A packaging paster device and method for semiconductor processing

Abstract

The application discloses a packaging and pasting device and method for semiconductor processing, and relates to the technical field of semiconductor processing, which comprises a base, a loading table arranged on the base and used for placing a substrate, and a material plate station arranged behind the loading table and used for placing chip components, a front-back moving platform arranged on both sides of the loading table and capable of moving forward and backward to place the chip components on the substrate of the loading table, a horizontal moving platform arranged on the front-back moving platform and capable of horizontally moving to pick up the chip components at different positions, a lifting electric cylinder installed on the moving part of the horizontal moving platform and capable of vertically working, and a variable diameter mechanism arranged at the moving end of the lifting electric cylinder and used for adjusting the inner diameter. Through the application, the problems that the fixed pipe diameter cannot match the flow demand of large and small components, the working condition of picking up is contradictory, the flow passage cross-sectional area cannot be adaptively adjusted according to the specifications and sizes of the components to be picked up and the surface air leakage characteristics, and the whole machine has poor adaptability, insufficient picking stability and complicated production changeover debugging are solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically to a packaging and mounting apparatus and method for semiconductor processing. Background Technology

[0002] A semiconductor packaging pick-and-place machine is an automated device used for mounting electronic components. It is typically used on printed circuit board assembly lines to quickly and accurately place surface mount components of various sizes and shapes onto designated positions on a substrate. Pick-and-place machines can greatly improve production efficiency and reduce labor costs, making them one of the indispensable key pieces of equipment in the modern electronics manufacturing industry.

[0003] For example, CN120261350A discloses a semiconductor packaging placement device with an adjustable suction nozzle. Through the coordinated action of multiple steering motors and servo cylinders, the angle and height of the suction nozzle can be precisely adjusted to accommodate semiconductor packaged wafers of different shapes and sizes. Two suction racks respectively adsorb and position the outer and inner circumferential surfaces of the semiconductor packaged wafers, greatly improving the stability of adsorption and reducing the risk of component displacement and falling during placement, thereby significantly improving placement accuracy. However, existing motor end cap punching machines still have some shortcomings:

[0004] The negative pressure pipeline of the suction nozzle generally adopts a fixed inner diameter straight-through structure. The cross-sectional area of ​​the pipeline flow cannot be adaptively adjusted according to the specifications and dimensions of the components to be picked up and the surface leakage characteristics, resulting in many technical defects such as poor overall machine adaptability, insufficient picking stability, and complicated production change and debugging.

[0005] Fixed pipe diameter cannot match the flow requirements of components of different sizes, resulting in significant contradictions in the picking conditions. Existing technology has a constant inner diameter of negative pressure pipeline. If a small pipe diameter is used, when picking up large-size chips and large-area packaged devices, there will be continuous air leakage due to the micro-bumps on the device surface and the packaging gaps. The flow rate of the small pipe diameter is insufficient and cannot compensate for the air leakage loss in time, resulting in a significant decrease in negative pressure at the nozzle end. This can easily lead to problems such as component slippage, displacement, and mid-process material rejection.

[0006] If a large-diameter pipe structure is used uniformly, the internal air storage volume of the pipe will be too large when picking up small-sized components. The air flow rate and impact force will be large and strong when the vacuum is broken and the material is removed. This can easily blow away or deviate the extremely light micro-components, causing batch defects such as tombstoning, misalignment, and empty suction.

[0007] To address the aforementioned issues, there is an urgent need for innovative designs based on existing semiconductor packaging and surface mount devices. Summary of the Invention

[0008] The present invention addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different solution. Specifically, the present invention aims to provide a packaging and placement device and method for semiconductor processing, thereby solving the problems mentioned in the background art, where the suction nozzle negative pressure pipeline generally adopts a fixed inner diameter straight-through structure. The pipeline flow cross-sectional area cannot be adaptively adjusted according to the specifications and dimensions of the components to be picked up and the surface leakage characteristics, resulting in poor overall adaptability, insufficient picking stability, and cumbersome production changeover debugging.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a packaging and mounting device for semiconductor processing, comprising a base, a stage disposed on the base for placing a substrate, and a material board station behind the stage for placing chip components, a front-to-back motion platform disposed on both sides of the stage for moving back and forth to place chip components on the stage substrate, a horizontal motion platform disposed on the front-to-back motion platform for horizontally moving to pick up chip components at different positions, and a lifting electric cylinder mounted on the moving part of the horizontal motion platform for vertical operation, a diameter-changing mechanism disposed at the moving end of the lifting electric cylinder for adjusting the inner diameter, and a nozzle assembly disposed at the bottom end of the diameter-changing mechanism for stably positioning the chip components.

[0010] Preferably, the variable diameter mechanism includes an upper tube fixed to the moving end of the lifting electric cylinder and a flexible hose sealed at the top of the upper tube for sealing connection with the vacuum pump. The lower tube is sealed with a flange at the bottom end and has an adsorption tube that can extend and retract along the vertical direction of the lower tube installed inside by a sliding seal.

[0011] The outer circumference of the adsorption tube is integrally provided with a fixing ring and a reset spring located above the fixing ring to control the state reset after the adsorption tube expands and contracts.

[0012] Preferably, the upper tube, lower tube, and adsorption tube are axially connected, and the upper and lower ends of the reset spring abut against the bottom of the lower tube and the top of the fixing ring, respectively.

[0013] Preferably, a connecting ring that is in communication with the upper pipe is fixedly installed at the bottom of the upper pipe and inside the lower pipe. A variable diameter sleeve for flexibly changing the inner diameter by lifting is fixedly installed on the top of the connecting ring with screws. A follower ring with the same inner diameter as the connecting ring is fixedly installed on the top of the variable diameter sleeve with screws.

[0014] An inner liner plate is tightly fitted to the inner side of the top of the adsorption tube. A vertically upward follower rod is fixed at the axis of the inner liner plate. A wind equalization plate for averaging the airflow field inside the upper tube is fixedly installed at the axis of the top of the follower rod.

[0015] Preferably, the inner liner has symmetrically distributed and equally sized semi-circular through slots inside, which are used to connect the adsorption tube and the upper tube. The air distribution plate is fixedly installed with bolts and a follower ring. The variable diameter sleeve has retaining strips inside with the same cross-sectional shape as the variable diameter sleeve and equidistantly distributed in a ring about the axis of the variable diameter sleeve. The retaining strips can adaptively stretch and change with the variable diameter sleeve.

[0016] Preferably, the suction nozzle assembly includes a detachable bottom tube that is threaded to the bottom port of the suction tube. The bottom end of the bottom tube is fitted with a suction nozzle that can adaptively contract according to different pressure levels of the suction tube. A micro-pressure spring is provided in the internal interlayer of the suction nozzle to keep the suction nozzle from resetting after contraction.

[0017] Preferably, the cross-section of the suction nozzle is corrugated.

[0018] Preferably, an installation plate is fixed to the outer wall of the lower tube, and spring telescopic rods symmetrically distributed about the axis of the adsorption tube for positioning large-size chip components are fixed to the bottom of the installation plate. A conical positioning head for protecting the surface of the large-size chip components is installed at the bottom end of the spring telescopic rod, and the adsorption nozzle and the positioning head are in the same horizontal direction.

[0019] A packaging and mounting method for semiconductor processing includes the following steps:

[0020] S1: Place the substrate to be packaged and mounted on the stage first, and place the initial loading board of the chip or component to be mounted on the substrate behind the stage.

[0021] S2: Start the lifting electric cylinder to control the diameter changing mechanism and the suction nozzle assembly to move downward. The suction nozzle assembly presses down on the surface of the chip component and holds it in place. When adsorbing large-sized chips, the lifting electric cylinder controls the downward pressure of the suction tube to increase. When the downward pressure increases, the compression degree of the suction nozzle assembly will also increase. At the same time, the diameter changing sleeve will gradually expand upward from the initial state due to the large contraction of the suction tube, and finally achieve stable adsorption with a larger inner diameter.

[0022] S3: The lifting electric cylinder controls the diameter changing mechanism and the suction nozzle assembly to rise and move the sucked chip components away from the material board station;

[0023] S4: Then, the front and rear motion platforms and the horizontal motion platform are activated to control the lifting electric cylinder to transfer the picked-up chip components from the material board station to the carrier stage, and randomly place them on the predetermined substrate position, thus completing the chip mounting work.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. When picking up large-sized chip components, the adsorption tube is pressed down deeply, the inner diameter of the adsorption tube expands, and the flow rate increases, achieving precise adaptive matching between the flow rate and the material specifications. This completely solves the contradiction between the picking conditions of large and small components. For large-sized chips and large-area devices, the inner diameter is automatically expanded and the air flow rate is increased. This can quickly compensate for the micro-leakage loss on the surface of large components, continuously stabilize the negative pressure at the nozzle assembly end, and avoid component slippage, material throwing, and misalignment caused by negative pressure decay. This significantly improves the adsorption stability during high-speed handling of large components.

[0026] For micro-sized components, the inner diameter is automatically reduced, the flow rate and the gas storage volume of the pipeline are decreased, and the airflow impact force during vacuum breaking and material removal is significantly reduced. This eliminates the problem of micro-components being blown away or deviated from their proper position, and significantly improves the yield of micro-materials. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the semiconductor packaging and mounting device of the present invention.

[0028] Figure 2 for Figure 1 A magnified structural diagram at point A.

[0029] Figure 3 This is a schematic diagram of the initial working state of the variable diameter mechanism of the present invention.

[0030] Figure 4 for Figure 3 A diagram showing the upward viewing angle.

[0031] Figure 5 This is a schematic diagram illustrating the working state of the variable diameter sleeve controlling the expansion and contraction of the adsorption tube according to the present invention.

[0032] Figure 6 This is a cross-sectional view of the suction nozzle assembly of the present invention.

[0033] Figure 7 This is a cross-sectional view of the initial shape of the variable diameter sleeve of the present invention.

[0034] Figure 8 for Figure 7 A schematic diagram of the shape of the reducing sleeve after the diameter is changed.

[0035] In the diagram: 1. Base; 2. Platform; 3. Front and rear movement platform; 4. Horizontal movement platform; 5. Lifting electric cylinder; 6. Upper tube; 7. Flexible hose; 8. Lower tube; 9. Adsorption tube; 10. Connecting ring; 11. Variable diameter sleeve; 12. Follower ring; 13. Inner liner plate; 14. Follower rod; 15. Air distribution plate; 16. Fixed ring; 17. Return spring; 18. Bottom tube; 19. Adsorption nozzle; 20. Micro-pressure spring; 21. Mounting plate; 22. Spring telescopic rod; 23. Positioning head; 24. Holding strip. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Please see Figures 1 to 8 The present invention provides a technical solution: a packaging and mounting device for semiconductor processing, including a base 1, a platform 2 disposed on the base 1 for placing a substrate, and a material board station behind the platform 2 for placing chip components, a front-to-back motion platform 3 disposed on both sides of the platform 2 and movable back and forth to place chip components on the substrate of the platform 2, a horizontal motion platform 4 disposed on the front-to-back motion platform 3 and movable horizontally to pick up chip components at different positions, and also includes a vertically working lifting cylinder 5 mounted on the moving part of the horizontal motion platform 4, a diameter changing mechanism disposed at the moving end of the lifting cylinder 5 for adjusting the inner diameter, and a nozzle assembly disposed at the bottom end of the diameter changing mechanism for stably positioning the chip components.

[0038] In this embodiment, the substrate to be packaged and mounted is placed on the stage 2. The stage 2 is a commercially available, technologically mature, adjustable stage used to adapt to substrates of different specifications and models. Behind the stage 2 is an initial loading plate for placing the chips or components to be mounted onto the substrate. Then, the forward / backward motion platform 3 and the horizontal motion platform 4 are activated. These are commercially available XY dual-axis moving platforms. When picking up a chip or component, the lifting electric cylinder 5 is activated to control the diameter-changing mechanism and the suction nozzle assembly to move downwards. The suction nozzle assembly... The chip component is pressed down and held in place. Finally, the lifting cylinder 5 controls the diameter changing mechanism and the suction nozzle assembly to rise and transfer the held chip component from the material board station to the stage 2, where it is randomly placed on the predetermined substrate position. The chip mounting process is then complete. In actual use, if it is necessary to adsorb large-sized chip components, the downward pressure of the lifting cylinder 5 is increased, and the relative force of the suction nozzle assembly contacting the chip component increases. This switches the diameter changing mechanism from the minimum inner diameter to the required inner diameter. The degree of diameter change depends on the size of the chip component and the downward pressure of the lifting cylinder 5.

[0039] The variable diameter mechanism includes an upper tube 6 fixed to the moving end of the lifting cylinder 5 and a hose 7 sealed at the top of the upper tube 6 for sealing connection with the vacuum pump. The lower tube 8 is sealed to the flange at the bottom of the upper tube 6. An adsorption tube 9 that can extend and retract along the vertical direction of the lower tube 8 is installed inside the lower tube 8 through a sliding seal.

[0040] An integral fixing ring 16 and a reset spring 17 located above the fixing ring 16 are provided on the outer circumference of the adsorption tube 9 to control the state reset after the adsorption tube 9 extends or retracts.

[0041] The upper tube 6, lower tube 8 and adsorption tube 9 are axially connected, and the upper and lower ends of the return spring 17 abut against the bottom of the lower tube 8 and the top of the fixing ring 16, respectively.

[0042] In this embodiment, the lifting cylinder 5 controls the lower tube 8 to move directly above the chip component to be mounted. When adsorbing a small-sized chip component, the lifting cylinder 5 controls the upper tube 6, lower tube 8, and adsorption tube 9 to descend so that the suction nozzle assembly lightly touches and adheres to the chip component. At this time, the adsorption tube 9 has a low degree of extension or even no extension, and the variable diameter sleeve 11 inside the upper tube 6 is in its initial state, with the inner diameter of the variable diameter sleeve 11 at its smallest. This can be observed... Figure 7 It can be seen that when adsorbing large-sized chips, the lifting cylinder 5 controls the downward pressure of the adsorption tube 9 to increase. When the downward pressure increases, the compression degree of the suction nozzle assembly also increases. At the same time, the variable diameter sleeve 11, affected by the significant contraction of the adsorption tube 9, will gradually expand upward from its initial state, ultimately increasing its inner diameter. This enlarges the flow field channels within the upper tube 6 and lower tube 8. This can be observed through... Figure 8 It can be seen that when the downward pressure on the adsorption tube 9 is released, the state of the adsorption tube 9 can be reset by the reset spring 17.

[0043] A connecting ring 10 that is in communication with the upper pipe 6 is fixedly installed at the bottom of the upper pipe 6 and inside the lower pipe 8. A variable diameter sleeve 11 that is used to flexibly change the inner diameter by lifting is fixedly installed on the top of the connecting ring 10 with screws. A follower ring 12 with the same inner diameter as the connecting ring 10 is fixedly installed on the top of the variable diameter sleeve 11 with screws.

[0044] An inner liner plate 13 is tightly fitted to the inner side of the top end of the adsorption tube 9. A vertically upward follower rod 14 is fixed at the axis of the inner liner plate 13. A wind equalization plate 15 is fixedly installed at the top axis of the follower rod 14 to average the airflow field inside the upper tube 6.

[0045] The inner liner plate 13 has symmetrically distributed and equally sized semi-circular through slots inside, which are used to connect the adsorption tube 9 and the upper tube 6. The air distribution plate 15 is fixedly installed with bolts and the follower ring 12. The variable diameter sleeve 11 has retaining strips 24 inside with the same cross-sectional shape and equidistantly distributed in a ring about the axis of the variable diameter sleeve 11. The retaining strips 24 can adapt to the stretching and changing of the variable diameter sleeve 11.

[0046] As an example in this embodiment, see Figure 4 and Figure 5It can be seen that when the adsorption tube 9 rises, it drives the inner liner plate 13 and the follower rod 14 to control the air distribution plate 15 to move upward. During the upward movement of the air distribution plate 15, it drives the follower ring 12 to move upward. At the same time, the follower ring 12 pulls the variable diameter sleeve 11 in the initial state to expand upward, thereby realizing the expansion of the small inner diameter of the variable diameter sleeve 11. The air distribution plate 15 can rectify and equalize the turbulent airflow generated by the variable diameter, eliminate the local negative pressure difference and eddy pressure loss of the pipeline section, stabilize the vacuum pressure during the switching between large and small flow rates, make the surface of the suction nozzle assembly uniformly stressed, avoid local leakage and slippage of large-area chips, and intercept pipeline impurities.

[0047] The effective inner diameter of the upper tube 6 is changed in real time by the pressure of the adsorption tube 9: when picking up small-sized components, the adsorption tube 9 has a shallow pressure stroke, the inner diameter is reduced, and the flow rate is reduced.

[0048] When picking up large-sized chip components, the adsorption tube 9 is pressed down deeply, the inner diameter of the adsorption tube 9 expands, and the flow rate increases, achieving precise adaptive matching between the flow rate and the material specifications. This completely solves the contradiction between the picking conditions of large and small components. For large-sized chips and large-area devices, the inner diameter is automatically expanded and the air flow rate is increased, which can quickly compensate for the micro-leakage loss on the surface of large components. It continuously stabilizes the negative pressure at the nozzle assembly end, avoiding component slippage, material throwing, and misalignment caused by negative pressure decay, and greatly improves the adsorption stability during high-speed handling of large components.

[0049] For micro-sized components, the inner diameter is automatically reduced, the flow rate and the gas storage volume of the pipeline are decreased, and the airflow impact force during vacuum breaking and material removal is significantly reduced. This eliminates the problem of micro-components being blown away or deviated from their proper position, and significantly improves the yield of micro-materials.

[0050] The suction nozzle assembly includes a detachable bottom tube 18 that is threaded to the bottom port of the suction tube 9. The bottom end of the bottom tube 18 is fitted with a suction nozzle 19 that can adaptively retract according to different degrees of downward pressure of the suction tube 9. A micro-pressure spring 20 is provided in the internal interlayer of the suction nozzle 19 to keep the suction nozzle 19 returning to its original position after retraction.

[0051] The cross-section of the suction nozzle 19 is corrugated.

[0052] In this embodiment, in actual use, the bottom tube 18 can be disassembled and replaced according to the real-time working conditions of the equipment to replace the damaged suction nozzle assembly. When the suction nozzle assembly is working, it is affected by the downward pressure of the suction tube 9. The suction nozzle 19 can shrink into different postures. Small-sized chip components shrink less, while large-sized chip components shrink more. The micro-pressure spring 20 keeps the suction nozzle 19 reset at all times, which can extend the fatigue resistance of the suction nozzle 19. At the same time, when the variable diameter sleeve 11 shrinks and resets, the retaining strip 24 inside the variable diameter sleeve 11 will undergo adaptive deformation following the change of the variable diameter sleeve 11. At the same time, it can completely reset the variable diameter sleeve 11 from the unfolded state to the initial contracted state.

[0053] Traditional rigid suction nozzles have fixed lengths and end-face heights, and uniform downward pressure, making them unsuitable for the diverse bonding needs of large-sized chips and micro-components. Larger components require greater compression strokes to achieve full-surface bonding, while smaller components are prone to damage from over-pressure or leakage from under-pressure. Utilizing the stretchable properties of corrugated silicone, the nozzle adapts to the device's downward pressure depth. For large components, deep compression and large stretching can fully compensate for surface flatness errors, encapsulation warping, and micro-gaps, ensuring full-area bonding of the 19-inch end face of the suction nozzle to the chip / component surface. This significantly reduces edge leakage and localized pressure loss in large-area components, stabilizes negative pressure adsorption, and prevents slippage, ejection, and misalignment of large components. For smaller components, shallow compression and small stretching allow for flexible, light-contact bonding, achieving precise sealing without excessive compression. This prevents micro-components from shifting or breaking due to excessive pressure, enabling integrated pick-up of components of all sizes.

[0054] A mounting plate 21 is fixed to the outer wall of the lower tube 8. A spring telescopic rod 22 is fixed to the bottom of the mounting plate 21. The rods are symmetrically distributed about the axis of the adsorption tube 9 to position large-sized chip components. A conical positioning head 23 is installed at the bottom of the spring telescopic rod 22 to protect the surface of the large-sized chip components. The adsorption nozzle 19 and the positioning head 23 are in the same horizontal direction.

[0055] In this embodiment, when adsorbing small-sized chip components, the length of the small-sized chip components will not exceed the relative distance of the positioning head 23. Therefore, the positioning head 23 will not be stably positioned when adsorbing small-sized chip components. When adsorbing large-sized chip components, the length of the large-sized chip components will exceed the relative distance of the positioning head 23. Therefore, when the adsorption tube 9 descends to adsorb, the mounting plate 21 follows the control spring extension rod 22 to drive the positioning head 23 to descend and stably position it on the surface of the large-sized chip components, which can prevent the large-sized chip components from warping.

[0056] A packaging and mounting method for semiconductor processing includes the following steps:

[0057] S1: Place the substrate to be packaged and mounted on stage 2 first, and place the initial loading board of the chip or component to be mounted on the substrate behind stage 2.

[0058] S2: Start the lifting electric cylinder 5 to control the diameter changing mechanism and the suction nozzle assembly to move downward. The suction nozzle assembly presses down on the surface of the chip component and holds it in place. When adsorbing large-sized chips, the lifting electric cylinder 5 controls the downward pressure of the suction tube 9 to increase. When the downward pressure increases, the compression degree of the suction nozzle assembly will also increase. At the same time, the diameter changing sleeve 11 will gradually expand upward from the initial state due to the large contraction of the suction tube 9, and finally achieve stable adsorption with a larger inner diameter.

[0059] S3: The lifting electric cylinder 5 controls the diameter changing mechanism and the suction nozzle assembly to rise and move the sucked chip components away from the material board station;

[0060] S4: Then, the front and rear motion platform 3 and the horizontal motion platform 4 are started to control the lifting electric cylinder 5 to transfer the picked-up chip components from the material board station to the carrier stage 2, and randomly place them on the predetermined substrate position, thus completing the chip mounting work.

[0061] Working principle: When using this packaging and placement device and method for semiconductor processing,

[0062] 1. Pre-placement stage: The substrate to be packaged and placed is first placed on stage 2. Then, the initial loading board of the chip or component to be placed on the substrate is placed behind stage 2. Users can choose to place it manually or use a robotic arm to pick it up and place it according to actual needs and working conditions.

[0063] II. Adsorption of chip components stage: The lifting cylinder 5 controls the lower tube 8 to move directly above the chip component to be mounted;

[0064] When adsorbing small-sized chip components, the lifting electric cylinder 5 controls the adsorption tube 9 to descend so that its suction nozzle assembly lightly touches and adheres to the chip component. The adsorption tube 9 has a low degree of extension or even no extension. The inner diameter of the variable diameter sleeve 11 is the smallest, reducing the flow rate and the gas storage volume of the pipeline, which greatly reduces the airflow impact force when breaking the vacuum and de-materializing.

[0065] When adsorbing large-sized chips, the lifting electric cylinder 5 controls the downward pressure of the adsorption tube 9 to increase. When the downward pressure increases, the compression degree of the nozzle assembly also increases. At the same time, the variable diameter sleeve 11 is affected by the large contraction of the adsorption tube 9 and will gradually expand upward from the initial state, eventually achieving an increase in inner diameter. The flow field channels in the upper tube 6 and lower tube 8 become larger, which can quickly compensate for the micro-leakage loss on the surface of the large component packaging and continuously stabilize the negative pressure at the nozzle assembly end.

[0066] III. Placement Stage: Subsequently, the forward and backward motion platform 3 and the horizontal motion platform 4 are activated to control the lifting electric cylinder 5 to transfer the picked-up chip components from the material board station to the carrier stage 2, and randomly place them on the predetermined substrate position, thus completing the placement work.

[0067] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A packaging and mounting apparatus for semiconductor processing, comprising a base (1), a stage (2) disposed on the base (1) for placing a substrate, and a material board station behind the stage (2) for placing chip components, a forward and backward motion platform (3) disposed on both sides of the stage (2) for placing chip components on the substrate of the stage (2), and a horizontal motion platform (4) disposed on the forward and backward motion platform (3) for picking up chip components at different positions, characterized in that: It also includes a lifting electric cylinder (5) that can work vertically and is installed on the moving part of the horizontal motion platform (4), a diameter changing mechanism that is set at the moving end of the lifting electric cylinder (5) to adjust the inner diameter, and a nozzle assembly that is set at the bottom end of the diameter changing mechanism to stably position the chip components.

2. The packaging and mounting apparatus for semiconductor processing according to claim 1, characterized in that: The variable diameter mechanism includes an upper tube (6) fixed to the moving end of the lifting cylinder (5) and a hose (7) sealed at the top of the upper tube (6) for sealing connection with the vacuum pump. The lower tube (8) is sealed to the flange at the bottom of the upper tube (6). An adsorption tube (9) that can extend and retract along the vertical direction of the lower tube (8) is installed inside the lower tube (8) by sliding seal. The outer circumference of the adsorption tube (9) is integrally provided with a fixing ring (16) and a reset spring (17) located above the fixing ring (16) to control the state reset after the adsorption tube (9) extends and retracts.

3. The packaging and mounting apparatus for semiconductor processing according to claim 2, characterized in that: The upper tube (6), lower tube (8) and adsorption tube (9) are axially connected, and the upper and lower ends of the reset spring (17) abut against the bottom of the lower tube (8) and the top of the fixing ring (16) respectively.

4. A packaging and mounting apparatus for semiconductor processing according to claim 2, characterized in that: The upper tube (6) is fixedly installed at the bottom and inside the lower tube (8) with a connecting ring (10) that is in communication with the upper tube (6). A variable diameter sleeve (11) for flexibly changing the inner diameter by lifting is fixedly installed on the top of the connecting ring (10) with screws. A follower ring (12) with the same inner diameter as the connecting ring (10) is fixedly installed on the top of the variable diameter sleeve (11) with screws. An inner liner plate (13) is tightly fitted to the inner side of the top of the adsorption tube (9). A vertically upward follower rod (14) is fixed at the axis of the inner liner plate (13). A wind equalization plate (15) for averaging the airflow field inside the upper tube (6) is fixedly installed at the top axis of the follower rod (14).

5. A packaging and mounting apparatus for semiconductor processing according to claim 4, characterized in that: The inner lining disc (13) has symmetrically distributed and equally sized semi-circular through slots inside, which are used to connect the adsorption tube (9) and the upper tube (6). The air distribution disc (15) is fixedly installed with bolts and follower ring (12). The variable diameter sleeve (11) has retaining strips (24) with the same cross-sectional shape and equidistantly distributed in a ring about the axis of the variable diameter sleeve (11). The retaining strips (24) can adapt to the stretching and changing of the variable diameter sleeve (11).

6. A packaging and mounting apparatus for semiconductor processing according to claim 2, characterized in that: The suction nozzle assembly includes a bottom tube (18) that is threaded to the bottom port of the suction tube (9) and is detachable. The bottom end of the bottom tube (18) is fitted with a suction nozzle (19) that can adaptively shrink according to different pressure levels of the suction tube (9). A micro-pressure spring (20) is provided in the internal interlayer of the suction nozzle (19) to keep the suction nozzle (19) from resetting after shrinking.

7. A packaging and mounting apparatus for semiconductor processing according to claim 6, characterized in that: The cross-section of the suction nozzle (19) is corrugated.

8. A packaging and mounting apparatus for semiconductor processing according to claim 2, characterized in that: The lower tube (8) is fixedly provided with an installation plate (21) on its outer wall. The bottom of the installation plate (21) is fixedly provided with spring telescopic rods (22) symmetrically distributed about the axis of the adsorption tube (9) for positioning large-size chip components. The bottom end of the spring telescopic rod (22) is equipped with a conical positioning head (23) for protecting the surface of the large-size chip components. The adsorption nozzle (19) and the positioning head (23) are in the same horizontal direction.

9. A packaging and mounting method for semiconductor processing, applicable to the packaging and mounting apparatus for semiconductor processing as described in any one of claims 1-8, characterized in that, Includes the following steps: S1: Place the substrate to be packaged on the stage (2) first, and place the initial loading board of the chip or component to be packaged on the substrate behind the stage (2). S2: Start the lifting cylinder (5) to control the diameter changing mechanism and the suction nozzle assembly to move downward. The suction nozzle assembly presses down on the surface of the chip components and sucks them in place. When adsorbing large-sized chips, the lifting cylinder (5) controls the downward pressure of the suction tube (9) to increase. When the downward pressure increases, the compression degree of the suction nozzle assembly will also increase. At the same time, the diameter changing sleeve (11) will gradually expand upward from the initial state due to the large-scale contraction of the suction tube (9), and finally achieve stable adsorption with a larger inner diameter. S3: The lifting electric cylinder (5) controls the diameter changing mechanism and the suction nozzle assembly to rise and move the sucked chip components away from the material board station; S4: Then start the front and rear motion platform (3) and the horizontal motion platform (4) to control the lifting cylinder (5) to transfer the picked-up chip components from the material board station to the carrier (2) and place them randomly on the predetermined substrate position. The chip mounting work is completed.

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