Micro light emitting diode array, manufacturing method thereof, and light emitting device

Abstract

The application discloses a micro light emitting diode array and a manufacturing method thereof and a light emitting device, and belongs to the technical field of light emitting diodes. The optical adjustment part and the light emitting unit are fixedly connected through the bonding part. The optical adjustment part and the light emitting unit can be independently designed and manufactured. The parameters of the optical adjustment part can be customized and designed according to the optical parameters of the light emitting unit and the requirements of the application scene, which is beneficial to coupling the optical adjustment part with the light emitting unit and the application scene, and improving the light emitting effect of the micro light emitting diode array.

Description

Technical Field

[0001] This application relates to the field of light-emitting diode technology, and in particular to a micro light-emitting diode array, its fabrication method, and a light-emitting device. Background Technology

[0002] Micro LEDs, including Micro LEDs and Mini LEDs, have attracted widespread attention due to their advantages such as high brightness, high contrast, long lifespan, and low power consumption. They have become an important development direction for next-generation display and lighting technologies.

[0003] Currently, the native light patterns of micro-light-emitting diodes cannot directly meet diverse and customized needs. Therefore, how to accurately control the native light patterns of micro-light-emitting diodes to adapt to the optical performance requirements of different application scenarios is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] This application provides a micro light-emitting diode array, a method for fabricating the same, and a light-emitting device, to at least partially solve the aforementioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a micro light-emitting diode array is provided, comprising: Multiple light-emitting units; Multiple optical adjustment sections are provided, each of which corresponds to one of the multiple light-emitting units. The optical adjustment sections are located on the light-emitting side corresponding to the light-emitting unit. Multiple adhesive portions are provided, each corresponding to one of the multiple light-emitting units, and the adhesive portions are bonded between the corresponding light-emitting unit and the corresponding optical adjustment portion.

[0006] Optionally, the optical adjustment unit includes a first dielectric layer and a second dielectric layer stacked together, wherein the refractive index of the first dielectric layer is greater than that of the second dielectric layer; wherein, in at least two light-emitting units, the first parameter of the first dielectric layer corresponding to each light-emitting unit is different, and / or the first parameter of the second dielectric layer corresponding to each light-emitting unit is different, wherein the first parameter includes any one or more combinations of thickness, number of layers, and refractive index.

[0007] Optionally, the refractive index of the adhesive portion is different from the refractive index of the film layer adjacent to the optical adjustment portion.

[0008] Optionally, the adhesive portion includes a first adhesive sublayer and a second adhesive sublayer, wherein the refractive index of the first adhesive sublayer is different from that of the second adhesive sublayer.

[0009] Optionally, the surface of the optical adjustment section furthest from the film layer corresponding to the light-emitting unit is an arc surface.

[0010] Optionally, the emission wavelength of the plurality of light-emitting units includes a first wavelength and a second wavelength, wherein the first wavelength is greater than the second wavelength; wherein the radius of curvature of the arc surface of the optical adjustment part farthest from the film layer corresponding to the light-emitting unit corresponding to the first wavelength is greater than the radius of curvature of the arc surface of the optical adjustment part farthest from the film layer corresponding to the light-emitting unit corresponding to the second wavelength.

[0011] Optionally, the light-emitting surface of the light-emitting unit includes an optical adjustment area and an original optical area, and the optical adjustment part is correspondingly disposed in the optical adjustment area.

[0012] Optionally, the micro-light-emitting diode array further includes an optical functional part covering the sidewall of the light-emitting unit; wherein the optical functional part includes a reflective functional layer or a light-absorbing functional layer.

[0013] According to a second aspect of this application, a method for fabricating a micro light-emitting diode array is provided, comprising: Provide multiple light-emitting units and obtain the optical parameters of the light-emitting units; An adhesive portion is formed on the light-emitting side of the light-emitting unit, and a corresponding optical adjustment portion is formed on the side of the adhesive portion away from the light-emitting unit according to the optical parameters of the light-emitting unit.

[0014] According to a third aspect of this application, a light-emitting device is provided, comprising a micro light-emitting diode array as described in any of the above.

[0015] In the micro LED array of this application embodiment, the optical adjustment part and the light-emitting unit are fixedly connected by the bonding part through the above technical solution. The optical adjustment part and the light-emitting unit can be designed and manufactured independently. The parameters of the optical adjustment part can be customized according to the optical parameters of the light-emitting unit and the requirements of the application scenario. This is beneficial to couple the optical adjustment part with the light-emitting unit and the application scenario, thereby improving the light-emitting effect of the micro LED array.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0019] Figure 1 This is a schematic diagram of the first structure of the micro light-emitting diode array provided in the exemplary embodiments of this disclosure; Figure 2 This is a schematic diagram of a second structure of the micro-light-emitting diode array provided in an exemplary embodiment of this disclosure; Figure 3 This is a schematic diagram of a third structure of the micro-light-emitting diode array provided in an exemplary embodiment of this disclosure; Figure 4 This is a schematic diagram of the fourth structure of the micro-light-emitting diode array provided in the exemplary embodiments of this disclosure; Figure 5 This is a schematic diagram of the fifth structure of the micro light-emitting diode array provided in the exemplary embodiments of this disclosure; Figure 6 This is a schematic flowchart of a method for fabricating a micro-light-emitting diode array provided in an exemplary embodiment of this disclosure; Figures 7A to 7I This is a schematic diagram of the micro-light-emitting diode array provided in the exemplary embodiments of this disclosure during the fabrication process; Figure 8 This is a schematic diagram of the structure of the light-emitting device provided in an exemplary embodiment of this disclosure.

[0020] Explanation of reference numerals in the attached figures: 10. Micro LED array; 11. First substrate; 12. Temporary bonding layer; 13. Second substrate; 14. Carrier plate; 15. Substrate; 21. Light-emitting unit; 22. Optical functional part; 221. Optical functional material layer; 222. Optical functional layer; A1. Optical adjustment area; A2. Original optical area; 30. Optical adjustment part; 301. Optical adjustment material layer; 31. First dielectric layer; 32. Second dielectric layer; 40. Adhesive part; 401. Adhesive material layer; 41. First adhesive sublayer; 42. Second adhesive sublayer; 100. Light-emitting device. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] According to the first aspect of this application, referring to Figures 1 to 5This disclosure provides a micro light-emitting diode array 10, including a plurality of light-emitting units 21, a plurality of adhesive portions 40, and a plurality of optical adjustment portions 30; the plurality of optical adjustment portions 30 correspond one-to-one with the plurality of light-emitting units 21, and the optical adjustment portions 30 are disposed on the light-emitting side of the corresponding light-emitting unit 21; the plurality of adhesive portions 40 correspond one-to-one with the plurality of light-emitting units 21, and the adhesive portions 40 are bonded between the corresponding light-emitting unit 21 and the corresponding optical adjustment portion 30.

[0023] It is understood that one light-emitting unit 21 corresponds to one adhesive part 40 and one optical adjustment part 30. One light-emitting unit 21 is provided with one adhesive part 40 and one optical adjustment part 30 on the light-emitting side. The adhesive part 40 is disposed between the corresponding light-emitting unit 21 and the corresponding optical adjustment part 30 and is used to bond the corresponding light-emitting unit 21 and the corresponding optical adjustment part 30.

[0024] In traditional processes, optical structures are directly grown during the fabrication of light-emitting units. The materials of these optical structures differ from the chip materials of the light-emitting units. The lattice and thermal mismatch stress introduced by this heterogeneous material integration can easily lead to wafer warping in subsequent processes, such as thinning and bonding, resulting in reduced yield and reliability. This application overcomes the limitations of traditional light-emitting units 21, which have fixed light patterns and single optical parameters, by independently setting a dedicated optical adjustment unit 30 on the light-emitting side of the light-emitting unit 21. This allows for precise control of the optical parameters of a single light-emitting unit 21 or the desired light emission effect, such as adjusting the wavelength range, emission angle, light path direction, and light convergence / divergence effect of the light-emitting unit 21. Precise control is achieved to meet customized optical requirements in different scenarios. The bonding part 40 is used to bond and fix the light-emitting unit 21 and the optical adjustment part 30. The optical adjustment part 30 is fixed to the light-emitting side of the light-emitting unit through the bonding part 40, rather than being directly grown on the light-emitting surface of the light-emitting unit. The assembly structure is simple, stable, and ensures light emission accuracy. The light-emitting unit 21 and the optical adjustment part 30 can be designed independently, fabricated separately, and flexibly matched. Without modifying the chip body structure of the light-emitting unit 21, the optical adjustment part 30 can be adjusted to adapt to different application scenarios, improving the scenario adaptability and design flexibility of the micro light-emitting diode array 10 and optimizing the overall light emission effect.

[0025] In some embodiments, please refer to the following for details. Figure 2The optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together, wherein the refractive index of the first dielectric layer 31 is greater than the refractive index of the second dielectric layer 32; wherein, in at least two of the light-emitting units 21, the first parameter of the first dielectric layer 31 corresponding to each light-emitting unit 21 is different, and / or the first parameter of the second dielectric layer 32 corresponding to each light-emitting unit 21 is different, wherein the first parameter includes any one or more combinations of thickness, number of layers, and refractive index.

[0026] The optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together. The refractive index of the first dielectric layer 31 is greater than that of the second dielectric layer 32. It can be understood that the optical adjustment unit 30 can be a DBR (Distributed Bragg Reflector) film. The DBR film relies on the interference principle of alternating stacks of high and low refractive index media to selectively reflect, transmit, filter, and correct light paths in specific wavelength bands. The first dielectric layer 31 corresponds to the high refractive index medium of the DBR film, and the second dielectric layer 32 corresponds to the low refractive index medium of the DBR film. Compared to a single-layer optical structure, it offers more optical adjustment dimensions, higher control precision, and stronger band adaptability. It can effectively optimize light output uniformity, eliminate stray light, and correct original optical path deviations. Simultaneously, it can precisely select target spectra and suppress stray spectra according to requirements. By adjusting the DBR films of different light-emitting units 21 in the array... The dielectric layer thickness, number of layers, and refractive index are configured differently, breaking the limitation of uniform optical parameters and consistent light patterns of all light-emitting units 21 in the traditional micro-LED array 10. It can match exclusive DBR optical parameters according to the differences in emission wavelength and emission intensity of different light-emitting units 21, so as to realize the independent customization of the optical performance of each pixel in the array. The exclusive DBR film control mode can be adapted to different precision requirements such as high-precision display, special lighting, and automotive backlight, which broadens the application range of micro-LED array 10, improves the overall light emission consistency and color uniformity of the array, and improves the overall display effect of micro-LED array 10.

[0027] Specifically, multiple layers of the first dielectric layer 31 and multiple layers of the second dielectric layer 32 are stacked alternately, for example... Figure 2 In the optical adjustment unit 30, there are two layers of first dielectric layer 31 and two layers of second dielectric layer 32 stacked alternately.

[0028] Specifically, the material of the first dielectric layer 31 may include titanium dioxide, etc., and the material of the second dielectric layer 32 may include silicon dioxide, etc. The film layer closest to the corresponding light-emitting unit 21 in the optical adjustment section 30 is the starting layer. The starting layer is specifically the first dielectric layer 31 or the second dielectric layer 32, which can be flexibly adjusted according to actual needs. For example, if the first dielectric layer 31 is the starting layer and is a high refractive index medium, the refractive index difference between the high refractive index medium and the bonding part 40 can be preferentially utilized. When the light path is reflected in the optical adjustment section 30, the light is more likely to undergo total internal reflection at the interface between the starting layer of the high refractive index medium and the bonding part 40, so that the light is emitted towards the light-emitting side, thereby improving the light emission efficiency. Alternatively, if the second dielectric layer 32 is the starting layer and is a low refractive index layer, low refractive index materials such as silicon dioxide have a small absorption rate of visible light, resulting in lower overall initial optical loss.

[0029] For details, please refer to Figure 2 The optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together, wherein the refractive index of the first dielectric layer 31 is greater than the refractive index of the second dielectric layer 32; wherein, in at least two light-emitting units 21, the thickness of the first dielectric layer 31 corresponding to each light-emitting unit 21 is different, and / or, the thickness of the second dielectric layer 32 corresponding to each light-emitting unit 21 is different.

[0030] The thickness of the first dielectric layer 31 and / or the second dielectric layer 32 of the DBR film are core parameters affecting its optical interference band, light refraction path, optical path difference, and light transmittance. Through differentiated thickness design of the DBR film's dielectric layers, precise and controllable light pattern and spectral modulation can be achieved. DBR films composed of high and low refractive index dielectric layers of different thicknesses correspond to different characteristic interference bands, allowing for precise matching of light with different emission wavelengths. This alters the propagation path and refraction angle of light within the film layers. Thickness control directly changes the reflection bandwidth, transmittance, and light deflection amplitude of the DBR film, specifically achieving light convergence, divergence, softening, and light emission. Different light patterns, such as spectral screening, can be adapted to the original light emission defects and spectral deviations of different light-emitting units 21. The DBR film thickness control process is simple, precise, and highly mass-producible. It does not require changes to the dielectric material and stacked structure. Single-pixel differentiated optical adaptation can be achieved simply by fine-tuning the thickness of high and low refractive index film layers. It takes into account both product optical performance and mass production cost-effectiveness. The optimal DBR film thickness can be matched for long and short wavelength light-emitting units 21 and high and low brightness light-emitting units 21 in the array, respectively. This solves the problems of inconsistent long and short wavelength light effects, uneven brightness, and spectral spuriousness in traditional arrays, and improves the color reproduction and display uniformity of the display.

[0031] For details, please refer to Figure 2The optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together, wherein the refractive index of the first dielectric layer 31 is greater than the refractive index of the second dielectric layer 32; wherein, in at least two light-emitting units 21, the number of layers of the first dielectric layer 31 corresponding to each light-emitting unit 21 is different, and / or, the number of layers of the second dielectric layer 32 corresponding to each light-emitting unit 21 is different.

[0032] By differentiating the number of stacked layers of the first dielectric layer 31 and / or the second dielectric layer 32 of the DBR film, gradient and graded adjustment of optical modulation intensity is achieved, adapting to different amplitudes of optical pattern correction and spectral modulation requirements. The core performance of the DBR film is affected by the number of periodic layers of alternating high and low refractive index media. The more layers, the more times light interference, reflection, filtering, and optical path shaping occur, resulting in higher optical selectivity and modulation precision of the film layer. This enables significant optical pattern correction, stray light filtering, viewing angle adjustment, and spectral purification. For example, for the light-emitting unit 21 in the array with small emission deviation and high spectral purity, fewer DBR stacking periods can be used to simplify the structure, reduce the overall thickness of the film layer, and reduce light loss. For the light-emitting unit 21 with large original optical pattern deviation, abnormal brightness, scattered optical path, and spectral straying, a multi-period DBR stacking structure can be used to achieve high-precision and large-amplitude optical correction and spectral filtering. This approach balances the requirements of lightweight device design and high-precision modulation, improving the problems of insufficient modulation of some pixels and over-modulation of some pixels caused by the uniform number of layers in the DBR film design.

[0033] Specifically, the optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together, wherein the refractive index of the first dielectric layer 31 is greater than that of the second dielectric layer 32; wherein the refractive indices of the first dielectric layer 31 corresponding to each light-emitting unit 21 are different, and / or the refractive indices of the second dielectric layer 32 corresponding to each light-emitting unit 21 are different. By differentially controlling the material composition and deposition process of the high and low refractive index dielectric layers, the refractive index gradient of each layer can be precisely controlled, so that the center wavelength, bandwidth, and reflectivity of the DBR reflection spectrum dynamically shift according to pixel requirements.

[0034] Specifically, the optical adjustment unit 30 includes a first dielectric layer 31 and a second dielectric layer 32 stacked together, wherein the refractive index of the first dielectric layer 31 is greater than the refractive index of the second dielectric layer 32; wherein, in at least two light-emitting units 21, the difference between the refractive index of the first dielectric layer 31 and the refractive index of the second dielectric layer 32 corresponding to each light-emitting unit 21 is different.

[0035] By designing differentiated refractive index differences, the optical control intensity of the DBR film can be finely graded and adapted. The greater the difference between the refractive index of the first dielectric layer 31 and the refractive index of the second dielectric layer 32, the stronger the light refraction, deflection, and interference effects between the DBR film layers, and the higher the spectral screening accuracy. This allows for rapid correction of large-angle scattered light, concentration of output brightness, and filtering of stray spectra. The smaller the refractive index difference, the gentler the optical control of the DBR film, which can preserve the original light output characteristics of the device to the greatest extent, requiring only slight optical path softening and brightness uniformization. By matching DBR film structures with different refractive index differences to different light-emitting units 21 in the array, different wavelengths and brightness of light-emitting pixels can be precisely adapted, solving the pain point that traditional single-parameter DBR films cannot meet the differentiated optical and spectral control needs of multiple pixels. The controllable refractive index difference can precisely control the light transmission and reflection ratio of the DBR film, effectively reducing light interface reflection loss and improving effective light output transmittance. While accurately correcting the light pattern and purifying the spectrum, it can also improve the light output efficiency of the light-emitting unit 21 and reduce the overall power consumption of the device.

[0036] In some embodiments, the refractive index of the bonding portion 40 is different from the refractive index of the film layer adjacent to the optical adjustment portion 30. By designing the refractive index difference between the bonding portion 40 and the optical adjustment portion 30, the problems of light transmission distortion, total internal reflection, and excessive light loss at the interface are improved. Utilizing the refractive index difference, light undergoes controllable refraction at the interface between the bonding portion 40 and the optical adjustment portion 30, initially completing optical path shaping and assisting the optical adjustment portion 30 in achieving high-precision optical pattern control. This structure does not require additional optical film layers; auxiliary optical control can be achieved simply by optimizing the material parameters of the bonding portion 40. The structure is simple, cost-effective, and further optimizes the optical performance of the device while ensuring the stability of the bonding and fixing.

[0037] In some embodiments, please refer to the following for details. Figure 3 The bonding portion 40 includes a first bonding sub-layer 41 and a second bonding sub-layer 42, wherein the refractive index of the first bonding sub-layer 41 is different from that of the second bonding sub-layer 42. By configuring the bonding portion 40 as a double-layer differential refractive index structure, it balances assembly fixation with multi-level optical control. The double-layer differential refractive index bonding sub-layers can form a two-stage optical path adjustment structure. When light passes through the first bonding sub-layer 41 and the second bonding sub-layer 42, two controllable refractions occur, achieving light focusing or amplification. Simultaneously, the light focusing or amplification is gradually softened and calibrated, resulting in a smoother optical path transition and more uniform light output. By matching the refractive index gradients of the two bonding sub-layers, the parameters of different optical adjustment parts 30 are adapted, further improving the adaptability of the overall optical system and resulting in higher precision and more stable light pattern control.

[0038] Specifically, the material of the adhesive portion 40 may include OCA optically transparent adhesive, etc.

[0039] In some embodiments, please refer to the following for details. Figure 4 The surface of the optical adjustment section 30 furthest from the film layer corresponding to the light-emitting unit 21 is an arc surface. Specifically, Figure 4 The optical adjustment unit 30 has a first dielectric layer 31 as the film layer furthest from the corresponding light-emitting unit 21. The surface of the first dielectric layer 31 furthest from the corresponding light-emitting unit 21 is set as an arc surface, which can flexibly form a convex lens or a concave lens optical shape, corresponding to the two core control functions of light focusing and light diffusing, respectively, to achieve controllable shaping of light. It can be understood that if the arc surface protrudes from the side away from the light-emitting unit 21, it corresponds to a convex lens, and if the arc surface is concave from the side closer to the light-emitting unit 21, it corresponds to a concave lens. The convex lens can converge the emitted light, gather scattered light, and improve the brightness and concentration of the center light output, which is suitable for narrow viewing angle, high brightness precision lighting, and fixed-point display scenarios. The concave lens can diverge and diffuse the light, greatly widening the light output viewing angle, achieving uniform diffusion of light across the entire area, effectively eliminating problems such as central bright spots, edge dark areas, and uneven light and shadow, which is suitable for wide viewing angle displays and wide-area backlight scenarios. The light focusing or diffusing effect can be flexibly matched according to different scenario requirements, weakening the dead angle of light refraction, reducing stray light convergence, and improving the clarity and color uniformity of the imaging display.

[0040] In some embodiments, please refer to the following for details. Figure 4 The emission wavelengths of the plurality of light-emitting units 21 include a first wavelength and a second wavelength, wherein the first wavelength is greater than the second wavelength; wherein the radius of curvature of the arc surface of the optical adjustment part 30 corresponding to the first wavelength that is furthest from the film layer of the corresponding light-emitting unit 21 is greater than the radius of curvature of the arc surface of the optical adjustment part 30 corresponding to the second wavelength that is furthest from the film layer of the corresponding light-emitting unit 21.

[0041] By precisely matching the emission wavelength with the radius of curvature of the outer arc surface of the DBR film, and combining the optical control principle of convex lens focusing and concave lens amplification, the synchronous and precise correction of the light pattern, viewing angle, and dispersion of multi-color light can be achieved. It can be understood that for the same medium material, the longer the wavelength of light, the smaller the refractive index of the medium material, and the shorter the wavelength of light, the larger the refractive index of the medium material. Therefore, for the same radius of curvature and the same material, the convex or concave lens has a greater influence on the shorter wavelength of light. The arc surface with a larger radius of curvature is more flat, and the focusing or amplification effect of the convex or concave lens is weaker. The arc surface with a smaller radius of curvature has a stronger focusing or amplification effect of the convex or concave lens.

[0042] Please refer to the details. Figure 4 Taking the first wavelength as red and the second wavelength as blue as an example, then the first wavelength corresponds to... Figure 4 The leftmost light-emitting unit 21 corresponds to the second wavelength. Figure 4The rightmost light-emitting unit 21, which is a convex or concave lens with the same radius of curvature and the same material, has a stronger focusing or amplifying effect on blue light and a weaker focusing or amplifying effect on red light. Therefore, the arc curvature radius of the optical adjustment part 30 corresponding to the blue and red light-emitting units 21 is designed differently: the red light-emitting unit 21 corresponds to a larger radius of curvature, and the blue light-emitting unit 21 corresponds to a smaller radius of curvature, so as to balance the difference in focusing / amplifying intensity of red and blue light and ensure that the two are consistent in terms of light emission angle, brightness distribution and dispersion characteristics.

[0043] It is understandable that the first wavelength and the second wavelength can both correspond to the same color light-emitting unit 21, for example, both use green light-emitting unit 21. However, the specific emission wavelength of the green light-emitting unit 21 may have slight deviations due to driving current, temperature or process differences. The first wavelength corresponds to a slightly higher green peak wavelength, and the second wavelength corresponds to a slightly lower green peak wavelength. Similarly, at this time, precise optical compensation for different wavelengths of light of the same color system can still be achieved through differentiated curvature radius design, ensuring the consistency of light output and color purity of the same color system under different working conditions.

[0044] In some embodiments, please refer to the following for details. Figure 5 The light-emitting unit 21 has a light-emitting surface including an optical adjustment area A1 and an original optical area A2, with the optical adjustment unit 30 correspondingly disposed within the optical adjustment area A1. A zoned light-emitting design is adopted, balancing optical control requirements with the advantages of native light emission, achieving refined and selective light pattern adjustment. For areas requiring adjustment, targeted optimization is performed, with the optical adjustment unit 30 in the optical adjustment area A1 completing optical path shaping and brightness calibration. For areas with excellent native light patterns that do not require adjustment, the original optical area A2 is retained, improving the light loss and color shift issues caused by additional optical film layers. This ensures both the standardization and consistency of the overall light pattern while retaining the device's inherent high brightness and high transmittance advantages. For example, the optical adjustment unit 30 is a reflective film, with the optical adjustment area A1 and the original optical area A2 each occupying half the area of ​​the light-emitting surface. The reflective film precisely controls the light path reflection angle of a designated area, enabling display scenarios such as single-sided privacy protection.

[0045] Specifically, the optical adjustment area A1 can be located outside the original optical area A2, or the original optical area A2 can be located outside the optical adjustment area A1, so that the light emission effect of the central area of ​​the light-emitting surface of the light-emitting unit 21 is different from that of the peripheral area, so as to adapt to various application scenarios.

[0046] Specifically, the adhesive portion 40 may cover the entire light-emitting surface of the light-emitting unit 21, or it may be provided only in the optical adjustment area A1.

[0047] In some embodiments, please refer to the following for details. Figures 1 to 5The micro-LED array 10 further includes an optical functional section 22 covering the sidewall of the light-emitting unit 21; wherein the optical functional section 22 includes a reflective functional layer or a light-absorbing functional layer. By covering the sidewall of the light-emitting unit 21 with the optical functional section 22, when a reflective functional layer is used, the lateral scattered light from the sidewall of the light-emitting unit 21 can be reflected to the front light-emitting side, effectively eliminating light leakage problems, improving light utilization and overall device brightness, while reducing crosstalk between adjacent pixels and improving display contrast; when a light-absorbing functional layer is used, it can absorb stray light from the sidewall and refract residual light, eliminating stray light interference, adapting to ultra-high contrast display scenarios, optimizing the light pattern throughout the entire process from the light source of the light-emitting unit 21 to the light-emitting end, and significantly improving the display accuracy, contrast and color purity of the micro-LED array 10.

[0048] Specifically, the reflective functional layer can be made of materials such as white oil, and the light-absorbing functional layer can be made of materials such as black matrix.

[0049] In some embodiments, the optical adjustment unit 30 includes color resist. The color resist can precisely filter stray light, short-wavelength stray light, and spectral redundancy bands from the light-emitting unit 21, purify the spectrum of the emitted light, and improve the saturation and purity of the emitted color. It can adapt to the needs of full-color display and wide color gamut display. For example, by using color resists of red, green, and blue to match the light-emitting units 21 of the corresponding colors, color crosstalk and spectral overlap can be significantly suppressed, so that each sub-pixel can independently present high-purity monochromatic light.

[0050] In some embodiments, please refer to the following for details. Figures 1 to 5 The micro-LED array 10 also includes a carrier plate 14 for supporting multiple light-emitting units 21.

[0051] According to the second aspect of this disclosure, in conjunction with Figure 6 , Figures 7A to 7I A method for fabricating a micro light-emitting diode array 10 is provided, comprising: S1. Provide multiple light-emitting units 21 and obtain the optical parameters of the light-emitting units 21. For details, please refer to [link to documentation]. Figures 7A to 7D .

[0052] S2. An adhesive portion 40 is formed on the light-emitting side of the light-emitting unit 21, and a corresponding optical adjustment portion 30 is formed on the side of the adhesive portion 40 away from the light-emitting unit 21 according to the optical parameters of the light-emitting unit 21. Please refer to [link to details]. Figures 7E to 7I .

[0053] The optical adjustment part 30 and the light-emitting unit 21 are fixedly connected by the adhesive part 40. The optical adjustment part 30 and the light-emitting unit 21 can be designed and manufactured independently. The parameters of the optical adjustment part 30 can be customized according to the optical parameters of the light-emitting unit 21 and the requirements of the application scenario. This is conducive to coupling the optical adjustment part 30 with the light-emitting unit 21 and the application scenario, and improving the light-emitting effect of the micro light-emitting diode array 10.

[0054] S1. Provide multiple light-emitting units 21 and obtain the optical parameters of the light-emitting units 21. For details, please refer to [link to documentation]. Figures 7A to 7D .

[0055] Specifically, multiple light-emitting units 21 are provided and the emission wavelength of the light-emitting units 21 is obtained.

[0056] Specifically, multiple light-emitting units 21 are provided, and the photoelectric performance of the light-emitting units 21 is tested and sorted. By sorting and removing light-emitting units 21 with abnormal photoelectric parameters, the overall brightness uniformity and color consistency of the array are ensured.

[0057] Specifically, the light-emitting unit 21 can be a Mini-LED or a Micro LED.

[0058] Specifically, Mini-LED can be used in backlight modules of display devices or in direct-view display devices, while Micro LED can be used in direct-view display devices.

[0059] For details, please refer to Figure 7A A plurality of light-emitting units 21 are provided, and the plurality of light-emitting units 21 are disposed on the substrate 15.

[0060] Multiple light-emitting units 21 are transferred onto the first substrate 11. Please refer to [link / reference]. Figure 7A The light-emitting unit 21 includes a light-emitting chip and electrodes.

[0061] For details, please refer to Figure 7A A temporary bonding layer 12 is disposed on the first substrate 11, and the light-emitting unit 21 is disposed on the temporary bonding layer 12.

[0062] For details, please refer to Figure 7B After transferring multiple light-emitting units 21 onto the first substrate 11, the substrate 15 is removed.

[0063] Please see Figure 7C , Figure 7D An optical functional layer 222 is formed on the side wall of the light-emitting unit 21.

[0064] Please see Figure 7CAn optical functional material layer 221 is formed on the first substrate 11, and chemical mechanical polishing is performed to expose the light-emitting surface of the light-emitting unit 21. (See [link to relevant documentation]). Figure 7D To form an optical functional layer 222 covering the sidewall of the light-emitting unit 21.

[0065] Specifically, the optical functional material layer 221 includes a reflective functional layer or a light-absorbing functional layer.

[0066] S2. An adhesive portion 40 is formed on the light-emitting side of the light-emitting unit 21, and a corresponding optical adjustment portion 30 is formed on the side of the adhesive portion 40 away from the light-emitting unit 21 according to the optical parameters of the light-emitting unit 21. Please refer to [link to details]. Figures 7E to 7I .

[0067] Please see Figure 7E An adhesive material layer 401 is formed on the light-emitting side of the light-emitting unit 21.

[0068] Please see Figure 7E An optical adjustment material layer 301 is formed on the side of the adhesive material layer 401 away from the light-emitting unit 21.

[0069] Specifically, the optical adjustment material layer 301 can be prepared using physical vapor deposition or atomic layer deposition processes.

[0070] For details, please refer to Figure 7E The adhesive material layer 401 and the optical adjustment material layer 301 can be first formed on the second substrate 13, and then the adhesive material layer 401 and the optical adjustment material layer 301 can be transferred as a whole to the light-emitting side of the light-emitting unit 21 through the second substrate 13; after the transfer is completed, please refer to Figure 7F , Figure 7G Peel off the second substrate 13, leaving the adhesive material layer 401 and the optical adjustment material layer 301 intact.

[0071] Please see Figure 7H The adhesive material layer 401 and the optical adjustment material layer 301 are patterned to form the adhesive portion 40 and the optical adjustment portion 30.

[0072] For details, please refer to Figure 7H The adhesive material layer 401, the optical adjustment material layer 301, and the optical functional layer 222 are patterned to form an adhesive portion 40, an optical adjustment portion 30, and an optical functional portion 22. Each adhesive portion 40, each optical adjustment portion 30, and each optical functional portion 22 corresponds to one light-emitting unit 21.

[0073] For details, please refer to Figure 7IAfter forming the bonding portion 40, the optical adjustment portion 30 and the optical functional portion 22, the first substrate 11 and the temporary bonding layer 12 can be peeled off and transferred to other substrates to meet the final packaging requirements.

[0074] According to the third aspect of this disclosure, in conjunction with Figure 8 A light-emitting device 100 is provided, comprising a micro light-emitting diode array 10 as described in any of the above descriptions.

[0075] In some embodiments, the light-emitting device 100 includes a display device, which includes a micro light-emitting diode array 10 as described above.

[0076] Specifically, the display device can be a liquid crystal display device, including a backlight module and a display panel. The backlight module includes a micro light-emitting diode array 10 as described above, for providing uniform high-brightness backlight.

[0077] Specifically, the display device can be a self-emissive display device, including an array substrate and a micro-light-emitting diode array 10 as described above. In this self-emissive display device, the micro-light-emitting diode array 10 is directly integrated onto the array substrate.

[0078] In some embodiments, the light-emitting device 100 includes an illumination device, which includes a micro-light-emitting diode array 10 as described above. The illumination device can be applied to high-precision light control scenarios such as indoor general lighting, automotive headlights, ambient lighting, or surgical shadowless lamps. Its micro-light-emitting diode array 10 can dynamically adjust the light emission angle, color temperature, and brightness of each light-emitting unit 21 according to the spatial light distribution requirements.

[0079] Specifically, for example, in automotive headlights, the optical adjustment unit 30 can be designed to adapt to an asymmetric reflection spectrum in order to cooperate with other secondary optical components of the automotive headlights to form a brightness cutoff light pattern that complies with regulations.

[0080] Specifically, for example, in ambient lighting, the optical adjustment unit 30 can be designed to adapt to a reflective spectrum that provides uniform light emission over a wide viewing angle or strong light emission at a specific angle.

[0081] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0082] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0083] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0084] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A micro-light-emitting diode array (10), characterized in that, include: Multiple light-emitting units (21); Multiple optical adjustment sections (30) are provided, each of which corresponds to one of the multiple light-emitting units (21). The optical adjustment sections (30) are located on the light-emitting side corresponding to the light-emitting unit (21). Multiple adhesive portions (40) are provided, each of which corresponds to one of the multiple light-emitting units (21). The adhesive portions (40) are bonded between the corresponding light-emitting unit (21) and the corresponding optical adjustment portion (30).

2. The micro-light-emitting diode array (10) according to claim 1, characterized in that, The optical adjustment unit (30) includes a first dielectric layer (31) and a second dielectric layer (32) stacked together, wherein the refractive index of the first dielectric layer (31) is greater than the refractive index of the second dielectric layer (32); Among them, in at least two of the light-emitting units (21), the first parameter of the first dielectric layer (31) corresponding to each light-emitting unit (21) is different, and / or the first parameter of the second dielectric layer (32) corresponding to each light-emitting unit (21) is different, and the first parameter includes any one or more combinations of thickness, number of layers, and refractive index.

3. The micro-light-emitting diode array (10) according to claim 1, characterized in that, The refractive index of the adhesive portion (40) is different from the refractive index of the film layer adjacent to the optical adjustment portion (30).

4. The micro-light-emitting diode array (10) according to claim 1, characterized in that, The adhesive portion (40) includes a first adhesive sublayer (41) and a second adhesive sublayer (42), wherein the refractive index of the first adhesive sublayer (41) is different from that of the second adhesive sublayer (42).

5. The micro-light-emitting diode array (10) according to any one of claims 1 to 4, characterized in that, The surface of the optical adjustment section (30) furthest from the film layer corresponding to the light-emitting unit (21) is an arc surface.

6. The micro-light-emitting diode array (10) according to claim 5, characterized in that, The emission wavelengths of the plurality of light-emitting units (21) include a first wavelength and a second wavelength, wherein the first wavelength is greater than the second wavelength; Wherein, the radius of curvature of the arc surface of the optical adjustment part (30) corresponding to the first wavelength that is furthest from the film layer corresponding to the light-emitting unit (21) is greater than the radius of curvature of the arc surface of the optical adjustment part (30) corresponding to the second wavelength that is furthest from the film layer corresponding to the light-emitting unit (21).

7. The micro-light-emitting diode array (10) according to claim 1, characterized in that, The light-emitting surface of the light-emitting unit (21) includes an optical adjustment area (A1) and an original optical area (A2), and the optical adjustment part (30) is correspondingly disposed in the optical adjustment area (A1).

8. The micro-light-emitting diode array (10) according to claim 1, characterized in that, The micro-light-emitting diode array (10) also includes an optical functional part (22) covering the sidewall of the light-emitting unit (21). The optical functional part (22) includes a reflective functional layer or a light-absorbing functional layer.

9. A method for fabricating a micro-light-emitting diode array (10), characterized in that, include: Provide multiple light-emitting units (21) and obtain the optical parameters of the light-emitting units (21); An adhesive portion (40) is formed on the light-emitting side of the light-emitting unit (21), and a corresponding optical adjustment portion (30) is formed on the side of the adhesive portion (40) away from the light-emitting unit (21) according to the optical parameters of the light-emitting unit (21).

10. A light-emitting device (100), characterized in that, Includes a micro light-emitting diode array (10) as described in any one of claims 1 to 8.

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