IC supply cabinet single-layer self-defined multi-disc management method and system, electronic device and storage medium

Abstract

The application discloses an IC feeding cabinet single-layer self-defined multi-plate control method, system, equipment and medium, and belongs to the SMT mounting technical field. In view of the problems of low space utilization, the need of stopping and changing materials and poor cooperation of the existing IC feeding cabinet single-layer single-plate feeding mode, the application configures multiple independent tray stations on a single-layer plate; a reference mapping is established by selecting a Mark point positioning mode for each station, teaching and verifying the material taking parameters; the actual Mark point is recognized to calculate the deviation and the material taking parameters are compensated in real time during feeding; the mounting program is analyzed to predict the calling node to advance the plate conveying; and the material state is monitored, and the non-stop material changing is completed by using the idle window of the chip mounter. The application breaks through the traditional single-plate physical limitation, greatly improves the material online capacity and the space utilization, completely eliminates the waiting time, meets the micron-level high-precision mounting demand, has the triple error-proofing capability, and significantly improves the production line productivity and the mounting yield.

Description

Technical Field

[0001] This invention relates to the field of SMT assembly production technology, and more specifically, to a method, system, electronic device, and storage medium for single-layer custom multi-tray management of IC feed cabinets. Background Technology

[0002] In PCB SMT assembly production, the IC feeding cabinet is the core supporting feeding equipment of the pick and place machine, and its feeding mode directly determines the production efficiency, placement accuracy and production line flexibility of the pick and place machine.

[0003] In existing technologies, the number of Mark points in IC feeding cabinets is fixed and requires additional hardware modifications or software customization for adjustment. Furthermore, it suffers from numerous insurmountable core defects when used with pick-and-place machines, severely restricting the production efficiency of these machines. These defects are mainly manifested in the following aspects: Firstly, the IC cabinet space utilization rate is extremely low, and there are insufficient layers when the pick-and-place machine is mounting multiple types of PCBs: When the pick-and-place machine mounts multiple types of PCBs, the BOM of a single PCB usually contains multiple IC materials, but the IC feeder can only supply one type of material per layer, which requires a lot of layers. The conventional 20-layer IC feeder can only support a maximum of 20 types of materials online, which cannot meet the flexible mounting needs of pick-and-place machines for multiple types and small batches. Frequent machine shutdowns are required to change materials, and the pick-and-place machine's utilization rate is greatly reduced.

[0004] Secondly, the lack of a custom multi-disc function leads to frequent material replenishment when the pick-and-place machine is used for large-volume placement: When the pick-and-place machine is placing a large number of single PCBs, some IC materials are used in large quantities. The capacity of the single-layer single-disc supply is limited, requiring frequent machine stops for material replenishment, interrupting the continuous placement cycle of the pick-and-place machine, resulting in low production efficiency.

[0005] Third, the inflexible Mark point positioning configuration cannot meet the high-precision placement requirements of pick-and-place machines: the number of Mark points for existing IC supplies is fixed. If it is necessary to increase the number of Mark points to improve positioning accuracy, hardware modification and software customization are required, which is complicated and costly. It cannot quickly adapt to the positioning requirements of high-density, high-precision placement of ultra-fine pitch BGAs and 01005 micro-components in pick-and-place machines, which can easily lead to material picking deviation of pick-and-place machines, causing problems such as material rejection, cold solder joints, and collisions, resulting in low placement yield.

[0006] Fourth, poor coordination between the feeding system and the pick-and-place machine, resulting in long waiting time for the pick-and-place machine: The existing IC feeding cabinet can only passively respond to the pick-and-place machine's material picking request, without any advance prediction or pre-transfer function. The waiting time for the layer conveyor directly leads to the pick-and-place machine waiting for material, which cannot match the high-speed placement cycle of the pick-and-place machine, thus limiting production efficiency.

[0007] Fifth, material changes require machine shutdown, affecting continuous production of the pick and place machine: When the existing IC feed cabinet is replaced with an empty tray, the pick and place machine production needs to be paused. The feeding can only be resumed after the tray replacement and parameter adjustment are completed. A single material change shutdown takes 3 to 5 minutes. Multiple material changes per day result in a significant reduction in the effective production time of the pick and place machine and poor continuous production capacity of the production line.

[0008] In summary, the existing IC feeding cabinet's single-layer fixed single-reel feeding mode cannot be flexibly adjusted according to the actual needs of pick-and-place machine assembly production. It cannot meet the production requirements of pick-and-place machines in terms of space utilization, flexibility, accuracy matching, and cycle time coordination. There is an urgent need for a single-layer IC cabinet management technology that can be customized with multiple reels and adapted to pick-and-place machine assembly production to solve the above-mentioned industry pain points. Summary of the Invention

[0009] To overcome the shortcomings of existing technologies, this invention provides a method, system, electronic device, and storage medium for single-layer custom multi-tray management of IC feeder cabinets, which can improve the space utilization of IC feeder cabinets and adapt to the multi-variety, large-volume placement needs of pick-and-place machines.

[0010] The technical solution adopted by this invention to solve its technical problem is: a single-layer custom multi-tray management method for IC feeding cabinets, the improvement of which is that it is applied to an SMT production line system linked with a pick-and-place machine, the SMT production line system including a vision positioning component, a motion control system and an IC cabinet driving mechanism, and the method includes the following steps: S1. Custom configuration of workstations: Configure one or more independent pallet workstations on a single layer of the IC feeding cabinet, and assign a workstation ID to each pallet workstation; S2. Mark Point Reference Calibration: The visual positioning component acquires the reference coordinates of the selected Mark point in the coordinate system, and establishes the mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix within the pallet station; S3. Teaching and verifying picking parameters: The picking coordinates and picking height of the chip matrix are obtained through the vision positioning component and the motion control system, and picking parameters are generated; the picking parameters are verified for compatibility. If the verification passes, the feeding cycle is entered; if the verification fails, the parameters are corrected. S4. Deviation Compensation: After the single-layer shelf is conveyed to the picking position or the pallet is replaced, the actual Mark point coordinates of the pallet station are identified by the vision positioning component, and the actual Mark point coordinates are compared with the Mark point reference coordinates to calculate the deviation parameter; the picking parameter is compensated and corrected in real time based on the deviation parameter, and the compensated picking parameter is sent to the motion control system. S5. Collaborative Material Supply Control: Analyze the placement program of the pick-and-place machine to obtain the material call node; based on the material call node, control the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position; S6. Intelligent material change scheduling: Monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, obtain the idle window of the pick-and-place machine according to the parsed placement program, and control the IC cabinet drive mechanism to complete the replacement of the empty pallet at the pallet station within the idle window that meets the preset material change time condition. After the empty pallet is replaced, the actual Mark point coordinates are re-identified through the vision positioning component and the deviation compensation step is triggered.

[0011] Furthermore, in step S1, multiple independent pallet stations are configured on a single-layer shelf of the IC feeding cabinet, including: Multiple pallet stations on a single-layer shelf are configured to bind different materials for independent feeding of dissimilar materials.

[0012] Furthermore, in step S1, multiple independent pallet stations are configured on a single-layer shelf of the IC feeding cabinet, including: Configure multiple pallet stations on a single shelf to bind the same material; In step S6, when an empty pallet is detected at the pallet station, the method further includes: automatically switching to other pallet stations on the same layer that are bound with the same material for continuous material supply.

[0013] Furthermore, step S1 also includes: saving the customized configuration of the number, size and layout of the pallet stations as a preset template; and configuring the pallet stations by calling the preset template when the pick-and-place machine changes production lines.

[0014] Furthermore, step S2 also includes: selecting a positioning mode for each of the pallet workstations using Mark points, wherein the positioning mode includes any one of a 1-point reference mode, a 2-point diagonal mode, a 3-point reference angle mode, or a 4-point four-corner mode.

[0015] Furthermore, when the 3-point reference angle mode or the 4-point four-corner mode is selected, step S4 further includes: The recognition accuracy of the actual Mark point coordinates is determined, and abnormal Mark points with recognition deviations exceeding a preset threshold are eliminated. The remaining valid Mark points are used to calculate the deviation parameters.

[0016] Furthermore, in step S3, the generated material picking parameters include motion coordinate parameters and Z-axis picking height parameters; When the pallet installation position changes, the workstation reference origin is recalibrated, and the motion coordinate parameters and the Z-axis pickup height parameters are updated based on the recalibrated workstation reference origin.

[0017] Furthermore, in step S3, the adaptability verification of the material taking parameters includes: The integrity and accuracy of the Mark point calibration data and the material picking parameters are verified to determine whether all parameters match the placement requirements of the pick-and-place machine.

[0018] Furthermore, in step S4, the deviation parameters include translation deviation parameters, rotation deviation parameters, and scaling deviation parameters; Real-time compensation and correction of the material picking parameters based on the deviation parameters include: using an affine transformation algorithm to solve the translation deviation parameters, the rotation deviation parameters, and the scaling deviation parameters, and updating the material picking coordinates of the chip matrix according to the solution results.

[0019] Furthermore, after sending the compensated material handling parameters to the motion control system in step S4, the method further includes: The system receives feedback from the motion control system on the material picking completion status, updates production control data synchronously, and uploads material consumption data and material change records to the PCB production MES system, which is connected to the SMT production line system.

[0020] Furthermore, before sending the compensated material handling parameters to the motion control system in step S4, the method also includes a fault-proofing verification step: The system performs triple error-proofing checks, including material information matching verification, visual secondary verification of Mark points, and validity verification of compensation parameters. If the verification is successful, the step of sending the compensated material handling parameters to the motion control system is allowed; if the verification fails, an alarm is triggered and material handling is prevented.

[0021] This invention also provides a single-layer custom multi-tray IC feeder cabinet control system, the improvement of which lies in its application to an SMT production line system linked with a pick-and-place machine. The SMT production line system includes a vision positioning component, a motion control system, and an IC cabinet drive mechanism. The control system includes: The workstation customization module is used to configure one or more independent pallet workstations on a single layer of the IC feeding cabinet, and to assign a workstation ID to each pallet workstation; The Mark point reference calibration module is used to acquire the Mark point reference coordinates corresponding to the chip matrix within the pallet station through the visual positioning component, and to establish a mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix. The material picking parameter teaching and verification module is used to obtain the material picking coordinates and picking height of the chip matrix through the vision positioning component and the motion control system, and generate material picking parameters; perform adaptability verification on the material picking parameters, and if the verification passes, enter the material feeding cycle; if the verification fails, correct the parameters. The deviation compensation module is used to identify the actual Mark point coordinates of the pallet station through the vision positioning component after the single-layer shelf is conveyed to the picking position or the pallet is changed, and compare the actual Mark point coordinates with the Mark point reference coordinates to calculate the deviation parameter; based on the deviation parameter, the picking parameter is compensated and corrected in real time, and the compensated picking parameter is sent to the motion control system; The collaborative material supply control module is used to parse the placement program of the pick-and-place machine and obtain the material call node; according to the material call node, it controls the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position; The intelligent material change scheduling module is used to monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, the idle window of the pick-and-place machine is obtained according to the parsed placement program. Within the idle window that meets the preset material change time condition, the IC cabinet drive mechanism is controlled to complete the replacement of the empty pallet at the pallet station. After the empty pallet is replaced, the actual Mark point coordinates are re-identified by the visual positioning component and the deviation compensation step is triggered.

[0022] The present invention also provides an electronic device, which is improved in that it includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the single-layer custom multi-tray management method for the IC feeder cabinet as described above.

[0023] The present invention also provides a computer-readable storage medium, wherein the improvement is that the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, it implements the steps of the single-layer custom multi-disc management method for IC feeding cabinets as described above.

[0024] The beneficial effects of this invention are as follows: The IC feeding cabinet single-layer custom multi-tray management method and system provided by this invention have significant technical and economic benefits. First, it breaks through the physical limitation of traditional single-layer limited to only one tray, supporting a flexible layout of multiple workstations for single-layer boards, which increases the online material capacity exponentially and perfectly adapts to multi-variety mixed-line production. Second, in terms of efficiency and collaboration, it can intelligently predict material call nodes to pre-deliver layers in advance, and accurately capture equipment idle windows to perform non-stop material changes and seamless switching of workstations with the same material, completely eliminating the waiting time of the pick-and-place machine. Furthermore, in terms of accuracy and quality control, it integrates multi-mark point positioning recognition by default and introduces an anomaly rejection mechanism, combined with affine transformation algorithms to achieve micron-level real-time multi-dimensional deviation compensation, greatly improving the placement yield; it provides an intelligent upgrade solution for SMT production lines with zero hardware modification cost, high flexibility, and great industry promotion value. Attached Figure Description

[0025] Figure 1 This is a flowchart illustrating a single-layer customized multi-tray management method for an IC feeding cabinet according to the present invention.

[0026] Figure 2 This is an application block diagram of a single-layer custom multi-tray control system for IC feeding cabinets according to the present invention.

[0027] Figure 3 This is an internal structural diagram of a computer device according to one embodiment of the present invention. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this invention can be combined interactively without contradicting each other.

[0030] This invention provides a single-layer custom multi-tray management method and system for IC feed cabinets, which is applied to SMT production line systems linked with pick-and-place machines. Specifically, the SMT production line system includes an IC feed cabinet, a pick-and-place machine main control system (with a pick-and-place machine main control unit, vision positioning components, motion control system, etc.), and a PCB production MES system.

[0031] Example 1 This embodiment provides a method for managing multiple trays in a single layer of an IC feeding cabinet. In this embodiment, the method includes steps S1-S6, the specific contents of which are as follows: S1. Custom configuration of workstations: Configure one or more independent pallet workstations on a single layer of the IC feeding cabinet, and assign a workstation ID to each pallet workstation; In one specific implementation, step S1 involves configuring multiple independent pallet stations on a single-layer shelf of the IC feeding cabinet, including: configuring the multiple pallet stations on the single-layer shelf to bind different materials for independent feeding of dissimilar materials.

[0032] In another specific embodiment, in step S1, multiple independent pallet stations are configured on a single-layer shelf of the IC feeding cabinet, including: configuring multiple pallet stations on the single-layer shelf to bind the same material; and in this case, in step S6, when an empty pallet is detected at a pallet station, the method further includes: automatically switching to other pallet stations on the same layer that bind the same material for continuous feeding (this step needs to be executed in step S6).

[0033] In addition, step S1 also includes: saving the customized configuration of the number, size and layout of the pallet station as a preset template; when the pick-and-place machine changes production line, the configuration of the pallet station is completed by calling the preset template.

[0034] Combined with appendix Figure 1 As shown, step S1 corresponds to the attached... Figure 1 The process involves steps such as "system initialization," "loading default configuration," and "custom pallet setting." Specifically, in this embodiment, the single-layer board of the IC feeding cabinet is configured by default as a standard pallet station, adapting to the conventional single-pallet feeding requirements of the pick-and-place machine. In step S1, based on the BOM requirements of the PCB materials to be mounted by the pick-and-place machine and the pallet specifications, multiple independent pallet stations are customized, and the size and layout of each pallet station are adjusted. Furthermore, each pallet station is assigned a station ID bound to the pick-and-place machine's mounting production, and an isolated independent parameter storage domain is constructed for each pallet station. The parameter storage domain includes station configuration parameters, 1 to 4 Mark point positioning parameters, teaching coordinate parameters, mounting adaptation parameters, and production control parameters. Therefore, this invention supports configuring different materials in a single-layer multi-station configuration to achieve independent feeding of dissimilar materials, or configuring the same material to achieve expanded feeding of the same material, adapting to the multi-variety, large-volume mounting production needs of the pick-and-place machine.

[0035] S2, Mark Point Reference Calibration: The visual positioning component collects the reference coordinates of the selected Mark point in the coordinate system, and establishes the mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix within the pallet station; Step S2 further includes: selecting a positioning mode for each pallet station, wherein the positioning mode includes any one of a 1-point reference mode, a 2-point diagonal mode, a 3-point reference angle mode, or a 4-point four-corner mode. When the 3-point reference angle mode or the 4-point four-corner mode is selected, step S4 further includes: determining the recognition accuracy of the actual Mark point coordinates, eliminating abnormal Mark points whose recognition deviation exceeds a preset threshold, and using the remaining valid Mark points to calculate the deviation parameter.

[0036] Combination Figure 1 As shown, step S2 corresponds to Figure 1 The step of "selecting Mark point mode (1-4 points)" is described. Specifically, in this embodiment, the present invention supports the positioning, identification, and deviation compensation of 1-4 Mark points. Depending on the accuracy requirements of the pick-and-place machine, a positioning mode of 1 / 2 / 3 / 4 Mark points can be selected. Four Mark point configuration templates—1-point reference, 2-point diagonal, 3-point reference angle, and 4-point four corners—are preset for one-click access. Through the visual positioning component of the pick-and-place machine, the selected Mark point on the current workstation tray is identified. The reference coordinates of the Mark point in the unified mechanical coordinate system of the pick-and-place machine-IC feeding cabinet are collected, establishing a mapping relationship between the Mark point reference coordinate system and the tray workstation and chip matrix. All calibration data is written into the Mark point positioning parameter field of the corresponding workstation, adapting to the micron-level positioning accuracy requirements of the pick-and-place machine.

[0037] S3. Teaching and Verification of Picking Parameters: The picking coordinates and picking height of the chip matrix are obtained through the vision positioning component and the motion control system, and picking parameters are generated; the picking parameters are verified for compatibility. If the verification passes, the feeding cycle is entered; if the verification fails, the parameters are corrected.

[0038] In step S3, the generated material picking parameters include motion coordinate parameters and Z-axis picking height parameters. When the pallet installation position changes, the workstation reference origin is recalibrated, and the motion coordinate parameters and Z-axis picking height parameters are updated based on the recalibrated workstation reference origin.

[0039] In step S3, the adaptability of the material picking parameters is verified, including: verifying the integrity and accuracy of the Mark point calibration data and the material picking parameters, and determining whether all parameters match the placement requirements of the pick-and-place machine.

[0040] Combination Figure 1As shown, step S3 corresponds to Figure 1 The steps of "visual calibration and deviation compensation", "teaching material picking parameters", "adaptability verification passed?" and "parameter correction" should be noted. When the "parameter correction" step is executed, it returns to step S2 (i.e. the step of "selecting Mark point mode (1-4 points)").

[0041] Specifically, in this embodiment, the present invention provides an independent teaching entry for each pallet station, which is linked in real time with the visual positioning component and motion control system of the pick-and-place machine. It collects the relative coordinates of the chip matrix reference point with respect to the station reference origin and generates absolute coordinates for chip matrix picking that are adapted to the motion control of the pick-and-place machine. Simultaneously, it completes intelligent teaching of the pallet material picking height, automatically records the optimal picking height, and generates precise Z-axis parameters for the pick-and-place machine nozzle to pick up materials. In this way, the problem of material throwing and collision caused by inaccurate manual parameter setting is solved. All picking parameters are fully compatible with the parameter format and calling rules of the pick-and-place machine motion control system.

[0042] S4. Deviation Compensation: After the single-layer board is conveyed to the picking position or the pallet is changed, the actual Mark point coordinates of the pallet station are identified by the vision positioning component, and the actual Mark point coordinates are compared with the Mark point reference coordinates to calculate the deviation parameters; the picking parameters are compensated and corrected in real time based on the deviation parameters, and the compensated picking parameters are sent to the motion control system; in step S4, the deviation parameters include translational deviation parameters, rotational deviation parameters, and scaling deviation parameters; the real-time compensation and correction of the picking parameters based on the deviation parameters includes: using an affine transformation algorithm to solve the translational deviation parameters, the rotational deviation parameters, and the scaling deviation parameters, and updating the picking coordinates of the chip matrix according to the solution results.

[0043] In this embodiment, before sending the compensated material handling parameters to the motion control system in step S4, the method further includes a fault-proofing verification step: The system performs triple error-proofing checks, including material information matching verification, visual secondary verification of Mark points, and validity verification of compensation parameters. If the verification is successful, the step of sending the compensated material handling parameters to the motion control system is allowed; if the verification fails, an alarm is triggered and material handling is prevented.

[0044] Combination Figure 1 As shown, step S4 corresponds to Figure 1 The process includes steps such as "prediction and conveying of the shelf", "real-time deviation compensation", "triple error prevention verification" and "alarm to prevent material picking".

[0045] Specifically, in this embodiment, each time the IC feeding cabinet shelf is transported to the picking position and the tray is replaced, the system automatically identifies the actual Mark point coordinates of the tray through the pick-and-place machine's vision positioning component, compares them with the reference coordinates to calculate translational deviation parameters, rotational deviation parameters, and scaling full deviation parameters; based on all deviation parameters, the chip matrix picking coordinates and picking height are compensated and corrected in real time to generate the compensated accurate picking parameters, and directly sends them to the pick-and-place machine's motion control system through the pick-and-place machine's standard communication protocol to drive the pick-and-place machine to complete accurate picking, with the compensation accuracy matching the technical requirements of the pick-and-place machine's high-density and high-precision mounting.

[0046] S5. Collaborative material supply control: Analyze the placement program of the chip mounter to obtain the material call node; according to the material call node, control the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position.

[0047] After the compensated material picking parameters are sent to the motion control system in step S4, the method further includes: receiving the material picking completion status fed back by the motion control system, synchronously updating the production control data, and uploading the material consumption data and material change records to the PCB production MES system that is communicatively connected to the SMT production line system.

[0048] Combination Figure 1 As shown, step S5 corresponds to Figure 1 The steps in the MES are "pick-and-place machine" and "update data to MES".

[0049] Specifically, in this embodiment, the present invention records information such as the remaining quantity of materials, the position of the pick-up pointer, and the batch of materials in real time, seamlessly integrating with the pick-and-place machine's mounting program. It analyzes the pick-and-place machine's mounting sequence, material call nodes, and mounting cycle time to establish a material call prediction mechanism. It pre-controls the IC feeding cabinet drive mechanism to pre-transport the target layer board to the pick-up position, eliminating the pick-and-place machine's waiting time. When responding to the pick-and-place machine's pick-up request, it quickly matches the corresponding workstation and issues precise pick-up parameters, achieving synchronous coordination between single-layer multi-tray and the pick-and-place machine's mounting cycle time. After picking up the materials, it synchronously updates the workstation's production control data and uploads it to the PCB production MES system, achieving full-chain traceability of the pick-and-place machine's mounting production. The target layer board mentioned above is the single-layer board described above.

[0050] S6. Intelligent material change scheduling: Monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, obtain the idle window of the pick-and-place machine according to the parsed placement program, and control the IC cabinet drive mechanism to complete the replacement of the empty pallet at the pallet station within the idle window that meets the preset material change time condition. After the empty pallet is replaced, the actual Mark point coordinates are re-identified through the vision positioning component and the deviation compensation step is triggered.

[0051] It should be noted that the "step of performing the deviation compensation" mentioned in step S6 corresponds to the appendix. Figure 1 The actual step performed is the "prediction and conveying of the shelf" step in step S4. Step S6 corresponds to... Figure 1 The steps for determining "material depletion", "production completion", and "material replacement without stopping the machine" are explained.

[0052] Specifically, in this embodiment, the present invention monitors the material status of the pallet station in real time. When it detects that a pallet station has run out of material and becomes empty, if the pallet station contains the same material, it automatically switches to other stations on the same layer with the same material for continuous material supply, ensuring uninterrupted pick-and-place machine production. Simultaneously, it analyzes the pick-and-place machine's placement program, intelligently predicting the idle window when the pick-and-place machine calls materials from other layers and performs PCB transfer / placement head repositioning, and ensuring that the idle window duration is greater than the preset minimum material replacement time threshold. Within the idle window, it controls the IC feeding cabinet to push out the shelf to complete the empty pallet replacement. After replacement, it automatically performs Mark point recognition, deviation compensation, and material picking parameter adaptation, retracts the shelf, and resumes material supply, without occupying the effective placement machine production time. Therefore, the present invention supports independent material replacement of any single empty pallet on a single layer without affecting the normal material supply of other stations on the same layer, adapting to the continuous production requirements of the pick-and-place machine.

[0053] Example 2 This invention provides a single-layer customizable multi-tray IC feeder system for use in SMT production lines linked with pick-and-place machines. In this embodiment, it combines... Figure 2 As shown, combined with Figure 2 As shown, the IC feeding cabinet single-layer custom multi-tray management system includes an IC cabinet single-layer management module, and the SMT production line system is... Figure 2 The pick-and-place machine main control system shown in the figure includes a vision positioning component, a motion control system, a pick-and-place machine main control unit, and an IC cabinet drive mechanism.

[0054] In this embodiment, the IC feeding cabinet single-layer custom multi-tray management system includes an IC cabinet single-layer management module. This module includes a workstation custom configuration module, a Mark point benchmark calibration module, a material picking parameter teaching and verification module, a deviation compensation module, a collaborative feeding management module, and an intelligent material change scheduling module. Wherein: The workstation customization module is used to configure one or more independent pallet workstations on a single layer of the IC feeding cabinet, and to assign a workstation ID to each pallet workstation; The Mark point reference calibration module is used to acquire the Mark point reference coordinates corresponding to the chip matrix within the pallet station through the visual positioning component, and to establish a mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix. The material picking parameter teaching and verification module is used to obtain the material picking coordinates and picking height of the chip matrix through the vision positioning component and the motion control system, and generate material picking parameters; perform adaptability verification on the material picking parameters, and if the verification passes, enter the material feeding cycle; if the verification fails, correct the parameters. The deviation compensation module is used to identify the actual Mark point coordinates of the pallet station through the vision positioning component after the single-layer shelf is conveyed to the picking position or the pallet is changed, and compare the actual Mark point coordinates with the Mark point reference coordinates to calculate the deviation parameter; based on the deviation parameter, the picking parameter is compensated and corrected in real time, and the compensated picking parameter is sent to the motion control system; The collaborative material supply control module is used to parse the placement program of the pick-and-place machine and obtain the material call node; according to the material call node, it controls the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position; The intelligent material change scheduling module is used to monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, the idle window of the pick-and-place machine is obtained according to the parsed placement program. Within the idle window that meets the preset material change time condition, the IC cabinet drive mechanism is controlled to complete the replacement of the empty pallet at the pallet station. After the empty pallet is replaced, the actual Mark point coordinates are re-identified by the visual positioning component and the deviation compensation step is triggered.

[0055] In addition, production control data is updated synchronously through the IC cabinet single-layer control module, and material consumption data and material change records are uploaded to the PCB production MES system that is connected to the SMT production line system.

[0056] Example 3 Based on Example 1, this invention provides a single-layer custom multi-tray IC feeding cabinet management method for automotive electronic PCB mounting, specifically a single-layer multi-tray heterogeneous material feeding method. In this example, addressing the mixed-line production needs of mounting three automotive electronic PCBs using a pick-and-place machine, the BOM lists for these three PCBs contain a total of 24 IC materials. Traditional IC cabinets require 24 layers, while this invention uses only 6 IC cabinet layers to achieve online feeding of all 24 materials, enabling mixed-line mounting of multiple PCB types with the pick-and-place machine. The specific implementation steps are as follows: Step 1: System Initialization and Custom Pallet Setup: The IC cabinet and pick-and-place machine linkage system is powered on, and each layer of the board is loaded with one standard pallet station by default. According to the BOM requirements and pallet specifications of the three PCB materials to be mounted by the pick-and-place machine, the operator customizes each of the six layers into four independent pallet stations, for a total of 24 stations. The system assigns a unique ID to each station and automatically binds the corresponding IC material information. At the same time, the configuration scheme is saved as "Automotive Electronics PCB Mixed Line Mounting Template" for one-click recall during subsequent line changes.

[0057] Step 2, Mark Point Configuration and Calibration: Based on the placement accuracy requirements of the pick-and-place machine, a 4-point Mark point positioning mode is selected for the 6 high-density BGA material stations, a 2-point Mark point positioning mode is selected for the 12 conventional IC material stations, and a 1-point Mark point positioning mode is selected for the 6 ordinary IC material stations. All of these are achieved by using preset templates. The system calls the visual positioning component of the pick-and-place machine to complete the benchmark calibration of all station Mark points, automatically removes one Mark point with excessive recognition deviation, establishes coordinate mapping relationships, and adapts to the placement requirements of different precision levels of the pick-and-place machine.

[0058] Step 3, Chip Placer Linkage Teaching and Parameter Adaptation: The system links with the chip placement machine's vision positioning component and motion control system to complete the relative coordinate teaching of the chip matrix and intelligent teaching of the pick-up height for 24 stations. The generated pick-up coordinates, Z-axis height, and other parameters are fully adapted to the calling rules of the chip placement machine's motion control system. If the tray installation position is subsequently adjusted, only the station reference origin needs to be recalibrated, without re-teaching the chip.

[0059] Step 4, Mounting Compatibility Verification: The system verifies the completeness and accuracy of the Mark point calibration data and material feeding parameters, confirming that all parameters match the mounting requirements of the pick-and-place machine, and then proceeds to the formal material feeding process.

[0060] Step 5, Deviation Compensation and Precise Collaborative Material Feeding: After the pick-and-place machine starts mixed-line placement production, each time an IC cabinet shelf is transported to the pick-up position, the system automatically identifies the actual Mark point coordinates of the tray, calculates the translational deviation parameters, rotational deviation parameters, and scaling deviation parameters, and completes the compensation. The compensated precise material feeding parameters are directly sent to the motion control system through the pick-and-place machine's standard protocol. Simultaneously, the system analyzes the pick-and-place machine's placement program, predicts material call nodes, and pre-transports the target shelf to the pick-up position, eliminating pick-and-place machine waiting time. All 24 workstations independently respond to the pick-and-place machine's material call requests, achieving synchronous feeding of multiple IC materials on a single PCB. During Mark point identification and deviation compensation, the system calculates the translational deviation parameters, rotational deviation parameters, and scaling deviation parameters, typically using affine transformation. ; Where (x,y) are theoretical coordinates, (x′,y′) are actual coordinates, θ is the rotation angle, Sx and Sy are scaling factors, and Δx and Δy are translation amounts; the above parameters can be solved using at least two Mark points.

[0061] Step 6, Collaborative Management and Data Traceability: Configure independent material management threads for each of the 24 workstations to record the remaining quantity of materials and the position of the material pick-up pointer at each workstation in real time. After material pick-up is completed, update the production management data immediately and upload it to the PCB production MES system simultaneously to achieve full-chain traceability of the pick-and-place machine assembly production.

[0062] Step 7, Empty Tray Replacement Without Stopping the Machine: The system monitors the material status of 24 workstations in real time. When the material at a certain workstation is exhausted, the system analyzes the pick-and-place machine's mounting program and identifies a 15-second idle window (greater than the preset 8-second material replacement threshold) for the pick-and-place machine to call other layers of materials. Within this window, the system automatically pushes out the layer board to complete the empty tray replacement. After replacement, it quickly completes Mark point identification and deviation compensation, retrieves the layer board, and resumes material supply. The entire process does not occupy the effective mounting time of the pick-and-place machine and only locks the empty tray workstation. The other 3 workstations on the same layer continue to supply materials normally, ensuring continuous mixed-line mounting of multiple PCB types by the pick-and-place machine.

[0063] Step 8, Full-process error prevention verification: Error prevention verification is superimposed on all operation links. Before the pick-up machine picks up the material, it performs triple verification of material code matching, secondary visual recognition of Mark points, and validity of compensation parameters. Only when all verifications pass will the picking parameters be issued, thus eliminating the problem of incorrect or off-target materials from the root.

[0064] In this embodiment, IC cabinet space utilization is increased by 4 times, pick-and-place machine downtime for material changes is reduced by 80%, uptime is increased by 18%, pick-and-place machine rejection rate is reduced by 50%, and PCB placement yield is increased by 2.5%. .

[0065] Example 4 Based on Example 1, this embodiment of the present invention provides a single-layer multi-tray control method for IC feeding cabinets, offering a capacity expansion application for single-layer multi-tray same-material feeding in high-volume consumer electronics PCB mounting. Specifically, this embodiment is used to meet the high-volume production needs of a pick-and-place machine mounting a certain consumer electronics PCB. This PCB contains two types of core precision IC materials, and the pick-and-place machine has a single-hour mounting capacity of 500 pieces. Traditional single-layer single-tray feeding requires a machine stoppage for refilling every two hours. This invention, through single-layer custom multi-tray, customizes each of the two layers of the IC cabinet to four stations for the same material, achieving a fourfold capacity expansion for the two types of IC materials. This, combined with the pick-and-place machine, enables high-volume continuous mounting. The specific core steps are as follows: Step 1: Customize the 7th and 8th layers of the IC cabinet into 4 independent pallet stations. Configure the 4 stations on the 7th layer with core IC material A, and configure the 4 stations on the 8th layer with core IC material B. The system automatically assigns an ID to each station and binds the material information to complete the expansion of the same material pallet.

[0066] in, .

[0067] Step 2: For both types of precision IC material workstations, a 4-point Mark point positioning mode is selected. Calibration is completed through the pick-and-place machine's vision component, and abnormal Mark points are automatically rejected to match the precision requirements of the pick-and-place machine's high-density placement. The chip matrix teaching and intelligent teaching of the pickup height are completed to generate pick-and-place machine picking parameters.

[0068] Step 3: After the pick-and-place machine starts mass production, the system analyzes the pick-and-place machine's placement program to realize material call prediction and shelf pre-feeding, eliminating waiting time for materials; the four stations with the same material are automatically fed in sequence. When the material at a station is exhausted, the system seamlessly switches to the next station with the same material to ensure continuous material supply for the pick-and-place machine.

[0069] Step 4: During the 20-second idle window when the pick-and-place machine is performing PCB transfer and placement head repositioning, the system completes the non-stop replacement of empty trays at the workstation, extending the replenishment cycle from 2 hours to 8 hours, reducing the number of pick-and-place machine downtimes for replenishment by 75%, realizing continuous placement of large batches of PCBs, and improving production efficiency by 22%.

[0070] in, .

[0071] Step 5: All material handling operations undergo triple error prevention checks, and production data is synchronized to the MES system in real time to meet the quality traceability requirements of mass production.

[0072] Compared with the prior art, the embodiments of the present invention have the following significant advantages: Firstly, space utilization is increased exponentially, perfectly adapting to flexible placement of multiple product types: breaking through the physical limitation of traditional single-layer PCBs limited to only one tray, by dividing the workstations into ≥1 customizable locations. For example, a 20-layer IC cabinet can accommodate more than 80 types of materials online, making mixed-line production of multiple PCB types possible, reducing the number of pick-and-place machine downtimes for material changes by 80%, and increasing uptime by more than 15%.

[0073] Secondly, the same material supply capacity is expanded, fully releasing the capacity for large-volume continuous mounting: multiple same material stations are configured in a single layer, achieving a several-fold increase in capacity. The replenishment cycle is significantly extended, and with the seamless material change mechanism within the idle window, the number of downtimes during mass production is reduced by 75%, and production efficiency is directly increased by more than 20%.

[0074] Thirdly, the ultra-high precision compensation without configuration ensures micron-level placement yield: It integrates 1~4 Mark points for positioning by default, supplemented by anomaly rejection and affine transformation algorithms, with a compensation accuracy of ≤±0.003mm. It can meet the stringent positioning requirements of ultra-fine pitch BGA and 01005 micro components without any hardware modification, reducing the pick-and-place machine's material rejection rate by 50% and improving the PCB placement yield by 2%~2.5%.

[0075] Fourth, deep system-wide collaboration truly eliminates machine waiting time: It abandons the passive response mode and innovatively analyzes the placement program to predict material call nodes and pre-delivers target layers in advance, so that the actions of the IC feeding cabinet and the high-speed placement cycle of the pick-and-place machine can achieve seamless synchronization and collaboration.

[0076] Fifth, construct a full-process error prevention barrier to meet high-end manufacturing quality: It has created a unique triple error prevention and verification system that covers material matching, visual secondary recognition, and compensation effectiveness, and implements forced blocking in the underlying logic to eliminate devastating production accidents such as wrong materials and material deviations from the physical and data roots.

[0077] Sixth, pure software upgrade at zero cost, with extremely strong adaptability to existing production line transformation: all custom settings, multi-point compensation, and program prediction are encapsulated in software modules, which can be directly integrated into the existing pick-and-place machine main control system. Existing SMT production lines can achieve a revolutionary upgrade of the material supply mode with almost zero transformation cost.

[0078] In one exemplary embodiment, an electronic device is provided. In this embodiment, the electronic device is a computer device, which may be a terminal. Its internal structure diagram may be as follows: Figure 3 As shown, the computer device includes a processor, memory, input / output interfaces, a communication interface, a display unit, and an input device. The processor, memory, and input / output interfaces are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interfaces. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interfaces are used for exchanging information between the processor and external devices. The communication interface, such as a network interface card, is used for wired or wireless communication with external terminals. Wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0079] Those skilled in the art will understand that Figure 3The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0080] In one exemplary embodiment, a chip is provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the method in any of the above embodiments.

[0081] In one exemplary embodiment, a network interface card is provided, including a chip as described in any of the above embodiments and multiple interfaces, wherein the chip communicates externally through the interfaces.

[0082] In one embodiment, a computer device is also provided, including a processor, a chip in any of the above embodiments, or a network interface card in any of the above embodiments, wherein the chip or the network interface card is used to schedule packets to the processor or the chip or the network interface card itself for processing, and the processor is used to process the packets scheduled by the chip or the network interface card.

[0083] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0084] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0085] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory may include read-only memory (Read-Only Memory). Only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in this application may include at least one of relational databases and non-relational databases. Non-relational databases may include distributed databases based on blockchain, etc., and are not limited thereto. The processors involved in the various embodiments provided in this application may be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited thereto.

[0086] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0087] Similarly, it should be understood that, for the purpose of simplification and aiding understanding of one or more aspects of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention above. Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and it should be noted that the above embodiments are illustrative of the invention and not restrictive, and that alternative embodiments can be devised by those skilled in the art without departing from its scope.

Claims

1. A method for managing multiple trays in a single-layer IC feeding cabinet, characterized in that, An SMT production line system linked with a pick-and-place machine, the SMT production line system including a vision positioning component, a motion control system, and an IC cabinet drive mechanism, the method comprising the following steps: S1. Custom configuration of workstations: Configure one or more independent pallet workstations on a single layer of the IC feeding cabinet, and assign a workstation ID to each pallet workstation; S2. Mark Point Reference Calibration: The visual positioning component acquires the reference coordinates of the selected Mark point in the coordinate system, and establishes the mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix within the pallet station; S3. Teaching and verifying picking parameters: The picking coordinates and picking height of the chip matrix are obtained through the vision positioning component and the motion control system, and picking parameters are generated; the picking parameters are verified for compatibility. If the verification passes, the feeding cycle is entered; if the verification fails, the parameters are corrected. S4. Deviation Compensation: After the single-layer shelf is conveyed to the picking position or the pallet is replaced, the actual Mark point coordinates of the pallet station are identified by the vision positioning component, and the actual Mark point coordinates are compared with the Mark point reference coordinates to calculate the deviation parameter; the picking parameter is compensated and corrected in real time based on the deviation parameter, and the compensated picking parameter is sent to the motion control system. S5. Collaborative Material Supply Control: Analyze the placement program of the pick-and-place machine to obtain the material call node; based on the material call node, control the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position; S6. Intelligent material change scheduling: Monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, obtain the idle window of the pick-and-place machine according to the parsed placement program, and control the IC cabinet drive mechanism to complete the replacement of the empty pallet at the pallet station within the idle window that meets the preset material change time condition. After the empty pallet is replaced, the actual Mark point coordinates are re-identified through the vision positioning component and the deviation compensation step is triggered.

2. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, In step S1, multiple independent pallet stations are configured on a single-layer shelf of the IC feeding cabinet, including: Multiple pallet stations on a single-layer shelf are configured to bind different materials for independent feeding of dissimilar materials.

3. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, In step S1, multiple independent pallet stations are configured on a single-layer shelf of the IC feeding cabinet, including: Configure multiple pallet stations on a single shelf to bind the same material; In step S6, when an empty pallet is detected at the pallet station, the method further includes: automatically switching to other pallet stations on the same layer that are bound with the same material for continuous material supply.

4. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, Step S1 further includes: saving the customized configuration of the number, size and layout of the pallet station as a preset template; and configuring the pallet station by calling the preset template when the pick-and-place machine changes production lines.

5. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, Step S2 further includes: selecting a positioning mode for each pallet station using Mark points, wherein the positioning mode includes any one of a 1-point reference mode, a 2-point diagonal mode, a 3-point reference angle mode, or a 4-point four-corner mode.

6. The IC feeding cabinet single-layer customized multi-tray management method according to claim 5, characterized in that, When the 3-point reference angle mode or the 4-point four-corner mode is selected, step S4 further includes: The accuracy of the actual Mark point coordinates is determined, and abnormal Mark points with recognition deviations exceeding a preset threshold are eliminated. The remaining valid Mark points are used to calculate the deviation parameters.

7. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, In step S3, the generated material picking parameters include motion coordinate parameters and Z-axis picking height parameters; When the pallet installation position changes, the workstation reference origin is recalibrated, and the motion coordinate parameters and the Z-axis pickup height parameters are updated based on the recalibrated workstation reference origin.

8. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, In step S3, the compatibility of the material taking parameters is verified, including: The integrity and accuracy of the Mark point calibration data and the material picking parameters are verified to determine whether all parameters match the placement requirements of the pick-and-place machine.

9. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, In step S4, the deviation parameters include translation deviation parameters, rotation deviation parameters, and scaling deviation parameters; Real-time compensation and correction of the material picking parameters based on the deviation parameters include: using an affine transformation algorithm to solve the translation deviation parameters, the rotation deviation parameters, and the scaling deviation parameters, and updating the material picking coordinates of the chip matrix according to the solution results.

10. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, After sending the compensated material handling parameters to the motion control system in step S4, the method further includes: The system receives feedback from the motion control system on the material picking completion status, updates production control data synchronously, and uploads material consumption data and material change records to the PCB production MES system, which is connected to the SMT production line system.

11. The IC feeding cabinet single-layer customized multi-tray management method according to claim 1, characterized in that, Before sending the compensated material handling parameters to the motion control system in step S4, the method further includes a fault-proofing verification step: The system performs triple error-proofing checks, including material information matching verification, visual secondary verification of Mark points, and validity verification of compensation parameters. If the verification is successful, the step of sending the compensated material handling parameters to the motion control system is allowed; if the verification fails, an alarm is triggered and material handling is prevented.

12. A single-layer customizable multi-tray control system for IC feeding cabinets, characterized in that, An SMT production line system integrated with a pick-and-place machine, the SMT production line system including a vision positioning component, a motion control system, and an IC cabinet drive mechanism, the control system including: The workstation customization module is used to configure one or more independent pallet workstations on a single shelf of the IC feeding cabinet, and to assign a workstation ID to each pallet workstation; The Mark point reference calibration module is used to acquire the Mark point reference coordinates corresponding to the chip matrix within the pallet station through the visual positioning component, and to establish a mapping relationship between the Mark point reference coordinate system and the pallet station and the chip matrix. The material picking parameter teaching and verification module is used to obtain the material picking coordinates and picking height of the chip matrix through the vision positioning component and the motion control system, and generate material picking parameters; perform adaptability verification on the material picking parameters, and if the verification passes, enter the material feeding cycle; if the verification fails, correct the parameters. The deviation compensation module is used to identify the actual Mark point coordinates of the pallet station through the vision positioning component after the single-layer shelf is conveyed to the picking position or the pallet is changed, and compare the actual Mark point coordinates with the Mark point reference coordinates to calculate the deviation parameter; based on the deviation parameter, the picking parameter is compensated and corrected in real time, and the compensated picking parameter is sent to the motion control system; The collaborative material supply control module is used to parse the placement program of the pick-and-place machine and obtain the material call node; according to the material call node, it controls the IC cabinet drive mechanism to pre-transport the target layer to the material pick-up position; The intelligent material change scheduling module is used to monitor the material status of each pallet station. When an empty pallet is detected at a pallet station, the idle window of the pick-and-place machine is obtained according to the parsed placement program. Within the idle window that meets the preset material change time condition, the IC cabinet drive mechanism is controlled to complete the replacement of the empty pallet at the pallet station. After the empty pallet is replaced, the actual Mark point coordinates are re-identified by the visual positioning component and the deviation compensation step is triggered.

13. An electronic device, characterized in that, include: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the IC feeder single-layer custom multi-tray management method as described in any one of claims 1-11.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the IC feeding cabinet single-layer customized multi-pan management method as described in any one of claims 1-11.

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