be in direct contact with heat dissipation structure 50.

[0043] In some arrangements, the electronic device 1a may include a thermally conductive layer 72. The thermally conductive layer 72 may be disposed on or above the electronic component 32. For example, the thermally conductive layer 72 may be disposed on or above the upper surface of the electronic component 32. In other arrangements, the thermally conductive layer 72 may be disposed on the side (or side) of the electronic component 32. The thermally conductive layer 72 may be disposed between the electronic component 32 and the heat dissipation structure 50. The thermally conductive layer 72 may be configured to transfer heat between the electronic component 32 and the heat dissipation structure 50. In some arrangements, the thermally conductive layer 72 may contain a thermally conductive material, such as a thermal interface material (TIM), thermal paste, or other suitable material. In some arrangements, metal particles, such as silver or gold, may be incorporated into the thermally conductive layer 72.

[0044] In some arrangements, the electronic device 1a may include a spacer 73. In some arrangements, the spacer 73 may be disposed within a recess 50r2 of the heat dissipation structure 50. In some arrangements, the spacer 73 may be disposed between the electronic component 32 and the heat dissipation structure 50. The spacer 73 may be configured to transfer heat between the electronic component 32 and the heat dissipation structure 50. The spacer 73 may comprise a thermally conductive material, such as a metal or alloy. In other arrangements, the spacer 73 and the heat dissipation structure 50 may be integrally formed. In some arrangements, the heat dissipation structure 50 may be configured to provide a heat transfer path to the electronic component 32 that does not pass through the conductive element 63a. In some arrangements, the heat dissipation structure 50 may be configured to provide a heat transfer path to the electronic component 32 that does not pass through the circuit structure 12.

[0045] In this arrangement, electronic device 1a includes interconnects 60a and 60b for transmitting power and signals. In some cases, the current flowing through conductive element 63a exceeds the current flowing through conductive element 63b. Therefore, if the transmission path is too long, the interconnects responsible for power transmission may experience significant power loss. In this configuration, electronic component 20 is positioned closer to the power delivery board 40 than the second-stage power module 30. Furthermore, the length of conductive element 63a is shorter than the length of conductive element 63b, resulting in a shortened power transmission path. Therefore, power loss can be minimized.

[0046] In this arrangement, the heat dissipation structure 50 may define one or more recesses (e.g., recesses 50r1 and 50r2) for accommodating electronic components 20 and 32, which enhances the heat dissipation performance of the electronic device 1a. Additionally, the presence of recesses 50r1 and 50r2 helps to reduce the overall thickness (i.e., the dimension along the Z direction) of the electronic device 1a.

[0047] Figure 3A , 3B The 3C description includes some arrangements of the heat dissipation structure 50, interconnects 60a and 60b according to this disclosure.

[0048] like Figure 3A As shown, conductive element 63a may have a length L1 along the Z direction. Conductive element 63b may have a length L2 along the Z direction. In some arrangements, length L2 may be greater than length L1. In some arrangements, conductive element 63a may have a diameter (or width) greater than the diameter (or width) of conductive element 63b. For example... Figure 3B As shown, in some arrangements, interconnect 60b may include a housing for receiving or securing a portion of conductive element 63b. Conductive elements 63a and 63b may have protrusions of different lengths extending from surface 50s1.

[0049] like Figure 3A and 3CAs shown, electronic device 1a may include a fixing module 52 (or fastening module). In some arrangements, the fixing module 52 may abut a surface 50s2 of the heat dissipation structure 50. In some arrangements, the fixing module 52 may be partially embedded within the heat dissipation structure 50. In some arrangements, the fixing module 52 may be configured to secure interconnects 60a and / or 60b to the heat dissipation structure 50. In some arrangements, the fixing module 52 may be configured to secure conductive elements 63a and / or 63b to the heat dissipation structure 50. Figure 3C As shown, the fixing module 52 may include a base 53 and a fastener 54. In some arrangements, the heat dissipation structure 50 may define a recess for receiving the base 53. The base 53 may include a plate defining a plurality of holes for receiving the fastener 54, conductive element 63a, and / or conductive element 63b. In some arrangements, the fastener 54 may penetrate the base 53. In some arrangements, the fastener 54 may penetrate the heat dissipation structure 50. In some arrangements, the fastener 54 may include a screw, pin, or other suitable element. In some arrangements, after the interconnects 60a and 60b are fixed to the heat dissipation structure 50 by the fixing module 52, the lower surfaces of the connectors 62a and 62b may be attached to or mated to surface 50s2.

[0050] In some cases, conductive elements 63a and 63b may become tilted if their protruding portions exceed a certain length (e.g., greater than 7 mm or more) or if the depth of connectors 61a, 61b, 62a, and 62b is insufficient (e.g., less than 3 mm). To address this issue, the fixing module 52 is designed to secure interconnects 60a and 60b. Therefore, conductive elements 63a and 63b can remain properly aligned even when there are significant length differences between them.

[0051] Figure 4A and 4B The illustration shows a cross-sectional view of connector 64a according to some arrangements of this disclosure. In some arrangements, connectors 61a, 61b, 61c and 61d may have the same or similar structure as connector 64a.

[0052] Connector 64a may include a base 65 and a retainer 66 on the base 65. The base 65 may include a dielectric structure and conductive traces within the dielectric structure. The retainer 66 (or receiver) may be configured to connect, retain, or accommodate a conductive element 63a (or conductive element 63b), such as... Figure 2A and 2BAs shown in the diagram. In some arrangements, the retainer 66 may include a hollow portion for receiving a conductive element 63a (or conductive element 63b). In some arrangements, the retainer 66 may have a surface 66s1 and a surface 66s2 (or a side or lateral surface). In some arrangements, the retainer 66 may have a recess 66r recessed from the surface 66s1. In some arrangements, the recess 66r may be configured to secure the conductive element 63a (or conductive element 63b). The recess 66r may be configured to allow the retainer 66 to expand when the conductive element 63a (or conductive element 63b) is inserted into the retainer 66. Figure 4B As shown, connector 64a may include two recesses 66r located on opposite sides of surface 66s2. In other arrangements, from a top view, the recesses 66r may be located in the same semi-circular area.

[0053] Figure 5 The illustration shows a top view of connector 64b according to some arrangements of this disclosure. Connector 64b may include a structure similar to that of connector 64a, except that connector 64b may include four recesses 66r evenly spaced around the outer periphery of surface 66s2. In some arrangements, connectors 61a, 61b, 61c, and 61d may have the same or similar structure as connector 64b.

[0054] Figure 6A , 6B The diagram above shows a partially enlarged view of the interconnect 60c according to some arrangements of this disclosure. In some arrangements, Figures 1A to 2B The interconnects 60a and 60b shown can be replaced with interconnect 60c.

[0055] like Figure 6A and 6B As shown, interconnect 60c may include connector 64c. Connector 64c may have the same or similar structure as connector 64a or connector 64b, except that connector 64c may include a notch 66i (or cutout). In some arrangements, notch 66i may be recessed from surface 66s2 of retainer 66. Notch 66i may be configured to secure conductive element 67. Notch 66i may have any suitable profile for mating conductive element 67.

[0056] like Figure 6A and 6C As shown, conductive element 67 may include sleeve 68 and terminal 69. Terminal 69 may be disposed on two opposite sides of sleeve 68. Terminal 69 may also be inserted into connector 64c. Terminal 69 may include plug 69p and notch 69r (or cutout). In some arrangements, plug 69p may be configured to mate with or match the contour of notch 66r. In some arrangements, notch 69r may be configured to mate with or match the contour of notch 66i.

[0057] In this arrangement, the conductive element 67 can be securely attached to the connector 64c using a suitable fixing pattern (e.g., notch 66i, recess 66r, plug 69p, and / or notch 69r). Therefore, the conductive element 67 remains stable and is not easily tilted.

[0058] Figure 7 A cross-sectional view of an electronic device 1b arranged according to some of the present disclosure is shown. Electronic device 1b is similar to electronic device 1a, except as follows.

[0059] In some arrangements, electronic device 1b may include circuit structure 13. In some arrangements, circuit structure 13 may be formed as a printed circuit board, flexible printed circuit board, or other suitable circuit structure. Circuit structure 13 may include a plurality of metal layers separated from each other by dielectric material layers and interconnected by conductive vias. In some embodiments, circuit structure 13 may be formed of epoxy resin, glass fiber reinforced epoxy resin, epoxy resin with inorganic fillers, ceramic materials, or polymer materials such as polyimide. Circuit structure 13 may have a surface 13s1 (or a lower surface) and a surface 13s2 (or an upper surface) opposite to surface 13s1. Surface 13s2 of circuit structure 13 may face surface 12s1 of circuit structure 12.

[0060] In some arrangements, electronic device 1b may include a passive component 74. The passive component 74 may be disposed on or above surface 13s2 of circuit structure 13. The passive component 74 may be electrically connected to circuit structure 12. In some arrangements, the passive component 74 may be disposed between circuit structures 12 and 13. The passive component 74 may be electrically connected to circuit structure 13. In some arrangements, the passive component 74 may be configured to regulate power from the second-stage power module 30 to the operation module 80 (or computing module). In some arrangements, the passive component 74 may include a capacitor. In some arrangements, the passive component 74 may include an input capacitor (Cin) through which power flows before being delivered to the second-stage power module 30 (e.g., electronic component 32). In some arrangements, the passive component 74 may include an output capacitor (Cout) through which power flows after being transferred from the second-stage power module 30 (e.g., electronic component 32).

[0061] Electronic device 1b may include electrical connector 75. Electrical connector 75 may be located between circuit structures 12 and 13. Electrical connector 75 may be or include electrical contacts, such as solder balls (e.g., controlled collapse chip connection (C4) bumps, ball grid array (BGA), land grid array (LGA) packages), conductive bumps, etc. Electrical connector 75 may contain an alloy of gold and tin solder or an alloy of silver and tin solder, or other suitable materials.

[0062] Electronic device 1b may include a carrier 14 (or substrate). In some arrangements, the carrier 14 may be disposed on or below surface 13s1 of circuit structure 13. In some arrangements, the carrier 14 may include a semiconductor substrate, such as silicon, germanium, and other group III-V and group IV materials. The carrier 14 may include metal lines and vias, including, but not limited to, through-silicon vias (TSVs) for interconnection. In some arrangements, the carrier 14 may include a wafer, a board, or other suitable form. The carrier 14 may have a surface 14s1 (or lower surface) and a surface 14s2 (or upper surface) opposite to surface 14s1.

[0063] The carrier 14 can be electrically connected to the circuit structure 13 via the electrical connector 76. The carrier 14 can be configured to support the operating module 80. In some arrangements, the electrical connector 76 may contain resolderable material. The electrical connector 76 may be or contain electrical contacts, such as solder balls (e.g., controlled collapse chip connection (C4) bumps, ball grid array (BGA), grid array package (LGA)), conductive bumps, etc. The electrical connector 76 may contain an alloy of gold and tin solder or an alloy of silver and tin solder, or other suitable materials.

[0064] In some arrangements, the operating module 80 may be disposed on or below the surface 14s1 of the carrier 14. In some arrangements, the operating module 80 may be configured to generate non-electrical signals, such as analog signals, digital signals, clock signals, or other electrical signals besides electrical signals. The operating module 80 may include electronic components 81 and 82. In some arrangements, electronic components 81 and 82 may be disposed on or below the surface 14s1 of the carrier 14. In some arrangements, electronic component 81 may include a processor or other suitable component. In some arrangements, electronic component 81 may include an active device, such as a central processing unit (CPU), microprocessor unit (MPU), graphics processing unit (GPU), microcontroller unit (MCU), radio frequency integrated circuit (RFIC), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or another type of IC. In some arrangements, electronic component 82 may include a data storage unit or other suitable component. Electronic component 82 may be electrically connected to electronic component 81 via the carrier 14. Electronic component 82 may be disposed on or below the surface 14s1 of the carrier 14. In some arrangements, electronic component 82 may be configured to store signals from electronic component 81 and / or other devices. In some arrangements, electronic component 82 may include a high-bandwidth memory (HBM) die, a dynamic random access memory (DRAM) die, a static random access memory (SRAM) die, or other suitable memory devices. In some arrangements, operating module 80 may additionally include other components, such as input / output dies, configured to receive regulated power from secondary power module 30 and / or transmit processed signals to other devices (not shown). Electronic components 81 and 82 may be electrically connected to carrier 14 via electrical connector 77. In some arrangements, electrical connector 77 may contain resolderable material. Electrical connector 77 may be or contain electrical contacts, such as solder balls (e.g., controlled collapse chip connection (C4) bumps, ball grid array (BGA), grid array package (LGA)), conductive bumps, etc. Electrical connector 77 may contain an alloy of gold and tin solder or an alloy of silver and tin solder, or other suitable materials. In other arrangements, electronic components 81 and 82 may be electrically connected to the carrier 14 via a hybrid bonding technique involving bonding between metallic materials (e.g., copper-to-copper bonding) and bonding between dielectric materials (e.g., oxide-to-oxide bonding).

[0065] In some arrangements, interconnect 60a may be configured to receive power P1 (or voltage or external power) from power delivery board 40. In some arrangements, circuit structure 11 may be configured to provide an electrical path (or power supply path) for conducting power P1.

[0066] Circuit structures 11, 12, and interconnect 70 may be configured to provide electrical paths (or power paths) for conducting power P2a and P2b from electronic component 20. In some arrangements, electronic component 32 may be configured to receive power P2a from electronic component 20 through circuit structures 11, 12, and interconnect 70. In some arrangements, electronic component 34 may be configured to receive power P2b from circuit structures 11, 12, and interconnect 70. In some arrangements, power P2a may be substantially the same as power P2b.

[0067] The operating module 80 may be configured to receive power P3a and P3b (or regulated power) from the second-stage power module 30 (e.g., electronic components 32 and 34). In some arrangements, circuit structure 12 may be configured to provide an electrical path (or power path) for conducting power P3a and P3b. In some arrangements, circuit structure 13 may be configured to provide an electrical path (or power path) for conducting power P3a and P3b. In some arrangements, carrier 14 may be configured to provide an electrical path (or power path) for conducting power P3a and P3b. In some arrangements, the second-stage power module 30 may supply the operating module 80 with different power levels (e.g., 8 V, 6 V, 4 V, 2 V, or less). For example, power P3a may be different from power P3b.

[0068] Figure 8 The illustration shows a cross-sectional view of interconnect 60d according to some arrangements of this disclosure. In some arrangements, interconnect 60d is similar to interconnect 60a, with the following differences.

[0069] In some arrangements, connector 61a (or connector 62a) may be replaced by retaining module 79. In some arrangements, retaining module 79 may be attached to power delivery plate 40. In some arrangements, retaining module 79 may be configured to secure, grip, or retain conductive element 63a. Retaining module 79 may include, for example, clips, latches, or other suitable elements.

[0070] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain a plural or multiple indicators.

[0071] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials are generally defined as materials that exhibit very little or no resistance to the flow of electric current. A unit of measurement for conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity greater than approximately 10. 4 S / m, for example, at least 10 5 S / m or at least 106 A material with S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0072] As used herein, the terms “approximately,” “substantially,” “roughly,” and “about” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to examples where the event or situation occurred precisely or very approximately. For example, when used in conjunction with numerical values, these terms may refer to a range of variation less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of these values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the two values ​​may be considered “substantially” the same or equal. For example, "generally parallel" can refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. Similarly, "generally perpendicular" can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0073] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0074] Although this disclosure has been described and illustrated with reference to specific arrangements, such descriptions and illustrations are not limiting of this disclosure. Those skilled in the art will understand that various changes and equivalent substitutions can be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, the process reproduction in this disclosure may differ from actual equipment. Other arrangements may exist that are not specifically described in this disclosure. The description and drawings should be considered illustrative rather than restrictive. Modifications can be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are considered to be included within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not a limitation of this disclosure.

Claims

1. An electronic device comprising: Heat dissipation structure; A first conductive element penetrates the heat dissipation structure; as well as A first electronic component is disposed below the heat dissipation structure and electrically connected to the first conductive element. The heat dissipation structure is configured to provide the first electronic component with a heat transfer path that does not pass through the first conductive element.

2. The electronic device of claim 1, wherein the heat dissipation structure defines a recess for receiving the first electronic component.

3. The electronic device according to claim 1, further comprising: A power delivery plate, located above the heat dissipation structure and configured to provide a first voltage of first power to the first electronic component.

4. The electronic device according to claim 3, further comprising: The first carrier supports the first electronic component; as well as A first connector is disposed above the first carrier and configured to support the first conductive element.

5. The electronic device according to claim 4, further comprising: A second connector is disposed below the power transmission plate and configured to support the first conductive element.

6. The electronic device according to claim 4, further comprising: A second electronic component is configured to receive a second power from the first electronic component at a second voltage less than the first voltage; as well as The second carrier is disposed below the first carrier and configured to support the second electronic component.

7. The electronic device of claim 6, further comprising a second conductive element extending between the power transmission plate and the second carrier, wherein the dimensions of the second conductive element are different from those of the first conductive element.

8. The electronic device of claim 6, further comprising a second conductive element configured to transmit a signal between the power transmission plate and the second carrier.

9. The electronic device of claim 6, wherein the second electronic component has a portion protruding from the first carrier toward the heat dissipation structure.

10. The electronic device of claim 3, further comprising a fastener configured to secure the first conductive element to the heat dissipation structure, wherein the distance between the fastener and the power delivery plate is less than the distance between the fastener and the first electronic component.

11. An electronic device comprising: First carrier; A first electronic component is disposed above the first carrier; A first conductive element, disposed above the first carrier and electrically connected to the first electronic component; and A first connector is disposed above the first carrier and configured to support the first conductive element. The first connector includes a fastening profile configured to secure the first conductive element.

12. The electronic device of claim 11, wherein the fastening profile includes a recess recessed from the upper surface of the first connector.

13. The electronic device of claim 11, further comprising: A power transmission plate configured to transmit power to the first electronic component via the first conductive element.

14. The electronic device of claim 11, further comprising: The second carrier is located below the first carrier; as well as A second electronic component, located above the second carrier and configured to receive a first regulated power from the first electronic component at a first voltage.

15. The electronic device of claim 14, further comprising: A third electronic component is located between the second carrier and the first carrier and is configured to receive a second regulated power from the first electronic component at a second voltage, wherein the first voltage is substantially equal to the second voltage.

16. An electronic device comprising: Power transmission plate; A first electronic component, configured to receive power from the power delivery plate via a first conductive element; as well as A first carrier, configured to receive signals from the power transmission plate via a second conductive element. The length of the first conductive element is different from the length of the second conductive element.

17. The electronic device of claim 16, further comprising: A heat dissipation structure is located between the first electronic component and the power transmission plate; as well as A fastening module, at least partially between the heat dissipation structure and the power transmission plate, wherein the fastening module is configured to secure the first conductive element to the heat dissipation structure.

18. The electronic device of claim 16, further comprising: The second carrier is located above the first carrier and supports the first electronic component; as well as A first connector is located above the second carrier and configured to support the first conductive element.

19. The electronic device of claim 18, further comprising: A second connector is located on the first carrier and configured to support the first conductive element.

20. The electronic device of claim 16, further comprising: A second electronic component is located above the first carrier and configured to receive regulated power from the first electronic component.

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