A semiconductor device airtightness detection device

Abstract

The application relates to the field of airtight detection, in particular to a semiconductor equipment airtightness detection device which comprises a ring rail structure installed and fixed around a flange type circumferential detection point, a moving mechanism moving in the circumferential direction of the ring rail structure, and an ultrasonic detection mechanism installed on the moving mechanism; the ring rail structure is composed of at least two track mechanisms connected at the head and tail, the track mechanism comprises an arc-shaped plate and a clamping member installed on the arc-shaped plate in the radial direction, both ends of the arc-shaped plate are respectively fixed with a plug and a socket, the plug can be inserted into the socket and be penetrated by a pin shaft in the transverse direction at the same time, thereby forming rotating connection of two adjacent arc-shaped plates; the clamping member comprises a double-bar frame in sliding connection with the arc-shaped plate in the penetrating mode, and a clamping plate fixed at the inner end of the double-bar frame, and a spring is arranged between the clamping plate and the arc-shaped plate. The device can be quickly clamped at the flange type circumferential detection point for circumferential scanning detection.

Description

Technical Field

[0001] This invention relates to the field of airtightness testing, and in particular to an airtightness testing device for semiconductor equipment. Background Technology

[0002] In semiconductor wafer manufacturing, etching, thin film deposition and other process equipment, vacuum chambers, vacuum pipelines, valves and various connecting flanges must maintain high airtightness. Once a micro-leak occurs, external moisture, dust and impurities can easily enter the chamber, causing wafer process defects, abnormal equipment operation, and seriously affecting production yield and equipment lifespan.

[0003] Currently, the industry generally adopts a combined detection method of first ultrasonic screening and then helium mass spectrometry for fine inspection: first, ultrasonic leak detection devices are used to conduct a wide-range and rapid screening of easily leaking areas such as equipment flange edges, sealing joints, bolt holes, and valve gaps to quickly locate suspected leak points; then, helium mass spectrometry leak detectors are used to perform high-precision quantitative fine inspection of the suspected points, thus balancing detection efficiency and detection accuracy.

[0004] Current ultrasonic leak detection operations mostly rely on manual handheld ultrasonic probes. During testing, the operator must maintain a constant distance between the probe and the surface of the flange being tested, continuously and uniformly scanning the entire outer circumference of the flange, sealing joints, bolt locations, and valve gaps. However, manual handheld operation has significant drawbacks: Firstly, for flange-type circumferential testing points, the operator often needs to switch between holding the probe with their left and right hands, which can easily lead to breaks in the scanning trajectory, missed areas, poor consistency, and low testing efficiency. Furthermore, manual operation cannot achieve standardized and traceable closed-loop scanning. Secondly, the detection accuracy is highly dependent on the operator's hand stability, and hand tremors, spacing deviations, and uneven walking speeds can easily cause weak leak signals to be missed or misjudged.

[0005] Therefore, there is a need for an ultrasonic testing device for the sealing of semiconductor equipment that can be quickly clamped at flange-type circumferential testing points to complete circumferential scanning. This eliminates the need for manual operation by holding the probe around the device, avoiding testing errors caused by hand tremors and hand switching, and improving the accuracy, consistency, and efficiency of leak screening. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor device for sealing inspection, which can be quickly clamped at a flange-type circumferential inspection point for circumferential scanning inspection.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor device airtightness testing device includes a ring rail structure that is mounted and fixed around a flange-type circumferential testing point, a moving mechanism that moves circumferentially along the ring rail structure, and an ultrasonic testing mechanism mounted on the moving mechanism. The ring track structure is composed of at least two track mechanisms connected end to end. The track mechanism includes an arc plate and a clamping member that is radially installed through the arc plate. A plug and a socket are fixed at both ends of the arc plate respectively. The plug can be inserted into the socket and is simultaneously penetrated laterally by a pin, forming a rotatable connection between two adjacent arc plates. The clamping member includes a double-bar frame that is slidably connected to the arc-shaped plate, and a clamping plate fixed to the inner end of the double-bar frame. A spring is provided between the clamping plate and the arc-shaped plate.

[0008] Furthermore, the arc-shaped plate is threadedly connected to a tightening screw at the location corresponding to the double-rod frame.

[0009] Furthermore, the moving mechanism includes a mounting frame, rollers, and an upper connecting seat. Three rollers rotate on one side of the mounting frame. The three rollers are triangular in shape and roll alternately on the inner and outer arc surfaces of the arc plate. The upper connecting seat is installed inside the mounting frame for mounting the ultrasonic testing mechanism.

[0010] Furthermore, the arc-shaped plate extends outward with a protruding ridge, and the roller is provided with a groove that mates with the protruding ridge.

[0011] Furthermore, the mounting frame is rotatably equipped with an adjusting screw, which is parallel to the axis of the arc-shaped plate and is threadedly connected to the upper connecting seat.

[0012] Furthermore, the ultrasonic testing mechanism includes a lower connecting seat and an ultrasonic probe. The lower connecting seat has a portal frame in the middle, and the ultrasonic probe is installed inside the portal frame and can rotate towards or away from the plane where the ring track structure is located.

[0013] Furthermore, a toothed ring is fixed on the ultrasonic probe, and a power gear that meshes with the toothed ring is rotatably mounted on the upper end of the portal frame.

[0014] Furthermore, a semiconductor device hermetically sealed testing device also includes a connecting mechanism installed between the upper connecting seat and the lower connecting seat, the connecting mechanism being able to control the ultrasonic probe to move closer to or further away from the axis of the arc plate.

[0015] Furthermore, the connecting mechanism includes a lower slider, a connecting plate, a central shaft, an upper slider, and a bidirectional screw. There are two lower sliders, which slide on the two ends of the upper side of the lower connecting seat respectively. The bidirectional screw is rotatably mounted on the upper connecting seat. The two upper sliders are threadedly connected to the two ends of the bidirectional screw respectively. The four connecting plates rotate in pairs on the two lower sliders and the two upper sliders. The central shaft rotates in the middle of the four connecting plates.

[0016] Furthermore, two uprights are vertically fixed in the middle of the lower connecting seat, and both uprights are slidably connected to the central axis.

[0017] The present invention has the following beneficial effects: When a flange-type circumferential inspection point is required, one of the pins is removed from the two plugs and sockets. Then, through the opening at this point, the area to be inspected is surrounded, and multiple clamps are aligned with the flange-type circumferential inspection point. The separate plugs and sockets are then connected and installed using the pin, completing the circular track. At this point, the clamps on each arc-shaped plate constituting the circular track will press against the flange-type circumferential inspection point, thus achieving rapid fixation of the inspection device to the flange-type circumferential inspection point. Furthermore, because each track mechanism constituting the circular track is identical and circumferentially distributed... The circular track will automatically align with the flange-type circumferential detection point. At this point, the ultrasonic testing mechanism moves along the circular track via the moving mechanism, thus enabling the ultrasonic testing mechanism to perform circumferential scanning at the flange-type circumferential detection point while maintaining a constant distance between the probe and the surface of the test point. Simultaneously, since the clamping plates can slide radially on the arc plate via the double rod frame, multiple clamping plates can adapt to the clamping installation at flange-type circumferential detection points of different diameters, allowing the testing device to better match the situation of a large number and different specifications of various circular flanges in semiconductor equipment. Attached Figure Description

[0018] Figure 1 A schematic diagram of the structure of a semiconductor device hermeticity testing device Figure 1 ; Figure 2 A schematic diagram of the structure of a semiconductor device hermeticity testing device Figure 2 ; Figure 3 This is a schematic diagram of the ring track structure of a semiconductor device's airtightness detection device when it is opened. Figure 4 A schematic diagram of a semiconductor equipment hermetic sealing testing device, using a flange assembly as an example. Figure 1 ; Figure 5 A schematic diagram of a semiconductor equipment hermetic sealing testing device, using a flange assembly as an example. Figure 2 ; Figure 6 A schematic diagram of a semiconductor equipment hermetic sealing testing device, using a flange assembly as an example. Figure 3 ; Figure 7 This is a partial structural diagram of a semiconductor device's airtightness detection device; Figure 8 This is a schematic diagram of the track mechanism; Figure 9 This is a structural schematic diagram of the clamping component; Figure 10This is a schematic diagram of the moving mechanism; Figure 11 This is a schematic diagram of the ultrasonic testing mechanism; Figure 12 This is a structural diagram of the ultrasonic testing mechanism and the connecting mechanism.

[0019] In the picture: Track mechanism 1; arc plate 11; clamping component 12; double rod frame 121; clamping plate 122; spring 123; plug 13; socket 14; tightening screw 15; protruding rib 16; Moving mechanism 2; mounting frame 21; roller 22; groove 221; upper connecting seat 23; adjusting screw 24; Ultrasonic testing mechanism 3; lower connecting seat 31; ultrasonic probe 33; gear ring 34; power gear 35; upright rod 36; Connecting mechanism 4; lower slider 41; connecting plate 42; central shaft 43; upper slider 44; bidirectional screw 45. Detailed Implementation

[0020] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0021] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Combination Figure 1-3 As shown, a semiconductor device sealing test device includes a ring track structure that is fixed around a flange-type circumferential test point, a moving mechanism 2 that moves circumferentially along the ring track structure, and an ultrasonic testing mechanism 3 mounted on the moving mechanism 2. By fixing the ring track structure to the flange-type circumferential test point to be tested, a track is formed for the ultrasonic testing mechanism 3 to move around the flange-type circumferential test point. The moving mechanism 2 drives the ultrasonic testing mechanism 3 to move along the ring track structure, so that the ultrasonic testing mechanism 3 performs circumferential scanning test at the flange-type circumferential test point. Combination Figure 8 The ring track structure is composed of at least two track mechanisms 1 connected end to end. The track mechanism 1 includes an arc plate 11 and a clamping member 12 that is radially installed on the arc plate 11. The two ends of the arc plate 11 are respectively fixed with a plug 13 and a socket 14. The plug 13 can be inserted into the socket 14 and is simultaneously penetrated laterally by a pin 15, forming a rotatable connection between two adjacent arc plates 11. Two adjacent arc-shaped plates 11 are connected by a plug 13 on one arc-shaped plate 11 into a socket 14 on the adjacent arc-shaped plate 11, and then connected by a pin 15 through the plug 13 and the socket 14. When the two arc-shaped plates 11 are rotated to be aligned by the pin 15, the ends of the two arc-shaped plates 11 are in contact and coaxial, so that the annular track formed by the arc-shaped plates 11 is a continuous and complete circle, which facilitates the movement mechanism 2 to move circumferentially along the annular track. Combination Figure 9 As shown, the clamping member 12 includes a double rod frame 121 that is slidably connected to the arc plate 11, and a clamping plate 122 fixed to the inner end of the double rod frame 121. A spring 123 is provided between the clamping plate 122 and the arc plate 11.

[0024] The spring force of the spring 123 pushes the clamping plate 122 to move away from the arc plate 11. Then, when multiple arc plates 11 form a circular track, multiple clamping plates 122 can move closer to the center through the corresponding spring 123, so that multiple clamping plates 122 cooperate to clamp each other at the flange-type circumferential detection point, thereby enabling the ultrasonic detection mechanism 3 to align with the detection point and perform scanning detection. In practical use, all the arc plates 11 that make up the circular track are connected at both ends by pins 15 passing through the plug 13 and socket 14. When the circular track needs to be fitted onto the flange-type circumferential detection point, such as Figure 3As shown, one of the pins 15 is removed from the two plugs 13 and sockets 14. Then, through the opening here, the position to be detected is surrounded, and multiple clamps 122 are aligned with the flange-type circumferential detection point. Then, the two separate plugs 13 and sockets 14 are pulled closer together and the pin 15 is inserted back in to make the annular track complete. At this time, the clamps 122 on each arc plate 11 that constitutes the annular track will be affected by the corresponding springs 123 and press against the flange-type circumferential detection point, thereby realizing the rapid fixation of the detection device to the flange-type circumferential detection point. Moreover, since the multiple clamping plates 122 are evenly distributed circumferentially, each spring 123 experiences the same clamping force, which allows the double rod frame 121 to automatically slide and adjust its position on the arc plate 11. With multiple springs 123 being identical, the annular track will automatically be coaxial with the flange-type circumferential detection point. At this time, the ultrasonic detection mechanism 3 is driven to move along the annular track by the moving mechanism 2, which forms a scanning detection at the flange-type circumferential detection point where the ultrasonic detection mechanism 3 performs circumferential scanning while maintaining a constant distance between the probe and the surface of the test point. Meanwhile, since the clamping plates 122 can slide radially on the arc plate 11 through the double rod frame 121, the multiple clamping plates 122 can adapt to clamping at flange-type circumferential detection points of different diameters, thus enabling the detection device to better match the situation where there are many circular flanges of various types and different specifications in semiconductor equipment. The pin 15 is parallel to the axis of the arc plate 11, which allows for better clamping and fixing of the flange-type circumferential detection point during installation. One end of the pin 15 is equipped with a retaining ring, and the other end is equipped with a through-hole pin, which facilitates the through-connection of the pin 15 to the plug 13 and the socket 14 by removing the pin. Moreover, after the pin 15 connects the two arc plates 11, the axis of the pin 15 is located on the end face of the corresponding end of the arc plate 11, thus ensuring that the annular track has a continuous and complete structure when two adjacent arc plates 11 are connected, ensuring smooth movement of the moving mechanism 2.

[0025] Preferably, the clamping plate 122 has a V-shaped groove on the side away from the corresponding arc plate 11, which increases the area of ​​the clamping position, improves the clamping stability, and makes the clamping position more coaxial with the annular track; at the same time, an anti-slip layer is provided at the V-shaped groove to further improve the clamping stability.

[0026] Combination Figure 8 In some embodiments, the arc plate 11 is threadedly connected to the double rod frame 121 with a tightening screw 15; When the arc-shaped plate 11 is fixedly installed around the flange-type circumferential detection point by forming a ring track, and the clamping plate 122 is pressed against the flange-type circumferential detection point by the elastic force of the spring 123, if the diameter of the flange-type circumferential detection point is small, the elastic force automatically generated by the spring 123 due to the ring track is insufficient to clamp the flange-type circumferential detection point, thus fixing the detection device at the flange-type circumferential detection point. Therefore, a threaded hole is provided in the arc-shaped plate 11 for threaded installation of the tightening screw 15. By rotating the tightening screw 15, the tightening screw 15 can move radially within the threaded hole of the arc-shaped plate 11, thereby pushing the clamping plate 122 to move away from the arc-shaped plate 11, thereby increasing the clamping force of the clamping plate 122 at the flange-type circumferential detection point, so that the detection device can be more stably installed and fixed at the flange-type circumferential detection point. Moreover, due to the limitations of the overall structure of the semiconductor equipment, some detection points have narrow spaces and restricted postures. When there is no corresponding cylindrical clamping position, the position of the clamping plate 122 can be manually adjusted by rotating the top tightening screw 15, so that multiple clamping plates 122 can be fixed to clamping positions of different shapes, thereby keeping the annular track and the circumferential detection points coaxial, and continuing to ensure that the ultrasonic detection mechanism 3 can maintain a constant scanning detection distance with the surface of the measured point.

[0027] Combination Figure 10 In some embodiments, the moving mechanism 2 includes a mounting frame 21, rollers 22 and an upper connecting seat 23. Three rollers 22 rotate on one side of the mounting frame 21. The three rollers 22 are triangular in shape and roll alternately on the inner and outer arc surfaces of the arc plate 11. The upper connecting seat 23 is installed in the mounting frame 21 for mounting the ultrasonic testing mechanism 3.

[0028] Specifically, the mounting frame 21 has a rectangular structure. One side of the mounting frame 21 is close to the circular track and parallel to the plane of the circular track. Three rollers 22 are rotatably mounted on this side. One roller 22 is rolledly connected to the outer side of the arc plate 11 and is located between the other two rollers 22. The other two rollers 22 are rolledly connected to the inner side of the arc plate 11. Thus, the mounting frame 21 can move along the arc plate 11 through the three rollers 22, thereby forming a moving mechanism 2 that drives the ultrasonic testing mechanism 3 to move circumferentially on the circular track. Among them, a power motor is installed on the side of the mounting frame 21 near the circular track. The power motor drives the roller 22 located in the middle. The friction between the roller 22 and the arc plate 11 is used to realize the automatic movement of the moving mechanism 2 on the circular track. Moreover, by controlling the power motor, automatic uniform speed movement can be achieved, further ensuring the accuracy of ultrasonic testing. It should be noted that one of the three rollers 22 can be rotatably connected to the inner side of the arc plate 11 and located between the other two rollers 22, while the other two rollers 22 are rotatably connected to the outer side of the arc plate 11.

[0029] In some embodiments, the arc plate 11 extends outward with a protruding rib 16, and the roller 22 is provided with a groove 221 that mates with the protruding rib 16.

[0030] The three rollers 22 roll alternately in a triangular shape on the inner and outer arc surfaces of the arc plate 11. Although this enables the automatic movement of the moving mechanism 2 on the circular track, when the circular track is tilted, the moving mechanism 2 and the ultrasonic testing mechanism 3 are affected by their own gravity, causing the rollers 22 to move axially on the outer arc surface of the arc plate 11, which may cause the rollers 22 to fall off the circular track. Therefore, a protruding rib 16 is provided on the arc plate 11, and a groove 221 is provided on the roller 22. Through the cooperation of the protruding rib 16 and the groove 221, the rollers 22 can be axially limited on the circular track, preventing the moving mechanism 2 and the ultrasonic testing mechanism 3 from falling off the circular track when the circular track is tilted, thus making it impossible to perform the test.

[0031] In some embodiments, the mounting frame 21 is rotatably equipped with an adjusting screw 24, which is parallel to the axis of the arc plate 11 and is threadedly connected to the upper connecting seat 23.

[0032] In practical use, due to the limitations of the overall structure of semiconductor equipment, it is not convenient to directly clamp and install the flange-type circumferential detection point to be tested. However, it is easier to clamp and fix it at a distance from the coaxial point. In order for the testing device to still be used for testing, the annular track can be fixedly installed around it at a distance from the coaxial point. First, the testing device and the flange-type circumferential detection point to be tested are coaxially fixed. Then, by rotating the adjusting screw 24, the upper connecting seat 23 can be moved along the adjusting screw 24 through the threaded connection between the adjusting screw 24 and the upper connecting seat 23. This will drive the ultrasonic testing mechanism 3 to move along the axis of the annular track until the ultrasonic testing mechanism 3 is aligned with the detection point, thus completing the circumferential test and improving the applicability of the testing device. The mounting frame 21 has through holes on both sides. The two ends of the upper connecting seat 23 are respectively limited to slide within the two through holes and slide against the left and right sides of the mounting frame 21. This limits the upper connecting seat 23 to slide only along the axis of the arc plate 11. The position of the upper connecting seat 23 on the mounting frame 21 is controlled by the threaded engagement between the upper connecting seat 23 and the adjusting screw 24.

[0033] Combination Figure 11In some embodiments, the ultrasonic testing mechanism 3 includes a lower connecting seat 31 and an ultrasonic probe 33. A portal frame 32 is provided in the middle of the lower connecting seat 31. The ultrasonic probe 33 is installed in the portal frame 32 and can rotate towards or away from the plane where the ring track structure is located.

[0034] Specifically, the lower connecting seat 31 is located directly below the upper connecting seat 23, that is, the lower connecting seat 31 is closer to the axis of the arc plate 11 than the upper connecting seat 23. A portal frame 32 is provided with a downward opening in the middle of the lower connecting seat 31. The ultrasonic probe 33 is rotatably connected to the two sides of the portal frame 32 through the shafts at both ends, forming a rotatable installation of the ultrasonic probe 33 within the portal frame 32. Then, by rotating the ultrasonic probe 33 within the portal frame 32, the orientation of the ultrasonic probe 33 can be adjusted. Taking a flange assembly as an example, the orientation of the ultrasonic probe 33 is explained. The detection device is clamped and fixed to the pipe body welded to the flange by the clamping plate 122. When it is necessary to scan and detect the gap between the two flanges, such as... Figure 4 As shown, simply align the ultrasonic probe 33 vertically downwards with the gap between the two flanges; when it is necessary to inspect the flanges on the pipe body that are far from the inspection device, such as the weld between the pipe body and the flange, or the corresponding bolt installation positions on the flange, etc. Figure 5 As shown, rotate the ultrasonic probe 33 towards the direction of the circular track to align it with the weld or bolt mounting position. When it is necessary to inspect the flange on the pipe body near the inspection device, such as the weld between the pipe body and the flange, or the corresponding bolt mounting position on the flange, etc. Figure 6 As shown, rotate the ultrasonic probe 33 away from the circular track so that the ultrasonic probe 33 is aligned with the weld or bolt installation position. Thus, by controlling the ultrasonic probe 33 to rotate closer to, further away from, or parallel to the plane of the annular track, the orientation of the ultrasonic probe 33 is changed, enabling ultrasonic scanning detection at different angles.

[0035] When gas leaks out at high speed from a tiny hole, it generates ultrasonic waves above 20kHz. The ultrasonic probe 33 collects the leak sound waves through its high-sensitivity ultrasonic sensor, filters low-frequency noise from the environment, locates the leak point and determines whether the seal is qualified by the signal strength, thereby achieving detection.

[0036] In some embodiments, a toothed ring 34 is fixed on the ultrasonic probe 33, and a power gear 35 that meshes with the toothed ring 34 is rotatably mounted on the upper end of the gantry frame 32.

[0037] Specifically, a gear ring 34, coaxial with the shaft head for mounting the ultrasonic probe 33, is set at the end of the ultrasonic probe 33 away from the probe's orientation. A power gear 35 is installed on the upper end of the portal frame 32. By rotating the power gear 35, it can mesh with the transmission gear ring 34, causing the gear ring 34 to drive the ultrasonic probe 33 to rotate around the shaft head, thereby realizing the orientation change of the ultrasonic probe 33. In order to make the detection device more automated, a micro motor can be installed on the portal frame 32 to control the transmission of the power gear 35, thereby realizing the automated control of the ultrasonic probe 33.

[0038] Combination Figure 1-3 As shown, in some embodiments, a semiconductor device sealing detection device further includes a connection mechanism 4 installed between the upper connector 23 and the lower connector 31, the connection mechanism 4 being able to control the ultrasonic probe 33 to move closer to or away from the axis of the arc plate 11.

[0039] By controlling the ultrasonic probe 33 to move closer to or further away from the axis of the arc plate 11 through the connecting mechanism 4, the position of the ultrasonic probe 33 can be adjusted through the connecting mechanism 4 for flange-type circumferential detection points of different diameters, ensuring that the distance between the ultrasonic probe 33 and the surface of the detection point is always within the ultrasonic detection range, thereby enabling the device to better adapt to circumferential detection at flange-type circumferential detection points of different diameters.

[0040] Combination Figure 12 In some embodiments, the connecting mechanism 4 includes a lower slider 41, a connecting plate 42, a central shaft 43, an upper slider 44, and a bidirectional screw 45. There are two lower sliders 41, which slide on the two ends of the upper side of the lower connecting seat 31 respectively. The bidirectional screw 45 is rotatably mounted on the upper connecting seat 23. The two upper sliders 44 are threadedly connected to the two ends of the bidirectional screw 45 respectively. The four connecting plates 42 rotate in pairs on the two lower sliders 41 and the two upper sliders 44. The central shaft 43 rotates in the middle of the four connecting plates 42.

[0041] Specifically, the upper side of the lower connecting seat 31 is provided with a T-shaped groove for limiting the sliding of the lower slider 41. The upper connecting seat 23 and the lower connecting seat 31 are arranged vertically opposite each other. The upper slider 44 and the lower slider 41 are tilted and rotate side by side with two connecting plates 42, thus forming four connecting plates 42 in pairs and in a cross state. The central shaft 43 rotates through the middle position of the four connecting plates 42, so that the four connecting plates 42 and the central shaft 43 form an "X" shaped fork. In practical use, rotating the bidirectional screw 45, with its oppositely oriented threads at both ends, causes the two upper sliders 44 to move closer or further apart synchronously. This, in turn, drives the two sets of connecting plates 42 to rotate around the central axis 43, which in turn causes the two lower sliders 41 to slide within the T-groove. When the two upper sliders 44 move closer together, the two lower sliders 41 also move closer within the T-groove, causing the upper connecting seat 23 and the lower connecting seat 31 to move further apart. This, in turn, brings the ultrasonic probe 33 closer to the axis of the annular track, allowing the detection device to adapt to flange-type circumferential detection points with smaller diameters. Conversely, when the two upper sliders 44 move further apart, the two lower sliders 41 also move further apart within the T-groove, causing the upper connecting seat 23 and the lower connecting seat 31 to move closer together. This, in turn, moves the ultrasonic probe 33 away from the axis of the annular track, allowing the detection device to adapt to flange-type circumferential detection points with larger diameters. Thus, the detection device achieves the effect of adapting to flange-type circumferential detection points of different diameters. Meanwhile, another micro motor can be installed at the measuring end of the upper connecting seat 23 to drive the bidirectional screw 45, further increasing the automation level of the detection device.

[0042] In some embodiments, two uprights 36 are vertically fixed in the middle of the lower connecting seat 31, and both uprights 36 are slidably connected to the central shaft 43.

[0043] Although the rotation of the "X"-shaped fork can be controlled by the bidirectional screw 45, which in turn allows the two lower sliders 41 to slide within the T-shaped groove, thus controlling the lifting and lowering of the lower connecting seat 31, the lower connecting seat 31 cannot be guaranteed not to move left or right when the two lower sliders 41 slide within the T-shaped groove, thereby changing the position of the ultrasonic probe 33. Therefore, two uprights 36 are set to pass through the central axis 43 to form a limit, ensuring that the lower connecting seat 31 is always located directly below the upper connecting seat 23, preventing the lower connecting seat 31 from causing the ultrasonic probe 33 to shift left or right, thus affecting the detection.

[0044] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0045] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A semiconductor device hermetically sealed testing device, characterized in that, It includes a ring rail structure that is fixed around the flange-type circumferential detection point, a moving mechanism (2) that moves circumferentially along the ring rail structure, and an ultrasonic detection mechanism (3) installed on the moving mechanism (2). The ring track structure is composed of at least two track mechanisms (1) connected end to end. The track mechanism (1) includes an arc plate (11) and a clamping member (12) that is radially installed on the arc plate (11). The two ends of the arc plate (11) are respectively fixed with a plug (13) and a socket (14). The plug (13) can be inserted into the socket (14) and is simultaneously penetrated laterally by a pin (15) to form a rotatable connection between two adjacent arc plates (11). The clamping member (12) includes a double rod frame (121) that is slidably connected to the arc plate (11) and a clamping plate (122) fixed to the inner end of the double rod frame (121). A spring (123) is provided between the clamping plate (122) and the arc plate (11).

2. The semiconductor equipment hermeticity testing device according to claim 1, characterized in that, The arc plate (11) is threadedly connected to the double rod frame (121) with a tightening screw (15).

3. The semiconductor equipment hermeticity testing device according to claim 1, characterized in that, The moving mechanism (2) includes a mounting frame (21), rollers (22) and an upper connecting seat (23). Three rollers (22) rotate on one side of the mounting frame (21). The three rollers (22) are triangular in shape and roll alternately on the inner and outer arc surfaces of the arc plate (11). The upper connecting seat (23) is installed in the mounting frame (21) for installing the ultrasonic testing mechanism (3).

4. The semiconductor device airtightness testing device according to claim 3, characterized in that, The arc plate (11) extends outward with a protruding ridge (16), and the roller (22) is provided with a groove (221) that cooperates with the protruding ridge (16).

5. The semiconductor device airtightness testing device according to claim 3, characterized in that, The mounting frame (21) has an adjusting screw (24) that rotates. The adjusting screw (24) is parallel to the axis of the arc plate (11), and the adjusting screw (24) is threadedly connected to the upper connecting seat (23).

6. The semiconductor device airtightness testing device according to claim 3, characterized in that, The ultrasonic testing mechanism (3) includes a lower connecting seat (31) and an ultrasonic probe (33). The lower connecting seat (31) has a gantry frame (32) in the middle. The ultrasonic probe (33) is installed in the gantry frame (32) and can rotate to be closer to or away from the plane where the ring track structure is located.

7. The semiconductor device airtightness detection device according to claim 6, characterized in that, A toothed ring (34) is fixed on the ultrasonic probe (33), and a power gear (35) that meshes with the toothed ring (34) is rotatably connected to the upper end of the gantry frame (32).

8. The semiconductor device airtightness detection device according to claim 6, characterized in that, It also includes a connecting mechanism (4) installed between the upper connecting seat (23) and the lower connecting seat (31), the connecting mechanism (4) being able to control the ultrasonic probe (33) to move closer to or away from the axis of the arc plate (11).

9. A semiconductor device airtightness testing device according to claim 8, characterized in that, The connecting mechanism (4) includes a lower slider (41), a connecting plate (42), a central shaft (43), an upper slider (44), and a bidirectional screw (45). There are two lower sliders (41), which slide on the upper ends of the lower connecting seat (31). The bidirectional screw (45) is rotatably mounted on the upper connecting seat (23). The two upper sliders (44) are threaded to the two ends of the bidirectional screw (45). The four connecting plates (42) rotate in pairs on the two lower sliders (41) and the two upper sliders (44). The central shaft (43) rotates in the middle of the four connecting plates (42).

10. A semiconductor device airtightness testing device according to claim 9, characterized in that, The lower connecting seat (31) has two vertically fixed uprights (36) in the middle, and both uprights (36) are slidably connected to the central shaft (43).

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