Electronic circuit board and its immersion cooling device

Abstract

The present disclosure relates to an electronic circuit board having improved cooling efficiency and an immersion cooling device thereof. An immersion cooling device according to an embodiment of the present disclosure can include a housing in which a cooling fluid is stored, a plurality of electronic circuit boards disposed in an interior of the housing and immersed in the cooling fluid, and a heat exchange device that exchanges heat with the cooling fluid that has absorbed heat of the plurality of electronic circuit boards. At least a portion of the plurality of electronic circuit boards can include a substrate, a plurality of electronic components disposed on the substrate, and at least one condensing portion located between the plurality of electronic components and configured to condense at least one vapor bubble generated by heat of an electronic component located at a lower end among the plurality of electronic components and rising in an upper end direction of the housing.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to electronic circuit boards and immersion cooling devices thereof. Background Technology

[0002] With the development of cutting-edge technologies such as the Internet of Things (IoT), artificial intelligence (AI), 5G mobile communication, and streaming media, the development of high-performance chips (e.g., integrated circuits, ICs) is accelerating. These high-performance chips feature high integration and processing speed to improve computing power, but this comes at the cost of increased heat generation. For example, in high-density chip structures, limited heat dissipation can lead to overheating, which may result in decreased system performance and stability.

[0003] Immersion cooling technology has gained attention in recent years for solving the heat generation problem of high-performance chips. By immersing the substrate on which the high-performance chip is mounted into a non-conductive cooling fluid (e.g., dielectric fluid or dielectric coolant), heat can be effectively removed.

[0004] On the other hand, during immersion cooling, the cooling fluid (e.g., liquid or vapor) that has absorbed heat from the lower chip can flow upwards. In this case, the heat removal efficiency of the upper chip may decrease. For example, when multiple substrates are immersed in the cooling fluid adjacent to each other (e.g., spaced apart by a predetermined interval), vapor bubbles may attach to one side (e.g., the back side) of other substrates along the rising path of the vapor bubbles generated by the heat from the chips on the substrates. Due to this vapor attachment phenomenon, vapor pockets or thin vapor films are formed on one side of other substrates, which can lead to a decrease in heat dissipation performance. In this case, the cooling efficiency of the immersion cooling device may decrease. Summary of the Invention

[0005] Technical problems to be solved

[0006] According to one aspect of this disclosure, an electronic circuit board with improved cooling efficiency and its immersion cooling device can be provided.

[0007] Technical solution

[0008] An immersion cooling apparatus according to an embodiment of the present disclosure may include a housing that stores cooling fluid inside, a plurality of electronic circuit boards disposed inside the housing and immersed in the cooling fluid, and a heat exchange device that exchanges heat with the cooling fluid that has absorbed heat from the plurality of electronic circuit boards. At least a portion of the plurality of electronic circuit boards may include a substrate, a plurality of electronic components disposed on the substrate, and at least one condensation portion located between the plurality of electronic components and for condensing at least one vapor bubble (hereinafter referred to as a first vapor bubble) generated by heat generated by the lower electronic component among the plurality of electronic components and rising in the direction to the upper end of the housing (hereinafter referred to as the vertical direction).

[0009] According to one embodiment, the first vapor bubble can be condensed into a specific size by a corresponding condensation section, and the vapor bubble of the specific size (hereinafter referred to as the second vapor bubble) detaches from the corresponding condensation section and rises again in the vertical direction.

[0010] According to one embodiment, the second vapor bubble has buoyancy exceeding the adhesion between the second vapor bubble and the adjacent substrate in the vertical direction, so that the second vapor bubble may not be attached to the adjacent substrate.

[0011] According to one embodiment, the plurality of electronic circuit boards can be tilted within an angle range determined by a specified formula.

[0012] According to one embodiment, the tilt angle range can be calculated based on the length of the substrate, the substrate spacing, the horizontal length of the condensation portion, and the height of the condensation portion.

[0013] According to one embodiment, each condensation section may include a base attached to the substrate; and a condensation plate fastened to the base at a specified angle and used to condense the first vapor bubbles.

[0014] According to one embodiment, the specified angle may be determined by taking into account at least one of the tilt of the substrate, the substrate spacing, and the amount, size, and moving speed of the first vapor bubble.

[0015] According to one embodiment, the condensation plate can be formed as a vane structure with a regular or irregular pattern.

[0016] According to one embodiment, the condensation plate may include a solid plate.

[0017] According to one embodiment, each condensation section may further include an angle adjustment section for adjusting the angle between the base and the condensation plate.

[0018] According to one embodiment, each condensation section may further include: an elastomer that maintains the angle adjustment section in a default state; and a limiting member that restricts the condensation plate so that the condensation plate does not rotate beyond a specified range.

[0019] According to one embodiment, the at least one condensation portion may be located at the upper end of at least one electronic component that overlaps with other substrates in the vertical direction among the plurality of electronic components.

[0020] According to one embodiment, the substrate may further include a blocking structure that restricts the movement or flow of the cooling fluid between the plurality of electronic components.

[0021] An electronic circuit board according to an embodiment of the present disclosure may include a substrate, a plurality of electronic components disposed on the substrate, and at least one condensation portion located between the plurality of electronic components for condensing at least one vapor bubble generated by the heat of at least one electronic component located at the lower end of the plurality of electronic components during immersion cooling. Attached Figure Description

[0022] Figure 1 This is a schematic diagram illustrating the configuration of an immersion cooling apparatus according to an embodiment of the present disclosure.

[0023] Figure 2 This is a diagram illustrating an electronic circuit board according to an embodiment of the present disclosure.

[0024] Figure 3 This is a diagram illustrating the relationship between the tilt angle of an electronic circuit board and the position of the condenser portion according to an embodiment of the present disclosure.

[0025] Figure 4 This is a diagram illustrating various shapes of a condenser according to an embodiment of the present disclosure.

[0026] Figure 5 This is a diagram illustrating an example of a condenser section according to an embodiment of the present disclosure. Detailed Implementation

[0027] The present disclosure will now be described in detail with reference to the accompanying drawings. However, this is merely exemplary, and the present disclosure is not limited to the specific embodiments described herein.

[0028] Although terms such as "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are clearly not limited by these terms. These terms are used only to distinguish one element, constituent element, or part from other elements, constituent elements, or parts. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of this disclosure.

[0029] The terminology used in this specification is for illustrative purposes and not for limiting the scope of this disclosure. In this specification, the singular forms include the plural forms unless specifically indicated herein. For the use of "comprises" and / or "made of," the described constituent elements, steps, actions, and / or components do not preclude the presence or addition of one or more other constituent elements, steps, actions, and / or components.

[0030] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) are to be used in the sense that would be commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, unless explicitly defined otherwise, terms as defined in general dictionaries should not be interpreted ideally or excessively.

[0031] Furthermore, the terms "upper," "above," "lower," "bottom," "side," "right," and "left" used in this specification can be used to refer to various positions or directions shown in the accompanying drawings to indicate positional relationships in a given context. Specifically, the terms "upper," "lower," and "bottom" can represent the height direction perpendicular to the planar direction. In a three-dimensional orthogonal coordinate system, the planar direction can correspond to the X-axis and Y-axis, and the height direction can correspond to the Z-axis. For example, the Z-axis can represent the vertical direction in which the bubble moves upward.

[0032] Figure 1 This is a schematic diagram illustrating the configuration of an immersion cooling apparatus according to an embodiment of the present disclosure. Figure 2 This is a diagram illustrating an electronic circuit board according to an embodiment of the present disclosure. Figure 3 This is a diagram illustrating the relationship between the tilt angle of an electronic circuit board and the position of the condenser portion according to an embodiment of the present disclosure. Figure 4 This is a diagram illustrating various shapes of a condenser according to an embodiment of the present disclosure.

[0033] Reference Figures 1 to 4 According to one embodiment of the present disclosure, the immersion cooling device 100 can be a two-phase system in which the cooling fluid 10 undergoes a phase change during the immersion cooling process (e.g., the cooling fluid 10 (e.g., dielectric fluid or dielectric coolant) absorbs heat and vaporizes, and then is converted back into a liquid by the condenser 140). The immersion cooling device 100 may include a housing 110, a plurality of electronic circuit boards 120, a heat exchange device 130, and a condenser 140.

[0034] The housing 110 can store cooling fluid 10 inside. The housing 110 can have a cuboid shape, but is not limited to it. For example, the housing 110 has an internal space for accommodating objects to be cooled (e.g., electronic circuit boards 120), and can store cooling fluid 10 in the internal space to immerse multiple objects to be cooled (e.g., multiple electronic circuit boards 120).

[0035] The housing 110 may be configured such that at least a portion thereof is openable and closable to allow insertion or removal of a cooled object. The housing 110 may be sealed during cooling to prevent the cooling fluid (hereinafter referred to as vapor) that undergoes a phase change by absorbing heat from the electronic circuit board 120 from leaking to the outside.

[0036] The condenser 140 may be located in the upper empty space of the housing 110. The condenser 140 may be connected to the heat exchange device 130 via a first pipe 111 and a second pipe 112. According to one embodiment, the condenser 140 may exchange heat (e.g., absorb heat from the vapor) with vapor (e.g., a cooling fluid 10 that undergoes a phase change (e.g., vaporization) due to heat from the electronic circuit board 120). The vapor, having lost heat to the condenser 140, condenses into a liquid state and can fall freely. On the other hand, although in Figure 1 The first piping 111 and the second piping 112 are shown separately for illustration purposes, but this is only for ease of explanation; the first piping 111 and the second piping 112 can be formed as a single piping. According to some embodiments, the condenser 140 may not be included in the immersion cooling device 100. In this case, the cooling fluid 10 that has absorbed heat can move through the first piping 111 to the heat exchange device 130 outside the housing 110, and after exchanging heat with the heat exchange device 130, return to the housing 110 through the second piping 112.

[0037] The heat exchange device 130 is located outside the housing 110 and is capable of heat exchange. The heat exchange device 130 can cool the refrigerant (e.g., refrigerant that has absorbed heat from vapor) flowing into the condenser 140 via heat exchange. For example, the heat exchange device 130 can exchange heat with the refrigerant flowing into the housing 111 via a heat exchange medium 131. Specifically, the heat exchange device 130 can absorb heat from the refrigerant flowing into the condenser 140 via the first pipe 111 through the heat exchange medium 131 for cooling, and supply the cooled refrigerant to the condenser 140 via a second pipe 112. As another example, when the immersion cooling device 100 does not include a condenser 140, the heat exchange device 130 can exchange heat with the cooling fluid 10 flowing into the housing 110 via the first pipe 111. The heat exchange device 130 can then allow the cooled fluid 10, after heat exchange, to flow out into the housing 110 via the second pipe 112.

[0038] Multiple electronic circuit boards 120 may be disposed inside the housing 110. For example, multiple electronic circuit boards 120 may be disposed inside the housing 110 and immersed in cooling fluid 10. Specifically, the multiple electronic circuit boards 120 may be disposed inside the housing 110 at a predetermined angle (or mounting angle) to the lower surface (or bottom surface) of the housing 110 and spaced apart in a first direction (e.g., the X-axis direction or the Y-axis direction).

[0039] Each of the plurality of electronic circuit boards 120 (hereinafter referred to as each electronic circuit board) may include a plurality of electronic components (e.g., integrated circuit (IC) chips). Each electronic circuit board may include (e.g., mounted or set) on one side (e.g., between electronic components) a condenser (e.g., a coalescer) for restricting (e.g., condensing) the movement of a vapor bubble (e.g., a vapor bubble generated by nucleate boiling).

[0040] like Figure 2 As shown, each of the plurality of electronic circuit boards 120 may include a substrate 121, a plurality of electronic components 122, and a condenser 123.

[0041] Multiple electronic components 122 may be disposed (or mounted) on the substrate 121. The substrate 121 may include a printed circuit board (PCB), a flexible printed circuit board (FPCB), etc.

[0042] Multiple electronic components 122 may be disposed on substrate 121. These components 122 may include a central processing unit (CPU), graphics processing unit (GPU), power supply module, memory (e.g., random access memory (RAM), read-only memory (ROM), etc.), storage medium (e.g., hard disk, solid-state drive (SSD), etc.), and communication module, etc., for constituting a system (e.g., a server). The multiple electronic components 122 generate heat during system operation, which can be cooled by cooling fluid 10. The degree of heat generation by the multiple electronic components 122 may vary depending on their performance. For example, higher integration and processing speed of the multiple electronic components 122 may result in more heat generation (e.g., increased vapor bubble formation rate and / or size).

[0043] The condensation portion 123 may be located (or disposed) among a plurality of electronic components 122. For example, the condensation portion 123 may be located at the upper end of at least one electronic component that overlaps with other substrates in a second direction (e.g., the Z-axis direction) (hereinafter referred to as the vertical direction). Furthermore, the condensation portion 123 may condense at least one vapor bubble generated by the heat of the electronic component located at the lower end and rising towards the upper end of the housing 110. The condensation portion 123 may be integrally formed with the substrate 121, or it may be formed separately and then attached or fastened to the substrate 121.

[0044] According to one embodiment, the condenser 123 can restrict the movement or flow of vapor bubbles 21 generated by heat from the electronic component 122. In other words, as Figure 3 As shown, the condensation section 123 prevents vapor bubbles 21 generated on the first substrate 121-1 of the plurality of substrates 121 from adhering to the second substrate 121-2. Specifically, when the first electronic component 122-1 of the first substrate 121-1 generates heat, at least one vapor bubble (hereinafter referred to as a first vapor bubble) 21 can be generated on the surface of the first electronic component 122-1 (or on the surface of a heat sink covering the surface of the first electronic component 122-1 for heat dissipation) through the phenomenon of nucleate boiling. The generated first vapor bubble 21 can rise (or float) vertically by buoyancy (e.g., the buoyancy of the first vapor bubble 21 and the flow of cooling fluid 10). The first vapor bubble 21 rising vertically can adhere to the condensation section 123 (e.g., located on the movement path) that blocks the movement path (or rising path) of the first vapor bubble 21. The first vapor bubble 21 can condense on the condensation section 123 until it reaches a certain size. In other words, the condenser 123 can intercept the first vapor bubble 21 rising upwards along the upward path toward the adjacent substrate in the vertical direction. The condenser 123 can condense the first vapor bubble 21 into a condensed vapor bubble (hereinafter referred to as the second vapor bubble) 22. When the second vapor bubble 22 reaches a certain size (or a predetermined critical value) (e.g., the critical buoyancy at which the second vapor bubble separates), it can separate from the condenser 123, thereby preventing the first vapor bubble 21 from adhering to the adjacent substrate. The "critical buoyancy" can refer to the critical value at which the buoyant force of the second vapor bubble 22 exceeds the critical value of the adhesive force between the second vapor bubble 22 and the condenser 123.

[0045] According to one embodiment, the condensation section 123 may include a base 123-1 bonded (e.g., fixed) to a substrate 121 and a condensation plate 123-2 for the attachment and condensation of the first vapor bubbles 21. The condensation plate 123-2 may be fastened (e.g., fixed) to the base 123-1 at a specified angle (or condensation plate angle). The specified angle may be determined (e.g., optimized) taking into account the spacing of the substrates 121 (hereinafter referred to as substrate spacing) and / or the tilt angle of the substrates 121, so that the first vapor bubbles 21 rising vertically can adhere well. The specified angle may be further determined taking into account the amount (e.g., generation rate), size (e.g., average size), and movement speed (or movement speed of the cooling fluid 10) of the first vapor bubbles 21. For example, as... Figure 3 As shown, the specified angle can be the angle at which the condensation plate 123-2 and the bottom surface of the shell 110 remain horizontal.

[0046] According to some embodiments, such as Figure 2 As shown, the condensation section 123 may further include an angle adjustment section (e.g., a hinge) 123-3 capable of adjusting the angle between the base 123-1 and the condensation plate 123-2. The angle adjustment section 123-3 can appropriately adjust the angle between the base 123-1 and the condensation plate 123-2 according to the control of the immersion cooling device 100 (or the user). The angle between the base 123-1 and the condensation plate 123-2 can be adjusted based on the amount, size, and moving speed of the first vapor bubble 21 (or the moving speed of the cooling fluid 10), the tilt angle of the substrate 121, and / or the substrate spacing, etc.

[0047] According to one embodiment, the angle between the base 123-1 and the condensation plate 123-2 can be automatically adjusted by an immersion cooling device 100 (e.g., a drive module (e.g., a motor (not shown) that controls the rotation of the angle adjustment unit 123-3). For example, the immersion cooling device 100 can use a temperature sensor to confirm the temperature or temperature distribution of electronic components contained in the substrate 121, and control the angle between the base 123-1 and the condensation plate 123-2 according to the confirmed temperature or temperature distribution. The immersion cooling device 100 extracts the angle corresponding to the confirmed temperature or temperature distribution from a mapping table that matches temperature (or temperature distribution) with angle, and adjusts the angle between the base 123-1 and the condensation plate 123-2 to the extracted angle. According to some embodiments, the immersion cooling device 100 can use an artificial intelligence (AI) model to predict the angle. The AI ​​model may include, but is not limited to, a regression model that uses learning data to learn the correlation between input variables (e.g., temperature (or temperature distribution)) and output variables (e.g., angle). The artificial intelligence model may also consider learning at least one of the following as input variables: the amount, size, and moving speed of the first vapor bubble 21 (or the moving speed of the cooling fluid 10), the tilt angle of the substrate 121, and the substrate spacing.

[0048] According to some embodiments, the angle between the base 123-1 and the condensation plate 123-2 can be manually adjusted by the user.

[0049] On the other hand, such as Figure 3 As shown, the second vapor bubble 22, condensed into the specified size, can detach from the condensation section 123 and rise again in the vertical direction. During this process of rising again in the vertical direction, even if the second vapor bubble 22 comes into contact with the second substrate 121-2 (e.g., the back side of the second substrate 121-2), it will not adhere to the second substrate 121-2. This is because the buoyancy of the second vapor bubble 22 (= buoyancy + the moving speed of the cooling fluid 10 (or the drag force generated by the flow of the cooling fluid 10)) is greater than the adhesion force that the second vapor bubble 22 seeks to attach to the second substrate 121-2 (e.g., the adhesion force between the second vapor bubble 22 and the second substrate 121-2).

[0050] On the other hand, when the tilt angle between the first substrate 121-1 and the second substrate 121-2 reaches a certain size or above (for example, when the substrate 121 gradually approaches the horizontal state from the vertical state), the second vapor bubble 22 may not be able to be discharged from the space between the first substrate 121-1 and the second substrate 121-2, but instead adhere to the second substrate 121-2 or remain in the space between the first substrate 121-1 and the second substrate 121-2.

[0051] The tilt angle (θ) of the first substrate 121-1 and the second substrate 121-2, which allow the second vapor bubble 22 to rise smoothly to the upper space of the housing 110 (e.g., the position of the condenser 140), can be determined (calculated) by the following <Equation 1> and <Equation 2>.

[0052] L1sin θ < D ……………… <Formula 1>

[0053] L2tan θ < h ………………… <Formula 2>

[0054] In Equations 1 and 2 above, "L1" refers to the length of the substrate 121 (e.g., vertical (Z-axis) length), "D" refers to the substrate spacing, "L2" refers to the horizontal length of the condensation section 123 (e.g., the horizontal length from the surface of the substrate 121 on which the base 123-1 is mounted to the end of the condensation plate 123-2), and "h" refers to the height of the condensation section 123 (e.g., the height from the bottom of the substrate 121 to the condensation section 123).

[0055] According to one embodiment, the condensation section 123 (e.g., condensation plate 123-2) may have a structure capable of smoothly condensing the first vapor bubble 21 to a specified size (e.g., when the second vapor bubble 22 reaches critical buoyancy). According to one embodiment, the condensation plate 123-2 may be formed as a vane structure with a regular or irregular pattern. For example, as... Figure 4 As shown, the condensation plate 123-2 of the condensation section 123 can be formed as a blade structure with a ladder pattern 410, a grid pattern 420, a comb pattern 430, or a wave pattern 440. As another example, the condensation plate 123-2 can be formed as a blade structure with a flexible wire pattern. The size of the second vapor bubble 22 (or the rising speed of the second vapor bubble 22) can be adjusted according to the size of the blade structure (e.g., the spacing). According to some embodiments, the condensation plate 123-2 can be formed as a solid plate 450.

[0056] On the other hand, in the above Figure 2 and Figure 3Although it is shown and described that each substrate 121 includes one cohesive portion 123, each substrate 121 may include multiple cohesive portions 123. On the other hand, some of the multiple substrates 121 may not include a cohesive portion 123. For example, assuming that the multiple substrates 121 are arranged along a transverse direction (e.g., the X-axis direction), and the substrates 121 are tilted to the right, the leftmost substrate (e.g., the leftmost substrate) may not include a cohesive portion 123. Figure 3 The second substrate 121-2 may not include the condensation section 123.

[0057] The aforementioned immersion cooling device 100 has a condensation section for the condensed vapor along the movement path of the cooling fluid (vapor) that has absorbed heat from the electronic components. This prevents vapor from adhering to adjacent substrates located along the vapor's movement path (e.g., overlapping). The immersion cooling device 100 eliminates temperature imbalances between electronic components during immersion cooling, improving reliability and cooling efficiency. Furthermore, by effectively removing heat from the electronic components, the immersion cooling device 100 improves their lifespan. This improved lifespan reduces maintenance frequency (or increases maintenance cycles) and / or reduces maintenance costs.

[0058] On the other hand, such as Figure 2 As shown, each substrate 121 may further include a blocking structure 124 (e.g., baffle, rib, wall, etc.) that blocks (or restricts) the movement or flow of the cooling fluid 10 between multiple electronic components 122. The condensation portion 123 is capable of intercepting the first vapor bubbles 21 generated by the multiple electronic components 122. On the other hand, the blocking structure 124 can suppress convective transfer caused by the heated cooling fluid 10 between vertically aligned electronic components 122 on the same substrate 121. The blocking structure 124 may be located between electronic components that overlap in the upward path of the cooling fluid 10 among the multiple electronic components 122 disposed on the substrate 121. The blocking structure 124 can prevent the cooling fluid 10, which has absorbed heat from the electronic components located in the lower part of the upward path of the cooling fluid 10, from moving to the electronic components located in the upper part, thus preventing a decrease in the cooling efficiency of the electronic components located in the upper part.

[0059] Figure 5 This is a diagram illustrating an example of a condenser section according to an embodiment of the present disclosure.

[0060] Reference Figure 5 According to an embodiment of the present disclosure, the condensing part 123 may include a base 123-1, a condensing plate 123-2, an angle adjustment part 123-3, an elastomer 123-4, and a limiting member (or rotation limiting part) 123-5.

[0061] Detailed descriptions of the base 123-1, the condensation plate 123-2, and the angle adjustment part 123-3 have been provided in reference to... Figures 1 to 4 The description has already been provided, so it is omitted here.

[0062] The elastomer 123-4 can maintain the angle adjustment part (e.g., hinge) 123-3 in the default state (e.g., the base 123-1 and the condensation plate 123-2 are set at the default angle).

[0063] The stopper (e.g., a latch) 123-5 can limit the condensation plate 123-2 from rotating beyond a specified range. For example, the stopper 123-5 can limit the rotation range of the condensation plate 123-2 so that the condensation plate 123-2 does not collide with other substrates (or electronic components) when rotating by the buoyancy of the vapor bubbles 21, 22.

[0064] According to one embodiment, the condensation plate 123-2 of the condensation section 123 can rotate with reference to the rotation axis (e.g., hinge axis) of the angle adjustment section 123-3 by the buoyancy of the vapor bubbles condensed on the condensation plate 123-2. For example, when the condensation plate 123-2 is in its default state, vapor bubbles 21 are generated due to heat generated by the electronic components 122 contained in the substrate 121, as shown in the figure of identification code 510, the vapor bubbles 21 can rise and condense on the condensation plate 123-2. If the buoyancy of the vapor bubbles 21, 22 condensed on the condensation plate 123-2 exceeds the tension of the elastomer 123-4, then as shown in the figure of identification code 520, the condensation plate 123-2 can rotate upward with reference to the rotation axis of the angle adjustment section 123-3. If the condensed vapor bubbles 21, 22 detach from the condensation plate 123-2, the condensation plate 123-2 can return to its default state due to the tension of the elastomer 123-4.

[0065] According to some embodiments, the elastomer 123-4 may be replaceable. In this case, by replacing the elastomer 123-4 with an elastomer with a different tension, the degree of condensation (e.g., the amount of condensation) of the vapor bubbles 22 condensed on the condensation plate 123-2 can be adjusted.

[0066] The cooling efficiency of the immersion cooling apparatus according to an embodiment of this disclosure can be improved (e.g., increased). For example, it can prevent vapor bubbles of the cooling fluid that undergoes a phase change due to heat absorption from attaching to adjacent substrates, thus preventing a decrease in the heat dissipation performance of those substrates. In this case, no vapor bags or thin vapor films are formed between the substrate and the cooling fluid, and the heat transfer coefficient can be improved as the cooling fluid comes into direct contact with the substrate.

[0067] Furthermore, the immersion cooling device disclosed herein can prevent vapor adhesion from causing a decrease in the heat dissipation performance of certain areas of a specific substrate that generate vapor pockets or thin vapor films, thus preventing the formation of hot-spot areas. As described above, preventing the formation of hot-spot areas can eliminate temperature imbalances between substrates during immersion cooling and improve the reliability of immersion cooling. In addition, by improving the lifespan of electronic components, the frequency of maintenance (or the increase in maintenance cycles) and / or maintenance costs can be reduced.

[0068] The above description is merely an example of applying the principles of this disclosure, and other configurations may be further included without departing from the scope of the invention. For example, at least some of the various embodiments of this disclosure described above may be combined.

Claims

1. An immersion cooling device, comprising: The casing stores cooling fluid inside; Multiple electronic circuit boards are disposed inside the housing and immersed in the cooling fluid; as well as A heat exchange device exchanges heat with a cooling fluid that has absorbed the heat from the multiple electronic circuit boards. At least a portion of the plurality of electronic circuit boards includes: substrate; Multiple electronic components are disposed on the substrate; and At least one condensation section, located between the plurality of electronic components, is used to condense at least one vapor bubble generated by heat from the lower electronic component among the plurality of electronic components and rising towards the upper end of the housing. The upper end of the shell is vertical, and the vapor bubble is the first vapor bubble.

2. The immersion cooling device according to claim 1, wherein: The first vapor bubble condenses to a specific size through a corresponding condensation section. Vapor bubbles of a specific size detach from the corresponding condensation section and rise again in the vertical direction, forming a second vapor bubble.

3. The immersion cooling device according to claim 2, wherein: The second vapor bubble has buoyancy exceeding the adhesion between the second vapor bubble and the adjacent substrate in the vertical direction, and the second vapor bubble is not attached to the adjacent substrate.

4. The immersion cooling device according to claim 1, wherein: The multiple electronic circuit boards are tilted at an angle within a range determined by a specified formula.

5. The immersion cooling device according to claim 4, wherein: The tilt angle range is calculated based on the length of the substrate, the substrate spacing, the horizontal length of the condensation section, and the height of the condensation section.

6. The immersion cooling device according to claim 1, wherein, Each cohesion department includes: Base, attached to the substrate; and A condensation plate, fastened to the base at a specified angle, is used to condense the first vapor bubbles.

7. The immersion cooling apparatus according to claim 6, wherein: The specified angle is determined by taking into account at least one of the substrate tilt, substrate spacing, and the amount, size, and moving speed of the first vapor bubble.

8. The immersion cooling apparatus according to claim 6, wherein: The condensation plate is formed into a blade structure with regular or irregular patterns.

9. The immersion cooling device according to claim 6, wherein: The condensation plate includes a solid plate.

10. The immersion cooling apparatus according to claim 6, wherein, Each of the aforementioned condensation units also includes: An angle adjustment unit adjusts the angle between the base and the condensation plate.

11. The immersion cooling apparatus according to claim 10, wherein, Each of the aforementioned condensation units also includes: The elastomer maintains the angle adjustment part in its default state; and A limiting component restricts the condensation plate from rotating beyond a specified range.

12. The immersion cooling apparatus according to claim 1, wherein: The at least one condensation section is located at the upper end of at least one electronic component that overlaps with other substrates in the vertical direction among the plurality of electronic components.

13. The immersion cooling device according to claim 1, wherein, The substrate further includes: A blocking structure that restricts the movement or flow of the cooling fluid between the plurality of electronic components.

14. An electronic circuit board, comprising: substrate; Multiple electronic components are disposed on the substrate; as well as At least one condensation section, located between the plurality of electronic components, is used to condense at least one vapor bubble generated by the heat of the lower electronic component among the plurality of electronic components during immersion cooling, the vapor bubble being a first vapor bubble.

15. The electronic circuit board according to claim 14, wherein, Each cohesion department includes: Base, attached to the substrate; and A condensing plate is fastened to the base at a specified angle and condenses the first vapor bubbles.

16. The electronic circuit board according to claim 15, wherein: The condensation plate is formed into a blade structure with regular or irregular patterns.

17. The electronic circuit board according to claim 15, wherein: The condensation plate includes a solid plate.

18. The electronic circuit board according to claim 15, wherein, Each of the aforementioned condensation units also includes: An angle adjustment unit adjusts the angle between the base and the condensation plate.

19. The electronic circuit board according to claim 18, wherein, Each of the aforementioned condensation units also includes: The elastomer maintains the angle adjustment part in its default state; and A limiting component restricts the condensation plate from rotating beyond a specified range.

20. The electronic circuit board according to claim 14, wherein, The substrate further includes: The blocking structure restricts the movement or flow of cooling fluid between the multiple electronic components.

Images