Combined radiator, electric control box and refrigeration system

Abstract

The application provides a combined heat sink, an electric control box and a refrigeration system. The combined heat sink comprises a heat bottom plate, a plurality of mounting nuts fixed to the periphery of the heat contact top surface of the heat bottom plate, a protective shell, the top of the protective shell being an open side, the bottom wall of the protective shell opposite to the open side being a support side, the middle part of the support side being provided with an opening, the support side being supported on the heat contact top surface and each mounting nut passing through a plurality of displacement through holes provided in the periphery of the support side and matched with the shape of the mounting nut, a plurality of hollow insulation columns abutting against the heat contact top surface and respectively sleeved outside each mounting nut, the top end of the hollow insulation column being higher than the top end of the mounting nut, a circuit board provided inside the protective shell and placed on the top end of each hollow insulation column, the circuit board being provided with a plurality of fixing holes matched with each hollow insulation column, and a plurality of threaded fasteners respectively passing through the corresponding fixing holes, hollow insulation columns and mounting nuts. The combined heat sink has the advantages of easy maintenance, low cost, high heat dissipation and high strength.

Description

Technical Field

[0001] This invention relates to the field of air conditioning technology, and in particular to a combined radiator, electrical control box, and refrigeration system. Background Technology

[0002] In the field of industrial automation, the electrical control box is the core control unit of equipment such as refrigeration systems. It integrates high-power-density electronic components such as frequency converter drive boards, PLC motherboards, and power modules. These electronic components generate a large amount of heat during operation. If this heat cannot be dissipated in time, the component temperature will rise, leading to performance degradation, shortened lifespan, or even burnout. Electrical control boxes typically use liquid-cooled or air-cooled radiators for heat dissipation. Liquid-cooled radiators, due to their high heat exchange efficiency, are increasingly widely used in high-power-density equipment.

[0003] Currently, there are two main traditional approaches to liquid cooling solutions for high-power-density industrial control equipment: 1. Split plastic housing heat dissipation: The PCB board is first installed in an injection-molded plastic housing, and then the entire plastic housing is mounted on a separate metal heat sink. However, because plastic is a poor conductor of heat, its high thermal resistance severely hinders the heat conduction path from the PCB board to the heat sink, resulting in low heat dissipation efficiency. In addition, plastic materials are prone to fatigue deformation under long-term vibration, leading to low mechanical strength of the plastic housing, easy cracking or loosening of mounting holes, which in turn increases the risk of stress on internal precision electronic components and affects their reliability. 2. All-aluminum integrated heat sink: This heat sink is made of aluminum alloy through CNC machining or extrusion molding into a single structure, with the PCB board directly embedded or fixed in the aluminum structure. Its advantages are the elimination of the intermediate heat insulation layer, high heat dissipation efficiency due to the excellent thermal conductivity of aluminum alloy, high structural strength, and no risk of welding leaks. However, these all-aluminum integrated heat sinks also have drawbacks such as high cost and high cost of aluminum alloy materials and CNC machining, which are not conducive to promotion. In addition, once a part of the heat sink structure (such as the side wall) is damaged due to severe vibration or external impact, the entire expensive heat sink assembly often needs to be replaced. For PCB boards that are fixed with potting compound, if the heat sink is damaged and the potting compound is exposed or the substrate is deformed, the entire circuit board is scrapped and cannot be repaired separately, so maintenance is difficult and extremely costly.

[0004] Furthermore, when fixing PCB boards to traditional metal heat sinks, screws are typically used to directly pass through the mounting holes on the PCB and tighten onto the metal base plate. This method presents the following serious safety hazards: 1. Risk of electrical short circuits: Copper shavings or damaged solder mask layers can easily remain at the drilled holes on the PCB board, causing electrical connections between the PCB board and the grounded metal base plate / screws, leading to short circuits or signal interference; 2. Stress concentration in rigid connections: Rigid screws directly tightened under vibration can easily cause the PCB board to crack; 3. Poor insulation reliability of gasket or bushing connections: Traditional screw connections rely on independent insulating gaskets or bushings, which are prone to loss, displacement, or failure due to aging during assembly. These components often require additional countersunk or through-hole machining on the aluminum plate, increasing mold costs and processing steps. Summary of the Invention

[0005] This invention proposes a combined radiator, electrical control box, and refrigeration system to solve the technical problem of high processing and maintenance costs of liquid-cooled radiator structures in existing electrical control boxes.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0007] This invention provides a combined radiator, comprising:

[0008] Heat dissipation base plate;

[0009] Several mounting nuts are fixed to the periphery of the heat dissipation contact top surface of the heat dissipation base plate;

[0010] The protective housing has an open top and a support side on the bottom wall facing away from the open side. The support side has an opening in the middle and is supported on the heat dissipation contact top surface. Each mounting nut passes through several clearance through holes located around the perimeter of the support side and matching the shape of the mounting nut.

[0011] Several hollow insulating columns abut against the heat dissipation contact top surface and are respectively sleeved on the outside of each mounting nut, with the top of the hollow insulating column protruding above the top of the mounting nut;

[0012] The circuit board is located inside the protective housing and placed on the top of each hollow insulating post, and the circuit board has several fixing holes that match each hollow insulating post respectively.

[0013] Several threaded fasteners are respectively inserted into the corresponding fixing holes, hollow insulating columns and mounting nuts.

[0014] Preferably, the threaded fastener is a screw, with the screw shank passing through the corresponding fixing hole, hollow insulating post, and mounting nut, and the radial dimension of the screw head being larger than the diameter of the fixing hole.

[0015] Furthermore, the combined radiator also includes:

[0016] An insulating gasket is fitted onto the outside of the screw and placed between the head and the edge of the corresponding fixing hole on the circuit board.

[0017] Preferably, the inner diameter of the hollow insulating post is larger than the outer diameter of the mounting nut, and the inner diameter of the hollow insulating post is smaller than the diameter of the fixing hole, while the outer diameter of the hollow insulating post is larger than the diameter of the fixing hole.

[0018] Preferably, the mounting nut is riveted to the periphery of the heat dissipation contact top surface.

[0019] Preferably, the heat dissipation base plate, protective shell and circuit board are all rectangular, and four mounting nuts are respectively fixed at the four corners of the heat dissipation contact top surface of the heat dissipation base plate.

[0020] Preferably, the sidewall of the protective housing is provided with several potting ports, which are connected to the floating gap formed between the back side of the circuit board facing away from the open side and the top surface of the heat dissipation contact. The potting ports are used to pot thermally conductive adhesive into the floating gap.

[0021] Preferably, the heat dissipation base plate has a heat dissipation channel inside, and the base plate mounting surface facing away from the heat dissipation contact top surface has an inlet and an outlet that are respectively connected to the heat dissipation channel.

[0022] Preferably, at least one sidewall of the protective housing is provided with a folded edge that bends and extends toward the wall surface of the adjacent sidewall at the junction with the adjacent sidewall, and the end of the folded edge is spot-welded to the wall surface of the adjacent sidewall.

[0023] The present invention also provides an electrical control box, including a box body and the above-mentioned combined radiator. A plurality of mounting feet are provided at the junction of the side wall of the protective shell and the supporting side, and the mounting feet are used to connect with the box body.

[0024] The present invention also provides a refrigeration system, including the above-described electrical control box.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The combined heat sink provided by this invention adopts a brand-new heat dissipation solution, which combines the easy maintenance and low cost advantages of the split heat sink structure with the high heat dissipation efficiency and high mechanical strength performance of the integrated metal structure. It does not require additional machining of the heat sink base plate and ensures that the PCB board and the metal structure are completely insulated. Attached Figure Description

[0027] To more clearly illustrate the technical solution proposed by this invention, the invention will be described in detail below with reference to embodiments and accompanying drawings. It should be understood that the embodiments and drawings described in the following detailed description and specification are merely some embodiments of this invention, and those skilled in the art can make changes to these drawings within the framework of this invention.

[0028] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the combined heat sink of the present invention;

[0029] Figure 2 for Figure 1 A top view of an embodiment of the combined radiator;

[0030] Figure 3 for Figure 1 A cross-sectional view of the combined radiator along the AA direction.

[0031] Figure 4 for Figure 3 A magnified schematic diagram of the local structure of region B in the diagram;

[0032] Figure 5 This is a top view of the heat dissipation base plate of an embodiment of the combined heat sink of the present invention;

[0033] Figure 6 This is a bottom view of the heat dissipation base plate of an embodiment of the combined heat sink of the present invention.

[0034] Figure 7 This is a bottom view (not transparent) of the heat dissipation base plate of an embodiment of the combined heat sink of the present invention.

[0035] Figure 8 This is a side view of the heat dissipation base plate of an embodiment of the combined heat sink of the present invention;

[0036] Figure 9 This is a three-dimensional structural diagram of the protective shell of an embodiment of the combined radiator of the present invention;

[0037] Figure 10 This is a top view of the protective casing of an embodiment of the combined radiator of the present invention;

[0038] Figure 11 This is a three-dimensional structural diagram of a circuit board according to an embodiment of the combined heat sink of the present invention.

[0039] The main markings in the attached figures are as follows:

[0040] 1. Heat dissipation base plate; 11. Heat dissipation contact top surface; 12. Base plate mounting bottom surface; 13. Heat dissipation flow channel; 14. Liquid inlet; 15. Liquid outlet; 16. Sealing groove;

[0041] 2. Install the nuts;

[0042] 3. Protective outer shell; 31. Open side; 32. Bottom wall; 321. Opening; 322. Clearance through hole; 33. Side wall; 331. Folded edge; 34. Floating gap;

[0043] 4. Hollow insulating column;

[0044] 5. Circuit board; 51. Mounting hole; 52. Heating element;

[0045] 6. Threaded fastener; 61. Head; 62. Screw;

[0046] 7. Insulating gaskets;

[0047] 8. Glue dispensing port;

[0048] 9. Install the foot pads; 91. Connect the through holes. Detailed Implementation

[0049] To make the technical problem to be solved, the technical solution and the beneficial effects of the present invention clearer, the following description is provided in conjunction with the appendix. Figure 1-11 The present invention will be further described in detail below with reference to the embodiments.

[0050] Please refer to the following: Figure 1-11 The combined heat sink provided by the present invention includes:

[0051] Heat dissipation base plate 1;

[0052] Several mounting nuts 2 are fixed to the periphery of the heat dissipation contact top surface 11 of the heat dissipation base plate 1;

[0053] The protective shell 3 has an open side 31 at the top and a support side 32 at the bottom facing away from the open side 31. The support side has an opening 321 in the middle and is supported on the heat dissipation contact top surface 11. Each mounting nut 2 passes through a number of clearance through holes 322 located around the periphery of the support side and matching the shape of the mounting nut 2.

[0054] Several hollow insulating columns 4 abut against the heat dissipation contact top surface 11 and are respectively sleeved on the outside of each mounting nut 2, and the top of the hollow insulating column 4 is higher than the top of the mounting nut 2;

[0055] Circuit board 5 is located inside the protective housing 3 and placed on the top of each hollow insulating post 4. Circuit board 5 is provided with a number of fixing holes 51 that match each hollow insulating post 4 respectively.

[0056] Several threaded fasteners 6 are respectively inserted into the corresponding fixing holes 51, hollow insulating columns 4 and mounting nuts 2.

[0057] Therefore, the combined heat sink provided by the present invention mainly consists of three parts: a heat dissipation base plate 1 as the core of heat exchange, a protective shell 3 as the structural support and protective housing, and a circuit board 5 fixed inside the protective shell 3. The three parts are connected separately, achieving the best balance between heat dissipation, insulation and mechanical strength.

[0058] Since the protective housing 3 can be made of sheet metal, the combined heat sink solves the problems of high thermal resistance and high device junction temperature caused by the poor thermal conductivity of traditional plastic housing heat sinks, and avoids obstruction of the heat dissipation path.

[0059] Furthermore, the combined heat sink provided by this invention abandons the traditional process of milling insulating grooves and drilling insulating holes on the aluminum alloy base plate. Instead, it uses mounting nuts 2 (such as standard press-fit nuts) to be directly and vertically riveted to the aluminum alloy surface of the flat heat sink base plate 1 (such as aluminum alloy heat sink base plate 1). A low-cost hollow insulating post 4 (such as standard injection-molded hollow insulating post 4) is sleeved outside each press-fit nut (mounting nut 2). The hollow insulating post 4 wraps around the metal press-fit nut like a sleeve, so that the back of the circuit board 5 (such as PCB board) only contacts the plastic hollow insulating post 4. The front of the circuit board 5 can be further isolated from the threaded fasteners 6 (such as screws) by insulating gaskets 7 (such as plastic gaskets). Thus, absolute electrical isolation between the circuit board 5 and the metal components is achieved without compromising the integrity of the heat sink base plate 1. According to actual comparison, compared with the traditional aluminum alloy base plate with insulating groove solution, the processing time of the aluminum alloy base plate of this combined heat sink can be reduced by more than 70%, which significantly simplifies the manufacturing process and reduces production costs and cycle time.

[0060] Meanwhile, the sheet metal shell of the protective shell 3, the hollow insulating column 4 and the matching insulating gasket 7, and the aluminum alloy heat dissipation base plate 1 of the combined radiator provided by the present invention can all be replaced independently in a modular manner. In particular, the replacement of the hollow insulating column 4 and the matching insulating gasket 7 is very convenient. There is no need to disassemble the circuit board 5. Just loosen the threaded fasteners 6 (such as screws) to remove the hollow insulating column 4 and the insulating gasket 7 and install new replacement parts. The maintenance time can be shortened to minutes, which reduces the maintenance cost of the radiator throughout its entire life cycle, ensures convenient and economical maintenance, and solves the problem that traditional all-aluminum integrated radiators need to be replaced as a whole after partial damage, which is costly and wasteful of resources.

[0061] Please refer to the following: Figure 1 , 3 -8. In one embodiment of the combined heat sink provided by the present invention, the heat sink base plate 1 is made of aluminum alloy sheet in 6061-T6 condition. This material has excellent thermal conductivity and good machinability and corrosion resistance. Using aluminum alloy material can achieve the best balance between cost, weight, machinability and thermal conductivity of the heat sink base plate 1.

[0062] In other embodiments of the combined heat sink provided by this invention, the heat sink base plate 1 can also be made of other non-aluminum alloy materials, such as copper and its alloys, which have the advantages of high heat dissipation efficiency and good temperature rise control; diamond composite material, which is one of the materials with the best thermal conductivity known to date, can be used for local coverage of key heat-generating points or as a thin layer composite on the substrate of the heat sink base plate 1; aluminum nitride ceramic material, which has a high thermal conductivity (close to aluminum), is itself insulating, thus simplifying the insulation structure and has the advantages of high temperature resistance; other materials with high thermal conductivity, such as silver, graphite sheets / graphene composite plates, etc.; in addition, a combination scheme can also be adopted, such as an aluminum alloy base + a surface coated with other materials with high thermal conductivity, etc.

[0063] Please refer to the following: Figure 2-4 10. In one embodiment of the combined radiator provided by the present invention, the mounting nut 2 is riveted to the periphery of the heat dissipation contact top surface 11, that is, the mounting nut 2 is a press-fit nut.

[0064] Specifically, the combined heat sink provided by this invention has four fixing holes 51 at the four corners of the PCB board (circuit board 5) on the bottom of the sheet metal protective shell 3. These holes are pre-riveted vertically to the heat dissipation contact top surface 11 of the heat sink base plate 1 using hydraulic tools. During riveting, it is ensured that the bottom surface of the rivet nut (mounting nut 2) is completely in contact with the heat dissipation contact top surface 11 of the heat sink base plate 1. This step eliminates the need for any additional drilling or tapping operations on the heat sink base plate 1, greatly simplifying the processing technology of the heat sink base plate 1.

[0065] Please refer to the following: Figure 2-4 In one embodiment of the combined radiator provided by the present invention, the threaded fastener 6 is a screw, and the screw shank 62 is respectively inserted into the corresponding fixing hole 51, hollow insulating post 4 and mounting nut 2. The radial dimension of the screw head 61 is larger than the hole diameter of the fixing hole 51.

[0066] In one embodiment of the combined radiator provided by the present invention, the threaded fastener 6 can also be a bolt, such as an M4 or M6 bolt.

[0067] In one embodiment of the combined heat sink provided by the present invention, to ensure good heat conduction efficiency, the heat dissipation contact top surface 11 of the heat dissipation base plate 1 undergoes surface polishing treatment to keep the area absolutely flat. This eliminates microscopic gaps on the heat dissipation contact top surface 11 of the heat dissipation base plate 1, maximizing the effective heat conduction area; ensures uniform thickness of the heat conduction interface material; and ensures that the flat surface of the heat dissipation base plate 1 guarantees uniform distribution of silicone grease or pads across the entire bottom surface of the circuit board 5, forming a constant and extremely thin heat conduction layer. This is key to achieving efficient heat dissipation and ensures uniform distribution of mechanical clamping force during the fastening process of the circuit board 5, preventing warping and deformation of the circuit board 5 and fatigue damage to the solder joints of the circuit board 5.

[0068] Please refer to the following: Figure 1-4 In one embodiment of the combined radiator provided by the present invention, the combined radiator further includes:

[0069] An insulating washer 7 is fitted onto the outside of the screw shank 62 and is placed between the head 61 of the screw and the edge of the corresponding fixing hole 51 of the circuit board 5.

[0070] Therefore, the combined heat sink provided by this invention completely eliminates the risk of electrical short circuit between the circuit board 5 (such as a PCB board) and the sheet metal (metal) heat sink without requiring additional drilling or milling of the aluminum alloy heat sink base plate 1, thus improving the reliability of electrical insulation and ensuring the safe operation of the heat sink in high-pressure environments. Through the physical wrapping of the hollow insulating column 4 and the isolation of the plastic insulating gasket 7, the electrical connection between the circuit board 5 and the metal heat sink and the metal threaded fastener 6 is completely disconnected. Even if there are burrs at the PCB drilling points or damage to the solder mask layer, a short circuit will not occur, enabling the heat sink to meet safety standards and making it particularly suitable for high-pressure, high-noise industrial environments.

[0071] Furthermore, the combined radiator provided by this invention simplifies the assembly process of the radiator's insulation fixing structure, avoids the use of easily lost independent insulation bushings, and reduces the difficulty of radiator production assembly and manufacturing process costs.

[0072] Meanwhile, the combined heat sink provided by this invention provides strong structural support through the protective shell 3 made of stainless steel / carbon steel sheet metal, resisting vibration deformation; a plastic insulating pad 7 is set at the fixing hole 51 on the front of the circuit board 5 (such as PCB board), which together with the plastic hollow insulating column 4 at the bottom forms a "double-layer plastic buffer clamping structure"; the plastic hollow insulating column 4 and the insulating pad 7 act as elastic medium elements, absorbing vibration energy, with excellent shock resistance and mechanical stress dispersion, thereby avoiding direct pressure on the PCB substrate by rigid screws, preventing stress damage such as PCB cracking and solder joint fatigue detachment, and extending the service life of the equipment in harsh vibration environments. Therefore, this combined heat sink significantly improves the mechanical reliability of the heat sink in harsh vibration environments.

[0073] Furthermore, the modular heat sink provided by this invention adopts a modular, maintainable, and flexible buffer connection mechanism. Its aluminum alloy heat sink base 1 and sheet metal protective shell 3 can be connected by screws, and the two are completely decoupled. When the sheet metal protective shell 3 is damaged, only the inexpensive sheet metal parts need to be replaced; when the plastic hollow insulating pillars 4 and insulating gaskets 7 age, only the inexpensive injection molded parts need to be replaced, without having to replace the expensive aluminum alloy heat sink base 1 and PCB board.

[0074] Please refer to the following: Figure 2-410. In one embodiment of the combined radiator provided by the present invention, the hollow insulating column 4 is a hollow cylinder injection molded from flame-retardant and high-temperature resistant PBT material.

[0075] In other embodiments of the combined heat sink provided by the present invention, if the heat dissipation requirements of the PCB board (circuit board 5) are extremely high, the material of the hollow insulating pillar 4 can be replaced with thermally conductive plastic to further improve the heat transfer efficiency from the back of the PCB board (circuit board 5) to the insulating base plate.

[0076] Please refer to the following: Figure 2-4 In one embodiment of the combined radiator provided by the present invention, the inner diameter of the hollow insulating column 4 is larger than the outer diameter of the mounting nut 2, and the inner diameter of the hollow insulating column 4 is smaller than the diameter of the fixing hole 51, while the outer diameter of the hollow insulating column 4 is larger than the diameter of the fixing hole 51.

[0077] The positioning mechanism of the combined heat sink provided by this invention is as follows: The hollow insulating post 4 is directly fitted onto the mounting nut 2 (such as a press-fit nut) that is already riveted to the heat dissipation contact top surface 11 of the heat dissipation base plate 1. Since the inner diameter of the hollow insulating post 4 is slightly larger than the outer diameter of the press-fit nut, a small clearance fit is formed between the two, which ensures the smooth assembly of the hollow insulating post 4 onto the outside of the press-fit nut and avoids the hollow insulating post 4 interfering with the screw screw insertion path. At the same time, the outer diameter of the hollow insulating post 4 is larger than the diameter of the fixing hole 51, and the outer diameter of the hollow insulating post 4 is slightly smaller than the diameter of the fixing hole 51 of the circuit board 5 (such as a PCB board), so as to form a transition fit between the two and play a radial positioning role.

[0078] After the hollow insulating pillar 4 is installed, the top surface (end surface) of the hollow insulating pillar 4 is higher than the heat dissipation contact top surface 11 of the heat dissipation base plate 1, thus forming a floating gap 34 between the back side of the circuit board 5 (such as the PCB board) facing away from the open side 31 and the heat dissipation contact top surface 11. The stainless steel / carbon steel sheet metal protective shell 3 has extremely high rigidity and yield strength, which can effectively resist the severe vibration in the industrial environment. After the thermally conductive adhesive (such as silicone grease or high-performance epoxy resin) is injected and sealed in the floating gap 34 through the potting port 8 on the side wall 33 of the protective shell 3, the transmission of high-frequency micro-vibrations to the internal circuit of the PCB board can be greatly suppressed, preventing the internal components from being deformed or damaged by force.

[0079] Meanwhile, the combined heat sink provided by this invention adopts a split design of "bottom aluminum alloy heat sink 1 and upper high-strength sheet metal protective shell 3", which makes the heat-generating components of the PCB board (such as driver IPM, etc.) fit tightly with the heat sink, ensuring that heat is efficiently conducted to the heat sink, eliminating the heat insulation effect of the plastic shell, significantly reducing thermal resistance, and establishing a low thermal resistance path of "PCB board-thermal grease-aluminum alloy heat sink". Compared with the traditional plastic shell solution, it effectively reduces the operating junction temperature of key components on the PCB board and improves stability and lifespan under high load.

[0080] Please refer to the following: Figure 1-4 11. In one embodiment of the combined heat sink provided by the present invention, the circuit board 5 is a standard industrial PCB board, and its fixing hole 51 is a non-metallized through hole to ensure that there is no copper foil residue on its hole wall, thus eliminating the risk of electrical conductivity from the source.

[0081] Please refer to the following: Figure 2-4 In one embodiment of the combined heat sink provided by the present invention, the outer diameter of the insulating pad 7 is larger than the outer diameter of the screw head 61, and the outer diameter of the screw shank 62 is much smaller than the diameter of the fixing hole 51.

[0082] The installation process of the PCB board (circuit board 5) of the combined heat sink provided by the present invention is as follows: The PCB board (circuit board 5) is gently pressed down onto the hollow insulating posts 4 pre-fitted onto the four corners of the heat dissipation contact top surface 11 of the pre-heat dissipation base plate 1, using four rivet nuts (installation nuts 2), so that the back of the PCB board (circuit board 5) is tightly attached to the top plane of the hollow insulating posts 4. At this time, the heating element 52 on the back of the PCB board (circuit board 5), coated with thermal grease, passes through the opening 321 in the middle of the bottom wall 32 of the protective shell 3 and comes into contact with the heat dissipation contact top surface 11 of the heat dissipation base plate 1. The cooling liquid flowing through the heat dissipation channel 13 inside the heat dissipation base plate 1 efficiently cools the heating element 52 on the PCB board (circuit board 5).

[0083] Then, a PBT plastic insulating washer 7 of the same material is placed in each of the fixing holes 51 on the front side 31 of the PCB board (circuit board 5) facing the protective housing 3. Next, a stainless steel Phillips head screw (threaded fastener 6) is inserted, and the screw (threaded fastener 6) is passed sequentially through the center hole of the insulating washer 7 and the fixing hole 51 of the PCB board (circuit board 5). Since the diameter of the screw shank is much smaller than the diameter of the fixing hole 51 of the PCB board (circuit board 5), the screw shank is suspended above the center of the fixing hole 51 of the PCB board (circuit board 5) and does not contact the hole wall. Finally, a torque screwdriver is used to rotate the screw (threaded fastener 6) clockwise until it is tightened into the rivet nut (installation nut 2) inside the hollow insulating post 4. A suitable tightening torque is set to prevent the screw (threaded fastener 6) from crushing the hollow insulating post 4 below, thus achieving buffering and locking of the front side of the PCB board (circuit board 5).

[0084] In one embodiment of the combined radiator provided by this invention, the protective shell 3 can be made of various sheet metal materials such as hot-dip galvanized sheet or stainless steel sheet, and the thickness of the protective shell 3 is about 1.5mm. The galvanized layer on the protective shell 3 can effectively prevent the shell from rusting and extend the service life of the equipment in harsh environments with high corrosion, such as coastal chemical plants.

[0085] Specifically, the sheet metal parts can be laser-cut and then bent into a U-shaped box-shaped protective shell 3 using a CNC bending machine. A large opening 321 is machined in the center of the bottom wall 32 (support side) of the shell so that the heat-generating element 52 on the back of the PCB board (circuit board 5) can be inserted into the heat dissipation base plate 1 through the opening 321 until it is aligned and in contact with the heat dissipation contact top surface 11 of the heat dissipation base plate 1.

[0086] Please refer to the following: Figure 1-3 In one embodiment of the combined heat sink provided by the present invention, the heat sink base plate 1, the protective shell 3 and the circuit board 5 are all rectangular. Four mounting nuts 2 are respectively fixed at the four corners of the heat sink contact top surface 11 of the heat sink base plate 1. That is, the combined heat sink is provided with four sets of hollow insulating pillars 4, insulating gaskets 7, fixing holes 51 and threaded fasteners 6 that match the four mounting nuts 2, so as to achieve uniform buffer support, smooth fastening and stress distribution at the four corners of the PCB board (circuit board 5).

[0087] Please refer to the following: Figure 1-2 9-10. In one embodiment of the combined heat sink provided by the present invention, the side wall 33 of the protective shell 3 is provided with a plurality of potting ports 8. The potting ports 8 are connected to the floating gap 34 formed between the back side of the circuit board 5 facing away from the open side 31 and the heat dissipation contact top surface 11. The potting ports 8 are used to pot thermally conductive adhesive into the floating gap 34.

[0088] The combined heat sink provided by this invention has four glue-filling ports 8 on the outer surfaces of the side walls 33 on both sides of the sheet metal protective shell 3. These glue-filling ports 8 can be integrally bent into shape from the radial side walls 33 of the protective shell 3, or they can be welded into shape. Considering the poor flowability of the thermally conductive adhesive, in order to prevent the appearance of hollow areas without glue filling at the bottom of the suspension gap 34, four glue-filling ports 8 are evenly provided on both sides of the protective shell 3 to avoid this phenomenon and thus reduce the shock absorption effect.

[0089] Please refer to the following: Figure 6-7 In one embodiment of the combined radiator provided by the present invention, the heat dissipation base plate 1 is provided with a heat dissipation channel 13 inside, and the base plate mounting bottom surface 12 of the heat dissipation base plate 1 facing away from the heat dissipation contact top surface 11 is provided with an inlet 14 and an outlet 15 respectively connected to the heat dissipation channel 13.

[0090] Specifically, the heat dissipation channel 13 of the combined radiator provided by the present invention can be machined using CNC precision milling technology to create a complex serpentine cooling channel (heat dissipation channel 13) inside the aluminum alloy heat dissipation base plate 1, thereby maximizing the contact area between the coolant and the wall of the heat dissipation channel 13. The heat dissipation channel 13 connects to the bottom mounting surface 12 of the base plate 1 at both ends, with an inlet 14 and an outlet 15 respectively. Flanges (joints) can be installed at the inlet 14 and outlet 15 to connect to an external water cooling system. A sealing groove 16, preferably 2mm deep, can also be machined at the inlet 14 and outlet 15 for installing sealing gaskets. Four M4 threaded holes can be machined in the middle of the heat dissipation contact top surface 11 of the heat dissipation base plate 1 for connecting and fixing the heat-generating element 52 that needs cooling on the heat dissipation base plate 1.

[0091] In other embodiments of the combined heat sink provided by the present invention, the heat dissipation channel 13 can be made of multiple parallel straight channels penetrating the heat dissipation base plate 1, the liquid inlet 14 is located at one end of the heat dissipation base plate 1, and the liquid outlet 15 is located on the other side of the heat dissipation base plate 1. It has the advantages of simple processing (low extrusion molding cost), low fluid resistance, low pumping energy consumption, and uniform flow rate. It is suitable for PCB boards (circuit boards 5) with relatively uniform heat distribution, or systems that are sensitive to voltage drop.

[0092] In other embodiments of the combined heat sink provided by the present invention, the heat dissipation channel 13 can adopt a pin-fin / column array, that is, the interior of the heat dissipation base plate 1 is not a cavity, but is filled with dense cylindrical, square or triangular columns (pin-fins). The coolant flows in the gaps between the columns, which has the advantage of extremely high heat exchange efficiency, greatly increases the contact area between the liquid and the solid, and the heat dissipation channel 13 has no dead corners and good turbulence effect, which is suitable for ultra-high power density chips and scenarios where space is limited but high voltage drop is allowed.

[0093] In other embodiments of the combined heat sink provided by the present invention, the heat dissipation channel 13 can be a spiral / concentric circle channel, that is, the heat dissipation channel 13 is spirally extended outward from the center of the heat dissipation base plate 1 or in multiple concentric rings. It has the advantages of the shortest heat diffusion path from the center to the surroundings, compact structure, and high utilization rate. It is suitable for central heat-generating devices and devices with obvious central heat sources, such as some motor driver modules.

[0094] In other embodiments of the combined heat sink provided by the present invention, the heat dissipation channel 13 can be made of porous medium / foam metal, that is, the heat dissipation base plate 1 is filled with open-pore metal foam (such as copper foam or aluminum foam), and the coolant flows directly through the pores. It has the advantages of huge surface area, extremely high heat transfer coefficient and isotropic thermal conductivity, and is suitable for extreme high heat flux density scenarios.

[0095] In one embodiment of the combined radiator provided by the present invention, the liquid inlet 14 and the liquid outlet 15 are respectively provided with internal threads, and the liquid inlet connector (not shown in the figure) and the liquid outlet connector (not shown in the figure) are respectively threadedly connected to the liquid inlet 14 and the liquid outlet 15. The liquid inlet connector and the liquid outlet connector can also be quick connectors without thread connection. The user only needs to press the connector to disconnect the pipeline, and can quickly drain the heat dissipation channel 13 or replace the liquid inlet connector and the liquid outlet connector without the use of additional tools, which greatly improves the efficiency of on-site maintenance.

[0096] In other embodiments of the combined heat sink provided by the present invention, the heat sink base plate 1 can also be provided with a cooling channel instead of the heat dissipation channel 13, and a cooling fan provided inside the heat sink base plate 1 can be used to achieve forced convection heat dissipation.

[0097] Please refer to the following: Figure 1-4 9-10. In one embodiment of the combined radiator provided by the present invention, at least one side wall 33 of the protective shell 3 is provided with a folded edge 331 that bends and extends toward the wall surface of the adjacent side wall 33 at the junction of the protective shell 3 and its adjacent side wall 33. The end of the folded edge 331 is spot welded to the wall surface of the adjacent side wall 33.

[0098] The combined radiator provided by this invention features a folded edge 331 at the bending joints of adjacent sidewalls 33 of the four sidewalls 33 of the protective shell 3. This folded edge 331 is then spot-welded to the wall surface of the adjacent sidewall 33, forming a corner that encloses the adjacent sidewall 33. This corner design effectively prevents the wall surface of the sidewall 33 from deforming due to external forces, while also reducing the amount of welding. Traditional sheet metal box-shaped protective shells 3 typically use full welding or intermittent welding to prevent wall deformation after bending, which could change the bending angle and affect structural stability. Furthermore, excessive welding not only increases costs but also causes significant thermal deformation of the parts. Simple spot welding of the joints may not meet operational requirements, but the corner design cleverly solves this problem.

[0099] Please refer to the following: Figure 1-4 9-10. The present invention also provides an electrical control box (not shown in the figure), including a box body and the above-mentioned combined radiator. The side wall 33 of the protective shell 3 is provided with a plurality of mounting feet 9 at the connection between the side wall 33 and the support side. The mounting feet 9 are used to connect with the box body.

[0100] Specifically, the combined heat sink provided by this invention has four mounting feet 9 welded to the outer sides of the side walls 33 on both sides of the sheet metal protective shell 3. The mounting feet 9 have connecting through holes 91 for fixing the protective shell 3 to the heat sink base plate 1. After the sheet metal protective shell 3, containing the PCB board (circuit board 5), is placed on the heat dissipation contact top surface 11 of the heat sink base plate 1, corresponding screws (threaded fasteners 6) around the heat sink are passed through the connecting through holes 91 on the corresponding mounting feet 9 and screwed into the corresponding threaded holes on both sides of the heat sink base plate 1. Then, the corresponding fixing holes 51 / fixing nuts of the electrical control box are screwed down, so that the protective shell 3 and the heat sink base plate 1 are evenly fixed and locked inside the electrical control box. This separate design of the heat sink base plate 1, protective shell 3, and circuit board 5 makes subsequent maintenance extremely convenient.

[0101] The present invention also provides a refrigeration system, including the above-described electrical control box.

[0102] Actual testing revealed that the insulation resistance between any live trace on the PCB board and the aluminum alloy base plate measured with a megohmmeter was greater than 1000MΩ, fully complying with safety standards and completely eliminating short-circuit hazards, demonstrating excellent insulation performance. Under full load conditions, compared to traditional plastic shell solutions, the temperature dissipation of the core module of the PCB board in the control box provided by this invention is significantly enhanced. This is because the removal of the plastic heat insulation layer and the application of thermally conductive silicone grease result in extremely low thermal resistance, improving heat dissipation efficiency. Vibration testing according to standards showed that the PCB board had no cracks, no solder joints were detached, and the insulation resistance remained normal, demonstrating good shock resistance reliability. A simulated fault scenario was presented: assuming the sheet metal protective shell 3 is dented due to an external impact, the operator only needs to loosen four screws or M6 bolts to remove the damaged sheet metal protective shell 3, exposing the intact PCB board and insulation structure. If only the insulation needs to be replaced, loosen the screws driven into the rivet nut (installation nut 2), remove the old plastic to the hollow insulation post 4 and insulation washer 7, then install the new hollow insulation post 4 and insulation washer 7 and tighten them again. This provides good maintenance convenience.

[0103] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art should understand that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A combined radiator, characterized in that, include: Heat dissipation base plate (1); Several mounting nuts (2) are riveted to the periphery of the heat dissipation contact top surface (11) of the heat dissipation base plate (1); The protective shell (3) has an open side (31) at the top and a support side (32) at the bottom wall of the protective shell (3) facing away from the open side (31). The support side has an opening (321) in the middle and is supported on the heat dissipation contact top surface (11) and each of the mounting nuts (2) passes through a plurality of clearance through holes (322) provided on the periphery of the support side and matching the shape of the mounting nuts (2). Several hollow insulating columns (4) abut against the heat dissipation contact top surface (11) and are respectively sleeved on the outside of each mounting nut (2), and the top of the hollow insulating column (4) is higher than the top of the mounting nut (2); The circuit board (5) is located inside the protective shell (3) and placed on the top of each hollow insulating post (4), and the circuit board (5) is provided with a number of fixing holes (51) that match each hollow insulating post (4); Several threaded fasteners (6) are respectively inserted into the corresponding fixing holes (51), hollow insulating columns (4) and mounting nuts (2).

2. The combined radiator as described in claim 1, characterized in that, The threaded fastener (6) is a screw, and the screw shank (62) is respectively inserted into the corresponding fixing hole (51), the hollow insulating column (4) and the mounting nut (2). The radial dimension of the screw head (61) is larger than the diameter of the fixing hole (51).

3. The combined radiator as described in claim 2, characterized in that, Also includes: An insulating pad (7) is fitted onto the outside of the screw (62) and placed between the head (61) and the edge of the fixing hole (51) of the circuit board (5).

4. The combined radiator as described in claim 2, characterized in that, The inner diameter of the hollow insulating column (4) is larger than the outer diameter of the mounting nut (2), and the inner diameter of the hollow insulating column (4) is smaller than the diameter of the fixing hole (51), while the outer diameter of the hollow insulating column (4) is larger than the diameter of the fixing hole (51).

5. The combined radiator as described in any one of claims 1-4, characterized in that, The heat dissipation base plate (1), the protective shell (3) and the circuit board (5) are all rectangular, and the four mounting nuts (2) are respectively fixed at the four corners of the heat dissipation contact top surface (11) of the heat dissipation base plate (1).

6. The combined radiator as described in claim 5, characterized in that, The protective housing (3) has a plurality of potting ports (8) on its sidewall (33). The potting ports (8) are connected to the floating gap (34) formed between the back side of the circuit board (5) facing away from the open side (31) and the heat dissipation contact top surface (11). The potting ports (8) are used to pot thermally conductive adhesive into the floating gap (34).

7. The combined radiator as described in any one of claims 1-4, characterized in that, The heat dissipation base plate (1) is provided with a heat dissipation channel (13) inside. The bottom surface (12) of the heat dissipation base plate (1) facing away from the heat dissipation contact top surface (11) is provided with an inlet (14) and an outlet (15) that are respectively connected to the heat dissipation channel (13).

8. The combined radiator as described in any one of claims 1-4, characterized in that, At least one side wall (33) of the protective shell (3) is provided with a folded edge (331) that bends and extends toward the wall surface of the adjacent side wall (33) at the junction of the side wall (33) and the adjacent side wall (33), and the end of the folded edge (331) is spot welded to the wall surface of the adjacent side wall (33).

9. An electrical control box, comprising a box body, characterized in that, It also includes a combined radiator as described in any one of claims 1-7, wherein a plurality of mounting feet (9) are provided at the junction of the side wall (33) of the protective housing (3) and the supporting side, and the mounting feet (9) are used to connect with the housing.

10. A refrigeration system, characterized in that, Includes the electrical control box as described in claim 9.

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