Vacuum chamber water cooling structure for semiconductor and manufacturing method thereof

Abstract

The application discloses a kind of vacuum cavity water cooling structure for semiconductor and manufacturing method, to provide a kind of vacuum cavity water cooling structure for semiconductor and manufacturing method, which can effectively reduce continuous welding amount, thereby effectively control vacuum cavity deformation, improve the sealing performance of water cooling structure, operating stability and reliability.It includes: a number of water cooling channels from bottom to top in turn, in the side wall of vacuum cavity, the water cooling channel is square, which includes four straight waterways in turn, the straight waterway is made by machining, each water cooling channel includes first end and end;Connecting groove, on the outer side wall surface of vacuum cavity, made by machining, the first end and end of any two adjacent water cooling channels are connected by connecting groove;Sealing cover, the slot of each connecting groove is sealed by sealing cover;Two inlets and outlets, one is arranged at the first end of the lowermost water cooling channel, and the other is arranged at the end of the uppermost water cooling channel.

Description

Technical Field

[0001] This invention relates to the field of vacuum cavity technology for semiconductors, and specifically to a water-cooled structure and manufacturing method for a vacuum cavity for semiconductors. Background Technology

[0002] Vacuum cavities used in semiconductors serve as the core carrier of vacuum systems, and their performance directly determines the stability, reliability, and accuracy of related processes and experiments. Currently, water-cooled structures for vacuum cavities typically employ a welded seal between an inner shell, an outer shell, and two end caps, forming the water-cooled vacuum cavity. In this type of water-cooled structure, the large amount of continuous welding between the inner and outer shells and the end caps makes them prone to deformation. This not only easily affects the sealing performance of the water-cooling structure but also often requires secondary processing of the inner shell's inner wall, increasing labor costs, reducing manufacturing efficiency, and increasing the risk of leakage problems.

[0003] For example, Chinese Patent Publication No. CN221301729U describes an invention entitled "A Water-Cooled Vacuum Chamber," which includes a sealing cover, an outer shell, and an inner shell. The inner shell is disposed inside the outer shell, and the sealing cover is sealed to the outer shell and the inner shell using a sealing element. A cooling chamber is formed between the inner shell and the outer shell. While this method avoids the problems of excessive welding and deformation between the sealing cover and the outer and inner shells, the sealing element is prone to aging and poor sealing, affecting its service life. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor vacuum cavity water-cooling structure and its manufacturing method that can effectively reduce the amount of continuous welding, thereby effectively controlling the deformation of the vacuum cavity and improving the sealing performance, operational stability and reliability of the water-cooling structure.

[0005] The technical solution of this invention is: A vacuum chamber water-cooling structure for semiconductors, comprising: Several water-cooling channels arranged sequentially from bottom to top are located inside the side wall of the vacuum chamber. The water-cooling channels are square and include four straight water channels that are connected sequentially from front to back and left to right. The straight water channels are machined and each water-cooling channel includes a head end and a tail end. The connecting groove is located on the outer wall surface of the vacuum chamber and is machined. The beginning and end of any two adjacent water cooling channels are connected through the connecting groove. Sealing caps are used to seal the openings of each connecting groove; The system has two inlets / outlets, one located at the beginning of the bottommost water-cooling channel and the other at the end of the topmost water-cooling channel. In this semiconductor vacuum chamber water-cooling structure, the water-cooling channels are square and include four sequentially connected straight water channels (front, back, left, and right), which are machined. Connecting grooves are machined onto the outer wall surface of the vacuum chamber, and the beginning and end of any two adjacent water-cooling channels are connected via these grooves. The connecting grooves are then sealed with a sealing cap. Thus, only the sealing cap and the machined ports formed by the machined straight water channels need to be welded to form a sealed vacuum chamber water-cooling structure. The welding of the plug and sealing cap is simple, with a small amount of continuous welding, effectively reducing the amount of continuous welding and thus effectively controlling and reducing vacuum chamber deformation, improving the sealing performance, operational stability, and reliability of the water-cooling structure. It also effectively solves the problem of increased labor costs, reduced manufacturing efficiency, and potential leakage issues caused by secondary machining of the inner wall of the shell due to large welding deformation. Furthermore, the sequential water-cooling channel structure from bottom to top also enhances the water-cooling effect, making the temperature inside the vacuum chamber more uniform.

[0006] Preferably, when each straight water channel is machined, a machined port is formed on the outer wall surface of the vacuum chamber, and each machined port located between the beginning and end of the water cooling channel is sealed with a plug. Since the machined port is formed on the outer wall surface of the vacuum chamber, there are no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber. This prevents water cooling channel leakage into the vacuum chamber, thus avoiding serious accidents such as product damage and scrap.

[0007] Preferably, the plug and the machined port are connected by electron beam welding for a sealed connection. This ensures the reliability and stability of the sealed connection between the plug and the machined port.

[0008] As a preferred option, it also includes inlet and outlet water pipes, which correspond one-to-one with the inlet and outlet, and the inlet and outlet water pipes are connected to the corresponding inlet and outlet by welding and sealing.

[0009] Preferably, the bottom of the connecting groove is provided with two machined connecting holes, one of which connects to the beginning of a water-cooling channel, and the other connects to the end of another water-cooling channel. This reduces the depth of the connecting groove and minimizes the amount of machining required to connect the water-cooling channels and the connecting groove via the machined connecting holes.

[0010] Preferably, the sealing cap connection groove is connected by electron beam welding. This ensures the sealing performance and stability of the sealing cap.

[0011] Preferably, the inner diameter of each straight water channel in the water-cooling channel is the same.

[0012] A method for fabricating a vacuum cavity water-cooled structure for semiconductors includes the following steps: First, the straight water channels of each water cooling channel are machined using a machine tool, and each straight water channel forms a machined port on the outer wall surface of the vacuum chamber. Second, machine tools are used to machine each connecting groove so that the beginning and end of any two adjacent water cooling channels are connected through the connecting groove; Third, the sealing caps are welded, and the openings of each connecting groove are sealed by welding the sealing caps. In this semiconductor vacuum chamber water-cooling structure, the machined ports located between the beginning and end of the water-cooling channels are sealed by plug welding. The water-cooling channels are square and include four sequentially connected straight water channels, which are machined. The connecting grooves are machined onto the outer wall surface of the vacuum chamber, and the beginning and end of any two adjacent water-cooling channels are connected through the connecting grooves. Then, the machined ports are sealed by plug welding, and the sealing caps are welded to seal the openings of the connecting grooves, thus forming a sealed vacuum chamber water-cooling structure. The welding of the plugs and sealing caps is simple, with a small amount of continuous welding, which can effectively reduce the amount of continuous welding, thereby effectively controlling and reducing the deformation of the vacuum chamber, improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0013] Preferably, the third step is followed by the following steps: A water pressure test is performed on the water-cooled vacuum chamber structure for semiconductors. The water pressure is P, and the holding time is t. This ensures the sealing performance, operational stability, and reliability of the water-cooled vacuum chamber structure for semiconductors.

[0014] As a preferred option, the inlet and outlet water pipes are welded together, and the inlet and outlet water pipes are connected to the corresponding inlet and outlet by welding and sealing.

[0015] The beneficial effects of this invention are: Firstly, the welding of the plug and the sealing cover is simple, with a small continuous welding amount. Welding can effectively control and reduce the deformation of the vacuum cavity, thereby improving the sealing performance, operational stability and reliability of the water-cooled structure.

[0016] Secondly, the water-cooling channel structure arranged sequentially from bottom to top can enhance the water-cooling effect and make the temperature inside the vacuum chamber more uniform.

[0017] Third, the inner wall surface of the entire vacuum chamber has no machined grooves or ports, and no welds, ensuring the integrity of the inner wall surface of the vacuum chamber. This prevents water cooling channels from leaking into the vacuum chamber, thus avoiding serious accidents such as product damage and scrapping. Attached Figure Description

[0018] Figure 1 This is an exploded view of a vacuum chamber water-cooling structure for semiconductors according to the present invention.

[0019] Figure 2 This is a schematic diagram of an assembly structure of a water-cooled vacuum cavity structure for semiconductors according to the present invention.

[0020] Figure 3 This is a front view of a vacuum cavity water-cooling structure for semiconductors according to the present invention.

[0021] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure at point AA.

[0022] Figure 5 yes Figure 3 A schematic diagram of a cross-sectional structure at point BB.

[0023] In the picture: Vacuum cavity 1; Water-cooled aisle 2, straight water channel 2.1; Connecting slot 3; Sealing cap 4; Imports and exports 5; 6 inlet and outlet water pipes; 7. Plug Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Specific Implementation Example 1, such as Figures 1-5 As shown, a vacuum chamber water-cooling structure for semiconductors includes several water-cooling channels 2, several connecting grooves 3, several sealing covers 4, several plugs 7, and two inlets and outlets 5 arranged sequentially from bottom to top.

[0025] Water-cooling channels 2 are located within the side wall of the vacuum chamber 1. Each water-cooling channel 2 includes a beginning and an end. The water-cooling channel 2 is square and includes four sequentially connected straight water channels 2.1. The straight water channels 2.1 are machined. During the machining process of each straight water channel 2.1, a machined port is formed on the outer surface of the vacuum chamber. Each machined port located between the beginning and end of the water-cooling channel 2 is sealed with a plug 7. In this embodiment, the plug 7 is welded to the machined port for a sealed connection.

[0026] A connecting groove 3 is located on the outer wall surface of the vacuum chamber 1. The connecting groove 3 is machined. The beginning and end of any two adjacent water-cooling channels 2 are connected by the connecting groove 3, so that the water-cooling channels 2 from bottom to top form a sequentially connected flow channel from bottom to top. The opening of each connecting groove 3 is sealed with a sealing cap 4. In this embodiment, the sealing cap 4 and the connecting groove 3 are connected by welding.

[0027] One of the two inlets / outlets 5 is located at the beginning of the bottom water-cooling channel 2, and the other is located at the end of the top water-cooling channel 2.

[0028] In this embodiment, the water-cooling channels 2 arranged sequentially from bottom to top can further enhance the water-cooling effect and make the temperature inside the vacuum cavity more uniform.

[0029] In this embodiment of the semiconductor vacuum chamber water-cooling structure, the water-cooling channel 2 is square and includes four straight water channels 2.1 connected sequentially in the front, back, left, and right directions. The straight water channels 2.1 are machined. The connecting groove 3 is machined on the outer wall surface of the vacuum chamber. The beginning and end of any two adjacent water-cooling channels 2 are connected by the connecting groove 3. Then, the connecting groove 3 is sealed by the sealing cover 4. Thus, only the sealing cover 4 and the machined port formed by the machined straight water channels 2.1 need to be welded to form a sealed vacuum chamber water-cooling structure. The welding of the plug 7 and the sealing cover 4 is simple and the continuous welding amount is small, which can effectively reduce the continuous welding amount, thereby effectively controlling and reducing the deformation of the vacuum chamber and improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0030] On the other hand, since the machined port is formed on the outer wall surface of the vacuum chamber and the connecting groove 3 is located on the outer wall surface of the vacuum chamber, there will be no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber, thereby preventing water cooling channel 2 from leaking into the vacuum chamber and causing serious accidents such as product damage and scrap.

[0031] In addition, since the plug 7 and the sealing cap 4 have simple structures and are easy to process, and the welding of the plug 7 and the sealing cap 4 is simple, even if repair is required, one or several plugs 7 and sealing caps 4 can be replaced individually as needed, which facilitates repair.

[0032] Specific embodiment two, such as Figures 1-5 As shown, a vacuum chamber water-cooling structure for semiconductors includes several water-cooling channels 2, several connecting grooves 3, several sealing covers 4, several plugs 7, two inlet and outlet 5, and inlet and outlet water pipes 6 arranged sequentially from bottom to top.

[0033] Water-cooling channels 2 are located within the side wall of the vacuum chamber 1. Each water-cooling channel 2 includes a beginning and an end. The water-cooling channel 2 is square and includes four sequentially connected straight water channels 2.1. The straight water channels 2.1 are machined. During machining, a machined port is formed on the outer surface of the vacuum chamber's outer wall. In this embodiment, the inner diameter of each straight water channel 2.1 is the same. Of course, the diameter of each water-cooling channel 2 can be set differently as needed; for example, the inner diameter of each water-cooling channel 2 can increase sequentially from bottom to top, or decrease sequentially from bottom to top.

[0034] Each machined port located between the beginning and end of the water-cooling channel 2 is sealed with a plug 7. In this embodiment, the plug 7 is welded to the machined port for a sealed connection. For example, the plug 7 is electron beam welded to the machined port for a sealed connection; electron beam welding can ensure the reliability and stability of the sealed connection between the plug 7 and the machined port.

[0035] The connecting groove 3 is located on the outer wall surface of the vacuum chamber 1. The connecting groove 3 is machined. The beginning and end of any two adjacent water-cooling channels 2 are connected by the connecting groove 3, so that the water-cooling channels 2 from bottom to top form a flow channel that is connected from bottom to top.

[0036] In one embodiment of this invention, the bottom of the connecting groove 3 is provided with two machined connecting holes. One connecting hole is connected to the beginning of one water-cooling channel 2, and the other connecting hole is connected to the end of another water-cooling channel 2. In this way, the machining depth of the connecting groove 3 can be reduced, and the water-cooling channel 2 and the connecting groove 3 can be connected by the machined connecting holes, thereby reducing the amount of machining required.

[0037] In another embodiment of this invention, the first end of one of the two water-cooling channels 2 connected to the connecting groove 3 is directly connected to the connecting groove 3, and the end of the other water-cooling channel 2 is also directly connected to the connecting groove 3.

[0038] Each connecting groove 3 is sealed with a sealing cap 4. In this embodiment, the sealing cap 4 and the connecting groove 3 are connected by welding. For example, the sealing cap 4 and the connecting groove 3 are connected by electron beam welding. Using electron beam welding can ensure the welding sealing performance and stability of the sealing cap 4.

[0039] One of the two inlets / outlets 5 is located at the beginning of the bottom water-cooling channel 2, and the other is located at the end of the top water-cooling channel 2.

[0040] The inlet and outlet pipes 6 correspond one-to-one with the inlet and outlet pipes 5, and the inlet and outlet pipes 6 and the corresponding inlet and outlet pipes 5 are connected by welding seal.

[0041] In this embodiment, the water-cooling channels 2 arranged sequentially from bottom to top can further enhance the water-cooling effect and make the temperature inside the vacuum cavity more uniform.

[0042] In this embodiment of the semiconductor vacuum chamber water-cooling structure, the water-cooling channel 2 is square and includes four straight water channels 2.1 connected sequentially in the front, back, left, and right directions. The straight water channels 2.1 are machined. The connecting groove 3 is machined on the outer wall surface of the vacuum chamber. The beginning and end of any two adjacent water-cooling channels 2 are connected by the connecting groove 3. Then, the connecting groove 3 is sealed by the sealing cover 4. Thus, only the sealing cover 4 and the machined port formed by the machined straight water channels 2.1 need to be welded to form a sealed vacuum chamber water-cooling structure. The welding of the plug 7 and the sealing cover 4 is simple and the continuous welding amount is small, which can effectively reduce the continuous welding amount, thereby effectively controlling and reducing the deformation of the vacuum chamber and improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0043] On the other hand, since the machined port is formed on the outer wall surface of the vacuum chamber and the connecting groove 3 is located on the outer wall surface of the vacuum chamber, there will be no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber, thereby preventing water cooling channel 2 from leaking into the vacuum chamber and causing serious accidents such as product damage and scrap.

[0044] In addition, since the plug 7 and the sealing cap 4 have simple structures and are easy to process, and the welding of the plug 7 and the sealing cap 4 is simple, even if repair is required, one or several plugs 7 and sealing caps 4 can be replaced individually as needed, which facilitates repair.

[0045] Specific embodiment three: A method for fabricating a vacuum cavity water-cooling structure for semiconductors, wherein the specific structure of the vacuum cavity water-cooling structure for semiconductors in this method refers to specific embodiment one or specific embodiment two.

[0046] A method for fabricating a vacuum cavity water-cooled structure for semiconductors includes the following steps: First, the straight water channels 2.1 of each water-cooling channel 2 are machined using a machine tool, and each straight water channel 2.1 forms a machined port on the outer wall surface of the vacuum cavity.

[0047] Second, each connecting groove 3 is machined using a machine tool so that the beginning and end of any two adjacent water cooling channels 2 are connected through the connecting groove 3, so that each water cooling channel 2 from bottom to top forms a flow channel that is connected from bottom to top.

[0048] Third, the sealing cap 4 is welded, and the openings of each connecting groove 3 are sealed by welding the sealing cap 4.

[0049] The plug 7 is welded to seal each machined port located between the beginning and end of the water cooling channel 2.

[0050] In this embodiment, the water-cooling channels 2 arranged sequentially from bottom to top can further enhance the water-cooling effect and make the temperature inside the vacuum cavity more uniform.

[0051] In the semiconductor vacuum cavity water-cooling structure fabricated using the method described in this embodiment, the water-cooling channel 2 is square and includes four straight water channels 2.1 connected sequentially in the front, back, left, and right directions. The straight water channels 2.1 are machined. The connecting groove 3 is machined on the outer wall surface of the vacuum cavity. The beginning and end of any two adjacent water-cooling channels 2 are connected through the connecting groove 3. Then, the connecting groove 3 is sealed by the sealing cap 4. Thus, only the sealing cap 4 and the machined port formed by the machined straight water channels 2.1 need to be welded to form a sealed vacuum cavity water-cooling structure. The welding of the plug 7 and the sealing cap 4 is simple and the continuous welding amount is small, which can effectively reduce the continuous welding amount, thereby effectively controlling and reducing the deformation of the vacuum cavity and improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0052] On the other hand, since the machined port is formed on the outer wall surface of the vacuum chamber and the connecting groove 3 is located on the outer wall surface of the vacuum chamber, there will be no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber, thereby preventing water cooling channel 2 from leaking into the vacuum chamber and causing serious accidents such as product damage and scrap.

[0053] In addition, since the plug 7 and the sealing cap 4 have simple structures and are easy to process, and the welding of the plug 7 and the sealing cap 4 is simple, even if repair is required, one or several plugs 7 and sealing caps 4 can be replaced individually as needed, which facilitates repair.

[0054] Specific embodiment four: A method for fabricating a vacuum cavity water-cooling structure for semiconductors, wherein the specific structure of the vacuum cavity water-cooling structure for semiconductors in this method refers to specific embodiment one or specific embodiment two.

[0055] A method for fabricating a vacuum cavity water-cooled structure for semiconductors includes the following steps: First, the straight water channels 2.1 of each water-cooling channel 2 are machined using a machine tool, and each straight water channel 2.1 forms a machined port on the outer wall surface of the vacuum cavity.

[0056] Second, each connecting groove 3 is machined using a machine tool so that the beginning and end of any two adjacent water cooling channels 2 are connected through the connecting groove 3, so that each water cooling channel 2 from bottom to top forms a flow channel that is connected from bottom to top.

[0057] Third, the sealing cap 4 is welded, and the openings of each connecting groove 3 are sealed together using electron beam welding. Using electron beam welding ensures the sealing performance and stability of the sealing cap 4.

[0058] The plug 7 is welded to each machined port located between the beginning and end of the water-cooling channel 2 using electron beam welding. Electron beam welding ensures the reliability and stability of the sealed connection between the plug 7 and the machined ports.

[0059] The inlet and outlet water pipes 6 are welded together, and the inlet and outlet water pipes 6 are connected to the corresponding inlet and outlet 5 by welding and sealing.

[0060] In this embodiment, the water-cooling channels 2 arranged sequentially from bottom to top can further enhance the water-cooling effect and make the temperature inside the vacuum cavity more uniform.

[0061] In the semiconductor vacuum cavity water-cooling structure fabricated using the method described in this embodiment, the water-cooling channel 2 is square and includes four straight water channels 2.1 connected sequentially in the front, back, left, and right directions. The straight water channels 2.1 are machined. The connecting groove 3 is machined on the outer wall surface of the vacuum cavity. The beginning and end of any two adjacent water-cooling channels 2 are connected through the connecting groove 3. Then, the connecting groove 3 is sealed by the sealing cap 4. Thus, only the sealing cap 4 and the machined port formed by the machined straight water channels 2.1 need to be welded to form a sealed vacuum cavity water-cooling structure. The welding of the plug 7 and the sealing cap 4 is simple and the continuous welding amount is small, which can effectively reduce the continuous welding amount, thereby effectively controlling and reducing the deformation of the vacuum cavity and improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0062] On the other hand, since the machined port is formed on the outer wall surface of the vacuum chamber and the connecting groove 3 is located on the outer wall surface of the vacuum chamber, there will be no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber, thereby preventing water cooling channel 2 from leaking into the vacuum chamber and causing serious accidents such as product damage and scrap.

[0063] In addition, since the plug 7 and the sealing cap 4 have simple structures and are easy to process, and the welding of the plug 7 and the sealing cap 4 is simple, even if repair is required, one or several plugs 7 and sealing caps 4 can be replaced individually as needed, which facilitates repair.

[0064] Specific embodiment five: A method for fabricating a vacuum cavity water-cooling structure for semiconductors, wherein the specific structure of the vacuum cavity water-cooling structure for semiconductors in this method refers to specific embodiment one or specific embodiment two.

[0065] A method for fabricating a vacuum cavity water-cooled structure for semiconductors includes the following steps: First, the straight water channels 2.1 of each water-cooling channel 2 are machined using a machine tool, and each straight water channel 2.1 forms a machined port on the outer wall surface of the vacuum cavity.

[0066] Second, each connecting groove 3 is machined using a machine tool so that the beginning and end of any two adjacent water cooling channels 2 are connected through the connecting groove 3, so that each water cooling channel 2 from bottom to top forms a flow channel that is connected from bottom to top.

[0067] Third, the sealing cap 4 is welded, and the openings of each connecting groove 3 are sealed together using electron beam welding. Using electron beam welding ensures the sealing performance and stability of the sealing cap 4.

[0068] The plug 7 is welded to each machined port located between the beginning and end of the water-cooling channel 2 using electron beam welding. Electron beam welding ensures the reliability and stability of the sealed connection between the plug 7 and the machined ports.

[0069] The inlet and outlet water pipes 6 are welded together, and the inlet and outlet water pipes 6 are connected to the corresponding inlet and outlet 5 by welding and sealing.

[0070] Fourth, perform water pressure testing on the vacuum chamber water-cooling structure for semiconductors. The water pressure is P, and the pressure holding time is t. Specifically, connect the two inlet and outlet water pipes 6 to the external water pipe, and then connect water with a pressure of P, where P is 1 MPa. The pressure holding time t is 1-2 hours, for example, t is 2 hours.

[0071] If there is no leakage in the water-cooled vacuum chamber structure for semiconductors during the pressure holding time, it indicates that the water-cooled vacuum chamber structure for semiconductors is qualified; if leakage occurs, it indicates that the water-cooled vacuum chamber structure for semiconductors is unqualified and needs to be repaired. After repair, the water pressure test is repeated until the water-cooled vacuum chamber structure for semiconductors is qualified.

[0072] In this embodiment, the water-cooling channels 2 arranged sequentially from bottom to top can further enhance the water-cooling effect and make the temperature inside the vacuum cavity more uniform.

[0073] In the semiconductor vacuum cavity water-cooling structure fabricated using the method described in this embodiment, the water-cooling channel 2 is square and includes four straight water channels 2.1 connected sequentially in the front, back, left, and right directions. The straight water channels 2.1 are machined. The connecting groove 3 is machined on the outer wall surface of the vacuum cavity. The beginning and end of any two adjacent water-cooling channels 2 are connected through the connecting groove 3. Then, the connecting groove 3 is sealed by the sealing cap 4. Thus, only the sealing cap 4 and the machined port formed by the machined straight water channels 2.1 need to be welded to form a sealed vacuum cavity water-cooling structure. The welding of the plug 7 and the sealing cap 4 is simple and the continuous welding amount is small, which can effectively reduce the continuous welding amount, thereby effectively controlling and reducing the deformation of the vacuum cavity and improving the sealing performance, operational stability, and reliability of the water-cooling structure. At the same time, it can effectively solve the problem of increased labor costs, reduced manufacturing efficiency, and easy leakage caused by secondary processing of the inner wall of the shell due to large welding deformation.

[0074] On the other hand, since the machined port is formed on the outer wall surface of the vacuum chamber and the connecting groove 3 is located on the outer wall surface of the vacuum chamber, there will be no machined grooves or ports on the inner wall surface of the entire vacuum chamber, ensuring the integrity of the inner wall surface of the vacuum chamber, thereby preventing water cooling channel 2 from leaking into the vacuum chamber and causing serious accidents such as product damage and scrap.

[0075] In addition, since the plug 7 and the sealing cap 4 have simple structures and are easy to process, and the welding of the plug 7 and the sealing cap 4 is simple, even if repair is required, one or several plugs 7 and sealing caps 4 can be replaced individually as needed, which facilitates repair.

[0076] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, alterations, and equivalent transformations made to the above embodiments based on the technical essence of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A vacuum cavity water-cooling structure for semiconductors, characterized in that, include: Several water-cooling channels arranged sequentially from bottom to top are located inside the side wall of the vacuum chamber. The water-cooling channels are square and include four straight water channels that are connected sequentially from front to back and left to right. The straight water channels are machined. Each water-cooling channel includes a head end and a tail end. The connecting groove is located on the outer wall surface of the vacuum cavity and is machined. The beginning and end of any two adjacent water cooling channels are connected through the connecting groove. Sealing caps are used to seal the openings of each connecting groove; There are two inlets and outlets, one located at the beginning of the bottom water-cooling channel and the other at the end of the top water-cooling channel.

2. The vacuum cavity water-cooling structure for semiconductors according to claim 1, characterized in that, When each straight water channel is machined, a machined port is formed on the outer wall surface of the vacuum chamber, and each machined port located between the beginning and end of the water cooling channel is sealed with a plug.

3. The water-cooled vacuum cavity structure for semiconductors according to claim 2, characterized in that, The plug and the machined port are connected by electron beam welding for sealing.

4. A vacuum cavity water-cooling structure for semiconductors according to claim 1, 2, or 3, characterized in that, It also includes inlet and outlet water pipes, which correspond one-to-one with the inlet and outlet, and the inlet and outlet water pipes are connected to the corresponding inlet and outlet by welding and sealing.

5. A vacuum cavity water-cooling structure for semiconductors according to claim 1, 2, or 3, characterized in that, The bottom of the connecting groove is provided with two machined connecting holes, one of which is connected to the beginning of a water-cooling channel and the other is connected to the end of another water-cooling channel.

6. A vacuum cavity water-cooling structure for semiconductors according to claim 1, 2, or 3, characterized in that, The sealing cover connecting groove is sealed and connected by electron beam welding.

7. A vacuum cavity water-cooling structure for semiconductors according to claim 1, 2, or 3, characterized in that, The inner diameter of each straight water channel in the water-cooling channel is the same.

8. A method for fabricating a vacuum cavity water-cooled structure for semiconductors according to any one of claims 1-7, characterized in that, Includes the following steps, First, the straight water channels of each water cooling channel are machined using a machine tool, and each straight water channel forms a machined port on the outer wall surface of the vacuum chamber. Second, machine tools are used to machine each connecting groove so that the beginning and end of any two adjacent water cooling channels are connected through the connecting groove; Third, the sealing caps are welded, and the openings of each connecting groove are sealed by welding the sealing caps. Plug welding: Each machined port located between the first and last ends of the water cooling channel is sealed by plug welding.

9. The method for fabricating a water-cooled vacuum cavity structure for semiconductors according to claim 8, characterized in that, After the third step, Includes the following steps, A water pressure test was performed on a vacuum chamber water-cooled structure for semiconductors. The water pressure was P, and the holding time was t.

10. The method for fabricating a water-cooled vacuum cavity structure for semiconductors according to claim 8, characterized in that, The inlet and outlet water pipes are welded together, and the inlet and outlet water pipes are connected to the corresponding inlet and outlet pipes by welding and sealing.

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