Optical sensor with emi shielding structure and method of manufacturing the same

Abstract

The application relates to the technical field of light sensors, and discloses an optical sensor with an EMI shielding structure and a manufacturing method thereof. The optical sensor comprises a first substrate, a second substrate, a light emitter, a light receiver and a light shield cover. The second substrate is arranged on the first substrate, and the second substrate is provided with a containing hole. The light emitter is arranged in the containing hole and is electrically connected with the first substrate. The light receiver is arranged on the second substrate and is electrically connected with the first substrate. A shielding side wall is arranged on the inner side of the containing hole and surrounds the outer periphery of the light emitter. A metal cover plate is arranged on the upper end of the containing hole, and the metal cover plate is electrically connected with the shielding side wall. The metal cover plate is provided with a first hole, and the first hole is opposite to the light emitter in the up-down direction. The light shield cover is arranged on the second substrate, and the light shield cover is provided with a second hole and a third hole. The second hole is communicated with the first hole, and the third hole is opposite to the light receiver in the up-down direction. The electromagnetic shielding structure surrounds the outer periphery of the light emitter and covers the top of the light emitter, avoids causing electromagnetic interference on other electronic elements, and ensures product reliability.

Description

Technical Field

[0001] This invention relates to the field of optical sensor technology, and in particular to an optical sensor with an EMI shielding structure and its manufacturing method. Background Technology

[0002] Currently, optical sensors are widely used in industrial automation, consumer electronics, and automotive driver assistance systems. Examples include ambient light sensors, proximity sensors, and lidar, which consist of a light emitter, a light receiver, and a detection circuit that converts light signals into electrical signals to obtain detection results.

[0003] For example, Chinese invention patent application CN118156257A discloses a light sensor packaging structure and display device. The light sensor packaging structure includes a circuit board, a chip, a light-emitting component, and a shielding cover. The chip and the light-emitting component are disposed on the circuit board. The light-emitting component is used to emit light, and the sensing component of the chip is used to receive the light emitted by the light-emitting component after it illuminates an external object and is reflected back. The shielding cover has multiple guides, corresponding to the sensing component, the photosensitive component, and the light-emitting component, respectively. The chip is covered with a first encapsulating colloid, and the light-emitting component is covered with a second encapsulating colloid. The shielding cover is disposed on the circuit board and covers the first encapsulating colloid and the second encapsulating colloid. A wall is provided between the first encapsulating colloid and the second encapsulating colloid in the shielding cover to separate the light-emitting component and the chip, preventing the light signal emitted by the light-emitting component from leaking to the sensing component.

[0004] In existing optical sensor packaging structures, the light-emitting component emits light signals through the openings of the first encapsulation colloid and the shielding cover when in operation. However, changes in voltage or current in the driving circuit cause the light-emitting component to simultaneously generate electromagnetic wave signals, causing electromagnetic interference to other electronic components and making it difficult to guarantee the reliability of the optical sensor. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that when the light-emitting component of the existing optical sensor packaging structure is working, the light-emitting component also generates electromagnetic wave signals, which causes electromagnetic interference to other electronic components, making it difficult to guarantee the reliability of the optical sensor.

[0006] To address the aforementioned technical problems, this invention provides a technical solution for an optical sensor with an EMI shielding structure: Optical sensors with EMI shielding structures include: First substrate; A second substrate is disposed on the first substrate, and the second substrate has a receiving hole; A light emitter is disposed in the receiving hole, and the light emitter is electrically connected to the first substrate; A light receiver is disposed on the second substrate and is electrically connected to the first substrate. A shielding sidewall is provided inside the receiving hole, and the shielding sidewall is arranged around the outer periphery of the light emitter; A metal cover plate is disposed on the upper port of the receiving hole, and the metal cover plate is electrically connected to the shielding sidewall; the metal cover plate has a first hole, which is vertically opposite to the light emitter. A light shield is disposed on the second substrate and covers the light receiver and the metal cover plate. The light shield has a second hole and a third hole. The second hole communicates with the first hole, and the third hole is vertically opposite to the light receiver.

[0007] Furthermore, the shielding sidewall is formed by electroplating, and the metal cover plate is bonded to the shielding sidewall by conductive adhesive.

[0008] Furthermore, the conductive adhesive is applied to the second substrate and disposed around the upper port of the receiving hole. The coating height of the conductive adhesive is any size between 0.03mm and 0.1mm, and the coating width of the conductive adhesive is any size between 0.2mm and 0.3mm.

[0009] Furthermore, the conductive adhesive is any one of silver-based epoxy conductive adhesive, gold-based epoxy conductive adhesive, copper-based epoxy conductive adhesive, silicone conductive adhesive, and polyimide conductive adhesive.

[0010] Furthermore, the conductive adhesive includes a first overflow portion and a second overflow portion. The first overflow portion is disposed around the outer side of the metal cover plate and connects the side surface of the metal cover plate and the upper side surface of the second substrate. The second overflow portion is disposed around the inner wall of the receiving hole and connects the bottom surface of the metal cover plate and the side surface of the shielding sidewall.

[0011] Furthermore, the bottom surface of the first substrate is provided with a first circuit layer, the upper side of the first substrate is provided with a first pad, and the light emitter is electrically connected to the first pad; the upper side of the second substrate is provided with a second pad, and the light receiver is electrically connected to the second pad. Both the first substrate and the second substrate have through holes, and the through holes are filled with conductors. The conductors electrically connect the first pad and the first circuit layer, as well as the second pad and the first circuit layer.

[0012] Furthermore, the bottom surface of the second substrate is provided with a second circuit layer, the second circuit layer and the first pad are arranged at intervals, and the shielding sidewall is electrically connected to the second circuit layer; the optical sensor also includes an insulating layer, the insulating layer is disposed between the first substrate and the second substrate, and the insulating layer separates the first pad and the second circuit layer.

[0013] Furthermore, the surface of the second substrate also has a countersunk hole, which is vertically connected to the receiving hole, and the diameter of the countersunk hole is larger than the diameter of the receiving hole. The bottom of the countersunk hole has a stepped portion surrounding the receiving hole, and the metal cover plate is disposed on the stepped portion.

[0014] To address the aforementioned technical problems, this invention provides a technical solution for manufacturing an optical sensor with an EMI shielding structure: A method for fabricating an optical sensor with an EMI shielding structure, used to fabricate the optical sensor with an EMI shielding structure as described in any of the above-mentioned methods, the method comprising the following steps: S1. Prepare a first substrate and a second substrate, process a receiving hole on the second substrate, and form a shielding sidewall inside the receiving hole. S2. After bonding the first substrate and the second substrate, drill through holes in the first substrate and the second substrate and fill the through holes with conductors. S3. Perform a windowing process on the second substrate to form a countersunk hole and connect it to the receiving hole; S4. Place the light emitter into the receiving hole and connect it to the first substrate. Place the light receiver on the second substrate and connect it to the first substrate. S5. Place the metal cover plate over the receiving hole and electrically connect the metal cover plate to the shielding side wall. S6. Assemble the light shield on the upper side of the second substrate.

[0015] Furthermore, in step S5, a ring of conductive adhesive is first applied to the upper side of the receiving hole, and then a metal cover plate is installed. The conductive adhesive is squeezed through the metal cover plate to form a first overflow portion on the outside of the metal cover plate and a second overflow portion on the bottom surface of the metal cover plate.

[0016] Compared with existing technologies, the optical sensor with EMI shielding structure and its manufacturing method of the present invention have the following advantages: The optical sensor with EMI shielding structure adopts a design of a first substrate, a second substrate, a light emitter, a light receiver, and a light shield. The second substrate is disposed on the first substrate and has a receiving hole. The light emitter is disposed in the receiving hole and electrically connected to the first substrate, and the light receiver is disposed on the second substrate and electrically connected to the first substrate. The light emitter is used to emit light signals, and the light receiver is used to receive external light signals. The first substrate and the second substrate form a double-layer substrate for the optical sensor. The light emitter forms an embedded structure within the receiving hole, which allows for the spatial partitioning of the light emitter and light receiver in the vertical direction.

[0017] The optical sensor features a shielding sidewall inside the receiving aperture, surrounding the outer periphery of the emitter. A metal cover plate is positioned over the upper end of the receiving aperture and electrically connected to the shielding sidewall. The metal cover plate has a first hole through which light signals can be emitted outwards. The shielding sidewall and the metal cover plate together form an electromagnetic shielding structure that simultaneously surrounds the outer periphery of the emitter and covers its top. Furthermore, the connection between these two parts forms a seamless joint, preventing electromagnetic signals from transmitting from the receiving aperture to the emitter and shielding them from outward transmission, thus avoiding electromagnetic interference to other electronic components and improving the reliability of the optical sensor.

[0018] In addition, a light shield is disposed on the second substrate, covering the light receiver and the metal cover plate. The light shield has a second hole and a third hole. The second hole communicates with the first hole, and the third hole is vertically opposite to the light receiver. The light shield effectively seals and shields the emitter and receiver from light, preventing external moisture from entering and causing corrosion and damage to the emitter, receiver, and circuitry. The second hole of the light shield communicates with the first hole of the metal cover plate, jointly defining the path direction of the emitted light signal, while the third hole of the light shield defines the path direction of the received light signal, thereby ensuring the accuracy of light signal transmission and reception. Attached Figure Description

[0019] Figure 1 This is a cross-sectional schematic diagram of an optical sensor with an EMI shielding structure according to an embodiment of the present invention; Figure 2 This is a three-dimensional schematic diagram of an optical sensor with an EMI shielding structure (omitting the light shield and metal cover) according to an embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of step S1 in the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention. Figure 4 This is a cross-sectional schematic diagram of the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention, specifically step S2 (drilling through holes). Figure 5 This is a cross-sectional schematic diagram of step S2 (filling conductor) in the method of manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention. Figure 6 This is a cross-sectional schematic diagram of step S3 in the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention. Figure 7 This is a cross-sectional schematic diagram of step S4 in the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention. Figure 8 This is a cross-sectional schematic diagram of the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention, in step S5 (completing the adhesive coating). Figure 9 This is a cross-sectional schematic diagram of step S5 in the method for manufacturing an optical sensor with an EMI shielding structure according to an embodiment of the present invention. In the figure: 1. First substrate; 11. First circuit layer; 12. First pad; 13. Through hole; 14. Conductor; 2. Second substrate; 20. Receiving hole; 21. Shielding sidewall; 22. Metal cover plate; 220. First hole; 23. Second pad; 24. Second circuit layer; 25. Countersunk hole; 250. Stepped portion; 3. Light emitter; 4. Light receiver; 5. Light shield; 51. Second hole; 52. Third hole; 53. Barrier; 6. Conductive adhesive; 61. First overflow portion; 62. Second overflow portion; 7. Insulating layer. Detailed Implementation

[0020] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" used to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] like Figure 1 , Figure 2As shown, the optical sensor with EMI shielding structure of this invention includes: a first substrate 1, a second substrate 2, a light emitter 3, a light receiver 4, and a light shield 5; the second substrate 2 is disposed on the first substrate 1, and the second substrate 2 has a receiving hole 20; the light emitter 3 is disposed in the receiving hole 20 and is electrically connected to the first substrate 1; the light receiver 4 is disposed on the second substrate 2 and is electrically connected to the first substrate 1; the shielding sidewall 21 is disposed inside the receiving hole 20 and surrounds the outer periphery of the light emitter 3.

[0025] A metal cover plate 22 is installed on the upper port of the receiving hole 20, and the metal cover plate 22 is electrically connected to the shielding sidewall 21; the metal cover plate 22 has a first hole 220, which is vertically opposite to the light emitter 3. A light shield 5 is installed on the second substrate 2 and covers the light receiver 4 and the metal cover plate 22. The light shield 5 has a second hole 51 and a third hole 52, the second hole 51 is connected to the first hole 220, and the third hole 52 is vertically opposite to the light receiver 4.

[0026] The optical sensor with EMI shielding structure adopts a design of a first substrate 1, a second substrate 2, a light emitter 3, a light receiver 4, and a light shield 5. The light emitter 3 is used to emit light signals, and the light receiver 4 is used to receive external light signals. The first substrate 1 and the second substrate 2 form a double-layer substrate of the optical sensor. The light emitter 3 is embedded in the receiving hole 20, which can realize the purpose of spatially partitioning the light emitter 3 and the light receiver 4 in the vertical direction.

[0027] The receiving hole 20 has a shielding sidewall 21 on its inner side, which surrounds the outer periphery of the emitter 3. A metal cover plate 22 is placed over the upper port of the receiving hole 20 and is electrically connected to the shielding sidewall 21. The metal cover plate 22 has a first hole 220 through which light signals can be emitted. The shielding sidewall 21 and the metal cover plate 22 are connected to form an electromagnetic shielding structure, which simultaneously surrounds the outer periphery of the emitter 3 and covers the top of the emitter 3.

[0028] Furthermore, the connection between these two parts forms a complete seam, which not only prevents electromagnetic wave signals from being transmitted from the receiving hole 20 to the light emitter 3, but also shields the electromagnetic wave signals from being transmitted outward, avoiding electromagnetic interference to other electronic components and improving the reliability of the optical sensor. In addition, a light shield 5 is disposed on the second substrate 2, covering the light receiver 4 and the metal cover plate 22. The light shield 5 has a second hole 51 and a third hole 52. The second hole 51 communicates with the first hole 220, and the third hole 52 is vertically opposite to the light receiver 4.

[0029] The light shield 5 seals and shields the light emitter 3 and the light receiver 4, preventing external moisture from entering and causing corrosion and damage to the light emitter 3, the light receiver 4, and the circuit. The second hole 51 of the light shield 5 is connected to the first hole 220 of the metal cover plate 22, which together define the path direction of the emitted light signal. The third hole 52 of the light shield 5 defines the path direction of the received light signal, thereby ensuring the accuracy of the transmission and reception of the light signal.

[0030] The light shield 5 also has a baffle wall 53 inside, made of light-blocking material with a thickness of 0.2 mm. The baffle wall 53 is disposed on the second substrate 2 and separates the light emitter 3 and the light receiver 4. The baffle wall 53 plays a role in blocking the light signal between the light-emitting area and the light-receiving area. In some embodiments, the baffle wall 53 is not limited to a continuous wall structure, but can also be a door-shaped structure (with a notch). The notch of the baffle wall 53 spans across the light receiver 4, which can also separate the light-receiving areas of the light emitter 3 and the light receiver 4.

[0031] In this embodiment, the shielding sidewall 21 is formed by electroplating, and the metal cover plate 22 is bonded to the shielding sidewall 21 with conductive adhesive 6. Electroplating ensures that the shielding sidewall 21 completely covers the inner surface of the receiving hole 20, and the bonding between the shielding sidewall 21 and the second substrate 2 is stable, avoiding gaps or seams that could lead to poor electromagnetic shielding. The conductive adhesive 6 fills the seam between the two components and forms a reliable electrical connection, thereby ensuring the integrity of the electromagnetic shielding structure.

[0032] It should be noted that the conductive adhesive 6 is applied to the second substrate 2 and surrounds the upper port of the receiving hole 20. Specifically, the conductive adhesive 6 is a silver-based epoxy conductive adhesive, with a coating height of 0.05 mm and a coating width of 0.25 mm. When the metal cover plate 22 is pressed on, the conductive adhesive 6 can be squeezed out, ensuring a complete electrical connection between the metal cover plate 22 and the shielding sidewall 21.

[0033] In some embodiments of this application, the coating height of the conductive adhesive 6 is 0.03 mm, 0.04 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm, or any other size between 0.03 mm and 0.1 mm. Correspondingly, the coating width of the conductive adhesive 6 is 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.26 mm, 0.27 mm, 0.28 mm, 0.29 mm, or 0.3 mm, or any other size between 0.2 mm and 0.3 mm. Furthermore, the conductive adhesive 6 is not limited to silver-based epoxy-based conductive adhesives, but can also be any one of gold-based epoxy-based conductive adhesives, copper-based epoxy-based conductive adhesives, silicone conductive adhesives, or polyimide conductive adhesives.

[0034] In this embodiment, as Figure 9 As shown, the conductive adhesive 6 includes a first overflow portion 61 and a second overflow portion 62. The first overflow portion 61 is disposed around the outer side of the metal cover plate 22 and connects the side surface of the metal cover plate 22 and the upper side surface of the second substrate 2. The second overflow portion 62 is disposed around the inner wall of the receiving hole 20 and connects the bottom surface of the metal cover plate 22 and the side surface of the shielding sidewall 21. The first overflow portion 61 forms two adhesive portions at the upper port of the receiving hole 20, and the second overflow portion 62 forms two adhesive portions inside the receiving hole 20, ensuring the connection stability between the metal cover plate 22 and the second substrate 2, as well as the reliable electrical connection between the metal cover plate 22 and the shielding sidewall 21.

[0035] As a further preferred embodiment, the bottom surface of the first substrate 1 is provided with a first circuit layer 11, and the upper side of the first substrate 1 is provided with a first pad 12, to which the light emitter 3 is electrically connected; the upper side of the second substrate 2 is provided with a second pad 23, to which the light receiver 4 is electrically connected; both the first substrate 1 and the second substrate 2 are provided with through holes 13, and the through holes 13 are filled with conductors 14, which electrically connect the first pad 12 and the first circuit layer 11, and the second pad 23 and the first circuit layer 11. By utilizing the design of the through holes 13 and the conductors 14, the purpose of electrical connection in the vertical direction of the first substrate 1 can be achieved, ensuring that the light emitter 3 and the light receiver 4 form a reliable electrical connection with the first circuit layer 11 respectively.

[0036] The bottom surface of the second substrate 2 is provided with a second circuit layer 24, which is spaced apart from the first pad 12. The shielding sidewall 21 is electrically connected to the second circuit layer 24. The optical sensor also includes an insulating layer 7, which is disposed between the first substrate 1 and the second substrate 2, and separates the first pad 12 and the second circuit layer 24. The second circuit layer 24 is isolated from the first circuit layer 11 and can serve as a grounding circuit for grounding the electrical signal induced by the shielding sidewall 21.

[0037] It should be noted that, as Figure 7 As shown, the surface of the second substrate 2 also has a countersunk hole 25, which is vertically connected to the receiving hole 20. The diameter of the countersunk hole 25 is larger than that of the receiving hole 20. The bottom of the countersunk hole 25 has a stepped portion 250 surrounding the receiving hole 20. A metal cover plate 22 is disposed on the stepped portion 250 of the countersunk hole 25. For example, the depth of the countersunk hole 25 is 0.1 mm, and correspondingly, the thickness of the metal cover plate 22 is 0.15 mm. The outer diameter of the metal cover plate 22 is larger than that of the receiving hole 20, ensuring that it can provide complete electromagnetic shielding for the entire receiving hole 20 and the light emitter 3.

[0038] The method for manufacturing the aforementioned optical sensor includes the following steps: S1. Prepare the first substrate 1 and the second substrate 2, such as... Figure 3 As shown, a receiving hole 20 is processed on the second substrate 2, and a shielding sidewall 21 is formed inside the receiving hole 20. Specifically, the shielding sidewall 21 is formed by electroplating. Electroplating ensures that the shielding sidewall 21 completely covers the inner surface of the receiving hole 20, and the connection between the shielding sidewall 21 and the second substrate 2 is stable and good, avoiding the problem of poor electromagnetic shielding caused by gaps or gaps.

[0039] S2. After bonding the first substrate 1 and the second substrate 2, as follows: Figure 4 , Figure 5 As shown, through holes 13 are drilled in the first substrate 1 and the second substrate 2, and conductors 14 are filled into the through holes 13. It should be noted that the first substrate 1 and the second substrate 2 are bonded together by hot pressing with an insulating layer 7. The first substrate 1 and the second substrate 2 form a double-layer substrate of the optical sensor, providing a structural basis for embedding the light emitter 3 in the receiving hole 20. Moreover, the insulating layer 7 effectively isolates the first circuit layer 11 of the first substrate 1 and the second circuit layer 24 of the second substrate 2, preventing electrical signal crosstalk problems.

[0040] S3. Perform windowing treatment on the second substrate 2, such as... Figure 6 As shown, a window is opened to form a countersunk hole 25 and connects to the receiving hole 20. For example, the depth of the countersunk hole 25 is 0.1 mm, and the bottom of the countersunk hole 25 has a stepped portion surrounding the receiving hole 20, through which the stepped portion of the countersunk hole 25 provides a mounting base for the metal cover plate 22.

[0041] S4, such as Figure 7 As shown, the light emitter 3 is placed in the receiving hole 20 and electrically connected to the first substrate 1, and the light receiver 4 is placed on the second substrate 2 and electrically connected to the first substrate 1. Specifically, the light emitter 3 is wire-connected to the first pad 12 of the first substrate 1 and electrically connected to the first circuit layer 11 through the conductor 14; correspondingly, the light receiver 4 is wire-connected to the second pad 23 of the second substrate 2 and electrically connected to the first circuit layer 11 through the conductor 14.

[0042] S5, such as Figure 8 , Figure 9As shown, a metal cover plate 22 is placed over the receiving hole 20, and the metal cover plate 22 is electrically connected to the shielding sidewall 21. It should be noted that a ring of conductive adhesive 6 is applied to the upper side of the receiving hole 20 before the metal cover plate 22 is installed. The conductive adhesive 6 is pressed against the metal cover plate 22, forming a first overflow portion 61 on the outer side of the metal cover plate 22 and a second overflow portion 62 on the bottom surface of the metal cover plate 22. The first overflow portion 61 at the upper port of the receiving hole 20 and the second overflow portion 62 inside the receiving hole 20 form two adhesive portions, ensuring the connection stability between the metal cover plate 22 and the second substrate 2, as well as the reliable electrical connection between the metal cover plate 22 and the shielding sidewall 21.

[0043] S6, such as Figure 1 As shown, the light shield 5 is assembled on the upper side of the second substrate 2. The second hole 51 of the light shield 5 communicates with the first hole 220 of the metal cover plate 22, and the third hole 52 of the light shield 5 is vertically opposite to the light receiver 4, ensuring the accuracy of optical signal transmission and reception. The light shield 5 seals and shields the light emitter 3 and the light receiver 4, preventing external moisture from entering and causing corrosion and damage to the light emitter 3, the light receiver 4, and the circuit.

[0044] The specific embodiments of the method for manufacturing the optical sensor with an EMI shielding structure of the present invention are the same as the specific embodiments of the method for manufacturing the optical sensor described above in the specific embodiments of the optical sensor with an EMI shielding structure of the present invention, and will not be repeated here.

[0045] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. An optical sensor with an EMI shielding structure, characterized in that, include: First substrate (1); The second substrate (2) is disposed on the first substrate (1), and the second substrate (2) has a receiving hole (20). A light emitter (3) is disposed in the receiving hole (20), and the light emitter (3) is electrically connected to the first substrate (1); A light receiver (4) is disposed on the second substrate (2), and the light receiver (4) is electrically connected to the first substrate (1); A shielding sidewall (21) is provided inside the receiving hole (20), and the shielding sidewall (21) is arranged around the outer periphery of the light emitter (3); A metal cover plate (22) is installed on the upper port of the receiving hole (20), and the metal cover plate (22) is electrically connected to the shielding sidewall (21); the metal cover plate (22) has a first hole (220), and the first hole (220) is vertically opposite to the light emitter (3); A light shield (5) is disposed on the second substrate (2) and covers the light receiver (4) and the metal cover plate (22). The light shield (5) has a second hole (51) and a third hole (52). The second hole (51) communicates with the first hole (220), and the third hole (52) is vertically opposite to the light receiver (4).

2. The optical sensor with EMI shielding structure according to claim 1, characterized in that, The shielding sidewall (21) is formed by electroplating, and the metal cover plate (22) is bonded to the shielding sidewall (21) by conductive adhesive (6).

3. The optical sensor with EMI shielding structure according to claim 2, characterized in that, The conductive adhesive (6) is applied to the second substrate (2) and is disposed around the upper port of the receiving hole (20). The coating height of the conductive adhesive (6) is any size between 0.03mm and 0.1mm, and the coating width of the conductive adhesive (6) is any size between 0.2mm and 0.3mm.

4. The optical sensor with an EMI shielding structure according to claim 2 or 3, characterized in that, The conductive adhesive (6) is any one of silver-based epoxy conductive adhesive, gold-based epoxy conductive adhesive, copper-based epoxy conductive adhesive, silicone conductive adhesive, and polyimide conductive adhesive.

5. The optical sensor with an EMI shielding structure according to claim 2 or 3, characterized in that, The conductive adhesive (6) includes a first overflow portion (61) and a second overflow portion (62). The first overflow portion (61) is disposed around the outer side of the metal cover plate (22) and the first overflow portion (61) connects the side of the metal cover plate (22) and the upper side of the second substrate (2). The second overflow portion (62) is disposed around the inner wall of the receiving hole (20) and the second overflow portion (62) connects the bottom surface of the metal cover plate (22) and the side of the shielding sidewall (21).

6. The optical sensor with an EMI shielding structure according to any one of claims 1 to 3, characterized in that, The bottom surface of the first substrate (1) is provided with a first circuit layer (11), and the upper side of the first substrate (1) is provided with a first pad (12). The light emitter (3) is electrically connected to the first pad (12); the upper side of the second substrate (2) is provided with a second pad (23), and the light receiver (4) is electrically connected to the second pad (23). Both the first substrate (1) and the second substrate (2) have through holes (13). The through holes (13) are filled with conductors (14). The conductors (14) electrically connect the first pad (12) and the first circuit layer (11), as well as the second pad (23) and the first circuit layer (11).

7. The optical sensor with EMI shielding structure according to claim 6, characterized in that, The bottom surface of the second substrate (2) is provided with a second circuit layer (24), the second circuit layer (24) and the first pad (12) are arranged at intervals, and the shielding sidewall (21) is electrically connected to the second circuit layer (24); the optical sensor also includes an insulating layer (7), the insulating layer (7) is disposed between the first substrate (1) and the second substrate (2), and the insulating layer (7) separates the first pad (12) and the second circuit layer (24).

8. The optical sensor with an EMI shielding structure according to any one of claims 1 to 3, characterized in that, The surface of the second substrate (2) also has a countersunk hole (25), which is connected vertically to the receiving hole (20), and the diameter of the countersunk hole (25) is larger than the diameter of the receiving hole (20). The bottom of the countersunk hole (25) has a stepped portion (250) surrounding the receiving hole (20), and the metal cover plate (22) is provided on the stepped portion (250).

9. A method for fabricating an optical sensor with an EMI shielding structure, characterized in that, The method for manufacturing an optical sensor with an EMI shielding structure as described in any one of claims 1 to 8 comprises the following steps: S1. Prepare a first substrate (1) and a second substrate (2), process a receiving hole (20) on the second substrate (2), and form a shielding sidewall (21) inside the receiving hole (20). S2. After bonding the first substrate (1) and the second substrate (2), drill through holes (13) in the first substrate (1) and the second substrate (2) and fill the through holes (13) with conductors (14). S3. The second substrate (2) is subjected to windowing treatment to form a countersunk hole (25) and connect it to the receiving hole (20). S4. Place the light emitter (3) into the receiving hole (20) and electrically connect it to the first substrate (1). Place the light receiver (4) on the second substrate (2) and electrically connect it to the first substrate (1). S5. Cover the receiving hole (20) with the metal cover plate (22) and electrically connect the metal cover plate (22) to the shielding sidewall (21); S6. Assemble the light shield (5) on the upper side of the second substrate (2).

10. The method for manufacturing an optical sensor with an EMI shielding structure according to claim 9, characterized in that, In step S5, a ring of conductive adhesive (6) is first applied to the upper side of the receiving hole (20), and then a metal cover plate (22) is installed. The conductive adhesive (6) is squeezed by the metal cover plate (22) to form a first overflow portion (61) on the outside of the metal cover plate (22) and a second overflow portion (62) on the bottom surface of the metal cover plate (22).

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