Control method and electronic device

Abstract

The application provides a control method and an electronic device, and relates to the technical field of intelligent control. The control method comprises the following steps: acquiring an operating parameter of the electronic device; the electronic device comprises at least two cooling modules, and the at least two cooling modules are respectively used for cooling different heat source assemblies; determining an operating state of the electronic device based on the operating parameter; acquiring temperature information of the heat source assemblies; determining control parameters of the cooling modules based on the operating state of the electronic device and the temperature information of the heat source assemblies; and driving the cooling modules based on the control parameters of the cooling modules. The operating state of the electronic device at least comprises a first operating state and a second operating state, and the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

Description

Technical Field

[0001] This application relates to the field of intelligent control technology, and in particular to a control method and electronic device. Background Technology

[0002] Electronic devices are typically equipped with cooling modules to dissipate heat from heat source components during operation. However, in related technologies, these cooling modules operate according to fixed strategies, which fail to effectively adapt to the heat dissipation requirements of electronic devices under different load scenarios. This can easily lead to wasted power consumption in low-load scenarios or insufficient heat dissipation in high-load scenarios, thus affecting the energy efficiency of electronic devices. Summary of the Invention

[0003] In view of this, this application provides a control method and an electronic device.

[0004] According to a first aspect of this application, a control method is provided, comprising: acquiring operating parameters of an electronic device; the electronic device including at least two cooling modules, the at least two cooling modules being used to cool different heat source components respectively; determining the operating state of the electronic device based on the operating parameters; acquiring temperature information of the heat source components; determining control parameters of each cooling module based on the operating state of the electronic device and the temperature information of the heat source components; driving each cooling module based on the control parameters of each cooling module; wherein the operating state of the electronic device includes at least a first operating state and a second operating state, and the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

[0005] According to a second aspect of this application, an electronic device is provided, comprising at least two cooling modules, each used to cool different heat source components; a memory for storing computer instructions; the computer instructions being loaded by a processor for: acquiring the operating state of the electronic device; determining the overall operating intensity of the cooling device based on the operating state; allocating the overall operating intensity to the at least two cooling modules based on the location of the cooling modules to determine the individual operating intensity of the cooling modules; and controlling the cooling modules to operate at the corresponding operating intensity.

[0006] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0007] The above and other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0008] Figure 1 An application scenario diagram of a control method and electronic device provided in the embodiments of this application;

[0009] Figure 2 One of the flowcharts for a control method provided in an embodiment of this application;

[0010] Figure 3 A second flowchart illustrating a control method provided in an embodiment of this application;

[0011] Figure 4 A flowchart of a control method provided in an embodiment of this application;

[0012] Figure 5 A flowchart of a control method provided in an embodiment of this application;

[0013] Figure 6 A flowchart of a control method provided in an embodiment of this application is shown in Figure 5.

[0014] Figure 7 This is a block diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0015] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of this application for ease of explanation. However, it will be apparent that one or more embodiments may be implemented without these specific details. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0016] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0017] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0018] When using expressions such as "at least one of A, B, and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0019] This application provides a control method and an electronic device.

[0020] The control method includes: acquiring operating parameters of the electronic device; the electronic device includes at least two cooling modules, each used to cool different heat source components; determining the operating state of the electronic device based on the operating parameters; acquiring temperature information of the heat source components; determining control parameters for each cooling module based on the operating state of the electronic device and the temperature information of the heat source components; and driving each cooling module based on the control parameters of each cooling module. The operating state of the electronic device includes at least a first operating state and a second operating state, wherein the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

[0021] By adopting the technical solution of this application, the operating parameters of the electronic device are acquired and the operating state is determined based on these parameters, enabling the identification of the current load scenario of the electronic device. Furthermore, by combining the temperature information of the heat source components, the control parameters of each cooling module are determined, allowing each cooling module to be adjusted specifically according to the actual heat dissipation needs of the electronic device under different operating states. Compared to the fixed-strategy operation of cooling modules in related technologies, this application achieves dynamic control based on operating state and temperature information. This reduces the power consumption output of the cooling module to avoid power waste when the electronic device is in a low-load first operating state, and enhances the heat dissipation capacity of the cooling module to ensure effective heat dissipation when the electronic device is in a high-load second operating state. This effectively adapts to the heat dissipation needs of the electronic device under different load scenarios, improving the energy efficiency of the electronic device.

[0022] Figure 1 This is an application scenario diagram of a control method and electronic device provided in an embodiment of this application.

[0023] like Figure 1 As shown, the application scenario according to the embodiments of this application may include a first terminal device 101, a second terminal device 102, a third terminal device 103, a network 104, and a server 105. The network 104 serves as a medium for providing a communication link between the first terminal device 101, the second terminal device 102, the third terminal device 103, and the server 105. The network 104 may include various connection types, such as wired or wireless communication links or fiber optic cables. For example, a user can use the first terminal device 101, the second terminal device 102, and the third terminal device 103 to interact with the server 105 through the network 104 to receive or send information, etc.

[0024] The first terminal device 101, the second terminal device 102, and the third terminal device 103 can be electronic devices such as smartphones, tablets, laptops, desktop computers, smart wearable devices, and in-vehicle terminals. Each terminal device is equipped with at least two cooling modules, each used to cool different heat source components to meet the heat dissipation requirements of the terminal device under different operating scenarios. The terminal device can determine its own operating status by acquiring operating parameters and adjust the control parameters of each cooling module based on the operating status and the temperature information of the heat source components, thereby achieving dynamic control of the cooling modules.

[0025] Server 105 can be a server that provides various services, such as a backend server that provides data processing and information interaction support for the first terminal device 101, the second terminal device 102, and the third terminal device 103. The server can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks, and basic cloud computing services such as big data and artificial intelligence.

[0026] It should be noted that the control method provided in the embodiments of this application can generally be executed by terminal devices 101-103. Accordingly, the control device provided in the embodiments of this application can generally be set in terminal devices 101-103. In some scenarios, the control method provided in the embodiments of this application can also be executed by server 105, and accordingly, the control device can also be set in server 105.

[0027] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included.

[0028] The following will be based on Figure 1 The control method described in this application will now be described in detail, based on the scenario described.

[0029] Figure 2 This is one of the flowcharts for a control method provided in an embodiment of this application.

[0030] like Figure 2 As shown, the control method may specifically include the following operations.

[0031] Operate S210 to obtain the operating parameters of the electronic device; the electronic device includes at least two cooling modules, each of which is used to cool different heat source components.

[0032] Operator S220 determines the operating status of the electronic device based on operating parameters.

[0033] Operate S230 to obtain temperature information of the heat source component.

[0034] Operator S240 determines the control parameters of each cooling module based on the operating status of the electronic equipment and the temperature information of the heat source components.

[0035] Operate S250 to drive each cooling module based on the control parameters of each cooling module.

[0036] The operating state of the electronic device includes at least a first operating state and a second operating state, and the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

[0037] In operation S210, the operating parameters of the electronic device refer to physical or logical quantities that can reflect the current operating status of the electronic device, and are used to characterize the load level, heat generation, and working status of the electronic device.

[0038] For example, the operating parameters of an electronic device may include, but are not limited to: hardware temperature parameters, system load parameters, parameter change rate, input device status parameters, etc.

[0039] Among them, hardware temperature parameters can be the real-time temperature of various heat source components; system load parameters can be processing resource utilization rate, storage resource occupancy rate, etc.; parameter change rate can be temperature change rate, load change rate, etc.; input device status parameters can be the input change amount of various interactive devices.

[0040] In this embodiment of the application, the electronic device includes at least two cooling modules, which are used to cool different heat source components.

[0041] A cooling module is a device that provides heat dissipation for internal components of electronic devices, thereby reducing the operating temperature of these components. For example, a cooling module may include, but is not limited to, one or more combinations of heat dissipation devices such as fans, liquid cooling systems, heat pipes, heat sinks, and thermoelectric coolers. Different cooling modules perform different heat dissipation tasks based on their installation location and functional positioning.

[0042] A heat source component refers to a part of an electronic device that generates heat during operation and is used to perform various functions of the electronic device. For example, a heat source component may include, but is not limited to, functional components that generate heat, such as processors, graphics processing units, memory, communication modules, display modules, and power supply modules.

[0043] In one implementation, operating parameters can be collected in real time through the sensor interface built into the electronic device, load-related parameters can be collected through the system interface, and the changing trends of each parameter can be calculated through an algorithm.

[0044] It should be noted that electronic devices can include computers, servers, mobile terminals, industrial control equipment, and other electronic devices with heat dissipation requirements. Different types of electronic devices may have different types and numbers of cooling modules. For example, mobile terminals may use heat pipes combined with heat sinks, while servers may use multiple fans combined with a liquid cooling system. At least two cooling modules can be differentiated in control based on their functional roles to achieve a balance between heat dissipation efficiency and energy consumption.

[0045] In operation S220, the operating status of the electronic device refers to the current working mode or load level of the electronic device, which is used to characterize the current working intensity and heat dissipation requirements of the electronic device.

[0046] The operating state of the electronic device includes at least a first operating state and a second operating state, and the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

[0047] The first operating state refers to the working state of an electronic device under low operating load, which can be understood as a state in which the electronic device has low resource utilization and low heat generation. For example, the first operating state may include idle state, standby state, low power consumption state, and other states with low operating load.

[0048] The second operating state refers to the working state of the electronic device under relatively high operating load, which can be understood as a state in which the resource utilization rate of the electronic device is relatively high and the heat generation is relatively large. For example, the second operating state may include a light load state, a medium load state, or other operating states with an operating load higher than the first operating state.

[0049] The main difference between the first and second operating states lies in the level of the operating load. In the first operating state, the heat dissipation requirements of the electronic equipment are lower, while in the second operating state, the heat dissipation requirements are relatively higher. Different cooling module control strategies are corresponding to the two operating states.

[0050] In one implementation, the collected operating parameters can be compared with a preset state judgment threshold. When the operating parameters meet the parameter range corresponding to the first operating state, it is determined that the electronic device is currently in the first operating state; when the operating parameters meet the parameter range corresponding to the second operating state, it is determined that the electronic device is currently in the second operating state.

[0051] In another implementation, multiple operating parameters can be combined to determine the status. By establishing a multi-dimensional status recognition model, the operating status of the electronic device can be determined based on the combination of various operating parameters, thereby improving the accuracy of status recognition.

[0052] It should be noted that the operating states of electronic devices can include many other types, such as heavy load state and full load state. Different operating states correspond to different operating load ranges and heat dissipation requirements. The embodiments of this application focus on the switching control between the first operating state and the second operating state to achieve dynamic matching between the power consumption and heat dissipation requirements of the cooling module.

[0053] In operation S240, the control parameters refer to the parameters used to control the working state of the cooling module and to adjust the heat dissipation capacity of the cooling module.

[0054] For example, the control parameters may include, but are not limited to, parameters that can affect the heat dissipation effect of the cooling module, such as the rotation speed, power, voltage, duty cycle, and cooling intensity of the cooling module.

[0055] In one implementation, the control parameter range for each cooling module can be determined based on the current operating state of the electronic device. Then, combined with the temperature information of each heat source component, the specific control parameter value for each cooling module can be determined within this range. For example, when the electronic device is in a first operating state, due to the low heat dissipation requirement, the control parameters of the cooling modules can be set to low values ​​or even zero. When the electronic device is in a second operating state, the control parameters of the cooling modules are set to corresponding values ​​based on the actual temperature of each heat source component to meet the heat dissipation requirements.

[0056] Optionally, when determining the control parameters of each cooling module, the functional positioning of the cooling module itself can also be considered. For example, for a cooling module that directly cools a specific heat source component, its control parameters are mainly determined based on the temperature information of the corresponding heat source component; for a cooling module that provides auxiliary heat dissipation for the entire electronic device, its control parameters can be determined by comprehensively considering the temperature information of multiple heat source components. In this way, the coordinated operation of each cooling module can be achieved, forming a complete heat dissipation cycle.

[0057] In operating the S250, driving the cooling module refers to sending a control signal to the cooling module so that it operates according to the control parameters, thereby adjusting the heat dissipation capacity of the cooling module.

[0058] In one feasible implementation, the control parameters can be converted into corresponding drive signals by the control circuit of the electronic device and output to each cooling module. For example, when the control parameter is a speed value, the control circuit can generate a corresponding pulse width modulation signal or voltage signal and send it to the drive interface of the cooling module to make the cooling module run at the target speed; when the control parameter is a power value, the control circuit can adjust the power supply parameters to make the cooling module work at the corresponding power level.

[0059] In another feasible implementation, the control parameters of each cooling module can be passed to the hardware driver layer by calling the driver interface through a software program. The hardware driver layer then performs the actual control of each cooling module. The software program can periodically update the control parameters of each cooling module, thereby achieving dynamic adjustment of the cooling modules.

[0060] Optionally, when driving each cooling module, a parallel driving method can be used, that is, sending control signals to multiple cooling modules simultaneously; or a sequential driving method can be used, that is, driving each cooling module in a certain order. The choice of driving method can be flexibly determined according to the heat dissipation requirements of the electronic equipment, the functional positioning of the cooling modules, and the hardware conditions of the control circuit.

[0061] By adopting the technical solution of this embodiment, dynamic control of the cooling module of electronic devices can be achieved, improving the heat dissipation efficiency and energy efficiency of electronic devices. By acquiring the operating parameters of the electronic device and determining the operating state based on the operating parameters, the current load scenario of the electronic device can be identified. Then, combined with the temperature information of the heat source components, the control parameters of each cooling module are determined, enabling each cooling module to be adjusted in a targeted manner according to the actual heat dissipation requirements of the electronic device under different operating states. This embodiment of the application realizes dynamic control based on operating state and temperature information, which can reduce the power consumption output of the cooling module to avoid power waste when the electronic device is in the first operating state of low load, and improve the heat dissipation capacity of the cooling module to ensure the heat dissipation effect when the electronic device is in the second operating state of higher load, thereby effectively adapting to the heat dissipation requirements of the electronic device under different load scenarios.

[0062] In addition, since the electronic device includes at least two cooling modules for cooling different heat source components, by determining the control parameters of each cooling module, differentiated heat dissipation control can be implemented for the heating of different heat source components, thereby improving the accuracy of heat dissipation and overall energy efficiency.

[0063] Figure 3 This is a second flowchart of a control method provided in an embodiment of this application.

[0064] Based on the above embodiments, as an optional embodiment, the above operation S240 may further include the following operations.

[0065] Operator S310 determines the target power consumption of at least two cooling modules based on the operating status of the electronic device.

[0066] The S320 is operated to determine the allocated power consumption of each cooling module based on the temperature information of the heat source component and the target power consumption.

[0067] Operate S330 to generate control parameters based on the allocated power consumption of each cooling module.

[0068] In operation S310, target power consumption refers to the expected total power consumption of at least two cooling modules under a specific operating state, which is used to limit the overall energy consumption level of the cooling modules.

[0069] Different operating states correspond to different heat dissipation requirements, and therefore different target power consumption. When the electronic device is in the first operating state, the heat dissipation requirement is small due to the low operating load, and the corresponding target power consumption can be set to a low value; when the electronic device is in the second operating state, the heat dissipation requirement is relatively large due to the relatively high operating load, and the corresponding target power consumption can be set to a relatively high value.

[0070] In one implementation, target power consumption thresholds can be pre-set for different operating states. Once the operating state of the electronic device is determined, the target power consumption threshold corresponding to that operating state is directly obtained as the current target power consumption.

[0071] It should be noted that the target power consumption setting can be adjusted according to the type of electronic device, heat dissipation requirements, and energy-saving requirements. Different types of electronic devices can be set with different target power consumption thresholds to suit their respective heat dissipation needs and energy consumption control goals.

[0072] In operation of S320, power allocation refers to the specific power consumption value allocated from the target power consumption to each cooling module, which is used to determine the actual operating power of each cooling module.

[0073] Since at least two cooling modules are used to cool different heat source components, and the temperatures of each heat source component may vary, it is necessary to allocate the target power consumption reasonably based on the temperature information of each heat source component. Cooling modules corresponding to heat source components with higher temperatures can be allocated higher power consumption, while cooling modules corresponding to heat source components with lower temperatures can be allocated lower power consumption.

[0074] In one implementation, the allocation ratio can be calculated based on the temperature information of each heat source component, and then the target power consumption can be allocated to each cooling module according to the allocation ratio. For example, the proportion of heat dissipation that each cooling module should bear can be calculated based on the difference between the current temperature of each heat source component and its reference temperature, thereby determining the allocated power consumption of each cooling module.

[0075] Optionally, when determining the allocated power consumption of each cooling module, it can be ensured that the sum of the allocated power consumption of each cooling module does not exceed the target power consumption, so as to meet the overall energy consumption control requirements.

[0076] In operating S330, generating control parameters refers to converting the allocated power consumption of each cooling module into corresponding control parameters, which are used to actually drive the cooling modules to work.

[0077] Optionally, there is a correspondence between the allocated power consumption and the control parameters. Different allocated power consumptions correspond to different control parameter values, and by adjusting the control parameters, the cooling module can operate at the corresponding power consumption level.

[0078] In one implementation, the allocated power consumption can be converted into corresponding control parameters based on the power consumption characteristic curve of the cooling module. For example, when the cooling module is a fan, the allocated power consumption can be converted into the corresponding target speed according to the fan's power-speed characteristic curve; when the cooling module is other types of heat dissipation devices, the allocated power consumption can be converted into corresponding control parameters according to the corresponding power consumption characteristic relationship.

[0079] In another implementation, control parameters can be generated by looking up a table. A table mapping the allocated power consumption to the control parameters is pre-established, and the corresponding control parameter value is looked up in the table based on the allocated power consumption of each cooling module.

[0080] By adopting the technical solution of this embodiment, power consumption allocation control based on operating status and temperature information can be achieved. By determining the target power consumption corresponding to the operating status, a reasonable control target can be set for the overall energy consumption of the cooling module. Then, based on the temperature information and target power consumption of each heat source component, the allocated power consumption of each cooling module is determined, so that each cooling module can obtain a reasonable power consumption allocation according to the actual heating situation of the corresponding heat source component, avoiding insufficient heat dissipation or power waste caused by uneven power consumption allocation.

[0081] Based on the above embodiments, as an optional embodiment, the above operation S320 may further include the following operations.

[0082] Operation S321 responds to the electronic device's operating state switching from the first operating state to the second operating state, and determines the allocation weight of the corresponding cooling module based on the importance of each heat source component in the electronic device and temperature information.

[0083] Operation S322 determines the allocated power consumption of each cooling module based on the allocation weight of each cooling module and the target power consumption.

[0084] In operation S321, the allocation weight refers to a value used to characterize the proportion of each cooling module in the power consumption allocation, and is used to determine the power consumption share that each cooling module should receive.

[0085] The importance of heat source components in electronic devices refers to their impact on the overall performance and stability of the electronic device, and is used to characterize the priority of the heat dissipation requirements for those components. Cooling modules for heat source components with higher importance should receive higher allocation weights, while cooling modules for heat source components with lower importance can receive lower allocation weights.

[0086] For example, the processor, as the core computing component of an electronic device, is usually more important than other heat source components; the graphics processing unit, as the graphics computing component, is usually second only to the processor in importance; the importance of other heat source components can be set according to their functional positioning in the electronic device.

[0087] In one implementation, a base weight value can be pre-set for each heat source component, reflecting the importance of each component. Heat source components with higher importance correspond to larger base weight values, while those with lower importance correspond to smaller base weight values. When determining the assigned weights, the base weight values ​​can be used as initial weights, and then adjusted based on the temperature information of each heat source component.

[0088] In another implementation, the allocation weights can be determined using a weighting formula based on the temperature information and baseline weight values ​​of each heat source component. For example, the baseline weight values ​​can be dynamically adjusted based on the difference between the current temperature of the heat source component and the reference temperature; the greater the temperature deviation from the reference temperature, the higher the corresponding allocation weight. This approach comprehensively considers both the importance of the heat source components and their actual heat generation, resulting in a more reasonable weight allocation.

[0089] Optionally, when determining the allocation weights, the allocation weights of each cooling module can be normalized so that the sum of the allocation weights of all cooling modules is a preset value. This normalization ensures that when calculating the allocated power consumption based on the allocation weights, the sum of the allocated power consumption of each cooling module matches the target power consumption.

[0090] It should be noted that when the operating state of an electronic device switches from the first operating state to the second operating state, the heat generation of each heat source component changes. At this time, it is necessary to redetermine the allocation weights of each cooling module to adapt to the new heat dissipation requirements. In the first operating state, the heat generation of each heat source component is relatively small, while in the second operating state, the heat generation of each heat source component is relatively large. By recalculating the allocation weights in response to the state switch, the power consumption distribution of the cooling modules can be adapted to the changes in the heat dissipation requirements of the electronic device in a timely manner.

[0091] In operation S322, the target power consumption can be proportionally allocated according to the allocation weights of each cooling module. Specifically, the allocation weight of each cooling module can be multiplied by the target power consumption to obtain the allocated power consumption of each cooling module. When the allocation weights have been normalized, the sum of the allocated power consumptions of each cooling module calculated in this way equals the target power consumption.

[0092] Optionally, after determining the allocated power consumption, the allocated power consumption of each cooling module can be verified to determine whether the allocated power consumption is within the operating power range of each cooling module. If the allocated power consumption of a certain cooling module exceeds its maximum operating power, the allocated power consumption of that cooling module can be limited to its maximum operating power, and the excess power consumption can be redistributed to other cooling modules.

[0093] By adopting the technical solution of this embodiment, differentiated power consumption allocation based on the importance and temperature information of heat source components can be achieved. When switching from a first operating state to a second operating state, the allocation weight is determined by comprehensively considering the importance and temperature information of each heat source component. This allows cooling modules corresponding to heat source components with higher importance and higher temperatures to receive higher power consumption allocations, while cooling modules corresponding to heat source components with lower importance or lower temperatures receive relatively lower power consumption allocations, thus achieving precise and differentiated power consumption allocation.

[0094] Figure 4 This is the third flowchart of a control method provided in an embodiment of this application.

[0095] Based on the above embodiments, as an optional embodiment, at least two cooling modules include a front cooling module and a rear cooling module; the front cooling module is used to provide air intake for the electronic device, and the rear cooling module is used to provide air exhaust for the electronic device.

[0096] Based on this, the above operation S320 may also include the following operations.

[0097] Operation S410 responds to the electronic device's operating state switching from a first operating state to a second operating state, and determines the average temperature of the heat source components based on the temperature information of each heat source component.

[0098] Operator S420 determines the first allocated power consumption of the pre-cooling module based on the average temperature and target power consumption.

[0099] Operation S430 determines the second allocated power consumption of the post-cooling module based on the temperature information and target power consumption of each heat source component. The second allocated power consumption is positively correlated with the temperature information of the heat source component.

[0100] The front-end cooling module is installed at the air intake of the electronic device to introduce external air into the device, providing cooling airflow for the entire device. The rear-end cooling module is installed at the air exhaust of the electronic device to expel hot air from the device, creating a heat dissipation cycle.

[0101] The pre-cooling module and the post-cooling module have different functional roles in the heat dissipation system. The pre-cooling module mainly provides overall cooling support for the various heat source components inside the electronic device, and its workload is related to the overall heat dissipation requirements of the electronic device; the post-cooling module is mainly responsible for timely dissipation of heat dissipation components, and its workload is directly related to the actual heat generation intensity of each heat source component.

[0102] In operation S410, when the operating state of the electronic device switches from the first operating state to the second operating state, the temperature of each heat source component will change. By calculating the average temperature, the change in the overall heat dissipation requirements of the electronic device can be obtained.

[0103] In operation S420, the first allocated power consumption refers to the power consumption value allocated to the pre-cooling module, which is used to control the working intensity of the pre-cooling module.

[0104] Since the pre-cooling module primarily provides overall airflow to the electronic device, its heat dissipation target is all heat-generating components inside the device. Therefore, its allocated power consumption is related to the overall thermal state of the electronic device. The average temperature reflects the overall thermal state of the electronic device; a higher average temperature indicates a greater overall heat dissipation demand, requiring the pre-cooling module to provide stronger airflow capacity, and consequently, a higher initial allocated power consumption.

[0105] In one implementation, the first allocated power consumption of the pre-cooling module can be determined based on the difference between the average temperature and the reference temperature.

[0106] Optionally, when determining the first allocated power consumption, the basic power consumption requirements of the pre-cooling module can also be considered to ensure that the first allocated power consumption can meet the requirements of the pre-cooling module to maintain basic air intake function.

[0107] In operation S430, the second power allocation refers to the power value allocated to the post-cooling module, which is used to control the working intensity of the post-cooling module.

[0108] Since the post-cooling module is primarily responsible for dissipating heat from the heat source components, its heat dissipation task is directly related to the actual heating intensity of each heat source component. Therefore, its allocated power consumption should be positively correlated with the temperature information of the heat source components. The higher the temperature of the heat source component, the more heat is dissipated, and the more powerful the post-cooling module needs to exhaust the heat in a timely manner, thus requiring a higher secondary allocated power consumption.

[0109] In one implementation, the second power consumption allocation can be determined based on the highest temperature in each heat source component.

[0110] In another implementation, the temperature information of each heat source component can be comprehensively considered to calculate the sum or weighted temperature value of the heat source components, and then the second power consumption allocation can be determined based on this value. The larger the sum or weighted temperature value, the more total heat needs to be dissipated, and the higher the corresponding second power consumption allocation, reflecting the positive correlation between the second power consumption allocation and temperature information.

[0111] It should be noted that the pre-cooling module and the post-cooling module work together to form a complete heat dissipation cycle. The pre-cooling module introduces cool air, while the post-cooling module exhausts hot air. A reasonable distribution of power consumption between the two improves the efficiency of the heat dissipation cycle. By determining the power consumption of the pre-cooling module based on the average temperature and the power consumption of the post-cooling module based on the temperature information of each heat source component, differentiated control can be achieved. This allows the pre-cooling module to adapt to the overall heat dissipation requirements of the electronic device, while the post-cooling module adapts to the specific heat dissipation requirements.

[0112] By adopting the technical solution of this embodiment, differentiated power consumption allocation control between the pre-cooling module and the post-cooling module can be achieved. By determining the average temperature based on the temperature information of each heat source component when the operating state switches from the first operating state to the second operating state, the overall thermal state of the electronic device can be obtained. Then, based on the average temperature and target power consumption, the first allocated power consumption of the pre-cooling module is determined, ensuring that the power consumption allocation of the pre-cooling module matches the overall heat dissipation requirements of the electronic device and provides appropriate airflow support. Simultaneously, based on the temperature information of each heat source component and the target power consumption, the second allocated power consumption of the post-cooling module is determined, and the second allocated power consumption is positively correlated with the temperature information, ensuring that the power consumption allocation of the post-cooling module matches the actual heat dissipation requirements and can promptly dissipate the heat emitted by the heat source components.

[0113] Figure 5 The fourth flowchart is a control method provided in the embodiments of this application.

[0114] Based on the above embodiments, as an optional embodiment, the above operation S250 may further include the following operations.

[0115] Operation S510, in response to the change of the operating state from the first operating state to the second operating state, determines the start-up sequence of each cooling module based on the importance of each heat source component in the electronic device.

[0116] Operation S520 drives each cooling module at different times according to the startup sequence; wherein, the startup time of the cooling module used to cool the first heat source component is earlier than the startup time of the cooling module used to cool the second heat source component, and the first heat source component is more important than the second heat source component in the electronic device.

[0117] In the S510 operation, the startup sequence refers to the order in which each cooling module starts working, which is used to specify the startup timing relationship of each cooling module.

[0118] When an electronic device switches from a first operating state to a second operating state, the heat generation of various heat source components changes, requiring the activation of cooling modules to dissipate heat. Different heat source components have varying degrees of importance within the electronic device; those with higher importance are more sensitive to temperature and require priority for heat dissipation. Therefore, the activation order of the corresponding cooling modules can be determined based on the importance of each heat source component, ensuring that cooling modules serving higher-importance heat source components are activated first.

[0119] In one implementation, an importance level can be pre-set for each heat source component. The cooling module corresponding to the heat source component with a higher importance level is placed at the beginning of the startup sequence, while the cooling module corresponding to the heat source component with a lower importance level is placed at the end of the startup sequence.

[0120] In another implementation, the startup order can be dynamically determined based on the functional positioning and performance impact of each heat source component in the electronic device. For heat source components undertaking core computing tasks, their corresponding cooling modules can be set to start first; for heat source components undertaking auxiliary functions, their corresponding cooling modules can be set to start later.

[0121] It should be noted that determining the startup sequence considers not only the importance of each heat source component, but also the coordination between cooling modules. For example, when an electronic device includes a pre-cooling module and a post-cooling module, the dedicated cooling module serving the important heat source components can be started first, followed by the pre-cooling module and the post-cooling module, to form a complete heat dissipation cycle.

[0122] In operating the S520, each cooling module is driven at different times, realizing time-sharing start control of the cooling modules.

[0123] In one implementation, a start-up time interval can be set for each cooling module, and each cooling module can be driven sequentially according to the start-up order.

[0124] In another implementation, different start-up time intervals can be set according to the priority differences of each cooling module. For cooling modules with similar priorities, a shorter start-up time interval can be set to ensure they start up almost synchronously; for cooling modules with significantly different priorities, a longer start-up time interval can be set to clearly distinguish their start-up times.

[0125] Optionally, when driving each cooling module in the startup sequence, a gradual startup method can be adopted to gradually increase the operating parameters of each cooling module to the target value, so as to avoid the impact of parameter changes on electronic equipment during the startup process.

[0126] It should be noted that the cooling module used to cool the first heat source component starts up earlier than the cooling module used to cool the second heat source component. This startup sequence ensures that the more critical heat source component receives priority cooling support. The first heat source component is more important than the second heat source component in the electronic device; therefore, its corresponding cooling module needs to start up earlier to prevent the first heat source component from affecting the performance and stability of the electronic device due to untimely cooling.

[0127] By adopting the technical solution of this embodiment, time-sharing start-up control of cooling modules based on the importance of heat source components can be achieved. When the operating state switches from a first operating state to a second operating state, the start-up order of each cooling module is determined based on the importance of each heat source component in the electronic device. This ensures that cooling modules serving more important heat source components start up first, while those serving less important heat source components start up later, achieving a match between the start-up order and heat dissipation priority. Furthermore, each cooling module is driven at different times according to the start-up order, resulting in an orderly timing relationship for the start-up of the cooling modules and avoiding the current surge and control complexity that could result from all cooling modules starting simultaneously.

[0128] Figure 6 The fifth flowchart is a control method provided in the embodiments of this application.

[0129] Based on the above embodiments, as an optional embodiment, the above operation S220 may further include the following operations.

[0130] Operator S610 determines the current operating status of the electronic device based on operating parameters.

[0131] Operate S620 to obtain historical operating parameters, which are the operating parameters of the electronic device during the first time period.

[0132] Operate S630 to determine the trend of operating parameters based on historical operating parameters.

[0133] Operator S640 determines the operating status of the electronic device in the second time period based on the changing trend and the current operating status; the second time period is after the first time period.

[0134] In operation S610, the current operating state refers to the operating state of the electronic device at the current moment, which is used to characterize the current load of the electronic device.

[0135] In one implementation, the currently collected operating parameters can be compared with a preset state judgment threshold, and the current operating state can be determined based on the parameter range in which the operating parameters fall. For example, when the operating parameters are below a first threshold, the current operating state is determined to be the first operating state; when the operating parameters are between the first threshold and a second threshold, the current operating state is determined to be the second operating state.

[0136] In operation S620, historical operating parameters refer to the operating parameters of electronic devices in the past period, which are used to reflect the operating status of electronic devices in the historical period.

[0137] The first time period refers to a time interval preceding the current moment, used to define the scope of historical operating parameter collection. For example, the first time period can be a preset duration preceding the current moment, which can be set according to the operating characteristics of the electronic device and predicted needs.

[0138] In one implementation, operating parameters for a first time period can be extracted from the electronic device's operating logs or cached data as historical operating parameters. These historical operating parameters may include sampled values ​​of operating parameters from multiple moments within the first time period.

[0139] In operation S630, the trend of change refers to the law of change of operating parameters over time, which is used to characterize the development direction and rate of change of operating parameters.

[0140] Trends can indicate whether operating parameters are rising, falling, or remaining stable, as well as the rate of change. By analyzing historical trends in operating parameters, we can predict their possible future trajectory.

[0141] In one implementation, historical operating parameters can be fitted with a trend to obtain the changing trend of the operating parameters. Specifically, linear fitting, polynomial fitting, or other fitting methods can be used to fit multiple sampled values ​​of operating parameters within a first time period to obtain a fitting curve or fitting function characterizing the changing trend. The slope or derivative of the fitting curve can reflect the rate and direction of change of the operating parameters.

[0142] Optionally, when determining the trend of change, the historical operating parameters can be filtered to remove noise interference from the operating parameters, making the determined trend of change more accurate and reliable.

[0143] In operation S640, the operating status of the second period is determined based on the changing trend and the current operating status, thus realizing the prediction of the future operating status.

[0144] The second time period refers to a time interval following the current moment, used to define the time range of the prediction. The second time period follows the first time period, and its operational state represents a future operational state that has not yet occurred.

[0145] In one implementation, the values ​​of operating parameters in the second time period can be inferred based on the changing trend, and then the operating status of the second time period can be determined based on the inferred operating parameter values. Specifically, the fitting function or rate of change corresponding to the changing trend can be extended to the second time period to calculate the predicted values ​​of operating parameters in the second time period, and then the operating status of the second time period can be determined based on the parameter range in which the predicted values ​​fall.

[0146] In another implementation, the operating status of the second time period can be directly inferred by comprehensively considering the current operating status and the changing trend. For example, when the current operating status is the first operating status and the changing trend shows that the operating parameters are on an upward trend, it can be predicted that the operating status of the second time period may switch to the second operating status; when the current operating status is the second operating status and the changing trend shows that the operating parameters are on a downward trend, it can be predicted that the operating status of the second time period may switch to the first operating status.

[0147] Optionally, after determining the operating status of the second time period, control preparations for the cooling module can be made in advance based on the predicted operating status of the second time period. For example, if it is predicted that the operating status of the second time period will switch to a higher load state, the control parameters of the cooling module can be adjusted in advance so that the cooling module can provide heat dissipation support in a timely manner when the state changes.

[0148] It should be noted that by combining the current operating status with the changing trends of historical operating parameters to predict the future operating status, predictive control of the cooling module can be achieved, allowing the operating status of the cooling module to adapt to future heat dissipation needs in advance, and avoiding lag in heat dissipation response when switching states.

[0149] By adopting the technical solution of this embodiment, the current operating state of the electronic device can be determined based on operating parameters, thus enabling the understanding of the current load status of the electronic device. Furthermore, by acquiring the historical operating parameters of the electronic device within a first time period and determining the changing trends of these parameters, the changing patterns and development directions of the operating parameters can be obtained. Finally, based on the changing trends and the current operating state, the operating state of the electronic device in the second time period is determined. This embodiment, by predicting the operating state in the second time period, allows the cooling module to adjust its control parameters in advance before the actual switching of operating states, avoiding lag in heat dissipation response and improving the adaptability and response speed of the heat dissipation system to load changes.

[0150] Based on the above embodiments, as an optional embodiment, operation S250 may further include the following operations.

[0151] Operation S251, in response to the electronic device switching its operating state from the first operating state to the second operating state in the second time period, adjusts the control parameters of each cooling module from the first parameter value corresponding to the first operating state to the first transition parameter value; the first transition parameter value is greater than the first parameter value and less than the second parameter value corresponding to the second operating state;

[0152] Operation S252, in response to the electronic device switching its operating state from the second operating state to the first operating state in the second time period, adjusts the control parameters of each cooling module from the second parameter value to the second transition parameter value; the second transition parameter value is less than the second parameter value and greater than the first parameter value.

[0153] The first parameter value refers to the control parameter value of the cooling module in the first operating state, used to control the working intensity of the cooling module under low load conditions. The second parameter value refers to the control parameter value of the cooling module in the second operating state, used to control the working intensity of the cooling module under high load conditions. Since the heat dissipation demand in the second operating state is higher than that in the first operating state, the second parameter value is greater than the first parameter value.

[0154] In operation S251, the first transition parameter value refers to the intermediate parameter value during the process of switching the operating state from the first operating state to the second operating state, which is used to achieve a smooth transition of control parameters.

[0155] When it is predicted that the electronic device will switch from the first operating state to the second operating state in the second time period, it indicates that the load on the electronic device is about to increase and the heat dissipation demand is about to increase. At this time, instead of directly jumping from the first parameter value to the second parameter value, the control parameter is first adjusted to the first transition parameter value to achieve a gradual adjustment of the control parameter.

[0156] Optionally, the first transition parameter value is greater than the first parameter value and less than the second parameter value, falling within the range between the two. By adjusting the control parameter to the first transition parameter value, the cooling module can respond to load increases in advance, providing heat dissipation capabilities between the first and second operating states.

[0157] In one implementation, a first transition parameter value can be calculated based on a first parameter value and a second parameter value. Specifically, the first transition parameter value can be set to a value between the first parameter value and the second parameter value according to a preset transition ratio. For example, the first transition parameter value can be a weighted average of the first parameter value and the second parameter value, and the weight can be set according to the accuracy of the prediction or the rate of load increase.

[0158] In another implementation, the first transition parameter value can be determined based on the changing trend of the operating parameters. When the changing trend shows that the operating parameters are rising rapidly, the first transition parameter value can be set to a value closer to the second parameter value; when the changing trend shows that the operating parameters are rising slowly, the first transition parameter value can be set to a value closer to the first parameter value.

[0159] In operation S252, the second transition parameter value refers to the intermediate parameter value during the process of switching the operating state from the second operating state to the first operating state, which is used to achieve a smooth transition of control parameters.

[0160] When it is predicted that the electronic device will switch from the second operating state to the first operating state in the second time period, it indicates that the load on the electronic device is about to decrease and the heat dissipation requirement is about to decrease. At this time, instead of directly jumping the control parameter from the second parameter value to the first parameter value, the control parameter is first adjusted to the second transition parameter value to achieve a gradual adjustment of the control parameter.

[0161] Optionally, the second transition parameter value is less than the second parameter value but greater than the first parameter value, also falling within the range between the two. By adjusting the control parameter to the second transition parameter value, the cooling module can moderately reduce its workload, avoiding drastic changes in the control parameter.

[0162] In one implementation, a second transition parameter value can be calculated based on the first parameter value and the second parameter value. Specifically, the second transition parameter value can be set to a value between the two values ​​according to a preset transition ratio. The second transition parameter value can be the same as or different from the first transition parameter value, depending on the control requirements of different switching directions.

[0163] In another implementation, the second transition parameter value can be determined based on the temperature information of the heat source component. When the temperature of the heat source component is still high, the second transition parameter value can be set to a value closer to the first parameter value to maintain strong heat dissipation capacity; when the temperature of the heat source component has decreased, the second transition parameter value can be set to a value closer to the first parameter value to moderately reduce power consumption.

[0164] Optionally, after adjusting the control parameter to the second transitional parameter value, the subsequent parameter adjustment strategy can be determined based on the temperature change of the heat source component. When the temperature of the heat source component drops rapidly, the control parameter can be further adjusted from the second transitional parameter value to the first parameter value; when the temperature of the heat source component drops slowly, the second transitional parameter value can be maintained for a period of time before being adjusted to the first parameter value.

[0165] By adopting the technical solution of this embodiment, a smooth transition adjustment of the cooling module control parameters can be achieved. When it is predicted that the operating state of the electronic device will switch from the first operating state to the second operating state in the second period, the control parameters are first adjusted to the first transition parameter value, so that the cooling module responds to the load increase in advance, avoiding the lag in heat dissipation response. At the same time, the transition parameter value avoids abrupt changes in the control parameters, and a smooth increase in the control parameters is achieved.

[0166] When it is predicted that the operating state will switch from the second operating state to the first operating state, the cooling module will reduce its workload appropriately by first adjusting the control parameters to the second transition parameter value. This will reduce power consumption while ensuring heat dissipation requirements are met, and at the same time avoid a sharp drop in control parameters, thus achieving a smooth decline in control parameters.

[0167] Based on the above embodiments, as an optional embodiment, the above operation S220 may further include the following operations.

[0168] In response to the fact that the operating parameters meet the first preset condition and continue for a first preset duration, the current operating state of the electronic device is determined to be the first operating state;

[0169] In response to the fact that the operating parameters meet the second preset condition, the current operating state of the electronic device is determined to be the second operating state;

[0170] The operating parameters include at least one of the following: hardware temperature parameters, system load parameters, and parameter change rate; wherein the operating parameter threshold range corresponding to the first preset condition is smaller than the operating parameter threshold range corresponding to the second preset condition.

[0171] The first preset condition refers to the conditional constraint used to determine the first operating state, which defines the range of operating parameters corresponding to the first operating state. The second preset condition refers to the conditional constraint used to determine the second operating state, which defines the range of operating parameters corresponding to the second operating state.

[0172] If the threshold range of the operating parameters corresponding to the first preset condition is less than the threshold range of the operating parameters corresponding to the second preset condition, it indicates that the value of the operating parameters corresponding to the first operating state is lower, and the value of the operating parameters corresponding to the second operating state is higher. For example, the first preset condition can be that the operating parameter is lower than the first threshold, and the second preset condition can be that the operating parameter is higher than the second threshold, where the second threshold is greater than the first threshold.

[0173] When determining the first operating state, it is required that the operating parameters not only meet the first preset condition, but also that this condition last for a first preset duration. The first preset duration refers to the length of time that the operating parameters need to continuously meet the first preset condition, in order to avoid misjudgment of the state caused by short-term fluctuations in the operating parameters.

[0174] For example, the first preset duration can be from several seconds to tens of seconds, and the specific duration can be set according to the operating characteristics of the electronic device. By setting the first preset duration, instantaneous drops in operating parameters can be filtered out, ensuring that the first operating state is only determined when the operating parameters remain at a low level.

[0175] In one implementation, timing can be started when the operating parameters are detected to meet a first preset condition. During the timing process, the operating parameters are continuously monitored. If the operating parameters continue to meet the first preset condition until the timing reaches a first preset duration, the current operating state of the electronic device is determined to be the first operating state. If the operating parameters no longer meet the first preset condition during the timing process, the timing is reset, and the judgment process restarts.

[0176] It should be noted that when determining the second operating state, it is not required that the operating parameters continuously meet the second preset condition for a preset duration. Rather, the second operating state is determined as soon as the operating parameters meet the second preset condition. The difference in this determination method is that the second operating state corresponds to a high-load state, requiring the cooling module to respond promptly to provide heat dissipation. Therefore, the determination condition is relatively lenient, allowing for rapid state switching. In contrast, the first operating state corresponds to a low-load state, and a duration requirement is set to avoid frequent state switching.

[0177] Hardware temperature parameters refer to parameters that reflect the temperature of the hardware components of electronic devices and are used to characterize the thermal state of the electronic devices. Hardware temperature parameters can include the temperature values ​​of individual heat source components, average temperature values, or maximum temperature values. Lower hardware temperature parameters indicate that the electronic device is under low load; higher hardware temperature parameters indicate that the electronic device is under high load.

[0178] In one implementation, the average temperature of each heat source component can be used as a hardware temperature parameter. When the average temperature is lower than a first temperature threshold and remains below it for a first preset duration, it is determined to be in a first operating state; when the average temperature is higher than a second temperature threshold, it is determined to be in a second operating state, wherein the second temperature threshold is greater than the first temperature threshold.

[0179] System load parameters refer to parameters that reflect the resource utilization of electronic devices and are used to characterize the workload of electronic devices. System load parameters can include processor utilization, memory utilization, graphics processing unit utilization, etc.

[0180] In one implementation, processor utilization can be used as a system load parameter. When the processor utilization is lower than a first utilization threshold and remains below it for a first preset duration, it is determined to be in a first operating state; when the processor utilization is higher than a second utilization threshold, it is determined to be in a second operating state, wherein the second utilization threshold is greater than the first utilization threshold.

[0181] The parameter change rate refers to the rate at which operating parameters change over time, and is used to characterize how quickly the load on electronic equipment changes. The parameter change rate can be the rate of change of hardware temperature parameters or the rate of change of system load parameters.

[0182] In one implementation, the change of the operating parameter per unit time can be calculated as the parameter change rate. When the absolute value of the parameter change rate is lower than a first change rate threshold and remains below it for a first preset duration, the operating parameter can be determined to be in a stable low-change state, and this is combined with the numerical value of the operating parameter to determine the first operating state. When the parameter change rate is higher than a second change rate threshold, it indicates that the operating parameter is rising rapidly, and this can be determined to be the second operating state.

[0183] Optionally, when determining the current operating state of an electronic device, multiple operating parameters can be considered comprehensively. For example, hardware temperature parameters and system load parameters can be detected simultaneously. When both meet a first preset condition and remain so for a first preset duration, the device is determined to be in a first operating state; when either meets a second preset condition, the device is determined to be in a second operating state. By comprehensively considering multiple operating parameters, the accuracy of operating state determination can be improved.

[0184] By adopting the technical solution of this embodiment, accurate determination of operating status based on operating parameters can be achieved. By requiring operating parameters to meet a first preset condition and remain at that condition for a first preset duration before determining the first operating state, misjudgments caused by short-term fluctuations in operating parameters can be avoided, ensuring the stability of the first operating state determination. By determining the second operating state as soon as operating parameters meet a second preset condition, the cooling module can quickly respond to load increases and provide timely heat dissipation support. Operating parameters can reflect the operating status of electronic devices from multiple dimensions, making the determination of operating status more comprehensive and accurate. By setting different threshold ranges corresponding to the first and second preset conditions, a hysteresis characteristic for operating status determination is formed, avoiding frequent switching of operating states.

[0185] Based on the above embodiments, as an optional embodiment, the operating parameters also include device status parameters, with the first operating state being an idle state and the second operating state being a light-load state.

[0186] The above control methods may also include the following operations.

[0187] In response to the fact that the electronic device is currently in an idle state and the device status parameters indicate that there is an input change in the electronic device's input devices, the operating state of the electronic device is determined to switch from an idle state to a light-load state.

[0188] Device status parameters refer to parameters that reflect the status of peripheral devices in electronic devices, and are used to characterize the interaction between the electronic device and the user. Device status parameters can include the status information of input devices, such as whether there is operation input from input devices such as keyboards, mice, and touch screens.

[0189] Idle state refers to the operating state of an electronic device when it is not performing user tasks or is only performing basic background tasks, corresponding to the lowest load state of the electronic device. In the idle state, the system load of the electronic device is low, the hardware temperature is low, and the heat dissipation requirement is minimal.

[0190] Light load refers to the operating state of an electronic device performing light tasks, corresponding to a lower load state. In light load mode, the system load of the electronic device increases, hardware temperature rises, and heat dissipation requirements increase. The load level in light load mode is higher than idle mode, but lower than medium load or heavy load mode.

[0191] Input devices are devices used to receive user input, including but not limited to keyboards, mice, touchpads, touchscreens, and styluses. Input devices are the primary means by which users interact with electronic devices, issuing commands to them.

[0192] Input changes refer to changes in the state of an input device that indicate that a user is interacting with the electronic device. Input changes can include pressing keyboard keys, moving or clicking a mouse, and touching a touchscreen.

[0193] In one implementation, the presence of an input change can be determined by monitoring the input signals from the input device. When an input signal is detected from the input device, an input change is determined to exist. For example, an input change is determined when a key press signal is detected from the keyboard, a movement signal or click signal is detected from the mouse, or a touch signal is detected from the touch screen.

[0194] In another implementation, the presence of input change can be determined by comparing the state of the input device at different times. When the current state of the input device differs from the state at the previous time, an input change is determined to have occurred.

[0195] When an electronic device is currently idle, it indicates that the device is not performing any user tasks and the system load is at a low level. If an input change is detected at this time, it means the user is beginning to interact with the electronic device and is about to initiate a new task. Although the user's input has just begun and the system load and hardware temperature of the electronic device have not yet risen significantly, it is foreseeable that the device will soon perform a user task, and the load will increase.

[0196] Therefore, when a change in input is detected, the operating state can be switched from idle to light load, allowing the cooling module to increase its workload in advance and prepare for the upcoming increase in load. This operation state switching based on the input device status enables rapid response to user operations and makes the control of the cooling module predictive.

[0197] In one implementation, upon detecting a change in input from the input device, the operating state can be immediately determined to switch from idle state to light load state, and the control parameters of the cooling module can be adjusted accordingly.

[0198] Optionally, after determining the operating state switch, a specific control strategy for the light-load state can be determined based on the type of input device or the type of input operation. Different types of input operations may correspond to different task types; for example, keyboard input may correspond to word processing tasks, and mouse clicks may correspond to application startup tasks. Appropriate heat dissipation control strategies can be adopted according to different task types.

[0199] By adopting the technical solution of this embodiment, rapid switching of operating states based on input device status can be achieved. By incorporating device status parameters into operating parameters, the usage of electronic devices can be monitored from the perspective of user interaction. When the electronic device is idle, monitoring for input changes on the input device allows for timely detection of when the user begins operating the device. Responding to input changes, the operating state is switched from idle to light-load, enabling the cooling module to respond in advance before the user's task is actually executed, improving the timeliness of heat dissipation preparation. This embodiment utilizes the input device status as the trigger condition for operating state switching, achieving predictive control of the cooling module, ensuring that heat dissipation capacity remains synchronized with user operation, and improving the response speed of the electronic device and the user experience.

[0200] This application also discloses an electronic device, including: at least two cooling modules, each used to cool different heat source components; a memory for storing computer instructions; the computer instructions are loaded by a processor and used to: obtain the operating status of the electronic device; determine the overall operating intensity of the cooling device based on the operating status; allocate the overall operating intensity to at least two cooling modules based on the location of the cooling modules to determine the individual operating intensity of the cooling modules; and control the cooling modules to operate at the corresponding operating intensity.

[0201] It should be noted that the specific operation process and technical effects achieved when the above computer instructions are executed by the processor can be referred to the relevant descriptions in the above method embodiments, and will not be repeated here.

[0202] Figure 7 This is a block diagram of an electronic device provided in an embodiment of this application. Figure 7 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0203] like Figure 7 As shown, an electronic device according to an embodiment of this application includes a display screen (not shown) and a processor 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a memory 708 into a random access memory (RAM) 703. The processor 701 may include, for example, a general-purpose microprocessor (e.g., a CPU), an instruction set processor and / or an associated chipset and / or a special-purpose microprocessor (e.g., an application-specific integrated circuit (ASIC)), etc. The processor 701 may also include onboard memory for caching purposes. The processor 701 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of this application.

[0204] RAM 703 stores various programs and data required for the operation of the electronic device. Processor 701, ROM 702, and RAM 703 are interconnected via bus 704. Processor 701 executes various operations of the method flow according to embodiments of this application by executing programs in ROM 702 and / or RAM 703. It should be noted that the programs may also be stored in one or more memories other than ROM 702 and RAM 703. Processor 701 may also execute various operations of the method flow according to embodiments of this application by executing programs stored in said one or more memories.

[0205] According to embodiments of this application, the electronic device may further include an input / output (I / O) interface 705, which is also connected to a bus 704. The electronic device 700 may also include one or more of the following components connected to the input / output (I / O) interface 705: an input device 706 including a keyboard, mouse, etc.; an output device 707 including a cathode ray tube (CRT), liquid crystal display (LCD), display screen, etc., and a speaker, etc.; a memory 708 including a hard disk, etc.; and a communication section 709 including a network interface card such as a LAN card, modem, etc. The communication section 709 performs communication processing via a network such as the Internet. A drive 710 is also connected to the input / output (I / O) interface 705 as needed. A removable medium 711, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on the drive 710 as needed so that computer programs read from it can be installed into the memory 708 as needed.

[0206] According to embodiments of this application, the method flow according to embodiments of this application can be implemented as a computer software program. For example, embodiments of this application include a computer program product comprising a computer program carried on a computer-readable storage medium, the computer program containing program code for performing the method shown in the flowchart. In such embodiments, the computer program can be downloaded and installed from a network via communication section 709, and / or installed from removable medium 711. When the computer program is executed by processor 701, it performs the functions defined in the system of embodiments of this application. According to embodiments of this application, the systems, devices, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0207] This application also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or it may exist independently and not assembled into the device / apparatus / system. The computer-readable storage medium carries one or more programs, which, when executed, implement the method according to the embodiments of this application.

[0208] According to embodiments of this application, the computer-readable storage medium can be a non-volatile computer-readable storage medium. Examples include, but are not limited to: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this application, the computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0209] For example, according to embodiments of this application, a computer-readable storage medium may include the ROM 702 and / or RAM 703 described above and / or one or more memories other than ROM 702 and RAM 703.

[0210] Embodiments of this application also include a computer program product comprising a computer program containing program code for performing the methods provided in the embodiments of this application. When the computer program product is run on an electronic device, the program code is used to enable the electronic device to implement the methods provided in the embodiments of this application.

[0211] When the computer program is executed by the processor 701, it performs the functions defined in the system / apparatus of this application embodiment. According to the embodiments of this application, the systems, apparatuses, modules, units, etc., described above can be implemented by computer program modules.

[0212] In one embodiment, the computer program may rely on a tangible storage medium such as an optical storage device or a magnetic storage device. In another embodiment, the computer program may also be transmitted and distributed in the form of signals over a network medium, and may be downloaded and installed via the communication section 709, and / or installed from a removable medium 711. The program code contained in the computer program can be transmitted using any suitable network medium, including but not limited to: wireless, wired, etc., or any suitable combination thereof.

[0213] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions. Those skilled in the art will understand that the features recited in the various embodiments and / or claims of this application can be combined and / or combined in various ways, even if such combinations or combinations are not expressly stated in this application. In particular, the various embodiments and / or features described in the claims of this application may be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

[0214] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this application, and all such substitutions and modifications should fall within the scope of this application.

Claims

1. A control method, comprising: Obtain the operating parameters of the electronic device; the electronic device includes at least two cooling modules, which are used to cool different heat source components respectively; The operating status of the electronic device is determined based on the operating parameters; Obtain the temperature information of the heat source component; Based on the operating status of the electronic device and the temperature information of the heat source component, the control parameters of each cooling module are determined; Each cooling module is driven based on its control parameters. The operating states of the electronic device include at least a first operating state and a second operating state, wherein the operating load of the electronic device in the first operating state is lower than the operating load of the electronic device in the second operating state.

2. The method according to claim 1, wherein determining the control parameters of each cooling module based on the operating status of the electronic device and the temperature information of the heat source component includes: Based on the operating status of the electronic device, the target power consumption of the at least two cooling modules is determined; Based on the temperature information of the heat source component and the target power consumption, the allocated power consumption of each of the cooling modules is determined respectively; Control parameters are generated based on the allocated power consumption of each of the cooling modules.

3. The method according to claim 2, wherein determining the allocated power consumption of each of the cooling modules based on the temperature information of the heat source component and the target power consumption includes: In response to the electronic device switching from a first operating state to a second operating state, the allocation weight of the corresponding cooling module is determined based on the importance of each heat source component in the electronic device and the temperature information. The allocated power consumption of each cooling module is determined based on the allocation weight of each cooling module and the target power consumption.

4. The method according to claim 2, wherein the at least two cooling modules include a pre-cooling module and a post-cooling module; the pre-cooling module is used to provide air intake for the electronic device, and the post-cooling module is used to provide air exhaust for the electronic device; The step of determining the allocated power consumption of each cooling module based on the temperature information of the heat source component and the target power consumption includes: In response to the electronic device switching its operating state from a first operating state to a second operating state, the average temperature of the heat source components is determined based on the temperature information of each heat source component. Based on the average temperature and the target power consumption, the first allocated power consumption of the pre-cooling module is determined; Based on the temperature information of each heat source component and the target power consumption, the second allocated power consumption of the post-cooling module is determined, and the second allocated power consumption is positively correlated with the temperature information of the heat source components.

5. The method according to claim 1, wherein driving each cooling module based on the control parameters of each cooling module comprises: In response to the change of the operating state from the first operating state to the second operating state, the start-up order of each cooling module is determined based on the importance of each heat source component in the electronic device; According to the startup sequence, each of the cooling modules is driven at different times. The cooling module for cooling the first heat source component is activated earlier than the cooling module for cooling the second heat source component, and the first heat source component is more important than the second heat source component in the electronic device.

6. The method according to claim 1, wherein determining the operating state of the electronic device based on the operating parameters comprises: The current operating status of the electronic device is determined based on the operating parameters; Obtain historical operating parameters, which are the operating parameters of the electronic device during a first time period; The changing trend of the operating parameters is determined based on the historical operating parameters; Based on the changing trend and the current operating status, the operating status of the electronic device in the second time period is determined; the second time period is after the first time period.

7. The method according to claim 6, wherein driving each cooling module based on the control parameters of each cooling module comprises: In response to the electronic device switching its operating state from a first operating state to a second operating state during a second time period, the control parameters of each cooling module are adjusted from the first parameter value corresponding to the first operating state to a first transition parameter value; the first transition parameter value is greater than the first parameter value and less than the second parameter value corresponding to the second operating state. In response to the electronic device switching its operating state from a second operating state to a first operating state during a second time period, the control parameters of each cooling module are adjusted from the second parameter value to a second transition parameter value; the second transition parameter value is less than the second parameter value and greater than the first parameter value.

8. The method according to claim 6, wherein determining the current operating state of the electronic device based on the operating parameters comprises: In response to the operating parameters satisfying a first preset condition and continuing for a first preset duration, the current operating state of the electronic device is determined to be a first operating state; In response to the operating parameters satisfying the second preset condition, the current operating state of the electronic device is determined to be the second operating state; The operating parameters include at least one of the following: hardware temperature parameters, system load parameters, and parameter change rate; Wherein, the threshold range of the operating parameters corresponding to the first preset condition is smaller than the threshold range of the operating parameters corresponding to the second preset condition.

9. The method according to claim 8, wherein the operating parameters further include equipment status parameters, the first operating state is an idle state, and the second operating state is a light-load state; The method further includes: In response to the fact that the electronic device is currently in the idle state and the device status parameter indicates that there is an input change in the input device of the electronic device, the operating state of the electronic device is determined to switch from the idle state to the light load state.

10. An electronic device, comprising: At least two cooling modules, each used to cool different heat source components; Memory, used to store computer instructions; The computer instructions are loaded by the processor and used for: Obtain the operating status of the electronic device; The overall operating intensity of the cooling device is determined based on the operating status. The overall operating intensity is allocated to the at least two cooling modules based on the location of the cooling modules, so as to determine the individual operating intensity of the cooling modules; The cooling module is controlled to operate at the corresponding operating intensity.

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