Environment-friendly in-situ cleaning apparatus for semiconductor and cleaning process thereof

Abstract

The application relates to the technical field of semiconductor cleaning, and particularly discloses an environment-friendly in-situ cleaning device for semiconductors and a cleaning process thereof, wherein the cleaning device comprises a rack, a feeding conveyor and a discharging conveyor arranged on the rack, and cleaning stations, cleaning liquid air-cut recovery stations, rinsing stations, rinsing liquid air-cut recovery stations and drying stations arranged in sequence between the feeding conveyor and the discharging conveyor; and a carrying assembly arranged on the rack and used for transferring a carrier loaded with semiconductor devices. The application realizes the automation and stability of the carrier in and out of the cleaning cavity, the negative pressure infiltration enables the cleaning liquid to rapidly penetrate into narrow fluid gaps among the semiconductor devices to overcome the surface tension, eliminates the air resistance, improves the cleaning efficiency and cleaning effect, realizes the recycling of the cleaning liquid and the rinsing liquid, and further reduces the energy consumption and operation cost.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cleaning technology, and more specifically to an environmentally friendly in-situ cleaning device and cleaning process for semiconductors. Background Technology

[0002] In semiconductor manufacturing processes, the surface cleanliness of products directly affects device yield and performance, making the cleaning process a critical step. As semiconductor processes evolve towards higher density and higher integration, back-end products such as system-in-package (SiP) and wafer-level package (WLP) products are characterized by high density, very small penetration gaps, and ultra-high cleanliness.

[0003] The existing semiconductor cleaning equipment mainly suffers from the following technical problems: 1. Traditional cleaning methods are prone to damaging the structure of high-density devices: the cavitation effect of ultrasonic cleaning can cause micro-damage to fragile structures such as nanoscale gate oxide layers and thin film circuits; the high-speed fluid impact force of jet cleaning can cause plastic deformation of the wire material or displacement of solder joints in high-density wiring areas, making it difficult to meet the cleaning requirements of high-density products such as system-in-package and wafer-level packaging.

[0004] 2. Lack of coordination in multi-chamber processes leads to serious waste of rinsing solution: In multi-chamber cleaning solutions, each process is executed independently without coordination. Especially in multiple rinsing processes, a large amount of rinsing solution is wasted, which cannot fully increase the number of times it can be recycled, thus increasing production costs and the burden of waste liquid discharge.

[0005] 3. Low penetration efficiency of cleaning high-density devices: For semiconductor devices with high density and narrow fluid gaps, the cleaning fluid has difficulty overcoming surface tension to enter the tiny gaps. The penetration efficiency of traditional immersion cleaning is not high enough, resulting in low cleaning efficiency and large amount of cleaning fluid used. Summary of the Invention

[0006] To address the aforementioned problems in the prior art, this invention provides an environmentally friendly in-situ cleaning device and cleaning process for semiconductors, which can solve the problems mentioned in the background art.

[0007] The objective of this invention can be achieved through the following technical solutions: An environmentally friendly in-situ cleaning device for semiconductors, comprising: A frame, a feeding conveyor and a discharging conveyor mounted on the frame, and a cleaning station, a cleaning fluid air-cutting and recovery station, a rinsing station, a rinsing fluid air-cutting and recovery station and a drying station arranged sequentially between the two; A conveying assembly, mounted on the frame, is used to transfer a carrier loaded with semiconductor devices between the feeding conveyor, the cleaning station, the cleaning fluid air-cutting and recovery station, the rinsing station, the rinsing fluid air-cutting and recovery station, the drying station, and the discharge conveyor. A cleaning circulation system is installed between the cleaning station and the cleaning fluid air-cutting recovery station; The rinsing circulation system is used for the recycling of rinsing solution within the rinsing station.

[0008] Preferably, the cleaning station includes a cleaning chamber and a Y-axis servo module. A door panel is fitted at the opening of the cleaning chamber, and a guide frame is provided on the side of the cleaning chamber near the opening. The Y-axis servo module is located on one side of the cleaning chamber, and a sliding seat is provided at the output end of the Y-axis servo module. A frame seat is slidably provided at the opening of the cleaning chamber along the inward extending direction. The frame seat is slidably engaged with the guide frame and is used to support the carrier. The sliding seat is slidably attached to the bottom end of the frame seat through a support plate. A dual-axis drive mechanism is provided on the sliding seat, and a claw is provided at the output end of the dual-axis drive mechanism to engage with the support plate to support the frame seat in and out of the cleaning chamber. The cleaning chamber is connected to a vacuum system.

[0009] Preferably, the cleaning station further includes a liquid collection tank, which is disposed between the guide frame and the opening of the cleaning chamber, for collecting the cleaning fluid carried out from the cleaning chamber by the carrier.

[0010] Preferably, the claw includes a horizontal portion and a vertical portion, and the horizontal portion and the vertical portion are perpendicularly connected to each other to form an L-shaped structure.

[0011] Preferably, the transport assembly includes a first pick-and-transfer mechanism and a second pick-and-transfer mechanism, wherein the first pick-and-transfer mechanism and the second pick-and-transfer mechanism independently perform the picking and transfer of the vehicle.

[0012] Preferably, the cleaning circulation system includes a magnetic pump, which is connected to the inlet of the cleaning station and the outlet of the washing liquid air-cutting recovery station via pipelines.

[0013] Preferably, the rinsing station includes a first rinsing chamber and a second rinsing chamber, and the rinsing circulation system includes a distillation tank and a condenser. The outlet of the first rinsing chamber is connected to the inlet of the second rinsing chamber in sequence through the distillation tank and the condenser, and the outlet of the second rinsing chamber is connected to the inlet of the first rinsing chamber to form a unidirectional circulation conveying loop.

[0014] This application also discloses an environmentally friendly in-situ cleaning process for semiconductors, comprising the following steps: S1. The carrier loaded with semiconductor devices is loaded by the feeding conveyor, and the carrier is transferred to the cleaning station by the handling component. There are several narrow fluid gaps between the semiconductor devices in the carrier. Cleaning liquid is injected into the cleaning station to perform immersion cleaning on the semiconductor devices. S2. After cleaning, the carrier is transferred to the cleaning fluid air-cutting recovery station by the transport component, and the semiconductor devices on the carrier are air-cut to recover the cleaning fluid on their surface; wherein, a cleaning circulation system is provided between the cleaning station and the cleaning fluid air-cutting recovery station, and the cleaning circulation system is used to send the cleaning fluid recovered by air-cutting back to the cleaning station. S3. The carrier that has undergone air cutting is transferred to the rinsing station by the conveying assembly, and rinsing solution is injected into the rinsing station to perform rinsing. S4. The carrier is transferred to the rinsing liquid air-cutting and recycling station by the conveying assembly, and the semiconductor devices on the carrier are air-cut to recover the rinsing liquid carried on their surface; wherein, a rinsing circulation system is provided between the rinsing station and the rinsing liquid air-cutting and recycling station, and the rinsing circulation system is used to process the rinsing liquid recovered by air-cutting and send it back to the rinsing station. S5. The carrier that has undergone air cutting is transferred to the drying station by the conveying component to dry the semiconductor device; S6. The dried carrier is transferred to the discharge conveyor by the conveying assembly, and then the carrier is unloaded.

[0015] Preferably, the cleaning circulation system returns the cleaning fluid recovered by the air cutter to the cleaning station via a magnetic pump to achieve the recycling of the cleaning fluid.

[0016] Preferably, the rinsing circulation system recycles the rinsing liquid recovered by air cutting through distillation and condensation processes before reusing it at the rinsing station.

[0017] The beneficial effects of this invention are as follows: 1. A cleaning station consisting of a cleaning chamber, door panel, guide frame, Y-axis servo module, sliding seat, frame seat, tray and dual-axis drive mechanism is set up. The cleaning chamber is connected to a vacuum system. Before cleaning, the cleaning chamber is evacuated to a negative pressure state. Then the cleaning fluid is injected to make the semiconductor device completely wetted in the negative pressure environment. The frame seat and guide frame slide to carry the carrier in and out of the cleaning chamber. The claw of the dual-axis drive mechanism engages with the inner wall of the frame seat and the top of the frame seat and the tray supports the frame seat. The door panel closes after the carrier enters to seal the cavity. The liquid collection tank is set between the guide frame and the opening of the cleaning chamber to collect the residual cleaning fluid on the surface when the carrier is removed. The technical effects achieved are as follows: the automation and stability of the carrier entering and exiting the cleaning chamber are realized; negative pressure immersion enables the cleaning fluid to overcome surface tension and quickly penetrate into the narrow fluid gaps between semiconductor devices, eliminating air resistance and improving cleaning effect and penetration efficiency; the coordinated cooperation between the claw and the tray ensures that the frame maintains a stable posture during entry and exit, avoiding shaking that could cause collisions or displacement of semiconductor devices; the sealed cavity ensures the establishment and maintenance of a negative pressure environment; and the collection tank prevents cleaning fluid from dripping and contaminating the device and reduces cleaning fluid loss, thereby improving the stability, safety, and economy of the cleaning process.

[0018] 2. Through the cleaning circulation system set between the cleaning station and the cleaning fluid air-cutting recovery station, the cleaning fluid air-cutting recovery station blows off and recovers the cleaning fluid carried on the surface of the vehicle, and then sends it back to the cleaning station via a magnetic pump, so as to realize the recycling of the cleaning fluid. The resulting technical benefits are: reduced consumption of cleaning fluid and waste discharge, lower production costs, and the shaftless design of the magnetic pump avoids external contamination caused by mechanical seal leakage in traditional pumps. It is particularly suitable for semiconductor cleaning scenarios with extremely high cleanliness requirements, achieving energy-saving and environmentally friendly in-situ cleaning.

[0019] 3. By setting up a rinsing circulation system consisting of a first rinsing chamber, a second rinsing chamber, a distillation tank and a condenser, the liquid outlet of the first rinsing chamber is connected to the liquid inlet of the second rinsing chamber in sequence through the distillation tank and the condenser, and the liquid outlet of the second rinsing chamber is connected to the liquid inlet of the first rinsing chamber to form a one-way circulation conveying loop. The resulting technical benefits are as follows: the rinsing solution from the coarse rinsing stage is purified through distillation and regeneration and then supplied to the fine rinsing stage. The rinsing solution used in the fine rinsing stage is then returned to the coarse rinsing stage for continued use, forming a unidirectional cycle with a concentration gradient. This not only ensures the purity requirements of the rinsing solution in the fine rinsing process, but also achieves full utilization of the rinsing solution and extends its service life, reduces waste liquid discharge, and further reduces energy consumption and operating costs. Attached Figure Description

[0020] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a front view of the present invention; Figure 3 This is an installation structure diagram of the frame, discharge conveyor, and cleaning station in this invention; Figure 4 This is a structural diagram of the cleaning station in this invention; Figure 5 This is a side view of the cleaning station in this invention; Figure 6 This is an installation structure diagram of the rinsing station in this invention; Figure 7 This is an installation structure diagram of the cleaning fluid air-cutting recovery station, rinsing station, rinsing fluid air-cutting recovery station, and drying station in this invention; Figure 8 This is an installation structure diagram of the conveying component in this invention; Figure 9 For the present invention Figure 4 Enlarged view of the structure at point A in the middle.

[0022] Explanation of reference numerals in the attached figures: 1. Frame; 2. Feed conveyor; 3. Discharge conveyor; 4. Cleaning station; 5. Cleaning fluid air-cutting and recovery station; 6. Rinsing station; 7. Rinsing fluid air-cutting and recovery station; 8. Drying station; 9. Handling components; 41. Cleaning chamber; 42. Door panel; 43. Guide frame; 44. Y-axis servo module; 45. Sliding seat; 46. Dual-axis drive mechanism; 47. Claw plate; 61. First rinsing chamber; 62. Second rinsing chamber; 91. First pick-up and transfer mechanism; 92. Second pick-up and transfer mechanism. Detailed Implementation

[0023] To further illustrate the technical means and effects adopted by the present invention to achieve its intended purpose, the specific implementation methods, structures, features, and effects of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and preferred embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In the description of this application, it should be understood that the orientation or positional relationship indicated by terms such as "inner" and "outer" are based on the orientation or position shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation, and therefore should not be construed as a limitation of this application.

[0025] Example 1: Reference Figures 1-9 This invention discloses an environmentally friendly in-situ cleaning device for semiconductors, used for cleaning semiconductor products with high cleaning density, very small penetration gaps, and ultra-high cleanliness, generally downstream products of semiconductor processes, such as system-in-package (SiP) products and wafer-level package (WLP) products. The structure of the environmentally friendly in-situ cleaning device is mainly as follows, including: To achieve overall equipment support and sequential layout of each workstation, in this embodiment: a frame 1, a feeding conveyor 2 and a discharging conveyor 3 mounted on the frame 1, and a cleaning workstation 4, a cleaning fluid air-cutting and recovery workstation 5, a rinsing workstation 6, a rinsing fluid air-cutting and recovery workstation 7, and a drying workstation 8 sequentially arranged between them. By arranging multiple processes such as cleaning, air-cutting and recovery, rinsing, and drying in a straight line, and with each workstation relatively independent, the problem of cross-contamination caused by shared pipelines or cavity wall residues when multiple processes are performed in a single cavity is avoided, thus improving the cleanliness and process stability of the cleaning process.

[0026] To achieve sealed entry and exit and guided support of the carrier within the cleaning station 4, in this embodiment: the cleaning station 4 includes a cleaning chamber 41 and a Y-axis servo module 44. A door panel 42 is fitted at the opening of the cleaning chamber 41, and a guide frame 43 is provided on the side of the cleaning chamber 41 near the opening. The Y-axis servo module 44 is located on one side of the cleaning chamber 41, and a sliding seat 45 is provided at the output end of the Y-axis servo module 44. A frame seat is slidably provided at the opening of the cleaning chamber 41 along the inward extending direction. The frame seat is slidably fitted with the guide frame 43 and is used to support the carrier. A support plate is provided on the sliding seat 45. The support plate is located at the bottom of the frame seat and is slidably fitted separately from the frame seat to support the frame seat when it enters or exits the cleaning chamber 41. The sliding seat 45 is also equipped with a dual-axis drive mechanism 46. The output end of the dual-axis drive mechanism 46 is equipped with claws 47, which are used to hold the inner wall and top of the frame seat to cooperate with the support plate to support the frame seat in and out of the cleaning chamber 41. After the carrier enters the cleaning chamber 41 with the frame seat, the door plate 42 closes to achieve sealing of the chamber during the cleaning process. Through the sliding cooperation between the frame seat and the guide frame 43, the movement stability of the carrier when entering and exiting the cleaning chamber 41 is ensured, and the collision or displacement of the semiconductor devices in the carrier is avoided due to shaking. The Y-axis servo module 44 drives the sliding seat 45 to move precisely, and cooperates with the claws 47 of the dual-axis drive mechanism 46 to hold the inner wall and top of the frame seat, so that the frame seat maintains a stable posture during entry and exit, and avoids the frame seat from tilting or shifting during sliding, effectively reducing the vibration and impact on the semiconductor devices during the entry and exit of the carrier. The dual-axis drive mechanism 46 has two independent drive axes. The first axis is set along the sliding direction of the frame seat and is used to drive the claw plate 47 to reciprocate along the sliding direction of the frame seat so as to drive the frame seat into or out of the cleaning chamber 41. The second axis is set along the vertical height direction and is used to drive the claw plate 47 to move up and down in the vertical direction so that the claw plate 47 engages or disengages with the inner wall and top of the frame seat, thereby realizing the locking and releasing of the claw plate 47 on the frame seat.

[0027] To facilitate the collection and recovery of cleaning fluid carried out of the cleaning chamber 41, in this embodiment, the cleaning station 4 further includes a collection tank. The collection tank is located between the guide frame 43 and the opening of the cleaning chamber 41, and is used to collect the cleaning fluid carried out of the cleaning chamber 41 along with the carrier. By centrally collecting the residual cleaning fluid on the surface when the carrier is removed, the collection tank prevents cleaning fluid from dripping onto the frame 1 or the ground and causing pollution. Simultaneously, it reduces cleaning fluid loss, improves the utilization rate of the cleaning fluid, and lowers production costs.

[0028] To achieve negative pressure immersion cleaning of semiconductor devices within the cleaning chamber, in this embodiment: the inlet of the cleaning chamber 41 is located above the top or side wall of the cleaning chamber 41. The cleaning chamber 41 is connected to a vacuum system for evacuating the interior of the cleaning chamber 41. Before cleaning, after the carrier enters the cleaning chamber 41, the door plate 42 closes to form a sealed cavity. The vacuum system is activated to evacuate the interior of the cleaning chamber 41 to a negative pressure state, thereby removing gas from the narrow fluid gaps between the semiconductor devices within the carrier. Under the negative pressure, the cleaning fluid is injected into the cleaning chamber 41 through the inlet. Under the action of negative pressure, the cleaning fluid quickly fills the cavity and penetrates into the narrow fluid gaps between the semiconductor devices, ensuring complete immersion of the semiconductor devices in the cleaning fluid. By first evacuating the vacuum and then injecting the cleaning fluid, the negative pressure environment eliminates air resistance within the fluid gaps, allowing the cleaning fluid to overcome surface tension and smoothly enter the tiny gaps, achieving thorough immersion and cleaning of the semiconductor device surface and gaps. After cleaning, the cleaning fluid is discharged from the drain port located at the bottom of the cleaning chamber 41, the vacuum system releases the negative pressure, and the carrier exits the cleaning chamber 41 along with the frame.

[0029] To achieve automatic transfer of carriers between workstations, in this embodiment: a handling component 9, mounted on the frame 1, is used to transfer carriers loaded with semiconductor devices between the feeding conveyor 2, the cleaning station 4, the cleaning fluid air-cutting and recovery station 5, the rinsing station 6, the rinsing fluid air-cutting and recovery station 7, the drying station 8, and the discharging conveyor 3. The handling component 9 includes a first pick-and-transfer mechanism 91 and a second pick-and-transfer mechanism 92, which independently perform the picking and transfer of carriers. By employing dual pick-and-transfer mechanisms to handle the carrier transfer in the first half of the process (from loading to rinsing) and the second half of the process (from rinsing to drying and unloading), independent transfer path planning reduces the travel distance and waiting time of individual actuators, improving the flow efficiency between workstations. Simultaneously, when one pick-and-transfer mechanism performs a pick-and-place action, the other can simultaneously perform a transfer action, achieving time overlap between carrier transfer and workstation processing, further improving equipment utilization.

[0030] To achieve the recycling of cleaning fluid at the cleaning station, in this embodiment: a cleaning circulation system is set between the cleaning station 4 and the cleaning fluid air-cutting recovery station 5. The cleaning circulation system includes a magnetic pump, which is connected to the inlet of the cleaning station 4 and the outlet of the cleaning fluid air-cutting recovery station 5 via pipelines. In the cleaning fluid air-cutting recovery station 5, a high-pressure airflow blows off the cleaning fluid carried on the carrier surface. The blown-off cleaning fluid flows into the cleaning circulation system through the outlet and is pumped by the magnetic pump back to the inlet of the cleaning station 4, thus achieving the recycling of the cleaning fluid. The magnetic pump adopts a shaft-seal-less design, avoiding external contamination caused by mechanical seal leakage during the transportation of cleaning fluid in traditional pumps. This is particularly suitable for semiconductor cleaning scenarios with extremely high cleanliness requirements, while also reducing the frequency of pump maintenance and replacement costs.

[0031] To achieve the recycling and distillation regeneration of the rinsing solution at rinsing station 6, in this embodiment: a rinsing circulation system is used for the recycling of rinsing solution within rinsing station 6. Rinsing station 6 includes a first rinsing chamber 61 and a second rinsing chamber 62. The rinsing circulation system includes a distillation tank and a condenser. The outlet of the first rinsing chamber 61 is connected sequentially to the inlet of the second rinsing chamber 62 via the distillation tank and the condenser. The outlet of the second rinsing chamber 62 is connected to the inlet of the first rinsing chamber 61, forming a unidirectional circulation conveying loop. The first rinsing chamber 61 serves as a coarse rinsing station, and the second rinsing chamber 62 serves as a fine rinsing station. The rinsing solution with a high impurity concentration in the first rinsing chamber 61 is heated and distilled in the distillation tank, and the low-boiling-point components vaporize to form steam. The steam is condensed by the condenser to form a high-purity regenerated rinsing solution, which is supplied to the second rinsing chamber 62. The rinsing solution with a lower impurity concentration after use in the second rinsing chamber 62 is returned to the first rinsing chamber 61 as a coarse rinsing solution. By setting up a unidirectional circulating conveying loop, a concentration gradient is formed between different work stations for the rinsing solution. The low-purity rinsing solution is used for the coarse rinsing process, and the high-purity regenerated solution is used for the fine rinsing process. This not only ensures the purity requirements of the second rinsing process, but also makes full use of the rinsing solution and extends its service life, reduces waste liquid discharge, and achieves the goal of environmentally friendly in-situ cleaning.

[0032] Based on the aforementioned environmentally friendly in-situ cleaning equipment for semiconductors, the specific cleaning process is as follows: S1. The carrier loaded with semiconductor devices is loaded by the feeding conveyor 2, and the carrier is transferred to the cleaning station 4 by the handling component 9. There are several narrow fluid gaps between the semiconductor devices in the carrier. Cleaning fluid is injected into the cleaning station 4 to perform immersion cleaning on the semiconductor devices.

[0033] S2. After cleaning, the carrier is transferred to the cleaning fluid air-cutting recovery station 5 via the transport component 9. The semiconductor devices on the carrier are then air-cut to recover the cleaning fluid carried on their surfaces. A cleaning circulation system is installed between the cleaning station 4 and the cleaning fluid air-cutting recovery station 5. This system returns the air-cutting recovered cleaning fluid to the cleaning station 4 via a magnetic pump, thus achieving the recycling of the cleaning fluid.

[0034] S3. The carrier that has undergone air cutting is transferred to the rinsing station 6 by the handling component 9, and rinsing solution is injected into the rinsing station 6 to perform rinsing.

[0035] S4. The carrier is transferred to the rinsing liquid air-cutting recovery station 7 via the transport component 9. The semiconductor devices on the carrier are air-cut to recover the rinsing liquid carried on their surface. A rinsing circulation system is set between the rinsing station 6 and the rinsing liquid air-cutting recovery station 7. The rinsing circulation system is used to process the rinsing liquid recovered by air-cutting and return it to the rinsing station 6. The rinsing circulation system sequentially distills and condenses the rinsing liquid recovered by air-cutting before reusing it to the rinsing station 6.

[0036] S5. The carrier that has undergone air cutting is transferred to the drying station 8 by the handling component 9 to dry the semiconductor device.

[0037] S6. The dried carrier is transferred to the discharge conveyor 3 by the handling component 9, and then the carrier is unloaded.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An environmentally friendly in-situ cleaning device for semiconductors, characterized in that, include: The frame (1), the feeding conveyor (2) and the discharging conveyor (3) are set on the frame (1), and the cleaning station (4), the cleaning fluid air-cutting and recovery station (5), the rinsing station (6), the rinsing fluid air-cutting and recovery station (7) and the drying station (8) are set between the two in sequence. The conveying assembly (9) is mounted on the frame (1) and is used to transfer the carrier loaded with semiconductor devices between the feed conveyor (2), the cleaning station (4), the cleaning fluid air-cutting and recovery station (5), the rinsing station (6), the rinsing fluid air-cutting and recovery station (7), the drying station (8) and the discharge conveyor (3). The cleaning circulation system is located between the cleaning station (4) and the cleaning fluid air-cutting recovery station (5); The rinsing circulation system is used for the recycling of rinsing solution in the rinsing station (6).

2. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 1, characterized in that, The cleaning station (4) includes a cleaning chamber (41) and a Y-axis servo module (44). The opening of the cleaning chamber (41) is fitted with a door panel (42). A guide frame (43) is provided on the side of the cleaning chamber (41) near the opening. The Y-axis servo module (44) is located on one side of the cleaning chamber (41), and a sliding seat (45) is provided at the output end of the Y-axis servo module (44). A frame seat is slidably provided at the opening of the cleaning chamber (41) along the inward extension direction. The frame seat is slidably fitted with the guide frame (43). The frame seat is used to support the carrier. The sliding seat (45) is slidably fitted to the bottom end of the frame seat through a support plate. A dual-axis drive mechanism (46) is provided on the sliding seat (45). A claw (47) is provided at the output end of the dual-axis drive mechanism (46) to cooperate with the support plate to support the frame seat in and out of the cleaning chamber (41).

3. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 2, characterized in that, The cleaning station (4) also includes a liquid collection tank, which is located between the guide frame (43) and the opening of the cleaning chamber (41) to collect the cleaning fluid carried out from the cleaning chamber (41) by the carrier.

4. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 2, characterized in that, The claw (47) includes a horizontal part and a vertical part, which are perpendicularly connected to each other to form an L-shaped structure.

5. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 1, characterized in that, The transport assembly (9) includes a first pick-and-transfer mechanism (91) and a second pick-and-transfer mechanism (92), wherein the first pick-and-transfer mechanism (91) and the second pick-and-transfer mechanism (92) independently perform the picking and transfer of the vehicle.

6. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 1, characterized in that, The cleaning circulation system includes a magnetic pump, which is connected to the inlet of the cleaning station (4) and the outlet of the washing liquid air-cutting recovery station (5) through pipelines.

7. The environmentally friendly in-situ cleaning equipment for semiconductors according to claim 1, characterized in that, The rinsing station (6) includes a first rinsing chamber (61) and a second rinsing chamber (62). The rinsing circulation system includes a distillation tank and a condenser. The outlet of the first rinsing chamber (61) is connected to the inlet of the second rinsing chamber (62) in sequence through the distillation tank and the condenser. The outlet of the second rinsing chamber (62) is connected to the inlet of the first rinsing chamber (61) to form a unidirectional circulation conveying loop.

8. An environmentally friendly in-situ cleaning process for semiconductors, characterized in that, The in-situ cleaning equipment according to any one of claims 1-7 includes the following steps: S1. The carrier loaded with semiconductor devices is loaded by the feeding conveyor (2), and the carrier is transferred to the cleaning station (4) by the handling component (9). There are several narrow fluid gaps between the semiconductor devices in the carrier. Cleaning liquid is injected into the cleaning station (4) to perform immersion cleaning on the semiconductor devices. S2. After cleaning, the carrier is transferred to the cleaning fluid air-cutting recovery station (5) by the transport component (9) to perform air-cutting treatment on the semiconductor devices on the carrier in order to recover the cleaning fluid carried on their surface; wherein, a cleaning circulation system is provided between the cleaning station (4) and the cleaning fluid air-cutting recovery station (5), and the cleaning circulation system is used to send the air-cutting recovered cleaning fluid back to the cleaning station (4). S3. The carrier that has undergone air cutting is transferred to the rinsing station (6) by the transport assembly (9), and rinsing liquid is injected into the rinsing station (6) to perform rinsing. S4. The carrier is transferred to the rinsing liquid air-cutting recovery station (7) by the transport assembly (9) to perform air-cutting treatment on the semiconductor devices on the carrier in order to recover the rinsing liquid carried on their surface; wherein, a rinsing circulation system is provided between the rinsing station (6) and the rinsing liquid air-cutting recovery station (7), and the rinsing circulation system is used to process the rinsing liquid recovered by air-cutting and send it back to the rinsing station (6). S5. The carrier that has undergone air cutting is transferred to the drying station (8) by the conveying assembly (9) to dry the semiconductor device; S6. The dried carrier is transferred to the discharge conveyor (3) by the transport assembly (9), and then the carrier is unloaded.

9. The environmentally friendly in-situ cleaning process for semiconductors according to claim 8, characterized in that, The cleaning circulation system will send the cleaning fluid recovered by the air cutter back to the cleaning station (4) through a magnetic pump to realize the recycling of the cleaning fluid.

10. The environmentally friendly in-situ cleaning process for semiconductors according to claim 8, characterized in that, The rinsing circulation system will process the rinsing liquid recovered by air cutting through distillation and condensation in sequence, and then reuse it at the rinsing station (6).

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