An active temperature control method applied to temperature regulation of a communication cabinet

Abstract

The present application relates to the field of active temperature control of equipment in electronic communication cabinet, and particularly relates to an active temperature control method applied to temperature regulation of cabinet case of communication cabinet. A heat pipe platform is installed in the shell of the device, the heat pipe platform is composed of a heat conduction plate, a heat pipe, a heat sink and a frame part, the heat sink is arranged in the frame part in the vertical direction, the heat pipe is a multi-channel loop structure arranged in a circulating and reciprocating manner and penetrating through the left and right side plates of the frame part and the heat sink, the upper and lower extending ends of the heat pipe and the connecting pipeline on one side of the frame part are provided with the heat conduction plate, and one side of the heat conduction plate is provided with a TEC thermoelectric refrigerator. The heating resistance sheet is installed at the two ends of the top of the frame part, and the thermocouple is installed at the air outlet of the side surface of the frame part. The present application actively controls the temperature of the working communication equipment through the refrigeration and heating performance of the TEC, reduces the power consumption of the air conditioning and other cooling equipment for temperature rise and fall of the communication equipment during operation, and greatly reduces the power consumption cost.

Description

[0001] This application is a divisional application of a Chinese invention patent application. The original application was filed on November 13, 2023, with application number 202311506001.9 and invention title: Active temperature control device and method for regulating the temperature of communication cabinet chassis. Technical Field

[0002] This invention relates to the field of active temperature control for equipment in electronic communication cabinets, and specifically to an active temperature control method for regulating the temperature of communication cabinet chassis. Background Technology

[0003] Currently, the main cooling system used for communication equipment (BBU, etc.) is the air conditioning compressor system. In order to ensure the equipment operates continuously at a constant temperature, the air conditioning compressor system needs to work continuously to maintain the temperature inside the entire space. What's worse, the air conditioning equipment often fails during continuous operation, especially the old outdoor communication cabinets and enclosures, which have a high failure rate. Communication maintenance personnel need to perform maintenance and repairs frequently. The high electricity and maintenance costs bring a lot of trouble and trouble to equipment operation and maintenance companies, and have become a pain point in the entire industry.

[0004] Thermoelectric coolers (TECs) are made using the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon where, when a direct current passes through a circuit composed of two semiconductor materials, one end absorbs heat and the other releases heat. Bismuth telluride, doped with other elements in both N-type and P-type forms, is the main semiconductor material used in TECs. Bismuth telluride elements are connected in series electrically and in parallel thermally. A TEC consists of several pairs (groups) of P-type and N-type elements connected together by electrodes and sandwiched between two ceramic electrodes. When current flows through the TEC, heat is transferred from one side to the other, creating a "hot" side and a "cold" side on the TEC. This is the principle behind the heating and cooling of a TEC. Most importantly, TECs operate without noise or mechanical movement, relying on the directional movement of charge carriers within the material, resulting in high reliability and durability. Summary of the Invention

[0005] The purpose of this invention is to provide an active temperature control method for regulating the temperature of communication cabinets. This method only requires providing forward and reverse currents and heating resistors to enable the module to cool or heat the equipment.

[0006] To achieve the above objectives, the technical solution of the present invention is as follows:

[0007] An active temperature control device for regulating the temperature of a communication cabinet chassis includes a housing containing a heat pipe platform. The heat pipe platform consists of a heat-conducting plate, heat pipes, heat sinks, and a frame. The frame is a cuboid frame structure formed by four side plates (top, bottom, left, and right). Multiple heat sinks are arranged vertically within the frame and are parallel to each other. The heat pipes are multi-channel loop structures that pass through the left and right side plates and heat sinks of the frame and are arranged in a reciprocating pattern. Heat-conducting plates are installed on the upper and lower extension ends of the heat pipes and on the connecting pipes on one side of the frame. A TEC thermoelectric cooler is installed on one side of the heat-conducting plate. Heating resistance elements are installed at both ends of the top of the frame of the heat pipe platform, and thermocouples are installed at the air outlets on the sides of the frame of the heat pipe platform.

[0008] The active temperature control device for regulating the temperature of communication cabinets has an air inlet and an air outlet on its shell. An intake fan is installed on one side of the heat pipe platform, corresponding to the heat pipe and heat sink of the heat pipe platform. The intake fan is installed at the air inlet of the shell. A heat sink and an exhaust fan are installed sequentially on one side of the TEC thermoelectric cooler. A heat conduction plate and a heat sink are connected to both sides of the TEC thermoelectric cooler, and the exhaust fan is installed at the air outlet of the shell.

[0009] The active temperature control device applied to the temperature regulation of communication cabinets and chassis includes a TEC thermoelectric cooler connected to a TEC temperature controller via a circuit. The current of the TEC thermoelectric cooler is controlled by the TEC temperature controller. By controlling the direction of the current, the hot and cold surfaces of the TEC thermoelectric cooler are transformed into each other, the heat pipe platform is transformed into a heat dissipation platform, and the heat sink is transformed into a cooling block.

[0010] The active temperature control device used for temperature regulation of communication cabinets has a heat insulation material layer at the connection between the heat pipe platform and the shell.

[0011] The active temperature control device for regulating the temperature of communication cabinets and chassis includes a heating resistor connected to a TEC temperature controller via a circuit, and a thermocouple connected to the temperature measurement interface of the TEC temperature controller via a circuit, serving as the sensing device of the TEC temperature controller.

[0012] The active temperature control device used for temperature regulation of communication cabinets has a heat pipe platform that is bolted to the housing.

[0013] The active temperature control device used for temperature regulation of communication cabinets and chassis has heating resistors connected to the heat pipe platform by adhesive bonding or welding.

[0014] The active temperature control device for regulating the temperature of communication cabinets and chassis uses a colloid with good thermal conductivity to connect both sides of the TEC thermoelectric cooler to the heat conduction plate and the heat sink.

[0015] An active temperature control method for regulating the temperature of a communication cabinet chassis includes the following steps:

[0016] (1) When the thermocouple senses that the external temperature is higher than the set temperature, the TEC temperature controller controls the TEC thermoelectric cooler to work. At this time, the heating resistance element does not work. Due to the Peltier effect, the cold surface of the TEC thermoelectric cooler absorbs heat, which in turn drives the heat pipe platform to absorb the heat around it. The air intake fan blows the cooled air into the air intake of the equipment that needs to be cooled, so as to achieve the purpose of cooling it. At the same time, the hot surface of the TEC thermoelectric cooler dissipates heat, which is carried away by the heat sink and finally transported to the outside of the equipment by the exhaust fan.

[0017] (2) When the thermocouple senses that the external temperature is lower than the set temperature, the TEC temperature controller controls the input of reverse current to the TEC thermoelectric cooler and the heating resistance element. Due to the Peltier effect, the cold surface of the TEC thermoelectric cooler is transformed into a hot surface, and the heat dissipation drives the heat pipe platform to raise the temperature of the air around it. The intake fan blows the hot air with the increased temperature into the air inlet of the equipment that needs to be insulated, so as to achieve the purpose of keeping it warm. At the same time, the cold surface of the TEC thermoelectric cooler absorbs heat, which is carried away by the heat sink and finally delivered to the outside of the equipment by the exhaust fan.

[0018] The active temperature control method applied to the temperature regulation of communication cabinets uses a heat pipe platform made of metal heat pipes or aluminum heat sinks.

[0019] The design concept of this invention is:

[0020] This invention includes a housing, a TEC thermoelectric cooler, a heat pipe platform, a heating resistance element, a thermocouple, a TEC temperature controller, an intake fan, a heat sink, and an exhaust fan. It utilizes the characteristics of TEC cooling or reverse current heating, combined with the heating resistance element. The TEC temperature controller, equipped with a temperature sensor, measures the outlet temperature to control the current direction, magnitude, and activation of the heating resistance element. During the cooling process, the fan delivers air from the cold surface area to the device requiring cooling. During the heating process, the current direction is changed to activate the heating element, delivering air from the hot surface area to the device requiring heating, thereby regulating the internal temperature of the communication cabinet. By comparing the temperature measured by the sensing unit with the set temperature, the controller intermittently supplies power to the TEC thermoelectric cooler and the heating resistance element, improving energy efficiency.

[0021] Compared with existing technologies, the advantages and beneficial effects of the present invention are as follows:

[0022] 1. The active temperature control device for regulating the temperature of the communication cabinet chassis of the present invention uses very low power consumption and achieves high stability and good temperature control effect through a closed-loop control circuit, which greatly saves electricity costs.

[0023] 2. The heat pipe platform of this invention adopts a multi-channel loop structure, and by controlling the input voltage and current, the temperature difference between the hot and cold surfaces of the TEC thermoelectric cooler in the module can be controlled within the optimal operating range, thereby improving its working efficiency.

[0024] 3. After the reverse current is applied and the external heating resistor is activated, the working environment of the equipment can be heated, which can completely replace the temperature control system of the air conditioner compressor. Attached Figure Description

[0025] Figure 1 This is an overall appearance view of the present invention.

[0026] Figure 2 This is a three-dimensional structural diagram of the present invention.

[0027] Figure 3 This is a schematic diagram of a heat pipe platform (which generates heat when powered in reverse) and its related structures.

[0028] In the diagram, 1. Housing, 2. Intake fan, 3. Heating resistor, 4. Heat pipe platform, 5. TEC thermoelectric cooler, 6. TEC temperature controller, 7. Exit fan, 8. Heat sink, 9. Thermocouple, 10. Heat conduction plate, 11. Heat pipe, 12. Heat sink, 13. Frame. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] Reference Figures 1-3This invention proposes an active temperature control device for regulating the temperature of a communication cabinet chassis. The overall structure of the device includes a housing 1, in which a heat pipe platform 4 is installed. The installation method is not limited to bolts or other connection methods. The heat pipe platform 4 consists of a heat-conducting plate 10, heat pipes 11, heat sinks 12, and a frame part 13. The frame part 13 is a cuboid frame structure formed by four side plates: upper, lower, left, and right. The heat sinks 12 are arranged vertically within the frame part 13, and multiple heat sinks 12 are arranged in parallel to each other. The heat pipes 11 are multi-channel loop structures that pass through the left and right side plates of the frame part 13 and the heat sinks 12 and are arranged in a cyclic reciprocating pattern. The heat-conducting plate 10 is installed on the upper and lower protruding ends of the heat pipes 11 and on the connecting pipes on one side of the frame part 13. A TEC thermoelectric cooler 5 is installed on one side of the heat-conducting plate 10. Heating resistance plates 3 are installed at both ends of the top of the frame part 13 of the heat pipe platform 4. The heating resistance plates 3 are connected to the heat pipe platform 4 by adhesive or welding. Thermocouples 9 are installed at the air outlet on the side of the frame part 13 of the heat pipe platform 4.

[0031] The housing 1 is provided with an air inlet and an air outlet. An air intake fan 2 is installed on one side of the heat pipe platform 4. The air intake fan 2 corresponds to the heat pipe 11 and heat sink 12 of the heat pipe platform 4. The air intake fan 2 is installed at the air inlet of the housing 1. A heat sink 8 and an air outlet fan 7 are installed in sequence on one side of the TEC thermoelectric cooler 5. The heat conduction plate 10 and the heat sink 8 are connected to both sides of the TEC thermoelectric cooler 5, respectively. The connection method is not limited to using a colloid or other connection method with good thermal conductivity. The air outlet fan 7 is installed at the air outlet of the housing 1.

[0032] The TEC thermoelectric cooler 5 is connected to the TEC temperature controller 6 via a circuit. The current to the TEC thermoelectric cooler 5 is controlled by the TEC temperature controller 6. By controlling the direction of the current, the hot and cold sides of the TEC thermoelectric cooler 5 are interchanged, the heat pipe platform 4 becomes a heat dissipation platform, and the heat sink 8 becomes a cooling block. An insulating material layer is present at the connection between the heat pipe platform 4 and the housing 1 to prevent heat transfer. The heating resistance element 3 is connected to the TEC temperature controller 6 via a circuit and is energized when the equipment needs to be heated. Thermocouple 9 is connected to the temperature measurement interface of the TEC temperature controller 6 via a circuit to monitor the outlet temperature in real time, serving as the sensing device for the TEC temperature controller 6 to meet the temperature requirements of different equipment.

[0033] When thermocouple 9 senses that the external temperature is higher than the set temperature, it controls the TEC thermoelectric cooler 5 to operate via the TEC temperature controller 6 (at this time, the heating resistance element 3 is not working). Due to the Peltier effect, the cold surface of the TEC thermoelectric cooler 5 absorbs heat, which in turn drives the heat pipe platform 4 to absorb heat from its surroundings. The intake fan 2 blows the cooled air into the air inlet of the equipment that needs cooling, thus achieving the purpose of cooling it. At the same time, the hot surface of the TEC thermoelectric cooler 5 dissipates heat, which is carried away by the heat sink 8 and finally transported to the outside of the equipment by the exhaust fan 7.

[0034] When thermocouple 9 senses that the external temperature is lower than the set temperature, it controls the TEC thermoelectric cooler 5 and the heating resistor 3 to input a reverse current through the TEC temperature controller 6. Due to the Peltier effect, the cold side of the TEC thermoelectric cooler 5 becomes the hot side, dissipating heat and causing the heat pipe platform 4 to raise the temperature of the surrounding air. The intake fan 2 blows the heated air into the air inlet of the equipment that needs to be insulated, achieving the purpose of heat preservation. At the same time, the cold side of the TEC thermoelectric cooler 5 absorbs heat, which is carried away by the heat sink 8 and finally delivered to the outside of the equipment by the exhaust fan 7.

[0035] The heat pipe platform 4 is made of metal products with good heat transfer efficiency, including heat pipes and aluminum heat sinks. When the TEC thermoelectric cooler 5 is subjected to positive current, it can effectively absorb and dissipate the heat of the air.

[0036] The results show that this invention utilizes the cooling and heating performance of the TEC (Thermal Design Equipment) to actively control the temperature of communication equipment during operation. The TEC temperature controller controls the heating and cooling process by changing the direction and magnitude of the current, the voltage, and the energizing time. This reduces the power consumption of communication equipment that requires cooling devices such as air conditioners, significantly lowering electricity costs and demonstrating high practicality and market value.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An active temperature control method for regulating the temperature of a communication cabinet chassis, characterized in that, Includes the following steps: (1) When the thermocouple (9) senses that the external temperature is higher than the set temperature, the TEC temperature controller (6) controls the TEC thermoelectric cooler (5) to work. At this time, the heating resistance (3) does not work. Due to the Peltier effect, the cold surface of the TEC thermoelectric cooler (5) absorbs heat, which in turn drives the heat pipe platform (4) to absorb the heat around it. The intake fan (2) blows the cooled air into the air inlet of the equipment that needs to be cooled, so as to achieve the purpose of cooling it. At the same time, the hot surface of the TEC thermoelectric cooler (5) dissipates heat, which is carried away by the heat sink (8) and finally transported to the outside of the equipment by the exhaust fan (7). (2) When the thermocouple (9) senses that the external temperature is lower than the set temperature, the TEC temperature controller (6) controls the TEC thermoelectric cooler (5) and the heating resistance plate (3) to input reverse current. Due to the Peltier effect, the cold surface of the TEC thermoelectric cooler (5) is transformed into a hot surface, and the heat dissipation drives the heat pipe platform (4) to increase the temperature of the air around it. The air intake fan (2) blows the hot air with the increased temperature into the air intake of the equipment that needs to be insulated, so as to achieve the purpose of heat preservation. At the same time, the cold surface of the TEC thermoelectric cooler (5) absorbs heat, which is carried away by the heat sink (8) and finally delivered to the outside of the equipment by the air exhaust fan (7). The overall structure of the device used in this method includes a shell (1), in which a heat pipe platform (4) is installed. The heat pipe platform (4) consists of a heat-conducting plate (10), a heat pipe (11), a heat sink (12), and a frame part (13). The frame part (13) is a cuboid frame structure formed by four side plates: upper, lower, left, and right. The heat sink (12) is vertically arranged inside the frame part (13), and multiple heat sinks (12) are arranged in parallel to each other. The heat pipe (11) passes through the frame part. The left and right side plates and heat sinks (12) of the heat pipe platform (4) are arranged in a multi-channel loop structure with a reciprocating arrangement. The heat pipe (11) is extended at the top and bottom, and a heat-conducting plate (10) is installed on the connecting pipe on one side of the frame part (13). A TEC thermoelectric cooler (5) is installed on one side of the heat-conducting plate (10). Heating resistance plates (3) are installed at both ends of the top of the frame part (13) of the heat pipe platform (4). A thermocouple (9) is installed at the air outlet on the side of the frame part (13) of the heat pipe platform (4).

2. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The housing (1) is provided with an air inlet and an air outlet. An air inlet fan (2) is installed on one side of the heat pipe platform (4). The air inlet fan (2) corresponds to the heat pipe (11) and heat sink (12) of the heat pipe platform (4). The air inlet fan (2) is installed at the air inlet of the housing (1). A heat sink (8) and an air outlet fan (7) are installed on one side of the TEC thermoelectric cooler (5). A heat conduction plate (10) and a heat sink (8) are connected to both sides of the TEC thermoelectric cooler (5). The air outlet fan (7) is installed at the air outlet of the housing (1).

3. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The TEC thermoelectric cooler (5) is connected to the TEC temperature controller (6) via a line. The current of the TEC thermoelectric cooler (5) is controlled by the TEC temperature controller (6). By controlling the direction of the current, the hot and cold surfaces of the TEC thermoelectric cooler (5) are transformed into each other, the heat pipe platform (4) is transformed into a heat dissipation platform, and the heat sink (8) is transformed into a cooling block.

4. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, A heat insulation material layer is provided at the connection between the heat pipe platform (4) and the shell (1).

5. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The heating resistance element (3) is connected to the TEC temperature controller (6) via a line, and the thermocouple (9) is connected to the temperature measurement interface of the TEC temperature controller (6) via a line, serving as the sensing device of the TEC temperature controller (6).

6. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The heat pipe platform (4) is bolted into the housing (1).

7. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The heating resistance element (3) is connected to the heat pipe platform (4) by adhesive bonding or welding.

8. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The two sides of the TEC thermoelectric cooler (5) are connected to the heat-conducting plate (10) and the heat sink (8) respectively using a colloid with good thermal conductivity.

9. The active temperature control method for adjusting the temperature of a communication cabinet chassis according to claim 1, characterized in that, The heat pipe platform is made of metal heat pipes or aluminum heat sinks.

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