Illumination device and illumination apparatus
Patent Information
- Application Number
- CN202510423610.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-07
- Publication Date
- 2026-10-16
AI Technical Summary
另外,若要提高光剂量,则必须提高发光二极管组件的驱动电流,这使得发光二极管组件表面温度也随之上升
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Figure CN122935012A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a light-illuminating device and a light-illuminating equipment. Background Technology
[0002] Many types of light-emitting devices are used in medical fields, such as phototherapy devices and laser acupuncture devices. In recent years, these devices have increasingly adopted light-emitting diode (LED) components as their light source. However, the electroluminescence efficiency of LED components is not 100%, thus generating heat when driven to emit light. Furthermore, increasing the light dose requires increasing the driving current of the LED component, which in turn raises the surface temperature of the LED component. If these light-emitting devices are used in skin-contact applications, the heat generated by the LED component may pose a risk of burns to the user's skin. To avoid this risk, the driving current of the LED component is usually reduced to lower the temperature, but this also reduces the light intensity of the light-emitting device. Therefore, to increase the light dose, the duration of light exposure must be lengthened to compensate. Summary of the Invention
[0003] This invention provides a light-illuminating device and equipment that can effectively increase light intensity while avoiding the risk of burns.
[0004] A light-emitting device according to the present invention includes a substrate, a light-emitting unit, an encapsulation layer, and a heat-conducting layer. The light-emitting unit is disposed on the substrate; the encapsulation layer is disposed on the side of the light-emitting unit away from the substrate; the heat-conducting layer is disposed on the side of the encapsulation layer away from the light-emitting unit; wherein the light transmittance of the heat-conducting layer is between 80% and 99%, and the light-emitting unit emits light with a wavelength between 650 nm and 830 nm, and the light intensity is set to a range of 1-200 mW / cm². 2 .
[0005] A lighting device according to the present invention includes a control device and a lighting device electrically connected to the control device, and includes a substrate, a light-emitting unit, an encapsulation layer, and a thermally conductive layer. The light-emitting unit is disposed on the substrate; the encapsulation layer is disposed on the side of the light-emitting unit away from the substrate; the thermally conductive layer is disposed on the side of the encapsulation layer away from the light-emitting unit; wherein the light transmittance of the thermally conductive layer is between 80% and 99%. The control device controls the light-emitting unit to emit light, the wavelength of which is between 650 nm and 830 nm, and the light intensity is set to a range of 1-200 mW / cm². 2 . Attached Figure Description
[0006] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:
[0007] Figure 1 This is a cross-sectional schematic diagram of the illumination device according to the first embodiment of the present invention.
[0008] Figure 2A In order to be like Figure 1 The diagram shows a simulation experiment of applying the light-emitting device to human skin.
[0009] Figure 2B For example Figure 2A The diagram shown is a top view of the lighting device in the simulation experiment.
[0010] Figures 3A to 3E Display as shown Figure 2A The results of the simulation experiment shown are as follows, in which Figure 3A The heat-conducting layer of the lighting device is 0.6mm. Figure 3B The heat-conducting layer of the lighting device is 1.2mm thick. Figure 3C The heat-conducting layer of the lighting device is 2.0mm thick. Figure 3D The heat-conducting layer of the lighting device is 3.2mm thick. Figure 3E The heat-conducting layer of the lighting device is 4.0 mm.
[0011] Figure 4A and Figure 4B The graph shows the temperature and light intensity of the attachment surface of the illumination device under different driving currents. Figure 4A This is for the case where no heat-conducting layer is installed. Figure 4B This indicates the case where the thickness of the heat-conducting layer is 3mm.
[0012] Figure 5 This is a cross-sectional schematic diagram of the illumination device according to the second embodiment of the present invention.
[0013] Figure 6 This is a cross-sectional schematic diagram of the illumination device according to the third embodiment of the present invention.
[0014] Figure 7A This is a three-dimensional schematic diagram of a lighting device according to an embodiment of the present invention.
[0015] Figure 7B For example Figure 7A The diagram shows the application of the lighting equipment.
[0016] Figure 8A This is a three-dimensional schematic diagram of a lighting device according to another embodiment of the present invention.
[0017] Figure 8B For example Figure 8A The diagram shows the application of the lighting equipment. Detailed Implementation
[0018] The following description, with reference to the accompanying drawings, illustrates a preferred embodiment of a lighting apparatus and lighting device according to the present invention, wherein the same components will be described using the same reference numerals. It should be understood that the following description provides many different embodiments for implementing various embodiments of the present invention. The specific components and arrangements described below are merely for the simple and clear description of some embodiments of the present invention. Of course, these embodiments are illustrative only and not intended to limit the scope of the invention. Furthermore, repeated reference numerals or designations may be used in different embodiments; these repetitions are merely for the simple and clear description of some embodiments of the present invention and do not represent any association between the different embodiments and / or structures discussed. Moreover, when it is mentioned that a component is located on or above another component, this includes a situation where one component is in direct contact with another component; or, it may also include a situation where one or more other components are spaced apart, in which case one component may not be in direct contact with another component.
[0019] Furthermore, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one component of the figures to another component. It is understood that if the apparatus in the figures is flipped so that it is upside down, the component described as being on the "lower" side will become the component on the "higher" side.
[0020] Here, the terms "about," "approximately," and "roughly" generally indicate within 20% of a given value or range, preferably within 10%, and even more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The quantities given here are approximate quantities, meaning that the meaning of "about," "approximately," and "roughly" may be implied even without specific mention of them.
[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the invention.
[0022] Some embodiments of the present invention can be used in conjunction with the appendix. Figure 1 It should be understood that the accompanying drawings of the embodiments of the present invention are also considered part of the description of the embodiments of the present invention. It should be understood that the drawings of the embodiments of the present invention are not shown to scale of the actual devices and components. The shape and thickness of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present invention. Furthermore, the structures and devices in the drawings are shown schematically to clearly illustrate the features of the embodiments of the present invention.
[0023] It should be understood that, without departing from the spirit of the present invention, features in several different embodiments can be replaced, recombined, or mixed to complete other embodiments.
[0024] Figure 1 This is a cross-sectional schematic diagram of the illumination device 1 according to the first embodiment of the present invention.
[0025] like Figure 1 As shown, the light irradiation device 1 in this embodiment includes a substrate 11, a light-emitting unit 12, an encapsulation layer 13, and a heat-conducting layer 14. In this embodiment, the light irradiation device 1 can be, for example, but not limited to, a phototherapy device or a laser acupuncture device; wherein, for example, the phototherapy device can irradiate the wound site by emitting light to provide effects such as reducing inflammation, accelerating wound healing, promoting collagen synthesis, and accelerating angiogenesis; the laser acupuncture device can, for example, use light to irradiate and stimulate traditional acupoints, thereby stimulating the human body by providing energy to the irradiated acupoints to achieve the effects of traditional acupuncture.
[0026] The substrate 11 can be, for example, a rigid or flexible substrate, and can include, for example, but not limited to, transparent or opaque organic and / or inorganic materials. Organic materials may include polyimide (PI), fiber-reinforced plastic (FRP), polyethylene terephthalate (PET), cycloolefin polymers (COP), or other known suitable materials or combinations thereof, but the invention is not limited thereto. Inorganic materials may include glass, quartz, sapphire, or ceramic, but are not limited thereto. In this embodiment, the substrate 11 is made of polyimide, making the substrate 11 a flexible substrate. Additionally, substrate 11 may be a substrate containing a circuit layer (not shown) electrically connected to the light-emitting unit 12. This circuit layer may include various passive and / or active components, such as resistors, capacitors, inductors, diodes, MOSFETs, CMOS transistors, BJTs, lateral diffusion transistors, high-power MOSFETs, thin-film transistors (TFTs), or other types of transistors. Furthermore, substrate 11 may be a driving substrate for driving the light-emitting unit 12 to emit light, such as a CMOS substrate, a liquid crystal on silicon (LCOS) substrate, a thin-film transistor substrate, or other circuit substrates with operating circuitry; this invention is not limited thereto. Moreover, the size of substrate 11 may be, for example, but not limited to, the size of a coin or larger, and its shape may be, for example, but not limited to, circular, rectangular, elliptical, etc.; this invention is not limited thereto.
[0027] The light-emitting unit 12 is disposed on the substrate 11. In this embodiment, the light-emitting unit 12 may include, for example, multiple light-emitting diode components, such as organic light-emitting diode components (OLED), inorganic light-emitting diode components (e.g., light-emitting diodes (LED), sub-millimeter light-emitting diodes (mini LED), micro light-emitting diodes (micro LED), quantum dot light-emitting diodes (QLED), other suitable materials, or combinations of the above materials, but the present invention is not limited thereto. Here, the circuit components in the circuit layer of the substrate 11 can be used to control and drive the light-emitting unit 12, so that the light-emitting unit 12 can emit light, wherein the emitted light can be, for example, visible light or invisible light. In some embodiments, the light can be, for example, red light and / or infrared light, and its wavelength can be, for example, between 650 nm and 830 nm, and its light intensity range can be, for example, set to 1-200 mW / cm². 2 For example, the light-emitting unit 12 may include one or more different light-emitting diode components, such as a red light-emitting diode (to emit red light with a wavelength of approximately 620–750 nm) or an infrared light-emitting diode (to emit infrared light with a wavelength of approximately 800–950 nm). Therefore, the wavelength of the light emitted by the light-emitting unit 12 when driven can be between 650 nm and 830 nm. In addition, by applying different driving currents to the light-emitting unit 12, its light intensity range can be set to 1–200 mW / cm². 2 In this case, the applied driving current is, for example, between 10mA and 10A, which is not limited by the present invention. The above description is merely an example and is not intended to limit the scope of the present invention.
[0028] An encapsulation layer 13 is disposed on the light-emitting unit 12. In one embodiment, the encapsulation layer 13 is located on the bonding side opposite to the light-emitting unit 12. In this embodiment, the encapsulation layer 13 can be formed on the light-emitting unit 12 and the substrate 11, and surrounds the light-emitting unit 12, allowing light emitted from the light-emitting unit 12 to pass through the encapsulation layer 13 and exit. The material of the encapsulation layer 13 can be, for example, a material with a low water vapor transmission rate (WVTR), such as, but not limited to, SiO2. x N y SiO x SiN x Materials such as SiO2, ZnO, Al2O3, or combinations thereof, can be used and can be formed using CVD or ALD processes. In some embodiments, the encapsulation layer 13 can be a single layer or multiple layers. Therefore, the encapsulation layer 13 can be used to protect the multiple light-emitting diode components of the light-emitting unit 12 from the influence of external moisture.
[0029] A thermally conductive layer 14 is disposed on the encapsulation layer 13. In one embodiment, the thermally conductive layer 14 is located on the side of the encapsulation layer 13 opposite to the light-emitting unit 12. In another embodiment, the side of the thermally conductive layer 14 opposite to the light-emitting unit can be used to contact the body surface. The light transmittance of the thermally conductive layer 14 is between 80% and 99%. In some embodiments, the light transmittance of the thermally conductive layer 14 is between 90% and 99%. Furthermore, in some embodiments, the thickness of the thermally conductive layer 14 is, for example, between 0.05 mm and 5 mm, and the thermal conductivity of the thermally conductive layer 14 is, for example, 0.2-4 W / mK. In some embodiments, the thickness of the thermally conductive layer 14 is, for example, between 0.3 mm and 2 mm, and the thermal conductivity of the thermally conductive layer 14 is, for example, 0.6-2 W / mK, but not limited thereto. It should be noted that in this embodiment, the thermal conductive layer 14 provides a limited thermal conductivity effect. Specifically, the thermal conductivity of the thermal conductive layer 14 is significantly lower than that of general excellent thermal conductive materials. For example, the thermal conductivity of copper, which is usually considered an excellent thermal conductive material, is approximately 401 W / mK. Therefore, the thermal conductive layer 14 will only partially conduct heat energy from the side adjacent to the encapsulation layer 13 and the light-emitting unit 12 to the side away from the encapsulation layer 13. In one embodiment, the side away from the encapsulation layer 13 may be, for example, the side in contact with the body surface, so that the temperature of the side of the thermal conductive layer 14 away from the encapsulation layer 13 can be lower than the temperature of the side of the thermal conductive layer 14 adjacent to the encapsulation layer 13. In practice, the side of the thermal conductive layer 14 away from the encapsulation layer 13 can be directly attached to the user's skin. Therefore, by means of the limited thermal conductivity of the thermal conductive layer 14, the temperature of the side of the thermal conductive layer 14 attached to the user's skin can be controlled to be higher than the human body temperature but lower than the temperature that may cause burns to the skin (e.g., 45°C). In some embodiments, the thermal conductivity can be measured, for example, using a thermal conductivity analyzer, but is not limited thereto. In some embodiments, the light transmittance can be measured, for example, by measuring the light intensity emitted by the illumination device and the light intensity emitted after removing the thermally conductive layer 14 from the illumination device, and the light transmittance is obtained by comparing the two intensities. The light intensity can be specifically measured, for example, using an illuminance meter, but is not limited thereto.
[0030] In addition, in this embodiment, the thermally conductive layer 14 may include a biocompatible material, thus making it suitable for prolonged application to the body surface, such as the skin surface. The material of the thermally conductive layer 14 may be, for example, but not limited to, a biocompatible hydrogel material or silicone material, or a combination thereof, or any material suitable as a dressing for the affected area; the present invention is not limited thereto. In one embodiment, the thermally conductive layer 14 may be a single-layer structure or a multi-layer structure (such as a double-layer structure); for example, the thermally conductive layer 14 may be, for example, a single-layer hydrogel material or silicone material, a mixture of a single-layer hydrogel material or silicone material and pressure-sensitive adhesive (PSA), a double-layer structure combining a single-layer hydrogel material or silicone material and pressure-sensitive adhesive, or a double-layer structure combining a single-layer hydrogel material or silicone material with a mixture of a single-layer hydrogel material or silicone material and pressure-sensitive adhesive, but the present invention is not limited thereto.
[0031] In another embodiment, the heat-conducting layer 14 may also include a pharmaceutical composition, which may include, for example but not limited to, one or a combination of a wound dressing and a transdermal drug. The wound dressing may be, for example, any substance that can act on the human body or a material that can accelerate wound healing, and the transdermal drug may be, for example, any material that can be absorbed through the skin. For example, the pharmaceutical composition may be, for example but not limited to, natural medicinal materials, chemically synthesized medicinal materials, such as pain-relieving medicinal materials (e.g., peppermint oil, camphor, eucalyptus oil, capsaicin, ginger extract, artemisia, angelica, etc.) or medicinal materials that increase blood circulation (e.g., safflower, salvia miltiorrhiza, cinnamon twig, frankincense, myrrh, etc.). It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.
[0032] Furthermore, the light irradiation device 1 may further include a release film (not shown) that is peelably attached to the side of the thermally conductive layer 14 away from the encapsulation layer 13. In one embodiment, the side of the thermally conductive layer 14 away from the encapsulation layer 13 may be, for example, the side in contact with the body surface. In practice, the release film can provide protection for the thermally conductive layer 14 when not in use. When using the light irradiation device 1, the release film can be peeled off from one side of the thermally conductive layer 14 before the thermally conductive layer 14 of the light irradiation device 1 is attached to the affected area for subsequent phototherapy or laser acupuncture treatments. The above description is merely illustrative and is not intended to limit the scope of the invention.
[0033] The following will refer to Figure 2A and Figure 2B This illustrates the application of light-emitting device 1 in a simulation experiment of human skin, in which... Figure 2A This is a schematic diagram of a simulation experiment applying the light irradiation device 1 to human skin. Figure 2B This is a top view of the lighting device 1 in the simulation experiment.
[0034] In this simulation experiment, the shape of the lighting device 1 is, for example, rectangular (e.g., ...). Figure 2BAs shown in the figure, first, three thermometer probes are placed between the encapsulation layer 13 and the thermally conductive layer 14, with their placement positions Pa1, Pa2, and Pa3 as shown in the figure. Figure 2A and Figure 2B As shown, three more thermometer probes are then placed on the side of the thermally conductive layer 14 away from the encapsulation layer 13, with their positions Pb1, Pb2, and Pb3 as shown. Figure 2A and Figure 2B As shown, the heat-conducting layer 14 of the light irradiation device 1 is then attached to one side of the artificial skin 20, and a heating plate 21 is placed on the other side of the artificial skin 20, wherein the heating plate 21 is set to maintain a state of heating to 34°C.
[0035] As described above, in one experimental example, the thermally conductive layer 14 is a single-layer structure with a thickness of 0.6 mm. After attaching the thermally conductive layer 14 to the artificial skin 20, a constant current of 1.5 A (voltage approximately 3.8 V) is applied to the light-emitting unit 12 to make it emit light and heat. The temperature data at positions Pa1, Pa2, Pa3, Pb1, Pb2, and Pb3 are continuously measured for approximately 20 minutes. The results are as follows. Figure 3A As shown in the figure, the highest temperatures at these multiple locations are summarized in Table 1 below.
[0036]
[0037] Table 1
[0038] In another experimental example, the thermally conductive layer 14 is a single-layer structure with a thickness of 1.2 mm. After attaching the thermally conductive layer 14 to the artificial skin 20, a constant current of 1.5 A (voltage approximately 3.8 V) is applied to the light-emitting unit 12 to make it emit light and heat. The temperature data at positions Pa1, Pa2, Pa3, Pb1, Pb2, and Pb3 are continuously measured for approximately 20 minutes. The results are as follows. Figure 3B As shown in Table 2, the highest temperatures at these multiple locations are summarized below.
[0039]
[0040] Table 2
[0041] In another experimental example, the thermally conductive layer 14 is a single-layer structure with a thickness of 2.0 mm. After attaching the thermally conductive layer 14 to the artificial skin 20, a constant current of 1.5 A (voltage approximately 3.8 V) is applied to the light-emitting unit 12 to make it emit light and heat. The temperature data at positions Pa1, Pa2, Pa3, Pb1, Pb2, and Pb3 are continuously measured for approximately 20 minutes. The results are as follows. Figure 3C As shown in Table 3, the highest temperatures at these multiple locations are summarized below.
[0042]
[0043] Table 3
[0044] In another experimental example, the thermally conductive layer 14 has a double-layer structure, with one layer having a thickness of 1.2 mm and the other layer having a thickness of 2.0 mm. After attaching the thermally conductive layer 14 to the artificial skin 20, a constant current of 1.5 A (voltage approximately 3.8 V) is applied to the light-emitting unit 12 to make it emit light and heat. The temperature data at positions Pa1, Pa2, Pa3, Pb1, Pb2, and Pb3 are continuously measured for approximately 20 minutes. The results are as follows. Figure 3D As shown in Table 4, the highest temperatures at these multiple locations are summarized below.
[0045]
[0046] Table 4
[0047] In another experimental example, the thermally conductive layer 14 has a double-layer structure, with both layers having a thickness of 2.0 mm. After attaching the thermally conductive layer 14 to the artificial skin 20, a constant current of 1.5 A (voltage approximately 3.8 V) is applied to the light-emitting unit 12 to make it emit light and heat. The temperature data at positions Pa1, Pa2, Pa3, Pb1, Pb2, and Pb3 are continuously measured for approximately 20 minutes. The results are as follows. Figure 3E As shown in Table 5, the highest temperatures at these multiple locations are summarized below.
[0048]
[0049] Table 5
[0050] As can be clearly seen from the above experimental examples, the illumination device 1 of this embodiment can partially block the heat generated by the light-emitting unit 12 by utilizing the limited thermal conductivity of the heat-conducting layer 14. This reduces the temperature of the side of the heat-conducting layer 14 that is attached to the user's skin (e.g., positions Pb1, Pb2, Pb3). For example, the temperature of the side of the heat-conducting layer 14 that is attached to the user's skin can be controlled to be higher than the human body temperature but lower than the temperature that may cause burns (e.g., below 45°C), thus avoiding the risk of burns. In addition, the above experimental examples also show the following characteristics: the thicker the heat-conducting layer 14, the less easily the heat generated by the light-emitting unit 12 can be dissipated, resulting in a higher temperature between the encapsulation layer 13 and the heat-conducting layer 14 (positions Pa1, Pa2, Pa3); furthermore, the thicker the heat generated by the light-emitting unit 12, the slower the heat is conducted to the surface of the heat-conducting layer 14 away from the encapsulation layer 13 (positions Pb1, Pb2, Pb3).
[0051] Additionally, please refer to Figure 4A and Figure 4B As shown, where Figure 4A and Figure 4B The graph shows the temperature and light intensity of the attachment surface of the illumination device under different driving currents. Figure 4AThis is for the case where no heat-conducting layer is installed. Figure 4B This indicates the case where the thickness of the thermally conductive layer 14 is 3 mm; in Figure 4A and Figure 4B In the diagram, the triangular black dots represent the corresponding temperature data of the surface of the illumination device when different driving currents are provided, and the square black dots represent the corresponding light intensity data of the illumination device when different driving currents are provided.
[0052] Depend on Figure 4A Data shows that, under the critical condition that the temperature of the attachment surface does not exceed 45°C, the driving current of the illumination device needs to be controlled below approximately 1.0A, while the emitted light intensity is approximately 14.1 mW / cm². 2 In addition, by Figure 4B Data shows that, under the critical condition that the temperature of the attachment surface (i.e., the side of the heat-conducting layer 14 that is attached to the user's skin) does not exceed 45°C, the driving current of the light-emitting device 1 can be increased to approximately 1.5A, and the emitted light intensity is approximately 18.8 mW / cm². 2 Therefore, it can be seen that, by providing a heat-conducting layer 14 in the light-emitting device 1, this embodiment can reduce the light intensity provided by the light-emitting device 1 from approximately 14.1 mW / cm² under critical conditions not exceeding 45°C. 2 Increased to approximately 18.8 mW / cm 2 Therefore, the light dose provided by the light irradiation device 1 within the same irradiation time can be significantly increased.
[0053] in addition, Figure 5 This is a cross-sectional schematic diagram of the illumination device 1a according to the second embodiment of the present invention.
[0054] like Figure 5 The configuration and connection relationship of the components of the illumination device 1a shown are as follows: Figure 1 The components of the light-illuminating device 1 shown are configured and connected in a generally similar manner. The difference lies in that the light-illuminating device 1a further includes a connecting layer 15 disposed between the encapsulation layer 13 and the thermally conductive layer 14. In this embodiment, the connecting layer 15 can be any suitable adhesive material, such as a thermosetting material, a photocurable material, or other suitable adhesive materials, such as pressure-sensitive adhesive (PSA), optically transparent adhesive (OCA), or optically transparent resin (OCR), etc., and the present invention is not limited thereto. In addition, the material of the connecting layer 15 can be, for example, one that is re-adhesive. In this case, the thermally conductive layer 14 can be replaced on the side of the connecting layer 15 away from the encapsulation layer 13. For example, if the concentration of the drug composition contained in the thermally conductive layer 14 decreases with increasing usage time, a brand-new thermally conductive layer 14 can replace the used thermally conductive layer 14. The above description is merely illustrative and is not intended to limit the scope of the present invention.
[0055] in addition, Figure 6This is a cross-sectional schematic diagram of the illumination device 1b according to the third embodiment of the present invention.
[0056] like Figure 6 The configuration and connection relationship of the components of the illumination device 1b shown are as follows: Figure 1 The components of the illumination device 1 shown are configured and connected in a generally similar manner. The difference lies in that the illumination device 1b further includes a back film layer 16, disposed on the side of the substrate 11 opposite to the light-emitting unit 12. In one embodiment, the back film layer 16 may, for example, include a heating component, which can provide a thermotherapy function as needed, further enhancing blood circulation and / or drug absorption. In one embodiment, the back film layer 16 may, for example, include a heat dissipation component. In some embodiments, the heat dissipation component may include, for example, a passive heat dissipation component, such as heat sink fins; or an active heat dissipation component, such as a fan, etc., but is not limited thereto. The heat dissipation component is used to provide heat dissipation to the light-emitting unit 12. The above description is merely illustrative and is not intended to limit the scope of the invention.
[0057] The following will refer to Figure 7A and Figure 7B This invention describes a lighting device according to an embodiment of the present invention and its application, wherein... Figure 7A This is a three-dimensional schematic diagram of a lighting device according to an embodiment of the present invention. Figure 7B For example Figure 7A The diagram shows the application of the lighting equipment.
[0058] like Figure 7A As shown, the lighting device 30 in this embodiment includes a control device 31 and a lighting device 1 (such as...). Figure 1 As shown, the illumination device 1 is electrically connected to the control device 31 via a connecting cable 32. In this embodiment, the illumination device 1 is rectangular in shape, and can be, for example, a flexible fabric design. Other structural designs of the illumination device 1 can refer to the aforementioned embodiments and will not be repeated here. Here, the control device 31 can transmit control signals and electrical energy to the illumination device 1 via the connecting cable 32 to control and drive the light-emitting unit 12 of the illumination device 1 to emit light. The wavelength of this light is between 650nm and 830nm, and its light intensity range is set to 1-200mW / cm². 2 It should be noted that the lighting device 1 can adopt any of the structures described in the foregoing embodiments, and the present invention is not limited thereto.
[0059] like Figure 7B As shown, since the light-emitting device 1 is rectangular in shape, its heat-conducting layer 14 can be adapted to be attached to large affected areas, such as the arm (e.g., Figure 7B(As shown), on the back and other locations; at this time, the user can operate the control device 31 to transmit control signals and electrical energy to the lighting device 1 through the connecting cable 32, so as to control and drive the light-emitting unit 12 of the lighting device 1 to emit a light. The wavelength of this light is between 650nm and 830nm, and its light intensity range can be set to 1mW / cm according to different driving currents. 2 With 200mW / cm 2 It should be noted that the above description is for illustrative purposes only and is not intended to limit the scope of the invention.
[0060] Therefore, the light emitted by the light-emitting unit 12 can pass through the heat-conducting layer 14 and irradiate the affected area, and the heat energy emitted by the light-emitting unit 12 can also pass through the heat-conducting layer 14 and be conducted to the skin of the affected area. Because the heat-conducting layer 14 has restrictive thermal conductivity, the temperature of the side of the heat-conducting layer 14 that is attached to the user's skin can be controlled to be higher than the human body temperature but lower than the temperature that may cause burns to the skin (e.g., below 45°C). Furthermore, it can effectively increase the light dose provided by the light-irradiation device 1 within the same irradiation time. In this embodiment, the light within this specific wavelength range can not only provide effects such as reducing inflammation, accelerating wound healing, promoting collagen synthesis, and accelerating angiogenesis, but also stimulate traditional acupoints under the skin surface by irradiating them. By providing energy to the acupoints, it can stimulate the body and achieve the effects of traditional acupuncture. In addition, the provided heat energy can effectively increase the absorption rate of the drug composition contained in the heat-conducting layer 14, thereby increasing its therapeutic effect.
[0061] In addition, the following will refer to Figure 8A and Figure 8B This invention describes a lighting device according to an embodiment of the present invention and its application, wherein... Figure 8A This is a three-dimensional schematic diagram of a lighting device according to an embodiment of the present invention. Figure 8B For example Figure 8A The diagram shows the application of the lighting equipment.
[0062] like Figure 8AAs shown, the lighting device 30a of this embodiment includes a control device 31 and multiple lighting devices 1. The lighting devices 1 are electrically connected to the control device 31 via one or more connecting lines 32a. The lighting devices 1 in this embodiment are circular (e.g., coin-shaped), for example, they can be flexible circular patches. The connecting lines 32a can be one-to-many, allowing one control device 31 to be connected to multiple lighting devices 1 simultaneously. Other structural designs of the lighting devices 1 can refer to the aforementioned embodiments and will not be repeated here. Here, the control device 31 can transmit control signals and electrical energy to the multiple lighting devices 1 via the connecting lines 32a to control and drive the light-emitting units 12 of each lighting device 1 to emit light. The wavelength of this light is between 650nm and 830nm, and its intensity range is set to 1-200mW / cm². 2 .
[0063] like Figure 8B As shown, since each light-emitting device 1 is circular in shape, its heat-conducting layer 14 can be adapted to be attached to the affected area of a single acupoint, such as different acupoints on the shoulder, neck, arm, back, etc. At this time, the user can operate the control device 31 to transmit control signals and electrical energy to multiple light-emitting devices 1 through the connecting line 32a, so as to control and drive the light-emitting unit 12 of each light-emitting device 1 to emit a light. The wavelength of this light is between 650nm and 830nm, and its light intensity range can be set to 1mW / cm according to different driving currents. 2 With 200mW / cm 2 It should be noted that the above description is for illustrative purposes only and is not intended to limit the scope of the invention.
[0064] In the above embodiment, the light emitted by the light-emitting unit 12 can pass through the heat-conducting layer 14 and irradiate the affected area (or acupoint), and the heat energy emitted by the light-emitting unit 12 can also pass through the heat-conducting layer 14 and be conducted to the skin of the affected area (or acupoint). Because the heat-conducting layer 14 has restrictive heat conduction properties, the temperature of the side of the heat-conducting layer 14 that is attached to the user's skin can be controlled to be higher than the human body temperature but lower than the temperature that may cause burns to the skin (e.g., below 45°C). Furthermore, it can effectively increase the light dose provided by the light irradiation device 1 within the same irradiation time. In this embodiment, the light within this specific wavelength range can not only provide effects such as reducing inflammation, accelerating wound healing, promoting collagen synthesis, and accelerating angiogenesis, but also stimulate traditional acupoints under the skin surface by irradiating them. By providing energy to the acupoints, it can stimulate the body and achieve the effects of traditional acupuncture. In addition, the provided heat energy can effectively increase the absorption rate of the drug composition contained in the heat-conducting layer 14, thereby increasing its therapeutic effect.
[0065] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.
Claims
1. A lighting device, comprising: One substrate; A light-emitting unit is disposed on the substrate; An encapsulation layer is disposed on the light-emitting unit; and A thermally conductive layer is disposed on the encapsulation layer, wherein the light transmittance of the thermally conductive layer is between 80% and 99%; in, This light-emitting unit emits light with a wavelength between 650nm and 830nm, and the light intensity is set to 1-200mW / cm². 2 .
2. The illumination device as described in claim 1, characterized in that, The thickness of the thermally conductive layer is between 0.05 mm and 5 mm.
3. The illumination device as described in claim 1, characterized in that, The thermal conductivity of this heat-conducting layer is 0.2-4 W / mK.
4. The illumination device as described in claim 1, characterized in that, The thermally conductive layer contains a biocompatible material.
5. The illumination device as described in claim 4, characterized in that, The biocompatible material comprises one or a combination of a hydrogel material and a silicone material.
6. The illumination device as claimed in claim 1, characterized in that, The light source is a phototherapy device.
7. The illumination device as claimed in claim 1, characterized in that, The light source is a laser acupuncture device.
8. The illumination device as claimed in claim 1, characterized in that, The thermally conductive layer contains a pharmaceutical composition.
9. The illumination device as described in claim 8, characterized in that, The pharmaceutical composition comprises one or a combination of a wound dressing and a transdermal absorbed drug.
10. A lighting device, comprising: A control device; and A lighting device electrically connected to the control device, wherein the lighting device includes: One substrate; A light-emitting unit is disposed on the substrate; An encapsulation layer is disposed on the light-emitting unit; and A thermally conductive layer is disposed on the encapsulation layer, wherein the light transmittance of the thermally conductive layer is between 80% and 99%; in, The control device controls the light-emitting unit to emit a light beam with a wavelength between 650nm and 830nm, and the light intensity is set to 1-200mW / cm². 2 .