A semiconductor discrete device continuous intelligent packaging processing system

Abstract

The application discloses a kind of continuous intelligent packaging processing systems of semiconductor discrete device, including conveyor belt, the top of conveyor belt is provided with two groups of front and rear symmetry guide plates, the inside of two groups of guide plates is provided with the fixed part for fixing the ceramic carrier that bears wafer, the middle part of conveyor belt is provided with the frame cover for the cage cover of fixed part, the rear side inner wall of frame cover is provided with the point glue part for the wafer of the surface of ceramic carrier fixed in fixed part is glued, conveyor belt completes ceramic carrier conveying operation, cooperate with guide plate to limit orientation to material, form integrated structure, each component structure integration degree is high, coherent wafer feeding, fixed, glue dispensing and cooling processing flow.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor packaging and processing systems, and specifically relates to a continuous intelligent packaging and processing system for discrete semiconductor devices. Background Technology

[0002] Discrete semiconductor devices (such as diodes, transistors, and thyristors) are fundamental components of electronic circuits, and their packaging is crucial for their electrical performance, reliability, heat dissipation, and long-term stability. Traditional packaging processes typically employ a discrete, multi-station operation mode, involving multiple independent steps such as chip mounting, wire bonding, molding, lead trimming, testing, and marking. With the surge in demand for discrete devices from fields such as 5G communications, new energy vehicles, and industrial control, as well as the requirements for device miniaturization, high power density, and higher reliability, the traditional intermittent, highly manual packaging mode can no longer meet the demands of large-scale, high-efficiency, and high-quality production.

[0003] A single-crystal silicon packaging device for semiconductor wafer processing, disclosed in CN222057879U, includes a processing stage. The processing stage includes a motor board and a mounting cavity. A drive mechanism is slidably connected to the motor board. A steering plate is fixedly connected to the bottom end of the drive mechanism. A dispensing mechanism is fixedly connected to one end of the steering plate. A cooling mechanism is fixedly connected to the bottom surface of the mounting cavity. The cooling mechanism includes a guide valve. A gas guiding mechanism is fixedly connected to the top end of the guide valve. The system controls the drive component to move in a general direction within a cross phase slot, and then controls and adjusts the steering plate to adjust for minute directional deviations. This ensures the accuracy of the dispensing position, reduces the possibility of such failures during use, and allows cold air to frequently contact the dispensing tank, thereby reducing the temperature inside the tank and allowing the dispensing on the single-crystal silicon board to cool and solidify rapidly. This greatly reduces the probability of the dispensing mixing with dust in the air and improves the quality of the wafer.

[0004] When the aforementioned semiconductor wafer processing single-crystal silicon packaging equipment is used, it relies on manual assistance for feeding and transferring materials. The material conveying has no continuous conveying structure, the material transfer process is scattered, the connection between each processing step is poor, and the layout of each processing component of the equipment is scattered with low integration. The feeding, fixing, dispensing and cooling processes cannot be coordinated, there is a lot of manual intervention, human error is large, the production continuity is insufficient, and it is not conducive to large-scale continuous production. Summary of the Invention

[0005] The purpose of this invention is to provide a continuous intelligent packaging system for discrete semiconductor devices to solve the technical problems of high manual involvement, poor process connection, low integration, and inability to achieve linkage in existing semiconductor packaging processes.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A continuous intelligent packaging system for semiconductor discrete devices includes a conveyor belt. Two sets of guide plates symmetrically arranged front to back are mounted on the top of the conveyor belt. Fixing components for securing ceramic carriers holding wafers are installed inside the two sets of guide plates. A frame cover for enclosing the fixing components is located above the middle of the conveyor belt. A dispensing component for dispensing adhesive onto the surface of the ceramic carriers fixed within the fixing components is located on the rear inner wall of the frame cover. A rotary conveyor for transporting the ceramic carriers holding wafers between the two sets of guide plates is located at one end of each set of guide plates. A cooling component for cooling the dispensed wafers is located between the other ends of the two sets of guide plates. A controller is located at the front of the conveyor belt.

[0008] As a further embodiment of the present invention, the fixing component includes two sets of arc-shaped plates disposed between the middle of two sets of guide plates. The openings of the two sets of arc-shaped plates are arranged opposite to each other. The inner cavities of the two sets of arc-shaped plates are respectively rotatably connected to fixing plates. The ends of the two sets of fixing plates are arranged correspondingly. Sliding clamping components are provided between the two ends of the two sets of fixing plates. The bottom of the two sets of fixing plates is provided with rectangular holes for the ceramic carrier to pass through. The ceramic carrier can be conveyed by a conveyor belt and enter the interior of the two sets of arc-shaped plates through the rectangular holes. The top of one set of arc-shaped plates is provided with a rotating component for driving the two sets of fixing plates to rotate, so as to close the openings of the two sets of arc-shaped plates. The top of one set of fixing plates is provided with a driving component for synchronously driving the two sets of sliding clamping components to move inward, so as to clamp and fix the ceramic carrier entering the interior of the arc-shaped plate, which facilitates the subsequent dispensing operation of the dispensing component on the wafer.

[0009] As a further embodiment of the present invention, the sliding clamping member includes an arc-shaped clamping block disposed between the two ends of two sets of fixed plates. The openings of the two sets of arc-shaped clamping blocks are arranged opposite to each other. A pressure sensor is disposed on the lower part of the opposite side of the two sets of arc-shaped clamping blocks, and a distance sensor is disposed on the upper part of the opposite side of the two sets of arc-shaped clamping blocks. The two sets of pressure sensors and the distance sensor are electrically connected to the signal input terminal of the controller through wires.

[0010] As a further embodiment of the present invention, the driving component includes a receiving groove formed on the top of one of the fixed plates. A double-sided rack is slidably connected to the inside of the receiving groove. Gears are meshed on both sides of the double-sided rack. The two sets of gears are respectively connected to the corresponding side arc-shaped clamps through a toggle member. A nut seat is embedded at the end of the double-sided rack. A lead screw is rotatably connected inside the nut seat. The lead screw is rotatably connected inside the receiving groove. A third drive motor is provided inside the receiving groove. The output shaft of the third drive motor is keyed to one end of the lead screw. The third drive motor is controlled by a controller.

[0011] As a further embodiment of the present invention, the actuating component includes a lever plate disposed on the opposite side of the two sets of gears, the other ends of the two sets of lever plates are bent upwards toward the corresponding side arc-shaped clamping block, and a lever hole is opened at the top of the other end of each set of lever plates, and a lever rod is slidably fitted inside the lever hole.

[0012] As a further embodiment of the present invention, the rotating component includes a worm gear ring fixedly connected to the top of two sets of fixed plates. The tooth surface of the worm gear ring meshes with a worm. Bearing seats are respectively rotatably sleeved at both ends of the worm. Both sets of bearing seats are fixedly connected to the top of one set of guide plates. A first drive motor is fixedly connected to the top of one set of guide plates. The first drive motor is controlled by a controller.

[0013] As a preferred embodiment of the present invention, the dispensing component includes a dispensing tube disposed inside the frame cover, the top of the dispensing tube being connected to a solenoid valve controlled by a controller, the input end of the solenoid valve being connected to a connecting pipe, one end of the connecting pipe extending outward through the frame cover and connecting to the dispensing machine, and the top of the frame cover being provided with a pushing member for pushing the dispensing tube downward to perform dispensing operations on the wafer.

[0014] As a further embodiment of the present invention, the pusher includes a support frame fixedly installed on the top of the frame cover. An electric push rod controlled by a controller is installed on the top of the support frame. The telescopic end of the electric push rod passes downward through the support frame and is fixedly connected to a transmission tube. One end of the transmission tube passes downward through the frame cover and is fixedly connected to a push tube. The push tube is fixedly sleeved on the outer circumferential surface of the dispensing tube.

[0015] As a preferred embodiment of the present invention, the cooling component includes a hollow plate fixedly connected to the other end of each set of guide plates. Semiconductor cooling chips are sealed and embedded on the opposite side surface of the two sets of hollow plates. The heating ends of the two sets of semiconductor cooling chips are respectively located inside the corresponding side hollow plates. A heat dissipation component for cooling the two sets of semiconductor cooling chips is provided inside one set of hollow plates.

[0016] The heat sink includes an intake pipe connected to the outer side of one end of one set of hollow plates, with a filter connected to one end of the intake pipe. The inner cavities of the other ends of the two sets of hollow plates are connected together through a conduit. An output pipe is connected to the outer side of one end of the other set of hollow plates. The output pipe extends outward through the frame cover and is connected to an exhaust fan.

[0017] As a preferred embodiment of the present invention, the rotary conveyor includes a rotating disk rotatably connected between one end of two sets of guide plates. Multiple sets of U-shaped grooves are formed on the outer circumferential surface of the rotating disk. A bearing plate is provided on the top of the rotating disk. A second drive motor is fixedly installed on the top of the bearing plate. The output axis of the second drive motor passes through the bearing plate downward and is fixedly connected to the top of the rotating disk.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. This system uses a conveyor belt to transport ceramic carriers, guides materials with guide plates, and integrates a fixed component, dispensing component, cooling component, and rotating conveyor to form an integrated processing structure. The functional components are neatly arranged and highly integrated, enabling the continuous processing of wafer feeding, fixing, dispensing, and cooling. The system relies on a controller to uniformly control the operation of each component, resulting in a high degree of automation. It eliminates the need for frequent manual intervention in material transfer and processing, effectively simplifying the processing flow, reducing errors caused by manual operation, and improving the continuity of wafer dispensing processing.

[0020] 2. This system uses an arc-shaped plate and a fixed plate to cooperate with each other. The opening and closing of the arc-shaped plate is achieved by rotating the fixed plate. This allows for external enclosure and limitation of the ceramic carrier before dispensing. The rectangular hole at the bottom of the fixed plate facilitates the smooth passage of the ceramic carrier. With the help of the sliding clamping component, secondary clamping and positioning can be achieved. The dual limiting method can effectively reduce the carrier's offset and shaking during processing. At the same time, the rotating component and the driving component are arranged separately to achieve enclosure and clamping and fixing actions respectively. The structure has a clear division of labor and clear action logic, which facilitates precise control of the fixed state of the ceramic carrier. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the internal structure of the frame cover in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the worm gear ring structure in an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the gear structure in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the fixing plate in an embodiment of the present invention.

[0027] Figure label:

[0028] 100. Conveyor belt; 101. Frame cover; 102. Controller; 103. Guide plate;

[0029] 200. Hollow core plate; 201. Conductor pipe; 202. Protective cover; 203. Semiconductor cooling chip; 204. Output pipe; 205. Suction pipe; 206. Filter; 207. Exhaust fan;

[0030] 300. Dispensing hose; 301. Push tube; 302. Solenoid valve; 303. Connecting tube; 304. Transmission tube; 306. Support frame; 307. Electric push rod;

[0031] 400. Worm gear ring; 401. First drive motor; 402. Worm; 403. Bearing housing; 404. Fixing plate;

[0032] 500, U-shaped groove; 502, bearing plate; 503, second drive motor; 504, rotating disk;

[0033] 600. Gear; 601. Double-sided rack; 602. Third drive motor; 603. Dial plate; 604. Dial hole; 605. Dial lever; 606. Distance sensor; 607. Arc-shaped clamp; 608. Pressure sensor; 609. Receiving groove; 610. Lead screw; 611. Nut seat. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0035] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0036] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.

[0037] See appendix Figure 1-5As shown in the figure, an embodiment of the present invention discloses a continuous intelligent packaging process for semiconductor discrete devices, including a conveyor belt 100. Two sets of guide plates 103 are symmetrically arranged at the top of the conveyor belt 100. Fixing members for fixing ceramic carriers carrying wafers are disposed inside the two sets of guide plates 103. A frame cover 101 for covering the fixing members is disposed above the middle of the conveyor belt 100. A dispensing member for dispensing the wafers on the surface of the ceramic carriers fixed within the fixing members is disposed on the rear inner wall of the frame cover 101. A rotating conveyor for conveying the ceramic carriers carrying wafers between the two sets of guide plates 103 is disposed at one end of each set of guide plates 103. A cooling member for cooling the wafers after dispensing is disposed between the other ends of the two sets of guide plates 103. A controller 102 is disposed at the front of the conveyor belt 100.

[0038] The conveyor belt 100 completes the conveying operation of the ceramic carrier, and works with the guide plate 103 to limit and guide the material. Together with the fixing parts, dispensing parts, cooling parts and wheel conveying parts, it forms an integrated processing structure. At the same time, the functional components are arranged in a regular manner and the structure has a high degree of integration. It completes the processing flow of wafer feeding, fixing, dispensing and cooling in a continuous manner. Moreover, the controller 102 uniformly controls the operation of each component, which has a high degree of automation. It does not require frequent manual intervention in material transfer and processing, effectively simplifies the processing flow, reduces the error caused by manual operation, and improves the continuity of wafer dispensing processing.

[0039] The fixing component includes two sets of arc-shaped plates disposed between the middle of two sets of guide plates 103. The openings of the two sets of arc-shaped plates are arranged opposite each other. The inner cavities of the two sets of arc-shaped plates are rotatably connected to fixing plates 404. The ends of the two sets of fixing plates 404 are arranged correspondingly. Sliding clamping components are provided between the two ends of the two sets of fixing plates 404. The bottom of the two sets of fixing plates 404 is provided with rectangular holes for the ceramic carrier to pass through. The ceramic carrier can be conveyed by the conveyor belt 100 and enter the interior of the two sets of arc-shaped plates through the rectangular holes. The top of one set of arc-shaped plates is provided with a rotating component for driving the two sets of fixing plates 404 to rotate, so as to close the openings of the two sets of arc-shaped plates. The top of one set of fixing plates 404 is provided with a driving component for synchronously driving the two sets of sliding clamping components to move inward, so as to clamp and fix the ceramic carrier entering the interior of the arc-shaped plate, which facilitates the subsequent dispensing operation of the dispensing component on the wafer.

[0040] The curved plate and the fixed plate 404 work together. The opening and closing of the curved plate is achieved by rotating the fixed plate 404. This allows for external enclosure and limitation of the ceramic carrier before the dispensing operation. The rectangular hole at the bottom of the fixed plate 404 facilitates the smooth passage of the ceramic carrier. With the help of the sliding clamping component, secondary clamping and positioning can be achieved. The dual limiting method can effectively reduce the carrier's offset and shaking during processing. At the same time, the rotating component and the driving component are arranged separately to achieve enclosure and clamping and fixing actions respectively. The structure has a clear division of labor and clear action logic, which facilitates precise control of the fixed state of the ceramic carrier.

[0041] The sliding clamping component includes arc-shaped clamping blocks 607 disposed between the two ends of two sets of fixed plates 404. The openings of the two sets of arc-shaped clamping blocks 607 are arranged opposite each other. A pressure sensor 608 is disposed on the lower part of the opposite side of the two sets of arc-shaped clamping blocks 607, and a distance sensor 606 is disposed on the upper part of the opposite side of the two sets of arc-shaped clamping blocks 607. The pressure sensor 608 and the distance sensor 606 are all electrically connected to the signal input terminal of the controller 102 through wires. By arranging the distance sensor 606 and the distance sensor 606 on the arc-shaped clamping blocks 607 respectively... The pressure sensor 608 and the distance sensor 606 can accurately determine the conveying position of the ceramic carrier and provide a trigger signal for the subsequent closing action of the fixing plate 404, ensuring the precise timing of the equipment's actions. The pressure sensor 608 can monitor the clamping force in real time during the clamping process. Furthermore, the two types of sensors work together to achieve dual control of position detection and pressure monitoring. This ensures that the carrier is in place before the fixing operation is performed, and also avoids damage to the ceramic carrier or wafer caused by improper clamping force, thereby improving the safety and stability of the equipment operation.

[0042] Controller 102: The FX3U-16MR programmable controller 102 is selected. This controller 102 has a fast operation response speed, strong anti-interference ability, and is suitable for multi-motor and multi-sensor collaborative control of semiconductor processing equipment. It can stably receive sensor signals and accurately drive each electric actuator to move in an orderly manner.

[0043] The ranging sensor 606 is the E2E-CR8B1 photoelectric ranging sensor 606, which is small in size, easy to install, and has high detection accuracy. It can stably sense the position of the ceramic carrier and is suitable for narrow installation spaces, meeting the precise triggering requirements of this equipment.

[0044] The pressure sensor 608 is a PT124G-210 thin-film pressure sensor 608. This sensor has high sensitivity and stable pressure acquisition. It can collect the clamping pressure of the arc-shaped clamp 607 in real time, which is suitable for precision clamping and detection conditions and prevents the ceramic carrier from being damaged by overload.

[0045] The driving component includes a receiving groove 609 formed on the top of one of the fixed plates 404. A double-sided rack 601 is slidably connected to the inside of the receiving groove 609. Gears 600 mesh on both sides of the double-sided rack 601. The two sets of gears 600 are respectively connected to the corresponding side arc-shaped clamps 607 through a toggle member. A nut seat 611 is embedded at the end of the double-sided rack 601. A lead screw 610 is rotatably connected inside the nut seat 611. The lead screw 610 is rotatably connected inside the receiving groove 609. A third drive motor 602 is arranged inside the receiving groove 609. The output shaft of the third drive motor 602 is connected to one end of the lead screw 610. The key connection is used, and the third drive motor 602 is controlled by the controller 102. It adopts a transmission method of lead screw 610, nut seat 611 and double-sided rack 601. Power is provided by the third drive motor 602. Compared with the traditional push structure, the transmission operation is smooth and the transmission accuracy is high. At the same time, the rotation of lead screw 610 is converted into the linear sliding of rack, which can drive the gears 600 on both sides to operate synchronously at a uniform speed. This ensures that the opposite movement of the arc-shaped clamping blocks 607 on both sides is consistent. In addition, the pressure sensor 608 is used to finely adjust the clamping stroke in real time, which can be adapted to clamp and fix ceramic carriers of different specifications. The clamping adjustment is flexible and the application range is wider.

[0046] The actuating component includes a lever plate 603 disposed on the opposite side of the two sets of gears 600. The other ends of the two sets of lever plates 603 are bent upwards towards the corresponding arc-shaped clamping block 607. Each set of lever plates 603 has a lever hole 604 at the top of its other end. A lever 605 is slidably fitted inside each lever hole 604. By utilizing the lever plate 603, lever hole 604, and lever 605 to form a sliding engagement transmission structure, the rotational power of the gears 600 is smoothly transmitted to the arc-shaped clamping block 607. The bent lever plate 603 structure is adapted to the installation space of the fixed plate 404 and the clamping block. The structure is compact and does not occupy extra space. Furthermore, the sliding engagement between the lever hole 604 and the lever 605 can compensate for positional deviations during transmission, reduce the probability of mechanical jamming and transmission jamming, improve the smoothness of clamping action, and ensure the service life of long-term frequent reciprocating clamping operations.

[0047] The rotating component includes a worm gear ring 400 fixedly connected to the top of two sets of fixed plates 404. The tooth surface of the worm gear ring 400 meshes with a worm 402. Bearing seats 403 are rotatably sleeved at both ends of the worm 402. Both sets of bearing seats 403 are fixedly connected to the top of one set of guide plates 103. A first drive motor 401 is fixedly connected to the top of one set of guide plates 103. The first drive motor 401 is controlled by a controller 102 and drives the fixed plates 404 to rotate through the transmission method of meshing the worm gear ring 400 and the worm 402. This transmission structure has a self-locking function. After the fixed plates 404 rotate to the closed position, they can lock themselves and are not easily displaced by external force vibration, ensuring the stability of the arc plate after closing. In addition, the first drive motor 401 has a smooth power output, low noise during transmission, and uniform rotation. It can accurately control the opening and closing action of the fixed plates 404, providing stable external protection for the ceramic carrier, avoiding displacement of the carrier during dispensing, and improving the accuracy of dispensing operation.

[0048] The dispensing assembly includes a dispensing tube 300 housed inside a frame cover 101. The top of the dispensing tube 300 is connected to a solenoid valve 302 controlled by a controller 102. The input end of the solenoid valve 302 is connected to a connecting pipe 303. One end of the connecting pipe 303 extends outward through the frame cover 101 and connects to a dispensing machine. A pusher is located at the top of the frame cover 101 to push the dispensing tube 300 downwards, thereby performing dispensing operations on the wafer. The dispensing tube 300, in conjunction with the solenoid valve 302, controls the flow of adhesive, precisely managing the timing of adhesive flow and preventing unauthorized dripping and material contamination. The connecting pipe 303 connects to an external dispensing machine, ensuring convenient and stable adhesive supply. The pusher also allows for vertical displacement adjustment of the dispensing tube 300. The frame cover 101 provides shielding protection for the entire dispensing area, isolating it from external dust, airflow, and other interference factors, preventing the external environment from affecting the dispensing effect and effectively improving the uniformity of adhesive dispensing on the wafer surface.

[0049] The pushing component includes a support frame 306 fixedly mounted on the top of the frame cover 101. An electric push rod 307 controlled by the controller 102 is mounted on the top of the support frame 306. The telescopic end of the electric push rod 307 passes downward through the support frame 306 and is fixedly connected to a transmission tube 304. One end of the transmission tube 304 passes downward through the frame cover 101 and is fixedly connected to a push tube 301. The push tube 301 is fixedly sleeved on the outer circumference of the dispensing tube 300. The pushing component uses the electric push rod 307 as a power source. The transmission tube 304 and the push tube 301 work together to drive the dispensing tube 300 to move vertically. The transmission structure is rigid and the displacement control is precise. The support frame 306 provides stable support for the electric push rod 307, ensuring that the push rod does not shake during the telescopic process. This allows the dispensing tube 300 to approach the wafer surface vertically and stably, preventing the dispensing tube 300 from tilting and causing the dispensing position to shift.

[0050] The cooling component includes a hollow plate 200 fixedly connected to the other end of each set of guide plates 103. Semiconductor cooling chips 203 are sealed and embedded on the opposite side surface of the two sets of hollow plates 200. The heating ends of the two sets of semiconductor cooling chips 203 are located inside the corresponding side hollow plates 200. A heat dissipation component for cooling the two sets of semiconductor cooling chips 203 is provided inside one set of hollow plates 200.

[0051] The heat sink includes an intake pipe 205 connected to the outer side of one end of one set of hollow plates 200. One end of the intake pipe 205 is connected to a filter 206. The inner cavities of the other ends of the two sets of hollow plates 200 are connected together through a conduit 201. One end of the other set of hollow plates 200 is connected to an output pipe 204. The output pipe 204 extends outward through the frame cover 101 and is connected to an exhaust fan 207. The wafer after dispensing is cooled by using a semiconductor cooling chip 203. The cooling response is fast, which can quickly accelerate the curing of the adhesive and shorten the processing interval. The heating end of the semiconductor cooling chip 203 is placed inside the hollow plate 200. Together with the heat sink, it forms an active heat dissipation structure. The exhaust fan 207, together with the filter 206 and the conduit 201, forms a circulating airflow, which can remove the heat generated by the cooling chip in time. This not only avoids heat accumulation that affects the cooling effect, but also filters impurities in the air, prevents dust from adhering to the surface of the components, and ensures the long-term stable operation of the cooling components. A protective cover 202 is fixedly connected to the top of the two sets of hollow panels 200 to prevent cold air from escaping.

[0052] The rotary conveyor includes a rotating disk 504 rotatably connected between one end of two sets of guide plates 103. Multiple sets of U-shaped grooves 500 are formed on the outer circumferential surface of the rotating disk 504. A bearing plate 502 is provided on the top of the rotating disk 504. A second drive motor 503 is fixedly installed on the top of the bearing plate 502. The output shaft of the second drive motor 503 passes downward through the bearing plate 502 and is fixedly connected to the top of the rotating disk 504. The rotary conveyor drives the rotating disk 504 to rotate by the second drive motor 503. The ceramic carrier is placed by using the U-shaped grooves 500 on the surface of the rotating disk 504. The material is placed stably and is not easy to slip. Furthermore, the rotary intermittent feeding method ensures that the feeding rhythm is uniform and controllable, and the carrier can be transported between the guide plates 103 in an orderly manner, avoiding material accumulation and disordered conveying.

[0053] The first drive motor 401, the second drive motor 503, and the third drive motor 602 are preferably Huichuan MS1H1-10B30CB-A331Z servo motors. The motors have built-in EA79 series 23-bit absolute encoders, which can provide real-time feedback on motor rotation angle and position information. The position memory is not lost after power failure, ensuring that the station position can be accurately reproduced without returning to zero each time it starts, meeting the high-precision control requirements of wafer dispensing and clamping operations.

[0054] When the equipment is working, the rotating conveyor completes the feeding and conveying operation. The second drive motor 503 drives the rotating disk 504 to rotate continuously. Multiple sets of U-shaped grooves 500 on the outer periphery of the rotating disk 504 sequentially receive the ceramic carriers carrying the wafers. Through the intermittent feeding of the rotating disk 504, the ceramic carriers are smoothly fed between the two sets of guide plates 103. The guide plates 103 laterally limit the ceramic carriers, so that the ceramic carriers fall stably on the surface of the conveyor belt 100 and are conveyed forward with the conveyor belt 100.

[0055] When the ceramic carrier moves with the conveyor belt 100 to the fixed position, the ceramic carrier passes through the rectangular hole at the bottom of the fixed plate 404 and enters the interior of the two sets of arc plates. The distance sensor 606 set on the upper part of the arc clamp 607 detects the entry position of the ceramic carrier in real time. When the ceramic carrier is detected to have reached the designated work station, the distance sensor 606 transmits the detection signal to the controller 102.

[0056] After receiving the signal, the controller 102 controls the first drive motor 401 to start. The first drive motor 401 drives the worm gear 402 to rotate. The worm gear 402 meshes with the worm wheel ring 400 to drive the fixed plate 404 to rotate, so that the two sets of fixed plates 404 move closer to each other, close the opening of the arc plate, and form an outer closed limit for the ceramic carrier.

[0057] After the arc plate closes, the controller 102 controls the drive components to work. After the arc plate closes, the controller 102 controls the third drive motor 602 to start. The third drive motor 602 drives the lead screw 610 to rotate inside the receiving groove 609. The lead screw 610, in conjunction with the nut seat 611, drives the double-sided rack 601 to slide linearly inside the receiving groove 609. The double-sided rack 601 slides inside the receiving groove 609. The gears 600 mesh on both sides of the double-sided rack 601 and rotate synchronously. The gears 600 drive the actuating component to move. The actuating plate 603 rotates with the gear 600 and, in conjunction with the sliding engagement between the actuating hole 604 and the actuating rod 605, drives the two arc-shaped clamping blocks 607 to move towards each other, clamping and fixing the ceramic carrier inward.

[0058] During the clamping process, the pressure sensor 608 at the bottom of the arc-shaped clamping block 607 collects the clamping pressure signal in real time and feeds it back to the controller 102. The controller 102 adjusts the clamping state in real time according to the pressure feedback to keep the ceramic carrier centered and fixed, avoid damage caused by excessive clamping, and prevent displacement and shaking during the dispensing process.

[0059] After the ceramic carrier completes its positioning and clamping, the equipment enters the dispensing process. The frame cover 101 encloses and shields the dispensing area to prevent external impurities from affecting the dispensing quality. The controller 102 controls the extension and retraction of the electric push rod 307. The electric push rod 307 drives the push tube 301 to move downward through the transmission tube 304, thereby pushing the dispensing tube 300 downward and closer to the wafer surface. At the same time, the dispensing machine delivers adhesive to the dispensing tube 300 through the connecting tube 303. The controller 102 uses the solenoid valve 302 to control the on / off of the dispensing tube 300, realizing precise dispensing operations on the wafer.

[0060] After the dispensing process is completed, each structure is reset in sequence. The third drive motor 602 rotates in reverse, causing the double-sided rack 601 to reset and slide. The sliding clamp releases the ceramic carrier, and the rotating part rotates in reverse to open the arc-shaped plate opening, releasing the limit constraint. The conveyor belt 100 continues to drive the ceramic carrier to the cooling part position.

[0061] Two sets of hollow plates 200 are embedded on opposite sides with semiconductor cooling chips 203 to cool and reduce the temperature of the wafer after dispensing, accelerating the curing of the adhesive. The heating end of the semiconductor cooling chip 203 is placed inside the hollow plate 200. The exhaust fan 207 generates negative pressure. Outside air is filtered by the filter 206 and enters the hollow plate 200 through the suction pipe 205. The airflow passes through the heating end of the semiconductor cooling chip 203 and carries away the heat. The airflow after heat exchange is discharged to the outside through the conduction pipe 201 and the output pipe 204, realizing continuous heat dissipation of the semiconductor cooling chip 203 and ensuring the long-term stable operation of the cooling structure.

[0062] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A continuous intelligent packaging system for semiconductor discrete devices, characterized in that: The system includes a conveyor belt (100), with two sets of guide plates (103) arranged symmetrically at the top of the conveyor belt (100). The two sets of guide plates (103) are equipped with fixing members for fixing ceramic carriers carrying wafers. A frame cover (101) is provided above the middle of the conveyor belt (100) to cover the fixing members. The rear inner wall of the frame cover (101) is equipped with a dispensing member for dispensing the wafers on the surface of the ceramic carriers fixed in the fixing members. One end of the two sets of guide plates (103) is equipped with a rotary conveyor for conveying the ceramic carriers carrying wafers between the two sets of guide plates (103). The other end of the two sets of guide plates (103) is equipped with a cooling member for cooling the wafers after dispensing. A controller (102) is provided on the front side of the conveyor belt (100).

2. The continuous intelligent packaging system for semiconductor discrete devices according to claim 1, characterized in that: The fixing component includes two sets of arc-shaped plates disposed between the middle of two sets of guide plates (103). The openings of the two sets of arc-shaped plates are arranged opposite each other. The inner cavities of the two sets of arc-shaped plates are respectively rotatably connected to fixing plates (404). The ends of the two sets of fixing plates (404) are arranged correspondingly. Sliding clamping components are provided between the two ends of the two sets of fixing plates (404). The bottom of the two sets of fixing plates (404) is provided with rectangular holes for ceramic carriers to pass through. The ceramic carriers can be transported by the conveyor belt (100) and enter the interior of the two sets of arc-shaped plates through the rectangular holes. The top of one set of arc-shaped plates is provided with a rotating component for driving the two sets of fixing plates (404) to rotate so as to close the openings of the two sets of arc-shaped plates. The top of one set of fixing plates (404) is provided with a driving component for synchronously driving the two sets of sliding clamping components to move inward so as to clamp and fix the ceramic carriers entering the interior of the arc-shaped plates, which facilitates the subsequent dispensing operation of the dispensing component on the wafer.

3. The continuous intelligent packaging system for semiconductor discrete devices according to claim 2, characterized in that: The sliding clamping component includes an arc-shaped clamping block (607) disposed between the two ends of two sets of fixed plates (404). The openings of the two sets of arc-shaped clamping blocks (607) are arranged opposite each other. A pressure sensor (608) is disposed on the lower part of the opposite side of the two sets of arc-shaped clamping blocks (607), and a distance sensor (606) is disposed on the upper part of the opposite side of the two sets of arc-shaped clamping blocks (607). The pressure sensor (608) and the distance sensor (606) are all electrically connected to the signal input terminal of the controller (102) through wires.

4. The continuous intelligent packaging system for semiconductor discrete devices according to claim 3, characterized in that: The driving component includes a receiving groove (609) opened on the top of one of the fixed plates (404). A double-sided rack (601) is slidably connected to the inside of the receiving groove (609). Gears (600) are meshed on both sides of the double-sided rack (601). The two sets of gears (600) are respectively connected to the corresponding side arc-shaped clamps (607) through a toggle member. A nut seat (611) is embedded at the end of the double-sided rack (601). A lead screw (610) is rotatably connected inside the nut seat (611). The lead screw (610) is rotatably connected inside the receiving groove (609). A third drive motor (602) is provided inside the receiving groove (609). The output shaft of the third drive motor (602) is keyed to one end of the lead screw (610). The third drive motor (602) is controlled by a controller (102).

5. The continuous intelligent packaging system for semiconductor discrete devices according to claim 4, characterized in that: The actuating component includes a lever (603) disposed on the opposite side of the two sets of gears (600). The other ends of the two sets of levers (603) are bent upwards toward the corresponding side arc-shaped clamp (607). Each set of levers (603) has a lever hole (604) at the top of the other end. Each set of lever holes (604) has a lever (605) slidingly fitted inside.

6. The continuous intelligent packaging system for semiconductor discrete devices according to claim 5, characterized in that: The rotating component includes a worm gear ring (400) fixedly connected to the top of two sets of fixed plates (404). The tooth surface of the worm gear ring (400) meshes with a worm (402). The two ends of the worm (402) are respectively rotatably sleeved with bearing seats (403). Both sets of bearing seats (403) are fixedly connected to the top of one set of guide plates (103). The top of one set of guide plates (103) is fixedly connected to a first drive motor (401). The first drive motor (401) is controlled by a controller (102).

7. The continuous intelligent packaging system for semiconductor discrete devices according to claim 1, characterized in that: The dispensing component includes a dispensing tube (300) disposed inside the frame cover (101). The top of the dispensing tube (300) is connected to a solenoid valve (302) controlled by a controller (102). The input end of the solenoid valve (302) is connected to a connecting pipe (303). One end of the connecting pipe (303) extends outward through the frame cover (101) and is connected to the dispensing machine. The top of the frame cover (101) is provided with a pusher for pushing the dispensing tube (300) downward to perform dispensing operations on the wafer.

8. The continuous intelligent packaging system for semiconductor discrete devices according to claim 7, characterized in that: The pusher includes a support frame (306) fixedly installed on the top of the frame cover (101). An electric push rod (307) controlled by a controller (102) is installed on the top of the support frame (306). The telescopic end of the electric push rod (307) passes downward through the support frame (306) and is fixedly connected to a transmission tube (304). One end of the transmission tube (304) passes downward through the frame cover (101) and is fixedly connected to a push tube (301). The push tube (301) is fixedly sleeved on the outer circumferential surface of the dispensing tube (300).

9. The continuous intelligent packaging system for semiconductor discrete devices according to claim 1, characterized in that: The cooling component includes a hollow plate (200) fixedly connected to the other end of each set of guide plates (103). Semiconductor cooling chips (203) are sealed and embedded on the opposite side surface of the two sets of hollow plates (200). The heating ends of the two sets of semiconductor cooling chips (203) are respectively located inside the corresponding side hollow plates (200). A heat dissipation component for cooling the two sets of semiconductor cooling chips (203) is provided inside one set of hollow plates (200). The heat dissipation component includes an intake pipe (205) connected to the outer side of one end of one set of hollow plates (200), one end of the intake pipe (205) is connected to a filter (206), the inner cavities of the other ends of the two sets of hollow plates (200) are connected together by a guide pipe (201), and one end of the outer side of the other set of hollow plates (200) is connected to an output pipe (204), the output pipe (204) extends outward through the frame cover (101) and is connected to an exhaust fan (207).

10. The continuous intelligent packaging system for semiconductor discrete devices according to claim 1, characterized in that: The rotary conveyor includes a rotating disk (504) rotatably connected between one end of two sets of guide plates (103). The outer circumferential surface of the rotating disk (504) is provided with multiple sets of U-shaped grooves (500). A bearing plate (502) is provided on the top of the rotating disk (504). A second drive motor (503) is fixedly installed on the top of the bearing plate (502). The output axis of the second drive motor (503) passes through the bearing plate (502) downward and is fixedly connected to the top of the rotating disk (504).

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