A wafer pretreatment device for integrated circuit production and processing

Abstract

The application relates to a wafer pretreatment device for integrated circuit production and processing and relates to the technical field of wafer pretreatment. The device comprises a main body, a rinsing tank arranged in the main body, a shaking assembly arranged at the top of a fixing base, a rotating assembly arranged at one side of the base, a plurality of rollers arranged at equal angles between the fixing ring and the base, and a fixing assembly arranged at one side of the rollers. The supporting contact points continuously and dynamically move along the wafer edge without fixed stopping positions. The top surface of the gear ring is symmetrically fixed with a lifting platform. The rollers alternately pass through the top surface of the lifting platform and the top surface of the gear ring with the rotation of the gear ring, drive the lifting column to make interval lifting movement, further drive the lock catch to periodically open and close around the hinge point, realize intermittent locking and unlocking of the wafer, and the symmetrically distributed lock catches alternately open and close. At least one group of supporting structures keeps effective contact with the wafer at any time, ensures that the wafer is always in the effective limiting state during the whole cleaning process, and cannot be tilted due to the unlocking of the support.

Description

Technical Field

[0001] This invention relates to the field of wafer preprocessing technology, specifically to a wafer preprocessing apparatus for integrated circuit manufacturing. Background Technology

[0002] The wafer pretreatment equipment used in integrated circuit production is a core process equipment that connects wafer forming and front-end manufacturing. Its core function is to eliminate contaminants such as particles, organic matter, metal ions, and native oxide layers on the wafer surface, and to regulate the surface energy and chemical state to provide a substrate that meets the cleanliness requirements for subsequent processes such as photolithography, oxidation, and thin film deposition. After treatment, the wafer enters the overflow rinsing tank, where high-purity deionized water is continuously overflowed and refreshed, combined with spray rinsing to remove residual alkaline cleaning solution from the surface, ensuring that all chemical reagent residues are completely removed.

[0003] However, in existing integrated circuit manufacturing wafer cleaning processes, batches of wafers are vertically and densely inserted. During immersion in the cleaning solution, air is easily trapped between wafers, forming trapped bubbles. In particular, bubbles in the central area of ​​the wafer are difficult to expel. The areas blocked by bubbles do not have sufficient contact with the cleaning solution, and the chemical reaction and megasonic effect are easily ineffective, forming a sheet-like cleaning blind zone. In tank cleaning, the wafers are vertically inserted into the wafer boat slots, and the support clips are in close contact with the edge sidewalls of the wafers. This cleaning blind zone is not easy to solve by extending the cleaning time or increasing the concentration of the cleaning solution. It is also the core cause of wafer edge particle residue and edge corrosion defects, making it difficult to achieve effective cleaning.

[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on existing wafer preprocessing equipment used in integrated circuit manufacturing. Summary of the Invention

[0005] The present invention addresses the problem that existing technical solutions are too simplistic by providing a solution that is significantly different from existing technologies. Specifically, the purpose of the present invention is to provide a wafer preprocessing apparatus for integrated circuit manufacturing, thereby solving the problems mentioned in the background.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer pretreatment device for integrated circuit manufacturing, comprising a main body, a rinsing tank disposed within the main body, nozzles symmetrically fixed to the inner wall of the rinsing tank, a placement frame slidably connected within the nozzles, a filter plate fixed within the rinsing tank, a fixed base fixed to the top of the filter plate, a shaking component disposed on the top of the fixed base, and the shaking component driving the placement frame to periodically shake within the rinsing tank, a plurality of fixed rings equally spaced fixed to the top of the placement frame, a plurality of bases equally spaced fixed to the top of the placement frame, a rotating component disposed on one side of the bases, a plurality of rollers disposed at equal angles between the fixed rings and the bases, and the rotating component driving the rollers to periodically lift and lower, a fixing component disposed on one side of the rollers, a connecting seat slidably connected to one side of the fixing component, and the fixing component fixing the position of the wafer.

[0007] Preferably, the connecting seat is fixedly connected to the fixing ring, the placement frame and the fixing seat are slidably connected, and the placement frame is slidably connected to the main worktable.

[0008] Preferably, the shaking assembly includes a rotating shaft passing through the fixed base, a motor fixed to one end of the rotating shaft, a movable ring slidably connected to the outer wall of the rotating shaft, a push plate rotatably connected to a protrusion on one side of the movable ring, a rotating ring rotatably connected to the push plate, a fixing member slidably connected to the rotating ring, and the fixing member being fixedly connected to the placement frame.

[0009] Preferably, the rotating ring has an "I" shaped cross section and is composed of two circular plates and a cylinder. The rotating shaft passes through the rotating ring, and a connecting shaft is rotatably connected inside the rotating ring.

[0010] Preferably, the rotating shaft is rotatably connected to the rotating ring via a connecting shaft, and the rotating shaft has a cavity that cooperates with the movement of the rotating ring.

[0011] Preferably, an electric push rod is fixed between the movable ring and the fixed seat protrusion, and a cavity is formed between the two circular plates of the rotating ring to accommodate the movement of the fixing component.

[0012] Preferably, the rotating assembly includes a gear disposed on one side of the base, the gear meshing with a gear ring, a lifting platform symmetrically fixed to the top of the gear ring, and multiple connecting plates fixed at equal angles on the inner wall of the gear ring, with an abutment rod connected to one side of the connecting plate via a telescopic rod.

[0013] Preferably, the lifting platform and the gear ring are slidably connected to the rollers, one side of the abutment rod is slidably connected to the wafer, and one end of the gear is rotatably connected to a motor.

[0014] Preferably, the fixing component includes a roller rotatably connected to a lifting column, a fixing plate fixed inside the lifting column, a latch slidably connected to the fixing plate, the latch being rotatably connected to a connecting seat, and the lifting column being slidably connected to the connecting seat.

[0015] Preferably, the lifting column and the connecting seat have cavities that cooperate with the locking mechanism, the fixing plate is fixedly connected to the inner wall of the cavity, and a spring is provided between the top of the lifting column and the inner wall of the cavity of the connecting seat.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention achieves continuous circumferential sliding of the contact rod along the wafer sidewall as the gear ring rotates, with the support contact point continuously and dynamically moving along the wafer edge without a fixed stopping position. Simultaneously, a lifting platform is symmetrically fixed on the top surface of the gear ring. Rollers alternately pass over the top surface of the lifting platform and the top surface of the gear ring as the gear ring rotates, driving the lifting column to perform intermittent lifting and lowering movements. This, in turn, drives the latches to periodically open and close around the hinge point, achieving intermittent locking and unlocking of the wafer. This allows the contact rod to continuously slide, providing basic circumferential support. The symmetrically distributed latches open and close alternately, ensuring that at least one set of support structures maintains effective contact with the wafer at any given time. The limiting constraint is not lost throughout the entire process, ensuring that the wafer remains in an effective limiting state throughout the cleaning process. It will not tip over, move, or collide due to the support detaching. While achieving blind-zone-free cleaning, it avoids the risk of wafer displacement and fragmentation, and solves the inherent defects of permanent contact blind zones in traditional fixed slots. It significantly reduces the risk of residual particles, concentration corrosion, and crystallization defects at the wafer edge, improving the yield of edge areas.

[0017] 2. This invention uses a placement rack to drive the entire batch of wafers to perform periodic horizontal oscillation, which can continuously disturb the flow field between wafers, break the static air film between wafers, and force the trapped microbubbles to float upwards and be discharged along the gaps between wafers. This eliminates the sheet-like cleaning blind spots caused by bubble blockage, greatly improving the rinsing uniformity and effective cleaning area of ​​the entire wafer surface. At the same time, the reciprocating oscillation causes relative motion between the wafer and the water flow, enhancing the shearing and scouring force of the water flow on the wafer surface and improving the stripping efficiency of submicron particles.

[0018] 3. This invention uses multiple sets of contact rods evenly arranged along the circumference of the wafer. The contact rods are connected to the connecting plate via telescopic rods. The connecting plate is fixed to the inner wall of the gear ring and rotates synchronously with the gear ring. It can automatically adapt to wafers of different diameters and thicknesses through radial extension and contraction. It can complete the changeover of multiple specifications of products without changing the fixture, which greatly improves the equipment changeover efficiency and process compatibility. At the same time, the swing amplitude can be infinitely adjusted by the tilt angle of the rotating ring. For large-size wafers, a large stroke can be used to ensure the debubbling and rinsing effect. For thin wafers and patterned wafers, a small stroke can be used to avoid stress damage. It can flexibly match the pre-processing requirements of wafers of different sizes and process nodes, and the equipment has strong versatility. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the main body of the present invention; Figure 2 This is a schematic diagram showing the connection between the filter plate and the fixing base of the present invention; Figure 3 This is a three-dimensional structural diagram of the shaking component of the present invention; Figure 4 This is a three-dimensional structural schematic diagram of the shaking component of the present invention; Figure 5 This is a three-dimensional structural schematic diagram of the shaking component from another perspective of the present invention; Figure 6 This is a three-dimensional structural schematic diagram of the rotating component of the present invention; Figure 7 This is a three-dimensional structural schematic diagram of the rotating component from another perspective of the present invention; Figure 8 This is a three-dimensional structural diagram of the fixing component of the present invention; Figure 9 This is a schematic side sectional view of the three-dimensional structure of the fixing component of the present invention; Figure 10 This is a side sectional view of the three-dimensional structure of the fixing component from another perspective of the present invention.

[0020] In the diagram: 1. Main body; 2. Rinse tank; 3. Spray nozzle; 4. Placement rack; 5. Filter plate; 6. Fixed base; 701. Rotating shaft; 702. Moving ring; 703. Push plate; 704. Rotating ring; 705. Connecting shaft; 706. Fixing component; 8. Fixed ring; 9. Base; 101. Gear; 102. Gear ring; 103. Lifting platform; 104. Connecting plate; 105. Abutment rod; 11. Roller; 121. Lifting column; 122. Fixed plate; 123. Lock; 124. Spring; 13. Connecting base. Detailed Implementation

[0021] Please see Figures 1 to 10 This invention provides a technical solution: a wafer pretreatment device for integrated circuit manufacturing, comprising a main body 1, a rinsing tank 2 disposed within the main body 1, nozzles 3 symmetrically fixed to the inner wall of the rinsing tank 2, a placement frame 4 slidably connected within the nozzles 3, a filter plate 5 fixed within the rinsing tank 2, a fixing seat 6 fixed to the top of the filter plate 5, a shaking component disposed on the top of the fixing seat 6, and the shaking component drives the placement frame 4 to periodically shake within the rinsing tank 2, a plurality of fixing rings 8 evenly spaced at the top of the placement frame 4, a plurality of bases 9 evenly spaced at the top of the placement frame 4, a rotating component disposed on one side of the bases 9, a plurality of rollers 11 disposed at equal angles between the fixing rings 8 and the bases 9, and the rotating component drives the rollers 11 to periodically lift and lower, a fixing component disposed on one side of the rollers 11, a connecting seat 13 slidably connected to one side of the fixing component, and the fixing component fixes the position of the wafer.

[0022] In practice, the shaking component drives the placement rack 4 to shake back and forth to eliminate the blind spots of inter-wafer bubble cleaning. The rotating component drives the roller 11 to rise and fall periodically. The linkage fixing component intermittently switches the wafer support contact point to eliminate the blind spots of wafer edge fixing support cleaning. Combined with the stable rinsing flow field inside the rinsing tank 2, which is composed of filter plate 5 and nozzle 3, it can improve the overall cleaning uniformity and surface cleanliness of the wafer. At the same time, it can be adapted to wafers of various specifications, making the equipment more versatile.

[0023] As a further embodiment of the present invention, the connecting seat 13 is fixedly connected to the fixing ring 8, the placement frame 4 and the fixing seat 6 are slidably connected, and the placement frame 4 is slidably connected to the worktable of the main body 1.

[0024] In practice, the placement rack 4 can smoothly complete periodic reciprocating sliding under the drive of the shaking component and relying on two limiting sliding structures. In conjunction with the rollers 11, fixed components, and rotating components that are matched with the fixed ring 8 and the base 9, the wafer edge support contact position is dynamically switched to eliminate edge cleaning blind spots while ensuring stable wafer positioning. At the same time, the placement rack 4 shakes as a whole to break up the trapped air bubbles between wafers. Combined with the unidirectional rinsing flow field formed by the filter plate 5 and the nozzle 3 in the rinsing tank 2, uniform cleaning of the entire wafer area without dead corners is achieved.

[0025] As a further embodiment of the present invention, the shaking component includes a rotating shaft 701 that passes through the fixed base 6. A motor is fixed to one end of the rotating shaft 701. A movable ring 702 is slidably connected to the outer wall of the rotating shaft 701. A push plate 703 is rotatably connected to a protrusion on one side of the movable ring 702. A rotating ring 704 is rotatably connected to the push plate 703. A fixing member 706 is slidably connected to the rotating ring 704. The fixing member 706 is fixedly connected to the placement frame 4.

[0026] In practice, the motor at the end of the rotating shaft 701 drives the rotating shaft 701 to rotate continuously. The outer wall of the rotating shaft 701 is slidably fitted with a moving ring 702. The moving ring 702 is hinged to a rotating ring 704 through a push plate 703. The rotating ring 704 is slidably engaged with the fixing part 706 fixed to the placement frame 4. When the wafer specification is changed, the moving ring 702 slides along the rotating shaft 701. The tilt angle of the rotating ring 704 is adjusted by the push plate 703. The rotation of the rotating shaft 701 can drive the placement frame 4 to make periodic reciprocating slides along the fixed seat 6 and the worktable of the main body 1 through the rotating ring 704 and the fixing part 706. The reciprocating sway of the placement frame 4 as a whole disturbs the flow field between wafers, removes trapped air bubbles, and eliminates the sheet-like cleaning blind spots caused by air bubbles. At the same time, the swing stroke of the placement frame 4 can be steplessly adjusted to adapt to wafers of different specifications, improving cleaning uniformity and equipment versatility.

[0027] As a further embodiment of the present invention, the rotating ring 704 has an "I" shaped cross section and is composed of two circular plates and a cylinder. The rotating shaft 701 passes through the rotating ring 704, and a connecting shaft 705 is rotatably connected inside the rotating ring 704.

[0028] In specific implementation, when the moving ring 702 slides and drives the push plate 703 to deflect, the rotating ring 704 can complete the angle tilt adjustment around the connecting shaft 705. When the rotating shaft 701 rotates, the tilted rotating ring 704 clamps the slidingly engaged fixing part 706 through its two circular plates, causing the fixing part 706 and the connected placement frame 4 to perform periodic reciprocating sliding, thereby changing the swing stroke of the placement frame 4 to adapt to various wafers. By shaking and disturbing the flow field between wafers with the placement frame 4, bubbles are discharged, eliminating the sheet-like cleaning blind area formed by bubbles.

[0029] As a further embodiment of the present invention, the rotating shaft 701 is rotatably connected to the rotating ring 704 via the connecting shaft 705, and the rotating shaft 701 has a cavity that cooperates with the movement of the rotating ring 704.

[0030] In practice, the rotating shaft 701 has a cavity for the rotating ring 704 to move in. The rotating shaft 701 is rotated and assembled with the rotating ring 704 via the connecting shaft 705. The moving ring 702 can push the rotating ring 704 to complete the angular deflection within the cavity of the rotating shaft 701 by the push plate 703. During the rotation of the rotating shaft 701, the tilted rotating ring 704 can drive the fixing part 706 and the placement frame 4 to slide back and forth periodically, thereby disturbing the flow field between wafers, expelling trapped air bubbles, and eliminating the sheet-like cleaning blind spots formed by air bubble blockage. At the same time, the swing stroke of the placement frame 4 can be changed by adjusting the tilt amplitude of the rotating ring 704 to adapt to wafers of different sizes and types, thereby improving the cleaning uniformity and universal adaptability of the device.

[0031] As a further embodiment of the present invention, an electric push rod is fixed between the moving ring 702 and the protrusion of the fixed seat 6, and a cavity is opened between the two circular plates of the rotating ring 704 to cooperate with the movement of the fixing member 706.

[0032] In practice, the electric push rod can push the moving ring 702 to slide along the outer wall of the rotating shaft 701, and then drive the rotating ring 704 to deflect around the connecting shaft 705 to adjust the tilt angle through the push plate 703. A cavity is set between the two circular plates of the rotating ring 704 so that the fixing member 706 can move. When the rotating shaft 701 rotates, the tilted rotating ring 704 will rely on the cavity to drive the fixing member 706 and the placement rack 4 to make periodic reciprocating swaying, disturbing the flow field between the wafers and expelling the trapped air bubbles to eliminate the blind spots of sheet cleaning. At the same time, the tilt angle of the rotating ring 704 can be adjusted by the electric push rod to change the swing amplitude of the placement rack 4, adapting to wafers of different specifications, improving cleaning uniformity and equipment versatility.

[0033] As a further embodiment of the present invention, the rotating component includes a gear 101 disposed on one side of the base 9, the gear 101 meshing with a gear ring 102, a lifting platform 103 symmetrically fixed at the top of the gear ring 102, and multiple connecting plates 104 fixed at equal angles on the inner wall of the gear ring 102, and an abutment rod 105 connected to one side of the connecting plate 104 via a telescopic rod.

[0034] In practice, when the motor-driven gear 101 drives the gear ring 102 to rotate as a whole, the connecting plate 104 rotates synchronously with the gear ring 102, causing the contact rod 105 to continuously slide and change the support point along the circumferential direction of the wafer sidewall, eliminating the cleaning blind zone formed by the fixed contact of the wafer edge. The telescopic rod can adapt to wafers of different specifications to complete flexible positioning. The synchronous gear ring 102 drives the lifting platform 103 to rotate together, and cooperates with the roller 11 to realize the intermittent opening and closing of the latch 123, ensuring the stable positioning of the wafer throughout the process, avoiding the risk of wafer movement and breakage, and greatly improving the cleanliness of the wafer edge and the adaptability and versatility of the device.

[0035] As a further embodiment of the present invention, the lifting platform 103 and the gear ring 102 are slidably connected to the roller 11, one side of the contact rod 105 is slidably connected to the wafer, and one end of the gear 101 is rotatably connected to a motor.

[0036] In practice, the motor drives the gear 101 to rotate, and the gear 101 meshes with the gear ring 102 to rotate synchronously. The gear ring 102 and the lifting platform 103 fixed at the top slide together with the roller 11. During the rotation of the gear ring 102, the roller 11 slides alternately along the surfaces of the two to achieve intermittent lifting and lowering. The linkage latch 123 completes the periodic opening and closing. At the same time, the gear ring 102 drives the connecting plate 104 and the contact rod 105 to rotate circumferentially. The side wall of the contact rod 105 continuously slides in contact with the edge of the wafer, dynamically switching the wafer support point position, eliminating the cleaning blind spot caused by the fixed support of the wafer edge. The alternating limit of the contact rod 105 and the latch 123 can always stably constrain the wafer, avoiding the wafer from moving, colliding and breaking during the cleaning process. Combined with the rinsing flow field, it improves the overall cleaning uniformity of the wafer and the edge cleaning effect.

[0037] As a further embodiment of the present invention, the fixing component includes a roller 11 rotatably connected to a lifting column 121, a fixing plate 122 fixed inside the lifting column 121, a latch 123 slidably connected to the fixing plate 122, the latch 123 rotatably connected to the connecting seat 13, and the lifting column 121 slidably connected to the connecting seat 13.

[0038] In practice, the lifting column 121 and the connecting seat 13 slide together. When the gear ring 102 and the lifting platform 103 rotate, the roller 11 moves up and down intermittently. The movement of the roller 11 drives the lifting column 121 to slide up and down along the connecting seat 13, which in turn drives the fixing plate 122 to pull the latch 123 to periodically flip and open around the connecting seat 13. This forms a complementary support with the circumferentially sliding contact rod 105. When the latch 123 is released, the corresponding edge area of ​​the wafer is exposed and cleaned. When the latch 123 clamps, it works with the contact rod 105 to firmly limit the wafer, preventing the wafer from tilting or moving throughout the process. This eliminates the blind spots in the fixed contact cleaning of the wafer edge and improves the cleanliness of the wafer edge cleaning and the safety of the operation.

[0039] As a further embodiment of the present invention, the lifting column 121 and the connecting seat 13 are provided with cavities that cooperate with the locking buckle 123 to move. The fixing plate 122 is fixedly connected to the inner wall of the cavity, and a spring 124 is provided between the top of the lifting column 121 and the inner wall of the cavity of the connecting seat 13.

[0040] In practice, when the roller 11 is lifted, it pushes the lifting column 121 to slide upward along the connecting seat 13 and compresses the spring 124. The fixing plate 122 moves synchronously with the lifting column 121, pulling the latch 123 to rotate around the connecting seat 13 and clamp the wafer. After the roller 11 falls, the spring 124 releases its elastic force, causing the lifting column 121 and the fixing plate 122 to reset. The latch 123 then rotates back to release the wafer. The latch 123 automatically resets by relying on the spring 124. The latch 123 and the abutment rod 105 alternately support the wafer, which can dynamically expose the wafer edge to eliminate contact cleaning blind spots, and can also keep the wafer stable and limited throughout the process to prevent the wafer from shaking, colliding and breaking.

[0041] Working principle: When using the wafer pretreatment device for integrated circuit production and processing, the front-end robot of the main body 1 takes the wafer to be cleaned out of the transfer box and inserts it vertically into the placement rack 4 at fixed intervals. The optical sensor identifies the flat edge and notch of the wafer to ensure that all wafers are aligned and inserted in place, and checks for warped or stacked abnormalities. High-purity deionized water is continuously injected from the bottom of the rinsing tank 2 through the filter plate 5 and smoothly discharged from the top of the rinsing tank 2 through the overflow weir of the spray pipe 3, forming a unidirectional flow field from bottom to top, continuously replacing the water in the tank, and rinsing away the alkaline solution and reaction by-products remaining on the surface of the wafer. When the wafer is placed between the fixing ring 8 and the base 9 fixed at the top of the placement rack 4 (after the wafer is inserted from one side of the fixing ring 8, it moves towards the base 9 to between the fixing ring 8 and the base 9, so that it abuts against the contact rod 105 and the latch 123. A telescopic rod is provided between the contact rod 105 and the connecting plate 104, so that the contact rod 105 can adapt to the wafer size. The wafer is fixed in position by the contact rod 105 and the latch 123, realizing flexible contact positioning. It can be compatible with multiple wafer sizes without changing the fixture, improving the equipment changeover efficiency. Flexible contact can avoid edge chipping and micro-damage to the wafer caused by rigid contact), when the spray system of the nozzle 3 is started, the motor is started. The motor drives the gear 101 to rotate, which in turn drives the gear ring 102 that meshes with the gear 101 to rotate. The rotation of the gear ring 102 drives the multiple connecting plates 104 fixed at equal angles on its inner wall to rotate synchronously, causing the abutment rod 105 fixed on one side of the connecting plate 104 to rotate synchronously. At this time, the abutment rod 105 slides circumferentially on one side of the wafer, which allows the support contact point to move continuously along the edge of the wafer. The edge area that was originally blocked by the abutment rod 105 is exposed to the rinsing water flow in turn, eliminating the edge contact cleaning blind zone caused by the fixed support. At the same time, the slight friction of the circumferential sliding can help to peel off the particles and drug crystals embedded in the chamfer of the wafer edge, improving the cleanliness of the edge area. Simultaneously, the rotation of the gear ring 102 drives the lifting platform 103 fixed at its top to rotate synchronously. Since the lifting platform 103 is symmetrically fixed at the top of the gear ring 102, the rollers 11 slide on the surfaces of the gear ring 102 and the lifting platform 103, causing the rollers 11 to perform intermittent lifting and lowering movements through the rotation of the gear ring 102 and the lifting platform 103. At this time, when two of the symmetrically distributed rollers 11 are at the top of the lifting platform 103, they are in an upward state, and when the other two symmetrically distributed rollers 11 are at the top of the gear ring 102, they are in a downward state. When the rollers 11 are in the upward state, they drive the lifting column 121 connected to them to slide within the connecting seat 13. At this time, the lifting and lowering... The spring 124 between the column 121 and the connecting seat 13 is in a compressed state. The movement of the lifting column 121 causes the fixing plate 122, which is fixed to its inner wall, to move synchronously. Since the fixing plate 122 is slidably connected to the latch 123, the movement of the fixing plate 122 causes the latch 123 to rotate around its hinge point with the connecting seat 13. After rotation, the latch 123 locks the wafer. When the roller 11 is in the descending state, the spring 124 releases its elasticity, causing the lifting column 121 to reset, thereby resetting the latch 123 and releasing its contact with the wafer. Through the intermittent locking of the latch 123, there is no blind spot for cleaning on the other side of the wafer. The roller 11 rises and falls intermittently, complementing the circumferentially sliding contact rod 105. The side wall area covered by the contact rod 105 and the side wall area covered by the latch 123 alternately disengage from contact and are exposed to the water flow, ultimately achieving full coverage rinsing of the entire circumferential side wall of the wafer without dead angles. At the same time, the alternating locking design ensures that at least one set of support structure (contact rod 105 or latch 123) is in contact with the wafer throughout the process, keeping the wafer in a stable and limited state. It will not tip over, move, or collide during the rinsing and swinging process, thus achieving blind-spot-free cleaning while fully ensuring operational safety. When the gear ring 102 rotates, the motor on one side of the rotating shaft 701 is started synchronously, driving the rotating shaft 701 to rotate. Since the moving ring 702 and the rotating shaft 701 are connected by a limiting sliding connection, and the rotating ring 704 is rotatably connected to the rotating ring 704 via the connecting shaft 705, the rotating shaft 701 drives the moving ring 702 and the rotating ring 704 to rotate synchronously. The fixing member 706 is located in the cavity between the two circular plates of the rotating ring 704. When the rotating ring 704 is perpendicular to the rotating shaft 701, the rotating ring 704 will not change the position of the fixing member 706. However, when… When the wafer specifications change, the electric push rod is activated, which drives the moving ring 702 to slide on the outer wall of the rotating shaft 701. This causes the push plate 703, which is rotatably connected to the rotating shaft 701, to rotate. The rotating push plate 703 pushes the rotating ring 704, which is rotatably connected to it, to rotate around the connecting shaft 705 on the outer wall of the rotating shaft 701. At this time, the rotating shaft 701 and the rotating ring 704 are tilted. The rotating ring 704 drives the fixing part 706 to slide back and forth periodically. This causes the placement frame 4, which is fixed to the fixing part 706, to slide back and forth periodically at the top of the fixing seat 6. The placement frame 4 drives the entire batch of wafers to swing back and forth periodically, which can continuously disturb the inter-wafer flow field, break the static gas film between wafers, accelerate the floating and discharge of trapped bubbles from the gaps between wafers, eliminate the sheet-like cleaning blind spots caused by inter-wafer bubbles, and greatly improve the uniformity of rinsing the entire surface. At the same time, the relative water flow disturbance generated by the back and forth swing can enhance the scouring and shearing force of the water flow on the wafer surface, improve the particle stripping efficiency, and reduce the adhesion residue of submicron particles.

[0042] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention are within the scope of the present invention.

Claims

1. A wafer preprocessing apparatus for integrated circuit manufacturing, comprising a main body (1), characterized in that: The main body (1) is provided with a rinsing tank (2). Spray pipes (3) are symmetrically fixed on the inner wall of the rinsing tank (2). A placement frame (4) is slidably connected inside the spray pipe (3). A filter plate (5) is fixed inside the rinsing tank (2). A fixed seat (6) is fixed at the top of the filter plate (5). A shaking component is provided at the top of the fixed seat (6). The shaking component drives the placement frame (4) to shake periodically inside the rinsing tank (2). Multiple fixed rings (8) are fixed at equal intervals at the top of the placement frame (4). Multiple bases (9) are fixed at equal intervals at the top of the placement frame (4). A rotating component is provided on one side of the base (9). Multiple rollers (11) are provided at equal angles between the fixed rings (8) and the bases (9). The rotating component drives the rollers (11) to perform periodic lifting and lowering movements. A fixed component is provided on one side of the rollers (11). A connecting seat (13) is slidably connected on one side of the fixed component. The fixed component fixes the position of the wafer.

2. The wafer preprocessing apparatus for integrated circuit manufacturing according to claim 1, characterized in that: The connecting seat (13) is fixedly connected to the fixing ring (8), the placement frame (4) and the fixing seat (6) are slidably connected, and the placement frame (4) is slidably connected to the worktable of the main body (1).

3. The wafer preprocessing apparatus for integrated circuit manufacturing according to claim 1, characterized in that: The swaying assembly includes a rotating shaft (701) that passes through the fixed base (6). A motor is fixed to one end of the rotating shaft (701). A movable ring (702) is slidably connected to the outer wall of the rotating shaft (701). A push plate (703) is rotatably connected to a protrusion on one side of the movable ring (702). A rotating ring (704) is rotatably connected to the push plate (703). A fixing member (706) is slidably connected to the rotating ring (704). The fixing member (706) is fixedly connected to the placement frame (4).

4. The wafer preprocessing apparatus for integrated circuit manufacturing according to claim 3, characterized in that: The rotating ring (704) has an "I" shaped cross section and is composed of two circular plates and a cylinder. The rotating shaft (701) passes through the rotating ring (704), and a connecting shaft (705) is rotatably connected inside the rotating ring (704).

5. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 3, characterized in that: The rotating shaft (701) is rotatably connected to the rotating ring (704) via a connecting shaft (705), and the rotating shaft (701) has a cavity that cooperates with the movement of the rotating ring (704).

6. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 3, characterized in that: An electric push rod is fixed between the movable ring (702) and the protrusion of the fixed seat (6), and a cavity is provided between the two circular plates of the rotating ring (704) to cooperate with the movement of the fixing member (706).

7. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 1, characterized in that: The rotating assembly includes a gear (101) disposed on one side of the base (9), the gear (101) meshing with a gear ring (102), a lifting platform (103) symmetrically fixed at the top of the gear ring (102), and multiple connecting plates (104) fixed at equal angles on the inner wall of the gear ring (102), and an abutment rod (105) connected to one side of the connecting plate (104) via a telescopic rod.

8. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 7, characterized in that: The lifting platform (103) and the gear ring (102) are slidably connected to the roller (11), one side of the abutment rod (105) is slidably connected to the wafer, and one end of the gear (101) is rotatably connected to a motor.

9. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 1, characterized in that: The fixing component includes a roller (11) rotatably connected to a lifting column (121), a fixing plate (122) fixed inside the lifting column (121), a latch (123) slidably connected to the fixing plate (122), the latch (123) rotatably connected to the connecting seat (13), and the lifting column (121) slidably connected to the connecting seat (13).

10. A wafer preprocessing apparatus for integrated circuit manufacturing according to claim 9, characterized in that: The lifting column (121) and the connecting seat (13) have cavities that cooperate with the locking buckle (123) to move. The fixing plate (122) is fixedly connected to the inner wall of the cavity. A spring (124) is provided between the top of the lifting column (121) and the inner wall of the cavity of the connecting seat (13).

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