Display panel, preparation method of display panel and electronic device

Abstract

The application provides a display panel, a preparation method of the display panel and an electronic equipment, and relates to the technical field of display. The display panel comprises a driving backboard and a light emitting device. The driving backboard is provided with an electric connection structure on one side. The electric connection structure comprises a protruding part. The light emitting device is located on the side of the driving backboard provided with the electric connection structure. The light emitting device is provided with an electrode pin on the side facing the driving backboard. The electrode pin comprises a recessed part on the side facing the driving backboard. The shape and size of the recessed part are matched with the protruding part. The electrode pin of the light emitting device is electrically connected with the electric connection structure through the matching of the protruding part and the recessed part. In this way, the electrode pin of the light emitting device can be tightly connected with the electric connection structure. The gap defects between the electrode pin of the light emitting device and the electric connection structure in the driving backboard are reduced. The bonding force between the two is enhanced. The stability and reliability of the display panel are improved. The risk of electric connection failure caused by external force impact or vibration is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] In Micro-LED display technology, the quality of the electrical connection between the light-emitting device and the driving backplane directly affects the display performance and reliability. Summary of the Invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a display panel, a method for manufacturing the display panel, and an electronic device.

[0004] In a first aspect, embodiments of this application provide a display panel, the display panel comprising:

[0005] A drive backplate, wherein an electrical connection structure is provided on one side of the drive backplate, the electrical connection structure including a protrusion;

[0006] A light-emitting device is located on the side of the driving back plate where the electrical connection structure is provided. The side of the light-emitting device facing the driving back plate is provided with electrode pins, and the side of the electrode pins facing the driving back plate includes a recess.

[0007] The electrode pins of the light-emitting device are electrically connected to the electrical connection structure through the cooperation of the protrusion and the recess.

[0008] In one possible implementation, the electrical connection structure includes a pad layer and a solder layer, and the display panel further includes a leveling layer located below the pad layer;

[0009] The leveling layer includes raised structures and film layer vias, the film layer vias exposing at least a portion of the conductive traces in the drive backplane;

[0010] The pad layer is at least partially located on the surface of the protrusion structure, and at least a portion of the pad layer is electrically connected to the conductive trace via the film via.

[0011] The solder layer is located on the side of the pad layer away from the drive backplate;

[0012] Preferably, the orthographic projection of the protrusion on the drive back plate is located within the orthographic projection of the recess on the drive back plate.

[0013] In one possible implementation, the display panel includes a plurality of light-emitting devices, and the electrical connection structure includes a plurality of corresponding electrical connection pairs;

[0014] Each of the light-emitting devices is connected to a corresponding electrical connection pair;

[0015] Preferably, the spacing between adjacent electrical connection pairs is 50µm to 500µm.

[0016] In one possible implementation, the light-emitting device includes a first electrode pin and a second electrode pin, and the electrical connection pair includes a first electrical connection portion and a second electrical connection portion;

[0017] The first electrode pin includes a first recess, and the first electrical connection portion includes a first protrusion. The first electrical connection portion achieves electrical connection with the first electrode pin through the cooperation of the first protrusion and the first recess.

[0018] The second electrode pin includes a second recess, and the second electrical connection portion includes a second protrusion. The second electrical connection portion achieves electrical connection with the second electrode pin through the cooperation of the second protrusion and the second recess.

[0019] Preferably, the distance between the first electrical connection portion and the second electrical connection portion is 10µm to 30µm.

[0020] In one possible implementation, the cross-sectional shape of the protrusion structure in a section perpendicular to the direction of the drive backplate includes triangle, trapezoid, and rectangle;

[0021] Preferably, the thickness of the pad layer is 0.1µm to 1µm in the direction perpendicular to the drive backplate;

[0022] Preferably, the thickness of the solder layer is 0.5µm to 5µm in the direction perpendicular to the drive backplate.

[0023] Secondly, embodiments of this application also provide a method for manufacturing a display panel, the method comprising:

[0024] Provide a drive backplane;

[0025] An electrical connection structure including a protrusion is formed on one side of the drive back plate;

[0026] The light-emitting device is moved to the side of the electrical connection structure away from the driving backplate, and the electrode pins of the light-emitting device are electrically connected to the electrical connection structure. The side of the electrode pins facing the driving backplate includes a recess, and the electrode pins of the light-emitting device are electrically connected to the electrical connection structure through the cooperation of the protrusion and the recess.

[0027] In one possible implementation, the electrical connection structure includes a pad layer and a solder layer, and the display panel further includes a leveling layer located below the pad layer. The step of fabricating the electrical connection structure including protrusions on one side of the drive backplate includes:

[0028] A leveling layer comprising raised structures and film-layer vias is fabricated on one side of the drive backplane, wherein the film-layer vias expose at least a portion of the conductive traces in the drive backplane.

[0029] Metal deposition is performed on the drive backplane with the leveled layer fabricated to form a pad layer that is at least partially located on the surface of the raised structure, and at least a portion of the pad layer is electrically connected to the conductive traces through the film layer vias.

[0030] Metal deposition is performed on the drive backplane with the prepared pad layer to form a solder layer located on the side of the pad layer away from the drive backplane.

[0031] In one possible implementation, the step of fabricating a leveling layer comprising raised structures and film through-holes on one side of the drive backplate includes:

[0032] An organic material is coated on one side of the drive backplate, and the organic material is cured to form a flat organic material layer on one side of the drive backplate.

[0033] The organic material layer is etched to form a protruding structure and through-holes in the film.

[0034] In one possible implementation, the step of transferring the light-emitting device to the side of the electrical connection structure away from the driving backplane and electrically connecting the electrode pins of the light-emitting device to the electrical connection structure includes:

[0035] The light-emitting device is moved to the side of the electrical connection structure away from the driving backplate, and the electrode pins of the light-emitting device are aligned with the electrical connection structure, such that the protrusion is located within at least a portion of the recess of the electrode pin;

[0036] The light-emitting device and the driving backplate are subjected to pressure and heat treatment so that the light-emitting device and the electrical connection structure are electrically connected through the cooperation of the protrusion and the recess.

[0037] Thirdly, embodiments of this application also provide an electronic device, which includes a display panel of any possible implementation of the first aspect or a display panel prepared by the method for preparing the display panel of any possible implementation of the second aspect.

[0038] Based on any of the above aspects, the display panel, display panel manufacturing method, and electronic device provided in the embodiments of this application include a driving backplate and a light-emitting device. An electrical connection structure is provided on one side of the driving backplate, and the electrical connection structure includes a protrusion. The light-emitting device is located on the side of the driving backplate where the electrical connection structure is provided. An electrode pin is provided on the side of the light-emitting device facing the driving backplate, and the side of the electrode pin facing the driving backplate includes a recess. The shape and size of the recess are adapted to the protrusion. The electrode pin of the light-emitting device and the electrical connection structure are electrically connected through the cooperation of the protrusion and the recess. This allows for a tight connection between the electrode pin of the light-emitting device and the electrical connection structure, reducing gaps and defects between the electrode pin of the light-emitting device and the electrical connection structure in the driving backplate, enhancing the bonding force between the two, improving the stability and reliability of the display panel, and reducing the risk of electrical connection failure due to external impact or vibration. Attached Figure Description

[0039] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of a display panel in related technologies;

[0041] Figure 2 Schematic diagram of the structure of the display panel provided in the embodiments of this application Figure 1 ;

[0042] Figure 3 Schematic diagram of the structure of the display panel provided in the embodiments of this application Figure 2 ;

[0043] Figure 4 A schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application;

[0044] Figure 5 for Figure 4 Corresponding process flow diagram;

[0045] Figure 6 for Figure 4 A flowchart illustrating the sub-steps of step S30. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0050] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0052] Please refer to Figure 1The inventors discovered that in related technologies, the light-emitting device 300 and the driving backplane 100 are typically electrically connected via eutectic bonding. Eutectic bonding refers to a technique where two bonding metals diffuse at the interface at a certain temperature to form an alloy compound, thereby connecting the chip and the backplane. Specifically, solder joints 101 corresponding to the electrode pins 310 of the light-emitting device 300 can be fabricated on the driving backplane 100. During eutectic bonding, the solder joints 101 diffuse with the metal of the electrode pins 310 on the light-emitting device 300 to form an alloy, achieving electrical connection. However, since the electrode pins 310 on the light-emitting device 300 often have a concave structure, they cannot perfectly match the flat solder joints 101 on the driving backplane 100, resulting in gaps between the solder joints and the electrode pins 310. Figure 1 The gaps and defects shown indicate insufficient welding strength between the light-emitting device 300 and the driving backplate 100, which can easily lead to defects such as misalignment or falling off of the light-emitting device 300, resulting in low reliability of the display panel 10.

[0053] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0054] Please refer to Figure 2 This application provides a display panel 10, which includes a driving back plate 100 and a light-emitting device 300. An electrical connection structure 200 is provided on one side of the driving back plate 100, and the electrical connection structure 200 includes a protrusion.

[0055] The light-emitting device 300 is located on the side of the driving backplate 100 where the electrical connection structure 200 is provided. The side of the light-emitting device 300 facing the driving backplate 100 has electrode pins 310, each including a recess. The shape and size of the recess are adapted to the protrusion, meaning the protrusion can fit into the recess. The electrode pins 310 of the light-emitting device 300 and the electrical connection structure 200 are electrically connected through the cooperation of the protrusion and the recess. This ensures a tight connection between the electrode pins 310 of the light-emitting device 300 and the electrical connection structure 200, reducing gaps between the light-emitting device 300 and the driving backplate 100, enhancing their bonding strength, improving the stability and reliability of the display panel 10, and reducing the risk of electrical connection failure due to external impacts or vibrations.

[0056] In some possible embodiments, please refer to Figure 3 The electrical connection structure 200 includes a pad layer 210 and a solder layer 220. The display panel 10 also includes a leveling layer 400 located below the pad layer 210. The leveling layer 400 includes a raised structure and film-layer vias, which expose at least a portion of the conductive traces in the drive backplane 100. The pad layer 210 is at least partially located on the surface of the raised structure, and at least a portion of the pad layer 210 is electrically connected to the conductive traces via the film-layer vias. The solder layer 220 is located on the side of the pad layer 210 away from the drive backplane 100. Preferably, the orthographic projection of the raised portion on the drive backplane 100 lies within the orthographic projection of the recessed portion on the drive backplane 100. In practical applications, eutectic bonding between the electrode pins 310 and the solder layer 220 can be achieved by soldering, ensuring the normal operation of the display panel 10.

[0057] In the above structure, the leveling layer 400 includes a raised structure and film layer vias. The pad layer 210 and solder layer 220 can be formed on the surface of the raised structure by metal deposition, forming an electrical connection structure 200 including the raised portion. The raised portion in the electrical connection structure 200 can better cooperate with the recessed portion in the electrode pin 310, improving the welding strength between the light-emitting device 300 and the electrical connection structure 200, and improving the structural stability and reliability of the display panel 10. The cross-sectional shape of the raised structure corresponds to the cross-sectional shape of the recessed portion. In the cross-section perpendicular to the direction of the driving backplate 100, the cross-sectional shape of the raised structure includes triangle, trapezoid, and rectangle. Preferably, in the cross-section perpendicular to the direction of the driving backplate 100, the cross-sectional shape of the raised structure and the recessed portion is rectangular. The leveling layer 400 is made of organic materials (e.g., epoxy resin). In the direction perpendicular to the drive back plate 100, the protrusion height of the protrusion structure is 1µm to 3µm. For example, the protrusion height of the protrusion structure can be 1µm, 1.1µm, 1.3µm, 1.5µm, 2µm, 2.5µm, 2.7µm, 2.8µm, 2.9µm, and 3µm, etc.

[0058] The pad layer 210 can be made of metals such as titanium, copper, gold, or silver, and its thickness can be 0.1µm to 1µm in the direction perpendicular to the drive backplane 100. For example, the thickness of the pad layer 210 in the direction perpendicular to the drive backplane 100 can be 0.1µm, 0.11µm, 0.13µm, 0.15µm, 0.25µm, 0.5µm, 0.75µm, 0.8µm, 0.95µm, 0.99µm, and 1µm.

[0059] The solder layer 220 may be made of metals such as tin or nickel, and its thickness in the direction perpendicular to the drive backplane 100 may be 0.5µm to 5µm. For example, the thickness of the solder layer 220 in the direction perpendicular to the drive backplane 100 may include 0.5µm, 0.6µm, 0.7µm, 0.8µm, 1µm, 2µm, 3µm, 4µm, 4.5µm, 4.7µm, 4.9µm, and 5µm.

[0060] Furthermore, the display panel 10 may include a plurality of light-emitting devices 300, and the electrical connection structure 200 may include a plurality of corresponding electrical connection pairs. Each light-emitting device 300 is connected to a corresponding electrical connection pair. The spacing between adjacent electrical connection pairs is 50um to 500um. For example, the spacing between adjacent electrical connection pairs may be 50um, 53um, 55um, 60um, 100um, 200um, 300um, 400um, 450um, 480um, 490um, 495um, and 500um, etc.

[0061] Furthermore, the light-emitting device 300 includes a first electrode pin and a second electrode pin, and the electrical connection pair includes a first electrical connection portion and a second electrical connection portion.

[0062] The first electrode pin includes a first recess, and the first electrical connection portion includes a first protrusion. The first electrical connection portion achieves electrical connection with the first electrode pin through the engagement of the first protrusion and the first recess. The second electrode pin includes a second recess, and the second electrical connection portion includes a second protrusion. The second electrical connection portion achieves electrical connection with the second electrode pin through the engagement of the second protrusion and the second recess. The distance between the first and second electrical connection portions is 10µm to 30µm. For example, the distance between the first and second electrical connection portions can be 10µm, 10.5µm, 11µm, 13µm, 15µm, 20µm, 25µm, 27µm, 29µm, 29.5µm, and 30µm, etc.

[0063] Based on the same inventive concept, this embodiment also provides a method for manufacturing the above-mentioned display panel 10, for details please refer to Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the process for manufacturing the display panel 10. Figure 5 for Figure 4 The corresponding process flow diagram. (See below for details.) Figure 4 and Figure 5 The steps of the method for manufacturing the display panel 10 are described in detail.

[0064] Step S110: Provide a drive backplane.

[0065] Step S120: Fabricate an electrical connection structure including a protrusion on one side of the drive backplate.

[0066] In this step, the electrical connection structure 200 includes a pad layer 210 and a solder layer 220. The display panel 10 also includes a leveling layer 400 located below the pad layer 210. The leveling layer 400 includes a raised structure and a film layer via. The film layer via exposes at least a portion of the conductive traces in the drive backplane 100. The pad layer 210 is connected to the conductive traces in the drive backplane 100 via the film layer via.

[0067] Step S130: Move the light-emitting device to the side of the electrical connection structure away from the driving backplate, and electrically connect the electrode pins of the light-emitting device to the electrical connection structure.

[0068] In this step, the electrode pin 310 includes a recess on the side facing the driving backplate 100. The electrode pin 310 of the light-emitting device 300 is electrically connected to the electrical connection structure 200 through the cooperation of the protrusion and the recess. Specifically, the light-emitting device 300 can be first transferred to the side of the electrical connection structure 200 away from the driving backplate 100, and the electrode pin 310 of the light-emitting device 300 can be aligned with the electrical connection structure 200, such that the protrusion is located within at least a portion of the recess of the electrode pin 310. Next, the light-emitting device 300 and the driving backplate 100 are subjected to pressure and heat treatment to achieve electrical connection between the light-emitting device 300 and the electrical connection structure 200 through the cooperation of the protrusion and the recess.

[0069] In this embodiment, a protrusion matching the recess of the electrode pin 310 is first provided on one side of the driving backplate 100. Then, the electrode pin 310 of the light-emitting device 300 is electrically connected to the electrical connection structure 200 through the cooperation of the protrusion and the recess. In this way, the electrode pin 310 of the light-emitting device 300 can be tightly connected to the electrical connection structure 200, reducing gaps and defects between the electrode pin of the light-emitting device 300 and the electrical connection structure in the driving backplate 100, enhancing the bonding force between the two, improving the stability and reliability of the display panel 10, and reducing the risk of electrical connection failure caused by external impact or vibration.

[0070] Furthermore, step S120 can be implemented by the following method.

[0071] Step S121: First, a leveling layer including raised structures and membrane through-holes is fabricated on one side of the drive backplate.

[0072] In this step, an organic material can be coated on one side of the drive backplane 100 and cured to form a flat organic material layer on one side of the drive backplane 100. For example, the organic material includes, but is not limited to, epoxy resin. Next, the organic material layer is etched to form a raised structure and film-layer vias, exposing at least a portion of the conductive traces in the drive backplane 100. The raised structure has a height of 1µm to 3µm in the direction perpendicular to the drive backplane 100. For example, the raised structure can have heights of 1µm, 1.1µm, 1.3µm, 1.5µm, 2µm, 2.5µm, 2.7µm, 2.8µm, 2.9µm, and 3µm.

[0073] Step S122: Deposit metal on the drive backplane with the leveled layer to form a pad layer that is at least partially located on the surface of the raised structure, and at least part of the pad layer is electrically connected to the conductive traces through the film layer vias.

[0074] In this step, a metal such as titanium, copper, gold, or silver can be deposited to form a pad layer 210. The thickness of the pad layer 210 in the direction perpendicular to the drive backplane 100 can be 0.1µm to 1µm. For example, the thickness of the pad layer 210 in the direction perpendicular to the drive backplane 100 is 0.1µm, 0.11µm, 0.13µm, 0.15µm, 0.25µm, 0.5µm, 0.75µm, 0.8µm, 0.95µm, 0.99µm, and 1µm, etc.

[0075] Step S123: Deposit metal on the driver backplane with the prepared pad layer to form a solder layer on the side of the pad layer away from the driver backplane.

[0076] In this step, a solder layer 220 can be formed by depositing metals such as tin / nickel to facilitate electrical connection between the electrode pins 310 of the light-emitting device 300 and the electrical connection structure 200 through soldering, ensuring the normal operation of the display panel 10. The thickness of the solder layer 220 in the direction perpendicular to the driving backplate 100 can be 0.5µm to 5µm. For example, the thickness of the solder layer 220 in the direction perpendicular to the driving backplate 100 is 0.5µm, 0.6µm, 0.7µm, 0.8µm, 1µm, 2µm, 3µm, 4µm, 4.5µm, 4.7µm, 4.9µm, and 5µm.

[0077] In summary, this application provides a display panel, a method for manufacturing the display panel, and an electronic device. The display panel includes a driving backplate and a light-emitting device. An electrical connection structure is provided on one side of the driving backplate, and the electrical connection structure includes a protrusion. The light-emitting device is located on the side of the driving backplate where the electrical connection structure is provided. The side of the light-emitting device facing the driving backplate has electrode pins, and the side of the electrode pins facing the driving backplate includes a recess. The shape and size of the recess are adapted to the protrusion. The electrode pins of the light-emitting device and the electrical connection structure are electrically connected through the cooperation of the protrusion and the recess. In this way, the electrode pins of the light-emitting device can be tightly connected to the electrical connection structure, reducing gaps and defects between the electrode pins of the light-emitting device and the electrical connection structure in the driving backplate, enhancing the bonding force between the two, improving the stability and reliability of the display panel, and reducing the risk of electrical connection failure due to external impact or vibration.

[0078] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes: A drive backplate, wherein an electrical connection structure is provided on one side of the drive backplate, the electrical connection structure including a protrusion; A light-emitting device is located on the side of the driving back plate where the electrical connection structure is provided. The side of the light-emitting device facing the driving back plate is provided with electrode pins, and the side of the electrode pins facing the driving back plate includes a recess. The electrode pins of the light-emitting device are electrically connected to the electrical connection structure through the cooperation of the protrusion and the recess.

2. The display panel according to claim 1, characterized in that, The electrical connection structure includes a pad layer and a solder layer, and the display panel also includes a leveling layer located below the pad layer; The leveling layer includes raised structures and film layer vias, the film layer vias exposing at least a portion of the conductive traces in the drive backplane; The pad layer is at least partially located on the surface of the protrusion structure, and at least a portion of the pad layer is electrically connected to the conductive trace via the film via. The solder layer is located on the side of the pad layer away from the drive backplate; Preferably, the orthographic projection of the protrusion on the drive back plate is located within the orthographic projection of the recess on the drive back plate.

3. The display panel according to claim 2, characterized in that, The display panel includes multiple light-emitting devices, and the electrical connection structure includes multiple corresponding electrical connection pairs; Each of the light-emitting devices is connected to a corresponding electrical connection pair; Preferably, the spacing between adjacent electrical connection pairs is 50µm to 500µm.

4. The display panel according to claim 3, characterized in that, The light-emitting device includes a first electrode pin and a second electrode pin, and the electrical connection pair includes a first electrical connection portion and a second electrical connection portion; The first electrode pin includes a first recess, and the first electrical connection portion includes a first protrusion. The first electrical connection portion achieves electrical connection with the first electrode pin through the cooperation of the first protrusion and the first recess. The second electrode pin includes a second recess, and the second electrical connection portion includes a second protrusion. The second electrical connection portion achieves electrical connection with the second electrode pin through the cooperation of the second protrusion and the second recess. Preferably, the distance between the first electrical connection portion and the second electrical connection portion is 10µm to 30µm.

5. The display panel according to claim 2, characterized in that, In a cross-section perpendicular to the direction of the drive backplate, the cross-sectional shape of the protrusion structure includes triangle, trapezoid, and rectangle; Preferably, the thickness of the pad layer is 0.1µm to 1µm in the direction perpendicular to the drive backplate; Preferably, the thickness of the solder layer is 0.5µm to 5µm in the direction perpendicular to the drive backplate.

6. A method for manufacturing a display panel, characterized in that, The method includes: Provide a drive backplane; An electrical connection structure including a protrusion is formed on one side of the drive back plate; The light-emitting device is moved to the side of the electrical connection structure away from the driving backplate, and the electrode pins of the light-emitting device are electrically connected to the electrical connection structure. The side of the electrode pins facing the driving backplate includes a recess, and the electrode pins of the light-emitting device are electrically connected to the electrical connection structure through the cooperation of the protrusion and the recess.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The electrical connection structure includes a pad layer and a solder layer, and the display panel further includes a leveling layer located below the pad layer. The step of fabricating an electrical connection structure including a protrusion on one side of the drive backplate includes: A leveling layer comprising raised structures and film-layer vias is fabricated on one side of the drive backplane, wherein the film-layer vias expose at least a portion of the conductive traces in the drive backplane. Metal deposition is performed on the drive backplane with the leveled layer fabricated to form a pad layer that is at least partially located on the surface of the raised structure, and at least a portion of the pad layer is electrically connected to the conductive traces through the film layer vias. Metal deposition is performed on the drive backplane with the prepared pad layer to form a solder layer located on the side of the pad layer away from the drive backplane.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The step of fabricating a leveling layer comprising a raised structure and film through-holes on one side of the drive backplate includes: An organic material is coated on one side of the drive backplate, and the organic material is cured to form a flat organic material layer on one side of the drive backplate. The organic material layer is etched to form a protruding structure and through-holes in the film.

9. The method for manufacturing a display panel according to claim 6, characterized in that, The step of transferring the light-emitting device to the side of the electrical connection structure away from the driving backplate and electrically connecting the electrode pins of the light-emitting device to the electrical connection structure includes: The light-emitting device is moved to the side of the electrical connection structure away from the driving backplate, and the electrode pins of the light-emitting device are aligned with the electrical connection structure, such that the protrusion is located within at least a portion of the recess of the electrode pin; The light-emitting device and the driving backplate are subjected to pressure and heat treatment so that the light-emitting device and the electrical connection structure are electrically connected through the cooperation of the protrusion and the recess.

10. An electronic device, characterized in that, The electronic device includes the display panel according to any one of claims 1-5, or the display panel prepared by the method of preparing the display panel according to any one of claims 6-9.

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