Wafer reverse coating method and wafer reverse coating machine

Abstract

This invention belongs to the field of semiconductor processing technology, and particularly relates to a wafer casting method and a wafer casting machine. The method is applied to a wafer casting machine, which includes a casting table with a material picking station, a dicing station, a film-peeling station, and a film-applying station. The method includes: conveying the workpiece from the material picking station to the dicing station; dividing the workpiece into a wafer with a first protective film attached to its first end face and a film-applying ring with a portion of the first protective film adhered to it; peeling off the first protective film attached to the surface of the film-applying ring; moving the wafer with the first protective film attached to its first end face and the film-applying ring after peeling off the first protective film to the film-applying station; and applying film to the second end face of the wafer and the film-applying ring, forming a film-applying workpiece. This application solves the technical problem in the prior art where different processes in wafer casting require manual or independent equipment for connection and transfer, which easily leads to long process waiting times, slow overall production cycle, and low efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, and particularly relates to a wafer casting method and a wafer casting machine. Background Technology

[0002] In the semiconductor manufacturing and packaging process, wafer casting is an important transitional step in wafer processing. In existing wafer casting methods, the workpiece needs to be transferred between loading equipment, cutting equipment, film peeling equipment and film application equipment. The connection between different processes relies on manual labor or independent equipment. It should be understood that the casting process in the existing technology is a split casting process.

[0003] The existing split-type casting process has defects. Specifically, the workpiece is transferred between multiple devices, the transfer path is long, and the waiting time of the process is long, resulting in a slow overall production cycle and low efficiency. After the wafer and the film-coating ring are cut and separated, they need to be transferred to different devices, which leads to a high risk of contamination due to the transfer. In addition, the first protective film adhering to the surface of the film-coating ring needs to be transferred to a separate device for separate removal. If the removal of the film-coating ring is not effectively coordinated with the wafer transfer and film-coating process, it will lead to an increase in intermediate waiting time, which in turn leads to low production efficiency.

[0004] Therefore, there is an urgent need to design a wafer casting method and a wafer casting machine. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer casting method and a wafer casting machine, which aims to solve the technical problem in the prior art that different processes in wafer casting processing require manual or independent equipment for connection and transfer, which easily leads to long process waiting time, slow overall production cycle and low efficiency.

[0006] To achieve the above objectives, embodiments of the present invention provide a wafer casting method, which is applied to a wafer casting machine. The wafer casting machine includes a casting table, and the casting table is provided with a material handling station, a dicing station, a film-peeling station, and a film-applying station. The method includes the following steps:

[0007] Step S100: The workpiece at the material handling station is transported to the cutting station, and the workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station. The workpiece includes a film-adhesive ring, a first protective film attached to the film-adhesive ring, and a wafer attached to the first protective film. The film-cutting mechanism is set at the cutting station.

[0008] Step S200: Transfer the film-adhesive ring with the first protective film attached from the cutting station to the film-adhesive ring peeling station, and peel off the first protective film attached to the surface of the film-adhesive ring;

[0009] Step S300: Move the wafer with the first protective film attached to its first end face and the film-applying ring after peeling off the first protective film to the film-applying station. The film-applying execution mechanism at the film-applying station applies the film to the second end face of the wafer and the film-applying ring, forming a film-applied workpiece.

[0010] The wafer casting method provided in this invention has at least one of the following technical effects:

[0011] This application establishes a workstation layout on the wafer casting stage that includes material handling, dicing, film stripping, and film application. This allows the processing steps in the wafer casting process to be completed sequentially within the same wafer casting machine, reducing disordered transfer of workpieces between different processing stages and improving the continuity of process connections. Specifically, the workpiece is first transported from the material handling station to the dicing station, where a dicing mechanism separates the workpiece into a wafer with a first protective film attached to its first end face and a film stripping ring with a portion of the first protective film adhering to it. This allows the workpiece to be separated from the film stripping ring at the dicing station. Then, the film stripping ring with the first protective film adhering to it is transferred from the dicing station to the film stripping ring removal station, where the first protective film is peeled off. By removing the first protective film from the surface of the film stripping ring before film application, the film stripping ring meets the requirements for subsequent film application with the wafer, reducing the impact of residual first protective film on the surface of the film stripping ring. To mitigate the risks associated with the film application process, the wafer with the first protective film attached to its first end face and the film-applying ring after the first protective film has been peeled off are moved to the film application station. The film application execution mechanism at the film application station applies the film to the wafer and the film-applying ring, resulting in a film-applied workpiece. At this point, the diced wafer and the film-applying ring after the film peeling process meet at the film application station, and the film application process is completed by the film application execution mechanism. This achieves a continuous process flow from workpiece dicing and film peeling of the film-applying ring to film application of the wafer and the film-applying ring. By setting up a sequential flow based on the material handling station, dicing station, film peeling station, and film application station, the workpiece dicing, first protective film peeling of the film-applying ring, and film application of the wafer and the film-applying ring are continuously connected, reducing process waiting and repetitive positioning, improving the automation continuity and production efficiency of wafer casting operations, and also reducing the risk of positional displacement or contamination of the wafer and the film-applying ring during multiple transfers.

[0012] To achieve the above objectives, embodiments of the present invention provide a wafer casting machine applying the above-described wafer casting method. The wafer casting machine includes a casting table, and the casting table is provided with a material handling station, a dicing station, a film-peeling station, and a film-applying station.

[0013] The workpiece at the material handling station is transported to the cutting station, and the workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station. The workpiece includes a film-adhesive ring, a first protective film attached to the film-adhesive ring, and a wafer attached to the first protective film. The film-cutting mechanism is set at the cutting station.

[0014] The film-adhesive ring with the first protective film attached is transferred from the cutting station to the film-adhesive ring peeling station, and the first protective film attached to the surface of the film-adhesive ring is peeled off.

[0015] The wafer with the first protective film attached to its first end face and the film-applying ring after the first protective film has been peeled off are moved to the film-applying station. The film-applying execution mechanism at the film-applying station applies the film to the second end face of the wafer and the film-applying ring, forming a film-applied workpiece.

[0016] The wafer casting machine provided in this embodiment of the invention has at least one of the following technical effects:

[0017] Because the wafer casting machine uses the above-mentioned wafer casting method, it can also solve the technical problem in the prior art that different processes in wafer casting processing need to be connected and transferred manually or by independent equipment, which easily leads to long waiting time for processes, slow overall production cycle and low efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of a wafer casting method provided in an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of a wafer casting machine provided in one embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of a wafer casting machine provided in one embodiment of the present invention.

[0022] Figure 4 This is a top view of a wafer casting machine provided in one embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram of the workpiece before cutting, provided in an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the structure of the film-applying ring provided in an embodiment of the present invention.

[0025] Figure 7 This is a schematic diagram of the workpiece handling mechanism provided in an embodiment of the present invention.

[0026] Figure 8 This is a schematic diagram of the workpiece transfer mechanism provided in Embodiment 1 of the present invention.

[0027] Figure 9 This is a schematic diagram of the wafer transfer mechanism provided in Embodiment 1 of the present invention.

[0028] Figure 10 This is a schematic diagram of the wafer transfer mechanism provided in Embodiment 1 of the present invention.

[0029] Figure 11 This is a schematic diagram of the film-applying and tearing device provided in Embodiment 2 of the present invention.

[0030] Figure 12 This is a side view of the film-applying and tearing device provided in Embodiment 2 of the present invention.

[0031] Figure 13 This is a schematic diagram of the membrane clamping mechanism provided in Embodiment 2 of the present invention.

[0032] Figure 14 This is a side view of the membrane clamping mechanism provided in Embodiment 2 of the present invention.

[0033] Figure 15 This is a schematic diagram of the structure of the film-tearing platform provided in Embodiment 2 of the present invention.

[0034] Figure 16 This is a side view of the film-tearing platform provided in Embodiment 2 of the present invention.

[0035] Figure 17 This is a schematic diagram of the film-applying and tearing device provided in Embodiment 3 of the present invention.

[0036] Figure 18 This is a partial schematic diagram of the film-applying and tearing device provided in Embodiment 3 of the present invention.

[0037] Figure 19 This is a schematic diagram of the rotary degumming mechanism provided in Embodiment 3 of the present invention.

[0038] Figure 20 This is a schematic diagram of the film-applying ring flipping mechanism provided in Embodiment 3 of the present invention.

[0039] Figure 21 This is a schematic diagram of the structure of the film cutting mechanism after the outer shell is hidden, as provided in an embodiment of the present invention.

[0040] The following are the labeling elements in the figure:

[0041] 900—Molding station; 001—Material picking station; 002—Film-peeling station for film-applying ring; 003—Film-applying station; 10—Film-peeling platform; 11—Positioning mechanism; 12—Positioning unit; 13—Film-applying ring placement area; 14—Void clearance groove; 20—Film clamping mechanism; 21—First clamping member; 22—Second clamping member; 23—Transmission component; 30—Moving execution mechanism; 40—Film-clamping moving module; 50—Static elimination mechanism; 60—Rotary de-adhesive mechanism; 61—Rotation mechanism; 62—De-adhesive housing; 63—De-adhesive rotary table; 64—De-adhesive lamp; 70—Film-applying ring flipping mechanism; 71—Flipping arm; 72—Flipping mechanism; 73—Flipping clamping mechanism; A—Clamping part of the first clamping member; B—Clamping part of the second clamping member;

[0042] 100—Booth; 101—Box; 102—Handling robot; 103—Handling moving module; 104—Loading track;

[0043] 120—Positioning cylinder; 121—Positioning slide; 122—Positioning core rod;

[0044] 130—Wafer transfer mechanism; 1300—Wafer placement stage; 1301—Wafer transfer module; 1302—Cutting station; 1303—Wafer lamination station; 1304—Temporary storage station;

[0045] 140—Workpiece transfer mechanism; 1400—Transfer fixing bracket; 1401—First translation module; 1402—First lifting module; 1403—Workpiece transfer gripper; 1404—Ultrasonic dust removal mechanism;

[0046] 150—Attitude adjustment mechanism; 1500—Second gripper; 1501—Tilting drive assembly; 1502—Second lifting module;

[0047] 160—Film-applying ring tearing device; 170—Film-applying execution mechanism; 171—Film-applying unit; 172—Film-applying ring feeding mechanism; 180—Film-cutting mechanism;

[0048] 211—First clamping surface; 212—Anti-slip ridge; 221—Second clamping surface; 222—Connecting platform; 230—Sliding block; 231—First connecting rod; 232—Second connecting rod; 233—Third connecting rod;

[0049] 300—Workpiece; 301—Wafer; 302—Film-attaching ring; 303—First protective film;

[0050] 400—Debonding and transport mechanism. Detailed Implementation

[0051] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0052] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0055] In one embodiment of the present invention, such as Figures 1-6 As shown, a wafer casting method is provided, which is applied to a wafer casting machine. The wafer casting machine includes a casting table 900, which is provided with a material handling station 001, a cutting station 1302, a film-attaching and peeling station 002, and a film-attaching station 003. The method includes the following steps:

[0056] Step S100: The workpiece 300 at the material handling station 001 is transported to the cutting station 1302, and the workpiece 300 is divided into a wafer 301 with a first protective film 303 attached to its first end face and a film-adhesive ring 302 with a portion of the first protective film 303 attached by the film-cutting mechanism 180 located at the cutting station 1302. The workpiece 300 includes the film-adhesive ring 302, the first protective film 303 attached to the film-adhesive ring 302, and the wafer 301 attached to the first protective film 303. The film-cutting mechanism 180 is located at the cutting station 1302.

[0057] In step S100, for the workpiece 300, in its initial state before being transported to the cutting station 1302, the first protective film 303 is attached to the first end face of the film-applying ring 302. Since the film-applying ring 302 is annular, the first protective film 303 is exposed in the middle. The wafer 301 is attached to the first protective film 303 in the middle of the film-applying ring 302. At this time, the first end face of the wafer 301 has been covered with the first protective film 303, while the second end face is where the film needs to be applied in subsequent steps.

[0058] The dicing process refers to cutting the wafer 301 along its length. At this point, the first end face of the cut wafer 301 has a first protective film 303, while the second end face does not. The remaining portion of the first protective film 303 remains attached to the film-adhesive ring 302. Therefore, after the workpiece 300 is diced, it forms a wafer 301 with the first protective film 303 attached to its first end face and a film-adhesive ring 302 with a portion of the first protective film 303 adhered to it.

[0059] Step S200: Transfer the film-adhesive ring 302 with the first protective film 303 attached to it from the cutting station 1302 to the film-adhesive ring peeling station 002, and peel off the first protective film 303 attached to the surface of the film-adhesive ring 302.

[0060] Step S300: The wafer 301 with the first protective film 303 attached to its first end face and the film-applying ring 302 after the first protective film 303 has been peeled off are moved to the film-applying station 003. The film-applying execution mechanism 170 of the film-applying station 003 applies the film to the wafer 301 and the film-applying ring 302, and the film-applying workpiece is formed after the film is applied.

[0061] In step S300 of this embodiment, applying a protective film to the wafer 301 and the film-applying ring 302 means applying a second protective film (not shown) to the second end face of the film-applying ring 302 from top to bottom, so that the first end face of the wafer 301 in the film-applying component is covered with a first protective film 303, and the second end face of the wafer 301 is covered with a second protective film.

[0062] In this embodiment, the first end face of the wafer 301 refers to the lower end face of the wafer. The second end face of the wafer 301 refers to the upper end face of the wafer. The first end face of the film-coating ring 302 refers to the lower end face of the film-coating ring 302. The second end face of the film-coating ring 302 refers to the upper end face of the film-coating ring 302.

[0063] This application establishes a workstation layout on the wafer casting stage 900 for material handling, cutting, film application ring tearing, and film application, enabling the processing steps in the wafer casting process to be completed sequentially in the same wafer casting machine. This reduces the disorderly transfer of workpieces 300 between different processing stages and improves the continuity of process connections.

[0064] Specifically, the workpiece 300 at the material handling station 001 is first transported to the cutting station 1302, and the workpiece 300 is divided into a wafer 301 with a first protective film 303 attached to its first end face and a film-adhesive ring 302 with a portion of the first protective film 303 attached, so that the workpiece 300 completes the separation of the wafer 301 and the film-adhesive ring 302 at the cutting station 1302.

[0065] Then, the film-attached ring 302 with the first protective film 303 attached is transferred from the cutting station 1302 to the film-attached ring peeling station 002, and the first protective film 303 attached to the surface of the film-attached ring 302 is peeled off. By removing the first protective film 303 from the surface of the film-attached ring 302 before film application, the film-attached ring 302 meets the subsequent processing requirements for film application with the wafer 301, reducing the risk of affecting the film application process due to the first protective film 303 remaining on the surface of the film-attached ring 302.

[0066] Next, the wafer 301 with the first protective film 303 attached to its first end face and the film-applying ring 302 after the first protective film 303 has been peeled off are moved to the film-applying station 003. The film-applying execution mechanism 170 of the film-applying station 003 applies the film to the wafer 301 and the film-applying ring 302, forming a film-applied workpiece. At this point, the wafer 301, which has undergone dicing, and the film-applying ring 302, which has undergone film peeling, meet at the film-applying station 003, and the film-applying process is completed by the film-applying execution mechanism 170, realizing a continuous process flow from workpiece 300 dicing, film peeling of the film-applying ring 302 to film application of the wafer 301 and the film-applying ring 302.

[0067] By setting up a sequential flow between the material handling station 001, the cutting station 1302, the film peeling station 002, and the film application station 003, the workpiece 300 is divided, the protective film is peeled off the film application ring 302, and the film application process of the wafer 301 and the film application ring 302 is continuously connected. This reduces process waiting and repetitive positioning, improves the automation continuity and production efficiency of wafer casting operations, and also reduces the risk of positional displacement or contamination of the wafer 301 and the film application ring 302 during multiple transfers.

[0068] In one embodiment of the present invention, such as Figure 1 As shown, after step S300, the method further includes:

[0069] Step S400: Remove the film-coated workpiece from the film-coating station 003, and flip the film-coated workpiece over and move it into the material hopper 100 of the material picking station 001.

[0070] In this embodiment, by removing the film-coated workpiece from the film-coating station 003 and flipping it over before moving it to the hopper 100 at the material handling station 001, the film-coated workpiece is unloaded, flipped, and returned to the hopper after film coating. This ensures the film-coated workpiece returns to the hopper 100 in a preset posture, facilitating subsequent storage, transfer, or entry into the next process. This step creates a complete closed-loop process for wafer casting, from material handling, cutting, film removal, film coating to hopper return, reducing manual unloading and flipping operations and improving the automation and continuity of the wafer casting operation.

[0071] In one embodiment of the present invention, such as Figure 1 As shown, step S100: The workpiece 300 at the material handling station 001 is conveyed to the cutting station 1302, and the workpiece 300 is divided into a wafer 301 with a first protective film 303 attached to its first end face and a film-adhesive ring 302 with a portion of the first protective film 303 attached by the film-cutting mechanism 180 set at the cutting station 1302, including:

[0072] Step S110: The workpiece 300 at the material handling station 001 is transported to a wafer placement stage 1300, wherein the wafer placement stage 1300 is driven to be connected to a wafer transfer module 1300.

[0073] Step S120: The wafer transfer module 1301 drives the wafer placement stage 1300 to move the workpiece 300 to the cutting station 1302.

[0074] Step S130: The workpiece 300 is divided into a wafer 301 with a first protective film 303 attached to its first end face and a film-attached ring 302 with a portion of the first protective film 303 attached by the film-cutting mechanism 180 set at the cutting station 1302.

[0075] In this embodiment, the workpiece 300 at the picking station 001 is transported to the wafer placement stage 1300 by the workpiece transfer mechanism 140. Then, the wafer transfer module 1301 drives the wafer placement stage 1300 to move the workpiece 300 to the dicing station 1302. The cutting mechanism 180 at the dicing station 1302 divides the workpiece 300 into a wafer 301 with a first protective film 303 attached to its first end face and a film-attached ring 302 with a portion of the first protective film 303 attached. This arrangement ensures that the workpiece 300 is first stably supported on the wafer placement stage 1300 and then moves with the wafer placement stage 1300 to the dicing station 1302 for cutting. This improves the stability of the workpiece 300 during transfer and pre-cutting positioning and reduces the risk of workpiece 300 shifting during the transfer to the dicing station 1302.

[0076] In one embodiment of the present invention, such as Figure 1 As shown, step S200: The film-adhesive ring 302 with the first protective film 303 adhering to it is transferred from the cutting station 1302 to the film-adhesive ring peeling station 002, and the first protective film 303 adhering to the surface of the film-adhesive ring 302 is peeled off by the film-adhesive ring peeling device 160 of the film-adhesive ring peeling station 002; including:

[0077] Step S210: The film-attaching ring 302 with the first protective film 303 attached is transported from the wafer placement stage 1300 to the film-attaching ring tearing station 002 by the workpiece transfer mechanism 140.

[0078] Step S220: The first protective film 303 attached to the surface of the film-applying ring 302 is UV de-adhesive-treated by the film-applying ring tearing device 160 set at the film-applying ring tearing station 002, and the first protective film peeling 303 is peeled off after de-adhesion.

[0079] In this embodiment, the workpiece transfer mechanism 140 transports the film-attached ring 302 with the first protective film 303 attached from the wafer placement stage 1300 to the film-attached ring peeling station 002. The film-attached ring peeling device 160, located at the film-attached ring peeling station 002, performs UV de-adhesion on the first protective film 303 attached to the surface of the film-attached ring 302. After de-adhesion, the first protective film peeling device 160 is peeled off. This allows the film-attached ring 302 requiring peeling to be transferred separately to the film-attached ring peeling station 002 after the workpiece 300 is cut, avoiding the first protective film 303 remaining on the surface of the film-attached ring 302 from affecting subsequent film application. At the same time, by concentrating the peeling action of the film-attached ring 302 at the film-attached ring peeling station 002, the peeling process of the first protective film 303 on the film-attached ring 302 does not require migration, thus improving the peeling stability.

[0080] In one embodiment of the present invention, such as Figure 1As shown, step S220: The first protective film 303 attached to the surface of the film-applying ring 302 is UV de-adhesive-treated by the film-applying ring peeling device 160 set at the film-applying ring peeling station 002, and the first protective film peeling 303 is peeled off after de-adhesion, including:

[0081] Step S221: The first protective film 303 attached to the surface of the film-applying ring 302 is removed by the rotary adhesive removal mechanism in the film-applying ring tearing device 160 located at the film-applying ring tearing station 002;

[0082] Step S222: The film-applying ring peeling device peels off the first protective film 303 after the adhesive has been removed.

[0083] In this embodiment, by first removing the adhesive and then peeling off the film, the normal peeling of the film is ensured, and problems such as incomplete peeling or film residue caused by not removing the adhesive are avoided.

[0084] In one embodiment of the present invention, such as Figure 1 As shown, step S221: The first protective film 303 attached to the surface of the film-applying ring 302 is removed by the rotary adhesive-removing mechanism in the film-applying ring tearing device 160 located at the film-applying ring tearing station 002, including:

[0085] Step S2211: The film ring 302 is flipped in the reverse direction by the film ring flipping mechanism 70 in the film ring tearing device 160 set in the film ring tearing station 002;

[0086] Step S2212: The rotary adhesive removal mechanism 60 in the film-applying ring tearing device 160 removes the adhesive from the reversed film-applying ring 302 to remove the first protective film 303 attached to the surface of the film-applying ring 302.

[0087] In this embodiment, the film-applying ring 302 is first flipped in the reverse direction by the film-applying ring flipping mechanism 70 in the film-applying ring tearing device 160, so that the side of the film-applying ring 302 with the first protective film 303 attached is adjusted to a position suitable for the adhesive removal mechanism 60 to remove the adhesive; then, the adhesive removal mechanism 60 removes the adhesive from the flipped film-applying ring 302, so as to weaken the adhesion between the first protective film 303 and the film-applying ring 302.

[0088] With the above configuration, the film-applying ring flipping mechanism 70 can adjust the posture of the film-applying ring 302 before de-adhesion, ensuring that the first protective film 303 is within the effective range of the rotary de-adhesion mechanism 60. This avoids the problem of the rotary de-adhesion mechanism 60 being unable to stably act on the first protective film 303 due to inconsistent orientation of the film-applying ring 302. When the rotary de-adhesion mechanism 60 de-adheses the flipped film-applying ring 302, it can apply a relatively uniform de-adhesion action to the first protective film 303 along the annular surface of the film-applying ring 302, gradually loosening the adhesion interface between the first protective film 303 and the film-applying ring 302.

[0089] Therefore, the tearing resistance required for the first protective film 303 during the subsequent tearing process is reduced, which can reduce the occurrence of breakage, residue, local unremoved adhesive, and damage to the surface of the film-applying ring 302. This improves the stability and success rate of the film-applying ring tearing device 160 in tearing the film-applying ring 302, and can also improve the automated continuous operation efficiency of the film-applying ring tearing station 002.

[0090] In one embodiment of the present invention, step S221: the first protective film 303 attached to the surface of the film-applying ring 302 is removed by the rotary adhesive-removing mechanism 60 in the film-applying ring tearing device 160 disposed at the film-applying ring tearing station 002; including:

[0091] Step S2211: The film ring 302 is flipped in the reverse direction by the film ring flipping mechanism 70 in the film ring tearing device 160 set in the film ring tearing station 002;

[0092] Step S2212: The rotary adhesive removal mechanism 60 in the film-applying ring tearing device 160 removes the adhesive from the reversed film-applying ring 302 to remove the first protective film 303 attached to the surface of the film-applying ring 302.

[0093] In this embodiment, through the above steps S221, S2211 and S2212, when the film-applying ring tearing device 160 removes the adhesive from the first protective film 303 on the surface of the film-applying ring 302, it does not directly tear the film-applying ring 302. Instead, it first flips the film-applying ring 302 in the reverse direction through the film-applying ring flipping mechanism 70 in the film-applying ring tearing device 160 located at the film-applying ring tearing station 002, and then removes the adhesive from the flipped film-applying ring 302 through the rotating adhesive removal mechanism 60.

[0094] Specifically, in step S2211, after the film-applying ring flipping mechanism 70 flips the film-applying ring 302 in the opposite direction, it can adjust the side of the film-applying ring 302 with the first protective film 303 attached to it to the position corresponding to the rotary adhesive removal mechanism 60. This facilitates the rotary adhesive removal mechanism 60 to stably act on the first protective film 303, avoiding the problem that the rotary adhesive removal mechanism 60 cannot effectively contact the first protective film 303 due to the inaccurate posture of the film-applying ring 302, or that the adhesive removal position is offset.

[0095] In step S2212, the rotating adhesive removal mechanism 60 removes the adhesive from the reversed film-applying ring 302. This process applies a continuous and uniform adhesive removal action to the first protective film 303 along the annular surface of the film-applying ring 302, gradually loosening the adhesion interface between the first protective film 303 and the film-applying ring 302, thereby reducing the adhesion force between them. Compared to directly tearing off the first protective film 303, this adhesive removal method reduces the likelihood of the first protective film 303 breaking, curling, leaving residue, or being partially unremoved during the tearing process, while also reducing the risk of damage to the surface of the film-applying ring 302.

[0096] Therefore, step S221, through the cooperation of the film-applying ring flipping mechanism 70 and the rotating adhesive-removing mechanism 60, achieves a continuous connection between the posture adjustment of the film-applying ring 302 and the adhesive-removing action of the first protective film 303. This not only improves the adhesive-removing stability and integrity of the first protective film 303, but also reduces the subsequent film-tearing resistance, thereby increasing the film-tearing success rate and automated continuous operation efficiency of the film-applying ring tearing device 160 at the film-applying ring tearing station 002.

[0097] In one embodiment of the present invention, such as Figure 1 As shown, step S300: The wafer 301 with the first protective film 303 attached to its first end face and the film-applying ring 302 after the first protective film 303 has been peeled off are moved to the film-applying station 003, and the film-applying execution mechanism 170 of the film-applying station 003 applies film to the wafer 301 and the film-applying ring 302, including:

[0098] Step S310: The wafer 301 with the first protective film 303 attached to the first end face is moved to the film application station 003 by the wafer transfer module 1301 driving the wafer placement stage 1300.

[0099] Step S320: The film-applying ring 302, which has completed the first protective film 303 peeling process, is placed on the wafer placement stage 1300 at the film-applying station 003 by the film-applying ring feeding mechanism 172 of the film-applying execution mechanism 170.

[0100] Step S330: The wafer 301 and the film-applying ring 302 are applied with film by the film-applying execution mechanism 170 set at the film-applying station 003, and a film-applying workpiece is formed after film application.

[0101] In this embodiment, the wafer transfer module 1301 drives the wafer placement stage 1300 to move the wafer 301 with the first protective film 303 attached to its first end face to the film application station 003. The film application execution mechanism 170 places the film application ring 302, which has completed the first protective film 303 peeling process, onto the wafer placement stage 1300 at the film application station 003. Then, the film application execution mechanism 170 applies film to the wafer 301 and the film application ring 302, so that the wafer 301 and the film application ring 302, which has completed the film peeling process, are reassembled at the film application station 003 and the film application process is completed at the same film application station 003. This reduces the repeated transfer and repositioning of the wafer 301 and the film application ring 302 before film application and improves the connection efficiency of the re-film application of the wafer 301 and the film application ring 302.

[0102] In one embodiment of the present invention, such as Figure 1 As shown, step S110: transporting the workpiece 300 from the material handling station 001 to a wafer placement stage 1300 includes:

[0103] Step S111: Drive the picking robot 102 to move towards the material box 101 via the picking moving module 103 of the material bin 100;

[0104] Step S112: The workpiece 300 is removed from the material box 101 by the material handling robot 102;

[0105] Step S113: Drive the picking robot 102 to move away from the material box 101 through the picking moving module 103, and transport the workpiece 300 to the wafer placement stage 1300 through the workpiece transfer mechanism 140.

[0106] In this embodiment, the material handling robot 102 is driven by the material handling moving module 103 of the material bin 100 to approach the material box 101. The material handling robot 102 takes the workpiece 300 out of the material box 101. Then, the material handling moving module 103 drives the material handling robot 102 away from the material box 101 and places the workpiece 300 on two parallel support rails 104. Subsequently, the workpiece transfer mechanism 140 transports the workpiece 300 located on the support rails 104 to the wafer placement stage 1300. This realizes a continuous material handling process of taking the workpiece 300 out of the material box 101, temporarily placing it on the support rails 104, and transporting it to the wafer placement stage 1300. The two parallel support rails 104 can provide stable support for the workpiece 300, reduce the risk of shaking and displacement of the workpiece 300 during the taking out and transfer process, and improve the stability of the material handling and loading process.

[0107] In one embodiment of the present invention, such as Figure 1 As shown, a wafer casting machine applying the above-mentioned wafer casting method is also provided. The wafer casting machine includes a casting table 900, which is provided with a material picking station 001, a cutting station 1302, a film-attaching ring tearing station 002 and a film-attaching station 003.

[0108] The workpiece 300 at the material handling station 001 is transported to the cutting station 1302, and the workpiece 300 is divided into a wafer 301 with a first protective film 303 attached to its first end face and a film-adhesive ring 302 with a portion of the first protective film 303 attached by the film-cutting mechanism 180 located at the cutting station 1302. The workpiece 300 includes the film-adhesive ring 302, the first protective film 303 attached to the film-adhesive ring 302, and the wafer 301 attached to the first protective film 303. The film-cutting mechanism 180 is located at the cutting station 1302.

[0109] The film-adhesive ring 302 with the first protective film 303 attached is transferred from the cutting station 1302 to the film-adhesive ring peeling station 002, and the first protective film 303 attached to the surface of the film-adhesive ring 302 is peeled off.

[0110] The wafer 301 with the first protective film 303 attached to its first end face and the film-applying ring 302 after the first protective film 303 has been peeled off are moved to the film-applying station 003. The film-applying execution mechanism 170 of the film-applying station 003 applies the film to the wafer 301 and the film-applying ring 302, and the film-applying workpiece is formed after the film is applied.

[0111] In this embodiment, by centrally arranging the material handling, cutting, film application and tearing, and film application processes in the wafer casting process on the casting table 900 of the same wafer casting machine, the workpiece 300 is sequentially transferred between each station, reducing intermediate transfer and waiting time between dispersed equipment, and improving the integration and process continuity of the wafer casting equipment.

[0112] In one embodiment, such as Figures 2-9As shown, the wafer casting machine includes a hopper 100, a wafer transfer mechanism 130, a workpiece transfer mechanism 140, a film-peeling ring device 160, and a film-applying execution mechanism 170. The hopper 100 is used to store workpieces 300. The wafer transfer mechanism 130 is located on the first side of the hopper 100; the wafer transfer mechanism 130 includes a wafer placement stage 1300 and a wafer transfer module 1301; the wafer transfer module 1301 drives the wafer placement stage 1300 to reciprocate between a dicing station 1302 and a film-applying station 1303; the dicing station 1302 is provided with a cutting mechanism 180 for dividing the workpiece 300 into wafers 301 and film-applying rings 302; the film-peeling ring device 160 is located on the second side of the hopper 100, and the film-peeling ring device 160 is used to peel off the first protective film 303 attached to the surface of the film-applying ring 302.

[0113] The workpiece transfer mechanism 140 is used to transport the workpiece 300 in the hopper to the wafer placement stage 1300 in the forward direction, and to transport the film-applying ring 302 placed on the wafer placement stage 1300 to the film-applying ring tearing device 160 in the reverse direction.

[0114] The film application execution mechanism 170 includes a film application unit 171 and a film application ring feeding mechanism 172; the film application ring feeding mechanism 172 is located on one side of the film application ring peeling device 160 for placing the film application ring 302, which has completed the first protective film 303 peeling process, on the wafer placement stage 1300 at the film application station 1303; the film application unit 171 is located at the film application station 1303 for simultaneously applying film to the combined wafer 302 and the film application ring 302.

[0115] Specifically, the entire process of a wafer casting machine is divided into three steps: workpiece separation, film application ring peeling, and wafer re-coating, as follows:

[0116] Workpiece separation process: The workpiece transfer mechanism 140 transports the workpiece 300 from the hopper 100 forward to the wafer placement stage 1300. The film cutting mechanism 180 divides the workpiece 300 into wafers 301 and film-attaching rings 302, as follows: Figure 18 and Figure 19 As shown;

[0117] Film-applying ring peeling process: The workpiece transfer mechanism 140 transports the film-applying ring 302 placed on the wafer placement stage 1300 in the reverse direction to the film-applying ring peeling device 160, while the wafer 301 remains on the wafer placement stage 1300. The wafer transfer module 1301 drives the wafer placement stage 1300 to move to the film-applying station 1303 to wait for film application; at the same time, the film-applying ring peeling device 160 clamps the film-applying ring 302 and peels off the first protective film 303 on the film-applying ring 302.

[0118] Wafer re-coating process: The film-coating ring feeding mechanism 172 places the peeled film-coating ring 302 on the wafer placement stage 1300 at the film-coating station 1303, so that the film-coating ring 302 and the wafer 301 are merged again. The film-coating execution mechanism 170 performs film-coating processing on the film-coating ring 302 and the wafer 301 on the wafer placement stage 1300.

[0119] In this embodiment of the invention, the wafer casting machine can realize the integrated design of fully automated operation, integrating various functional mechanisms into one, reducing the space occupied by the equipment, and the layout between the various components is reasonable and efficient. The workpiece transfer mechanism 140 realizes the bidirectional linkage of forward conveying of workpieces and reverse conveying of film-coating ring. The wafer transfer module 1301 drives the wafer placement stage 1300 to move back and forth between the dicing station 1302 and the film-coating station 1303, which can shorten the material transfer path, solve the drawbacks of poor process connection and low production efficiency of traditional equipment, improve the overall production efficiency, and adapt to the needs of large-scale production.

[0120] In embodiments of the present invention, such as Figures 7-8 As shown, the wafer casting machine's hopper 100 includes a material box 101, a material handling robot 102, a material handling moving module 103, and two parallel carrying tracks 104. The support track 104 is located on one side of the discharge area of ​​the material box 101 for placing the workpiece 300. Compared with a single support structure, the support track 104 can provide a stable support carrier for the workpiece 300 and the film-coating ring 302, ensuring the stability of the material during conveying and transfer. It can also avoid problems such as wafer 301 displacement and film-coating ring 302 deformation caused by uneven support surface or uneven force. The picking robot 102 is located on the upper side of the support track 104, and the picking moving module 103 is located on the outer side of the support track 104. The picking moving module 103 is connected to the picking robot 102 and is used to drive the picking robot 102 to move closer to or away from the material box 101. The spatial layout is reasonable, avoids structural interference, improves equipment integration, and can make full use of the longitudinal and lateral free space of the equipment. This staggered layout can effectively compress the overall layout space of the equipment.

[0121] In embodiments of the present invention, such as Figures 7-8As shown, the attitude adjustment mechanism 150 of the wafer casting machine is located on the third side of the hopper 100. The attitude adjustment mechanism 150 includes a second gripper 1500, a flipping drive assembly 1501, and a second lifting module 1502. The second lifting module 1502 is driven by the flipping drive assembly 1501 and is used to drive the flipping drive assembly 1501 to move up and down. The flipping drive assembly 1501 is driven by the second gripper 1500 and is used to drive the second gripper 1500 to rotate. It should be understood that the attitude adjustment mechanism 150 is used to flip the workpiece 300 placed on the bearing rail 104. The second lifting module 1502 is driven by the flipping drive assembly 1501 and can drive the flipping drive assembly 1501 and the second gripper 1500 to move up and down. It can flexibly adapt to the placement height of the workpiece 300 on the bearing rail 104, ensuring that the second gripper 1500 can accurately clamp the workpiece 300 on the bearing rail 104, avoiding slippage or displacement during clamping, and ensuring clamping stability. The second gripper 1500 is located between the two bearing rails 104, and is precisely adapted to the layout design of the dual bearing rails 104. It makes full use of the reserved space between the dual rails, further optimizes the compactness of the equipment mechanism layout, ensures the stability of independent operation and collaborative work of each mechanism, and shortens the material transfer path of the attitude adjustment mechanism 150. The attitude adjustment can be completed without additional transfer, thus improving process efficiency. After the wafer re-lamination process is completed, the wafer transfer module 1301 drives the wafer placement stage 1300 to move from the lamination station 1303 to the dicing station 1302, causing the wafer placement stage 1300 to leave the lamination unit 171. The workpiece transfer mechanism 140 transports the lamination-laden workpiece 300 to the carrying track 104. Before the second gripper 1500 picks up the workpiece 300, the material handling module 103 drives the material handling robot 102 to move towards the material box 101 to avoid interference from the material handling robot 102. The second lifting module 1502 drives the flipping drive assembly 1501 to move downward, thereby driving the second gripper 1500 to move downward. After reaching the predetermined low position, the second gripper... Hand 1500 begins to grasp workpiece 300. Subsequently, the second lifting module 1502 drives the flipping drive component 1501 to move upward, thereby driving the second gripper 1500 to move upward. After reaching the preset high point, the flipping drive component 1501 drives the second gripper 1500 to rotate 180 degrees, and the workpiece 300 rotates 180 degrees synchronously. After the workpiece 300 is flipped, the second lifting module 1502 drives the flipping drive component 1501 to move downward to reset, so that the workpiece 300 is placed back on the bearing rail 104. The second gripper 1500 releases the workpiece 300, and the second lifting module 1502 drives the flipping drive component 1501 to move upward to reset the second gripper 1500.

[0122] In embodiments of the present invention, such as Figures 9-10As shown, a temporary storage station 1304 is provided between the dicing station 1302 and the film-applying station 1303 of the wafer casting machine. The wafer transfer module 1301 drives the wafer placement stage 1300 to move between the dicing station 1302, the temporary storage station 1304, and the film-applying station 1303. Specifically, the temporary storage station 1304 is added between the dicing station 1302 and the film-applying station 1303, and the wafer transfer module 1301 drives the wafer placement stage 1300 to move between the dicing station 1302, the temporary storage station 1304, and the film-applying station 1303, realizing the connection of dicing, dust removal, and film-applying processes. This solves the problem of dust and debris residue generated during the process of workpiece 300 being diced. The addition of the temporary storage station 1304 can perform targeted dust removal treatment on the diced wafer 301, ensuring the cleanliness of the wafer 301 surface and providing a clean basis for the subsequent film-applying process. In the workpiece separation process, the temporary storage station 1304 is located at the forward end of the workpiece transfer mechanism 140. The workpiece transfer mechanism 140 transports the workpiece 300 forward and places it on the wafer placement stage 1300 at the temporary storage station 1304. The wafer transfer module 1301 then drives the wafer placement stage 1300 from the temporary storage station 1304 to the dicing station 1302 for dicing. After the workpiece 300 is diced into a wafer 301 and a film-coating ring 302, the wafer transfer module 1301 drives the wafer placement stage 1300 back to the temporary storage station 1304 to wait for dust removal. After the dust removal is completed, the workpiece transfer mechanism 140 transports the film-coating ring in the reverse direction to the carrying track 104. The wafer transfer module 1301 then drives the wafer placement stage 1300 to the film-coating station 1303.

[0123] Among them, such as Figure 8 As shown, the workpiece transfer mechanism 140 includes a transfer fixing bracket 1400, a first translation module 1401, a first lifting module 1402, a workpiece transfer gripper 1403, and an ultrasonic dust removal mechanism 1404. The first translation module 1401 is mounted on the transfer fixing bracket 1400. The first translation module 1401 and the first lifting module 1402 are connected by a transmission and are used to drive the first lifting module 1402 to move horizontally. The first lifting module 1402 and the workpiece transfer gripper 1403 are connected by a transmission and are used to drive the workpiece transfer gripper 1403 to move vertically. The ultrasonic dust removal mechanism 1404 is fixedly mounted on the transfer fixing bracket 1400 and located on the upper side of the temporary storage station 1304. The layout design is reasonable, optimizes the compactness of the equipment mechanism layout, and realizes the coordinated linkage of transportation and dust removal.

[0124] Example 2

[0125] In embodiments of the present invention, such as Figures 9-20As shown, the film-applying ring 302 formed after the film-cutting process in Embodiment 1 has an annular structure, and its surface is covered with a first protective film 303. An appropriate allowance is reserved in the inner ring of the first protective film 303, and this allowance extends beyond the inner ring of the film-applying ring 302. Thus, as... Figures 1-8 As shown, the film-peeling device 160 of the wafer casting machine includes a film-peeling platform 10, a film-clamping mechanism 20, and a moving actuator 30. The function of the film-peeling device 160 is to completely peel the annular first protective film 303 from the film-applying ring 302, achieving separation between the two. Figure 6 As shown.

[0126] The film-peeling platform 10 is equipped with a positioning mechanism 11 for positioning the film-applying ring.

[0127] The film clamping mechanism 20 includes a first clamp 21, a second clamp 22, and a transmission member 23 for driving the first clamp 21 to flip. Driven by the transmission member 23, the first clamp 21 flips, and its clamping portion A moves to the lower side of the clamping portion B of the second clamp 22 to form an upper and lower clamping structure, thereby clamping the first protective film 303 of the film-adhesive ring 302. Compared to existing clamping methods, the upper and lower clamping structure can form an effective clamping force on the inner ring of the first protective film 303, significantly increasing the clamping contact area. This effectively overcomes the adhesion between the first protective film 303 and the film-adhesive ring 302, as well as the instantaneous tension during the film-tearing process, preventing slippage due to insufficient clamping force and greatly reducing the problem of the first protective film 303 falling off due to improper clamping.

[0128] The mobile actuator 30 drives the film-tearing platform 10 to move along a preset trajectory, causing relative motion between the film-tearing platform 10 and the film-clamping mechanism 20 to complete the film tearing. The film-clamping mechanism 20 clamps the inner ring of the first protective film 303 through an upper and lower clamping structure formed between the first clamp 21 and the second clamp 22. Subsequently, the mobile actuator 30 drives the film-tearing platform 10 to move, generating relative motion between the film-tearing platform 10 and the film-clamping mechanism 20, thereby causing the first protective film 303 to peel off from the film-applying ring 302 on the film-tearing platform 10.

[0129] In this embodiment, as Figures 2-6 As shown, when the mobile actuator 30 drives the film-tearing platform 10 to move along a preset trajectory, the preset trajectory is the horizontal movement of the film-tearing platform 10 driven by the mobile actuator 30.

[0130] In this embodiment of the invention, the provided film-applying ring tearing device 160, through the coordinated linkage of the tearing platform 10, the film clamping mechanism 20 and the moving execution mechanism 30, forms an integrated operation process of positioning, clamping and tearing, which accurately solves the core pain point of the first protective film 303 being easy to fall off when being torn off in the prior art. The clamping stability is achieved through the upper and lower clamping structure of the film clamping mechanism 20, which effectively improves the smoothness of tearing and comprehensively improves the processing efficiency and yield.

[0131] In embodiments of the present invention, such as Figures 13-14 As shown, the first end of the first clamp 21 of the film-applying and tearing device 160 is rotatably connected to the second clamp 22. The second end of the first clamp 21 is bent towards the second clamp 22 to form a clamp. The clamping part A of the first clamp 21 has a first clamping surface 211 for engaging with the clamping part B of the second clamp 22. The first clamping surface 211 is provided to increase the contact area with the first protective film 303. The increased contact area of ​​the first clamping surface 211 can effectively disperse the clamping force, avoid excessive local pressure that could cause the first protective film 303 to tear, and at the same time increase the friction between the clamp and the first protective film 303, effectively overcoming the slippage risk caused by the smooth surface of the first protective film 303. Structurally, it avoids the problems of loose clamping and slippage, and significantly improves clamping stability.

[0132] In embodiments of the present invention, such as Figures 13-14 As shown, the clamping part B of the second clamp 22 of the film-applying and tearing device 160 has a second clamping surface 221 adapted to the first clamping surface 211, and the second clamping surface 221 is planar. Multiple anti-slip protrusions 212 are evenly arranged on the first clamping surface 211. The anti-slip protrusions 212 significantly increase friction, greatly reducing the risk of the first protective film 303 slipping off. The multiple anti-slip protrusions 212 evenly arranged on the first clamping surface 211 can further increase the friction between the first protective film 303 and the first protective film 303 based on the original contact area of ​​the first clamping surface 211, effectively compensating for the slippage problem caused by the smooth surface of the first protective film 303. The second clamping surface 221 and the anti-slip protrusion 212 work together to enhance clamping reliability and adapt to clamping needs in multiple scenarios: the full fit of the planar second clamping surface 221, together with the anti-slip and resistance-increasing effect of the anti-slip protrusion 212, not only ensures the stability of the clamping posture, but also improves the clamping firmness. This allows the film clamping mechanism 20 to stably adapt to the first protective film 303 with different surface characteristics (smooth, with anti-static coating) and different textures (thin, low toughness), further improving the adaptability and clamping reliability of the film clamping mechanism 20, and laying the foundation for smooth film removal in the future.

[0133] In embodiments of the present invention, such as Figures 13-14As shown, the second clamp 22 of the film-applying and tearing device 160 has a connecting platform 222 in the middle area of ​​its front side. The lower end of the front side of the second clamp 22 is bent forward to form a clamping part B. The first end of the first clamp 21 is rotatably connected to the connecting platform 222, and the second end of the first clamp 21 is arranged in an L-shape. The front side of the second clamp 22 adopts a partitioned design with a middle connection and a lower clamping. The connecting platform 222 in the middle area is specifically used to achieve a rotatable connection with the first clamp 21, providing a stable installation support point for the flipping action of the first clamp 21. The lower end is bent forward to form the clamping part B. The structure is simple and can accurately cooperate with the first clamp 21 to form an upper and lower clamping structure, realizing stable clamping of the first protective film 303. The connection and clamping functions do not interfere with each other and are compatible. The lower end of the second clamp 22, which bends forward, can naturally form a height difference with the first clamp 21, making it easy for the first clamp 21 to be flipped over and fit against it, adapting to the clamping posture of the upper and lower clamps. At the same time, the bending structure can enhance the structural strength of the clamping part B, prevent deformation during the clamping process, and ensure clamping stability.

[0134] Specifically, the first clamp 21 is provided with an air blowing hole, which is not shown in the figure. The air blowing hole is used to blow airflow onto the waste film to blow the waste film away from the anti-slip protrusion 212, thereby preventing the waste film from adhering to the anti-slip protrusion 212. The air blowing hole is connected to an air blowing device through an air pipe. After the air blowing device is activated, the airflow can be blown out through the air blowing hole. The air blowing hole is located on the inner wall of the first clamp 21.

[0135] In embodiments of the present invention, such as Figures 13-14As shown, the transmission component 23 of the film-applying and tearing device 160 includes a sliding block 230, a first connecting rod 231, a second connecting rod 232, and a third connecting rod 233. The sliding block 230 is slidably connected to the upper end of the front side of the second clamp 22 and can slide up and down along the front side of the second clamp 22. The first end of the first connecting rod 231 is rotatably connected to the sliding block 230, and the second end of the first connecting rod 231 is rotatably connected to the first end of the second connecting rod 232. The second end of the second connecting rod 232 is rotatably connected to the lower end of the second clamp 22, forming a stable rotation support point. The first end of the third connecting rod 233 is rotatably connected to the second connecting rod 232, and its rotation axis is located near the first end of the second connecting rod 232. The second end of the third connecting rod 233 is rotatably connected between the first end and the second end of the first clamp 21. The sliding block 230 slides along the front side of the second clamp 22, causing the first connecting rod 231 to rotate. The first connecting rod 231 further drives the second connecting rod 232 to rotate around the rotation point between itself and the lower end of the second clamp 22. When the second connecting rod 232 rotates, it simultaneously drives the third connecting rod 233 to move. Finally, the third connecting rod 233 drives the first clamp 21 to flip, realizing the clamping and opening action between the first clamp 21 and the second clamp 22. The transmission component 23 adopts a multi-link linkage structure, which smoothly transforms the linear sliding of the sliding block 230 into the flipping motion of the first clamp 21. During the transmission process, the force is uniform and there is no obvious jerking. It can accurately control the flipping speed and angle of the first clamp 21, ensuring the consistency of the clamping posture.

[0136] In embodiments of the present invention, such as Figures 11-12 As shown, the film-peeling device 160 also includes a film-clamping moving module 40. The film-clamping moving module 40 is connected to the film-clamping mechanism 20 and is used to drive the film-clamping mechanism 20 to move along a preset trajectory; wherein, the preset trajectory of the film-clamping mechanism 20 intersects with the preset trajectory of the film-peeling platform 10. The film-clamping mechanism 20 and the film-peeling platform 10 move simultaneously to perform the film-peeling action, significantly improving the film-peeling efficiency: compared to the traditional single-motion mode, the film-clamping moving module 40 drives the film-clamping mechanism 20 and the film-peeling platform 10 to move simultaneously along the intersecting trajectory, which can significantly increase the relative speed of the two and shorten the time for a single film peeling; at the same time, the design of the intersecting trajectory allows the first protective film 303 to achieve "bidirectional traction peeling" from the surface of the film-clamping ring 302, avoiding excessively long film-peeling cycles caused by unidirectional traction. In this embodiment, as... Figure 2 As shown, when the film clamping moving module 40 drives the film clamping mechanism 20 to move along a preset trajectory, the preset trajectory is the vertical movement of the film clamping mechanism 20 driven by the film clamping moving module 40.

[0137] In embodiments of the present invention, such as Figures 15-16As shown, the positioning mechanism 11 of the film-applying ring tearing device 160 includes multiple positioning units 12, which are arranged around the film-tearing platform 10. Each positioning unit 12 includes a positioning cylinder 120, a positioning slide 121, and a positioning core rod 122. The positioning slide 121 is slidably connected to the film-tearing platform 10, and the positioning core rod 122 is mounted on the positioning slide 121 and used to abut against the outer periphery of the film-applying ring 302. The piston part of the positioning cylinder 120 is connected to the positioning slide 121 and used to drive the positioning slide 121 to move towards or away from the film-tearing platform 10. Firstly, the positioning mechanism 11 can simultaneously abut and position the film-applying ring 302 from multiple directions around its outer periphery. Compared to single-direction positioning, the positioning stability is significantly improved, effectively preventing the film-applying ring 302 from shifting or misaligning during the film-removing process due to traction, electrostatic adsorption, etc., ensuring that the film-applying ring 302 is always in the preset film-removing position. Secondly, the positioning mechanism 11 is adaptable to film-applying rings 302 of various sizes, improving the versatility of the component: the positioning cylinder 120 can drive the positioning slide 121 to flexibly adjust the distance between the positioning core rod 122 and the center of the film-removing platform 10, thereby adapting to the positioning requirements of film-applying rings 302 of different diameters. There is no need to replace the positioning components; adaptation can be completed simply by adjusting the stroke of the positioning cylinder 120, greatly improving the versatility of the component.

[0138] In embodiments of the present invention, such as Figure 15 As shown, the top surface of the film-peeling platform 10 of the film-applying ring tearing device 160 is provided with a film-applying ring placement area 13, and a clearance groove 14 is provided in the middle of the film-applying ring placement area 13 for the film clamping mechanism 20 to extend into. The clearance groove 14 is provided in the middle of the film-applying ring placement area 13, which allows the film clamping mechanism 20 to smoothly extend into the inner ring of the film-applying ring 302, and avoids the top surface of the film-peeling platform 10 from blocking the contact between the film clamping mechanism 20 and the inner ring of the first protective film 303. This effectively solves the problem of the film clamping mechanism 20 being difficult to extend into and interfering with the platform caused by the lack of clearance structure in the traditional film-peeling platform 10.

[0139] In this embodiment of the invention, the film-applying ring placement area 13 of the film-applying ring tearing device 160 has a vacuum suction structure for adhering the film-applying ring 302 tightly. The vacuum suction structure consists of pores evenly arranged in the film-applying ring placement area 13. The pores are also connected by a vacuum pump to generate negative pressure. The vacuum suction structure uses negative pressure to tightly adsorb the film-applying ring 302 onto the film-applying ring placement area 13. The uniform adsorption force allows the bottom surface of the film-applying ring 302 to fully adhere to the film-applying ring placement area 13, further improving the stability of the placement posture of the film-applying ring 302.

[0140] In this embodiment of the invention, the film-applying ring tearing device 160 further includes an antistatic mechanism 50, which can remove static electricity generated during the film tearing process. The antistatic mechanism 50 is located on one side of the film clamping mechanism 20 and is positioned within a preset trajectory of the film tearing platform 10. The antistatic mechanism 50 can simultaneously perform antistatic processing during the movement of the film tearing platform 10 and the clamping and traction of the film clamping mechanism 20, without interfering with the film clamping moving module 40, the film tearing platform 10, the positioning mechanism 11, etc., further improving processing efficiency. It should be understood that the working principle and structure of the antistatic mechanism 50 are well known to those skilled in the art, and this embodiment will not elaborate further.

[0141] Example 3

[0142] In this embodiment of the invention, the difference from Embodiment 2 is as follows: Figures 17-20 As shown, the film-applying ring tearing device 160 also includes a rotary adhesive-removing mechanism 60 and an adhesive-removing and conveying mechanism 400.

[0143] A rotary de-adhesion mechanism 60 is located on one side of the film-peeling platform 10. The rotary de-adhesion mechanism 60 includes a rotary mechanism 61, a de-adhesion housing 62, a de-adhesion rotary table 63 located inside the de-adhesion housing 62, and a de-adhesion lamp 64. The rotary mechanism 61 is connected to the de-adhesion rotary table 63 and is used to drive the de-adhesion rotary table 63 to rotate. The de-adhesion lamp 64 is located on the upper side of the de-adhesion rotary table 63. After the de-adhesion lamp 64 is activated, the rotary mechanism 61 drives the de-adhesion rotary table 63 to rotate, thereby realizing rotary de-adhesion processing. During the de-adhesion process, the rotary mechanism 61 drives the de-adhesion rotary table 63 to rotate continuously, so that the film-applying ring is heated and exposed to light evenly, avoiding the problem of incomplete de-adhesion in some areas.

[0144] Specifically, the degumming machine housing 62 includes a UV degumming lower cover, a UV degumming upper cover, and an upper cover flipping mechanism; the UV degumming upper cover is placed on the upper side of the UV degumming lower cover, so that a sealed cavity is formed between the UV degumming upper cover and the UV degumming lower cover, and the degumming rotary table 63 and the degumming lamp 64 are placed in the sealed cavity; the upper cover flipping mechanism is connected to the UV degumming upper cover and is used to drive the UV degumming upper cover to move upward. The upper cover flipping mechanism can drive the UV degumming upper cover to open and close automatically without manual disassembly of the housing, which facilitates the loading and unloading of film-coated ring materials.

[0145] The adhesive removal and transport mechanism 400 is used to transport the film-applying ring 302 placed on the adhesive removal rotary table 63 to the film-peeling platform 10. After the adhesive removal process of the film-applying ring 302 is completed, the adhesive removal and transport mechanism 400 transports the film-applying ring 302 to the film-peeling platform 10. This embodiment can realize the automatic transfer from the adhesive removal station to the film-peeling platform 10, and the entire process can be continuously automated, reducing process downtime and manual operation, shortening the processing cycle of a single workpiece, and improving the overall production capacity and operational stability of the equipment.

[0146] In this embodiment of the invention, the film-applying ring tearing device 160 further includes a film-applying ring flipping mechanism 70, used to flip the film-applying ring 302 in the reverse direction. The film-applying ring flipping mechanism 70 is provided because after the previous cutting process, the first protective film 303 is located below the film-applying ring 302. When the film-applying ring 302 is in an unflipped position, it will not match the tearing action of the film clamping mechanism 20, causing subsequent tearing processing to be hindered. Secondly, when the first protective film 303 is located below the film-applying ring 302, the film-applying ring 302 will block the adhesive-removing lamp 64, preventing the adhesive-removing light from effectively illuminating the position of the first protective film 303, thus hindering the smooth UV adhesive removal process. The core of the film-applying ring flipping mechanism 70 provided in this embodiment is to adjust the placement posture of the film-applying ring 302, accurately placing the flipped and adjusted film-applying ring 302 on the adhesive-removing rotary table 63, achieving automated feeding and adapting to the fully automated continuous production process of the equipment. It should be understood that this embodiment applies to the case where the first protective film 303 is located below the film-applying ring 302 after the previous cutting process.

[0147] The film-applying ring flipping mechanism 70 includes a flipping arm 71 and a flipping mechanism 72; the flipping arm is provided with a flipping clamping mechanism 73 for clamping the film-applying ring 302, and the flipping mechanism 72 is connected to the flipping arm 71 and is used to drive the flipping arm 71 to flip.

[0148] The flipping mechanism 72 drives the flipping arm 71 to flip, so that the film-applying ring 302, which is held on the flipping clamping mechanism 73, is placed on the adhesive removal rotating table 63.

[0149] In this embodiment of the invention, the film-applying ring flipping mechanism 70 completes the posture adjustment and automatic feeding of the film-applying ring through the flipping arm 71 and the flipping clamping mechanism 73. It can stably and accurately place the film-applying ring on the adhesive removal rotating table 63, replacing manual placement, and the feeding position accuracy is high.

[0150] In another embodiment, such as Figure 21 As shown, the film cutting mechanism 180 includes a column 181, a cleaning and lateral movement mechanism 182, a cutter mounting plate 183, a cutter circumferential cutting drive 184, and a cutter head 185.

[0151] The column 181 is mounted on the casting table 900 of the wafer casting machine. The cleaning transverse movement mechanism 182 is disposed on the column 181. The cutter mounting plate 183 is mounted on the column 181. The cutter circumferential cutting drive 184 is mounted on the cutter mounting plate 183. The cutter head 185 is mounted on the cutter circumferential cutting drive 184. The cutter circumferential cutting drive 184 and the cutter head 185 are drivenly connected.

[0152] The front end of the cleaning traverse mechanism 182 is provided with a cleaning head 186, which is positioned facing the cutting head 185. The cleaning traverse mechanism 182 is used to drive the cleaning head 186 to move in a straight line, approaching or moving away from the cutting head 185, thereby cleaning the cutting head 185 with the cleaning head 186. In this embodiment, the cleaning traverse mechanism 182 is a linear slide or a guide rail cylinder, as long as it can drive the cleaning head 186 to move. The cleaning head 186 can be a cleaning block, a brush, a scraper, or a nozzle, thereby cleaning the cutting head 185.

[0153] The circumferential cutting drive 184 is used to drive the cutting head 185 to rotate, thereby achieving circumferential cutting of the film. The circumferential cutting drive 184 adopts a mature servo rotation module in the prior art, or a motor-driven rotary mechanism, as long as it can drive the cutting head 185 to move in the circumferential direction to complete the circumferential cutting.

[0154] It should be noted that the film-applying unit 171 described in this application is prior art, therefore its specific structure will not be described in detail here. Even if this application does not elaborate further, those skilled in the art should know how to configure the film-applying unit 171 to achieve the effects desired in this application.

[0155] The rest of this embodiment is the same as that in Embodiment 1. Features not explained in this embodiment are explained using the methods in Embodiment 1, and will not be repeated here.

[0156] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer casting method, characterized in that, The method is applied to a wafer casting machine, which includes a casting table with a material handling station, a cutting station, a film-attaching and peeling station, and a film-attaching station. The method includes the following steps: Step S100: The workpiece at the material handling station is transported to the cutting station, and the workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station. The workpiece includes a film-adhesive ring, a first protective film attached to the film-adhesive ring, and a wafer attached to the first protective film. The film-cutting mechanism is set at the cutting station. Step S200: Transfer the film-adhesive ring with the first protective film attached from the cutting station to the film-adhesive ring peeling station, and peel off the first protective film attached to the surface of the film-adhesive ring; Step S300: Move the wafer with the first protective film attached to its first end face and the film-applying ring after peeling off the first protective film to the film-applying station. The film-applying execution mechanism at the film-applying station applies the film to the second end face of the wafer and the film-applying ring, forming a film-applied workpiece.

2. The wafer casting method according to claim 1, characterized in that, After step S300, the method further includes: Step S400: Remove the film-coated workpiece from the film-coating station, flip the film-coated workpiece over, and move it to the material hopper at the material picking station.

3. The wafer casting method according to claim 1, characterized in that, Step S100: The workpiece at the material handling station is conveyed to the cutting station, and the workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station, including: Step S110: The workpiece at the picking station is transported to a wafer placement stage, wherein the wafer placement stage is driven to connect to a wafer transfer module. Step S120: The wafer transfer module drives the wafer placement stage to move the workpiece to the dicing station; Step S130: The workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station.

4. The wafer casting method according to claim 3, characterized in that, Step S200: Transfer the film-adhering ring with the first protective film attached from the cutting station to the film-adhering ring peeling station, and peel off the first protective film attached to the surface of the film-adhering ring using the film-adhering ring peeling device at the film-adhering ring peeling station; including: Step S210: The film-adhesive ring with the first protective film attached is transported from the wafer placement stage to the film-adhesive ring peeling station by the workpiece transfer mechanism; Step S220: The first protective film attached to the surface of the film-applying ring is UV de-adhesive-treated by the film-applying ring peeling device set at the film-applying ring peeling station, and the first protective film is peeled off after de-adhesion.

5. The wafer casting method according to claim 4, characterized in that, Step S220: The first protective film attached to the surface of the film-applying ring is UV-de-adhesive-assisted by a film-applying ring peeling device located at the film-applying ring peeling station, and the first protective film is peeled off after de-adhesion, including: Step S221: The first protective film attached to the surface of the film-applying ring is removed by the rotary de-adhesion mechanism in the film-applying ring tearing device located at the film-applying ring tearing station; Step S222: The film-applying ring peeling device peels off the first protective film after the adhesive has been removed.

6. The wafer casting method according to claim 4, characterized in that, Step S221: The first protective film attached to the surface of the film-applying ring is removed by a rotary adhesive-removing mechanism in the film-applying ring tearing device located at the film-applying ring tearing station; including: Step S2211: The film-applying ring is flipped in the reverse direction by the film-applying ring flipping mechanism in the film-applying ring tearing device located at the film-applying ring tearing station; Step S2212: The rotating adhesive removal mechanism in the film-applying ring tearing device removes the adhesive from the reversed film-applying ring to remove the first protective film attached to the surface of the film-applying ring.

7. The wafer casting method according to claim 3, characterized in that, Step S300: The wafer with the first protective film attached to its first end face and the film-applying ring after the first protective film has been peeled off are moved to the film-applying station. The film-applying execution mechanism at the film-applying station applies film to the second end face of the wafer and the film-applying ring, including: Step S310: Drive the wafer placement stage through the wafer transfer module to move the wafer with the first protective film attached to the first end face to the film application station; Step S320: The film-applying ring that has completed the first protective film peeling process is placed on the wafer placement stage at the film-applying station by the film-applying ring feeding mechanism of the film-applying execution mechanism; Step S330: The second end face of the wafer and the film-applying ring are applied with film by the film-applying execution mechanism set at the film-applying station, and a film-applying workpiece is formed after film application.

8. The wafer casting method according to claim 3, characterized in that, Step S110: Transporting the workpiece from the picking station to a wafer placement stage, including: Step S111: Drive the picking robot arm to move towards the material box via the picking and moving module of the hopper; Step S112: The workpiece is removed from the material box by the material handling robot; Step S113: Drive the picking robot to move away from the material box through the picking moving module, and transport the workpiece to the wafer placement stage through the workpiece transfer mechanism.

9. A wafer casting machine applying the wafer casting method according to any one of claims 1-8, characterized in that, The wafer casting machine includes a casting table, which is equipped with a material handling station, a cutting station, a film application and peeling station, and a film application station. The workpiece at the material handling station is transported to the cutting station, and the workpiece is divided into a wafer with a first protective film attached to its first end face and a film-adhesive ring with a portion of the first protective film attached by a film-cutting mechanism set at the cutting station. The workpiece includes a film-adhesive ring, a first protective film attached to the film-adhesive ring, and a wafer attached to the first protective film. The film-cutting mechanism is set at the cutting station. The film-adhesive ring with the first protective film attached is transferred from the cutting station to the film-adhesive ring peeling station, and the first protective film attached to the surface of the film-adhesive ring is peeled off. The wafer with the first protective film attached to its first end face and the film-applying ring after the first protective film has been peeled off are moved to the film-applying station. The film-applying execution mechanism at the film-applying station applies the film to the second end face of the wafer and the film-applying ring, forming a film-applied workpiece.

Images