Display device

Abstract

According to an embodiment of the disclosure, a display device includes a substrate having a plurality of sub-pixels defined thereon, a plurality of light emitting elements disposed in each of the plurality of sub-pixels, a black bank disposed at a boundary between the plurality of sub-pixels, a transparent bank disposed on the black bank, and a plurality of light conversion layers disposed on the plurality of light emitting elements, wherein each of the plurality of light conversion layers is disposed in a space formed by the transparent bank and the black bank. Accordingly, the transparent bank can function as a partition wall that separates the plurality of light conversion layers from each other.

Description

Cross-reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10-2025-0046111 filed with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display device, and more particularly to a display device using light-emitting diodes (LEDs). Background Technology

[0003] Display devices used for computer monitors, TVs, or mobile phones include organic light-emitting displays (OLEDs) that emit their own light and liquid crystal displays (LCDs) that require a separate light source.

[0004] Display devices have been used in a variety of applications, including computer monitors and TVs as well as personal portable devices, and research is underway on display devices with large display areas and reduced size and weight.

[0005] Furthermore, in recent years, LED display devices have received increasing attention as next-generation display devices. Because LEDs are made of inorganic rather than organic materials, they offer superior reliability and a longer lifespan than liquid crystal displays or organic light-emitting diode displays. Moreover, LEDs possess a faster light emission speed, excellent luminous efficiency, and strong shock resistance, resulting in excellent stability and the ability to display high-brightness images. However, the limited configuration of the opaque partitions between LEDs makes it difficult to achieve display devices with high resolution and wide viewing angles. Summary of the Invention

[0006] One objective of this disclosure is to provide a display device capable of displaying high-resolution images.

[0007] Another objective of this disclosure is to provide a display device with high resolution and wide viewing angle.

[0008] Another objective of this disclosure is to provide a display device that reduces the area of ​​each of a plurality of sub-pixels.

[0009] Another objective of this disclosure is to provide a display device with a wide viewing angle.

[0010] Another objective of this disclosure is to provide a display device with improved light conversion efficiency.

[0011] Another objective of this disclosure is to provide a display device with improved viewing angle characteristics.

[0012] Another objective of this disclosure is to provide a display device with improved red light efficiency.

[0013] Another objective of this disclosure is to provide a display device capable of forming a black matrix.

[0014] The purpose of this disclosure is not limited to the foregoing objectives, and other objectives not mentioned above will be clearly understood by those skilled in the art from the following description.

[0015] According to embodiments of this disclosure, a display device includes: a substrate defining a plurality of sub-pixels; a plurality of light-emitting elements disposed in each of the plurality of sub-pixels; a black barrier disposed at a boundary between the plurality of sub-pixels; a transparent barrier disposed on the black barrier; and a plurality of light conversion layers disposed on the plurality of light-emitting elements, wherein each of the plurality of light conversion layers is disposed in a space formed by the transparent barrier and the black barrier. Therefore, the transparent barrier can be used as a partition wall separating the plurality of light conversion layers from each other.

[0016] Further details of the embodiments are included in the detailed description and accompanying drawings.

[0017] According to this disclosure, the area of ​​multiple sub-pixels can be reduced, thereby providing a high-resolution display device.

[0018] According to this disclosure, the area of ​​each of the multiple sub-pixels can be reduced by setting transparent embankments that separate the light conversion layer.

[0019] According to this disclosure, viewing characteristics can be improved by setting a transparent section on a black section.

[0020] According to this disclosure, viewing angle characteristics can be improved by closely arranging the light conversion layer and the light-emitting element together.

[0021] According to this disclosure, light conversion efficiency can be improved by closely arranging the light conversion layer and the light-emitting element together.

[0022] According to this disclosure, red light efficiency can be improved by combining a blue light-emitting element with high light efficiency with a red light conversion layer.

[0023] According to this disclosure, a black matrix can be formed by stacking color filters, and the black matrix can be formed while forming the color filters, thereby reducing manufacturing costs.

[0024] The effects of this disclosure are not limited to those exemplified above, and include a variety of other effects. Attached Figure Description

[0025] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic block diagram of a display device according to exemplary embodiments of the present disclosure. Figure 2 This is a partial cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Figure 3 This is a schematic enlarged plan view of the display area of ​​a display device according to an exemplary embodiment of the present disclosure. Figure 4 This is a schematic enlarged plan view of the display area of ​​a display device according to an exemplary embodiment of the present disclosure. Figure 5 It is along Figure 3 The cross-sectional view of the display device is taken by line AA′. Figure 6 It is along Figure 3 A schematic cross-sectional view of the display device taken by line BB′. Figure 7 This is an enlarged plan view of the display area of ​​a display device according to another exemplary embodiment of the present disclosure. Figure 8 It is along Figure 7 A schematic cross-sectional view of the display device taken by line CC′. Figure 9 It is according to yet another exemplary embodiment of this disclosure, along with similar Figure 3 A schematic cross-sectional view of the display device taken from the line BB′ in the diagram. Figure 10 It is according to yet another exemplary embodiment of this disclosure, along with similar Figure 7 A schematic cross-sectional view of the display device taken from line C-C'. Detailed Implementation

[0026] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below, taken in conjunction with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0027] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0028] Even if not explicitly stated, the components are interpreted as including the normal error range.

[0029] When using terms such as “on,” “above,” “below,” and “beside” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts, unless these terms are used with the terms “immediately adjacent” or “directly.”

[0030] When one element or layer is placed "on" another element or layer, the other layer or element can be directly inserted onto or between the other element.

[0031] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, the first component mentioned below may be the second component in the technical concept of this disclosure.

[0032] Throughout this disclosure, the same reference numerals generally denote the same elements.

[0033] For ease of description, the dimensions and thickness of each component shown in the figures are illustrated, and this disclosure is not limited to the dimensions and thickness of the components shown.

[0034] Features of the various embodiments of this disclosure may be partially or completely dependent on or combined with each other, and may be interlocked and operated in various technical ways, and the embodiments may be performed independently or in association with each other.

[0035] This disclosure will now be described in detail with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic configuration diagram of a display device according to exemplary embodiments of the present disclosure. Figure 2 This is a partial cross-sectional view of a display device according to an exemplary embodiment of the present disclosure. Figure 1 For ease of description, only the display panel PN, gate driver GD, data driver DD, and timing controller TC are shown among the various components of the display device 100.

[0037] Reference Figure 1 The display device 100 includes: a display panel PN, which includes a plurality of sub-pixels SP; a gate driver GD and a data driver DD, which provide various signals to the display panel PN; and a timing controller TC, which controls the gate driver GD and the data driver DD.

[0038] The gate driver GD provides multiple scan signals to multiple scan lines SL based on multiple gate control signals provided by the timing controller TC. Figure 1 A gate driver GD is shown positioned spaced apart from one side of the display panel PN. However, the number and arrangement of gate drivers GDs are not limited to this.

[0039] The data driver DD supplies data voltages to multiple data lines DL based on multiple data control signals and image data provided by the timing controller TC. The data driver DD can use a reference gamma voltage to convert image data into data voltages and supply the converted data voltages to the multiple data lines DL.

[0040] The timing controller TC aligns the image data input from the outside and provides the image data to the data driver DD. The timing controller TC can generate gate control signals and data control signals using synchronization signals input from the outside (e.g., dot clock signals, data enable signals, horizontal / vertical synchronization signals). Furthermore, the timing controller TC provides the generated gate control signals and data control signals to the gate driver GD and the data driver DD, respectively, to control the gate driver GD and the data driver DD.

[0041] The display panel PN is configured to display an image to a user and includes multiple subpixels SP. In the display panel PN, multiple scan lines SL and multiple data lines DL may intersect each other, and multiple subpixels SP may be formed at the intersection of scan lines SL and data lines DL.

[0042] In the display panel PN, the display area AA and the non-display area NA can be defined.

[0043] The display area AA is the area in the display device 100 where an image is displayed. Within the display area AA, multiple sub-pixels SP constituting multiple pixels and pixel circuitry for driving the multiple sub-pixels SP can be provided. The multiple sub-pixels SP are the smallest units constituting the display area AA, and n sub-pixels SP can form one pixel. Pixel circuitry for driving multiple light-emitting elements 120 can be provided in each of the multiple sub-pixels SP. The multiple light-emitting elements 120 can be defined differently depending on the type of the display panel PN. For example, when the display panel PN is an inorganic light-emitting display panel PN, the light-emitting elements 120 can be light-emitting elements (LEDs) or micro-light-emitting elements (LEDs).

[0044] Within the display area AA, multiple signal lines are provided for transmitting various signals to multiple sub-pixels SP. For example, the multiple signal lines may include multiple data lines DL providing data voltage to each of the multiple sub-pixels SP, and multiple scan lines SL providing scan signals to each of the multiple sub-pixels SP. The multiple scan lines SL may extend in one direction within the display area AA and be connected to the multiple sub-pixels SP, while the multiple data lines DL may extend in a direction different from that direction within the display area AA and be connected to the multiple sub-pixels SP. Furthermore, the display area AA may also include power lines PL, reference lines, etc., but is not limited to these.

[0045] The non-display area NA is the area where no image is displayed and can be defined as the area extending from the display area AA. In the non-display area NA, link lines and pad electrodes for transmitting signals to the sub-pixels SP of the display area AA can be provided, or driver ICs, such as gate driver ICs or data driver ICs, can be provided. The non-display area NA can be located on the rear surface of the display panel PN, i.e., on the surface where sub-pixels SP are not provided or can be omitted, and is not limited to what is shown in the figures.

[0046] Meanwhile, drivers such as gate driver GD, data driver DD, and timing controller TC can be connected to the display panel PN in various ways. For example, the gate driver GD can be installed in the non-display area NA as a gate in panel (GIP), or installed between multiple sub-pixels SP in the display area AA as a gate in display area (GIA).

[0047] For example, the data driver DD and the timing controller TC can be formed on separate flexible films and printed circuit boards. Furthermore, the display panel PN, the data driver DD, and the timing controller TC can be electrically connected by bonding the flexible film and the printed circuit board to pad electrodes formed in the non-display area NA of the display panel PN.

[0048] As another example, when the gate driver GD is mounted in the display area AA in a GIA configuration, the flexible film and printed circuit board can be bonded to the rear surface of the display panel PN, forming side lines SRL that connect the signal lines on the front surface of the display panel PN to the pad electrodes on the rear surface of the display panel PN. Therefore, the non-display area NA on the front surface of the display panel PN can be minimized. Thus, when the gate driver GD, data driver DD, and timing controller TC are connected to the display panel PN in the manner described above, a virtually bezel-less design can be achieved.

[0049] In the non-display area NA of the display panel PN, multiple pad electrodes are provided for transmitting various signals to multiple sub-pixels SP. For example, a first pad electrode PAD1 for transmitting signals to multiple sub-pixels SP is provided in the non-display area NA on the front surface of the display panel PN, and a second pad electrode PAD2 that is electrically connected to driving components such as flexible films and printed circuit boards is provided in the non-display area NA on the rear surface of the display panel PN.

[0050] In this case, although not shown in the figure, various signal lines (e.g., scan lines SL or data lines DL) connected to multiple sub-pixels SP extend from the display area AA to the non-display area NA to be electrically connected to the first pad electrode PAD1.

[0051] Furthermore, a side line SRL is provided along the side surface of the display panel PN. The side line SRL is electrically connected to a first pad electrode PAD1 on the front surface of the display panel PN and a second pad electrode PAD2 on the rear surface of the display panel PN. Therefore, signals from the driving components on the rear surface of the display panel PN can be transmitted to multiple sub-pixels SP through the second pad electrode PAD2, the side line SRL, and the first pad electrode PAD1. Thus, a signal transmission path is formed from the front surface to the side and rear surfaces of the display panel PN to minimize the area of ​​the non-display region NA on the front surface of the display panel PN.

[0052] Therefore, the driving component is connected to the rear surface of the display panel PN using a side line SRL to reduce the area of ​​the non-display area NA and achieve a display device 100 with a minimized bezel. Furthermore, when multiple display devices 100 with minimized bezels are arranged to form a tiled display device, the seam area between one display device 100 and another adjacent display device 100 where no image is displayed is minimized to improve display quality.

[0053] In the following text, reference will be made to Figures 3 to 6 The sub-pixels SP of the display device 100 according to exemplary embodiments of the present disclosure will be described in more detail.

[0054] Figure 3 This is a schematic enlarged plan view of the display area of ​​a display device according to an exemplary embodiment of the present disclosure. Figure 4 This is a schematic enlarged plan view of the display area of ​​a display device according to an exemplary embodiment of the present disclosure. Figure 5 It is along Figure 3 The cross-sectional view of the display device is taken by line AA′. Figure 6 It is along Figure 3 A schematic cross-sectional view of the display device taken by line BB′. For ease of description, in Figure 3The image shows only multiple light-emitting elements 120, multiple reflective electrodes (RE1 and RE2), multiple light conversion layers QD, a black dam 116a, and a transparent dam 116b, and... Figure 4 The image shows only multiple light-emitting elements 120, multiple reflective electrodes (RE1 and RE2), multiple color filters CF, a black embankment 116a, and a black matrix BM, and... Figure 6 The image schematically illustrates the TFT array TA and the light-emitting element 120.

[0055] Reference Figures 3 to 6 The display area AA has a plurality of sub-pixels SP. Each of the plurality of sub-pixels SP includes a light-emitting element 120 and can emit light independently. The plurality of sub-pixels SP can be arranged into a matrix when forming multiple rows and columns, but the exemplary embodiments of this disclosure are not limited thereto.

[0056] Multiple subpixels SP include a red subpixel SPR, a green subpixel SPG, and a blue subpixel SPB. Images of various colors can be displayed by combining red, green, and blue light from each of the red subpixel SPR, green subpixel SPG, and blue subpixel SPB.

[0057] The red subpixel SPR, green subpixel SPG, and blue subpixel SPB can be positioned on the same line. The blue subpixel SPB can be positioned between the red subpixel SPR and the green subpixel SPG. The red subpixel SPR can be spaced apart from the green subpixel SPG, with the blue subpixel SPB interspersed in between, and the blue subpixel SPB can be positioned adjacent to both the red and green subpixels SPR. For setting up multiple optical conversion layers (QDs), the blue subpixel SPB can be positioned between the red and green subpixels SPG, as will be described in more detail below.

[0058] The substrate 110 is a component that supports other parts of the display device 100 and may be an insulating substrate 110. For example, the substrate 110 may be made of glass, resin, etc. Furthermore, the substrate 110 may be made of polymer, plastic, etc., and in some embodiments, the substrate 110 may be made of a flexible plastic material. Multiple sub-pixels SP may be formed on the substrate 110 to display images.

[0059] A light-shielding layer BSM is disposed on the substrate 110 in each of the plurality of sub-pixels SP. The light-shielding layer BSM blocks light incident on the active layer ACT of the driving transistor DT to minimize leakage current. For example, the light-shielding layer BSM is disposed below the active layer ACT of the driving transistor DT to block light incident on the active layer ACT. When light shines on the active layer ACT, leakage current is generated, which can reduce the reliability of the driving transistor DT. Therefore, a light-shielding layer BSM for blocking light is disposed on the substrate 110 to improve the reliability of the driving transistor DT. The light-shielding layer BSM may be made of an opaque conductive material, such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto.

[0060] A buffer layer 111 is disposed on the substrate 110 and the light-shielding layer BSM. The buffer layer 111 is configured to cover one surface of the substrate 110 to reduce the penetration of moisture or impurities into the substrate 110. For example, the buffer layer 111 may be configured as a single layer or multiple layers made of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Depending on the type of substrate 110 or the type of transistor, the buffer layer 111 may be omitted, but is not limited thereto.

[0061] A driving transistor DT is disposed on a buffer layer 111 in each of the plurality of sub-pixels SP. The driving transistor DT includes an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. Additionally, although not shown in the figure, other components, such as a switching transistor, a sensing transistor, an emitter control transistor, and a storage capacitor, may be additionally disposed in each of the plurality of sub-pixels SP besides the driving transistor DT.

[0062] The active layer ACT of the driving transistor DT is disposed on the buffer layer 111. The active layer ACT may be configured to overlap with the light-shielding layer BSM. The active layer ACT may be formed of a semiconductor material such as oxide semiconductor, amorphous silicon, or polycrystalline silicon, but is not limited thereto. Furthermore, although not shown in the figure, the active layers of other transistors such as switching transistors, sensing transistors, and emitter control transistors may also be formed of semiconductor materials such as oxide semiconductor, amorphous silicon, or polycrystalline silicon, but are not limited thereto. In addition, the active layers ACT of the driving transistor DT, switching transistor, sensing transistor, and emitter control transistor may be formed of the same material or different materials.

[0063] A gate insulating layer 112 is disposed on the active layer ACT. The gate insulating layer 112 is an insulating layer that insulates the active layer ACT from the gate electrode GE. For example, the gate insulating layer 112 may be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. In this case, even if the gate insulating layer 112 is shown to be disposed only below the gate electrode GE in the figure, the gate insulating layer 112 may be disposed on the entire surface of the substrate 110, but is not limited thereto.

[0064] The gate electrode GE is disposed on the gate insulating layer 112. The gate electrode GE may be configured to overlap with the active layer ACT. The gate electrode GE may be made of a conductive material such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto.

[0065] A first interlayer insulating layer 113a and a second interlayer insulating layer 113b are disposed on the gate electrode GE. Contact holes are formed in the first interlayer insulating layer 113a and the second interlayer insulating layer 113b, through which the source electrode SE and the drain electrode DE are connected to the active layer ACT. The first interlayer insulating layer 113a and the second interlayer insulating layer 113b are insulating layers protecting the components beneath them, and may be composed of a single layer or a double layer of silicon oxide (SiOx) or silicon nitride (SiNx), but are not limited thereto.

[0066] The source electrode SE and drain electrode DE are disposed on the second interlayer insulating layer 113b. The source electrode SE and drain electrode DE can be electrically connected to the active layer ACT through contact holes formed in the first interlayer insulating layer 113a, the second interlayer insulating layer 113b, and the gate insulating layer 112. Either the source electrode SE or the drain electrode DE can be electrically connected to the light-emitting element 120. For example, either the source electrode SE or the drain electrode DE can provide a driving current to the light-emitting element 120 through the first reflective electrode RE1. The source electrode SE and the drain electrode DE can be made of conductive materials such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but are not limited thereto.

[0067] A first conductive layer CL1 is disposed on the gate insulating layer 112. The first conductive layer CL1 is an electrode for applying a constant voltage to the light-shielding layer BSM, and can be electrically connected to the light-shielding layer BSM through contact holes in the gate insulating layer 112 and the buffer layer 111. For example, the light-shielding layer BSM is connected to the first conductive layer CL1 so that it does not operate as a floating gate, and can prevent threshold voltage fluctuations of the driving transistor DT due to the floating light-shielding layer BSM. The first conductive layer CL1 may be formed of conductive materials such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto.

[0068] A second conductive layer CL2 is disposed on the second interlayer insulating layer 113b, and a third conductive layer CL3 electrically connected to the second conductive layer CL2 is disposed between the first interlayer insulating layer 113a and the second interlayer insulating layer 113b. The second conductive layer CL2 and the third conductive layer CL3 can be configured to overlap with the gate electrode GE of the driving transistor DT to form a capacitor with the gate electrode GE of the driving transistor DT. Therefore, various conductive layers such as the second conductive layer CL2 and the third conductive layer CL3 are disposed on the substrate 110 to form a capacitor. The second conductive layer CL2 and the third conductive layer CL3 can be made of conductive materials such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but are not limited thereto.

[0069] A power line PL is disposed on the second interlayer insulating layer 113b. The power line PL can be configured to transmit power voltage to the light-emitting elements 120 of multiple sub-pixels SP. The power line PL can be made of conductive materials such as copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto. The power line PL can be electrically connected to the multiple light-emitting elements 120 via the second reflective electrode RE2. Depending on the configuration of the pixel circuit, the power line PL can be configured as a low-potential power line or a high-potential power line.

[0070] A first insulating layer 114 is disposed on the driving transistor DT, the power line PL, and the second interlayer insulating layer 113b. The first insulating layer 114 can planarize the upper part of the pixel circuit including the driving transistor DT. The first insulating layer 114 can be configured as a single layer or multiple layers, and can be made of any of, but is not limited to, organic materials such as benzocyclobutene or acrylic acid or inorganic materials such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0071] Meanwhile, a portion of the circuitry and lines provided for driving the sub-pixels SP, such as the driving transistor DT, power line PL, and multiple conductive layers (CL1, CL2, and CL3), can also be defined as a TFT (thin-film transistor) array TA. For example, components disposed in the region between the substrate 110 and the first insulating layer 114 can be included in the TFT array TA. For example, the light-shielding layer BSM, the driving transistor DT, the multiple conductive layers (CL1, CL2, and CL3), the power line PL, and the insulating layers (e.g., 111, 112, 113a, 113b, and 114) disposed above and below the light-shielding layer BSM can be referred to as the TFT array TA.

[0072] A first reflective electrode RE1 and a second reflective electrode RE2 are disposed on the first insulating layer 114. The first reflective electrode RE1 and the second reflective electrode RE2 are electrodes for connecting each of the driving transistor DT and the power line PL to the light-emitting element 120. In addition, the first reflective electrode RE1 and the second reflective electrode RE2 may be reflectors that reflect light from the light-emitting element 120 that is directed toward the substrate 110 toward the upper side of the light-emitting element 120.

[0073] The first reflective electrode RE1 is an electrode that reflects the light emitted from the light-emitting element 120 toward the upper side of the substrate 110 and is electrically connected to the light-emitting element 120 and the driving transistor DT.

[0074] The second reflective electrode RE2 is an electrode that reflects light emitted from the light-emitting element 120 toward the upper side of the substrate 110 and is electrically connected to the light-emitting element 120 and the power line PL. In this case, the second reflective electrode RE2, which is connected to the power line PL of multiple sub-pixels SP, can be shared in multiple sub-pixels SP. For example, multiple sub-pixels SP can share the second reflective electrode RE2.

[0075] Considering light reflection efficiency and resistance, the first reflective electrode RE1 and the second reflective electrode RE2 may include various conductive layers. For example, the first reflective electrode RE1 and the second reflective electrode RE2 may include opaque conductive layers (e.g., silver (Ag), aluminum (Al), molybdenum (Mo), titanium (Ti) or alloys thereof) and transparent conductive layers (e.g., indium tin oxide (ITO)), but the configuration of the first reflective electrode RE1 and the second reflective electrode RE2 is not limited to this.

[0076] A conductive adhesive layer AD is disposed on a plurality of first reflective electrodes RE1 and second reflective electrodes RE2. The conductive adhesive layer AD may be formed on the front surface of the substrate 110 to fix the light-emitting element 120 disposed on the conductive adhesive layer AD and to electrically connect the light-emitting element 120 to the first reflective electrodes RE1 and the second reflective electrodes RE2.

[0077] The conductive adhesive layer AD can be an adhesive layer in which conductive spheres are dispersed in an insulating substrate member. When heat or pressure is applied to the conductive adhesive layer AD, the conductive spheres are electrically connected in the portions where heat or pressure is applied to have conductive properties, and the conductive spheres may not be electrically connected in areas where heat or pressure is not applied to have insulating properties. Therefore, by applying heat or pressure after transferring the light-emitting element 120 onto the conductive adhesive layer AD, the conductive adhesive layer AD has conductive properties only below the electrodes of the light-emitting element 120, such that the first electrode 124 and the second electrode 125 of the light-emitting element 120 can be electrically connected to the first reflective electrode RE1 and the second reflective electrode RE2, respectively.

[0078] The light-emitting element 120 is disposed on a conductive adhesive layer AD in each of the plurality of sub-pixels SP. The light-emitting element 120 is an inorganic light-emitting element that emits light by means of a driving current supplied to the light-emitting element 120. The light-emitting element 120 may be any of a light-emitting diode (LED) and a micro light-emitting diode (micro LED), but the exemplary embodiments of this disclosure are not limited thereto.

[0079] Furthermore, in the display device 100 according to an exemplary embodiment of the present disclosure, images of various colors can be displayed by a combination of a blue light-emitting element 120, a red light conversion layer QDR, and a green light conversion layer QDG. Therefore, in the following, it is assumed that the light-emitting element 120 of the display device 100 according to an exemplary embodiment of the present disclosure is a blue light-emitting element 120.

[0080] The light-emitting element 120 includes a first semiconductor layer 121, an emitting layer 122, a second semiconductor layer 123, a first electrode 124, and a second electrode 125.

[0081] A second semiconductor layer 123 is disposed on the first reflective electrode RE1 and the second reflective electrode RE2, and a first semiconductor layer 121 is disposed on the second semiconductor layer 123. The first semiconductor layer 121 and the second semiconductor layer 123 can be semiconductor layers doped with p-type and n-type impurities. For example, the first semiconductor layer 121 and the second semiconductor layer 123 can be layers in which p-type and n-type impurities are doped into materials such as gallium nitride (GaN), indium aluminum phosphide (InAlP), or gallium arsenide (GaAs). The p-type impurity can be magnesium (Mg), zinc (Zn), beryllium (Be), etc., and the n-type impurity can be silicon (Si), germanium (Ge), tin (Sn), etc., but are not limited thereto.

[0082] An emitting layer 122 is disposed between a first semiconductor layer 121 and a second semiconductor layer 123. The emitting layer 122 can emit light based on a driving current supplied to the light-emitting element 120. For example, the emitting layer 122 can emit blue light, and the light-emitting element 120 can be a blue light-emitting element 120. The emitting layer 122 can be formed of a single-layer or multiple quantum well (MQW) structure, for example, it can be formed of indium gallium nitride (InGaN) or gallium nitride (GaN), but is not limited thereto.

[0083] A first electrode 124 is disposed below the first semiconductor layer 121. The first electrode 124 may contact the lower surface of the first semiconductor layer 121. The first electrode 124 is an electrode for electrically connecting the light-emitting element 120 to the first reflective electrode RE1 and the driving transistor DT. The light-emitting element 120 can be electrically connected to the driving transistor DT through the first electrode 124 and the first reflective electrode RE1. The first electrode 124 may be formed of an opaque conductive material (e.g., titanium (Ti), gold (Au), silver (Ag), copper (Cu) or alloys thereof), a transparent conductive material (e.g., indium tin oxide (ITO) or indium zinc oxide (IZO)), or a combination of opaque and transparent conductive materials, but is not limited thereto.

[0084] The second electrode 125 is disposed below the second semiconductor layer 123. The second electrode 125 can contact the lower surface of the second semiconductor layer 123. The second electrode 125 is an electrode for electrically connecting the light-emitting element 120 to the power line PL. The light-emitting element 120 can be electrically connected to the power line PL through the second electrode 125 and the second reflective electrode RE2. The second electrode 125 can be formed of an opaque conductive material (e.g., titanium (Ti), gold (Au), silver (Ag), copper (Cu) or alloys thereof), a transparent conductive material (e.g., indium tin oxide (ITO) or indium zinc oxide (IZO)), or a combination of opaque and transparent conductive materials, but is not limited thereto.

[0085] Meanwhile, although not shown in the figure, a protective layer may be provided to surround the first semiconductor layer 121, the emitter layer 122, and the second semiconductor layer 123. The protective layer protects the first semiconductor layer 121, the emitter layer 122, and the second semiconductor layer 123. For example, the protective layer may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0086] A second insulating layer 115 is disposed on the first reflective electrode RE1 and the second reflective electrode RE2 and surrounds the plurality of light-emitting elements 120. The second insulating layer 115 may be configured to surround the sides of the plurality of light-emitting elements 120. For example, the second insulating layer 115 may be configured as a single layer or multiple layers and may be made of benzocyclobutene or acrylic-based organic materials. However, this disclosure is not limited thereto.

[0087] Black dam 116a is disposed between the plurality of sub-pixels SP and on the second insulating layer 115. Specifically, the black dam 116a is disposed directly on the second insulating layer 115 to reduce the vertical distance between the black dam 116a and the light-emitting element 120. The black dam 116a may be disposed along the boundaries between the plurality of sub-pixels SP. The black dam 116a prevents the light from each of the plurality of sub-pixels SP from mixing with each other. The black dam 116a minimizes crosstalk caused by mixing the light from the plurality of sub-pixels SP.

[0088] The thickness of the black dam 116a can be less than the thickness of the light conversion layer QD. The black dam 116a can be formed to have a minimum thickness for reducing color mixing and crosstalk. The height of the black dam 116a is formed to be lower than the light conversion layer QD to achieve a wide viewing angle display device 100, and the area of ​​the sub-pixel SP is reduced to achieve a high resolution display device 100. Light emitted from the light-emitting element 120 and guided toward the wide viewing angle region is prevented from being blocked by the black dam 116a and thus not guided toward the wide viewing angle region. That is, the black dam 116a has a smaller height than the light conversion layer QD and the transparent dam 116b, thereby avoiding the blocking of light guided toward the wide viewing angle region. Furthermore, even if the gap between the black dam 116a and the light-emitting element 120 is formed to be narrow, light emitted from the light-emitting element 120 is easily guided to the wide viewing angle region due to the low height of the black dam 116a. Therefore, a display device 100 with a wide viewing angle and high resolution can be achieved by reducing the height of the black dam 116a.

[0089] A transparent dam 116b is disposed between multiple sub-pixels SP and on the second insulating layer 115 and the black dam 116a. Furthermore, the transparent dam 116b may extend to some sub-pixels SP in which the light conversion layer QD is not disposed to cover the light-emitting element 120. For example, in a blue sub-pixel SPB where a blue light-emitting element 120 is disposed, the transparent dam 116b may be disposed on the second insulating layer 115 and the light-emitting element 120. The transparent dam 116b may be disposed in the blue sub-pixel SPB to cover a portion of the black dam 116a and the light-emitting element 120, and may contact the side surfaces of the material of the light conversion layer QD of the adjacent red sub-pixel SPR and green sub-pixel SPG, but is not limited thereto. For example, the light conversion layer QD may be disposed in all sub-pixels SP, depending on the color design of the display device. For ease of description, the sub-pixels in which the transparent dam 116b is disposed may be referred to as the first group of sub-pixels, and the sub-pixels in which the light conversion layer QD is disposed may be referred to as the second group of sub-pixels.

[0090] Meanwhile, the transparent barrier 116b can be made of an organic material with hydrophobic properties. The hydrophobic transparent barrier 116b pushes out the material of the light conversion layer QD, so that the material of the light conversion layer QD is not disposed on the transparent barrier 116b, but rather in the region between the transparent barriers 116b, i.e., the region of the sub-pixel SP. Furthermore, during the formation of the material of the light conversion layer QD, some material of the light conversion layer QD applied to the transparent barrier 116b due to errors flows from the transparent barrier 116b and is disposed in the region of the sub-pixel SP.

[0091] Multiple light conversion layers (QDs) are disposed on the second insulating layer 115 of the remaining sub-pixels SP in the multiple sub-pixels SP. The multiple light conversion layers (QDs) include light conversion materials such as quantum dots, nano phosphors, or organic phosphors to convert light emitted from the light-emitting element 120 into light of various colors.

[0092] Multiple light conversion layers (QDs) include a green light conversion layer (QDG) and a red light conversion layer (QDR). In the red sub-pixel (SPR), the red light conversion layer (QDR) is disposed on the second insulating layer 115 to cover a portion of the black dam 116a and the light-emitting element 120, and contacts the side surface of the transparent dam 116b disposed in the adjacent blue sub-pixel (SPB). In the green sub-pixel (SPG), the green light conversion layer (QDG) is disposed on the second insulating layer 115 to cover a portion of the black dam 116a and the light-emitting element 120, and contacts the side surface of the transparent dam 116b disposed in the adjacent blue sub-pixel (SPB). Therefore, an image can be displayed by a combination of blue light from the blue light-emitting element 120, green light converted by the green light conversion layer (QDG), and red light converted by the red light conversion layer (QDR).

[0093] Meanwhile, a typical red light-emitting element has a lower luminous efficiency than the blue light-emitting element 120. Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, the blue light-emitting element 120 with higher luminous efficiency and the red light conversion layer QDR are disposed together in the red sub-pixel SPR to improve red light efficiency.

[0094] A transparent dam 116b is disposed between the red light conversion layer QDR and the green light conversion layer QDG. The red light conversion layer QDR or the green light conversion layer QDG can be filled in the space formed by the transparent dam 116b and the black dam 116a. Together, the transparent dam 116b and the black dam 116a separate each of the plurality of light conversion layers QD. The space where the red light conversion layer QDR and the green light conversion layer QDG are disposed can be separated by the transparent dam 116b and the black dam 116a. Each of the plurality of light conversion layers QD can be spaced apart from each other, with the transparent dam 116b inserted between them.

[0095] To separate the multiple light conversion layers QD from each other, the thickness of the transparent dam 116b can be equal to or greater than the thickness of the light conversion layer QD. The top surface of the transparent dam 116b can be set to be equal to or higher than the top surface of the light conversion layer QD. The transparent dam 116b can be set to surround the light conversion layer QD at a height equal to or greater than the height of the light conversion layer QD, and to be in direct contact with the side surface of the light conversion layer QD.

[0096] The transparent dam 116b may have a tapered shape. Specifically, the transparent dam 116b may have a trapezoidal shape, wherein the width decreases from bottom to top as the cross-sectional shape decreases. Furthermore, each of the plurality of light conversion layers QD formed in the space between the tapered transparent dams 116b may have an inverted tapered shape. The width of the space between the tapered transparent dams 116b may increase from bottom to top; therefore, the plurality of light conversion layers QD filling this space may be formed in an inverted tapered shape. Each of the plurality of light conversion layers QD may have an inverted trapezoidal shape, wherein the width increases from bottom to top as the cross-sectional shape increases.

[0097] A third insulating layer 117 is disposed on the transparent dam 116b and the plurality of light conversion layers QD. The third insulating layer 117 protects the plurality of light conversion layers QD. The third insulating layer 117 provides a flat surface on the plurality of light conversion layers QD and the transparent dam 116b. The third insulating layer 117 can be formed of any of organic insulating materials and inorganic insulating materials.

[0098] Multiple color filters (CFs) are disposed on the third insulating layer 117. The multiple color filters (CFs) can overlap with multiple sub-pixels (SPs). The multiple color filters (CFs) include a red color filter (CFR), a green color filter (CFG), and a blue color filter (CFB). The red color filter (CFR) can overlap with the red sub-pixel (SPR), the green color filter (CFG) can overlap with the green sub-pixel (SPG), and the blue color filter (CFB) can overlap with the blue sub-pixel (SPB). Light from the multiple light conversion layers (QDs) and the light-emitting element 120 can pass through the multiple color filters (CFs) and be extracted to the outside of the display device 100. On the other hand, external light incident on the display device 100 is absorbed by the multiple color filters (CFs) and is not reflected back to the outside of the display device 100. Therefore, by providing color filters (CFs) that absorb external light and only transmit light converted by the light conversion layer (QD) and light directly emitted from the blue light-emitting element 120 to the outside of the display device 100 from the sub-pixel (SP), display quality and color reproduction are improved.

[0099] A black matrix BM is disposed on the third insulating layer 117. The black matrix BM can be disposed between multiple color filters CF. The black matrix BM can block light from each of the multiple sub-pixels SP so that they do not mix with each other. In addition, the black matrix BM absorbs light incident on the display device 100 from the outside, thereby minimizing the reduction in visibility caused by reflection of external light from the internal configuration of the display device 100. The black matrix BM can be formed of a material different from the material of the multiple color filters CF. For example, the black matrix BM contains a black component and can be made of an opaque resin containing pigment, but is not limited thereto.

[0100] Conventionally, multiple sub-pixels are separated by embankment-like opaque partitions, and a light conversion layer is disposed in the space at the height of the opaque partitions. However, the opaque partitions and the light-emitting elements must be spaced apart by a predetermined interval so that light from the light-emitting elements passes through the opaque partitions and propagates towards a wide viewing angle. For example, as the height of the opaque partitions increases or the distance between the opaque partitions and the light-emitting elements decreases, light guided from the light-emitting elements to the wide viewing angle is blocked by the opaque partitions and has difficulty propagating to the outside. Furthermore, light conversion efficiency can only be ensured when the thickness of the light conversion layer is formed to be higher than a predetermined level, so the height of the opaque partitions separating the multiple light conversion layers should be formed to be equal to or higher than the height of the light conversion layers. Therefore, considering the thickness of the light conversion layer and the light guided towards the wide viewing angle, high resolution is difficult to achieve due to the increase in the thickness of the opaque partitions or the increase in the interval between the light-emitting elements and the opaque partitions, and the increase in the area of ​​each of the multiple sub-pixels.

[0101] Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, a black dam 116a having a height lower than that of the light conversion layers QD is provided, and a transparent dam 116b separating each of the plurality of light conversion layers QD is provided on top of the black dam 116a. Light emitted from the light-emitting element 120 along the wide viewing angle direction can be easily guided to the outside through the transparent dam 116b. Furthermore, by forming the black dam 116a to be thinner, the gap between the black dam 116a and the light-emitting element 120 can be narrowed, and the area of ​​the sub-pixel SP can be reduced. Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, the black dam 116a and the transparent dam 116b are together provided between the plurality of light conversion layers QD to provide a display device 100 with a wide viewing angle and high resolution.

[0102] Furthermore, in the display device 100 according to an exemplary embodiment of the present disclosure, the light conversion layer QD is directly disposed on the light-emitting element 120 to reduce the distance between the light-emitting element 120 and the light conversion layer QD and improve the light conversion efficiency. As the distance between the light-emitting element 120 and the light conversion layer QD becomes closer, the light conversion efficiency can be improved.

[0103] Figure 7 This is an enlarged plan view of the display area of ​​a display device according to another exemplary embodiment of the present disclosure. Figure 8 It is along Figure 7 A schematic cross-sectional view of the display device taken by line CC′. Figure 7 and Figure 8 The display device 700 and Figures 1 to 6The only difference between the display devices 100 is the configuration of the multiple sub-pixels SP, the light-emitting element 720 and the light conversion layer QD, but the other configurations are basically the same, so redundant descriptions will be omitted.

[0104] Reference Figure 7 and Figure 8 Multiple sub-pixels SP include a red sub-pixel SPR, a green sub-pixel SPG, and a blue sub-pixel SPB. The red sub-pixel SPR, green sub-pixel SPG, and blue sub-pixel SPB can be arranged side-by-side on the same line. In this case, the red sub-pixel SPR can be positioned between the green sub-pixel SPG and the blue sub-pixel SPB. The red sub-pixel SPR can be positioned adjacent to either the green sub-pixel SPG or the blue sub-pixel SPB. To set the light conversion layer QD in the red sub-pixel SPR, the red sub-pixel SPR can be positioned between the green sub-pixel SPG and the blue sub-pixel SPB, where a transparent dam 116b is provided.

[0105] The plurality of light-emitting elements 720 includes a blue light-emitting element 720B and a green light-emitting element 720G. The blue light-emitting element 720B is disposed in the blue sub-pixel SPB and the red sub-pixel SPR, and the green light-emitting element 720G is disposed in the green sub-pixel SPG.

[0106] The light conversion layer QD includes a red light conversion layer QDR. The red light conversion layer QDR can be disposed on the second insulating layer 115 and the blue light emitting element 720B in the red sub-pixel SPR to convert blue light into red light. However, the light conversion layer QD does not need to be disposed in the green sub-pixel SPG in which the green light emitting element 720G is disposed, or in the blue sub-pixel SPB in which the blue light emitting element 720B is disposed.

[0107] Therefore, the transparent barrier 116b can be disposed at the boundary between the multiple sub-pixels SP, and is disposed in both the green sub-pixel SPG and the blue sub-pixel SPB. Light from each of the green light-emitting elements 720G and the blue light-emitting elements 720B can pass through the transparent barrier 116b as is and propagate toward the outside of the display device 700.

[0108] Therefore, in a display device 700 according to another exemplary embodiment of the present disclosure, a green light-emitting element 720G is disposed in the green sub-pixel SPG to improve green light efficiency. Instead of the combination of a blue light-emitting element 720B and a green light conversion layer QDG, green light can be emitted from the green light-emitting element 720G. Furthermore, since the efficiency of a red light-emitting element is lower than that of the green light-emitting element 720G and the blue light-emitting element 720B, a blue light-emitting element 720B and a red light conversion layer QDR can be disposed in the red sub-pixel SPR to ensure higher light efficiency. Therefore, the green light-emitting element 720G is disposed in the green sub-pixel SPG to simplify the process of forming the green light conversion layer QDG, thereby reducing manufacturing costs, and the blue light-emitting element 720B, which has higher light efficiency than the red light-emitting element, is disposed together with the red light conversion layer QDR in the red sub-pixel SPR to improve color reproduction rate.

[0109] Figure 9 It is according to yet another exemplary embodiment of this disclosure along a path similar to Figure 3 A schematic cross-sectional view of the display device taken from the line BB′. Figure 10 It is according to yet another exemplary embodiment of this disclosure along a path similar to Figure 7 A schematic cross-sectional view of the display device taken from line C-C'. Apart from the black matrix BM, Figure 9 and Figure 10 Each of the display devices 900 and 1000 is configured with Figures 1 to 6 The display device 100 and Figure 7 and Figure 8 The display device 700 is basically the same as that in the previous version. Therefore, repeated descriptions of the same parts will be omitted.

[0110] Reference Figure 9 and Figure 10 A black matrix BM can be formed by stacking materials of multiple color filters CF. For example, a black matrix BM may include a green layer CFGa formed using the same process as a green color filter CFG, a blue layer CFBa formed using the same process as a blue color filter CFB, and a red layer CFRa formed using the same process as a red color filter CFR.

[0111] A green layer CFGa can be disposed on the third insulating layer 117, a blue layer CFBa can be disposed on the green layer CFGa, and a red layer CFRa can be disposed on the blue layer CFBa. The arrangement order of the green layer CFGa, the blue layer CFBa, and the red layer CFRa can vary according to the formation order of the green color filter CFG, the blue color filter CFB, and the red color filter CFR.

[0112] The green layer CFGa, blue layer CFBa, and red layer CFRa, arranged to overlap each other, function like the black matrix BM. Since green light transmitted through the green layer CFGa is in a different wavelength band than that of the blue and red layers CFBa, it cannot pass through them. Similarly, blue and red light do not pass through layers of different wavelengths. Therefore, during the fabrication of the color filter CF, a portion of the color filter CF is formed together with the region of the black matrix BM to form the black matrix BM.

[0113] For example, refer to Figure 9 The display device 900, in conjunction with Figures 1 to 6 In the same structure as the display device 100, instead of forming the black matrix BM as black material, the materials of the red color filter CFR, green color filter CFG, and blue color filter CFB can be stacked to form the black matrix BM.

[0114] As another example, see Figure 10 The display device 1000, the black matrix BM can be constructed by stacking multiple color filters CF on top of each other. Figure 7 and Figure 8 The display device 700 is formed in the same structure.

[0115] Therefore, in display devices 900 and 1000 according to yet another exemplary embodiment of this disclosure, the black matrix BM can be replaced with a color filter CF to simplify the process of forming the black matrix BM and reduce the manufacturing cost of display devices 900 and 1000. Since a red color filter CFR, a green color filter CFG, and a blue color filter CFB are always provided regardless of the configuration of the light conversion layer QD and the light-emitting elements 120, 720, the black matrix BM formed by stacking multiple color filters CF can be applied to display devices 900 and 1000 with various structures.

[0116] Exemplary embodiments of this disclosure can also be described as follows:

[0117] According to an embodiment of the present disclosure, a display device includes: a substrate defining a plurality of sub-pixels; a plurality of light-emitting elements disposed in each of the plurality of sub-pixels; a black dam disposed at a boundary between the plurality of sub-pixels; a transparent dam disposed on the black dam; and a plurality of light conversion layers disposed on the plurality of light-emitting elements, wherein each of the plurality of light conversion layers is disposed in a space formed by the transparent dam and the black dam.

[0118] According to another aspect of this disclosure, each of the plurality of light conversion layers may be configured to be spaced apart from each other, with a transparent dam and a black dam inserted therebetween.

[0119] According to another aspect of this disclosure, the transparent embankment may have hydrophobic properties.

[0120] According to another aspect of this disclosure, the thickness of the transparent embankment may be equal to or greater than the thickness of the plurality of light conversion layers.

[0121] According to another aspect of this disclosure, the thickness of the transparent embankment and the thickness of the multiple light conversion layers may be greater than the thickness of the black embankment.

[0122] According to another aspect of this disclosure, a portion of the transparent embankment may be disposed on a black embankment at the boundary between multiple sub-pixels, and the remainder of the transparent embankment may cover multiple light-emitting elements in a first group of sub-pixels among the multiple sub-pixels.

[0123] According to another aspect of this disclosure, a plurality of light conversion layers cover the light-emitting elements in a second group of sub-pixels of a plurality of sub-pixels, and each of the second group of sub-pixels can be configured to be spaced apart from each other, and the first group of sub-pixels is interposed therebetween.

[0124] According to another aspect of this disclosure, the plurality of light-emitting elements may be blue light-emitting elements, the first group of sub-pixels may include blue sub-pixels, and the second group of sub-pixels may include red sub-pixels and green sub-pixels.

[0125] According to another aspect of this disclosure, the plurality of light conversion layers may include a red light conversion layer disposed in a red sub-pixel and a green light conversion layer disposed in a green sub-pixel, and a transparent dam may be disposed in a blue sub-pixel and between the red light conversion layer and the green light conversion layer.

[0126] According to another aspect of this disclosure, the plurality of light-emitting elements may include blue light-emitting elements and green light-emitting elements, the first group of sub-pixels may include blue sub-pixels and green sub-pixels, and the second group of sub-pixels may include red sub-pixels.

[0127] According to another aspect of this disclosure, the plurality of light conversion layers may include a red light conversion layer disposed in a red sub-pixel, and the transparent dam may be disposed in a blue sub-pixel and a green sub-pixel.

[0128] According to another aspect of this disclosure, the display device may further include: a plurality of color filters disposed on a plurality of light conversion layers and overlapping each of a plurality of sub-pixels; and a black matrix disposed between the plurality of color filters.

[0129] According to another aspect of this disclosure, the black matrix may be made of a material different from the material of the multiple color filters.

[0130] According to another aspect of this disclosure, the plurality of color filters include a red color filter, a green color filter, and a blue color filter, and the black matrix includes a red layer formed of the same material as the red color filter, a green layer formed of the same material as the green color filter, and a blue layer formed of the same material as the blue color filter, and the black matrix can be formed by stacking the red layer, the green layer, and the blue layer.

[0131] According to another aspect of this disclosure, the transparent embankment can be configured to surround the multiple light conversion layers by directly contacting the side surfaces of the multiple light conversion layers.

[0132] According to another aspect of this disclosure, the top surface of the transparent embankment may be configured to be equal to or higher than the top surface of each of the plurality of light conversion layers.

[0133] According to another aspect of this disclosure, each of the plurality of light conversion layers can be directly disposed on a corresponding one of the plurality of light-emitting elements.

[0134] According to another aspect of this disclosure, the black embankment can be directly disposed on the insulating layer surrounding the sides of the plurality of light-emitting elements.

[0135] While exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be embodied in various forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all embodiments and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be understood to fall within the scope of the present disclosure.

Claims

1. A display device, comprising: A substrate having multiple sub-pixels defined thereon; Multiple light-emitting elements are disposed in each of the multiple sub-pixels; The black embankment is set at the boundary between the plurality of sub-pixels; A transparent embankment is provided on the black embankment; as well as Multiple light conversion layers are disposed on the multiple light-emitting elements. Each of the plurality of light conversion layers is disposed within the space formed by the transparent embankment and the black embankment.

2. The display device according to claim 1, wherein, Each of the plurality of light conversion layers is arranged to be spaced apart from each other, and the transparent dam and the black dam are inserted therebetween.

3. The display device according to claim 1, wherein, The transparent embankment has hydrophobic properties.

4. The display device according to claim 1, wherein, The thickness of the transparent embankment is equal to or greater than the thickness of the plurality of light conversion layers.

5. The display device according to claim 4, wherein, The thickness of the transparent embankment and the thickness of the plurality of light conversion layers are greater than the thickness of the black embankment.

6. The display device according to claim 1, wherein, A portion of the transparent dam is disposed on the black dam at the boundary between the plurality of sub-pixels, and the remainder of the transparent dam covers the light-emitting element in the first group of sub-pixels among the plurality of sub-pixels.

7. The display device according to claim 6, wherein, The plurality of light conversion layers cover the light-emitting elements in the second group of sub-pixels of the plurality of sub-pixels, and the second group of sub-pixels is arranged to be spaced apart from each other, and the first group of sub-pixels is inserted therebetween.

8. The display device according to claim 7, wherein, The plurality of light-emitting elements are blue light-emitting elements. The first group of sub-pixels includes blue sub-pixels, and The second group of sub-pixels includes red sub-pixels and green sub-pixels.

9. The display device according to claim 8, wherein, The plurality of optical conversion layers include: A red light conversion layer is disposed in the red sub-pixel; and A green light conversion layer, which is disposed in the green sub-pixel; and The transparent embankment is disposed in the blue sub-pixel and between the red light conversion layer and the green light conversion layer.

10. The display device according to claim 7, wherein, The plurality of light-emitting elements includes blue light-emitting elements and green light-emitting elements. The first group of sub-pixels includes blue sub-pixels and green sub-pixels, and the second group of sub-pixels includes red sub-pixels.

11. The display device according to claim 10, wherein, The plurality of light conversion layers include a red light conversion layer disposed in the red sub-pixel, and The transparent embankment is disposed in the blue sub-pixel and the green sub-pixel.

12. The display device according to claim 1, wherein, The display device further includes: Multiple color filters are disposed on the multiple light conversion layers and overlap with each of the multiple sub-pixels; and A black matrix is ​​positioned between the plurality of color filters.

13. The display device according to claim 12, wherein, The black matrix is ​​formed of a material different from the material of the plurality of color filters.

14. The display device according to claim 12, wherein, The plurality of color filters includes a red color filter, a green color filter, and a blue color filter, and The black matrix includes: A red layer formed of the same material as the red color filter; A green layer formed of the same material as the green filter; A blue layer formed of the same material as the blue filter, and The black matrix is ​​formed by stacking the red layer, the green layer, and the blue layer.

15. The display device according to claim 4, wherein, The transparent embankment is configured to surround the plurality of light conversion layers and to be in direct contact with the side surfaces of the plurality of light conversion layers.

16. The display device according to claim 4, wherein, The top surface of the transparent embankment is configured to be equal to or higher than the top surface of each of the plurality of light conversion layers.

17. The display device according to claim 1, wherein, Each of the plurality of light conversion layers is directly disposed on a corresponding one of the plurality of light-emitting elements.

18. The display device according to claim 1, wherein, The black embankment is directly disposed on the insulating layer surrounding the sides of the plurality of light-emitting elements.

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