A liquid silicone rubber filled, sealed, elastomeric, thermally conductive structure

Abstract

The application discloses a liquid silicone rubber filled sealed elastic heat conducting structure and relates to the technical field of heat management. The liquid silicone rubber filled sealed elastic heat conducting structure comprises a cold plate upper cover plate, a liquid cooling flow channel base body is arranged below the cold plate upper cover plate, a shunt joint is arranged at the end of the liquid cooling flow channel base body, an inlet and outlet liquid pipeline is connected with the shunt joint, a plurality of groups of heat conducting cavity assemblies are arranged in an array on the bottom of the liquid cooling flow channel base body, and the heat conducting cavity assemblies comprise a cavity shell and a cavity cover plate. Through the sealing cooperation of the cold plate upper cover plate and the liquid cooling flow channel base body, a closed and smooth cooling liquid circulating channel is formed, the heat conducting fins in the flow channel can fully exchange heat, the heat transferred by the heat conducting side can be continuously and efficiently taken away, the overall heat dissipation performance is stable and reliable, the module connecting assembly can be arranged to realize the series connection and liquid path communication of a plurality of cold plate units, and the scene adaptability and assembly convenience of the product are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology, specifically to a sealed elastic thermally conductive structure filled with liquid silicone rubber. Background Technology

[0002] Sealed elastic thermal conductive structures are core thermal interface devices in electronic thermal management systems. They are mainly placed between heat-generating components and heat dissipation devices to fill the assembly gaps, absorb surface form and position tolerances, and achieve low thermal resistance heat conduction. Compared with traditional solid thermal pads and thermal grease, this type of structure adapts to assembly deviations by relying on its own elastic deformation capability. It can maintain stable contact pressure over a wide range of operating conditions and avoid large fluctuations in interface thermal resistance with assembly status. Currently, this type of structure has been widely used in high-density heat dissipation scenarios such as optical communication modules, server chips, and power semiconductor devices.

[0003] Liquid silicone rubber-filled sealed elastic thermally conductive structures are one of the mainstream technical routes in this field. Typically, a metal shell is used to encapsulate the liquid thermally conductive silicone rubber. The high fluidity and thermal conductivity of silicone rubber are used to improve the interface wetting effect and reduce the contact thermal resistance. Various encapsulation structure solutions have emerged in the industry. Most of them form a sealed cavity by stamping a metal shell and using a cover plate, and then fill the thermally conductive silicone rubber with a potting process. Compared with pure solid thermally conductive structures, they have better interface bonding performance.

[0004] However, there is still room for improvement in the practical application of liquid cooling: First, under long-term hot and cold cycles, there is a risk of slow migration and seepage of the internal liquid silicone rubber, and the performance of the heat-conducting medium is prone to decay, making it difficult to maintain stable heat conduction performance throughout the entire life cycle; Second, relying solely on the deformation adaptation tolerance of the silicone rubber itself has limited ability to compensate for circuit board warping and chip height differences, and the assembly requires high precision in controlling the clamping pressure, which is not conducive to improving the overall practicality of the device. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a sealed elastic thermally conductive structure filled with liquid silicone rubber to solve the technical problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a sealed elastic thermally conductive structure filled with liquid silicone rubber, comprising a cold plate cover plate, a liquid-cooled flow channel substrate disposed below the cold plate cover plate, and a flow divider provided at the end of the liquid-cooled flow channel substrate, wherein the flow divider is externally connected to inlet and outlet liquid pipes, and a plurality of sets of thermally conductive cavity assemblies are arranged in an array at the bottom of the liquid-cooled flow channel substrate, wherein the thermally conductive cavity assembly comprises a cavity shell and a cavity cover plate, and the circumferential sidewall of the cavity shell is configured as a corrugated pleated structure.

[0007] By adopting the above technical solution, and through the sealed fit between the cold plate cover and the liquid cooling channel substrate, combined with the connection structure of the diversion joint and the inlet and outlet liquid pipes, a closed and smooth coolant circulation channel can be formed. The heat exchange fins within the channel fully utilize heat exchange, continuously and efficiently removing the heat transferred from the heat conduction side, ensuring stable and reliable overall heat dissipation performance. The modular connection components allow for the series connection and liquid circuit connection of multiple cold plate units, flexibly adapting to the heat dissipation needs of different numbers of chips, effectively improving the product's scenario adaptability and assembly convenience. Through the heat conduction cavity assembly... The arrangement of components at the bottom of the cold plate, with the help of the corrugated elastic sidewall structure of the cavity shell, can automatically compensate for circuit board warpage, chip height differences and assembly tolerances, so that the contact surface is evenly stressed and can maintain good thermal conductivity and bonding effect without the need for precise control of the fastening pressure. The setting of opening the injection hole on the cavity cover and sealing it with the injection sealing plug not only facilitates the injection of liquid silicone rubber into the cavity, but also ensures the complete sealing of the cavity, eliminating the problems of silicone rubber pumping out, drying and assembly overflow contamination, and achieving stable thermal conductivity without maintenance throughout the product's entire life cycle.

[0008] The present invention is further configured such that the cover plate on the cold plate covers the top surface of the liquid cooling channel substrate, and the two are sealed together to form a closed coolant channel.

[0009] Preferably, the cover plate on the cold plate and the liquid cooling channel substrate are sealed together to form a closed and stable coolant channel, which avoids coolant leakage and ensures the continuous and reliable operation of the liquid cooling cycle.

[0010] The present invention is further configured such that the flow divider is fixedly installed on the side end of the liquid cooling channel substrate, and the inlet and outlet liquid pipes are connected to the internal flow channel of the liquid cooling channel substrate through the flow divider.

[0011] Preferably, the diverter connector, in conjunction with the inlet and outlet liquid lines, can realize the diversion and delivery of coolant and the convergence and return of coolant, ensuring a stable connection and smooth flow of the liquid circuit.

[0012] The present invention is further configured such that the surface of the cavity cover plate is provided with an injection hole, and the injection hole is connected to the closed inner cavity of the heat-conducting cavity assembly.

[0013] Preferably, the injection hole on the cavity cover provides an injection channel for the filling of liquid silicone rubber, which facilitates the injection operation inside the cavity and ensures that the filling process is controllable.

[0014] The present invention is further configured such that an adhesive injection sealing plug is fitted inside the adhesive injection hole, and the adhesive injection sealing plug is sealed inside the adhesive injection hole.

[0015] Preferably, the glue-filling sealing plug can seal the glue-filling hole after glue filling, ensuring the overall sealing performance of the cavity and preventing the leakage of internal silicone rubber.

[0016] The present invention is further configured such that the cavity shell is an integrally stamped stainless steel shell, and its circumferential corrugated pleated structure is a continuous bending structure, which is arranged around the circumference of the cavity shell.

[0017] Preferably, the integrally stamped cavity shell has higher structural strength and sealing reliability, and its continuous corrugated structure can provide stable and uniform elastic rebound force.

[0018] The present invention is further configured such that a module connection component is provided between the liquid cooling channel substrates, and multiple cold plate units are spliced ​​and fixed by the module connection component.

[0019] Preferably, the modular connection component can realize the modular splicing and liquid circuit connection of multiple cold plate units, flexibly adapting to heat dissipation needs of different scales.

[0020] The present invention is further configured such that a plurality of support blocks are provided at the bottom of the heat-conducting cavity assembly.

[0021] Preferably, the support block at the bottom of the heat-conducting cavity assembly can provide air-free support for the bottom of the cavity, reserve a buffer space for heat diffusion, and optimize the heat dissipation effect.

[0022] The present invention is further configured such that the support blocks are evenly spaced along the bottom of the heat-conducting cavity assembly.

[0023] Preferably, the evenly spaced support blocks can ensure that the support force and heat distribution are uniform and consistent, thus ensuring that the cavity is installed stably and that heat dissipation is uniform.

[0024] In summary, the present invention has the following main beneficial effects:

[0025] This invention, through the sealed fit between the cold plate cover and the liquid cooling channel substrate, combined with the connection structure of the diverter and the inlet / outlet liquid pipes, can form a closed and smooth coolant circulation channel. With the help of the heat dissipation fins in the channel, heat exchange is fully carried out, continuously and efficiently removing the heat transferred from the heat conduction side, ensuring stable and reliable overall heat dissipation performance. Through the modular connection components, multiple cold plate units can be connected in series and liquid channels, flexibly adapting to the heat dissipation requirements of different numbers of chips, effectively improving the product's scenario adaptability and assembly convenience.

[0026] This invention utilizes an array of heat-conducting cavity components arranged at the bottom of a cold plate. Leveraging the corrugated elastic sidewall structure of the cavity housing, it automatically compensates for circuit board warping, chip height differences, and assembly tolerances, ensuring uniform force on the contact surface. This allows for consistent and excellent thermal conductivity and adhesion without requiring precise control of the mounting pressure. Furthermore, the cavity cover features injection holes sealed with injection plugs, facilitating the injection of liquid silicone rubber into the cavity while ensuring complete sealing. This eliminates issues such as silicone rubber pumping out, drying, and assembly overflow contamination, achieving stable thermal conductivity with no maintenance throughout the product's lifecycle. Attached Figure Description

[0027] Figure 1 This is a side perspective view of the present invention;

[0028] Figure 2 This is a front view of the present invention;

[0029] Figure 3 This is a bottom view diagram of the present invention;

[0030] Figure 4 This is a side view of the present invention;

[0031] Figure 5 This is a schematic diagram showing the disassembled parts of the present invention;

[0032] Figure 6 This is a schematic diagram of the liquid cooling channel substrate structure of the present invention;

[0033] Figure 7 This is a schematic diagram of the thermally conductive cavity assembly structure of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Cold plate cover; 2. Liquid cooling channel substrate; 3. Flow divider; 4. Inlet and outlet liquid pipelines; 5. Heat-conducting cavity assembly; 6. Module connection assembly; 50. Cavity shell; 51. Cavity cover; 52. Glue injection hole; 53. Glue injection sealing plug; 7. Support block. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] The embodiments of the present invention will now be described.

[0038] First embodiment: A sealed elastic thermally conductive structure filled with liquid silicone rubber, please refer to... Figures 1-7The system includes a cold plate cover 1, a liquid cooling channel base 2 located below the cold plate cover 1, and a flow divider 3 at the end of the liquid cooling channel base 2. The flow divider 3 is externally connected to inlet and outlet liquid pipes 4. Several sets of heat-conducting cavity assemblies 5 are arranged in an array at the bottom of the liquid cooling channel base 2. Each heat-conducting cavity assembly 5 includes a cavity shell 50 and a cavity cover 51. The circumferential sidewall of the cavity shell 50 is corrugated. Through the sealed fit between the cold plate cover 1 and the liquid cooling channel base 2, combined with the connection between the flow divider 3 and the inlet and outlet liquid pipes 4, a closed and smooth coolant circulation channel can be formed. The heat exchange fins within the channel fully facilitate heat exchange, continuously and efficiently removing the heat transferred from the heat-conducting side, ensuring stable and reliable overall heat dissipation performance. Through the modular connection assembly 6, it is possible to... By connecting multiple cold plate units in series and connecting them with liquid channels, the heat dissipation requirements of different numbers of chips can be flexibly adapted, effectively improving the product's adaptability to different scenarios and ease of assembly. Through the arrangement of the heat-conducting cavity components 5 array at the bottom of the cold plate, the corrugated elastic sidewall structure of the cavity shell 50 can automatically compensate for circuit board warping, chip height differences and assembly tolerances, so that the contact surface is subjected to uniform force and can maintain a good thermal conductivity and bonding effect without the need for precise control of the locking pressure. The cavity cover plate 51 has a glue injection hole 52 and a glue injection sealing plug 53 for sealing, which facilitates the injection of liquid silicone rubber into the cavity and ensures the complete sealing of the cavity, eliminating the problems of silicone rubber pumping out, drying and assembly overflow contamination, and achieving stable thermal conductivity performance without maintenance throughout the product's entire life cycle.

[0039] For details regarding the above embodiments, please refer to [link / reference]. Figures 1-6 The upper cover plate 1 of the cold plate covers the top surface of the liquid cooling channel base 2. The two are sealed together to form a closed coolant channel. The sealed cooperation between the upper cover plate 1 of the cold plate and the liquid cooling channel base 2 can form a closed and stable coolant channel, avoid coolant leakage, and ensure the continuous and reliable operation of the liquid cooling cycle.

[0040] For details regarding the above embodiments, please refer to [link / reference]. Figures 1-6 The diverter 3 is fixedly installed on the side of the liquid cooling channel base 2, and the inlet and outlet liquid pipes 4 are connected to the internal flow channel of the liquid cooling channel base 2 through the diverter 3. The diverter 3, together with the inlet and outlet liquid pipes 4, can realize the diversion and delivery of coolant and the convergence and return of coolant, ensuring that the liquid circuit connection is stable and the flow is smooth.

[0041] For details regarding the above embodiments, please refer to [link / reference]. Figures 1-7 The cavity cover plate 51 has an injection hole 52 on its surface, and the injection hole 52 is connected to the closed inner cavity of the heat-conducting cavity assembly 5. The injection hole 52 on the cavity cover plate 51 provides an injection channel for the filling of liquid silicone rubber, which facilitates the injection operation inside the cavity and ensures that the filling process is controllable.

[0042] For details regarding the above embodiments, please refer to [link / reference]. Figures 2-7 An injection sealing plug 53 is installed inside the injection hole 52, and the injection sealing plug 53 seals the injection hole 52. The injection sealing plug 53 can seal the injection hole 52 after the injection is completed, ensuring the overall sealing performance of the cavity and preventing the leakage of internal silicone rubber.

[0043] For details regarding the above embodiments, please refer to [link / reference]. Figure 7 The cavity shell 50 is a one-piece stamped stainless steel shell. Its circumferential corrugated structure is a continuous bending structure, which is arranged around the circumference of the cavity shell 50. The one-piece stamped cavity shell 50 has higher structural strength and sealing reliability, and its continuous corrugated structure can provide stable and uniform elastic rebound force.

[0044] For details regarding the above embodiments, please refer to [link / reference]. Figures 1-6 A modular connection component 6 is provided between the liquid cooling channel base 2, and multiple cold plate units are spliced ​​and fixed through the modular connection component 6. The modular connection component 6 can realize the modular splicing and liquid circuit connection of multiple cold plate units, flexibly adapting to heat dissipation needs of different scales.

[0045] Second embodiment: Please refer to Figures 2-5 The difference between Embodiment 2 and Embodiment 1 is that, while retaining the features of Embodiment 1, several sets of support blocks 7 are added to the bottom of the heat-conducting cavity assembly 5. This creates a support structure at the bottom of the heat-conducting cavity assembly 5, providing a buffer space for heat diffusion. This facilitates the even distribution of heat conducted by the heat-conducting cavity assembly 5 to the surrounding area, preventing local heat accumulation and further improving the uniformity of heat dissipation, thus effectively enhancing the overall practicality of the device.

[0046] In practical operation, this invention:

[0047] This structure serves as a heat-conducting interface, assembled between the liquid-cooled cold plate and the heat-generating chip. During operation, the coolant is transported through the inlet and outlet pipes 4 and enters the internal flow channel of the liquid-cooled flow channel substrate 2 through the diverter 3. The cover plate 1 on the cold plate and the liquid-cooled flow channel substrate 2 form a closed loop by sealing and fitting together. The coolant flows along the flow channel to exchange heat, continuously carrying away the heat conducted below and returning it to the external cooling system, thus completing the heat dissipation process on the cold plate side.

[0048] Furthermore, the heat generated by the chip is conducted upward through this heat-conducting structure. The corrugated sidewalls of the cavity shell 50 undergo elastic deformation under assembly pressure, which can automatically compensate for circuit board warping, chip height differences, and assembly tolerances, so that the bottom surface of the cavity and the chip surface are uniformly and tightly attached. Stable low contact thermal resistance can be maintained without precise control of the mounting pressure. The liquid silicone rubber filled inside the cavity serves as a heat-conducting medium, which evenly conducts heat to the cavity cover plate 51 and then to the liquid cooling channel substrate 2 above, realizing efficient interface conduction of heat from the chip to the cold plate.

[0049] Furthermore, the injection hole 52 on the cavity cover plate 51, together with the injection sealing plug 53, completely seals the liquid silicone rubber inside the cavity, structurally eliminating the problems of pumping effect, material drying and assembly overflow contamination, and achieving stable thermal conductivity without maintenance throughout the product's entire life cycle. In the optimized embodiment, several sets of support blocks 7 are set at the bottom of the cavity shell 50, forming a hollow support for the bottom of the cavity, reserving a heat diffusion buffer space, so that heat is evenly distributed in all directions and avoiding local heat accumulation. Multiple sets of cold plate units can be connected in series through the module connection component 6 to flexibly adapt to different heat dissipation scenarios.

[0050] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A sealed, elastic, and thermally conductive structure filled with liquid silicone rubber, comprising a cover plate on a cold plate (1), characterized in that: A liquid cooling channel substrate (2) is provided below the cover plate (1) on the cold plate, and a flow divider (3) is provided at the end of the liquid cooling channel substrate (2). The flow divider (3) is connected to an inlet and outlet liquid pipe (4). Several sets of heat-conducting cavity assemblies (5) are arranged in an array at the bottom of the liquid cooling channel substrate (2). The heat-conducting cavity assembly (5) includes a cavity shell (50) and a cavity cover plate (51). The circumferential sidewall of the cavity shell (50) is set as a corrugated pleated structure.

2. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 1, characterized in that: The diverter (3) is fixedly installed on the side of the liquid cooling channel base (2), and the inlet and outlet liquid pipes (4) are connected to the internal flow channel of the liquid cooling channel base (2) through the diverter (3).

3. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 1, characterized in that: The cavity cover plate (51) has an injection hole (52) on its surface, and the injection hole (52) is connected to the closed inner cavity of the heat-conducting cavity assembly (5). The closed inner cavity is filled with liquid silicone rubber.

4. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 4, characterized in that: The injection hole (52) is fitted with an injection sealing plug (53), and the injection sealing plug (53) seals the injection hole (52).

5. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 1, characterized in that: The cavity shell (50) is an integrally stamped stainless steel shell, and its circumferential corrugated structure is a continuous bending structure, which is arranged around the circumference of the cavity shell (50).

6. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 1, characterized in that: The liquid cooling channel substrate (2) is provided with a module connection component (6), and multiple cold plate units are spliced ​​and fixed by the module connection component (6).

7. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 1, characterized in that: The bottom of the heat-conducting cavity assembly (5) is provided with several sets of support blocks (7).

8. The sealed elastic thermally conductive structure filled with liquid silicone rubber according to claim 7, characterized in that: The support blocks (7) are evenly spaced along the bottom of the heat-conducting cavity assembly (5).

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