Dual-rail synchronization method based on position regulation

Abstract

The application belongs to the technical field of silicon wafer conveying equipment, and discloses a double-track synchronization method based on position regulation. The double-track synchronization method based on position regulation synchronously regulates the operation speed of two silicon wafer conveying tracks by independently regulating the operation speed of the two silicon wafer conveying tracks, does not need to stop the operation of any silicon wafer conveying track, and can continuously perform the conveying process, thereby effectively avoiding the interruption of the conveying process and helping to improve the overall production efficiency. In addition, the synchronization regulation process is entirely performed by an automatic system, does not need manual intervention throughout the process, can effectively reduce the subjective position deviation caused by manual operation, helps to maintain the flush precision of the corresponding silicon wafers on the two silicon wafer conveying tracks within a preset range, provides a relatively consistent silicon wafer position reference for subsequent detection, processing and other processes, and further helps to improve the product yield.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer transmission equipment technology, and in particular to a dual-track synchronization method based on position control. Background Technology

[0002] In order to improve the production efficiency of silicon wafers, existing technologies typically use a dual-track parallel method to transport silicon wafers, so as to carry out continuous processes such as feeding, inspection and processing, and adapt to the operational requirements of subsequent processing equipment.

[0003] To address the issue of uneven silicon wafer positions during dual-track transport, existing technologies primarily employ two methods for adjustment: first, stopping one conveyor belt and restarting it after the silicon wafers are aligned; second, manually adjusting the silicon wafer positions to ensure they are aligned during dual-track transport.

[0004] However, stopping the conveyor belt will interrupt the transmission process and reduce production efficiency; while manual adjustment is prone to positional deviation, which can affect the accuracy of subsequent inspection, processing and other processes, thus reducing the product yield.

[0005] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a dual-track synchronization method based on position control to avoid interruption of the transmission process and help improve overall production efficiency.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A dual-track synchronization method based on position control includes the following steps:

[0009] It provides two parallel and independently operating silicon wafer transport tracks;

[0010] A position detection unit is set up, which detects the position information of the corresponding silicon wafers on the two silicon wafer transport tracks respectively;

[0011] A control unit is provided, which is communicatively connected to the position detection unit. The control unit controls the operation of the two silicon wafer transport tracks according to the position information, so that the corresponding silicon wafers on the two silicon wafer transport tracks are kept flush at a preset target position.

[0012] An anomaly handling unit is set up, which is communicatively connected to the control unit. When the position information indicates that the position deviation of the corresponding silicon wafer on the two silicon wafer transmission tracks exceeds the preset range or a single track is missing a wafer, the anomaly handling unit skips the synchronization adjustment process and executes the corresponding anomaly transmission process.

[0013] Preferably, the silicon wafer transport track includes multiple transport segments connected in series, at least one of the multiple transport segments is an alignment segment, and the position detection unit is set corresponding to the alignment segment.

[0014] Preferably, the control unit controls the operation of the alignment segment based on the time difference or position difference between corresponding silicon wafers on the two silicon wafer transport tracks detected by the position detection unit.

[0015] Preferably, when silicon wafers on the two silicon wafer transport tracks arrive at the alignment section one after the other, the control unit reduces the running speed of the alignment section where the silicon wafer that arrives first is located, and / or increases the running speed of the alignment section where the silicon wafer that arrives later is located.

[0016] Preferably, multiple alignment segments are connected in series on each silicon wafer transport track. When the alignment segment of the previous stage cannot adjust the positional deviation of the corresponding silicon wafer to a preset range, the alignment segment of the next stage continues to adjust, so as to gradually reduce the positional deviation of the corresponding silicon wafer on the two silicon wafer transport tracks.

[0017] Preferably, the position detection unit includes two inlet sensors, which are respectively set at the inlet positions of the alignment sections of the two silicon wafer transport tracks.

[0018] Preferably, the length of each alignment segment is greater than the length of the silicon wafer and only one silicon wafer is carried at a time.

[0019] Each alignment segment is equipped with an exit sensor at its exit position, which is used to detect whether the silicon wafer has left the alignment segment.

[0020] Preferably, the position detection unit includes two trigger sensors, which are installed at the same straight line position on the two silicon wafer transport tracks to form a unified starting line;

[0021] When the silicon wafer moves along the silicon wafer transport track to the unified starting line, the trigger sensor is triggered, and the control unit controls the silicon wafer to move a preset distance along the silicon wafer transport track and then stop.

[0022] The control unit controls the two silicon wafer transport tracks to start synchronously, driving the corresponding silicon wafers to be transported downstream synchronously.

[0023] Preferably, the unified starting line is set upstream of the next processing station, and the silicon wafer is sent into the next processing station after synchronous alignment is completed.

[0024] Preferably, the corresponding abnormal transmission process includes:

[0025] When a single-track wafer shortage is detected, the anomaly handling unit controls the arrived silicon wafers to perform a single-track independent transmission process.

[0026] When the positional deviation of the corresponding silicon wafer on the two silicon wafer transport tracks exceeds the preset range, the anomaly processing unit will directly determine the corresponding silicon wafer as a defective product and reject it.

[0027] The beneficial effects of this invention are:

[0028] The dual-track synchronization method based on position control provided by this invention achieves synchronous adjustment by independently controlling the running speed of two silicon wafer transport tracks. It does not require stopping the operation of either silicon wafer transport track, and the transport process can continue continuously, thereby effectively avoiding interruptions in the transport process and helping to improve overall production efficiency.

[0029] In addition, the entire synchronization adjustment process is executed by an automated system. The position detection unit can collect the position information of the corresponding silicon wafers on the two silicon wafer transport tracks in real time. The control unit adjusts the speed based on the position information. No manual intervention is required throughout the process, which can effectively reduce the subjective position deviation caused by manual operation. This helps to maintain the alignment accuracy of the corresponding silicon wafers on the two silicon wafer transport tracks within the preset range, providing a relatively consistent silicon wafer position reference for subsequent inspection, processing and other processes, thereby helping to improve product yield. Attached Figure Description

[0030] Figure 1 This is a flowchart of the dual-track synchronization method based on position control provided by the present invention;

[0031] Figure 2 This is a flowchart illustrating the application of the position-controlled dual-track synchronization method provided by the present invention to a segmented transmission mode;

[0032] Figure 3 This is a flowchart illustrating the application of the position-controlled dual-track synchronization method provided by the present invention to a continuous transmission mode;

[0033] Figure 4 This is a schematic diagram of the dual-track synchronization method based on position control provided by the present invention applied to a segmented transmission mode;

[0034] Figure 5 This is a schematic diagram of the dual-track synchronization method based on position control provided by the present invention applied to a continuous transmission mode.

[0035] In the picture:

[0036] 100. Processing station;

[0037] 1. Silicon wafer transport track; 11. Transport section; 12. Alignment section; 2. Inlet sensor; 3. Outlet sensor; 4. Trigger sensor; 5. Unified starting line. Detailed Implementation

[0038] The invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the drawings, not the entire structure.

[0039] In the description of the invention, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the invention based on the specific circumstances.

[0040] In this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0042] Please see Figure 1 This embodiment provides a dual-track synchronization method based on position control, including the following steps:

[0043] Provide two parallel and independently operating silicon wafer transfer tracks 1;

[0044] A position detection unit is set up to detect the position information of the corresponding silicon wafers on the two silicon wafer transport tracks 1 respectively;

[0045] A control unit is set up, which is connected to the position detection unit. The control unit controls the operation of the two silicon wafer transfer tracks 1 according to the position information, so that the corresponding silicon wafers on the two silicon wafer transfer tracks 1 are kept flush at the preset target position.

[0046] An anomaly handling unit is set up, which is connected to the control unit. When the position information indicates that the position deviation of the corresponding silicon wafer on the two silicon wafer transmission tracks 1 exceeds the preset range or a single track is missing a wafer, the anomaly handling unit skips the synchronization adjustment process and executes the corresponding anomaly transmission process.

[0047] Understandably, by independently controlling the operating speed of the two silicon wafer transport tracks 1 to achieve synchronous adjustment, there is no need to stop the operation of either silicon wafer transport track 1, and the transport process can continue continuously, thereby effectively avoiding interruptions in the transport process and helping to improve overall production efficiency.

[0048] It is also understandable that the entire synchronization adjustment process is executed by an automated system. The position detection unit can collect the position information of the corresponding silicon wafers on the two silicon wafer transport tracks 1 in real time. The control unit adjusts the speed based on the position information. No manual intervention is required throughout the process, which can effectively reduce the subjective position deviation caused by manual operation. This helps to maintain the alignment accuracy of the corresponding silicon wafers on the two silicon wafer transport tracks 1 within the preset range, providing a relatively consistent silicon wafer position reference for subsequent inspection, processing and other processes, thereby helping to improve product yield.

[0049] It should be noted that the silicon wafer transport track 1 can be a belt-type or roller-type transport line. Each silicon wafer transport track 1 is equipped with an independent servo drive motor and a corresponding motor driver. The position detection unit can be a through-beam photoelectric sensor or a laser displacement sensor, installed at the corresponding detection points of the two silicon wafer transport tracks 1. The real-time position deviation is calculated by comparing the trigger signals when the silicon wafer passes over it. The control unit and the abnormal handling unit integrated within it can be implemented using a programmable logic controller or an industrial-grade microcontroller. It has a pre-stored speed adjustment algorithm based on position deviation and abnormal working condition judgment logic, which can output differentiated speed commands to achieve dynamic synchronization, and automatically execute a preset abnormal transmission process when the position deviation exceeds the limit or a single track is missing a wafer.

[0050] Specifically, the corresponding abnormal transmission process includes:

[0051] When a single-track wafer shortage is detected, the anomaly handling unit controls the arriving silicon wafers to perform a single-track independent transfer process.

[0052] When the positional deviation of the corresponding silicon wafer on the two silicon wafer transport tracks 1 exceeds the preset range, the anomaly processing unit will directly determine the corresponding silicon wafer as a defective product and reject it.

[0053] With this configuration, the abnormality handling unit controls the arrived silicon wafers to perform a single-track independent transmission process, which enables the normally operating silicon wafer transmission track 1 to continue transporting silicon wafers downstream. The abnormality of missing wafers on one silicon wafer transmission track 1 will not affect the normal transmission of another silicon wafer transmission track 1, which helps to reduce production downtime under abnormal operating conditions and maintain the relative stability of overall production efficiency.

[0054] In addition, the anomaly handling unit directly identifies the corresponding silicon wafer as a defective product and removes it. It can intercept defective silicon wafers at the source and prevent them from entering the downstream process, thus avoiding the waste of raw materials and processing time and helping to ensure product yield.

[0055] See Figure 2 and Figure 4 In this embodiment, the silicon wafer transmission track 1 includes a plurality of transmission segments 11 connected in series, at least one of the plurality of transmission segments 11 is an alignment segment 12, and the position detection unit is set corresponding to the alignment segment 12.

[0056] With this configuration, the silicon wafer transport track 1 includes multiple transport segments 11 connected in series, forming a structure with segmented transport mode. Synchronous adjustment is only performed within the alignment segment 12. The control unit only needs to adjust the running speed of the alignment segment 12 to achieve silicon wafer alignment without changing the running state of other transport segments 11. This avoids the impact of full track speed adjustment on the transport rhythm of front-end and back-end feeding, inspection, and processing processes, and helps maintain the stable operation of each process.

[0057] Furthermore, the position detection unit is positioned corresponding to the alignment segment 12, enabling centralized detection of the silicon wafer position within a preset synchronous adjustment area, reducing the accumulation of positional errors that may occur during long-distance transmission. Simultaneously, the control unit only needs to adjust the speed of the relatively short alignment segment 12, resulting in a higher response speed and control precision, which helps maintain the alignment accuracy of corresponding silicon wafers on the two silicon wafer transmission tracks 1 within a more optimal range.

[0058] Generally speaking, different types of position detection units can output different signal forms. Some detection units can output the time difference signal of the corresponding silicon wafer passing through the detection point on the two silicon wafer transmission tracks 1, such as photoelectric sensors; some detection units can directly output the position difference signal of the corresponding silicon wafer, such as laser displacement sensors and vision inspection sensors.

[0059] Correspondingly, the control unit controls the operation of the alignment segment 12 based on the time difference or position difference between the corresponding silicon wafers on the two silicon wafer transport tracks 1 detected by the position detection unit. Thus, the control unit supports controlling the operation of the alignment segment 12 based on either time difference or position difference signals, is compatible with different types of position detection units, and helps reduce the hardware adaptation cost of the system.

[0060] Furthermore, when the silicon wafers on the two silicon wafer transport tracks 1 arrive at the alignment section 12 one after the other, the control unit reduces the running speed of the alignment section 12 where the silicon wafer that arrives first is located, and / or increases the running speed of the alignment section 12 where the silicon wafer that arrives later is located.

[0061] This configuration supports reducing the running speed of the alignment segment 12 where the silicon wafer arrives first, increasing the running speed of the alignment segment 12 where the silicon wafer arrives later, or a combination of both. The control unit can select the most suitable adjustment method based on the actual positional deviation of the corresponding silicon wafers on the two silicon wafer transmission tracks 1. This can adapt to different degrees of positional deviation conditions, help shorten the response time of synchronous adjustment, and improve the overall efficiency of synchronous adjustment.

[0062] By adjusting the speed of the two alignment sections 12 in tandem, the required total speed adjustment is distributed across the two tracks, making the speed change of each track relatively smaller. This reduces the instantaneous operating load of the drive components to a certain extent, helps reduce wear on the components, and extends the service life of the alignment section 12 and other related equipment.

[0063] To further improve the synchronous adjustment effect under conditions of large deviation, multiple alignment segments 12 are connected in series on each silicon wafer transmission track 1. When the current level alignment segment 12 cannot adjust the position deviation of the corresponding silicon wafer to the preset range, the next level alignment segment 12 continues to adjust, so as to gradually reduce the position deviation of the corresponding silicon wafer on the two silicon wafer transmission tracks 1.

[0064] Understandably, the length of a single alignment segment 12 is limited, resulting in a short time window for speed adjustment. When the initial positional deviation of corresponding silicon wafers on the two silicon wafer transmission tracks 1 is large, a single-segment adjustment may not be able to reduce the deviation to the preset range within the limited transmission distance. However, a multi-stage series alignment segment 12 can provide a longer adjustment distance and more adjustment opportunities. By gradually reducing the positional deviation through multi-segment relay-style speed adjustment, it helps to cover operating conditions with larger deviations.

[0065] Meanwhile, the multi-level alignment segment 12 can distribute the total adjustment amount to multiple transmission segments 11, and each segment only needs to make a small speed adjustment, which helps to maintain the stability of the silicon wafer during transmission and reduce the risk of secondary offset of the silicon wafer position caused by sudden speed changes.

[0066] In addition, the multi-level alignment segment 12 can be set with different adjustment parameters according to functional requirements. The first few alignment segments 12 can be coarsely adjusted with a relatively fast adjustment speed to quickly reduce the large initial position deviation; the last alignment segment 12 can be finely adjusted with a relatively slow adjustment speed to ensure the final alignment accuracy. This helps to meet the alignment accuracy requirements while taking into account the overall synchronous adjustment efficiency.

[0067] Specifically, the position detection unit includes two entry sensors 2, which are respectively set at the entry positions of the alignment sections 12 of the two silicon wafer transport tracks 1. This allows the initial positional deviation between the two silicon wafers to be detected as soon as they enter the alignment section 12. Based on this initial deviation, the control unit can adjust the speed of the silicon wafers throughout their entire transport journey within the alignment section 12, avoiding the problem of insufficient adjustment time due to late detection point setting, which prevents synchronization from being completed before the silicon wafers leave the alignment section 12.

[0068] In addition, compared to dynamic continuous detection and real-time speed adjustment during transmission, the open-loop pre-calculation method based on the initial deviation at the inlet can reduce frequent speed adjustments and help make the speed adjustment process more stable and controllable.

[0069] Furthermore, each alignment segment 12 is longer than the length of the silicon wafer and carries only one silicon wafer at a time. An exit sensor 3 is provided at the exit position of each alignment segment 12, which is used to detect whether the silicon wafer has left the alignment segment 12.

[0070] The length of each alignment segment 12 is greater than the length of the silicon wafer, which ensures that the silicon wafer is completely within the range of a single alignment segment 12 throughout the entire adjustment process and will not simultaneously cross over two transmission segments 11. At the same time, each alignment segment 12 carries only one silicon wafer, so that the speed adjustment of each segment is only performed on the current single silicon wafer and will not interfere with the transmission status of other silicon wafers in the same segment or the transmission status of the preceding and following segments, which helps to improve the independence and controllability of single-segment synchronous adjustment.

[0071] Furthermore, an exit sensor 3 is installed at the exit position of each alignment segment 12 to detect in real time whether the silicon wafer has left the current alignment segment 12. The control unit can control the timing of the next silicon wafer entering the current alignment segment 12 based on the detection signal from the exit sensor 3, ensuring that each alignment segment 12 carries only one silicon wafer at a time, avoiding silicon wafer stacking or collisions, and helping to ensure that the multi-stage series alignment segments 12 complete the relay-style synchronous adjustment in an orderly manner according to the preset logic.

[0072] See Figure 3 and Figure 5 In other embodiments, the position detection unit includes two trigger sensors 4, which are installed at the same straight line position on the two silicon wafer transport tracks 1 to form a unified starting line 5. When the silicon wafer moves with the silicon wafer transport track 1 to the unified starting line 5, the trigger sensors 4 are triggered, and the control unit controls the corresponding silicon wafer transport track 1 to drive the silicon wafer to travel a preset distance and then stop. The control unit controls the two silicon wafer transport tracks 1 to start synchronously, driving the corresponding silicon wafers to be transported downstream synchronously.

[0073] It is understandable that both silicon wafer transmission tracks 1 adopt a continuous transmission method. By setting a unified starting line 5 at the same straight position on the two silicon wafer transmission tracks 1, the control unit only needs to execute a fixed timing process, without the need for complex closed-loop speed regulation algorithms and real-time position tracking, which helps to reduce the difficulty of developing control programs and the workload of on-site debugging.

[0074] In addition, the corresponding silicon wafers on the two silicon wafer transport tracks 1 are all based on the same unified starting line 5 and stop after traveling the same preset fixed distance. This ensures that the position reference of the two silicon wafers is highly consistent. The alignment accuracy mainly depends on the positioning accuracy of the drive mechanism, which helps to reduce random error fluctuations during the dynamic adjustment process.

[0075] If there is a long transmission distance between the unified starting line 5 and the next processing station 100, the silicon wafer may experience new positional deviations during its downstream transmission after synchronous alignment due to factors such as conveyor belt slippage, track vibration, and uneven friction between the silicon wafer and the transmission surface. This can lead to a decrease in the actual flushing accuracy of the silicon wafer when it enters the next processing station 100. Therefore, the unified starting line 5 is set upstream of the next processing station 100, and the silicon wafer is sent to the next processing station 100 after synchronous alignment. This effectively shortens the transmission distance after alignment, helps reduce secondary positional deviations caused by intermediate transmission links, and makes the flushing accuracy of the silicon wafer entering the next processing station 100 closer to the accuracy level of synchronous alignment.

[0076] It should be noted that the position detection unit also includes two station entrance alignment verification sensors. The two station entrance alignment verification sensors are respectively set at the entrance positions of the next processing station 100 of the two silicon wafer transport tracks 1. They are used to detect whether the flushing accuracy of the silicon wafer after synchronous alignment meets the preset requirements. If the flushing accuracy does not meet the preset requirements, the corresponding silicon wafer is determined to be unqualified and rejected. Only silicon wafers with the flushing accuracy that meet the preset requirements are sent into the next processing station 100.

[0077] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A dual-track synchronization method based on position control, characterized in that, Includes the following steps: Two parallel and independently operating silicon wafer transfer tracks are provided (1). A position detection unit is set up, which detects the position information of the corresponding silicon wafers on the two silicon wafer transport tracks (1); A control unit is set up, which is communicatively connected to the position detection unit. The control unit controls the operation of the two silicon wafer transfer tracks (1) according to the position information, so that the corresponding silicon wafers on the two silicon wafer transfer tracks (1) remain flush at the preset target position. An anomaly handling unit is set up, which is connected to the control unit. When the position information indicates that the position deviation of the corresponding silicon wafer on the two silicon wafer transmission tracks (1) exceeds the preset range or a single track is missing a wafer, the anomaly handling unit skips the synchronization adjustment process and executes the corresponding anomaly transmission process. The silicon wafer transport track (1) includes a plurality of transport segments (11) connected in series, at least one of the plurality of transport segments (11) is an alignment segment (12), and the position detection unit is set corresponding to the alignment segment (12); The corresponding abnormal transmission process includes: When a single-track wafer shortage is detected, the anomaly handling unit controls the arrived silicon wafers to perform a single-track independent transmission process. When the positional deviation of the corresponding silicon wafer on the two silicon wafer transport tracks (1) exceeds the preset range, the abnormality processing unit will directly determine the corresponding silicon wafer as a defective product and remove it.

2. The dual-track synchronization method based on position control according to claim 1, characterized in that, The control unit controls the operation of the alignment segment (12) based on the time difference or position difference of the corresponding silicon wafers on the two silicon wafer transport tracks (1) detected by the position detection unit.

3. The dual-track synchronization method based on position control according to claim 2, characterized in that, When the silicon wafers on the two silicon wafer transport tracks (1) arrive at the alignment section (12) one after the other, the control unit reduces the running speed of the alignment section (12) where the silicon wafer that arrives first is located, and / or increases the running speed of the alignment section (12) where the silicon wafer that arrives later is located.

4. The dual-track synchronization method based on position control according to claim 1, characterized in that, Multiple alignment segments (12) are connected in series on each silicon wafer transport track (1). When the current level alignment segment (12) cannot adjust the position deviation of the corresponding silicon wafer to the preset range, the next level alignment segment (12) continues to adjust, so as to gradually reduce the position deviation of the corresponding silicon wafer on the two silicon wafer transport tracks (1).

5. The dual-track synchronization method based on position control according to claim 1, characterized in that, The position detection unit includes two entry sensors (2), which are respectively set at the entry positions of the alignment segments (12) of the two silicon wafer transport tracks (1).

6. The dual-track synchronization method based on position control according to claim 5, characterized in that, Each of the alignment segments (12) is longer than the length of the silicon wafer and carries only one silicon wafer at a time; Each of the alignment segments (12) is provided with an exit sensor (3) at its exit position, which is used to detect whether the silicon wafer leaves the alignment segment (12).

7. The dual-track synchronization method based on position control according to claim 1, characterized in that, The position detection unit includes two trigger sensors (4), which are installed at the same straight line position on the two silicon wafer transfer tracks (1) to form a unified starting line (5). When the silicon wafer moves along the silicon wafer transport track (1) to the unified starting line (5), the trigger sensor (4) is triggered, and the control unit controls the silicon wafer to move a preset distance along the corresponding silicon wafer transport track (1) and then stops. The control unit controls the two silicon wafer transport tracks (1) to start synchronously, driving the corresponding silicon wafers to be transported downstream synchronously.

8. The dual-track synchronization method based on position control according to claim 7, characterized in that, The unified starting line (5) is set upstream of the next processing station (100). After the silicon wafer is synchronously aligned, it is sent into the next processing station (100).

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