Packaging structure

Abstract

A package structure is disclosed. The package structure includes a substrate, an integrated circuit, a light emitting element, a light receiving element, a first photoresist stopper, a second photoresist stopper, and a package. The integrated circuit is disposed on the substrate. The light emitting element is disposed on the substrate and has a light emitting surface. The light receiving element is disposed on the integrated circuit and has a light receiving surface. The first photoresist stopper is disposed on the integrated circuit and is located between the light emitting surface of the light emitting element and the light receiving surface of the light receiving element. The second photoresist stopper is disposed on the first photoresist stopper. The package is disposed on the light emitting element and the light receiving element.

Description

Technical Field

[0001] This invention relates to semiconductor technology, and more particularly to packaging structures. Background Technology

[0002] Photosensitive devices are widely used in electronic products, such as heart rate monitors, distance sensors, and other optical detection devices. Generally, the package structure of a photosensitive device has corresponding light-emitting elements and light-receiving elements. To avoid mutual interference between the light-emitting and light-receiving elements, they need to be separated by shielding components.

[0003] With the pursuit of thinner and smaller electronic products, photosensitive devices are required to have even smaller sizes. In this context, the methods of forming the shielding components through cutting, dispensing, molding, assembly, and other suitable manufacturing processes limit the miniaturization of the packaging structure and the photosensitive device it contains. Therefore, while existing packaging structures and the photosensitive devices they contain have gradually met their intended uses, they are not perfect in every aspect. Several issues regarding packaging structures still need to be overcome. Summary of the Invention

[0004] In some embodiments, a packaging structure is provided. The packaging structure includes a substrate, an integrated circuit, a light-emitting element, a light-receiving element, a first photoresist barrier, a second photoresist barrier, and a package body. The integrated circuit is disposed on the substrate. The light-emitting element is disposed on the substrate and has a light-emitting surface. The light-receiving element is disposed on the integrated circuit and has a light-receiving surface. The first photoresist barrier is disposed on the integrated circuit and located between the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element. The second photoresist barrier is disposed on the first photoresist barrier. The package body is disposed on the light-emitting element and the light-receiving element.

[0005] The packaging structure of this invention can be applied to various types of electronic devices. To make the features and advantages of this invention more apparent and understandable, various embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0006] The following detailed description, in conjunction with the accompanying drawings, will provide a better understanding of the embodiments of the present invention. It is worth noting that, according to industry standard practice, some features may not be drawn to scale. In fact, for clarity of description, the dimensions of different features may be increased or decreased.

[0007] Figures 1 to 5 These are three-dimensional schematic diagrams of the packaging structure at different formation stages according to some embodiments of the present invention;

[0008] Figure 6A and Figure 6B These are cross-sectional views of the packaging structure and another cross-sectional view, respectively, according to some other embodiments of the present invention;

[0009] Figure 7A and Figure 7B These are cross-sectional schematic diagrams and another cross-sectional schematic diagram showing the packaging structure, respectively, according to some embodiments of the present invention;

[0010] Figure 8A and Figure 8B These are cross-sectional schematic diagrams and another cross-sectional schematic diagram showing the packaging structure according to some embodiments of the present invention;

[0011] Figures 9A to 9C These are, respectively, perspective views, side views, and top views of the packaging structure according to some embodiments of the present invention;

[0012] Figure 10 This is a perspective view of the packaging structure according to some embodiments of the present invention;

[0013] Figure 11 This is a perspective view of the packaging structure according to some embodiments of the present invention;

[0014] Figure 12 This is a perspective view of the packaging structure according to some embodiments of the present invention;

[0015] Figure 13 This is a perspective view of the packaging structure according to some embodiments of the present invention.

[0016] Symbol Explanation

[0017] 10:Substrate

[0018] 11: Integrated Circuits

[0019] 12: Light-emitting element

[0020] 12A: First light-emitting element

[0021] 12B: Second light-emitting element

[0022] 12S: Luminescent Surface

[0023] 13: Light receiving element

[0024] 13A: First light-receiving element

[0025] 13B: Second light-receiving element

[0026] 13S: Finished surface

[0027] 14: First photoresist barrier

[0028] 14A: First Sub-blocking Section

[0029] 14B: Second Sub-block

[0030] 15: First electrical connection

[0031] 16: Second electrical connection

[0032] 17: Package

[0033] 17A: First Package Section

[0034] 17B: Second Packaging Section

[0035] 18: Second photoresist barrier

[0036] 19: Third electrical connection

[0037] 20: Fourth electrical connection

[0038] d1: Distance

[0039] d2: Distance

[0040] DP: Cutting and manufacturing process

[0041] G: Gap

[0042] h1: Height

[0043] h2: Height

[0044] h3: Height

[0045] h4: height

[0046] w1: width

[0047] w2: width Detailed Implementation

[0048] The following disclosure provides many different embodiments or examples for implementing the provided apparatus. Specific examples of the components and their configurations are described below to simplify the embodiments of the invention, but are not intended to limit the invention. For example, if the description refers to a first component forming on a second component, it may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components, so that the first and second components are not in direct contact. Furthermore, the invention may repeat element symbols and / or characters in different embodiments or examples. Such repetition is for brevity and clarity, and is not intended to indicate a relationship between the different embodiments and / or examples discussed.

[0049] In some embodiments of the present invention, terms such as "setup," "connection," and similar terms, unless specifically defined, may refer to two components in direct contact, or to two components not in direct contact, wherein an additional connecting component is located between the two structures. Terms such as "setup" and "connection" may also include cases where both structures are movable or both structures are fixed.

[0050] Furthermore, the terms "first," "second," and similar terms used in this specification or claims are used to name different components or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of components, nor to limit the manufacturing order or installation order of the components.

[0051] In this document, the terms "approximately," "about," and "substantially" generally indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantities are approximate; that is, without specific mention of "approximately," "about," or "substantially," their meaning is implied. The phrase "the range is between the first value and the second value" indicates that the range includes the first value, the second value, and other values ​​in between. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10%, 5%, 3%, 2%, 1%, or 0.5% between the first and second values. If the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, then the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

[0052] It should be understood that, for clarity, some components of the apparatus are omitted in the accompanying drawings, and only some components are schematically illustrated. In some embodiments, additional components may be added to the apparatus described below. In other embodiments, some components of the apparatus described below may be replaced or omitted. It should be understood that, in some embodiments, additional operating steps may be provided before, during, and / or after the method of manufacturing the apparatus. In some embodiments, some operating steps may be replaced or omitted, and the order of some operating steps is interchangeable.

[0053] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of the invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the invention.

[0054] In some existing packaging structures, to avoid interference between the light-emitting and light-receiving functions, a large space is reserved within the packaging structure to house the light-emitting and light-receiving elements. This results in the overall size of the packaging structure being significantly larger than the individual dimensions of the light-emitting and light-receiving elements. Furthermore, existing packaging structures may also include shielding components between the light-emitting and light-receiving elements to reduce signal crosstalk. For example, the shielding components can be formed by performing cutting, dispensing, molding, assembly, and other suitable manufacturing processes between the light-emitting and light-receiving elements in the packaging structure. To prevent damage to the light-emitting or light-receiving elements during the cutting process, a specific distance must be maintained between the cut and the light-emitting element, and between the cut and the light-receiving element. However, this approach not only limits the miniaturization of the packaging structure but also increases manufacturing costs. Therefore, this invention provides a packaging structure that reduces the required specific distance between the cut and the light-emitting element, and between the cut and the light-receiving element, by incorporating a sacrificial layer or barrier layer, thereby simplifying the manufacturing process and reducing the element size.

[0055] Reference Figures 1 to 5 These are, respectively, three-dimensional schematic diagrams showing the packaging structure at different formation stages according to some embodiments of the present invention. Figure 1 As shown, a substrate 10 is provided. Specifically, the substrate 10 is used to support components located thereon, such as an integrated circuit 11, a light-emitting element 12, a light-receiving element 13, and other suitable components, but the invention is not limited thereto. In some embodiments, the substrate 10 can also be used to form electrical connections between the integrated circuit 11, the light-emitting element 12, or the light-receiving element 13 and other components (e.g., a control unit, voltage source, not shown). For example, the substrate 10 can electrically connect one or more of the integrated circuit 11, the light-emitting element 12, and the light-receiving element 13. In some embodiments, the substrate 10 may be or may include a circuit board. For example, the circuit board may be a rigid circuit board, a flexible circuit board, a printed circuit board, a combination thereof, or other suitable circuit boards. In some embodiments, the substrate 10 may be a single-layer structure or a multi-layer structure.

[0056] In some embodiments, the substrate 10 includes a dielectric layer and a circuit pattern located within or on the dielectric layer. In some embodiments, the dielectric layer may include epoxy resin, polyimide (PI), phenolic resins (PF), bismaleimide triazine resin, glass fiber, carbon fiber, epoxy glass cloth, other suitable materials, or combinations thereof, but the invention is not limited thereto. In some embodiments, the circuit pattern may include metals, metal compounds, other suitable conductive materials, or combinations thereof. For example, the metal may be tin (Sn), copper (Cu), gold (Au), silver (Ag), nickel (Ni), indium (In), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), molybdenum (Mo), titanium (Ti), magnesium (Mg), zinc (Zn), germanium (Ge), or alloys thereof, but the invention is not limited thereto. For example, the metal compound may be tantalum nitride (TaN), titanium nitride (TiN), tungsten silicide (WSi2), indium tin oxide (ITO), indium oxide (InO), tin oxide (SnO), cadmium tin oxide (CTO), antimony tin oxide (ATO), aluminum zinc oxide (AZO), zinc tin oxide (ZTO), gallium zinc oxide (GZO), indium tungsten oxide (IWO), zinc oxide (ZnO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the present invention is not limited thereto.

[0057] like Figure 1 As shown, following the steps described above, an integrated circuit 11 is disposed on the substrate 10. Specifically, the integrated circuit 11 can be used to control one or both of the light-emitting element 12 and the light-receiving element 13, or can be used to electrically connect the light-emitting element 12, the light-receiving element 13, and other electronic components, but the present invention is not limited thereto. In some embodiments, the integrated circuit 11 covers a portion of the substrate 10 and exposes another portion of the substrate 10. In this case, the light-emitting element 12 may be disposed on the portion of the substrate 10 not covered by the integrated circuit 11, and the light-receiving element 13 may be disposed on or integrated into the integrated circuit 11. In some embodiments, the integrated circuit 11 includes a dielectric layer and a circuit pattern located in or on the dielectric layer. The possible materials of the dielectric layer and the circuit pattern can be referred to above and will not be repeated here.

[0058] like Figure 1As shown, following the steps described above, a light-emitting element 12 is disposed on the substrate 10, wherein the light-emitting element 12 has a light-emitting surface 12S. Specifically, the light-emitting element 12 is used to emit light, and the light leaves the light-emitting element 12 from the light-emitting surface 12S and interferes with (e.g., reflects) the target object. For ease of understanding, in the following text, the light leaving the light-emitting element 12 may be referred to as the first light, and the light after interfering with (e.g., reflecting) the target object may be referred to as the second light. In some embodiments, the light-emitting element 12 may include a light-emitting diode, such as an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro light-emitting diode (micro LED), or a quantum dot light-emitting diode (quantum dot LED), but the present invention is not limited thereto.

[0059] In some embodiments, the light-emitting element 12 includes an active layer, and the wavelength of the first light emitted by the light-emitting element 12 depends on the material composition of the active layer. For example, when the material of the active layer is or includes the InGaN series, it can emit blue light, deep blue light, or green light with a peak wavelength of 400 nm to 490 nm; when the material of the active layer is or includes the AlGaN series, it can emit ultraviolet light with a peak wavelength of 250 nm to 400 nm; when the material of the active layer is or includes the InGaAs series, InGaAsP series, AlGaAs series, or AlGaInAs series, it can emit infrared light with a peak wavelength of 700 nm to 1700 nm; when the material of the active layer is or includes the InGaP series or AlGaInP series, it can emit red light with a peak wavelength of 610 nm to 700 nm, or yellow light with a peak wavelength of 530 nm to 600 nm. It is worth mentioning that the colored light mentioned above is just an example; the light-emitting element 12 can also emit invisible light, such as infrared light or ultraviolet light.

[0060] like Figure 1As shown, following the steps described above, a light-receiving element 13 is disposed on the integrated circuit 11, wherein the light-receiving element 13 has a light-receiving surface 13S. Specifically, the light-receiving element 13 is used to receive a second light beam, wherein the second light beam enters the light-receiving element 13 via the light-receiving surface 13S and generates a corresponding sensing current. In some embodiments, the light-receiving element 13 may include a photoresistor, a photodiode, a light-emitting diode, a combination thereof, or other suitable elements, but the present invention is not limited thereto. In some embodiments, the light-receiving element 13 is embedded in or integrated into the integrated circuit 11. In other words, the light-receiving element 13 does not protrude from the integrated circuit 11. Alternatively, the light-receiving element 13 may be part of the integrated circuit 11 and formed in the same fabrication process as the integrated circuit 11. In this case, the light-receiving surface 13S of the light-receiving element 13 is coplanar with the upper surface of the integrated circuit 11.

[0061] In some embodiments, the light-receiving element 13 includes an optoelectronic conversion layer for converting light of a specific wavelength into electrical signals. For example, the optoelectronic conversion layer can convert blue light and dark blue light with peak wavelengths of 400 nm to 490 nm into electrical signals; green light with peak wavelengths of 490 nm to 550 nm into electrical signals; ultraviolet light with peak wavelengths of 250 nm to 400 nm into electrical signals; infrared light with peak wavelengths of 700 nm to 1700 nm into electrical signals; red light with peak wavelengths of 610 nm to 700 nm; or yellow light with peak wavelengths of 530 nm to 600 nm into electrical signals, but the invention is not limited thereto. It is worth noting that the above wavelength ranges are merely examples, and the light-receiving element 13 can also receive invisible light, such as infrared or ultraviolet light.

[0062] like Figure 1 As shown, following the above steps, a first photoresist barrier 14 is provided on the integrated circuit 11. The first photoresist barrier 14 is located between the light-emitting surface 12S of the light-emitting element 12 and the light-receiving surface 13S of the light-receiving element 13, and spans the entire integrated circuit 11. Specifically, the first photoresist barrier 14 can be used to block light to prevent the light-receiving element 13 from receiving side-facing light (i.e., the first light). In addition, the first photoresist barrier 14 can also be used as a sacrificial layer or a stop layer to prevent the integrated circuit 11 located under the first photoresist barrier 14 from being damaged during subsequent package cutting and fabrication processes.

[0063] In some embodiments, the first photoresist barrier 14 may include silicone, epoxy resin, polyphthalamide (PPA), polychlorinated biphenyl (PCB), copper foil, aluminum foil, combinations thereof, or other suitable materials, but the invention is not limited thereto. In some embodiments, the first photoresist barrier 14 may be formed by a dispensing process, a coating process, a pick and press process, combinations thereof, or other suitable processes, but the invention is not limited thereto. In some embodiments, the visible light transmittance of the first photoresist barrier 14 is less than 5%, but the invention is not limited thereto. For example, the visible light transmittance of the first photoresist barrier 14 may be 5%, 4%, 3%, 2%, 1%, 0.1%, or any value or range between the above values. In other embodiments, the infrared light transmittance of the first photoresist barrier 14 is less than 5%, or the ultraviolet light transmittance is less than 5%. In some embodiments, the shape of the first photoresist barrier 14 may be as follows: Figure 1 The first photoresist barrier 14 may be cylindrical as shown in the illustration, but the invention is not limited thereto. In other embodiments, the shape of the first photoresist barrier 14 may also be triangular, quadrilateral, polygonal, irregular, or other suitable shapes, but the invention is not limited thereto.

[0064] In some embodiments, the height h1 of the first photoresist barrier 14 is between 0.1 mm and 1.5 mm, but the invention is not limited thereto. For example, the height h1 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, 0.5 mm, 0.6 mm, 1.5 mm, or any value or range between the above. When the height h1 is less than 0.1 mm, the first photoresist barrier 14 may not provide sufficient protection for the integrated circuit 11. Conversely, when the height h1 is greater than 1.5 mm, the first photoresist barrier 14 may occupy too much space in the package structure, which is not conducive to the miniaturization of the entire device.

[0065] In some embodiments, the width w1 of the first photoresist barrier 14 is between 0.05 mm and 2 mm, but the invention is not limited thereto. For example, the width w1 can be 0.05 mm, 0.08 mm, 0.1 mm, 0.12 mm, 0.15 mm, 0.3 mm, 0.8 mm, 1 mm, 1.5 mm, 2 mm, or any value or range between the above. When the width w1 is less than 0.05 mm, the first photoresist barrier 14 may not provide enough space to accommodate the second photoresist barrier 18, resulting in a decrease in the margin of the cutting and fabrication process. Conversely, when the width w1 is greater than 2 mm, the first photoresist barrier 14 may occupy too much space in the packaging structure, which is not conducive to the miniaturization of the entire device.

[0066] In some embodiments, the distance d1 between the first photoresist barrier 14 and the light-emitting element 12 is between 0.1 mm and 4 mm, but the present invention is not limited thereto. For example, the distance d1 can be 0.1 mm, 0.5 mm, 1 mm, 1.2 mm, 1.5 mm, 2 mm, 2.2 mm, 3 mm, 4 mm, or any value or range between the above values. When the distance d1 is less than 0.1 mm, the first photoresist barrier 14 may be too close to the light-emitting element 12, which leads to a decrease in the margin of the cutting and fabrication process. Conversely, when the distance d1 is greater than 4 mm, the first photoresist barrier 14 may occupy too much space in the packaging structure, which is not conducive to the miniaturization of the entire device.

[0067] In some embodiments, the distance d2 between the first photoresist barrier 14 and the light-receiving element 13 is between 0.1 mm and 4 mm, but the invention is not limited thereto. For example, the distance d2 can be 0.1 mm, 0.5 mm, 1 mm, 1.2 mm, 1.5 mm, 2 mm, 2.2 mm, 3 mm, 4 mm, or any value or range between the above. When the distance d2 is less than 0.1 mm, the first photoresist barrier 14 may be too close to the light-receiving element 13, which leads to a decrease in the margin of the cutting and manufacturing process. Conversely, when the distance d2 is greater than 4 mm, the first photoresist barrier 14 may occupy too much space in the packaging structure, which is not conducive to the miniaturization of the entire device.

[0068] like Figure 1 As shown, following the above steps, a first electrical connector 15 is provided to electrically connect the light-emitting element 12 and the substrate 10, and a second electrical connector 16 is provided to electrically connect the integrated circuit 11 and the substrate 10. In some embodiments, the first electrical connector 15 or the second electrical connector 16 may be or may include various electrical connection elements such as lines, solder, ag paste, redistribution layers (RDLs), pins, and pads.

[0069] like Figure 2 As shown, following the above steps, a package 17 is provided on the substrate 10 to completely or partially cover the integrated circuit 11, the light-emitting element 12, the light-receiving element 13, and the first photoresist barrier 14, wherein the package 17 covers the light-emitting surface 12S of the light-emitting element 12 and the light-receiving surface 13S of the light-receiving element 13. Specifically, the package 17 is used to protect the light-emitting element 12 and the light-receiving element 13 from damage by dust and moisture. Therefore, in some embodiments, the package 17 may also cover multiple side surfaces of the light-emitting element 12 and / or multiple side surfaces of the light-receiving element 13 to more comprehensively protect the light-emitting element 12 and the light-receiving element 13.

[0070] In some embodiments, the encapsulation 17 may comprise a polymeric material, a combination thereof, or other suitable materials, but the invention is not limited thereto. For example, the polymeric material may be or may include epoxy resin, polyimide (PI), polypropylene (PP), a combination thereof, or other suitable polymeric materials, but the invention is not limited thereto. In some embodiments, the encapsulation 17 may be as follows: Figure 2 The rectangular shape shown is not the only one in the invention. In other embodiments, the package 17 may also be trapezoidal, polygonal, or other suitable shapes.

[0071] like Figure 3 As shown, following the above steps, using the first photoresist barrier 14 as a sacrificial layer or stop layer, a cutting fabrication process DP is performed on the package 17, dividing the package 17 into a first package portion 17A and a second package portion 17B. The light-emitting element 12 is located in the first package portion 17A, the light-receiving element 13 is located in the second package portion 17B, and the first photoresist barrier 14 is located between the first package portion 17A and the second package portion 17B. In some embodiments, the cutting fabrication process DP can be implemented using a blade, laser, etching, a combination thereof, or other suitable fabrication processes, but the invention is not limited thereto. In some embodiments where the cutting fabrication process DP is performed using a blade, the width of the blade can be smaller than the width w1 of the first photoresist barrier 14 to improve the margin of the cutting fabrication process DP.

[0072] like Figure 4As shown, following the above steps, after performing the cutting fabrication process DP, a gap G is formed between the first packaging portion 17A and the second packaging portion 17B. In some embodiments, the width of the gap G may be equal to the width of the blade. In other words, the width of the gap G may be less than the width w1 of the first photoresist barrier 14. In some embodiments, the height h2 of the first photoresist barrier 14 after performing the cutting fabrication process DP is less than the height h1 before performing the cutting fabrication process DP. In other words, a portion of the first photoresist barrier 14 may be removed by the cutting fabrication process DP, but the present invention is not limited thereto.

[0073] like Figure 5 As shown, a second photoresist barrier 18 is disposed on the first photoresist barrier 14 exposed from the gap G, wherein the first photoresist barrier 14 and the second photoresist barrier 18 are located between the first package portion 17A and the second package portion 17B, and span the entire integrated circuit 11. Specifically, the second photoresist barrier 18 can be directly disposed on the first photoresist barrier 14, and together with the first photoresist barrier 14, it is used to block light to prevent the light receiving element 13 from receiving side-facing light (i.e., the first light) and causing misjudgment.

[0074] In some embodiments, the second photoresist barrier 18 may include silicone, epoxy resin, PPA, PCB, copper foil, aluminum foil, combinations thereof, or other suitable materials, but the invention is not limited thereto. In some embodiments, the second photoresist barrier 18 may be formed by dispensing, coating, selection and pressing, combinations thereof, or other suitable manufacturing processes, but the invention is not limited thereto. In some embodiments, the material of the first photoresist barrier 14 may be different from the material of the second photoresist barrier 18. Alternatively, the second photoresist barrier 18 may be an air gap. That is, the second photoresist barrier 18 may not be solid, but rather a space filled with gas (e.g., air). In this case, total internal reflection of light can be achieved by adjusting the refractive index ratio between the package 17 and the gas located in the second photoresist barrier 18. For example, the refractive index ratio between the encapsulation 17 and the gas located in the second photoresist barrier 18 can be between 0.8:1 and 2:1, for example, it can be 0.8:1, 1.3:1, 1.6:1, 2:1, or any value or range between the above values, but the present invention is not limited thereto.

[0075] In some embodiments, the visible light transmittance of the second photoresist barrier 18 is less than 5%, but the present invention is not limited thereto. For example, the visible light transmittance of the second photoresist barrier 18 may be 5%, 4%, 3%, 2%, 1%, 0.1%, or any value or range between the above values. In other embodiments, the infrared light transmittance of the second photoresist barrier 18 is less than 5%, or the ultraviolet light transmittance is less than 5%. In some embodiments, the shape of the second photoresist barrier 18 may be as follows: Figure 5 The rectangular block shape shown is not limited to this. In other embodiments, the first photoresist barrier 14 may also be polygonal, irregular, or other suitable shapes, but the invention is not limited to these.

[0076] In some embodiments, the width w2 of the second photoresist barrier 18 is between 0.05 mm and 1 mm, but the invention is not limited thereto. For example, the width w2 can be 0.05 mm, 0.15 mm, 0.08 mm, 0.2 mm, 1 mm, or any value or range between the above. In some embodiments, the width w1 of the first photoresist barrier is different from the width w1 of the second photoresist barrier; for example, the width w1 can be less than, equal to, or greater than the width w2.

[0077] Through the above configuration, the present invention provides a packaging structure, which includes a substrate 10, an integrated circuit 11, a light-emitting element 12, a light-receiving element 13, a first photoresist barrier 14, a second photoresist barrier 18, and a package body 17. Specifically, the integrated circuit 11 is disposed on the substrate 10. The light-emitting element 12 is disposed on the substrate 10 and has a light-emitting surface 12S. The light-receiving element 13 is disposed on the integrated circuit 11 and has a light-receiving surface 13S. The first photoresist barrier 14 is disposed on the integrated circuit 11 and is located between the light-emitting surface 12S of the light-emitting element 12 and the light-receiving surface 13S of the light-receiving element 13. The second photoresist barrier 18 is disposed on the first photoresist barrier 14. The package body 17 is disposed on the light-emitting element 12 and the light-receiving element 13.

[0078] Various embodiments of the packaging structure will be further provided below to illustrate the technology of the present invention more completely. For the sake of simplicity, the same element symbols will represent the same or similar elements in the following text and in the accompanying drawings, and therefore will not be described again.

[0079] Reference Figure 6A and Figure 6B These are cross-sectional views and another cross-sectional view showing the packaging structure, respectively, according to other embodiments of the present invention. More specifically, Figure 6A This is observing the packaging structure from its long axis, while Figure 6A This involves observing the package structure from its short axis. For example... Figure 6B As shown, in some embodiments, the width of the integrated circuit 11 is smaller than the width of the substrate 10. In this case, the first photoresist barrier 14 can span the entire integrated circuit 11 and cover both side surfaces of the integrated circuit 11. In other words, the first photoresist barrier 14 can have an "inverted U-shaped" shape, without necessarily having a... Figure 5 The columnar shape shown.

[0080] Reference Figure 7A and Figure 7B These are cross-sectional schematic diagrams and another cross-sectional schematic diagram showing the packaging structure, respectively, according to some embodiments of the present invention. More specifically, Figure 7A This is observing the packaging structure from its long axis, while Figure 7A This involves observing the package structure from its short axis. For example... Figure 7A As shown, in some embodiments, the width of the integrated circuit 11 is smaller than the width of the substrate 10. In this case, first sub-blocking portions 14A can be provided on both sides of the integrated circuit 11. Specifically, the first sub-blocking portions 14A are used to support other components located thereon, such as the second sub-blocking portion 14B to be provided. Then, the second sub-blocking portion 14B is provided on the first sub-blocking portion 14A and the integrated circuit 11, wherein the first sub-blocking portion 14A and the second sub-blocking portion 14B together constitute the first photoresist barrier 14.

[0081] In some embodiments, the material of the first sub-blocking portion 14A may be similar to or the same as that of the second sub-blocking portion 14B, but the invention is not limited thereto. In some embodiments, the first sub-blocking portion 14A may have a higher mechanical strength than the second sub-blocking portion 14B to more effectively support the second sub-blocking portion 14B. In some embodiments, the second sub-blocking portion 14B may have a lower visible light transmittance (or invisible light transmittance) than the first sub-blocking portion 14A to prevent the light-receiving element 13 from receiving the first light.

[0082] In some embodiments, the shape of the first sub-blocking portion 14A may be as follows: Figure 7B The first sub-blocking portion 14A is shown as a circular sphere, but the invention is not limited thereto. In other embodiments, the shape of the first sub-blocking portion 14A may also be an elliptical sphere, a polygonal block, or other suitable shape. In some embodiments, the height h3 of the first sub-blocking portion 14A may be greater than the height h4 of the integrated circuit 11, but the invention is not limited thereto. In some embodiments, the height h3 of the first sub-blocking portion 14A may also be equal to or less than the height h4 of the integrated circuit 11.

[0083] In some embodiments, in a top view or sectional view, the width of the first sub-blocking portion 14A may be greater than the width of the second sub-blocking portion 14B to better support the second sub-blocking portion 14B located thereon. For example, the width of the first sub-blocking portion 14A may be 110%, 120%, 130%, 140%, 150% of the width of the second sub-blocking portion 14B, or any value or range between the above values, but the present invention is not limited thereto.

[0084] In some embodiments, the shape of the second sub-blocking portion 14B may be as follows: Figure 7B The elliptical cylinder shown is not the only embodiment of the invention. In other embodiments, the second sub-blocking portion 14B may also be a rectangular cylinder, a polygonal block, or other suitable shape. The first sub-blocking portion 14A and the second sub-blocking portion 14B have the following characteristics: Figure 6B In the embodiment with the shape shown, an opaque dielectric material may also be filled around the first sub-blocking portion 14A and the second sub-blocking portion 14B to prevent the first light from passing through the gap between the two elements.

[0085] Reference Figure 8A and Figure 8B These are cross-sectional schematic diagrams and another cross-sectional schematic diagram showing the packaging structure according to further embodiments of the present invention. More specifically, Figure 8A This is observing the packaging structure from its long axis, while Figure 8A This involves observing the package structure from its short axis. For example... Figure 8B As shown, in some embodiments, the first sub-block 14A may be a rectangular block to better cover the side surface of the integrated circuit 11 and support the second sub-block 14B. In other words, the present invention can adjust the specific shape of the first sub-block 14A or the specific shape of the second sub-block 14B according to design requirements to selectively cover all or part (e.g., a specific portion) of the side surface of the integrated circuit 11.

[0086] Reference Figures 9A to 9C These are, respectively, perspective views, side views, and top views of the packaging structure according to some embodiments of the present invention. Figure 9A As shown, in some embodiments, the light-receiving element 13 protrudes from the integrated circuit 11. In other words, the light-receiving element 13 may not be integrated into the integrated circuit 11, but may be independently disposed on the integrated circuit 11. In this case, the light-receiving surface 13S of the light-receiving element 13 is not coplanar with the upper surface of the integrated circuit 11. In some embodiments, the package structure further includes a third electrical connector 19, and the third electrical connector 19 electrically connects the light-receiving element 13 and the integrated circuit 11. Similarly, the third electrical connector 19 may also be or may include various electrical connectors such as wires, solder, silver paste, redistribution structures, pads, pins, etc.

[0087] like Figure 9B and Figure 9C As shown, in the cross-sectional or top view, the width w1 of the first photoresist barrier 14 is greater than the width w2 of the second photoresist barrier 18. Furthermore, the width w1 of the first photoresist barrier 14 can gradually decrease from the upper and lower sides of the substrate 10 towards the center, exhibiting a "dumbbell-shaped" structure. However, the present invention is not limited to this; the shape of the first photoresist barrier 14 can be determined according to design requirements.

[0088] Reference Figure 10 This is a perspective view of a package structure according to some embodiments of the present invention. As shown, in some embodiments, the integrated circuit 11 may extend below the light-emitting element 12. In other words, the light-emitting element 12 is disposed on the integrated circuit 11 and protrudes from the integrated circuit 11. In this case, the light-emitting surface 12S of the light-emitting element 12 is not coplanar with the upper surface of the integrated circuit 11. In some embodiments, the package structure further includes a fourth electrical connector 20, and the fourth electrical connector 20 electrically connects the light-emitting element 12 and the integrated circuit 11. Similarly, the fourth electrical connector 20 may be or may include various electrical connectors such as wires, solder, silver paste, redistribution structures, pads, pins, etc. In addition, in Figure 10 In the illustrated embodiment, the light-receiving element 13 is embedded in or integrated into the integrated circuit 11. In other words, the light-receiving element 13 does not protrude from the integrated circuit 11.

[0089] Reference Figure 11 The figure shows a perspective view of the packaging structure according to some embodiments of the present invention. As shown, in some embodiments, the light-emitting element 12 is disposed on and protrudes from the integrated circuit 11, and the light-receiving element 13 is embedded in or integrated into the integrated circuit 11 without protruding from the integrated circuit 11. In other words, the light-emitting element 12 and the light-receiving element 13 of the present invention may be optionally disposed independently on the substrate 10 or the integrated circuit 11 as required by design, or may be optionally integrated into or embedded in the integrated circuit 11.

[0090] Reference Figure 12 This is a perspective view of the packaging structure according to some embodiments of the present invention. As shown, in some embodiments, the number of light-emitting elements 12 is multiple. For example, the light-emitting elements 12 may include a first light-emitting element 12A and a second light-emitting element 12B, but the present invention is not limited thereto. The first light-emitting element 12A and the second light-emitting element 12B may be disposed on the substrate 10 or on the integrated circuit 11, depending on design requirements. For example, the first light-emitting element 12A may be disposed on the substrate 10, and the second light-emitting element 12B may be disposed on the integrated circuit 11.

[0091] Similarly, in some embodiments, the number of light-receiving elements 13 is multiple. For example, the light-receiving elements 13 may include a first light-receiving element 13A and a second light-receiving element 13B, but the present invention is not limited thereto. The first light-receiving element 13A and the second light-receiving element 13B may be disposed on the integrated circuit 11 or integrated (embedded) in the integrated circuit 11, depending on design requirements. For example, both the first light-receiving element 13A and the second light-receiving element 13B may be disposed on the integrated circuit 11.

[0092] Reference Figure 13 This is a perspective view of the package structure according to some embodiments of the present invention. As shown, in some embodiments, the first light-receiving element 13A and the second light-receiving element 13B may be disposed on the integrated circuit 11 or integrated (embedded) in the integrated circuit 11, depending on design requirements. For example, the first light-receiving element 13A and the second light-receiving element 13B may be disposed on the integrated circuit 11, and the second light-receiving element 13B may be integrated (embedded) in the integrated circuit 11.

[0093] In summary, the present invention provides a packaging structure that reduces the specific distance required between the cut-out and the light-emitting element and the light-receiving element by setting a sacrificial layer or a barrier layer, thereby simplifying the manufacturing process and reducing the element size.

[0094] Components in the embodiments of this invention can be freely mixed and matched as long as they do not violate the spirit of the invention or conflict with it. Furthermore, the scope of protection of this invention is not limited to the manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of this specification. Any manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps that are currently or will be developed in the future can be understood from the disclosure of this invention, and can be used according to this invention as long as they can perform substantially the same function or obtain substantially the same result in the embodiments described herein. Therefore, the scope of protection of this invention includes the above-mentioned manufacturing processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. No embodiment or claim of this invention needs to achieve all the objects, advantages, and / or features disclosed in this invention.

[0095] Several embodiments have been summarized above to enable those skilled in the art to better understand the viewpoints of the embodiments of the present invention. Those skilled in the art should understand that other manufacturing processes and structures can be designed or modified based on the embodiments of the present invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent manufacturing processes and structures do not depart from the spirit and scope of the present invention, and various changes, substitutions, and replacements can be made without departing from the spirit and scope of the present invention.

Claims

1. A packaging structure, comprising: substrate; Integrated circuits are disposed on this substrate; A light-emitting element is disposed on the substrate and has a light-emitting surface; A light-collecting element is disposed on the integrated circuit and has a light-collecting surface; A first photoresist barrier is disposed on the integrated circuit and located between the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element; A second photoresist barrier is disposed on the first photoresist barrier; as well as An encapsulation is disposed on the light-emitting element and the light-receiving element.

2. The encapsulation structure as claimed in claim 1, wherein the encapsulation partially or completely covers the light-emitting surface and the light-receiving surface.

3. The packaging structure as described in claim 1, wherein the packaging body comprises: The first encapsulation part covers the light-emitting element; as well as The second encapsulation section covers the light-receiving element. The first photoresist barrier and the second photoresist barrier are disposed between the first encapsulation portion and the second encapsulation portion.

4. The packaging structure as described in claim 1, wherein the number of light-emitting elements is multiple.

5. The packaging structure of claim 4, wherein the plurality of light-emitting elements comprises: A first light-emitting element is disposed on the substrate; as well as The second light-emitting element is disposed on the integrated circuit.

6. The packaging structure as described in claim 1, wherein the number of light-receiving elements is multiple.

7. The packaging structure of claim 6, wherein the plurality of light-receiving elements comprises: The first light-receiving element is disposed on the integrated circuit; as well as The second light-receiving element is embedded in the integrated circuit.

8. The encapsulation structure of claim 1, wherein the first photoresist barrier comprises: First sub-blocking section; as well as The second sub-blocking part is disposed on the first sub-blocking part.

9. The packaging structure of claim 8, wherein the first sub-blocking portion covers at least a portion of the side surface of the integrated circuit.

10. The packaging structure of claim 8, wherein, in a top view, the width of the first sub-block is greater than the width of the second sub-block.

11. The packaging structure of claim 8, wherein the material of the first sub-blocking portion is different from the material of the second sub-blocking portion.

12. The packaging structure of claim 8, wherein, in a cross-sectional view, the height of the first sub-block is greater than the height of the integrated circuit.

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