A multi-module array type two-phase liquid cooling cold plate device and heat dissipation method

Abstract

The application discloses a multi-module array type two-phase liquid cooling cold plate device and a heat dissipation method. The device comprises a liquid cooling plate body, a flow divider, a pump and a condenser. The liquid cooling plate body is internally provided with a plurality of heat exchange cavities arranged at intervals, and a plurality of heat exchange adhering surfaces are arranged at the bottom. The flow divider is provided with a plurality of adjusting valves. Each adjusting valve is communicated with the corresponding heat exchange cavity through a liquid inlet branch pipe. The output end of the pump is connected with the input end of the flow divider. The top of each heat exchange cavity is communicated with a leading branch pipe. After being converged, each leading branch pipe is communicated with the input end of the condenser. The output end of the condenser is connected with the input end of the pump. The method comprises the following steps: liquid working medium is pressurized by the pump and enters the flow divider; the flow divider independently adjusts and distributes the flow rate according to the heat load of each heat exchange cavity; the liquid working medium enters the heat exchange cavity to absorb the heat of the heating element and generates liquid-gas phase change; the gas-liquid mixed fluid is discharged and converged through the leading branch pipe; the gas-liquid mixed fluid enters the condenser to be liquefied; and the liquid working medium returns to the pump to enter the next cycle.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, specifically to a multi-module array-type two-phase liquid cooling plate device and a heat dissipation method. Background Technology

[0002] Pump-driven two-phase cold plate liquid cooling systems are advanced heat dissipation technologies widely used in high-heat-density equipment such as data centers, servers, and IGBTs. They utilize liquid as the cooling medium, which is circulated within the liquid cooling plate by a pump, achieving efficient heat dissipation for heat-generating components. In this system, the cooling liquid flows through microchannels within the cold plate, absorbing heat from the heat-generating components through conduction and convection. As the liquid temperature rises, a portion of the liquid undergoes a phase change, transforming from a liquid to a gaseous state, forming a gas-liquid mixture. This phase change process absorbs a significant amount of heat, resulting in highly efficient heat dissipation.

[0003] High-power computing servers and power converters typically have multiple chip modules arranged in a side-by-side array. A separate cooling solution, where a single cold plate is attached to each chip, suffers from drawbacks such as complex piping, uneven flow resistance, redundant installation space, and turbulent gas-liquid separation of the two-phase working fluid. Traditional integrated flow channel cold plates are difficult to manufacture for array modules, and sudden changes in heat flux density in certain chips can easily lead to localized working fluid burnout and heat exchange failure. Furthermore, the conventional cold plate's inlet and outlet are arranged on the same side, which is not conducive to two-phase gas-liquid separation, causing gas phase to accumulate on the upper part of the cold plate, forming gas blockages and significantly reducing phase change heat dissipation efficiency. Existing two-phase cold plates mostly use a single-inlet, single-outlet flow channel structure, which cannot be matched to the operating conditions of multiple chips arranged in a side-by-side array. Multiple parallel piping lines are prone to flow deviation, insufficient working fluid flow in some channels, and overheating of high-heat-load chips. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-module array-type two-phase liquid-cooled cold plate device and heat dissipation method to solve the technical problems of complex pipelines, uneven flow resistance, disordered gas-liquid separation, and local dry burning in the heat dissipation of multi-heat-generating element (chip) array modules in the prior art, and to achieve efficient and uniform heat dissipation of multi-module heat-generating element arrays.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A multi-module array-type two-phase liquid-cooled cold plate device includes a liquid-cooled plate body, a distributor, a pump, and a condenser. The liquid-cooled plate body has multiple heat exchange chambers arranged at intervals inside, and the bottom of the liquid-cooled plate body has multiple heat exchange contact surfaces corresponding to the positions of each heat exchange chamber. The distributor has multiple regulating valves, and the outlet of each regulating valve is connected to the corresponding heat exchange chamber through a liquid inlet branch pipe. The output end of the pump is connected to the input end of the distributor. Each heat exchange chamber has an outlet branch pipe connected above it. The outlet branch pipes merge and are connected to the input end of the condenser. The output end of the condenser is connected to the input end of the pump.

[0006] Furthermore, it also includes a manifold, which is located above the liquid cooling plate body. The bottom of the manifold has multiple interfaces, and each branch pipe is connected to the manifold through the corresponding interface. The manifold combines the branch pipes and connects them to the input end of the condenser.

[0007] Furthermore, the top of the manifold is equipped with a manifold outlet pipe, which is connected to the input end of the condenser.

[0008] Furthermore, the manifold outlet pipe is a multi-port pipe, including at least one input section and at least two output sections. The input section is connected to the output end of the manifold, and the two output sections are connected to the input end of the condenser.

[0009] Furthermore, the diameter of the outgoing branch pipe is larger than the diameter of the inlet branch pipe.

[0010] Furthermore, each heat exchange chamber is equipped with a temperature sensor and a flow sensor.

[0011] Furthermore, the heat exchange cavities are arranged at intervals along the length of the liquid cooling plate body, and each heat exchange contact surface is located directly below the corresponding heat exchange cavity.

[0012] A method for heat dissipation using a multi-module array-type two-phase liquid-cooled plate, employing the aforementioned multi-module array-type two-phase liquid-cooled plate device, includes the following steps: S1. The liquid working fluid is pressurized by the pump and then enters the distributor; S2. The distributor independently distributes the liquid working fluid to each inlet branch pipe through each regulating valve. The opening of each regulating valve is adjusted according to the heat load corresponding to each heat exchange chamber to control the flow rate distributed to each heat exchange chamber. S3. The liquid working fluid enters the corresponding heat exchange chamber through each inlet branch pipe. In the heat exchange chamber, it absorbs the heat from the heating element attached to the heat exchange bonding surface. After reaching the saturation temperature, a liquid-gas phase change occurs, generating a gas-liquid two-phase mixed fluid. S4. The gas-liquid two-phase mixed fluid in each heat exchange chamber is discharged and merged through the outlet branch pipe; S5. The combined gas-liquid two-phase fluid enters the condenser, where the gaseous working fluid releases heat and liquefies back into a liquid working fluid. S6. The liquid working fluid flows back to the pump and enters the next cycle.

[0013] Further, in step S2, the opening degree of each regulating valve is adjusted according to the heat load corresponding to each heat exchange chamber. Specifically, this includes: collecting the temperature of each heat exchange chamber; if the temperature of a heat exchange chamber is higher than a preset threshold, increasing the opening degree of the corresponding regulating valve to increase the liquid inlet flow rate of that heat exchange chamber; if the temperature of a heat exchange chamber is lower than a preset threshold, decreasing the opening degree of the corresponding regulating valve to reduce the liquid inlet flow rate of that heat exchange chamber; and simultaneously adjusting the output power of the pump to keep the sum of the target flow rates of each inlet branch pipe balanced with the total flow rate output by the pump.

[0014] Furthermore, in step S4, the gas-liquid two-phase mixed fluid in each heat exchange chamber first enters the manifold through the outlet branch pipe, and after converging in the manifold, it is discharged uniformly through the manifold outlet pipe. Beneficial effects

[0015] This invention provides a multi-module array-type two-phase liquid-cooled cold plate device and heat dissipation method, which has the following advantages compared with the prior art: 1. This invention utilizes multiple spaced heat exchange chambers within the liquid-cooled plate body, with a corresponding heat exchange contact surface at the bottom of each chamber, to achieve an integrated heat dissipation solution for a single cold plate supporting an array module of multiple heat-generating elements (chips). Compared to a split-type solution, this design simplifies piping layout, reduces installation space, minimizes pipe connection points, and lowers the risk of leakage.

[0016] 2. Each heat exchange chamber is independently equipped with an inlet branch pipe and an outlet branch pipe. The distributor independently distributes the liquid working fluid to each heat exchange chamber through regulating valves, and the flow rate can be independently adjusted according to the heat load of the corresponding heating element in each heat exchange chamber. If the temperature of a heat exchange chamber is higher than the threshold, the opening of the corresponding regulating valve is increased; if the temperature of a heat exchange chamber is lower than the threshold, the opening of the corresponding regulating valve is decreased. Furthermore, it can compensate for the resistance differences caused by the length differences of each inlet branch pipe. For the far-end heat exchange chamber, the opening of the corresponding regulating valve is increased to reduce local resistance and increase the working fluid flow rate into the far-end heat exchange chamber; for the near-end heat exchange chamber, the opening of the corresponding regulating valve is appropriately decreased to avoid excessive flow. This ensures that each heat exchange chamber receives a working fluid flow rate that matches the heat load of the corresponding chip, guaranteeing that each heating element in the array receives sufficient cooling working fluid.

[0017] 3. After absorbing heat from the heating elements, the working fluid in each heat exchange chamber undergoes a liquid-gas phase change, generating a gas-liquid two-phase mixture. The phase change process absorbs a large amount of latent heat, and the heat dissipation efficiency is much higher than that of single-phase liquid cooling, which can meet the heat dissipation requirements of high-power heating elements.

[0018] 4. The diameter of the outgoing branch pipe is larger than that of the inlet branch pipe, which makes the volumetric flow rate of the gas-liquid mixture stable, reduces the fluctuation of the gas holdup of the fluid at the condenser inlet, stabilizes the heat exchange load of the condenser, and can effectively improve the energy efficiency of the entire two-phase system.

[0019] 5. Each heat exchange chamber is connected to a branch pipe at the top, and the gas-liquid two-phase mixed fluid is discharged independently from each heat exchange chamber, avoiding the accumulation of gas phase on the upper part of the cold plate to form gas blockage, ensuring smooth flow of working fluid in each heat exchange chamber, and greatly improving phase change heat dissipation efficiency.

[0020] 6. Further, a manifold is installed, with each branch pipe connected to it first. After converging through the manifold, the fluid enters the condenser uniformly. A manifold outlet pipe is installed at the top of the manifold. The manifold outlet pipe adopts a multi-way pipe design, which can simultaneously supply flow to multiple input ends of the condenser, dispersing the entry path of the gas-liquid mixture, making the heat exchange load in the condenser more uniform, and further improving the heat exchange efficiency of the condenser.

[0021] 7. Each heat exchange chamber is equipped with a temperature sensor and a flow sensor, which can collect the temperature and flow data of each heat exchange chamber in real time, provide data support for the precise control of the flow divider regulating valve, realize closed-loop intelligent control, and ensure that each heating element always operates within a safe temperature range.

[0022] 8. A closed-loop circulation system is adopted. The liquid working fluid absorbs heat and undergoes phase change in the heat exchange chamber → the gas-liquid mixture enters the condenser and releases heat to liquefy → the liquid working fluid flows back to the pump → it is pressurized again and enters the distributor. This cycle repeats continuously. The working fluid is recycled in a closed system with no loss, making it green and environmentally friendly. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the multi-module array-type two-phase liquid-cooled cold plate device of the present invention; Figure 2 This is a schematic diagram of the system circulation principle of the multi-module array-type two-phase liquid-cooled cold plate device of the present invention; Figure 3 This is an exploded structural diagram of the liquid cooling plate body of the present invention; Figure 4 This is a schematic diagram of the connection structure between the liquid cooling plate body and the distributor and combiner of the present invention; Figure 5 This is a bottom view of the connection structure between the liquid cooling plate body and the liquid inlet branch pipe of the present invention; Figure 6 This is a top view of the connection structure between the liquid cooling plate body and the liquid inlet branch pipe of the present invention; Figure 7 This is a flowchart of the heat dissipation method of the present invention.

[0024] In the diagram: 1. Liquid cooling plate body; 11. Heat exchange chamber; 12. Heat exchange mating surface; 13. Upper cover plate; 14. Lower box body; 2. Flow divider; 3. Pump; 4. Condenser; 5. Liquid inlet branch pipe; 6. Outlet branch pipe; 7. Manifold; 8. Manifold outlet pipe. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] See Figures 1 to 6 This embodiment provides a multi-module array-type two-phase liquid-cooled cold plate device, mainly used for efficient heat dissipation of multiple heat-generating element (chip) modules arranged in a side-by-side array inside equipment such as data center servers and power converters. The device employs a two-phase phase change heat dissipation principle, using a pump to drive the working fluid to circulate within a closed-loop system, achieving independent, precise, and efficient heat dissipation for the multi-heat-generating element array modules.

[0027] The liquid cooling plate body 1 is a rectangular metal plate made of a metal material with excellent thermal conductivity, preferably copper or aluminum alloy, which can quickly conduct the heat generated by the heating element to the working fluid in the heat exchange cavity. In this embodiment, the liquid cooling plate body 1 includes an upper cover plate 13 and a lower box body 14, which are fitted together and sealed to ensure good sealing between the inside and outside, preventing working fluid leakage. The interior of the liquid cooling plate body 1 has multiple heat exchange cavities 11 arranged at intervals, which are distributed along the length of the liquid cooling plate body 1. In this embodiment, eight heat exchange cavities 11 are used as an example, corresponding to eight heating elements (chips) arranged in a linear array. Each heat exchange cavity 11 is an independent closed cavity.

[0028] Each heat exchange cavity 11 has a heat exchange mating surface 12 at its bottom, and each heat exchange mating surface 12 is located directly below the corresponding heat exchange cavity 11. The heat exchange mating surface 12 can be a flat metal surface protruding from the bottom of the liquid cooling plate body 1.

[0029] The distributor 2 is located on one side of the liquid-cooled plate body 1. The distributor 2 includes a distributor body and multiple regulating valves disposed inside the distributor body; alternatively, the regulating valves may be disposed within each liquid inlet branch pipe 5. The number of regulating valves corresponds to the number of heat exchange chambers 11; in this embodiment, there are eight regulating valves. Figure 2 As shown in M1 to M8, each regulating valve is an electronic expansion valve or proportional regulating valve with independently controllable opening. The opening can be continuously adjusted between 0% and 100%, thereby precisely controlling the flow rate of the working fluid through the regulating valve. The main input end of the distributor 2 is connected to the output end of the pump 3 through a pipeline. The distributor body has a main flow channel inside, which distributes the liquid working fluid output by the pump 3 to the inlet of each regulating valve.

[0030] The heat exchange chambers 11 are arranged at intervals along the length of the liquid-cooled plate body 1, therefore the distances between each heat exchange chamber 11 and the distributor 2 are not exactly the same. The heat exchange chamber 11 located on the side of the liquid-cooled plate body 1 closer to the distributor 2 is the near-end heat exchange chamber, and its inlet branch pipe 5 is shorter; the heat exchange chamber 11 located on the side of the liquid-cooled plate body 1 further away from the distributor 2 is the far-end heat exchange chamber, and its inlet branch pipe 5 is longer. Due to the different pipe lengths, the friction resistance of the liquid working fluid in each inlet branch pipe 5 is also different, with the resistance of the inlet branch pipe 5 of the far-end heat exchange chamber being greater than that of the near-end heat exchange chamber. If the same regulating valve opening is used for each branch, the problem of excessive flow in the near-end heat exchange chamber and insufficient flow in the far-end heat exchange chamber will occur.

[0031] Each regulating valve's outlet is connected to its corresponding heat exchange chamber 11 via an inlet branch pipe 5. The inlet branch pipe 5 is a metal pipe or a pressure-resistant flexible hose; in this embodiment, it is preferably a copper or stainless steel pipe, and its diameter is determined according to the design flow rate of each heat exchange chamber. One end of the inlet branch pipe 5 is connected to the outlet of the regulating valve via a welded or compression fitting, and the other end is connected to the corresponding inlet port on the liquid cooling plate body 1 via a welded or threaded connection. The inlet port is connected to the interior of the heat exchange chamber 11. By independently adjusting the opening of each regulating valve, the resistance difference caused by the length difference of each inlet branch pipe 5 can be compensated. For the far-end heat exchange chamber, the opening of the corresponding regulating valve is increased to reduce local resistance and increase the working fluid flow rate entering the far-end heat exchange chamber; for the near-end heat exchange chamber, the opening of the corresponding regulating valve is appropriately reduced to avoid excessive flow. This ensures that each heat exchange chamber 11 can obtain a working fluid flow rate that matches the thermal load of the corresponding chip, guaranteeing that each chip in the array receives sufficient cooling working fluid.

[0032] Each heat exchange chamber 11 is connected to an outlet branch pipe 6 at its top, which extends upwards from the top of the heat exchange chamber 11. One end of the outlet branch pipe 6 is connected to the top of the heat exchange chamber 11, preferably at the highest point of the top of the heat exchange chamber 11, to facilitate the smooth discharge of the gas-liquid two-phase mixture and prevent gas from accumulating in the dead corner at the top of the heat exchange chamber 11. The diameter of the outlet branch pipe 6 is larger than that of the inlet branch pipe 5. This difference in pipe diameter is designed to accommodate the changes in volumetric flow rate of the gas-liquid two-phase mixture: after the liquid working fluid absorbs heat in the heat exchange chamber 11, it undergoes a phase change, generating a large number of bubbles and significantly increasing its specific volume. When the liquid fluorinated liquid changes to a gaseous state, its specific volume increases by approximately tens to hundreds of times. Therefore, a larger pipe diameter is required to ensure smooth flow of the gas-liquid mixture and to avoid excessively high flow rates and pressure drops due to an excessively small pipe diameter, which would affect the system's heat dissipation performance and energy efficiency.

[0033] This embodiment also includes a manifold 7, which is positioned above the liquid-cooled plate body 1. The manifold 7 is a hollow container made of a metal material, such as copper or stainless steel, and has a collection cavity inside. The bottom of the manifold 7 has multiple interfaces, the number of which corresponds to the number of heat exchange chambers 11; in this embodiment, there are eight interfaces. The upper end of each branch pipe 6 is connected to the manifold 7 through a corresponding interface, and the connection method can be welding or compression fitting. Each branch pipe 6 introduces the gas-liquid two-phase mixed fluid from each heat exchange chamber 11 into the collection cavity of the manifold 7 for convergence.

[0034] The top of the manifold 7 is equipped with a manifold outlet pipe 8, which communicates with the manifold cavity. The manifold outlet pipe 8 is a multi-port pipe, including one input section and two output sections in this embodiment. The input section is connected to the output interface on the top of the manifold 7, and the two output sections are respectively connected to the two input ends of the condenser 4. After the gas-liquid two-phase mixed fluid converges in the manifold cavity of the manifold 7, it is discharged uniformly through the manifold outlet pipe 8 and enters the condenser 4 in two separate paths. This disperses the entry path of the gas-liquid mixed fluid, making the heat exchange load in the condenser 4 more uniform and avoiding excessive local load on the condenser caused by the gas-liquid mixed fluid concentrating at a single inlet, thereby improving the heat exchange efficiency and service life of the condenser.

[0035] The condenser 4 is an air-cooled or water-cooled heat exchanger used to cool and liquefy the gaseous working fluid in the gas-liquid two-phase mixture. In this embodiment, the condenser 4 is exemplified as an air-cooled microchannel condenser, consisting of multiple parallel-arranged microchannel flat tubes and heat dissipation fins. The heat dissipation fins are arranged between adjacent microchannel flat tubes, and heat dissipation is achieved through forced convection by a fan. The condenser 4 has at least two input ends and one output end. The two input ends are respectively connected to the two output sections of the manifold 8, and the output end is connected to the input end of the pump 3 through a pipeline. After the gas-liquid two-phase mixture enters the condenser 4, it flows inside the microchannel flat tubes, dissipating heat to the surrounding air through the tube walls and fins. The gaseous working fluid releases heat and liquefies back into a low-temperature liquid working fluid, which flows out from the output end of the condenser 4 and enters the pump 3.

[0036] Pump 3 is preferably a gear pump or a miniature centrifugal pump. Gear pumps are characterized by stable flow rate, strong self-priming capability, and small size, making them suitable for the precise flow control requirements of this system. The input end of pump 3 is connected to the output end of condenser 4 via a pipeline, and the output end of pump 3 is connected to the main input end of distributor 2 via a pipeline. Pump 3 provides power to the entire circulation system, pressurizing the liquid working fluid and sending it into distributor 2.

[0037] The heat exchange medium used in this embodiment is a two-phase medium, preferably a fluorinated liquid, such as perfluorohexanone or perfluorotriethylamine, which are insulating liquids with suitable boiling points. The boiling point of the fluorinated liquid is generally between 50°C and 80°C, and a suitable boiling point can be selected based on the allowable operating temperature of the heating element (chip). Fluorinated liquids are non-conductive, chemically stable, non-toxic, odorless, safe, and reliable, making them suitable for direct cooling of electronic equipment. The medium is circulated within a closed-loop system, resulting in no loss and making it environmentally friendly.

[0038] Each heat exchange chamber 11 is also equipped with a temperature sensor and a flow sensor (not shown in detail in the figure). The temperature sensor is preferably a thermocouple or platinum resistance temperature sensor, attached to the inner wall or outlet of the heat exchange chamber 11, for real-time acquisition of the temperature data of the working fluid in each heat exchange chamber 11. The flow sensor is preferably a miniature turbine flow meter or a thermal mass flow meter, installed at the inlet branch pipe 5 or the inlet of each heat exchange chamber 11, for real-time acquisition of the inlet flow rate data of each heat exchange chamber 11. The temperature sensor and the flow sensor transmit the acquired data to an external controller. The controller adjusts the opening degree of the corresponding regulating valve and the output power of the pump 3 according to the temperature data of each heat exchange chamber 11, thereby realizing precise closed-loop control of the flow rate of each heat exchange chamber.

[0039] This embodiment also provides a heat dissipation method for a multi-module array-type two-phase liquid-cooled plate, which uses the above-mentioned multi-module array-type two-phase liquid-cooled plate device and includes the following steps: S1. The liquid working fluid is pressurized by pump 3 and then enters the distributor 2. Pump 3 draws low-temperature liquid working fluid from condenser 4, pressurizes it to the required system pressure, and then sends it into distributor 2.

[0040] S2, the distributor 2 independently distributes the liquid working fluid to each inlet branch pipe 5 through each regulating valve. The opening of each regulating valve is adjusted according to the heat load corresponding to each heat exchange chamber 11 to control the flow rate distributed to each heat exchange chamber. At the same time, considering the difference in distance between each heat exchange chamber 11 and the distributor 2, the inlet branch pipe 5 corresponding to the far heat exchange chamber is longer and has greater friction resistance, so the opening of the regulating valve corresponding to the far heat exchange chamber is appropriately increased; the inlet branch pipe 5 corresponding to the near heat exchange chamber is shorter and has less friction resistance, so the opening of the regulating valve corresponding to the near heat exchange chamber is appropriately decreased to compensate for the resistance difference caused by the difference in pipe length, and to avoid excessive flow in the near heat exchange chamber and insufficient flow in the far heat exchange chamber. Specifically, the controller collects temperature data from each heat exchange chamber 11 in real time. If the temperature of a heat exchange chamber 11 is higher than a preset threshold (e.g., 60℃), it indicates that the load on the corresponding heating element (chip) has increased. The controller then increases the opening of the corresponding regulating valve to increase the liquid inflow rate of that heat exchange chamber 11. Conversely, if the temperature of a heat exchange chamber 11 is lower than a preset threshold (e.g., 40℃), it indicates that the load on the corresponding heating element (chip) has decreased. The controller then decreases the opening of the corresponding regulating valve to reduce the liquid inflow rate of that heat exchange chamber 11. Simultaneously, the controller calculates the sum of the target flow rates of each inlet branch pipe 5 based on the changes in the opening of each regulating valve, and adjusts the output power of the pump 3 to maintain a balance between the total output flow rate of the pump 3 and the sum of the target flow rates of each branch. This reduces pump power while meeting heat dissipation requirements, avoids excessive pressure loss, and achieves energy-efficient and high-performance heat dissipation.

[0041] S3. The liquid working fluid enters the corresponding heat exchange chamber 11 through each inlet branch pipe 5, flows within the heat exchange chamber 11, and absorbs the heat conducted by the heating element (chip) attached to the heat exchange bonding surface 12. As the temperature of the liquid working fluid rises, it boils after reaching its saturation temperature, changing from a liquid to a gaseous state, generating a large number of bubbles, and forming a gas-liquid two-phase mixture. During the phase change process, the liquid working fluid absorbs a large amount of latent heat of vaporization, achieving efficient heat dissipation. Since each heat exchange chamber 11 is independently supplied with liquid, the flow rate of the working fluid in each heat exchange chamber 11 can be independently adjusted according to the actual heat load of the corresponding heating element (chip), and there will be no flow deviation due to changes in the load of other chips.

[0042] S4. The gas-liquid two-phase mixture in each heat exchange chamber 11 is discharged through the top outlet branch pipe 6. The gas-liquid two-phase mixture in each outlet branch pipe 6 first enters the manifold 7 for convergence. After the gas-liquid mixture in each branch is fully mixed in the manifold 7, it is discharged through the manifold outlet pipe 8. Since the diameter of the outlet branch pipe 6 is larger than the diameter of the inlet branch pipe 5, the gas-liquid mixture flows smoothly and no air blockage occurs.

[0043] S5. The combined gas-liquid two-phase mixture flows into condenser 4 via two separate outlet pipes (8 and 8). Inside condenser 4, the gaseous working fluid releases heat and liquefies back into a low-temperature liquid working fluid.

[0044] S6. The liquid working fluid flows out from the output end of the condenser 4 and returns to the input end of the pump 3 through the pipeline. The pump 3 pressurizes the liquid working fluid again and sends it into the distributor 2 to enter the next cycle. This process repeats, forming a continuous closed-loop two-phase phase change heat dissipation cycle.

Claims

1. A multi-module array-type two-phase liquid-cooled cold plate device, characterized in that, The system includes a liquid-cooled plate body (1), a distributor (2), a pump (3), and a condenser (4). The liquid-cooled plate body (1) has multiple heat exchange chambers (11) arranged at intervals inside. The bottom of the liquid-cooled plate body (1) has multiple heat exchange contact surfaces (12) corresponding to the positions of each heat exchange chamber (11). The distributor (2) has multiple regulating valves. The outlet of each regulating valve is connected to the corresponding heat exchange chamber (11) through an inlet branch pipe (5). The output end of the pump (3) is connected to the input end of the distributor (2). Each heat exchange chamber (11) has an outlet branch pipe (6) connected above it. After the outlet branch pipes (6) merge, they are connected to the input end of the condenser (4). The output end of the condenser (4) is connected to the input end of the pump (3).

2. The multi-module array type two-phase liquid-cooled cold plate device according to claim 1, characterized in that, It also includes a manifold (7), which is located above the liquid cooling plate body (1). The bottom of the manifold (7) has multiple interfaces. Each of the outgoing branch pipes (6) is connected to the manifold (7) through the corresponding interface. The manifold (7) connects the outgoing branch pipes (6) to the input end of the condenser (4) after they are combined.

3. The multi-module array type two-phase liquid-cooled cold plate device according to claim 2, characterized in that, The top of the manifold (7) is provided with a manifold outlet pipe (8), which is connected to the input end of the condenser (4).

4. The multi-module array type two-phase liquid-cooled cold plate device according to claim 3, characterized in that, The manifold (8) is a multi-port pipe, including at least one input section and at least two output sections. The input section is connected to the output end of the manifold (7), and the two output sections are connected to the input end of the condenser (4).

5. The multi-module array type two-phase liquid-cooled cold plate device according to claim 1, characterized in that, The diameter of the outlet branch pipe (6) is larger than the diameter of the inlet branch pipe (5).

6. The multi-module array type two-phase liquid-cooled cold plate device according to claim 1, characterized in that, Each of the heat exchange chambers (11) is equipped with a temperature sensor and a flow sensor.

7. The multi-module array type two-phase liquid-cooled cold plate device according to any one of claims 1 to 6, characterized in that, Each heat exchange cavity (11) is arranged at intervals along the length of the liquid cooling plate body (1), and each heat exchange bonding surface (12) is located directly below the corresponding heat exchange cavity (11).

8. A method for heat dissipation of a multi-module array-type two-phase liquid-cooled cold plate, characterized in that, The multi-module array-type two-phase liquid-cooled cold plate device as described in any one of claims 1-7 includes the following steps: S1. The liquid working fluid is pressurized by pump (3) and then enters the distributor (2); S2, the distributor (2) distributes the liquid working fluid to each inlet branch pipe (5) independently through each regulating valve, and adjusts the opening of each regulating valve according to the heat load corresponding to each heat exchange chamber (11) to control the flow rate distributed to each heat exchange chamber; S3. The liquid working fluid enters the corresponding heat exchange chamber (11) through each liquid inlet branch pipe (5). In the heat exchange chamber (11), it absorbs the heat of the heating element attached to the heat exchange bonding surface (12). After reaching the saturation temperature, a liquid-gas phase change occurs, generating a gas-liquid two-phase mixed fluid. S4. The gas-liquid two-phase mixed fluid in each heat exchange chamber (11) is discharged and merged through the outlet branch pipe (6); S5. The combined gas-liquid two-phase fluid enters the condenser (4), and the gas phase working fluid releases heat and liquefies back into the liquid working fluid. S6, the liquid working fluid flows back to pump (3) and enters the next cycle.

9. The multi-module array-type two-phase liquid-cooled plate heat dissipation method according to claim 8, characterized in that, The temperature of each heat exchange chamber (11) is collected. If the temperature of a heat exchange chamber is higher than the preset threshold, the opening of the corresponding regulating valve is increased to increase the liquid flow rate of the heat exchange chamber. If the temperature of a heat exchange chamber is lower than the preset threshold, the opening of the corresponding regulating valve is decreased to reduce the liquid flow rate of the heat exchange chamber. At the same time, the opening of the corresponding regulating valve is adjusted according to the distance difference between each heat exchange chamber (11) and the distributor (2). For the liquid inlet branch pipe (5) connected to the far end heat exchange chamber (11), the opening of the corresponding regulating valve is increased to compensate for the resistance caused by the long pipeline. For the liquid inlet branch pipe (5) connected to the near end heat exchange chamber (11), the opening of the corresponding regulating valve is decreased to avoid excessive flow. At the same time, the output power of the pump (3) is adjusted so that the sum of the target flow rates of each liquid inlet branch pipe (5) is balanced with the total flow rate output by the pump (3).

10. The multi-module array-type two-phase liquid-cooled plate heat dissipation method according to claim 8, characterized in that, In step S4, the gas-liquid two-phase mixed fluid in each heat exchange chamber (11) first enters the manifold (7) through the outlet branch pipe (6), and after converging in the manifold (7), it is discharged uniformly through the manifold outlet pipe (8).

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