An interlayer insulation film coating device

Abstract

The application discloses an interlayer insulation adhesive film coating device for semiconductor packaging, and belongs to the field of coating equipment. Traditional coating methods have problems of uneven coating, waste of adhesive, and low production efficiency in the preparation of interlayer insulation adhesive film for semiconductor packaging. To solve these problems, the application provides an interlayer insulation adhesive film coating device, which comprises a release film uncoiling machine, a coating head, a vacuum drying box, a deviation rectifying mechanism, a covering film uncoiling machine and a winding machine. The coating head is composed of an adhesive film raw material feeding system, a constant temperature device, a temperature control system and a slit coating head, and the adhesive film raw material is uniformly coated on the PET release film through the slit coating mode. The coated release film is dried in the vacuum drying box to remove volatile solvents, form an adhesive film, and then be wound into a commercial interlayer insulation adhesive film after being compounded with a covering film. The application effectively solves the problems of uneven coating, waste of adhesive and low production efficiency, and has compact equipment design and simple operation.

Description

Technical Field

[0001] This invention patent relates to an apparatus for coating interlayer insulating adhesive film for semiconductor packaging, belonging to the field of coating equipment. Background Technology

[0002] In semiconductor packaging, interlayer insulating film is one of the key materials. Before being applied to the carrier board and component packaging, the interlayer insulating film for semiconductor packaging is a film coated on a PET release film, and its surface is usually covered with a capping film of about 25 μm. Traditional coating methods include: roller coating, which uses rollers or doctor blades to uniformly coat the coating onto the substrate surface; brush coating, which uses brushes to uniformly coat the coating onto the substrate surface; spray coating, which uses spray guns or nozzles to spray the coating onto the substrate surface in an aerosol form; dip coating, which immerses the substrate in a solution or slurry containing the coating to allow it to absorb a certain amount of coating; printing, which uses a printer or mold to print the coating onto the substrate surface; and ion beam sputtering, which uses an ion beam to bombard a coating source and deposit sputtered coating particles onto the substrate surface. However, these traditional coating methods suffer from problems such as uneven coating, waste of adhesive, and low production efficiency when used for preparing interlayer insulating films for semiconductor packaging. Therefore, a new coating device is needed to solve these problems. Summary of the Invention

[0003] To overcome the problems of uneven coating and low production efficiency of existing interlayer insulating films used in semiconductor packaging.

[0004] This invention provides an interlayer insulating film coating apparatus, characterized in that:

[0005] The interlayer insulating adhesive film coating device consists of the following components from unwinding to winding, according to the moving direction of the PET release film: release film unwinding machine (4), coating head (1), 1-2 sections of vacuum drying oven (9), correction mechanism (8), cover film unwinding machine (6), and winding machine (5). An exhaust fan (10) is installed above the coating head (1) to avoid environmental pollution in the workshop caused by the evaporation of solvents from the adhesive film raw materials.

[0006] The coating head (1) consists of four main parts: a film raw material feeding system (not shown in the figure), a constant temperature device (25), a temperature control system (not shown in the figure), and a slit coating head.

[0007] The constant temperature device (25) is composed of a box commonly used in this industry, which is equipped with a semiconductor cooling chip (thermoelectric cooling chip);

[0008] The temperature control system uses a semiconductor TEC temperature control module commonly used in this industry;

[0009] The top of the slit coating head (2) is connected to the film raw material storage tank (22), and the top of the film raw material storage tank is provided with a feed inlet (21). The film raw material supply system feeds the film raw material liquid into the slit coating head (2) device through the feed inlet (21).

[0010] The main body of the film raw material storage tank (22) is connected to the constant temperature device (25);

[0011] The slit coating head (2) has a film material distribution pipe (26) running through its interior; the slit coating port (23) is located at the lower end of the slit lip (24); the slit coating port (23) and the film material distribution pipe (26) are connected by a slit between the upper lip (241) and the lower lip (242) of the slit lip (24).

[0012] During the operation of the coating equipment, the film raw material supply system delivers the film raw material liquid to the film raw material storage tank (22) equipped with a constant temperature device (25), ensuring that the film raw material liquid maintains constant temperature-sensitive indicators such as viscosity during its residence in the film raw material storage tank (22), so as to maintain stable coating quality. The temperature-controlled film raw material liquid is filled into the slit between the upper lip (241) and the lower lip (242) of the slit through the film raw material distribution pipe (26). Under the pressure of the film raw material supply system, the film raw material liquid is uniformly extruded from the slit coating port (23) and coated onto the PET release film.

[0013] Afterwards, the PET release film (3) coated with the adhesive film raw material liquid is vacuum dried in 1-2 vacuum drying ovens (9) to remove volatile solvents and form an adhesive film (7). Finally, it is combined with a cover film of about 25 micrometers thickness from the cover film unwinding machine (6) through guide rollers on the surface of the adhesive film and then rolled together by the winding machine (5) to form a commercial interlayer insulating adhesive film, which can be transported to the packaging factory for semiconductor packaging.

[0014] During the transmission process of the interlayer insulating adhesive film coating device described in this invention, the adhesive film (7) is corrected by the correction mechanism (8) to ensure its stable operation.

[0015] The beneficial effects of this invention are that it completely solves the problems of uneven coating, waste of adhesive, and low production efficiency by using slit coating. The equipment is compact in design and easy to operate. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is a schematic diagram of an interlayer insulating film coating apparatus according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of a coating head according to an embodiment of the present invention.

[0019] Figure 3 This is a cross-sectional schematic diagram of a coating head according to an embodiment of the present invention. Detailed Implementation

[0020] Example 1. Apparatus for coating interlayer insulating film for semiconductor packaging and its application.

[0021] The following describes the process of producing interlayer insulating film using the interlayer insulating film coating apparatus of the present invention, taking PET, a commonly used release film in the art, as an example.

[0022] The PET release film (3) is conveyed from the release film unwinder (4) to the coating head (1). The film raw material supply system delivers the film raw material liquid to the film raw material storage tank (22) equipped with a constant temperature device (25) to ensure that the film raw material liquid maintains constant temperature-sensitive indicators such as viscosity during its residence in the film raw material storage tank (22), so as to maintain the stability of coating quality. The temperature-controlled film raw material liquid is filled into the slit between the upper lip (241) and the lower lip (242) of the slit through the film raw material distribution pipe (26). Under the pressure of the film raw material supply system, the film raw material liquid is uniformly extruded from the slit coating port (23) and coated onto the PET release film. Afterwards, the PET release film (3) coated with the adhesive film raw material liquid is vacuum dried in 1-2 vacuum drying ovens (9) to remove volatile solvents and form an adhesive film (7). Finally, it is combined with a cover film of about 25 micrometers thickness from the cover film unwinding machine (6) through guide rollers on the surface of the adhesive film and then rolled together by the winding machine (5) to form a commercial interlayer insulating adhesive film, which can be transported to the packaging factory for semiconductor packaging.

[0023] During the interlayer insulating film coating process, an exhaust device (10) is installed above the coating head (1) to continuously exhaust and remove the exposed volatile organic compounds, so as to avoid environmental pollution in the workshop caused by the evaporation of the film raw material solvent.

[0024] Furthermore, the adhesive film (7) is corrected by the correction mechanism (8) during the transmission process of the interlayer insulating adhesive film coating device described in this invention, so that it can operate stably.

[0025] The above description is merely one embodiment of the present invention and does not limit the scope of the invention. Those skilled in the art can make appropriate changes and improvements to the device based on the principles and embodiments of the present invention, and such changes and improvements are all within the protection scope of the present invention.

Claims

1. An interlayer insulating film coating apparatus, characterized in that: The interlayer insulating film coating device, according to the moving direction of the PET release film, consists of the following components from unwinding to winding: release film unwinding machine (4), coating head (1), 1-2 sections of vacuum drying oven (9), web guiding mechanism (8), cover film unwinding machine (6), and winding machine (5): An exhaust device (10) is installed above the coating head (1); The coating head (1) consists of four main parts: a film raw material feeding system, a constant temperature device (25), a temperature control system, and a slit coating head.

2. The interlayer insulating film coating apparatus according to claim 1, characterized in that: The constant temperature device (25) is composed of a box commonly used in this industry, which is equipped with a semiconductor cooling chip (thermoelectric cooling chip); The temperature control system uses a semiconductor TEC temperature control module commonly used in this industry.

3. The interlayer insulating film coating apparatus according to claim 1, characterized in that: The top of the slit coating head (2) is connected to the film raw material storage tank (22), and the top of the film raw material storage tank is provided with a feed inlet (21). The film raw material supply system feeds the film raw material liquid into the slit coating head (2) device through the feed inlet (21). The main body of the film raw material storage tank (22) is connected to the constant temperature device (25); The slit coating head (2) has a film material distribution pipe (26) running through its interior; the slit coating port (23) is located at the lower end of the slit lip (24); the slit coating port (23) and the film material distribution pipe (26) are connected by a slit between the upper lip (241) and the lower lip (242) of the slit lip (24).

4. The interlayer insulating film coating apparatus according to claim 1, characterized in that: The interlayer insulating film coating device operates as follows: During the operation of the coating equipment, the film raw material supply system delivers the film raw material liquid to the film raw material storage tank (22) equipped with a constant temperature device (25), ensuring that the film raw material liquid maintains constant temperature-sensitive indicators such as viscosity during its residence in the film raw material storage tank (22), so as to maintain the stability of the coating quality. The temperature-controlled film raw material liquid is filled into the slit between the upper lip (241) and the lower lip (242) of the slit through the film raw material distribution pipe (26). Under the pressure of the film raw material supply system, the film raw material liquid is uniformly extruded from the slit coating port (23) and coated onto the PET release film. Afterwards, the PET release film (3) coated with the adhesive film raw material liquid is vacuum dried in 1-2 vacuum drying ovens (9) to remove volatile solvents and form an adhesive film (7). Finally, it is combined with a cover film of about 25 micrometers thickness from the cover film unwinding machine (6) through guide rollers on the surface of the adhesive film and then rolled together by the winding machine (5) to form a commercial interlayer insulating adhesive film, which can be transported to the packaging factory for semiconductor packaging.

5. The interlayer insulating film coating apparatus according to claim 1, characterized in that: The adhesive film (7) is guided by the correction mechanism (8) during the transmission process of the interlayer insulating adhesive film coating device of the present invention, so as to make it run stably.

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