An optical chip quantum packaging alignment curing control system

Abstract

The application relates to the technical field of chip packaging, and discloses an optical chip quantum packaging alignment curing control system; relative position data between a chip and a substrate is collected in real time by an alignment sensing module; a multi-degree-of-freedom displacement adjustment is performed on the alignment execution module according to the sensing data to complete high-precision alignment; a curing control module starts a curing operation after the alignment is completed; a closed-loop feedback module continuously collects position data and generates a feedback signal during the curing process; the curing control module dynamically adjusts curing process parameters in response to the feedback signal, closed-loop linkage control of alignment precision and the curing process is realized, and the technical problems that alignment and curing are independent of each other, curing parameters cannot be adjusted, and environmental disturbance cannot be compensated for in the prior art are solved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a quantum packaging alignment and solidification control system for optical chips. Background Technology

[0002] Flip-chip bonding is an advanced packaging method that uses the functional side of a chip to directly interconnect with the substrate via solder bumps for electrical and mechanical bonding. It has advantages such as short interconnect length, low signal delay, and high packaging density, and is widely used in the packaging of highly integrated devices such as optical chips and quantum chips. In the flip-chip bonding process, the alignment accuracy between the optical chip and the substrate directly affects the optical signal transmission efficiency and electrical connection reliability, while the curing process after alignment determines the long-term stability of the solder joint structure and the service life of the chip.

[0003] In the field of optical chip packaging, especially in the packaging of high-value devices such as quantum chips, extremely high alignment accuracy is required. In existing technologies, to achieve high-precision alignment between the chip and the substrate, a vision alignment system combined with a high-precision displacement platform is typically used. For example, CN116721975B discloses a three-dimensional packaging structure for a quantum bare chip, which uses positioning pins to initially position the substrate, adjustment plate, fixing plate, and circuit board, and adjusts the position of the quantum bare chip using the adjustment plate. During the packaging process, the position of the quantum bare chip is monitored in real time and adjusted accordingly to improve alignment and packaging accuracy. CN119620423A discloses an optical imaging alignment system for precision flip-chip bonding, which achieves alignment between the wafer and the substrate through imaging. Another document reports an optical detection system, including an imaging subsystem and a ranging subsystem, capable of measuring the distance between the chip and the substrate with an accuracy of 0.1 μm. Furthermore, an automatic alignment and integrated control system for an optical crystal array is disclosed, which uses a quantum entanglement-enhanced sensing array to collect multi-dimensional error data in real time and performs composite control compensation for a robotic arm.

[0004] However, the aforementioned existing technologies still have the following shortcomings in terms of packaging alignment and curing control of optical chips and quantum chips: In existing technologies, the alignment process and the curing process are usually two independent steps performed sequentially. After alignment is completed, when the curing operation starts, the alignment state established between the chip and the substrate may shift due to changes in surface tension caused by solder melting during the curing process, differences in material thermal expansion, or micro-vibrations of the equipment. However, existing technologies lack a closed-loop control mechanism to continuously monitor the alignment state and adjust it in a timely manner during the curing process, resulting in the final packaging accuracy being lower than the measurement accuracy when alignment is completed. In existing curing solutions, process parameters such as the radiation intensity and radiation time of the curing light source are usually set once before curing begins and are not adjusted during the curing process. When alignment misalignment occurs during curing, the fixed parameters cannot be adjusted to compensate for it, and the only options are to accept the misalignment or discard the packaged product. For high-value quantum chips, such losses are unacceptable. Furthermore, during the precision alignment and curing process, changes in ambient temperature and micro-vibrations of the equipment are key disturbances affecting alignment accuracy. Although existing technologies have solutions for position adjustment during the packaging process, they have not yet achieved real-time integration of disturbances such as ambient temperature and vibration into alignment control and curing parameter adjustment. Summary of the Invention

[0005] The purpose of this invention is to provide a quantum packaging alignment and solidification control system for optical chips to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a quantum packaging alignment and solidification control system for optical chips, comprising: The alignment sensing module is used to collect the relative position data between the optical chip and the substrate in real time during the packaging alignment process of the optical chip and the substrate. The alignment execution module is communicatively connected to the alignment sensing module and is used to drive the optical chip or the substrate to perform multi-degree-of-freedom displacement according to the relative position data until the alignment deviation between the optical chip and the substrate meets a preset threshold. The curing control module, which is linked with the alignment execution module, is used to initiate the curing operation when the optical chip and the substrate are aligned and maintained in the alignment state. A closed-loop feedback module is communicatively connected to the alignment sensing module and the curing control module, respectively, and is used to continuously collect the relative position data during the curing operation and generate a feedback signal based on the relative position data; The curing control module responds to the feedback signal and dynamically adjusts the curing process parameters during the curing operation.

[0007] Preferably, the alignment sensing module includes: The visual alignment unit includes at least one set of microscopic imaging devices for acquiring images of a first alignment mark on the optical chip and a second alignment mark on the substrate, and calculating the positional deviation between the first alignment mark and the second alignment mark based on an image recognition algorithm; A laser ranging unit is used to measure the distance between the optical chip and the substrate during the alignment process between the optical chip and the substrate; The alignment sensing module outputs the positional deviation and the spacing as the relative position data.

[0008] Preferably, the alignment execution module includes: A multi-degree-of-freedom displacement platform is used to support the optical chip or the substrate; The drive unit is connected to the multi-degree-of-freedom displacement platform and is used to drive the multi-degree-of-freedom displacement platform to move in the X-axis direction, Y-axis direction, Z-axis direction and rotational direction about the Z-axis. The driving unit generates a driving signal based on the relative position data output by the alignment sensing module, and drives the multi-degree-of-freedom displacement platform to move until the alignment deviation between the optical chip and the substrate meets the preset threshold.

[0009] Preferably, the curing control module includes: A curing light source unit is used to provide curing radiation energy to the encapsulation area between the optical chip and the substrate; A parameter adjustment unit, connected to the curing light source unit, is used to adjust the radiation intensity, radiation time, and radiation wavelength of the curing light source unit. The parameter adjustment unit responds to the feedback signal output by the closed-loop feedback module and adjusts the radiation intensity or radiation time of the curing light source unit in real time during the curing process.

[0010] Preferably, the closed-loop feedback module includes: A real-time monitoring unit is used to collect the relative position data output by the alignment sensing module at a preset sampling frequency during the curing operation. The deviation calculation unit is used to calculate the deviation between the relative position data at the current moment and the reference position data at the moment of alignment completion. A signal generation unit is used to generate a feedback signal when the deviation exceeds a preset deviation threshold. The feedback signal contains information about the direction and magnitude of the deviation.

[0011] Preferably, the curing control module is further used for: Before the curing operation is started, initial curing process parameters are matched from a preset curing parameter library according to the material type and packaging area of ​​the optical chip and the substrate. During the curing operation, if the feedback signal output by the closed-loop feedback module indicates that the deviation exceeds the first threshold, the radiation intensity of the curing light source unit is reduced or the radiation time is shortened. If the deviation exceeds a second threshold greater than the first threshold, the solidification operation is paused and the alignment correction process is triggered.

[0012] Preferably, it also includes an environmental compensation module, which includes: A temperature sensor is used to collect real-time temperature data of the environment in which the optical chip and the substrate are located. A vibration sensor is used to collect vibration data of the optical chip and the environment in which the substrate is located in real time. The compensation calculation unit is used to calculate the environmental compensation amount based on the temperature data and the vibration data, and to add the environmental compensation amount to the drive signal of the alignment execution module to offset the alignment deviation caused by environmental factors.

[0013] Preferably, the optical chip is a quantum optical chip, and the system further includes: An optical power monitoring unit is used to input a test optical signal to the optical quantum chip and monitor the output optical power of the optical quantum chip during the alignment process between the optical chip and the substrate. The alignment execution module performs fine adjustment of the multi-degree-of-freedom displacement with the goal of maximizing the output optical power, and the output optical power serves as an auxiliary criterion for determining the alignment deviation.

[0014] Preferably, it also includes a data recording and traceability module, which is used for: Record the relative position data collected by the alignment sensing module during the alignment process and the curing process; The curing control module records the curing process parameters used during the curing process and their dynamic adjustments. The relative position data and the curing process parameters are associated and stored according to timestamps to form a data chain for the packaging process.

[0015] Preferably, the preset threshold includes a static alignment threshold and a dynamic holding threshold, wherein the static alignment threshold is less than the dynamic holding threshold; the alignment execution module performs the alignment operation using the static alignment threshold as the judgment criterion during the alignment process, and the closed-loop feedback module generates the feedback signal using the dynamic holding threshold as the judgment criterion during the solidification process.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention uses an alignment sensing module to collect the relative position data between the chip and the substrate in real time. After the alignment execution module completes high-precision alignment, the curing control module starts the curing operation. At the same time, the closed-loop feedback module continuously monitors the alignment status and generates feedback signals during the curing process. The curing control module dynamically adjusts the curing process parameters according to the feedback signals. This closed-loop linkage mechanism enables the timely detection of alignment shifts caused by changes in surface tension due to solder melting or thermal expansion of materials during the curing process. Compensation can be made by adjusting the radiation intensity or radiation time. This effectively solves the technical problem in the prior art where alignment and curing are independent and the final packaging accuracy is lower than the alignment accuracy. 2. This invention, through a parameter adjustment unit responding to the feedback signal from the closed-loop feedback module, adjusts the radiation intensity or radiation time of the curing light source in real time during the curing process. This allows the curing process parameters to dynamically match the actual alignment status. When the deviation is small, the radiation intensity is appropriately reduced to slow down the curing speed, allowing time for the self-adjustment of the alignment status. When the deviation exceeds a safety threshold, curing is paused and an alignment correction process is triggered. This hierarchical response mechanism ensures packaging quality while avoiding waste of high-value quantum chips. 3. This invention uses temperature and vibration sensors in the environmental compensation module to collect environmental data in real time. The compensation calculation unit calculates the environmental compensation amount based on the temperature and vibration data and adds it to the drive signal of the alignment execution module. This enables the system to maintain the stability of alignment accuracy even when there are disturbances such as environmental temperature fluctuations and equipment micro-vibrations, thus improving the system's adaptability in actual production environments. Attached Figure Description

[0017] Figure 1 This is a system framework diagram of a preferred embodiment of the optical chip quantum packaging alignment and solidification control system provided by the present invention; Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: A quantum packaging alignment and solidification control system for optical chips, comprising: The alignment sensing module is used to collect the relative position data between the optical chip and the substrate in real time during the packaging alignment process of the optical chip and the substrate. The alignment execution module is communicatively connected to the alignment sensing module and is used to drive the optical chip or the substrate to perform multi-degree-of-freedom displacement according to the relative position data until the alignment deviation between the optical chip and the substrate meets a preset threshold. The curing control module, which is linked with the alignment execution module, is used to initiate the curing operation when the optical chip and the substrate are aligned and maintained in the alignment state. A closed-loop feedback module is communicatively connected to the alignment sensing module and the curing control module, respectively, and is used to continuously collect the relative position data during the curing operation and generate a feedback signal based on the relative position data; The curing control module responds to the feedback signal and dynamically adjusts the curing process parameters during the curing operation.

[0020] It should be noted that this system includes four core modules: alignment sensing module, alignment execution module, fixed control module, and closed-loop feedback module.

[0021] The alignment sensing module is installed above the alignment station of the packaging equipment and includes at least one set of high-resolution microscopic imaging devices, such as an industrial camera with a telecentric lens, and a laser ranging unit, such as a laser displacement sensor. The microscopic imaging devices are used to acquire images of the first alignment mark (such as a cross mark, a circular mark, or an L-shaped mark) on the optical chip and the second alignment mark on the substrate. The laser ranging unit is used to measure the distance between the optical chip and the substrate, and the ranging accuracy can reach 0.1μm.

[0022] The alignment execution module includes a multi-degree-of-freedom displacement platform and a drive unit. The multi-degree-of-freedom displacement platform adopts a high-precision piezoelectric ceramic drive or servo motor drive, which can realize four degrees of freedom of movement: X-axis, Y-axis, Z-axis and rotation around the Z-axis. The displacement resolution is better than 0.1μm. The optical chip is fixed on the displacement platform by vacuum adsorption or mechanical clamping, and the substrate is fixed on the base of the alignment station.

[0023] The curing control module includes a curing light source unit and a parameter adjustment unit. The curing light source unit uses an ultraviolet LED light source or a laser light source to provide curing radiation energy to the packaging area between the light chip and the substrate. The parameter adjustment unit is connected to the curing light source unit and can adjust the radiation intensity by adjusting the driving current or the pulse width modulation duty cycle, and control the radiation time by a timer.

[0024] The closed-loop feedback module is communicatively connected to the alignment sensing module and the fixed control module, and includes a real-time monitoring unit, a deviation calculation unit, and a signal generation unit.

[0025] Workflow: The optical chip (such as a quantum optical chip) is placed on a multi-degree-of-freedom displacement platform, the substrate is fixed at the alignment station, the alignment sensing module is activated, and the microscopic imaging device acquires images of the first alignment mark on the optical chip and the second alignment mark on the substrate, respectively. The X-axis deviation and Y-axis deviation between the two alignment marks are calculated by the image recognition algorithm (such as template matching algorithm or edge detection algorithm). At the same time, the laser ranging unit measures the Z-axis distance between the optical chip and the substrate. Then, the alignment sensing module outputs the position deviation and spacing data as relative position data to the alignment execution module. The drive unit generates a drive signal based on the relative position data, driving the multi-degree-of-freedom displacement platform to perform displacement compensation in the X and Y axes until the alignment deviation between the optical chip and the substrate meets the preset static alignment threshold (e.g., X-axis deviation ≤ ±1μm, Y-axis deviation ≤ ±1μm, Z-axis spacing deviation ≤ ±0.5μm). After alignment is completed, the system records the position data at this time as the reference position data.

[0026] The curing control module initiates the curing operation when the alignment execution module completes the alignment and maintains the alignment state. The curing control module first matches the initial curing process parameters (e.g., radiation intensity 500mW / cm², radiation time 30 seconds) from the preset curing parameter library according to the material type of the optical chip and the substrate (e.g., silicon-based optical chip, lithium niobate optical chip, etc.) and the packaging area. After the solidification operation is initiated, the real-time monitoring unit of the closed-loop feedback module continuously collects the relative position data output by the alignment sensing module at a preset sampling frequency (e.g., 10Hz). The deviation calculation unit calculates the deviation between the relative position data at the current moment and the reference position data at the moment of alignment completion. When the deviation exceeds a preset dynamic holding threshold (e.g., X-axis deviation > ±2μm or Y-axis deviation > ±2μm), the signal generation unit generates a feedback signal containing information on the direction and magnitude of the deviation. The curing control module responds to feedback signals and dynamically adjusts curing process parameters during the curing operation. Specifically, when the feedback signal indicates that the deviation exceeds the first threshold (e.g., X-axis deviation > ±2μm and ≤ ±5μm), the parameter adjustment unit reduces the radiation intensity of the curing light source unit (e.g., from 500mW / cm² to 300mW / cm²) or shortens the radiation time (e.g., from 30 seconds to 20 seconds) to slow down the curing speed and provide a time window for self-adjustment of the alignment state. When the feedback signal indicates that the deviation exceeds the second threshold (e.g., X-axis deviation > ±5μm), the curing control module pauses the curing operation and triggers the alignment correction process to re-execute the alignment operation.

[0027] The above solution uses an alignment sensing module to collect the relative position data between the chip and the substrate in real time, an alignment execution module to complete high-precision alignment, a curing control module to start the curing operation, a closed-loop feedback module to continuously monitor the alignment status and generate feedback signals during the curing process, and a curing control module to dynamically adjust the curing process parameters based on the feedback signals. This achieves closed-loop linkage control between alignment and curing, effectively solving the technical problems in the prior art where alignment and curing are independent and the alignment status deviation during the curing process cannot be compensated.

[0028] Example 2: Based on Example 1, this example further adds an environmental compensation module to improve the system's adaptability in actual production environments.

[0029] The environmental compensation module includes a temperature sensor, a vibration sensor, and a compensation calculation unit. The temperature sensor, employing a high-precision thermistor or thermocouple, is installed near the alignment station to collect real-time temperature data of the environment surrounding the optical chip and substrate, with a temperature measurement accuracy better than ±0.1℃. The vibration sensor, using a piezoelectric accelerometer or MEMS accelerometer, is installed near the base or displacement platform of the alignment station to collect real-time vibration data of the environment, with a frequency response range covering 1Hz to 1kHz. The compensation calculation unit calculates the environmental compensation amount based on temperature and vibration data. The temperature compensation amount is calculated based on the thermal expansion coefficient of the material: ΔxT = α·L·ΔT, where α is the thermal expansion coefficient of the material, L is the characteristic dimension, and ΔT is the temperature change. The vibration compensation amount is calculated based on the amplitude and frequency of the vibration signal. Low-frequency vibration components are extracted as displacement disturbances through a filter. The compensation calculation unit superimposes the environmental compensation amount onto the drive signal of the alignment execution module to offset the alignment deviation caused by environmental factors. During the alignment and curing processes, temperature and vibration sensors continuously collect environmental data. The compensation calculation unit calculates the environmental compensation amount in real time and adds it to the drive signal of the alignment execution module. For example, when the ambient temperature rises by 1°C, causing the substrate to expand thermally and produce a displacement of 0.5μm, the compensation calculation unit adds a corresponding reverse displacement compensation amount to the drive signal, enabling the displacement platform to actively adjust its position to offset the effect of thermal expansion. When environmental vibration causes high-frequency disturbances in the relative position between the chip and the substrate, the compensation calculation unit reduces the impact of vibration on alignment accuracy through real-time compensation (such as increasing the servo bandwidth of the displacement platform or adopting a feedforward control strategy). This embodiment introduces an environmental compensation module into the system, enabling the system to maintain the stability of alignment accuracy even under disturbances such as ambient temperature fluctuations and equipment micro-vibrations, thus improving the system's adaptability in actual production environments.

[0030] Example 3: This example addresses the special packaging requirements of optical quantum chips by further adding an optical power monitoring unit based on Example 1 or Example 2.

[0031] The optical power monitoring unit includes a test light source (such as a narrow-linewidth laser or a broadband light source), an optical power meter, and an optical coupling device. The output of the test light source is connected to the input port of the optical quantum chip via an optical fiber or a spatial optical path, and the input of the optical power meter is connected to the output port of the optical quantum chip via an optical fiber or a spatial optical path.

[0032] During the alignment process between the quantum chip and the substrate, a test light source inputs a test light signal (such as continuous light or pulsed light with a wavelength of 1550nm) to the quantum chip, and an optical power meter monitors the output optical power of the quantum chip. The alignment execution module drives a multi-degree-of-freedom displacement platform for adjustment with the goal of maximizing the output optical power. Specifically, coarse alignment (deviation ≤ ±10μm) is first achieved through a visual alignment unit. Then, optical power monitoring is initiated, and the alignment execution module performs small-step scans (step size, for example, 0.1μm) in the X, Y, and z directions, recording the output optical power at each position in real time. When the output optical power reaches its maximum value, it indicates that the optical path alignment between the optical input port and the optical output port of the optical chip is optimal. The output optical power serves as an auxiliary criterion for determining alignment deviation and, together with the visual alignment result, determines the final alignment position. This embodiment uses optical power to assist alignment, reflecting the actual transmission efficiency of the optical signal. Compared to the visual alignment method that relies solely on geometric marks, it can more accurately guarantee the optical performance of the quantum chip, making it particularly suitable for quantum chip packaging scenarios with extremely high requirements for optical coupling efficiency.

[0033] Based on the above embodiments, a data recording and traceability module is also provided; the data recording and traceability module includes a data acquisition unit, a data storage unit, and a data query unit. The data acquisition unit communicates with the alignment sensing module and the curing control module via an industrial Ethernet or high-speed serial bus, acquiring relative position data during the alignment process and curing process parameter data during the curing process in real time. The data storage unit uses a solid-state drive or industrial-grade memory card to store the acquired data in association with timestamps. The data query unit provides retrieval functions based on time, batch, or chip number; Throughout the packaging process, the data logging and traceability module continuously records the following data: The relative position data (including X-axis deviation, Y-axis deviation, and Z-axis spacing) collected by the alignment sensing module during the alignment and curing processes. The curing control module records the curing process parameters (including radiation intensity, radiation time, and radiation wavelength) used during the curing process and their dynamic adjustments. The environmental compensation module collects temperature and vibration data; The output optical power data collected by the optical power monitoring unit.

[0034] The above data is stored in association with timestamps, forming a complete data chain for the encapsulation process.

[0035] When packaging quality issues occur, the complete packaging process data for the batch or chip can be retrieved through the data query unit to analyze the correlation between alignment deviation, curing parameter adjustment, and environmental conditions, and to pinpoint the cause of the quality problem.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A quantum packaging alignment and solidification control system for optical chips, characterized in that, include: The alignment sensing module is used to collect the relative position data between the optical chip and the substrate in real time during the packaging alignment process of the optical chip and the substrate. The alignment execution module is communicatively connected to the alignment sensing module and is used to drive the optical chip or the substrate to perform multi-degree-of-freedom displacement according to the relative position data until the alignment deviation between the optical chip and the substrate meets a preset threshold. The curing control module, which is linked with the alignment execution module, is used to initiate the curing operation when the optical chip and the substrate are aligned and maintained in the alignment state. A closed-loop feedback module is communicatively connected to the alignment sensing module and the curing control module, respectively, and is used to continuously collect the relative position data during the curing operation and generate a feedback signal based on the relative position data; The curing control module responds to the feedback signal and dynamically adjusts the curing process parameters during the curing operation.

2. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The alignment sensing module includes: The visual alignment unit includes at least one set of microscopic imaging devices for acquiring images of a first alignment mark on the optical chip and a second alignment mark on the substrate, and calculating the positional deviation between the first alignment mark and the second alignment mark based on an image recognition algorithm; A laser ranging unit is used to measure the distance between the optical chip and the substrate during the alignment process between the optical chip and the substrate; The alignment sensing module outputs the positional deviation and the spacing as the relative position data.

3. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The alignment execution module includes: A multi-degree-of-freedom displacement platform is used to support the optical chip or the substrate; The drive unit is connected to the multi-degree-of-freedom displacement platform and is used to drive the multi-degree-of-freedom displacement platform to move in the X-axis direction, Y-axis direction, Z-axis direction and rotational direction about the Z-axis. The driving unit generates a driving signal based on the relative position data output by the alignment sensing module, and drives the multi-degree-of-freedom displacement platform to move until the alignment deviation between the optical chip and the substrate meets the preset threshold.

4. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The curing control module includes: A curing light source unit is used to provide curing radiation energy to the encapsulation area between the optical chip and the substrate; A parameter adjustment unit, connected to the curing light source unit, is used to adjust the radiation intensity, radiation time, and radiation wavelength of the curing light source unit. The parameter adjustment unit responds to the feedback signal output by the closed-loop feedback module and adjusts the radiation intensity or radiation time of the curing light source unit in real time during the curing process.

5. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The closed-loop feedback module includes: A real-time monitoring unit is used to collect the relative position data output by the alignment sensing module at a preset sampling frequency during the curing operation. The deviation calculation unit is used to calculate the deviation between the relative position data at the current moment and the reference position data at the moment of alignment completion. A signal generation unit is used to generate a feedback signal when the deviation exceeds a preset deviation threshold. The feedback signal contains information about the direction and magnitude of the deviation.

6. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The curing control module is also used for: Before the curing operation is started, initial curing process parameters are matched from a preset curing parameter library according to the material type and packaging area of ​​the optical chip and the substrate. During the curing operation, if the feedback signal output by the closed-loop feedback module indicates that the deviation exceeds the first threshold, the radiation intensity of the curing light source unit is reduced or the radiation time is shortened. If the deviation exceeds a second threshold greater than the first threshold, the solidification operation is paused and the alignment correction process is triggered.

7. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: It also includes an environmental compensation module, which comprises: A temperature sensor is used to collect real-time temperature data of the environment in which the optical chip and the substrate are located. A vibration sensor is used to collect vibration data of the optical chip and the environment in which the substrate is located in real time. The compensation calculation unit is used to calculate the environmental compensation amount based on the temperature data and the vibration data, and to add the environmental compensation amount to the drive signal of the alignment execution module to offset the alignment deviation caused by environmental factors.

8. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: The optical chip is a quantum optical chip, and the system further includes: An optical power monitoring unit is used to input a test optical signal to the optical quantum chip and monitor the output optical power of the optical quantum chip during the alignment process between the optical chip and the substrate. The alignment execution module performs fine adjustment of the multi-degree-of-freedom displacement with the goal of maximizing the output optical power, and the output optical power serves as an auxiliary criterion for determining the alignment deviation.

9. The optical chip quantum packaging alignment and solidification control system according to claim 1, characterized in that: It also includes a data recording and traceability module, which is used for: Record the relative position data collected by the alignment sensing module during the alignment process and the curing process; The curing control module records the curing process parameters used during the curing process and their dynamic adjustments. The relative position data and the curing process parameters are associated and stored according to timestamps to form a data chain for the packaging process.

10. A quantum packaging alignment and solidification control system for optical chips according to any one of claims 1-9, characterized in that: The preset threshold includes a static alignment threshold and a dynamic holding threshold, wherein the static alignment threshold is less than the dynamic holding threshold; the alignment execution module performs the alignment operation using the static alignment threshold as the judgment criterion during the alignment process, and the closed-loop feedback module generates the feedback signal using the dynamic holding threshold as the judgment criterion during the solidification process.

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