Heating station, chip transfer apparatus and chip transfer method

Abstract

The present disclosure provides a heating table, a chip transfer device and a chip transfer method, and relates to the technical field of display. The heating table comprises a temperature control assembly and a bearing table. The temperature control assembly comprises a temperature control plate, a heating assembly and a cooling assembly. The heating assembly and the cooling assembly are stacked in the temperature control plate, and the heating assembly comprises a plurality of heating units. The bearing table is supported on the temperature control assembly and is used for bearing a receiving substrate. The side surface of the bearing table away from the temperature control assembly has a temperature control area corresponding to each heating unit. Each heating unit can be controlled independently to realize independent control of the temperature control area. In the present disclosure, the receiving substrate on the bearing table can be locally preheated by the heating unit, the transfer yield of the light emitting chip at a specific position is improved, and in addition, the receiving substrate can be cooled by the cooling assembly, and the transfer efficiency of the light emitting chip is improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a heating stage, a chip transfer device, and a chip transfer method. Background Technology

[0002] Mass transfer is a manufacturing technology that precisely transfers millions or even tens of millions of micron-sized light-emitting chips from a transfer substrate to a receiving substrate. It faces numerous challenges in terms of transfer yield, accuracy, and speed, thus becoming a technological bottleneck restricting next-generation display products. Currently, various laser-assisted transfer technologies have been developed. These technologies offer advantages such as minimal device damage, high selectivity, and fast and efficient response, making them a highly promising mass transfer solution.

[0003] Mass transfer technology has the most demanding requirements. It requires high-temperature, high-pressure, and high-precision transfer of upper and lower substrates of different sizes, as well as laser scanning processing and the peeling of upper and lower substrates. This process is a very important part of the production of display products. Due to the current complexity of this technology, there is an urgent need for a simpler transfer technology that can guarantee transfer yield, accuracy, and speed.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to provide a heating stage, a chip transfer device, and a chip transfer method that can improve the transfer yield and efficiency of light-emitting chips.

[0006] According to one aspect of this disclosure, a heating stage is provided, comprising:

[0007] A temperature control component includes a temperature control plate, a heating component, and a cooling component, wherein the heating component and the cooling component are stacked within the temperature control plate, and the heating component includes multiple heating units arranged in an array.

[0008] A support platform is supported on the temperature control component and is used to support the receiving substrate. The heating unit is used to heat the receiving substrate, and the cooling component is used to cool the receiving substrate.

[0009] The surface of the support platform away from the temperature control component has a temperature control zone corresponding to each heating unit. The opening and closing of each heating unit can be controlled individually to achieve independent control of the temperature of multiple temperature control zones.

[0010] According to any of the heating stages of this disclosure, the heating unit includes a heating wire or a heating tube, and in a first direction, the distribution density of the heating unit in the central region of the first direction is less than the distribution density in the edge region, and / or, in a second direction, the distribution density of the heating unit in the central region of the second direction is less than the distribution density in the edge region.

[0011] Wherein, the first direction is a direction parallel to the support platform, and the first direction and the second direction are perpendicular to each other.

[0012] According to any of the heating platforms described in this disclosure, in the first direction, the heating unit has a central region that takes the center of the heating unit as the midpoint and extends equidistantly to both sides of the heating unit, accounting for 1 / 6 of the size of the heating unit, and an edge region that takes one side of the heating unit as the boundary and extends to the other side of the heating unit, accounting for 1 / 6 of the size of the heating unit. The first direction is the row direction or column direction of the heating unit array distribution.

[0013] The heating unit has k1 winding segments distributed along the first direction in the central region and k2 winding segments distributed along the first direction in the edge region, wherein k2 is greater than k1, and the ratio of k2 to k1 is greater than or equal to 1.2 and less than or equal to 2.

[0014] According to any of the heating stages described in this disclosure, in the first direction, the distribution density of the heating units increases from the central region to the edge region.

[0015] According to any of the heating platforms described in this disclosure, the heating unit includes a plurality of first straight segments and a plurality of bent segments;

[0016] The first straight segments are parallel to each other and spaced apart, and the beginning and end ends of the first straight segments are connected sequentially by the multiple bent segments.

[0017] According to any of the heating platforms described in this disclosure, the heating unit includes a plurality of first straight segments, a plurality of bent segments, and a second straight segment;

[0018] The first straight line segments are parallel to each other and spaced apart, and the beginning and end ends of the first straight line segments are connected in sequence by the multiple bending segments;

[0019] The plurality of first straight line segments include a first sub-straight line segment and a second sub-straight line segment located on the outermost sides along the arrangement direction. The length direction of the second straight line segment is perpendicular to the arrangement direction of the plurality of first straight line segments and is connected to one of the first sub-straight line segment and the second sub-straight line segment.

[0020] According to any of the heating platforms described in this disclosure, in the arrangement direction of the plurality of first straight segments, the distance between two adjacent first straight segments is negatively correlated in the direction from the center of the heating unit to the two opposite edges in the arrangement direction of the first straight segments.

[0021] According to any of the heating stages described in this disclosure, the distances from the plurality of heating units to the support stage are not all the same.

[0022] According to any of the heating stages described in this disclosure, the cooling assembly includes a plurality of cooling units arranged in an array, each of the cooling units being disposed opposite to one or more of the temperature control zones.

[0023] According to any of the heating stages of this disclosure, the temperature control plate has a fixing hole that penetrates the temperature control plate in the thickness direction, the fixing hole being used to fix the temperature control plate and the support stage;

[0024] Both the heating component and the cooling component are arranged around the periphery of the fixing hole.

[0025] According to any of the heating platforms described in this disclosure, the temperature control plate has heating channels and cooling channels, and the heating component and the cooling component are respectively disposed in the heating channels and the cooling channels;

[0026] Alternatively, the temperature control plate may include at least three stacked layers, with the heating component and the cooling component located between two different layers.

[0027] According to any of the heating stages described in this disclosure, the heating stage further includes a temperature controller and a plurality of temperature sensors;

[0028] Each of the heating units is associated with one or more of the temperature sensors;

[0029] The support platform is provided with multiple slots facing away from the temperature control board, and each temperature sensor is located in one of the slots.

[0030] The temperature controller is communicatively connected to multiple heating units and multiple temperature sensors.

[0031] According to one aspect of this disclosure, a chip transfer apparatus is provided, comprising:

[0032] The heating table described in the above-mentioned aspect;

[0033] A pressurizing mechanism is located on the side of the heating stage near the support stage and is used to fix the transfer substrate;

[0034] The dissociation mechanism is located on the side of the pressurization mechanism away from the heating stage and is used to generate a laser of the target wavelength to irradiate the transfer substrate.

[0035] According to one aspect of this disclosure, a chip transfer method is provided, the method being applied to the chip transfer apparatus described in the above aspect, the method comprising:

[0036] The target heating unit included in the heating stage is used to locally heat the receiving substrate of the stage.

[0037] A laser of the target wavelength is generated by a dissociation mechanism to irradiate a transfer substrate fixed on a pressure mechanism, so that the light-emitting chip on the transfer substrate is transferred to the receiving area of ​​the receiving substrate.

[0038] The receiving substrate is cooled using the cooling components included in the heating stage to complete the transfer of the light-emitting chip in the receiving area on the receiving substrate.

[0039] According to any method described in this disclosure, the receiving substrate of the supported stage is locally heated using the target heating unit included in the heating stage, including:

[0040] The target heating unit and a plurality of adjacent heating units adjacent to the target heating unit are used to heat the receiving substrate.

[0041] Before generating a laser of the target wavelength using a dissociation mechanism to irradiate the transfer substrate fixed on the pressurization mechanism according to any method of this disclosure, the method further includes:

[0042] The heating temperature of the corresponding temperature control zone on the heating platform is collected by a temperature sensor and transmitted to the temperature controller;

[0043] When the temperature controller determines that the heating temperature is not within the reference temperature range, it adjusts the heating parameters of the target heating unit until the heating temperature is within the reference temperature range.

[0044] The embodiments disclosed herein include at least the following technical effects:

[0045] In this embodiment of the present disclosure, when transferring the light-emitting chip, the receiving substrate on the carrier stage can be locally preheated by the heating unit to improve the transfer effect of the light-emitting chip, reduce or even avoid the situation where the light-emitting chip falls off the receiving substrate, and ensure the transfer yield of the light-emitting chip; in addition, after the light-emitting chip is transferred, the receiving substrate can be locally cooled by the cooling unit so that the next local area of ​​the receiving substrate can be transferred in the future, thereby improving the transfer efficiency of the light-emitting chip.

[0046] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0047] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0048] Figure 1 This is a schematic diagram of a chip transfer device provided in this embodiment of the present disclosure.

[0049] Figure 2 This is a schematic diagram of the axial explosion structure of a heating table provided for an embodiment of this disclosure.

[0050] Figure 3 This is a top view of a temperature control component provided in an embodiment of the present disclosure.

[0051] Figure 4 This is a side view of a heating table provided for an embodiment of the present disclosure.

[0052] Figure 5 This is a side view of another heating stage provided in an embodiment of the present disclosure.

[0053] Figure 6 This is a top view of another temperature control component provided in this embodiment of the present disclosure.

[0054] Figure 7 This is a top view of another temperature control component provided in this embodiment of the present disclosure.

[0055] Figure 8 This is a top view of another temperature control component provided in this embodiment of the present disclosure.

[0056] Figure 9 This is a bottom view of a temperature control component provided in an embodiment of the present disclosure.

[0057] Figure 10 This is a schematic flowchart of a chip transfer method provided in this embodiment of the disclosure.

[0058] Figure label:

[0059] 10. Heating platform;

[0060] 1. Temperature control components; 2. Support platform; 3. Temperature sensor; 4. Insulation layer;

[0061] 11. Temperature control board; 12. Heating assembly; 13. Cooling assembly;

[0062] 111. Fixing hole; 112. Heating channel; 113. Cooling channel; 114. Sheet;

[0063] 121. Heating unit; 122. First straight segment; 123. Bending segment; 124. Second straight segment;

[0064] 131. Cooling unit; 132. Third straight section; 133. Bending section;

[0065] 21. Groove; 22. Temperature control zone. Detailed Implementation

[0066] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0067] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0068] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0069] This disclosure provides a chip transfer device for transferring millions or even tens of millions of micron-scale light-emitting chips (such as Micro LED chips) on a transfer substrate (such as a source substrate) to a receiving substrate (such as a relay substrate, a driver substrate, etc.).

[0070] The transfer substrate can be a glass substrate or a sapphire wafer, and the receiving substrate can be a glass substrate or a substrate containing a driving circuit. The driving circuit can be used to drive the light-emitting chip to emit light.

[0071] like Figure 1 As shown, the chip transfer apparatus 100 includes a heating stage 10, a pressurizing mechanism 20, and a dissociation mechanism 30. The heating stage 10 includes a support stage 2 and is used to support a receiving substrate. The pressurizing mechanism 20 is located on the side of the heating stage 10 close to the support stage 2 and is used to fix the transfer substrate. The dissociation mechanism 30 is located on the side of the pressurizing mechanism 20 away from the heating stage 10 and is used to generate a laser of a target wavelength to irradiate the transfer substrate.

[0072] Thus, after the receiving substrate and the transfer substrate are aligned based on the heating stage 10 and the pressurizing mechanism 20, the target wavelength laser can be generated by the dissociation mechanism 30 to irradiate the transfer substrate, thereby transferring a large number of light-emitting chips on the transfer substrate to the receiving substrate, thus realizing the transfer of a large number of light-emitting chips.

[0073] The specific structures of the pressurizing mechanism 20 and the dissociation mechanism 30 can be referenced from relevant technologies. The target wavelength of the laser generated by the dissociation mechanism 30 can be 100nm to 2000nm. Specifically, the target wavelength range can be 390nm to 780nm (such as visible light), 780nm to 2000nm (such as infrared light), or 100nm to 390nm (such as ultraviolet light). Further, the target wavelength can also be 770nm to 622nm (red light); 622nm to 597nm (orange light); 597nm to 577nm (yellow light); 577nm to 492nm (green light); 492nm to 450nm (cyan light); 450nm to 435nm (blue light); or 455nm to 350nm (violet light). Of course, the target wavelength can also be 100nm~1900nm, or 200nm~1800nm, or 300nm~1700nm, or 400nm~1600nm, or 500nm~1500nm, or 600nm~1400nm, or 700nm~1300nm, or 800nm~1200nm, or 900nm~1100nm, etc.

[0074] In related technologies, after the receiving substrate and the transfer substrate are aligned, the separation mechanism 30 is controlled to directly separate the transfer substrate from the light-emitting chip to achieve the transfer of the light-emitting chip. After careful research, the inventors discovered that after the light-emitting chip is transferred from the transfer substrate to the receiving substrate and connected to it, the connection may not be secure, and it is prone to detachment, thus reducing the transfer yield of the light-emitting chip.

[0075] This disclosure provides a chip transfer apparatus 100, including a heating stage 10 as shown in the figure. Figure 2 As shown, the heating stage 10 includes a temperature control component 1 and a support stage 2. The temperature control component 1 includes a temperature control plate 11, a heating component 12, and a cooling component 13. The heating component 12 and the cooling component 13 are stacked in the temperature control plate 11, and the heating component 12 includes a plurality of heating units 121 arranged in an array. The support stage 2 is supported on the temperature control component 1 and is used to support the receiving substrate. The heating units 121 are used to heat the receiving substrate, and the cooling component 13 is used to cool the receiving substrate.

[0076] Among them, such as Figure 2 As shown, the surface of the support platform 2 away from the temperature control component 1 has a temperature control zone 22 corresponding to each heating unit 121. The opening and closing of each heating unit 121 can be controlled individually to achieve independent control of the temperature of multiple temperature control zones 22. The temperature control zone 22 can be the area enclosed by the outer contour edge of the orthographic projection area of ​​the corresponding heating unit 121 on the surface of the support platform 2 away from the temperature control plate 11.

[0077] Thus, during the transfer of the light-emitting chip, the receiving substrate on the carrier stage 2 can be locally preheated by the heating unit 121, making it easier to transfer the light-emitting chip to the receiving substrate, improving the fixing effect between the light-emitting chip and the receiving substrate, reducing or even avoiding the situation where the light-emitting chip falls off the receiving substrate, and ensuring the transfer yield of the light-emitting chip; in addition, after the light-emitting chip is fixed to the receiving substrate, the receiving substrate can be cooled by the cooling component 13, and the areas on other receiving substrates can be reheated subsequently to improve the transfer efficiency of the light-emitting chip; furthermore, because the heating unit 121 has the effect of local heating, it can heat the area to be received on the receiving substrate while avoiding heating the non-receiving areas on the receiving substrate, thus achieving precise control of the heating area.

[0078] The temperature control plate 11 has a fixing hole 111 extending through it in the thickness direction. The fixing hole 111 is used to fix the temperature control plate 11 and the support platform 2, allowing for locking and fixing between the temperature control plate 11 and the support platform 2 by using fixing bolts or similar devices passing through the fixing hole 111. The fixing hole 111 on the temperature control plate 11 can be located at the edge of the temperature control plate 11 to avoid interference with the heating unit 121 and the cooling unit 131; of course, if... Figure 3 As shown, the fixing hole 111 can also be set at other positions on the temperature control plate 11, and the heating component 12 and cooling component 13 are arranged around the periphery of the fixing hole 111. In addition, when fixing the temperature control plate 11 and the support platform 2, the temperature control plate 11 and the support platform 2 can be directly attached and fixed, or a thermally conductive layer (such as thermally conductive adhesive) can be provided between the temperature control plate 11 and the support platform 2 to improve the heat transfer efficiency between the temperature control component 1 and the support platform 2.

[0079] The heating component 12 includes a heating unit 121, which can be an electric heating structure, such as a heating wire, or a heat exchange heating structure, such as a heating tube. The cooling component can be an air-cooled structure, such as a condenser tube, or a water-cooled structure, such as a water-cooling tube. Furthermore, the heating component 12 and the cooling component 13 can be integrally formed within the temperature control plate 11 to simplify the structure of the temperature control component 1, while ensuring close contact between the heating component 12, the cooling component 13, and the temperature control plate 11, thus improving heat transfer efficiency. For example, the heating component 12 and the cooling component 13 can be integrally injection molded with the temperature control plate 11 as inserts. Alternatively, the heating component 12 and the cooling component 13 can be fixed within the temperature control plate 11. Taking a single-layer plate 114 as an example, receiving grooves can be provided on both sides of the temperature control plate 11, and the heating component 12 and the cooling component 13 can be respectively disposed within the receiving grooves on both sides of the temperature control plate 11, or as... Figure 4 As shown, the temperature control plate 11 has heating channels 112 and cooling channels 113, and the heating component 12 and cooling component 13 are respectively disposed within the heating channels 112 and cooling channels 113; taking the temperature control plate 11 including at least three stacked plates 114 as an example, as Figure 5 As shown, the heating component 12 and the cooling component 13 are located between two different layers 114 to protect the heating component 12 and the cooling component 13 and extend their service life.

[0080] In some implementations, such as Figure 4 or Figure 5 As shown, the heating platform 10 also includes a heat insulation layer 4, which is located on the side of the temperature control component 1 away from the support platform 2.

[0081] Thus, by setting the heat insulation layer 4, it is easy to achieve thermal isolation between the temperature control component 1 and the external environment, thereby ensuring the heating efficiency of the heating component 12 to the receiving substrate and the cooling efficiency of the cooling component 13 to the receiving substrate.

[0082] The material of the insulation layer 4 can refer to relevant technologies. For example, the insulation layer 4 can be insulation cotton, etc.

[0083] In some implementations, such as Figure 2 As shown, the heating platform 10 also includes a temperature controller (not shown) and multiple temperature sensors 3. Each heating unit 121 is correspondingly provided with one or more temperature sensors 3, and the temperature controller is communicatively connected to the multiple heating units 121 and the multiple temperature sensors 3 respectively.

[0084] In this way, with the cooperation of the temperature controller and the temperature sensor 3, the heating temperature of the heating unit 121 on the receiving substrate and the cooling temperature of the cooling unit 131 on the receiving substrate can be effectively controlled.

[0085] The temperature sensor 3 can be mounted on the temperature control component 1 or on the support platform 2. Since the temperature sensor 3 is mainly used to detect the temperature of the receiving substrate, the closer the temperature sensor 3 is to the heating substrate, the more accurate the detected temperature value. Therefore, it is preferable that the temperature sensor 3 is mounted on the support platform 2.

[0086] For example, such as Figure 2 As shown, the support platform 2 is provided with multiple slots 21 facing away from the temperature control plate 11, and each temperature sensor 3 is located in one slot 21. In this way, multiple temperature sensors 3 can be arranged close to the receiving substrate without interfering with the placement of the receiving substrate, effectively ensuring the accuracy of the temperature values ​​of the receiving substrate detected by each temperature sensor 3 in each temperature control zone.

[0087] The temperature controller and temperature sensor 3 can communicate wirelessly or via wired connection. The heating platform 10 also includes connecting wires that are electrically connected to both the temperature controller and temperature sensor 3. Based on the location of the temperature sensor 3, the connecting wires can be injection molded within the support platform 2, with one end extending into the groove 21 on the support platform 2 and electrically connected to the temperature sensor 3, and the other end extending out of the support platform 2 and electrically connected to the temperature controller. Alternatively, the connecting wires can be located between the support platform 2 and the temperature control board 11, with one end extending out of the edge of the support platform 2 and electrically connected to the temperature controller, and the other end penetrating to the bottom of the groove 21 and electrically connected to the temperature sensor 3.

[0088] In this embodiment of the disclosure, for the stacked cooling component 13 and heating component 12, the cooling component 13 may be located between the heating component 12 and the support platform 2, or it may be as follows: Figure 4 or Figure 5 As shown, the cooling component 13 is located on the side of the heating component 12 away from the support platform 2. When the heating component 12 is located between the cooling component 13 and the support platform 2, the heating unit 121 can be selected as a heating wire to ensure the heat exchange effect between the cooling component 13 and the support platform 2, thereby ensuring the cooling effect on the receiving substrate.

[0089] The connection end of the heating unit 121 can extend from the edge of the temperature control plate 11 to facilitate the electrical connection between the heating unit 121 (e.g., heating wire) and the temperature controller, or to facilitate the connection between the heating unit 121 (e.g., heating tube) and the external pipeline; the connection end of the cooling unit 131 can extend from the edge of the temperature control plate 11, or from the surface of the temperature control plate 11 away from the support platform 2, to facilitate the connection between the cooling unit 131 (e.g., water cooling tube) and the external pipeline.

[0090] For the multiple heating units 121 distributed in the array, the multiple heating units 121 can be arranged in the same layer; or the multiple heating units 121 can be arranged in layers, that is, the distances of the multiple heating units 121 to the support platform 2 are not all the same, so that the connection ends of the multiple heating units 121 can extend from the edge of the temperature control plate 11 and avoid mutual interference between the multiple heating units 121.

[0091] For example, the plurality of heating units 121 include a plurality of first sub-heating units 121 and at least one second sub-heating unit 121. The plurality of first sub-heating units 121 are arranged on the same layer, and the at least one second sub-heating unit 121 is arranged on the same layer. The distance from the first sub-heating unit 121 to the support platform 2 is different from the distance from the second sub-heating unit 121 to the support platform 2. In this case, the connecting ends of the plurality of first sub-heating units 121 and the connecting ends of the at least one second sub-heating unit 121 can extend from the edge of the temperature control plate 11 at different layers.

[0092] Specifically, for multiple heating units 121 distributed in an array, if the number of rows or columns of heating units 121 is 1 or 2, the connection ends of multiple heating units 121 can all extend directly from the edge of the temperature control plate 11; however, if the number of rows and columns of heating units 121 is greater than or equal to 3, then there is at least one heating unit 121 surrounded by at least 8 heating units 121. In this case, for multiple heating units 121 in the same layer, the connection end of each surrounding heating unit 121 can extend from the edge of the temperature control plate 11 along the gap between two adjacent heating units 121 on the periphery; or the at least 8 heating units 121 on the periphery and the at least one heating unit 121 surrounded can be located on different layers, so that the connection ends of the peripheral heating units 121 and the connection ends of the surrounded heating units 121 extend from the edge of the temperature control plate 11 at different layers.

[0093] For example, such as Figure 6 or Figure 7 As shown, the heating assembly 12 includes four heating units 121 arranged in a 2*2 pattern, and the connection ends of all four heating units 121 can extend from the edge of the temperature control plate 11; as Figure 8 As shown, the heating assembly 12 includes 9 heating units 121 arranged in a 3*3 pattern. The 9 heating units 121 include 8 peripheral heating units 121 and a central heating unit 121 that is surrounded by them. The connection end of the central heating unit 121 can extend from the edge of the temperature control plate 11 along the gap between two adjacent peripheral heating units 121.

[0094] In this embodiment of the present disclosure, when a target heating unit 121 of a plurality of heating units 121 heats the receiving substrate in the corresponding target temperature control area, the heat of the target temperature control area is transferred to adjacent temperature control areas, causing the heating temperature of the target temperature control area in the central region to be higher than that in the edge region. At this time, the heating units 121 adjacent to the target heating unit 121 can be controlled to heat synchronously to achieve thermal compensation of the target temperature control area by the adjacent temperature control areas, thereby ensuring that the heating temperature of the target temperature control area in the central region is close to that in the edge region, thus ensuring the heating effect of the target temperature control area on the receiving substrate.

[0095] Of course, in addition to the above-mentioned method of thermal compensation for adjacent temperature control zones, other methods, or combinations thereof, can also be used to ensure the heating uniformity of the target temperature control zone.

[0096] In some implementations, such as Figure 6 or Figure 7 As shown, in the first direction X, the distribution density of the heating unit 121 in the middle region of the first direction X is less than the distribution density in the edge region, and / or, in the second direction Y, the distribution density of the heating unit 121 in the middle region of the second direction Y is less than the distribution density in the edge region; the first direction X is a direction parallel to the support platform 2, and the first direction X and the second direction Y are perpendicular to each other.

[0097] Thus, since the heating effect of each heating unit 121 in the edge region of the central region is better than that in the central region, and considering the heat dissipation in the edge region, this design ensures that the heating effect of the central region on the receiving substrate in the temperature control zone is close to that of the edge region on the receiving substrate, thereby ensuring the uniformity of heating of the receiving substrate.

[0098] The first direction X and the second direction Y can be the row and column directions of the multiple heating unit arrays. For example, the first direction X is the row direction of the multiple heating unit arrays and the second direction Y is the column direction of the multiple heating unit arrays; or the first direction X is the column direction of the multiple heating unit arrays and the second direction Y is the row direction of the multiple heating unit arrays.

[0099] In some embodiments, taking the first direction X as an example, the central region of the heating unit 121 refers to the area in the first direction X, with the center of the heating unit 121 as the midpoint, extending to both sides, whose size proportion on the heating unit 121 is greater than or equal to 1 / 8 and less than or equal to 2 / 3. The edge region of the heating unit 121 refers to the area in the first direction X, with one side edge of the heating unit 121 as the boundary, extending to the other side edge, whose size proportion on the heating unit 121 is greater than or equal to 1 / 8 and less than or equal to 1 / 3. The heating unit 121 has a first value of winding segments per unit size distributed along the first direction X in the central region, and a second value of winding segments per unit size distributed along the first direction X in the edge region, where the second value is greater than the first value.

[0100] For example, the proportion of the size of the central region relative to the heating unit 121 in the first direction X is 1 / 8, 1 / 6, 1 / 4, 1 / 3, 1 / 2, 2 / 3, etc., and the proportion of the size of the edge region relative to the heating unit 121 in the first direction X is 1 / 8, 1 / 6, 1 / 4, 1 / 3, etc.

[0101] The ratio of the second value to the first value is greater than or equal to 1.2 and less than or equal to 2. For example, the ratio of the second value to the first value may be 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 19, 2, etc. Of course, the ratio of the second value to the first value can also be slightly less than 1.2 or slightly greater than 2, as long as the uniformity of heating of the receiving substrate by the heating unit 121 in the corresponding temperature control zone is guaranteed.

[0102] For example, the heating unit 121 has a central region that is 1 / 6 of the size of the heating unit 121, extending equidistantly to both sides of the heating unit 121 with the center of the heating unit 121 as the midpoint, and an edge region that is 1 / 6 of the size of the heating unit 121, extending to the other side of the heating unit 121 with one side of the heating unit 121 as the boundary. The heating unit 121 has k1 winding segments distributed along the first direction X in the central region and k2 winding segments distributed along the first direction X in the edge region. k2 is greater than k1, and the ratio of k2 to k1 is greater than or equal to 1.2 and less than or equal to 2.

[0103] It should be noted that, for heating wires or heating tubes, the number of winding segments distributed along the first direction can be understood as: each time a heating wire or heating tube is cut in the first direction, the number of winding segments is counted once, and there can be multiple winding segments cut from the same heating wire or heating tube.

[0104] For example, the heating unit 121 has one (first value) winding segment distributed along the first direction X in the central region of 1 / 6 proportion, and two (second value) winding segments distributed along the first direction X in the edge region of 1 / 6 proportion, and the ratio of the second value to the first value is 2.

[0105] In some embodiments, in the first direction X, the distribution density of the heating unit 121 increases from the central region to the edge region (it can be a uniform increase or a step increase, etc.) so that the distribution density of the heating unit 121 in the central region is less than the distribution density in the edge region; of course, the heating unit 121 can also be uniformly distributed in the region other than the edge region, with a higher distribution density only in the edge region, and this disclosure does not limit this.

[0106] In this embodiment of the present disclosure, the heating unit 121 can be S-shaped coiled or spiral-shaped (such as rectangular spiral, circular spiral, etc.).

[0107] In the case of S-shaped coiling, the two connecting ends of the heating unit 121 can extend from the edge at a uniform thickness of the temperature control plate 11. In the case of spiral coiling, due to the mutual interference between the two connecting ends of the heating unit 121, the distances from the two connecting ends to the support platform 2 can be different, so that they can extend from the edge at different thicknesses of the temperature control plate 11.

[0108] The following explanation will take the example of a heating unit that is coiled in an S-shape.

[0109] In some implementations, such as Figure 6 As shown, the heating unit 121 includes a plurality of first straight segments 122 and a plurality of bent segments 123; the plurality of first straight segments 122 are parallel to each other and spaced apart, and the beginning and end ends of the plurality of first straight segments 122 are connected in sequence by the plurality of bent segments 123.

[0110] Specifically, in the arrangement direction (i.e., the first direction X) of the plurality of first straight line segments 122, the distance between two adjacent first straight line segments 122 is negatively correlated in the direction from the center of the heating unit 121 to the two opposite edges in the arrangement direction of the first straight line segments 122. That is, in the arrangement direction of the first straight line segments 122, the distance between two adjacent first straight line segments 122 decreases as they are further away from the center, and in the direction from the center to the edge, the distance between two adjacent first straight line segments 122 can decrease uniformly or in a stepwise manner.

[0111] In other implementations, such as Figure 7As shown, the heating unit 121 includes a plurality of first straight segments 122, a plurality of bent segments 123, and a second straight segment 124; the plurality of first straight segments 122 are parallel to each other and spaced apart, and the beginning and end ends of the plurality of first straight segments 122 are connected in sequence by a plurality of bent segments 123; the plurality of first straight segments 122 include a first sub-straight segment and a second sub-straight segment located on the outermost sides along the arrangement direction, and the length direction of the second straight segment 124 is perpendicular to the arrangement direction of the plurality of first straight segments 122, and is connected to one of the first sub-straight segments and the second sub-straight segment.

[0112] Specifically, in the arrangement direction of the plurality of first straight line segments 122 (i.e., the first direction X), the distance between two adjacent first straight line segments 122 is negatively correlated in the direction from the center of the heating unit 121 to the two opposite edges in the arrangement direction of the first straight line segments 122. That is, in the arrangement direction of the first straight line segments 122, the distance between two adjacent first straight line segments 122 decreases as they are further away from the center, and in the direction from the center to the edge, the distance between two adjacent first straight line segments 122 can decrease uniformly or in a stepwise manner. In addition, combined with the arrangement of the second straight line segment 124, it can be further ensured that in the direction perpendicular to the arrangement direction of the plurality of first straight line segments 122 (i.e., the second direction Y), the distribution density of the heating unit 121 in the central region is less than that in the edge region, thus more effectively ensuring the uniformity of heating of the receiving substrate by the heating unit 121 in the corresponding temperature control zone.

[0113] In this embodiment of the disclosure, the cooling assembly 13 can perform full-area cooling of the receiving substrate, or it can perform regional cooling of the receiving substrate; and in the case of regional cooling, it can be as follows: Figure 9 As shown, the cooling assembly 13 includes multiple cooling units 131 arranged in an array.

[0114] For example, the heating unit 121 and the cooling unit 131 can have a one-to-one correspondence. For example, each cooling unit 131 is arranged opposite to a temperature control zone 22 on the support platform 2, and the orthographic projection area of ​​the cooling unit 131 on the support platform 2 is smaller than the orthographic projection area of ​​the corresponding heating unit 121 on the support platform 2. For example, the orthographic projection of the cooling unit 131 on the support platform 2 is located within the area of ​​the corresponding temperature control zone 22.

[0115] For example, the heating unit 121 and the cooling unit 131 can also have a one-to-many relationship. For example, multiple cooling units 131 are arranged opposite to a temperature control zone 22 on the support platform 2, and the sum of the areas of the orthographic projections of the multiple cooling units 131 on the support platform 2 is less than the orthographic projection area of ​​the corresponding heating unit 121 on the support platform 2. For example, the orthographic projections of the multiple cooling units 131 on the support platform 2 are all located within the area of ​​the corresponding temperature control zone 22.

[0116] For example, the heating unit 121 and the cooling unit 131 can also have a many-to-one relationship. For example, one cooling unit 131 is arranged opposite to multiple temperature control zones 22 on the support platform 2, and the area of ​​the orthographic projection of one cooling unit 131 on the support platform 2 is smaller than the sum of the orthographic projection areas of the corresponding multiple heating units 121 on the support platform 2. For example, the orthographic projection of one cooling unit 131 on the support platform 2 is located within the area enclosed by the corresponding multiple temperature control zones 22.

[0117] It should be noted that the arrangement of the cooling unit 131 can refer to the arrangement of the heating unit 121 described above, in order to ensure the uniformity of cooling of the receiving substrate by the cooling unit 131. For example, as... Figure 9 As shown, the cooling unit 131 is S-shaped and coiled, that is, the cooling unit 131 includes multiple third straight segments 132 and multiple bent segments 133; the multiple third straight segments 132 are parallel to each other and spaced apart, and the beginning and end ends of the multiple third straight segments 132 are connected in sequence through multiple bent segments 133.

[0118] This disclosure also provides a chip transfer method, which is applied to the chip transfer apparatus described in the above embodiments, the chip transfer apparatus including the heating stage described above. Figure 10 As shown, the method includes steps S110 to S130.

[0119] Step S110: The receiving substrate carried is locally heated using the target heating unit included in the heating stage.

[0120] Step S120: A laser of the target wavelength is generated by a dissociation mechanism to irradiate the transfer substrate fixed on the pressure mechanism, so that the light-emitting chip on the transfer substrate is transferred to the receiving area of ​​the receiving substrate.

[0121] Step S130: Cool the receiving substrate using the cooling components included in the heating stage to complete the transfer of the light-emitting chip in the receiving area on the receiving substrate.

[0122] In this embodiment, the receiving substrate on the carrier stage can be locally preheated by the heating unit, making it easier to transfer the light-emitting chip transferred to the receiving substrate, improving the transfer effect of the light-emitting chip, reducing or even avoiding the situation where the light-emitting chip falls off the receiving substrate, and ensuring the transfer yield of the light-emitting chip; in addition, after the light-emitting chip is transferred, the receiving substrate can be locally cooled by the cooling unit, thereby realizing the rapid switching of the receiving area and improving the transfer efficiency of the light-emitting chip; furthermore, because the heating unit 121 has the effect of local heating, it can heat the area to be received on the receiving substrate, while avoiding heating the non-receiving areas on the receiving substrate, thus achieving precise control of the heating area.

[0123] In step S110 above, the target heating unit is one of the multiple heating units corresponding to the area to be received on the receiving substrate, thereby ensuring that the area to be received on the receiving substrate is heated after heating.

[0124] In addition, when using a target heating unit to locally heat the receiving substrate, combined with the heating stage described above, only the target heating unit can be controlled to heat the substrate to ensure the uniformity of heating of the area to be received on the receiving substrate; alternatively, the target heating unit and multiple adjacent heating units adjacent to the target heating unit can be controlled to heat the receiving substrate to ensure the uniformity of heating of the area to be received on the receiving substrate.

[0125] Alternatively, the heating can be performed before the transfer substrate fixed by the pressure mechanism comes into contact with the receiving substrate on the heating stage, or the heating can be performed after the pressure mechanism drives the fixed transfer substrate to come into contact with the receiving substrate on the heating stage and generates an interaction force. This disclosure does not limit the specific method.

[0126] In step 120 above, the transfer substrate can be irradiated with a laser of the target wavelength emitted by the dissociation mechanism, so that the light-emitting chip on the transfer substrate is transferred to the receiving area of ​​the receiving substrate.

[0127] In this process, when the laser emitted from the dissociation mechanism irradiates the transfer substrate, it can only irradiate the area on the transfer substrate that is directly opposite the area to be received on the receiving substrate, so as to avoid the light-emitting chip in the non-dissociated area on the transfer substrate being transferred to the receiving substrate, which would affect the transfer yield.

[0128] Furthermore, before step S120 above, the heating temperature of the corresponding temperature control zone on the heating platform can be collected by a temperature sensor and transmitted to the temperature controller; when the temperature controller determines that the heating temperature is not within the reference temperature range, the heating parameters of the target heating unit are adjusted until the heating temperature is within the reference temperature range.

[0129] The communication between the temperature sensor and the temperature controller can be referenced in the explanation of the heating stage above, such as through a connecting cable to achieve wired communication. If the temperature controller determines that the temperature detected by the temperature sensor is outside the reference temperature range, the surface heating temperature of the receiving substrate is too high or too low. In this case, the heating parameters of the heating unit are readjusted to ensure that the heating temperature of the receiving substrate is within the reference temperature range.

[0130] In the case where the heating unit is a heating wire, the heating parameters can be heating voltage, etc.; in the case where the heating unit is a heating tube, the heating parameters can be the temperature of the fluid inside the heating tube, etc.

[0131] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A heating platform, characterized in that, include: A temperature control component includes a temperature control plate, a heating component, and a cooling component, wherein the heating component and the cooling component are stacked within the temperature control plate, and the heating component includes multiple heating units arranged in an array. A support platform is supported on the temperature control component and is used to support the receiving substrate. The heating unit is used to heat the receiving substrate, and the cooling component is used to cool the receiving substrate. The surface of the support platform away from the temperature control component has a temperature control zone corresponding to each heating unit. The opening and closing of each heating unit can be controlled individually to achieve independent control of the temperature of multiple temperature control zones.

2. The heating table as described in claim 1, characterized in that, The heating unit includes a heating wire or a heating tube. In a first direction, the distribution density of the heating unit in the central region of the first direction is less than the distribution density in the edge region, and / or, in a second direction, the distribution density of the heating unit in the central region of the second direction is less than the distribution density in the edge region. Wherein, the first direction is a direction parallel to the support platform, and the first direction and the second direction are perpendicular to each other.

3. The heating stage as described in claim 2, characterized in that, In the first direction, the heating unit has a central region that takes the center of the heating unit as the midpoint and extends equidistantly to both sides of the heating unit, accounting for 1 / 6 of the size of the heating unit, and an edge region that takes one side of the heating unit as the boundary and extends to the other side of the heating unit, accounting for 1 / 6 of the size of the heating unit. The first direction is the row direction or column direction of the heating unit array distribution. The heating unit has k1 winding segments distributed along the first direction in the central region and k2 winding segments distributed along the first direction in the edge region, wherein k2 is greater than k1, and the ratio of k2 to k1 is greater than or equal to 1.2 and less than or equal to 2.

4. The heating table as described in claim 2, characterized in that, In the first direction, the distribution density of the heating units increases from the central region to the edge region.

5. The heating table as described in claim 1, characterized in that, The heating unit includes multiple first straight segments and multiple bent segments; The first straight segments are parallel to each other and spaced apart, and the beginning and end ends of the first straight segments are connected sequentially by the multiple bent segments.

6. The heating stage as described in claim 1, characterized in that, The heating unit includes multiple first straight segments, multiple bent segments, and second straight segments; The first straight segments are parallel to each other and spaced apart, and the beginning and end ends of the first straight segments are connected in sequence by the multiple bending segments; The plurality of first straight line segments include a first sub-straight line segment and a second sub-straight line segment located on the outermost sides along the arrangement direction. The length direction of the second straight line segment is perpendicular to the arrangement direction of the plurality of first straight line segments and is connected to one of the first sub-straight line segment and the second sub-straight line segment.

7. The heating table as described in claim 5 or 6, characterized in that, In the arrangement direction of the plurality of first straight segments, the distance between two adjacent first straight segments is negatively correlated in the direction from the center of the heating unit to the two opposite edges in the arrangement direction of the first straight segments.

8. The heating stage as described in any one of claims 1-6, characterized in that, The distances from the heating units to the support platform are not all the same.

9. The heating stage as described in any one of claims 1-6, characterized in that, The cooling assembly includes multiple cooling units arranged in an array, each cooling unit being disposed opposite to one or more temperature control zones.

10. The heating stage as described in any one of claims 1-6, characterized in that, The temperature control plate has a fixing hole that penetrates the temperature control plate in the thickness direction, and the fixing hole is used to fix the temperature control plate and the support platform; Both the heating component and the cooling component are arranged around the periphery of the fixing hole.

11. The heating stage as described in any one of claims 1-6, characterized in that, The temperature control board has heating channels and cooling channels, and the heating component and the cooling component are respectively installed in the heating channels and the cooling channels; Alternatively, the temperature control plate may include at least three stacked layers, with the heating component and the cooling component located between two different layers.

12. The heating table as described in any one of claims 1-6, characterized in that, The heating platform also includes a temperature controller and multiple temperature sensors; Each of the heating units is associated with one or more of the temperature sensors; The support platform is provided with multiple slots facing away from the temperature control board, and each temperature sensor is located in one of the slots. The temperature controller is communicatively connected to multiple heating units and multiple temperature sensors.

13. A chip transfer device, characterized in that, include: The heating stage according to any one of claims 1-12; A pressurizing mechanism is located on the side of the heating stage near the support stage and is used to fix the transfer substrate; The dissociation mechanism is located on the side of the pressurization mechanism away from the heating stage and is used to generate a laser of the target wavelength to irradiate the transfer substrate.

14. A chip transfer method, characterized in that, The method is applied to the chip transfer apparatus of claim 13, and the method includes: The target heating unit included in the heating stage is used to locally heat the receiving substrate of the stage. A laser of the target wavelength is generated by a dissociation mechanism to irradiate a transfer substrate fixed on a pressure mechanism, so that the light-emitting chip on the transfer substrate is transferred to the receiving area of ​​the receiving substrate. The receiving substrate is cooled using the cooling components included in the heating stage to complete the transfer of the light-emitting chip in the receiving area on the receiving substrate.

15. The method as described in claim 14, characterized in that, The receiving substrate of the platform is locally heated using the target heating unit included in the heating stage, including: The target heating unit and a plurality of adjacent heating units adjacent to the target heating unit are used to heat the receiving substrate.

16. The method as described in claim 14, characterized in that, Before using a dissociation mechanism to generate a laser of the target wavelength to irradiate the transfer substrate fixed on the pressurization mechanism, the process also includes: The heating temperature of the corresponding temperature control zone on the heating platform is collected by a temperature sensor and transmitted to the temperature controller; When the temperature controller determines that the heating temperature is not within the reference temperature range, it adjusts the heating parameters of the target heating unit until the heating temperature is within the reference temperature range.

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