Substrate processing method and substrate processing apparatus

Abstract

In the substrate processing method, the cleaning jig is carried from the cleaning jig housing portion to the substrate mounting portion by the second carrying mechanism (step S11), the substrate is carried from the substrate housing portion to the substrate mounting portion by the first carrying mechanism (step S13), the substrate is laminated to the cleaning jig in the substrate mounting portion, the substrate with the cleaning jig is taken out as a pre-processing substrate (step S15), the pre-processing substrate is carried from the substrate mounting portion to the processing unit by the second carrying mechanism (step S16), and the cleaning processing of the pre-processing substrate is performed in the processing unit (step S17).

Description

Technical Field

[0001] This disclosure relates to a substrate processing method and a substrate processing apparatus. The substrate to be processed includes, for example, substrates for FPD (Flat Panel Display) devices such as semiconductor wafers, liquid crystal display devices and organic EL (Electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, and substrates for solar cells. Background Technology

[0002] In the manufacturing process of semiconductor devices, a substrate processing apparatus is used to process substrates such as semiconductor wafers. Such a substrate processing apparatus, for example as disclosed in Patent Document 1, uses a transfer robot and a main transport robot to transport the substrate housed in a carrier to multiple processing units for surface processing of the substrate.

[0003] Furthermore, regarding the method of transporting the substrate to be processed, as disclosed in Patent Document 1, the disc-shaped substrate is usually transported directly to the processing unit. However, as disclosed in Patent Document 2, there are also cases where the substrate is transported to the processing unit in a state where it is placed on a protective film mounted on the inside of an annular mounting frame (the substrate in this state is referred to as a "framed substrate").

[0004] [Background Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-39827

[0007] [Patent Document 2] Japanese Patent Application Publication No. 2010-137349 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] As mentioned above, there are two main methods for transporting the substrate of the processing unit. For each of these two methods, setting up an individual processing unit or a transport robot will increase the installation space of the device and also increase the manufacturing or operating costs of the substrate processing device.

[0010] The purpose of this disclosure is to achieve miniaturization and cost reduction of the device for both conventional substrate handling and framed substrate handling. In particular, the purpose of this disclosure is to clean conventional substrates using the same equipment as for framed substrates.

[0011] [Technical means to solve the problem]

[0012] To address the aforementioned problem, one aspect of the substrate processing method disclosed herein involves a first conveying mechanism transferring a substrate from a substrate receiving section to a substrate placement section. A second conveying mechanism transfers a cleaning fixture from a cleaning fixture receiving section to the substrate placement section. In the substrate placement section, the substrate is deposited onto the cleaning fixture to obtain a substrate with the cleaning fixture attached as a pre-processing substrate. The second conveying mechanism then transfers the pre-processing substrate from the substrate placement section to a processing unit. In the processing unit, a cleaning process is performed on the pre-processing substrate.

[0013] One aspect of the substrate processing method disclosed herein involves using a substrate with a cleaning fixture attached after cleaning in a processing unit as a processed substrate. A second conveying mechanism transfers the processed substrate from the processing unit to a substrate placement unit. In the substrate placement unit, the processed substrate is separated into a cleaning fixture and a substrate. A first conveying mechanism transfers the substrate from the substrate placement unit to a substrate receiving unit, and a second conveying mechanism transfers the cleaning fixture from the substrate placement unit to a cleaning fixture receiving unit.

[0014] The substrate processing apparatus disclosed herein includes a substrate placement section, a first conveying mechanism, and a second conveying mechanism. The first conveying mechanism conveys a substrate between the substrate receiving section and the substrate placement section. The second conveying mechanism conveys a cleaning fixture between a cleaning fixture receiving section and the substrate placement section. The substrate placement section deposits the substrate onto the cleaning fixture as a pre-processing substrate, and the second conveying mechanism conveys the pre-processing substrate from the substrate placement section to a processing unit for cleaning.

[0015] The substrate processing apparatus disclosed herein includes a substrate placement section, a first conveying mechanism, and a second conveying mechanism. The second conveying mechanism removes a substrate, after cleaning in a processing unit and attaching a cleaning fixture, as a processed substrate from the processing unit. The substrate placement section receives the processed substrate removed by the second conveying mechanism and separates the processed substrate into a cleaning fixture and a substrate. The first conveying mechanism conveys the substrate from the substrate placement section to a substrate receiving section. The second conveying mechanism conveys the cleaning fixture from the substrate placement section to a cleaning fixture receiving section.

[0016] [The effects of the invention]

[0017] According to one aspect of this disclosure, since ordinary substrates can be cleaned with the same equipment as substrates with frames, miniaturization and cost reduction of the device size can be achieved. Attached Figure Description

[0018] Figure 1 This is a top view showing the schematic configuration of the substrate processing apparatus according to the embodiments disclosed herein.

[0019] Figure 2 This is a perspective view showing an example of the configuration of a framed substrate in an embodiment.

[0020] Figure 3 This is a side view showing the schematic configuration of the processing unit of the substrate processing apparatus according to the embodiment.

[0021] Figure 4 This is a schematic side view showing the configuration relationship between the handover unit and the cleaning fixture housing in the implementation method.

[0022] Figure 5 This is a side view showing the configuration of the transfer unit with lifting pin and the cleaning fixture in the embodiment.

[0023] Figure 6 This is a perspective view showing an example of the configuration of a framed substrate receiving portion in an embodiment.

[0024] Figure 7 This is a side view showing an example of the configuration of the framed substrate receiving portion of the embodiment.

[0025] Figure 8 This is a block diagram illustrating an example of the configuration of the control unit in an implementation method.

[0026] Figure 9 This is a flowchart illustrating the processing flow of a substrate with a frame attached by a substrate processing apparatus according to an embodiment.

[0027] Figure 10 This diagram shows the state of a substrate with a frame attached being cleaned by the substrate processing apparatus of the embodiment.

[0028] Figure 11 This is a flowchart illustrating the processing flow until the ordinary substrate is cleaned by the substrate processing apparatus of the embodiment.

[0029] Figure 12 This diagram shows the state of a substrate with a cleaning fixture being cleaned by the substrate processing apparatus of the embodiment.

[0030] Figure 13 This is a flowchart illustrating the processing flow of a normal substrate after cleaning by the substrate processing apparatus of the embodiment. Detailed Implementation

[0031] The following is for reference. Figures 1 to 13 An embodiment of this disclosure will be described.

[0032] [Composition of the substrate processing device]

[0033] First, refer to Figures 1 to 8 The general configuration of the substrate processing apparatus 100 will be described. Figure 1 This is a top view showing the schematic configuration of the substrate processing apparatus 100. (Example) Figure 1 As shown, the substrate processing apparatus 100 includes a transfer unit 1, a processing unit 2, and a control unit 3.

[0034] The substrate processing apparatus 100 is configured to perform various processes on either a general-purpose substrate W1 or a framed substrate W2. The substrate processing apparatus 100 is a monolithic device that processes wafer-sized substrates W1 or framed substrates W2 one by one.

[0035] Here, for reference Figure 2 The structure of the substrate W2 with the frame is described. Figure 2 This is a perspective view showing an example of the configuration of a substrate W2 with a frame attached. For example... Figure 2 As shown, the substrate W2 with the frame is composed of a frame 81, a thin film 82 and a substrate 83.

[0036] The frame 81 is made of a magnetic material such as stainless steel. The frame 81 is a ring-shaped plate component. Figure 2 In the example shown, the inner circumferential surface of frame 81 has a circular shape when viewed from above. The inner diameter of frame 81 is, for example, about 200 mm to 400 mm. The thickness of frame 81 is, for example, about 1 mm to 5 mm.

[0037] A thin film 82 is mounted inside the annular frame 81. The thin film 82 seals the inner opening of the frame 81. The thin film 82 is formed of a stretchable synthetic resin or the like. A substrate 83 is mounted on one side surface 82a of the thin film 82. The substrate 83 is, for example, attached to surface 82a of the thin film 82. The substrate 83 attached to the thin film 82 may also include a chip-shaped substrate.

[0038] [Structure of the transmission section]

[0039] like Figure 1 As shown, the transfer unit 1 includes a transfer robot IR, a first loading port LP1, a second loading port LP2, a third loading port LP3, and a fourth loading port LP4. The transfer robot IR is an example of a first conveying mechanism. The fourth loading port LP4 is an example of a substrate receiving unit.

[0040] The transfer robot IR has the function of transporting both substrate W1 and substrate W2 with a frame. The transfer robot IR has a base part 10 and a pair of hands 11.

[0041] The base portion 10 is fixed to the frame of the substrate processing apparatus 100 (not shown). A pair of hands 11 are components used to horizontally hold either the substrate W1 or the substrate W2 with the frame attached. Each pair of hands 11 has a shape capable of holding both the substrate W1 and the substrate W2 with the frame attached.

[0042] One pair of hands 11 is rotatable about a vertical axis relative to the base 10. Furthermore, the pair of hands 11 can be vertically moved relative to the base 10 by a lifting mechanism (not shown). The movement of each part of the transport robot IR is controlled by the control unit 3.

[0043] The transfer robot IR moves the unprocessed framed substrate W2 from the first loading port LP1, the second loading port LP2 and the third loading port LP3 to the transfer unit PASS, and receives the processed framed substrate W2 from the transfer unit PASS.

[0044] In addition, the transfer robot IR moves the unprocessed substrate W1 from the fourth loading port LP4 to the transfer unit PASS, and receives the processed substrate W1 from the transfer unit PASS. In this way, the transfer robot IR performs the transfer of substrate W1 or substrate W2 with a frame between itself and the central robot CR.

[0045] Alternatively, the transfer robot IR may have, for example, a first hand for holding a common substrate W1 and a second hand for holding a substrate W2 with a frame, instead of a pair of hands 11. In this case, the transfer robot IR can simply switch between using the first hand or the second hand depending on the type of substrate being transferred.

[0046] Loading ports LP1, LP2, and LP3 are carrier ports that hold multiple substrates W2 with frames attached, respectively. Furthermore, loading port LP4 is a carrier port that holds multiple substrates W1, respectively, within a carrier C2.

[0047] Carrier C2 is, for example, a FOUP (Front Opening Unified Pod) that houses a framed substrate W2 in a sealed state. Similarly, carrier C1 is, for example, a FOUP that houses a substrate W1 in a sealed state. Furthermore, carriers C2 and C1 are not limited to FOUPs; they can also be SMIF (Standard Mechanical Interface).

[0048] OC (Open Cassette), etc.

[0049] [Structure of the Processing Department]

[0050] Processing unit 2 includes a transfer unit PASS, a central robot CR, a processing unit U, a tower TW1, and a tower TW2. The central robot CR is an example of the second conveying mechanism.

[0051] (Handover Unit)

[0052] The transfer unit PASS is configured between the transfer robot IR and the central robot CR, and is capable of holding the substrate W1 or the substrate W2 with a frame attached. The transfer unit PASS is an example of a substrate mounting section.

[0053] The handover unit PASS has a first handover unit PASS1 and a second handover unit PASS2. The second handover unit PASS2 is positioned above the first handover unit PASS1 (see reference). Figure 4 The first handover unit PASS1 corresponds to the lower substrate mounting section. The second handover unit PASS2 corresponds to the upper substrate mounting section.

[0054] In the first transfer unit PASS1, the cleaning fixture 90 and the substrate W1 are deposited. Furthermore, in the second transfer unit PASS2, the cleaning fixture 90 and the substrate W1 are separated. Additionally, the internal structure of the first transfer unit PASS1 is the same as the internal structure of the second transfer unit PASS2.

[0055] (Central Robot)

[0056] The central robot CR has a base portion 50 and a pair of hands 51. The base portion 50 is fixed to the frame of the substrate processing apparatus 100 (not shown). The pair of hands 51 are components used to horizontally hold the substrate W1 or the substrate W2 with the frame attached. The pair of hands 51 has a shape capable of holding both the substrate W1, which is stacked in the cleaning fixture 90, and the substrate W2 with the frame attached.

[0057] One pair of hands 51 is rotatable about a vertical axis relative to the base 50. Furthermore, the pair of hands 51 can be vertically raised and lowered relative to the base 50 by a lifting mechanism (not shown). The movement of each part of the central robot CR is controlled by the control unit 3.

[0058] The central robot CR receives an unprocessed substrate W1 or a framed substrate W2 from the transfer unit PASS and transfers it to the processing unit U. Additionally, the central robot CR receives the processed substrate W1 or framed substrate W2 from the processing unit U and transfers it to the transfer unit PASS.

[0059] Two processing units U are positioned across the central robot CR. Each processing unit U performs various treatments, including treatment using processing liquids or gases, treatment using electromagnetic waves such as ultraviolet light, brush cleaning, and nozzle cleaning. The processing unit U is controlled by the control unit 3.

[0060] (tower)

[0061] Towers TW1 and TW2 are configured with a central robot CR between them. Tower TW1 has multiple chambers stacked vertically for housing processing units U. Tower TW2 also has multiple chambers stacked vertically for housing processing units U. Furthermore, the number of towers is not limited to two; for example, it could be four.

[0062] (Structure of the processing unit)

[0063] Next, refer to Figure 3 The processing unit U is described in detail. Figure 3 This is a side view showing the schematic configuration of the processing unit U of the substrate processing apparatus 100.

[0064] like Figure 3 As shown, a box-shaped chamber C is provided in the processing unit U. Inside the chamber C, a space is formed for arranging a framed substrate W2. The processing unit U performs various processes on the framed substrate W2 within the space inside the chamber C. The chamber C is equipped with an openable and closable inlet / outlet (not shown) for loading unprocessed framed substrates W2 and unloading processed framed substrates W2.

[0065] Furthermore, inside chamber C, such as Figure 3 As shown, a substrate holding portion 20 is disposed thereon. The substrate holding portion 20 includes a porous component 21, a base 22, a holding drive portion 24, and a rotation drive portion 25.

[0066] The substrate holding portion 20 holds the frame-attached substrate W2 while rotating the frame-attached substrate W2 about the rotation axis Q. Furthermore, the substrate holding portion 20 holds the frame-attached substrate W2 in a position where the substrate 83 is positioned above the thin film 82. The rotation axis Q is, for example, an axis extending vertically through the center of the circle followed by the inner circumferential surface of the frame 81.

[0067] The porous component 21 is a component used to adsorb the thin film 82 of the substrate W2 with the frame attached. The porous component 21 is porous and is formed, for example, from a ceramic such as alumina.

[0068] The base 22 has a support member 221 and a base plate 222. The support member 221 is a component that supports the frame 81 of the substrate W2 with the frame attached. The support member 221 has, for example, an annular shape when viewed from above, and is arranged to surround the porous member 21. The frame 81 is mounted on the upper surface of the support member 221. The porous member 21 is detachably fixed to the support member 221.

[0069] The suction unit 26 applies a negative pressure to the porous component 21 and the pore H. The porous component 21 is porous. Therefore, when a negative pressure is generated in the pore H, gas flows from the adsorption surface 23 of the porous component 21 through the interior of the porous component 21 into the pore H. As a result, the thin film 82 is adsorbed and held on the adsorption surface 23 of the porous component 21.

[0070] The holding drive unit 24 has a magnet 241 and a magnet movement drive unit 242. The holding drive unit 24 presses and holds the frame 81 against the support member 221 by applying the magnetic force of the magnet 241 to the magnetic frame 81. In addition, the support member 221 is formed of a non-magnetic material such as alumina, so the magnetic force of the magnet 241 does not act on the support member 221.

[0071] The holding drive unit 24 is controlled by the control unit 3 to adjust the magnetic attraction force acting between the frame 81 and the magnet 241. Specifically, the holding drive unit 24 switches between a holding state in which the frame 81 is held by the magnetic attraction force supporting the member 221, and a holding release state in which the magnetic attraction force of the frame 81 is reduced or disappears, releasing the holding of the frame 81 by pressing.

[0072] The magnet movement drive unit 242 moves the magnet 241 between a holding position and a holding release position. The holding position is where the magnetic attraction force from the magnet 241 is fully applied to the frame 81. The holding release position is where the magnetic attraction force from the magnet 241 is not substantially applied to the frame 81.

[0073] The rotary drive unit 25 is equipped with an electric motor as a drive source. The control unit 3 controls the electric motor of the rotary drive unit 25 to cause the porous component 21 and the base 22 to rotate as a whole around the rotation axis Q. As the porous component 21 and the base 22 rotate around the rotation axis Q, the substrate W2 with the frame also rotates around the rotation axis Q. In addition, the drive unit 24 and the rotary drive unit 25 are protected by the drive housing member 27 from the influence of the processing liquid.

[0074] The suction unit 26 comprises a suction tube (not shown), a suction valve, and a suction drive unit. The suction drive unit is controlled by the control unit 3. The upstream end of the suction tube of the suction unit 26 is connected to the gap H. The downstream end of the suction tube is connected to the suction drive unit.

[0075] The suction drive unit, for example, is a pump, which draws gas from the void H through a suction pipe. A suction valve is inserted into the suction pipe to switch the opening and closing of the suction pipe. The suction valve and the suction drive unit are controlled by the control unit 3. After the control unit 3 opens the suction valve, it actuates the suction drive unit. As a result, a negative pressure is generated in the void H, which adsorbs and holds the thin film 82 in the porous component 21.

[0076] Furthermore, a spraying section 60 is provided in the processing unit U. The spraying section 60 includes a nozzle 61, a supply pipe 62, a supply valve 63, and a flow adjustment valve 64. The nozzle 61 is located in the chamber C, positioned above the substrate W2 with a frame held by the substrate holding section 20. The nozzle 61 sprays processing liquid onto the upper surface of the substrate W2 with the frame.

[0077] The nozzle 61 is connected to the downstream end of the supply pipe 62. The upstream end of the supply pipe 62 is connected to a processing fluid supply source. The processing fluid supply source has a tank for storing processing fluid and supplies the processing fluid to the upstream end of the supply pipe 62. A supply valve 63 and a flow regulating valve 64 are provided on the supply pipe 62. The supply valve 63 switches the opening and closing of the supply pipe 62, and the flow regulating valve 64 adjusts the flow rate of the processing fluid flowing through the supply pipe 62. The supply valve 63 and the flow regulating valve 64 are controlled by the control unit 3.

[0078] If, with nozzle 61 in the processing position, processing liquid is sprayed onto the rotating framed substrate W2, the processing liquid adheres to the framed substrate W2. The processing liquid, subjected to centrifugal force due to the rotation of the framed substrate W2, flows radially outward, scattering from the periphery of the framed substrate W2 to the outside. At this time, by acting on the framed substrate W2 with the processing liquid, the framed substrate W2 is processed according to the type of processing liquid. For example, if the processing liquid is a cleaning solution, substrate 83 is cleaned.

[0079] Furthermore, a protection section 70 is provided in the processing unit U. The protection section 70 is capable of catching various processing liquids that splash from the periphery of the substrate W2 with the frame attached.

[0080] (Cleaning Fixture Storage Department)

[0081] Within the PASS handover unit, there is a cleaning fixture housing 9 for accommodating the cleaning fixture 90. Here, Figure 4 This is a schematic side view showing the configuration relationship of the first handover unit PASS1, the second handover unit PASS2, and the cleaning fixture housing 9.

[0082] like Figure 4 As shown, the cleaning fixture housing 9 is located between the transfer robot IR and the central robot CR, positioned above the first transfer unit PASS1 and the second transfer unit PASS2. This prevents processing liquids or the like from seeping into the cleaning fixture housing 9 from the processed substrate W1 or the framed substrate W2 that has been transferred to the second transfer unit PASS2.

[0083] Here, Figure 5 This is a side view showing the configuration of the cleaning fixture 90. (Example) Figure 5As shown, an opening 91 is formed in the cleaning fixture 90. Through the opening 91, multiple lifting pins L equipped in the transfer unit PASS are raised and lowered by a motor.

[0084] At the first height position H1, multiple lifting pins L receive the substrate W1, which is being transported from the fourth loading port LP4 by the transfer robot IR, in a horizontal position. When the multiple lifting pins L descend to the second height position H2, the substrate W1 is deposited on the cleaning fixture 90.

[0085] (Substrate housing with frame)

[0086] Figure 6 This is a three-dimensional view showing the structure of the substrate housing ST with a frame attached. Figure 7 This is a side view showing the configuration of the substrate housing ST with its frame attached. (Example) Figure 6 and Figure 7 As shown, inside the substrate receiving section ST with a frame, there is a frame section R that arranges and mounts multiple framed substrates W2 in the vertical direction.

[0087] The framed substrate receiving section ST has multiple partitions P that separate multiple framed substrates W2. The multiple partitions P separate multiple processed framed substrates W2 arranged vertically on the frame section R.

[0088] The framed substrate receiving section ST is positioned to the side of the transfer unit PASS. This allows the framed substrate W2 to be smoothly transferred between the framed substrate receiving section ST and the transfer unit PASS.

[0089] [Structure of the Control Unit]

[0090] Next, also refer to Figure 8 The structure of control unit 3 will be explained. Figure 8 This is a block diagram illustrating an example of the configuration of control unit 3. For example... Figure 8 As shown, the control unit 3 includes a CPU (Central Processing Unit) 31, a ROM (Read-Only Memory) 32, a RAM (Random Access Memory) 33, and a memory 34. These CPU 31, ROM 32, RAM 33, and memory 34 are electrically connected to each other via a bus.

[0091] CPU 31 controls the operation of transmission unit 1 and processing unit 2 by executing the program stored in ROM 32. RAM 33 functions as a temporary storage unit for various data when controlled by CPU 31. Various data are stored in memory 34.

[0092] [The processing of a substrate with a frame by a substrate processing apparatus]

[0093] Next, refer to Figure 9 and Figure 10 The processing procedure for the substrate W2 with a frame attached by the substrate processing apparatus 100 is described. Figure 9 This is a flowchart illustrating the processing flow of the substrate processing apparatus 100 on the substrate W2 with a frame attached. Figure 10 This diagram shows the state of the substrate W2 with the frame attached during the cleaning process.

[0094] Figure 9 In the flowchart shown, the control unit 3 of the substrate processing apparatus 100 uses a transfer robot IR to move the framed substrate W2 before processing from any one of the first loading ports LP1 to the third loading port LP3 to the first transfer unit PASS1 (step S1). The framed substrate W2 before processing is equivalent to the second pre-processing substrate.

[0095] After step S1, the control unit 3 uses the central robot CR to move the substrate W2 with the frame attached before processing from the first transfer unit PASS1 to the processing unit U (step S2).

[0096] Alternatively, the control unit 3 can also use the transfer robot IR to move the pre-processed substrate W2 with a frame from any one of the first loading port LP1 to the third loading port LP3 to the second transfer unit PASS2, and use the central robot CR to move the pre-processed substrate W2 with a frame from the second transfer unit PASS2 to the processing unit U.

[0097] After step S2, the control unit 3 performs a cleaning process on the framed substrate W2 before processing in the processing unit U (step S3). The framed substrate W2 after processing is equivalent to the substrate after the second processing.

[0098] In step S3, the control unit 3 controls the holding drive unit 24, such as... Figure 10 As indicated by arrow M1, the magnetic attraction force acting between frame 81 and magnet 241 is adjusted. Furthermore, control unit 3 controls suction unit 26, as... Figure 10 As indicated by arrow M2, gas is drawn from the adsorption surface 23 through the porous component 21 and the pores H. Thus, the thin film 82 is adsorbed and held on the adsorption surface 23 of the porous component 21.

[0099] Furthermore, the control unit 3 controls the rotation drive unit 25 to rotate the framed substrate W2, held by the substrate holding unit 20, around the rotation axis Q. The processing unit U cleans the framed substrate W2 by spraying processing liquid from the nozzle 61 onto the rotating framed substrate W2. Afterward, the control unit 3 dries the framed substrate W2, for example, by rotating it.

[0100] After step S3, the control unit 3 uses the central robot CR to move the processed substrate W2 with the frame from the processing unit U to the second transfer unit PASS2 (step S4). Alternatively, the control unit 3 can also use the central robot CR to move the processed substrate W2 with the frame to the first transfer unit PASS1.

[0101] After step S4, the control unit 3 uses the transfer robot IR to move the processed framed substrate W2 from the second transfer unit PASS2 to the framed substrate receiving unit ST (step S5). The processed framed substrate W2 is stored in the framed substrate receiving unit ST for a specified period. In this way, by storing the processed framed substrate W2 in the framed substrate receiving unit ST for a specified period, that is, from the time it is moved to the framed substrate receiving unit ST until it is moved to any one of the first loading port LP1 to the third loading port LP3, processing blockage within the substrate processing apparatus 100 can be prevented.

[0102] After step S5, the control unit 3 uses the transfer robot IR to move the processed substrate W2 with the frame from the substrate receiving unit ST with the frame to any one of the first loading port LP1 to the third loading port LP3 (step S6). As described above, the control unit 3 ends the processing of the substrate W2 with the frame.

[0103] Furthermore, in step S5, the transfer robot IR moves the processed, framed substrate W2 to the position of the framed substrate receiving section ST, which is the same height as in step S6, where the transfer robot IR moves the processed, framed substrate W2 into any one of the first loading port LP1 to the third loading port LP3. This ensures the smooth transfer of the processed, framed substrate W2.

[0104] Furthermore, the carrier used to house the framed substrate W2 before processing is preferred, and is different from the carrier used to house the framed substrate W2 after it has been transported and processed in step S6. This allows the processed framed substrate W2 to be housed in a clean carrier, while also suppressing a decrease in yield in the substrate processing apparatus 100.

[0105] [Processing of ordinary substrates by substrate processing equipment]

[0106] Next, refer to Figures 11-13 The cleaning process of the substrate processing apparatus 100 for ordinary substrate W1 is described. Figure 11 This is a flowchart illustrating the processing flow up to the point where the ordinary substrate W1 is cleaned by the substrate processing apparatus 100. Figure 12 This diagram shows the state of a substrate with a cleaning fixture being cleaned by the substrate processing apparatus 100.

[0107] Figure 11 In the flowchart shown, the control unit 3 controls the central robot CR, as follows: Figure 4 As indicated by arrow A11, the cleaning fixture 90 is moved from the cleaning fixture receiving section 9 to the first handover unit PASS1 (step S11).

[0108] After step S11, the control unit 3 drives the lifting pin L through the opening 91 of the cleaning fixture 90 to the first height position H1 by driving the motor (not shown) (step S12).

[0109] After step S12, the control unit 3 transmits the data to the robot IR, such as... Figure 4 As indicated by arrow A13, the substrate W1 is moved from the fourth loading port LP4 to the first transfer unit PASS1 (step S13).

[0110] In step S13, the transfer robot IR moves the substrate W1 housed in the fourth loading port LP4 above the lifting pins L and above the cleaning fixture 90, so that the substrate W1 abuts against the upper part of the lifting pins L. Multiple lifting pins L receive the substrate W1 at the first height position H1.

[0111] After step S13, the control unit 3 drives the motor to lower the lifting pin L from the third height position to the second height position H2 (step S14). In step S14, when lowering the lifting pin L from the first height position H1 to the second height position H2, the control unit 3 controls the motor to gradually slow down the descent speed of the lifting pin L. Therefore, when depositing the substrate W1 in the cleaning fixture 90, it is possible to suppress the displacement of the substrate W1's mounting position.

[0112] Specifically, when the lifting pin L descends from the third height position H3 to the second height position H2, the control unit 3 controls the descent speed of the lifting pin L to be slower in stages. Here, the third height position H3 is the height position between the first height position H1 and the second height position H2. In addition, the height between the first height position H1 and the second height position H2 is preferably set according to the thickness of the frame 81 or the deflection of the substrate W1.

[0113] After step S14, the control unit 3 drives the motor to lower the lifting pin L to a position below the cleaning fixture 90 (step S15), and obtains the substrate with the cleaning fixture attached to the substrate W1 deposited on the cleaning fixture 90 as the substrate before processing.

[0114] After step S15, control unit 3, through the central robot CR, such as... Figure 4 As shown by arrow A16, the substrate W1, which is in the state of being deposited in the cleaning fixture 90, i.e. the substrate before processing, is transferred from the first transfer unit PASS1 to the processing unit U (step S16).

[0115] After step S16, the control unit 3 performs a cleaning process on the substrate W1 in the cleaning fixture 90 state in the processing unit U (step S17).

[0116] In step S17, the control unit 3 controls the holding drive unit 24, such as... Figure 12 As indicated by arrow M1, the magnetic suction force acting between the cleaning fixture 90 and the magnet 241 is adjusted. Furthermore, the control unit 3 controls the suction unit 26, such as... Figure 12 As indicated by arrow M2, gas is drawn in through the porous component 21 and the pores H. Thus, the cleaning fixture 90 and the substrate W1 are adsorbed and held in the porous component 21.

[0117] Next, the control unit 3 controls the rotation drive unit 25 to rotate the substrate W1 held in the substrate holding unit 20 around the rotation axis Q. Furthermore, the substrate holding unit 20 and... Figure 3 Similarly, it is configured with a porous component 21, a base 22, a holding drive part 24, and a rotation drive part 25.

[0118] Furthermore, the processing unit U cleans the substrate W1 by spraying processing liquid from the nozzle 61 onto the rotating substrate W1. Afterward, the control unit 3 dries the substrate W1, for example, by rotating it.

[0119] Next, refer to Figure 13 This describes the processing flow of the ordinary substrate W1 after it has been cleaned by the substrate processing device 100. Figure 13 This is a flowchart illustrating the processing flow of a normal substrate W1 after it has been cleaned by the substrate processing apparatus 100.

[0120] Figure 13 In the flowchart shown, the control unit 3 uses the substrate W1, which has been cleaned in the processing unit U and has a cleaning fixture attached, as the processed substrate, and then uses the central robot CR to... Figure 4 As indicated by arrow A18, the data is transferred from processing unit U to the second handover unit PASS2 (step S18).

[0121] After step S18, the control unit 3 drives the motor to raise the lifting pin L to a first height position H1 above the second height position H2 through the opening 91 of the cleaning fixture 90 while it is in contact with the substrate W1, thus separating the substrate W1 from the cleaning fixture 90 (step S19).

[0122] In step S19, when the control unit 3 raises the lifting pin L to the first height position H1 relative to the processing unit U after cleaning the substrate, the rising speed of the lifting pin L is gradually reduced. This allows the substrate W1 to be placed on the lifting pin L without shifting.

[0123] After step S19, the control unit 3 transmits the data to the robot IR, such as... Figure 4 As indicated by arrow A20, the substrate W1 is moved from the second transfer unit PASS2 to the fourth loading port LP4 (step S20).

[0124] After step S20, the control unit 3 drives the motor to lower the lifting pin L to a position below the cleaning fixture 90 (step S21). In this way, by raising and lowering the lifting pin L, the cleaning fixture 90 can be quickly separated from the substrate W1 in the second transfer unit PASS2.

[0125] After step S21, the control unit 3, through the central robot CR, such as... Figure 4 As indicated by arrow A22, the cleaning fixture 90 is transferred from the second transfer unit PASS2 to the cleaning fixture receiving unit 9 (step S22). As described above, the control unit 3 ends the processing of the ordinary substrate W1.

[0126] [Effects of the Implementation Method]

[0127] In the substrate processing apparatus 100 of this embodiment described above, when cleaning a general substrate W1, the control unit 3 transfers the cleaning fixture 90 from the cleaning fixture receiving unit 9 to the first transfer unit PASS1 via the central robot CR (step S11). The substrate W1 is then transferred from the fourth loading port LP4 to the first transfer unit PASS1 via the transfer robot IR (step S13). In the first transfer unit PASS1, the substrate W1 is deposited onto the cleaning fixture 90, and the substrate with the cleaning fixture attached is used as the pre-processing substrate. Afterwards, the control unit 3 transfers the pre-processing substrate from the first transfer unit PASS1 to the processing unit U via the central robot CR. In the processing unit U, the pre-processing substrate is cleaned (step S17).

[0128] On the other hand, when cleaning the substrate W2 with the frame attached, the control unit 3, without using the cleaning fixture 90, moves the substrate W2 with the frame attached before processing from the first transfer unit PASS1 to the processing unit U via the central robot CR (step S2), and then performs the cleaning process on the substrate W2 with the frame attached before processing in the processing unit U (step S3).

[0129] Thus, when cleaning a standard substrate W1, the substrate W1 is deposited on the cleaning fixture 90, and the substrate with the cleaning fixture attached is transported to the processing unit U as a pre-processing substrate. This allows for the same transport method as when cleaning a substrate W2 with a frame. Therefore, the standard substrate W1 can be cleaned using the same equipment as the substrate W2 with a frame, thus enabling miniaturization and cost reduction of the substrate processing apparatus 100.

[0130] Furthermore, the control unit 3 uses a transfer robot IR to move the processed framed substrate W2 from the second transfer unit PASS2 to the framed substrate storage unit ST (step S5). After storing the processed framed substrate W2 in the framed substrate storage unit ST for a specified period, the transfer robot IR moves the processed framed substrate W2 from the framed substrate storage unit ST to any one of the first loading port LP1 to the third loading port LP3 (step S6). Thus, the process of moving the framed substrate W2 to the framed substrate storage unit ST after cleaning can be effectively performed while ensuring the cleanliness of the cleaned framed substrate W2.

[0131] Furthermore, after the control unit 3 moves the cleaning fixture 90 from the cleaning fixture receiving unit 9 to the first transfer unit PASS1 (step S11), it raises the lifting pin L to the first height position H1 (step S12). Then, the control unit 3 moves the substrate W1 from the fourth loading port LP4 to the first transfer unit PASS1 (step S13), places the substrate W1 on the lifting pin L, and lowers the lifting pin L to the second height position H2 (step S14), thereby obtaining the substrate with the cleaning fixture attached. In this way, by operating the lifting pin L, the substrate with the cleaning fixture attached can be prepared efficiently in the first transfer unit PASS1. Moreover, in steps S13 to S15, when the lifting pin L descends from the first height position H1 to the second height position H2, the control unit 3 controls the descent speed of the lifting pin L to be slower in stages by controlling the motor. Therefore, it is possible to suppress the positional shift of the cleaning fixture 90 required when cleaning a normal substrate W1 with the same equipment as the framed substrate W2 when it is being cleaned on the substrate W1.

[0132] Furthermore, the control unit 3 uses the transfer robot IR to move the substrate W1 from the second transfer unit PASS2 to the fourth loading port LP4 (step S20), and the central robot CR moves the cleaning fixture 90 from the second transfer unit PASS2 to the cleaning fixture receiving unit 9 (step S22). Thus, by using different transport mechanisms, the substrate with the cleaning fixture attached, after being cleaned in the processing unit U, is separated into the cleaning fixture 90 and the substrate W1, enabling rapid separation of the substrate with the cleaning fixture attached.

[0133] Furthermore, in the substrate processing apparatus 100, the cleaning fixture 90 and the substrate W1 are deposited in the first transfer unit PASS1, and the cleaning fixture 90 and the substrate W1 are separated in the second transfer unit PASS2. Thus, by performing the deposition and separation of the cleaning fixture 90 and the substrate W1 in different locations, the processing speed of the substrate processing apparatus 100 can be improved.

[0134] Furthermore, the framed substrate receiving section ST is separated by multiple partitions P in the vertical direction. Therefore, it is possible to prevent residual processing liquid or the like from the processed framed substrate W2 placed in the upper receiving space from seeping into the lower receiving space and contaminating the processed framed substrate W2 placed in the lower receiving space.

[0135] [Other Implementation Methods]

[0136] In the embodiment described, the substrate processing apparatus 100 is provided with two processing units U, but it is not limited to this; for example, four units may also be provided. Furthermore, the processing units U may also be arranged in two layers in the vertical direction.

[0137] Alternatively, a camera unit can be set up near the second handover unit PASS2 to photograph the processed framed substrate W2 or substrate W1 that has been transferred to the second handover unit PASS2. By photographing the framed substrate W2 or substrate W1 after step S4 or step S18 by the camera unit, it is possible to confirm whether the chip is properly configured and whether the cleaning process has been performed appropriately in the processed framed substrate W2 or substrate W1.

[0138] 〔Summarize〕

[0139] The substrate processing method disclosed herein involves a first conveying mechanism transferring a substrate from a substrate receiving section to a substrate placement section. A second conveying mechanism transfers a cleaning fixture from a cleaning fixture receiving section to the substrate placement section. In the substrate placement section, the substrate is deposited onto the cleaning fixture to obtain a substrate with the cleaning fixture attached as a pre-processing substrate. The second conveying mechanism then transfers the pre-processing substrate from the substrate placement section to a processing unit. In the processing unit, a cleaning process is performed on the pre-processing substrate.

[0140] Furthermore, in one aspect of the substrate processing method disclosed herein, after the cleaning fixture is transferred from the cleaning fixture receiving section to the substrate placement section, a lifting pin disposed within the substrate placement section is raised. Then, the substrate is transferred from the substrate receiving section to the substrate placement section and placed on the lifting pin. Subsequently, by lowering the lifting pin, the substrate is deposited on the cleaning fixture to obtain the substrate before processing.

[0141] One aspect of the substrate processing method disclosed herein involves using a substrate with a cleaning fixture attached after cleaning in a processing unit as a processed substrate. A second conveying mechanism transfers the processed substrate from the processing unit to a substrate placement unit. In the substrate placement unit, the processed substrate is separated into a cleaning fixture and a substrate. A first conveying mechanism transfers the substrate from the substrate placement unit to a substrate receiving unit, and a second conveying mechanism transfers the cleaning fixture from the substrate placement unit to a cleaning fixture receiving unit.

[0142] Furthermore, in one aspect of the substrate processing method disclosed herein, after the processed substrate is transferred from the processing unit to the substrate mounting section, a lifting pin disposed within the substrate mounting section is raised while abutting against the substrate, thereby separating the substrate from the cleaning fixture. Then, the substrate is transferred from the substrate mounting section to the substrate receiving section. Next, the lifting pin is lowered to a position below the cleaning fixture. Finally, the cleaning fixture is transferred from the substrate mounting section to the cleaning fixture receiving section.

[0143] Furthermore, in one aspect of the substrate processing method disclosed herein, the cleaning fixture has an opening, through which the lifting pin moves up and down.

[0144] The substrate processing apparatus disclosed herein includes a substrate placement section, a first conveying mechanism, and a second conveying mechanism. The first conveying mechanism conveys a substrate between the substrate receiving section and the substrate placement section. The second conveying mechanism conveys a cleaning fixture between a cleaning fixture receiving section and the substrate placement section. The substrate placement section deposits the substrate onto the cleaning fixture as a pre-processing substrate, and the second conveying mechanism conveys the pre-processing substrate from the substrate placement section to a processing unit for cleaning.

[0145] The substrate processing apparatus disclosed herein includes a substrate placement section, a first conveying mechanism, and a second conveying mechanism. The second conveying mechanism removes a substrate, after cleaning in a processing unit and attaching a cleaning fixture, as a processed substrate from the processing unit. The substrate placement section receives the processed substrate removed by the second conveying mechanism and separates the processed substrate into a cleaning fixture and a substrate. The first conveying mechanism conveys the substrate from the substrate placement section to a substrate receiving section. The second conveying mechanism conveys the cleaning fixture from the substrate placement section to a cleaning fixture receiving section.

[0146] Furthermore, in one aspect of the substrate processing apparatus disclosed herein, the substrate mounting portion includes a lower substrate mounting portion and an upper substrate mounting portion disposed above it. In the lower substrate mounting portion, the cleaning fixture and the substrate are laminated, and in the upper substrate mounting portion, the cleaning fixture and the substrate are separated.

[0147] Furthermore, in one aspect of the substrate processing apparatus disclosed herein, the cleaning fixture receiving portion is disposed above the substrate placement portion.

[0148] Furthermore, in one aspect of the substrate processing apparatus disclosed herein, the first conveying mechanism also transfers a framed substrate before processing, as a second pre-processing substrate, from the framed substrate receiving section to the substrate placement section. The second conveying mechanism also transfers the second pre-processing substrate from the substrate placement section to the processing unit. The processing unit further performs a cleaning process on the second pre-processing substrate, obtaining a second post-processing substrate.

[0149] This disclosure is not limited to the described embodiments. Various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical methods disclosed in different embodiments are also included within the technical scope of this invention.

[0150] [Symbol Explanation]

[0151] 1. Transmission Department

[0152] 2 Processing Department

[0153] 3. Control Department

[0154] 90 Cleaning fixtures

[0155] 91 Opening

[0156] 100 Substrate Processing Apparatus

[0157] L boost sales

[0158] U Processing Unit

[0159] W1 substrate

[0160] W2 Framed substrate

[0161] IR transfer robot (first conveyor mechanism)

[0162] CR Center Robot (Second Transfer Mechanism)

[0163] LP1 Loading Port 1

[0164] LP2 Loading Port 2

[0165] LP3 Loading Port 3

[0166] LP4 Loading Port 4 (Substrate Reception Section)

[0167] PASS Transfer Unit (Substrate Placement Section)

[0168] PASS1 First handover unit (lower substrate mounting section)

[0169] PASS2 Second handover unit (upper substrate mounting section)

[0170] ST is a substrate housing with a frame.

Claims

1. A substrate processing method, wherein a first conveying mechanism conveys a substrate from a substrate receiving section to a substrate mounting section. The second conveying mechanism transfers the cleaning fixture from the cleaning fixture receiving section to the substrate placement section. In the substrate mounting section, the substrate is deposited on the cleaning fixture, and the substrate attached to the cleaning fixture is obtained as the substrate before processing. The second conveying mechanism transports the pre-processing substrate from the substrate mounting section to the processing unit. In the processing unit, the substrate is cleaned before processing.

2. The substrate processing method according to claim 1, wherein after the cleaning fixture is transferred from the cleaning fixture receiving part to the substrate mounting part, the lifting pin disposed in the substrate mounting part is raised. Next, the substrate is transferred from the substrate receiving section to the substrate mounting section, and the substrate is placed on the lifting pin. Then, by lowering the lifting pin, the substrate is deposited on the cleaning fixture to obtain the substrate before processing.

3. A substrate processing method, wherein a substrate with a cleaning fixture attached after cleaning in a processing unit is used as a processed substrate and is transferred from the processing unit to a substrate placement unit by a second conveying mechanism. In the substrate placement section, the processed substrate is separated into a cleaning fixture and a substrate. The substrate is transferred from the substrate mounting section to the substrate receiving section by the first conveying mechanism. The second conveying mechanism moves the cleaning fixture from the substrate placement section to the cleaning fixture receiving section.

4. The substrate processing method according to claim 3, wherein after the processed substrate is transferred from the processing unit to the substrate mounting portion, a lifting pin disposed in the substrate mounting portion rises while abutting against the substrate, thereby separating the substrate from the cleaning fixture. Then, the substrate is transferred from the substrate mounting section to the substrate receiving section. Then, the lifting pin is lowered to a position lower than the cleaning fixture. Then, the cleaning fixture is transferred from the substrate placement section to the cleaning fixture receiving section.

5. The substrate processing method according to claim 2 or 4, wherein the cleaning fixture has an opening. The lifting pin moves up and down through the opening.

6. A substrate processing apparatus comprising a substrate mounting section, a first conveying mechanism, and a second conveying mechanism. The first conveying mechanism conveys the substrate between the substrate receiving portion and the substrate mounting portion. The second conveying mechanism conveys the cleaning fixture between the cleaning fixture receiving section and the substrate placement section. The substrate mounting portion allows the substrate to be deposited in the cleaning fixture as a pre-processing substrate. The second conveying mechanism transports the substrate before processing from the substrate placement section to the cleaning processing unit.

7. The substrate processing apparatus according to claim 6, wherein the first conveying mechanism also conveys a framed substrate before processing as a second pre-processing substrate from the framed substrate receiving section to the substrate placement section. The second conveying mechanism also transports the second pre-processing substrate from the substrate placement section to the processing unit. The processing unit also performs a cleaning process on the substrate before the second processing, which serves as the substrate after the second processing.

8. A substrate processing apparatus comprising: Substrate placement section, first conveying mechanism, and second conveying mechanism. The second conveying mechanism takes the substrate with the cleaning fixture attached, which has been cleaned in the processing unit, as the processed substrate and removes it from the processing unit. The substrate placement unit receives the processed substrate transported out by the second conveying mechanism and separates the processed substrate into a cleaning fixture and a substrate. The first conveying mechanism moves the substrate from the substrate mounting section to the substrate receiving section. The second conveying mechanism moves the cleaning fixture from the substrate placement section to the cleaning fixture receiving section.

9. The substrate processing apparatus according to claim 6 or 8, wherein the substrate mounting portion comprises a lower substrate mounting portion and an upper substrate mounting portion disposed thereon. In the lower substrate mounting section, the cleaning fixture and the substrate are laminated. In the upper substrate placement section, the cleaning fixture is separated from the substrate.

10. The substrate processing apparatus according to claim 6 or 8, wherein the cleaning fixture receiving portion is disposed above the substrate placement portion.

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