Teaching method of substrate transport apparatus and substrate processing apparatus

Abstract

The present application relates to a teaching method of a substrate transport apparatus and a substrate processing apparatus. A set position of a transport arm is taught in order to appropriately arrange a substrate on a stage of a substrate processing apparatus. For the teaching method of the present disclosure, in a substrate transport apparatus provided with a drive control section that controls a transport arm that transports a substrate to move to a set position that is set in advance, the teaching method includes the following steps: for three reference directions, a cycle including the following steps is performed for each reference direction: tilting at least one of a stage and the substrate held to the lift pins in one reference direction; handing over the substrate to the stage; receiving, by the transport arm, the substrate that has slid in the reference direction to reach an inner periphery of a rim of a stage surface; position detection of the substrate; determining a target position based on the position detection result; and setting the target position as the set position.

Description

Technical Field

[0001] This disclosure relates to a teaching method for a substrate transport apparatus and a substrate processing apparatus. Background Technology

[0002] In the manufacturing process of semiconductor devices, semiconductor wafers, which serve as substrates, undergo processes such as the deposition of metal films. Such processes are sometimes performed while the wafer is placed on a stage within a processing container.

[0003] Patent Document 1 illustrates a hot plate configured as a substrate mounting stage for placing wafers in an adhesion processing apparatus for improving the adhesion between resist and wafers. Regarding the wafer's placement on the hot plate, a transport arm or similar support, located outside the adhesion processing apparatus, supports the wafer and is positioned above the hot plate. Then, a support pin protrudes from the surface of the hot plate, receives the wafer from the transport arm, descends, and places the wafer on the hot plate.

[0004] [Existing Technical Documents]

[0005] [Patent Literature]

[0006] Patent Document 1: Japanese Patent No. 2885502 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] This disclosure provides a technique for teaching the setting position of a transport arm in order to properly position a substrate on the stage of a substrate processing apparatus.

[0009] [Methods used to solve problems]

[0010] A teaching method for a substrate conveying device, wherein,

[0011] The substrate conveying device includes: a conveying arm for conveying substrates; a driving mechanism for moving the conveying arm; and a driving control unit for controlling the driving mechanism to move the conveying arm to a preset position.

[0012] The mounting stage includes: a mounting surface for mounting a substrate; an edge portion that protrudes from the mounting surface along its periphery; and at least three lifting pins configured to protrude from and retract into the mounting surface to hold the substrate for transfer with the transport arm. When transporting the substrate relative to the mounting stage using the transport arm, the following steps are included:

[0013] For at least three reference directions that are set to extend in mutually different directions from the central side of the mounting surface toward the peripheral side, a cycle consisting of the following steps (a) to (d) is executed respectively;

[0014] (a) Process: Along a reference direction selected from at least three of the reference directions, at least one of the mounting surface and the substrate held by the lifting pin is tilted such that the height position of the peripheral side is lower than the height position of the central side.

[0015] (b) Process: Lower the lifting pin to transfer the substrate to the mounting platform;

[0016] (c) Process: The substrate delivered to the mounting table moves along the reference direction on the mounting surface, and after reaching the inner periphery of the edge, the lifting pin is raised so that the conveying arm receives the substrate.

[0017] (d) Process: Detecting the position of the substrate received from the loading stage by the conveyor arm;

[0018] Based on the results of detecting the position of the substrate after moving along all the aforementioned reference directions, a target position for transferring the substrate from the transport arm relative to the mounting stage is determined; and

[0019] The drive control unit sets the target position as the set position of the conveyor arm.

[0020] [Invention Effects]

[0021] According to the present invention, the setting position of the transport arm can be taught in order to properly position the substrate on the stage of the substrate processing apparatus. Attached Figure Description

[0022] Figure 1 This is a top view illustrating the substrate processing apparatus of the first embodiment.

[0023] Figure 2 This is a top view showing the holding part of the conveying mechanism.

[0024] Figure 3 This is a longitudinal sectional side view of the vacuum delivery chamber and the film-forming module.

[0025] Figure 4 This is a block diagram showing the substrate processing apparatus and the control unit.

[0026] Figure 5 This is a top view showing the holding part of the substrate and the line sensor.

[0027] Figure 6 This is a longitudinal sectional side view of the film-forming module.

[0028] Figure 7A This is a longitudinal sectional side view showing the holding part and lifting pin when the substrate is placed.

[0029] Figure 7B This is a longitudinal sectional side view showing the holding portion and the lifting pin when the substrate is placed.

[0030] Figure 8A This is a flowchart illustrating the cyclical process performed during the determination of the handover target position in the first embodiment.

[0031] Figure 8B This is a diagram showing the sequence of actions to determine the location of the target.

[0032] Figure 9A This is a partial longitudinal sectional side view of the platform representing the defined action.

[0033] Figure 9B This is a partial longitudinal sectional side view of the platform representing the defined action.

[0034] Figure 9C This is a partial longitudinal sectional side view of the platform representing the defined action.

[0035] Figure 10A This is a top view showing the mounting stage and substrate of the defined action.

[0036] Figure 10B This is a top view showing the mounting stage and substrate of the defined action.

[0037] Figure 10C This is a top view showing the mounting stage and substrate of the defined action.

[0038] Figure 10D This is a top view showing the mounting stage and substrate of the defined action.

[0039] Figure 11 This is a top view showing a modified example of a substrate processing apparatus.

[0040] Figure 12 This is a longitudinal sectional side view showing the film-forming module of the second embodiment.

[0041] Figure 13A This is a partial longitudinal sectional side view of the platform showing a specific action of the handover target position in the second embodiment.

[0042] Figure 13B This is a partial longitudinal sectional side view of the platform showing a specific action of the handover target position in the second embodiment.

[0043] Explanation of reference numerals in the attached figures

[0044] W, base plate; 10a, conveyor arm; 15, drive control unit; 17, pulse encoder; 32, stage; 33, mounting surface; 34, edge; 38, lifting pin; 5, control unit. Detailed Implementation

[0045] (First Embodiment)

[0046] Figure 1 This is a top view illustrating the substrate processing apparatus of the first embodiment. The substrate processing apparatus 1 is configured as a multi-chamber vacuum processing system, which includes film forming modules 101 to 104 for forming a film on a substrate W and a vacuum transport chamber (transport module) 24 for transporting the substrate W to them.

[0047] The substrate processing apparatus 1 includes, for example, an atmospheric pressure transport chamber 22, in which the internal atmosphere is at normal pressure. A loading port 21 is provided near the front of the atmospheric pressure transport chamber 22 for transferring the substrate W to a transport container K containing the substrate W. An opening / closing door 27 is provided on the front wall of the atmospheric pressure transport chamber 22, which opens when the substrate W is fed into or out of the transport container K. Furthermore, a transport mechanism 25 for transporting the substrate W is provided inside the atmospheric pressure transport chamber 22.

[0048] Figure 2 This is a top view of the holding portion 25m of the transport mechanism 25, which holds the substrate W. The transport mechanism 25 has the same structure as the transport mechanism 10 described later, but it has an edge clamping function by forming a mounting surface for the substrate W on the upper surface of the U-shaped holding portion 25m, two limiting protrusions 25a provided on the front end side of the mounting surface, and a pressing portion 25b provided on the base end side of the mounting surface. The transport mechanism 25 is configured such that when the substrate W is placed on the mounting surface, the pressing portion 25b moves toward the limiting protrusions 25a, and the limiting protrusions 25a and the pressing portion 25b limit the holding position of the substrate W. In this way, by holding the substrate W in a state of being pressed against the two limiting protrusions 25a, the transport mechanism 25 holds the substrate W in a state where, when viewed from above, the center of the substrate W is positioned at a predetermined position, such as the center of the holding portion 25m.

[0049] Furthermore, when viewed from the loading port 21 side, an alignment chamber 26 is provided on the left side wall of the atmospheric pressure conveying chamber 22 for adjusting the orientation and eccentricity of the substrate W. This alignment chamber 26 uses a notch (not shown) and an orientation plane formed on the periphery of the substrate W as a reference to determine the orientation of the substrate W and its handover position to the conveying mechanism 25. For example, when the orientation of the substrate W is determined based on the notch, the alignment chamber 26 sets the radial direction of the front end of the V-shaped notch through the notch to 0°, and the conveying mechanism 25 receives the substrate W with its center positioned at a predetermined location.

[0050] When viewed from the atmospheric pressure delivery chamber 22, two loading interlock chambers 23 arranged horizontally are connected to the wall opposite the loading port 21. Each loading interlock chamber 23 has the function of switching the internal atmosphere between atmospheric pressure and vacuum while containing the substrate W. When viewed from the atmospheric pressure delivery chamber 22, a vacuum delivery chamber 24 is arranged on the depth side of these loading interlock chambers 23. Each loading interlock chamber 23 is connected to the atmospheric pressure delivery chamber 22 and the vacuum delivery chamber 24 via a gate valve 29.

[0051] An exhaust mechanism (not shown) is connected to the vacuum delivery chamber 24, creating a vacuum atmosphere inside. Four film-forming modules 101-104 are connected to the side wall of the vacuum delivery chamber 24. Furthermore, line sensors 41-43 and two delivery mechanisms 10 are provided in the vacuum delivery chamber 24, each delivery mechanism 10 transferring the substrate W to the film-forming modules 101-104 and each loading interlock chamber 23.

[0052] Figure 3 This is a longitudinal sectional side view of the vacuum delivery chamber 24 and the film-forming module 104. For the film-forming module 104, the tilting mechanism 7, which will be described later, is omitted. Figure 6 The illustration is shown. Figure 4 This is a block diagram showing the substrate processing apparatus 1 and the control unit 5. Figure 3 For ease of illustration, the text will be... Figure 1 The line sensors 41-43, which are arranged on the side of the loading interlock chamber 23 in the vacuum delivery chamber 24, are shown on the side of the film forming module 104, and only two line sensors 41 and 42 are shown.

[0053] Each conveying mechanism 10 includes a conveying arm 10a configured as a multi-jointed arm. For example, the conveying arm 10a includes a lower arm member 11, a middle arm member 12, and an upper arm member 13, and rotation shafts 14 respectively provided at the root side of each arm member 11-13. Each rotation shaft 14 is connected to a rotation mechanism (not shown) and rotates independently to rotate each arm member 11-13. By combining these actions, the upper arm member 13 can perform rotational movement, linear movement, and movement along a desired trajectory. Furthermore, a holding portion 16 for holding the substrate W of the conveyed object is provided at the front end side of the upper arm member 13.

[0054] Furthermore, the conveyor arm 10a may also include a telescopic mechanism, which can extend and retract the upper arm member 13 to lengthen the linear travel distance. Such a telescopic and rotating mechanism constitutes the drive mechanism of the conveyor arm 10a, and a pulse encoder 17 is connected to a motor (not shown) that drives these drive mechanisms. Figure 4 Furthermore, the conveyor arm 10a is connected to the drive control unit 15, which manages the coordinates (hereinafter also referred to as "drive system coordinates") for the position of a specific holding unit 16. Figure 1 , Figure 3(Using the ZYZ coordinate system), control the rotation mechanism, etc., to move the holding part 16 to the set position described later.

[0055] The holding part 16 is provided on the front end side of the upper arm member 13, configured to transport the substrate W in a horizontal state. (As described later...) Figure 5 As shown, when viewed from above, and viewed from the base end side of the upper arm member 13, the retaining portion 16 forms a U-shape with two branches opening towards the front end. By arranging the substrate W in the retaining region, including the upper surface of the retaining portion 16, the substrate W can be horizontally supported. The retaining region is configured to effectively suppress positional displacement of the substrate W in its central region, thereby properly retaining the substrate W. The substrate W properly held in the retaining region is arranged such that the center C of the substrate W coincides with the center of the retaining region. Hereinafter, this position, in which the substrate W can be properly held, is sometimes referred to as the proper retaining position.

[0056] The holding unit 16 manages the center position of the holding area using, for example, polar coordinates (r, θ) with the rotation axis 14 of the lower arm member 11 as the origin, via the drive control unit 15 and the pulse encoder 17. These polar coordinates are associated with the drive system coordinates of the drive control unit 15. The conveying mechanism 10, configured as described above, enables the holding unit 16 to be moved to the desired position in the drive system coordinate system.

[0057] like Figure 1 , Figure 3 , Figure 5 As shown, three line sensors 41-43 are configured to detect the position of the substrate W held in the holding portion 16. Each line sensor 41-43 includes a pair of light-emitting portions 41A-43A and light-receiving portions 41B-43B. Each light-emitting portion 41A-43A and light-receiving portion 41B-43B is respectively disposed on, for example, the top plate side and the floor side of the housing of the vacuum transport chamber 24, facing each other in the vertical direction. Specifically, the light-emitting portions 41A-43A are disposed on the upper surface of a light-transmitting window 45A-47A, for example, made of quartz, disposed at the top of the vacuum transport chamber 24. On the other hand, the light-receiving portions 41B-43B are disposed on the lower surface of a light-transmitting window 45B-47B, for example, made of quartz, disposed at the floor portion of the vacuum transport chamber 24, facing the light-emitting portions 41A-43A.

[0058] Figure 5This is a top view showing the holding portion 16 holding the substrate W and the line sensors 41-43. The xy coordinates in this figure are relative coordinates as follows: when the origin is set at the center of the measurement area A1 (described later), and the substrate W, in its aligned state in the alignment chamber 26, is properly held in the holding area of ​​the holding portion 16, the direction in which the substrate W faces at 0° is set as the y-axis. The light-emitting portions 41A-43A and light-receiving portions 41B-43B of the line sensors 41-43 are separately arranged at positions corresponding to the periphery of the measurement area A1 when viewed from above. Each light-emitting portion 41A-43A is configured to irradiate light over a band extending from the inside to the outside of the measurement area A1, and each light-receiving portion 41B-43B receives the irradiated light at a position corresponding to the band. According to this structure, when the holding portion 16, in which the substrate W is held in the holding area, is arranged in the measurement area A1, the line sensors 41-43 can detect the positions of three distinct points along the periphery of the substrate W within the band area. Then, the position calculation unit 44 connected to the line sensors 41-43 ( Figure 4 The position (x, y) of the center c of the substrate W is calculated based on the positions of the three detected points. The position of the measurement area A1 is pre-stored in the drive control unit 15.

[0059] By using the strip-shaped line sensors 41-43, even if the substrate W is held by the holding part 16 in a state deviating from the proper holding position, the center position of the substrate W in that state can be calculated. The position calculation unit 44, together with the line sensors 41-43, constitutes the position detection unit (position detection mechanism) 4. Figure 4 ).

[0060] In this example, film-forming modules 101-104 are configured to form the same metal film. Taking these film-forming modules 101-104 as examples, the structure of film-forming module 104 will be briefly described. Figure 1 , Figure 3 As shown, the film-forming module 104 is composed of a processing container 31 connected to the housing of the vacuum delivery chamber 24 via a gate valve G1. The processing container 31 has inlet and outlet ports for feeding in and out the substrate W, which are opened and closed by the gate valve G1. By closing the gate valve G1, the processing container 31 becomes airtight. Furthermore, within the processing container 31, a mounting stage 32 is provided at a depth when viewed from the gate valve G1 side. In the first embodiment, when the substrate W is fed in from the inlet and outlet ports, the 0° direction of the substrate W is oriented towards the leading edge in the travel direction.

[0061] In addition, each film-forming module 101-104 is configured with... Figure 1 , Figure 3The secondary coordinate system (X'-Y'-Z' coordinate system) is also described in the text. This secondary coordinate system is set so that the radial direction of 0° set on the substrate W fed into the film deposition modules 101-104 is aligned with the Y' axis direction. Each secondary coordinate system is shown offset in each figure for visual clarity, but in the state described in the figures below as the "initial setting position," the origin is set at a position aligned with the center (C0) of the substrate W held in the holding part 16. Figure 10A Additionally, for ease of illustration, in Figure 1 The secondary coordinates of the two film-forming modules 101 and 104 are recorded together, but separate secondary coordinates corresponding to the connection direction relative to the vacuum delivery chamber 24 are also set for the remaining film-forming modules 101 and 104. Furthermore, in Figure 1 , Figure 3 In the example shown, the drive system coordinates (XYZ coordinate system) of the drive control unit 15 set in the conveying mechanism 10 are consistent with the axes of the secondary coordinates (X'-Y'-Z' coordinate system) set in the film forming module 104.

[0062] like Figure 3 As shown, a spray head 35 for supplying processing gas is provided on the top of the processing container 31, opposite to the mounting platform 32. Processing gas is supplied to the processing container 31 via the spray head 35 through a gas supply system (not shown). Furthermore, a through hole 31a and an exhaust port are formed at the bottom of the processing container 31, and an exhaust pipe 37, on which a vacuum pump 36 is installed, is connected to the exhaust port.

[0063] A support portion 32b for supporting the platform 32 is inserted through a through hole 31a formed at the bottom of the processing container 31. The upper end of the support portion 32b is disposed inside the processing container 31, and the rest is disposed outside the processing container 31. Figure 6 The support portion 32b is mounted to the bottom of the processing container 31 by means of the tilting mechanism 7. Normally, the support portion 32b is configured upright relative to the bottom of the processing container 31, but it can be tilted in various directions from its upright position using the tilting mechanism 7, which will be described later. The mounting platform 32 supported by the support portion 32b can tilt accordingly with the tilting of the support portion 32b. Through this action, the flat mounting surface 33 formed on the upper surface of the mounting platform 32 can also be tilted from a horizontal position toward a predetermined reference direction. Here, "reference direction" refers to a direction (radial direction) that extends from the center side of the mounting surface 33 toward the periphery. In this case, "tilting the mounting surface 33 toward the reference direction" means that, when viewed along the predetermined reference direction, the height position of the periphery side of the mounting surface 33 is lower than the height position of the center side of the mounting surface 33.

[0064] Figure 6This is a longitudinal sectional side view of the film-forming module 104, showing the structure and function of the tilting mechanism 7. The tilting mechanism 7 is configured to tilt the support portion 32b. Additionally, various wirings (not shown) for supplying power to components surrounding the mounting stage 32 are arranged side-by-side on the support portion 32b. When the mounting stage 32 is equipped with an electrostatic holding disk for electrostatically adsorbing the substrate W, the DC voltage applied to the electrostatic holding disk is supplied via these wirings.

[0065] The tilting mechanism 7 has the base member 77 already described, the bellows 79, and a plurality of, for example, six (in) Figure 6 (Only two actuators are shown in the figure) The base member 77 is configured to be mounted on the lower end of the support portion 32b via a vacuum seal 73 and is movable integrally with the platform 32. For example, a through hole with a diameter larger than the lower end of the support portion 32b is formed in the base member 77, through which the lower end of the support portion 32b is mounted to the vacuum seal 73, which is hermetically fixed on the lower surface of the base member 77. With the above structure, the base member 77 is connected to the platform 32 via the vacuum seal 73 and the support portion 32b, and can swing integrally with the platform 32.

[0066] Multiple actuators 78 are respectively connected to the bottom of the processing container 31 and the base member 77, and are arranged side by side around the support portion 32b in a separated state. The upper and lower ends of the actuators 78 are connected to the bottom of the processing container 31 and the base member 77 via universal joints. Furthermore, each of the multiple actuators 78 is configured to extend and retract freely in the axial direction. By appropriately extending and retracting each actuator 78, the distance between the bottom of the processing container 31 and the base member 77 changes. As a result, when the actuators 78 are not extended or retracted, the base member 77, which is parallel to the bottom of the processing container 31, can be appropriately tilted in each direction, and the mounting platform 32 can be appropriately tilted in the same direction as the base member 77. The tilting mechanism 7 configured as described above adjusts the extension and retraction of the multiple actuators 78 appropriately based on the tilting angle tilted in a predetermined direction (reference direction) to tilt the support portion 32b and the mounting platform 32.

[0067] At this time, the following situation also exists: the actuators 78, which extend and retract respectively, tilt about the axis of the support 32b, causing the base member 77 to rotate, and the stage 32 to tilt at a position deviating from the set direction. In the event of this phenomenon, to correct the effect of the rotation of the base member 77, a rotary drive mechanism (not shown) capable of independently rotating the support 32b can be provided, for example, between the vacuum seal 73 and the base member 77, below the vacuum seal 73. By using this rotary drive mechanism, the support 32b can be rotated in the opposite direction to the rotation of the base member 77, thus correcting the effect caused by the rotation of the base member 77. Therefore, the stage 32 can be tilted with high precision in a predetermined direction.

[0068] Furthermore, the position and tilt of the stage 32, adjusted by multiple actuators 78, can be specified by detecting the position and tilt of the base member 77 using various detection units. Examples of detection units include linear encoders, gyroscope sensors, 3-axis accelerometers, and laser trackers.

[0069] As explained above, in this embodiment, the tilting mechanism 7 has a plurality of actuators 78 disposed between the bottom of the processing container 31 and the base member 77, which is movable integrally. Thus, when the platform 32 is tilted relative to... Figure 6 When the reference direction, for example, the Y' direction, is tilted, the actuator 78 located in the reference direction is extended, and the actuator 78 located in the opposite direction of the reference direction is contracted, thereby tilting the base member 77, which is parallel to the X'Y' plane, toward the rotational direction about the X' axis. As a result, the support portion 32b, which stands upright in the vertical direction, is linked with the tilted base member 77 and tilts toward the rotational direction about the Y' axis. Furthermore, the mounting platform 32, which is supported at the front end of the support portion 32b, is also tilted toward the rotational direction about the X' axis, allowing the mounting surface 33 to tilt along the reference direction in the Y' direction. Thus, in the reference direction (Y' direction) of the mounting surface 33, the height position of the peripheral side of the reference direction can be lower than the height position of the central side. In this way, the tilting mechanism 7 can tilt the mounting surface 33 toward any three reference directions along the X'Y' plane, such as the Y' axis direction through the X'Y' plane, and directions deviating from the Y' axis by 120° and 240°.

[0070] The bellows 79 is arranged to surround the support portion 32b, with its upper and lower ends connected to the bottom of the processing container 31 and the base member 77, respectively. Thus, the bellows 79 airtightly seals the space between the bottom of the processing container 31 and the base member 77. The bellows 79 is configured to expand and contract according to the movement of the base member 77. In the film-forming module 104, even when the base member 77 is tilted, the expansion and contraction of the bellows 79 prevents air from flowing into the processing container 31 through the space between the bottom of the processing container 31 and the base member 77, or through the through hole 31a.

[0071] The loading stage 32, which is tilted by the tilting mechanism 7, is disposed within the processing container 31 of the film forming module 104. For example... Figure 3 The following is a description Figure 6 As shown, a heater 32a, serving as a resistive heating element, is embedded inside the mounting stage 32. Furthermore, a mounting surface 33 for mounting the substrate W and an edge portion 34 protruding from the mounting surface 33 along its periphery are formed on the upper surface of the mounting stage 32. The mounting surface 33 is a circular surface larger than the back surface of the substrate W, and for example, a smooth surface with relatively low surface roughness.

[0072] The edge 34 is formed in a concentric annular shape relative to the mounting surface 33. Furthermore, the upper end portion 34b of the edge 34 is flat, and a tapered surface 34a is formed on the inner circumference facing the mounting surface 33, gradually decreasing in height from the upper end portion 34b towards the mounting surface 33. Therefore, these tapered surfaces 34a and the upper end portion 34b constituting the edge 34 are also arranged concentrically relative to the mounting surface 33. In addition, for example, three (in) are provided on the mounting platform 32 in a manner that allows it to protrude from or be recessed freely relative to the mounting surface 33. Figure 3 , Figure 6 (Only two are shown in the diagram) Lifting pins 38. The three lifting pins 38 are arranged separately from each other, surrounding the center of the mounting surface 33 when viewed from above. Figure 1 These lifting pins 38 are positioned at 120-degree intervals from the center angle of the mounting surface 33. They are located using a lifting mechanism 39 ( Figure 4 The lifting plate 39a rises and falls simultaneously. The lifting mechanism 39, the lifting plate 39a, and the lifting pin 38 are fully separated from the tilting mechanism 7, the support 32b, and the platform 32 and are configured independently, so as not to be affected by their tilting movements. Therefore, even if the tilting mechanism 7 tilts, the lifting pin 38 can still rise and fall in the vertical direction.

[0073] Figure 7A , Figure 7B This is a longitudinal sectional side view showing the holding portion 16 and the lifting pin 38 when the substrate W is placed. When the substrate W is placed on the mounting stage 32, the conveying mechanism 10 keeps the holding portion 16 holding the substrate W in a standby position outside the gate valve G1. Then, as... Figure 7A As shown, the conveying mechanism 10 causes the upper arm member 13 to move straight into the processing container 31, positioning the holding part 16 in a pre-set "setting position". This setting position will be described later. Next, the protruding lifting pin 38 lifts and supports the back of the substrate W, receiving the substrate W. At this time, in order not to interfere with the holding part 16, the lifting pin 38 is positioned in a space that passes through the inside of the U-shape of the holding part 16 when viewed from above.

[0074] Next, as Figure 7B As shown, when the holding part 16 moves in the opposite direction to when it enters the processing container 31 and exits from the processing container 31, the lifting pin 38 descends and places the substrate W on the placement surface 33 of the placement stage 32. Then, when the film deposition process of the film deposition module 104 is completed, the lifting pin 38 transfers the substrate W from the placement stage 32 to the holding part 16 through an action opposite to that described during placement, and the holding part 16 exits from the processing container 31. In this way, the lifting pin 38 can transfer the substrate W between the transport mechanism 10 and the placement stage 32.

[0075] In the aforementioned placement operation, the set position of the holding part 16 needs to be the position where the substrate W, which is transferred to the placement stage 32, is placed within the placement surface 33. In the first embodiment, when viewed from above, the "set position" of the holding part 16 is set such that the center C of the substrate W held by the holding part 16 coincides with the center P of the placement surface 33. However, in the substrate processing apparatus 1, the control unit 5 and the drive control unit 15 do not have accurate knowledge of the position of the center P of the placement surface 33. For example, when the processing container 31 is opened for maintenance of the placement stage 32 and the lifting pin 38, sometimes the position of the center of the placement stage 32 and the position of the substrate W transferred to the placement stage 32 via the lifting pin 38 change.

[0076] Therefore, before starting the film deposition process, the substrate processing apparatus 1 pre-determines the center P of the mounting surface 33. Then, by positioning the holding portion 16 above the center P, it determines the substrate W to be transferred to the substrate transfer target position (target position) of the mounting surface 33 via the lifting pin 38. To ensure that this target position matches the previously described set position, the drive control unit 15 needs to be taught. For example, the diameter of the substrate W is 300 mm, the diameter of the mounting surface 33 is 302 mm, and the width of the conical surface 34a is 0.35 mm. In this case, by simply transferring the center of the substrate W to a position offset from the center P of the mounting surface 33 by 1.4 mm, the substrate W is deposited while being held on the edge portion 34. In the case of film deposition on a substrate W in a state where the entire back surface is not in contact with the mounting surface 33, for example, in-plane uniform temperature control cannot be achieved, and therefore the uniformity of the film thickness may be reduced, or the film may form on the back surface of the substrate W. Therefore, it is important to accurately determine the center P of the mounting surface 33 for teaching.

[0077] Regarding this, consider the following method: open the processing container 31, the operator measures the accurate position of the center P of the mounting surface 33, manually positions the substrate W so that the center of the substrate W matches the measured center P, and performs teaching based on the result received by the holding unit 16. Alternatively, consider the following method: instead of positioning the substrate W, place a clamp with a predetermined target position inside the processing container 31, and press the holding unit 16 against the clamp to perform teaching. However, these methods involve operation with the processing container 31 open, so particles may enter and remain inside the processing container 31. Furthermore, for the operator to perform the operation, cooling and pressurizing operations are required inside the processing container 31. Although cooling and pressurizing operations are not normally required except during maintenance, this becomes a major reason for the increased non-operating time (idle time) of the substrate processing device 1. Moreover, teaching performed at room temperature after cooling does not include the effects of thermal expansion of the mounting stage 32 and the lifting pin 38, thus making it difficult to perform high-precision teaching. Furthermore, the tilt of the lifting pin 38 sometimes differs slightly between teaching under atmospheric conditions and film formation under vacuum conditions, making it difficult to perform high-precision teaching. Based on these issues, the inventors of this application have developed a teaching method that can be performed even without opening the processing container 31 or performing cooling and pressurization operations on the stage 32.

[0078] The structure of the substrate processing apparatus 1 is described as follows: Figure 4 As shown, the control unit 5 is connected to the tilting mechanism 7, the position detection unit 4, the drive control unit 15, the pulse encoder 17, and the lifting mechanism 39, and cooperates with them to perform teaching from the target position. Furthermore, the control unit 5 is configured as a computer, which includes a center position determination unit 51 for calculating the center position of the center P of the mounting surface 33, a program storage unit 52 for storing various programs for operating the various parts of the substrate processing apparatus 1, a CPU 53, and a memory 54. The program for transporting the wafer is configured to hold the substrate W with the holding unit 16 and transport it to the film deposition modules 101-104 at each set position at the transport destination; specifically, it has a set of steps for calculating the track of the holding unit 16. Furthermore, the program for determining the handover target position of the holding unit 16 has multiple sets of steps for implementing the various processes described later.

[0079] Various programs are installed in the program storage unit 52 via storage media such as USB memory or DVD-ROM. The control unit 5 manages the operation control of the transport mechanism 10 by the drive control unit 15 based on signals from the pulse encoder 17, so that the holding unit 16 moves according to the processing program constituting the substrate W. In the substrate processing apparatus 1 described above, the control unit 5, the transport mechanism 10, the drive control unit 15, and the pulse encoder 17 constitute the substrate transport apparatus of this disclosure that performs teaching based on the result of a specific handover target position.

[0080] The specific location of the handover target is described. Figure 8A This is a flowchart illustrating the cyclical process performed during the determination of the handover target position in the first embodiment. Figure 8B This is a diagram showing the steps involved in determining the location of the target during the handover. Figure 9A , Figure 9B This is a partial longitudinal sectional side view of the platform 32 showing a specific action at the handover target position in the first embodiment. Figures 10A-10D This is a top view of the mounting stage 32 and the substrate W, representing this specific action. The reference direction is indicated by the lowest point of the periphery of the mounting surface 33, and the relative coordinates with the center P of the mounting surface 33 as the reference point are represented by a single-dotted line. The center of the substrate W is represented by a black dot. Furthermore, Figures 10A-10D The centers C0, C1~C3 shown indicate the positions where the mounting surface 33 is in a horizontal orientation without tilting. In these figures, solid arrows represent trajectories, and hollow arrows indicate the next direction of movement. This will be discussed in the second embodiment described later. Figure 13A , Figure 13B The same applies to China.

[0081] First, the specific principles governing the handover location will be explained. For example... Figure 9A , Figure 10A As shown, one direction of the XY plane used to tilt the mounting stage 32, namely the Y' axis direction, is set as the reference direction. Then, as described above, the mounting stage 32 is tilted along the Y' axis direction (step S11, tilting process). While maintaining this tilted state, the holding unit 16 transports the substrate W to a preset initial setting position C0, and the rising lifting pin 38 receives the substrate W. Figure 9A , Figure 10A Next, the lifting pin 38 is lowered to transfer the substrate W to the inclined mounting surface 33 (step S12, the process of transferring the substrate). Figure 9B The substrate W, which is positioned at the initial setting position C0 by the holding part 16 and transferred to the lifting pin 38, needs to be positioned within the inclined mounting surface 33. Therefore, the initial setting position C0 needs to be a position that allows the substrate W to be placed on the mounting surface 33 in a horizontal position without inclination, and also allows the substrate W to be placed on the inclined mounting surface 33. Such an initial setting position C0 can be predicted in advance based on the design drawings of the film deposition module 104 and the mounting stage 32, and a position that meets the above conditions can be confirmed by conducting preliminary tests.

[0082] Furthermore, when placed on the mounting surface 33, the substrate W, supported by the lifting pin 38 and in a horizontal position, first comes into contact with the inclined mounting surface 33 on the opposite side of the Y' axis. When the lifting pin 38 is inserted into the mounting stage 32, the entire surface of the substrate W is adjacent to the mounting surface 33. Figure 9B (The dashed line). Then, the substrate W slides along the Y' axis on the mounting surface 33, which is inclined in the Y' axis direction, due to gravity, and comes to rest in contact with the inner periphery of the conical surface 34a, i.e., the edge 34. Figure 9B solid lines Figure 10B To ensure sufficient sliding of the substrate W in the reference direction (Y' axis direction), it is preferable that when placed on the mounting surface 33, a large number of gas molecules remain on the lower surface of the substrate W near the mounting surface 33, creating a state where viscous resistance is exerted. Therefore, for example, when transferring the substrate W to the mounting surface 33, the pressure inside the processing container 31 can be pre-pressurized to approximately 100 Pa to increase the amount of gas molecules remaining between the lower surface of the substrate W and the mounting surface 33.

[0083] Furthermore, the side surface of the substrate W in its resting position is in contact with the inner periphery of the edge 34, and the entire lower surface is in contact with the mounting surface 33. Moreover, the resting position of the substrate W is, for example, located in the direction from the initial set position C0 towards the Y' axis and in contact with the periphery of the mounting surface 33. Figure 10B The center C1 of the substrate W at the stationary position is measured by the position detection unit 4 (step S13). It is assumed that the center C1 is located within the circle S representing the set of centers of the substrate W arranged in a manner that aligns with various positions on the inner periphery of the mounting surface 33. Figure 10B On the dashed line). And, it is assumed that the center of circle S is the same as the center P of the mounting surface 33. Therefore, if the positions of point C1 and the other two points C2 and C3 on the circumference of circle S are measured ( Figure 8A By finding the centers of the circles passing through these different points C1~C3 (P1~P3), the final handover target location (P4) can be specified.

[0084] The determination and teaching operations of the target position of the holding part 16 in the substrate transport apparatus of the first embodiment implemented based on the ideas described above will be explained. In this example, the first reference direction to the third reference direction are set to two directions offset from the 0° direction by 120° and 240° respectively, in addition to the Y' direction (0° direction) already described, so that the mounting surface 33 is inclined along each reference direction. Then, the substrate W, which is connected to the mounting surface 33 inclined along each reference direction, is slid towards the inclined downward side, and the center positions C1 to C3 of the substrate W that reach the stationary position are specified respectively. Figure 8B (Processing of P1~P3).

[0085] As a general overview, the determination of the target position in the first embodiment is performed in the following order: a specific action at the center C1 position of the substrate W, which slides along the 0° direction, which is the first reference direction ( Figure 8B Processing P1 Figure 9B , Figure 10B ), and the specific action of the substrate W sliding at the center C2 position along a 120° direction as the second reference direction (processing P2, Figure 10C ), and the specific action of the substrate W sliding along the 240° direction as the third reference direction at the center C3 position (processing P3, Figure 10D The specific actions (processing P4) are performed to determine the coordinates of the target position. Then, the target position is determined based on the positions of the centers C1 to C3 of the substrate W at these measured static positions. Figure 10A This is a flowchart illustrating a cycle (hereinafter referred to as a cycle process) in which the center C1 to C3 of the substrate W is detected by sliding the substrate W in each reference direction. Based on the positions of the center C1 to C3 of the substrate W at specific rest positions in each reference direction during the cycle process in each of these reference directions, the target position is determined.

[0086] Next, based on Figure 8B The specific operation of processing the center C1 of P1 will be described in detail. Processing P1 is the operation of reaching the position of the center C1 of the substrate W at a specific rest position in the 0° direction, which is the first reference direction. In this example, firstly, the substrate is transported to the loading port 21 using the conveying mechanism 25 in the atmospheric pressure conveying chamber 22. Figure 1 The substrate W in the transport container K is transported in the order of alignment chamber 26 → loading interlock chamber 23. In addition, the substrate W is not limited to the substrate transported by the transport container K, but can also be pre-positioned in the atmospheric pressure transport chamber 22, or a dummy substrate with the same shape as the substrate W can be used.

[0087] The substrate W, adjusted to face a predetermined direction in the alignment chamber 26, is placed by the transport mechanism 25 onto a mounting stage (not shown) in the loading interlock chamber 23. The substrate W placed on the mounting stage in the loading interlock chamber 23 has a 0° circumferential end (in this example, the top of a notch in a notch) positioned furthest from the gate valve 29 on the vacuum transport chamber 24 side. The loading interlock chamber 23 then transfers the substrate W, with this orientation set, to the holding portion 16 of the transport mechanism 10. The held substrate W is oriented such that the 0° circumferential end is positioned at the front end of the holding area of ​​the holding portion 16, and the held substrate W is positioned relative to the holding portion 16 at a pre-set appropriate holding position.

[0088] Next, the conveying mechanism 10 places the holding portion 16 holding the substrate W on the measurement area A1. Figure 5The position calculation unit 44 uses line sensors 41-43 to measure the position (x11, y11) of the center c11 of the substrate W and stores it in the memory 54. The position (x11, y11) of the center c11 of the substrate W, positioned appropriately, is, for example, in... Figure 5 The relative coordinates shown are, for example, (0, 0). In addition, the position of the center c11 (x11, y11) of the substrate W placed before the stage 32 in the alignment chamber 26 is approximately accurately positioned in the proper holding position, so the measurement by the position calculation unit 44 is not required.

[0089] On the other hand, in any one of the film-forming modules 101 to 104 that determine the target position of the holding part 16 (film-forming module 104 in this example), the tilting mechanism 7 is used to tilt the stage 32 toward the first reference direction of 0°. Figure 8A Step S11, (a) Operation: The operation of tilting the mounting surface. Figure 9A At this time, the tilt angle α of the mounting stage 32 is ( Figure 9A For example, the angle is 0.1° or higher, but it can be appropriately set according to the ease of sliding of the substrate W relative to the mounting surface 33. Then, the substrate W, whose center c11 position has been measured by the position calculation unit 44, is transported to the mounting stage 32 of the film deposition module 104. In detail, when the gate valve G1 of the film deposition module 104 is opened, based on the substrate transport procedure described above, the holding part 16 holding the substrate W is positioned at the previously set initial position C0 above the mounting stage 32, and then the substrate W is transferred to the mounting surface 33 via the lifting pin 38 (step S12, (b) process: process of transferring the substrate to the mounting stage, Figure 9B The substrate W is shown by the dashed line. Figure 10A As a result, after the substrate W slides along the first reference direction (Y' axis direction) on the mounting surface 33, it reaches a stationary position in contact with the inner periphery of the edge 34. Figure 9B The solid line represents the substrate W. Figure 10B ).

[0090] Next, while keeping the substrate W in a stationary position, the stage 32 is returned to horizontal (step S13). Figure 9C Then, the lifting pin 38 is raised from the returning horizontal mounting surface 33, and the substrate W, which is in the stationary position, is transferred to the holding part 16 (step S14, (c) process: process of receiving the substrate by the transport arm). By performing the above operation, the position offset L1 from the initial set position to the stationary position can be measured with high precision in the mounting surface 33, which is in the same horizontal posture as during the film deposition process. Figure 10B As will be described later, the position detection unit 4 implements the specific vector representing displacement, namely the position offset L1.

[0091] Furthermore, at this time, after the lifting pin 38 protrudes and the substrate W is raised from the mounting surface 33, the substrate W is handed over to the holding part 16 relative to the state of being repositioned in the initial set position C0. The handed-over substrate W is held by the holding part 16 in a state of horizontal movement by sliding from the appropriate holding position on the mounting surface 33 in the first reference direction, that is, in a state of maintaining position offset L1. Next, in order to detect this offset L1, the holding part 16 holding the substrate W is placed in the measurement area A1, and the position c'11 (x'11, y'11) of the center of the offset substrate W is detected (step S15, (d) process: process of detecting the position of the substrate). The center position specifying part 51 obtains the difference between the position coordinates of the center position c'11 and the center position c11 of the substrate W corresponding to the new holding position, and calculates the offset L1 as a vector. Then, the position of the center C1 of the offset L1 is specifically corrected from the initial set position C0 (step S16).

[0092] Next, in the 120° direction, which serves as the second reference direction, a specific action (P2) is performed to position the center C2 of the substrate W to the stationary position. First, the stage 32 is tilted in the 120° direction using the tilting mechanism 7 (step S11). Figure 10C Then, using the holding unit 16, the substrate W, whose center c11 position has been measured by the position calculation unit 44, is transported again to the initial set position C0 of the mounting stage 32 of the film deposition module 104. Then, the substrate W is transferred to the mounting surface 33 via the lifting pin 38 (step S12). Figure 10C ).

[0093] When the substrate W is positioned at the initial setting position C0, it is assumed that when the holding part 16 supports the substrate W in the appropriate holding position, the initial setting position can be the same as the initial setting position C0 of the specific operation (P1) at the center C1 position described above. However, in the first embodiment, during the cycle of this specific operation (P1), the substrate W is held offset from the appropriate holding position. As a first method corresponding to this situation, the substrate W can be set to the initial setting position C0 by re-holding it. For example, the following method can be used: after measuring the position of the center c'11 of the substrate W in the measurement area A1, the holding part 16 is re-entered into the film deposition module 104, and the substrate W is re-held using the lifting pin 38. Before re-holding, the holding part 16 is moved to the initial setting position, which is the previous setting position, and the substrate W is handed over to the lifting pin 38 to perform position correction by offsetting the substrate W relative to the holding part 16 by the amount of displacement L1. Then, if the substrate W is handed over from the lifting pin 38 to the position-corrected holding part 16, the substrate W can be positioned in the appropriate holding position.

[0094] As a first method, in addition to the example of using the film-forming module 104 as described above, it is also possible to utilize... Figure 2 The described conveyor mechanism 25 has an edge clamping function. The substrate W is transferred from the conveyor mechanism 10 to the conveyor mechanism 25 via... Figure 2 The limiting protrusion 25a and pressing part 25b provided in the holding part 25m are positioned to enable the position correction of the substrate W. Moreover, as a variation of the first method, when the substrate W needs to be corrected for orientation as it rotates around the center on the worktable, the orientation and position of the substrate W can be corrected by transferring the substrate W to the alignment chamber 26 and the transport mechanism 25.

[0095] Furthermore, as a second method to eliminate the influence of deviation from the proper holding position, the substrate W can be transferred to the lifting pin 38 at the initial setting position C0 without re-holding it. In this case, if the substrate W is positioned at a position that offsets the offset L1 from the specific initial setting position C0 in the first reference direction, the substrate W can be directly positioned at the initial setting position C0.

[0096] Similar to the specific action P1 described above, the substrate W, which has been positioned at the initial set position C0 using the above method, is transferred to the inclined mounting surface 33. Then, after the substrate W slides on the mounting surface 33 to a stationary position, the mounting stage 32 is returned to horizontal, and the holding part 16 receives the substrate W. Then, the center position of the substrate W is detected in the measurement area A1, specifically the position of the substrate center C2 at the stationary position in the second reference direction (120° direction) (steps S12-S16). Figure 10C Then, similar to the specific actions P1 and P2 described above, a specific action (P3, steps S11~S15) is performed on the position of the center C3 of the substrate W in the stationary position in the 240° direction, which is the third reference direction, and the specific center C3 (step S16, ...) is also performed. Figure 10D ).

[0097] Next, the center position of the circle S connecting the aforementioned distinct centers C1 to C3 is calculated, and the center position P of the mounting surface 33, which is approximately the same as this center, is determined to be the target position (P4). The center position determination unit 51 sets the target position to the drive control unit 15, which is the drive control unit, as the setting position of the holding unit 16 (the process of setting the target position). Thus, the target position of the film forming module 104 is taught to the drive control unit 15.

[0098] The target position determination and teaching are also performed on film-forming modules 101-103 other than film-forming module 104, but this can also be performed as appropriate when maintenance of each module 101-104 is required. As described above, this target position determination and teaching are performed during substrate processing, such as when film-forming processing is not being performed. After the target positions of each film-forming module 101-104 are determined and taught, film-forming processing begins in the substrate processing apparatus 1. Regarding the transport path of the substrate W in the film-forming process of the substrate processing apparatus 1 of the first embodiment, firstly, it is transported in the order of transport container K → loading port 21 → alignment chamber 26 → atmospheric pressure transport chamber 22 → vacuum transport chamber 24 → any one of the film-forming modules 101-104. The substrate W formed in any one of the film-forming modules 101-104 is transported back to the transport container K in the reverse order of the above sequence.

[0099] When conveying substrate W to any of the film-forming modules 101-104 in the above-mentioned conveying path, such as Figure 7A , Figure 7B As shown, the drive control unit 15 moves the holding part 16 holding the substrate W to the teaching setting position. After the substrate W supported by the holding part 16 is placed on the center P of the mounting surface 33, it is lowered towards the center P of the horizontal mounting surface 33 without tilting via the lifting pin 38, and placed on the mounting surface 33, and then film is formed.

[0100] As described above, in the teaching method of the substrate transport apparatus of the first embodiment, a tilting mechanism 7 for tilting the mounting stage 32 is provided in the film deposition module 104. Then, a reference direction is arbitrarily selected from at least three different reference directions, and the mounting stage 32 is tilted in the selected reference direction using the tilting mechanism 7. Next, the substrate W disposed at the set position C0 is transferred to the mounting surface 33 via the lifting pin 38, and the substrate W is slid along the reference direction until it comes to rest in contact with the inner periphery of the edge portion 34. Then, while maintaining the substrate W in the resting position, the mounting surface 33 is returned to the horizontal position, and the holding portion 16 is received via the lifting pin 38. The center C1 of the substrate W in the resting position is detected using the position detection unit 4. This cyclic process is also performed for the remaining reference directions, and the center of the substrate W in the resting position in these reference directions is detected. The center P of the mounting stage 32 can be identified based on the circle connecting the points of these multiple centers C1 to C3. As described above, according to this embodiment, while maintaining the vacuum atmosphere and temperature of the vacuum delivery chamber 24 and the film deposition modules 101-104, the position of the center P of the mounting stage 32 can be automatically, easily, and quickly determined. Then, the center P of the mounting stage 32 determined in this way can be set as the target position for transferring the substrate W from the holding part 16 to the mounting stage 32.

[0101] (Modified example)

[0102] In the first embodiment, after tilting the mounting stage 32 using the tilting mechanism 7, the substrate W is transferred to the tilted mounting surface 33 via the lifting pin 38. However, the teaching method of this disclosure is not limited to this step. For example, the substrate W may be transferred from the holding part 16 to the lifting pin 38 before tilting the mounting stage 32, and then the mounting stage 32 may be tilted, causing the lifting pin 38 to descend and transfer the substrate W to the tilted mounting surface 33. Alternatively, for example, the substrate W may be transferred to the lifting pin 38 first before tilting the mounting stage 32, and after the lifting pin 38 descends and transfers the substrate W to the non-tilted mounting surface 33, the mounting surface 33 may be tilted, causing the substrate W in contact with the mounting surface 33 to slide in the tilting direction. In this case, the substrate W on the mounting surface 33 is in contact with the mounting surface 33 and is difficult to slide, thus allowing for a larger tilt angle.

[0103] Furthermore, in the first embodiment, the first to third reference directions are set to 0°, 120°, and 240°, respectively. However, this is not a limitation; three reference directions can be set at 120° intervals, with a position deviating from 0° as the reference. Also, the reference directions do not necessarily have to be set at 120° intervals; four can be set at 90° intervals, or six at 60° intervals. Moreover, the intervals between the reference directions do not need to be consistent; they can be set at different intervals. In other words, as long as the circle for the center P of the specific mounting stage 32 can be determined based on the position of the center of the specific substrate W after repeated specific actions, the reference directions can be freely set. Therefore, it is acceptable as long as the reference direction for each specific action is different.

[0104] Furthermore, in the first embodiment, when performing specific actions (P1 to P3) on the centers C1 to C3 of the substrates at rest positions in the first to third reference directions, the substrate W is positioned at the same initial setting position C0. Alternatively, for example, the substrate W can be positioned at different locations each time to perform its specific actions. Thus, even if the substrate W is positioned at mutually different initial setting positions, the rest position of the substrate W eventually reaches approximately the same position according to the reference directions. Therefore, if the position of the initial setting position when the substrate W is handed over in each reference direction can be determined, the center position of the substrate W at a specific rest position can be offset according to the position.

[0105] Furthermore, during the actual sliding action of the substrate W on the mounting surface 33, when the substrate W slides away from its respective reference direction or slides while rotating, sometimes the substrate W may be at the intersection between the reference direction and the edge 34 (in Figures 10B-10C(The positions marked with a cross surrounded by a circle are indicated in the text.) The substrate W remains stationary at different positions. Even in such cases, as long as the positions where the substrate W contacts the inner periphery of the mounting surface 33 and remains stationary are different in at least three specific actions, the center P of the mounting stage 32 can be identified. Therefore, as long as the substrate W can slide on the mounting surface 33 until it reaches a stationary position, there is no particular limitation on the tilt of the mounting stage 32, and the tilt angle and tilt direction can be changed midway through the sliding of the substrate W.

[0106] In the first embodiment, the position or trajectory of the holding part 16 is set for the holding region, and is set such that the center of the holding region coincides with the center C of the substrate W at the holding position, but it may not be set to coincide. The teaching method in the first embodiment is used to set the position of the film forming modules 101 to 104, but is not limited thereto. For example, it can also be used to set the position of the rotating holding disk in a loading interlock chamber 23 or a liquid treatment module (not shown in this disclosure).

[0107] In the first embodiment, the substrate W is transported using a transport arm 10a, which is a multi-jointed arm. However, other transport mechanisms may also be used, such as a transport mechanism that uses magnetic levitation based on an electromagnet for movement. The edge 34 in the first embodiment is provided with a conical surface 34a, but it may not be provided. The inner peripheral side of the edge 34 may also be a vertical surface that rises from the mounting platform 32. The tilting mechanism 7 disclosed in the first embodiment is merely one example; other tilting mechanisms may also be used to tilt the mounting platform 32.

[0108] It is not limited to using line sensors 41-43 to measure the positional offset of the substrate W before and after placement, as in the substrate processing apparatus 1 of this disclosure. Figure 11 This is a top view showing a modified example of the substrate processing apparatus 1. In the substrate processing apparatus 1A, line sensors 48 and 49, with a different configuration and number than those in the first embodiment, are provided in the vacuum transport chamber 24. Line sensors 48 and 49 are similarly provided in the housing of the vacuum transport chamber 24 as line sensors 41 to 43, and are respectively positioned on both sides of the gate valve G1 before each gate valve G1 of the film deposition modules 101 to 104. As a result, because the light from the substrate W passing through the feed inlet / outlet of the film deposition modules 101 to 104 is blocked by the line sensors 48 and 49 at the 90° and 270° sides, the peripheral points of the substrate W are detected by, for example, four points, thereby enabling the measurement of the position of the center c of the substrate W that has passed through.

[0109] Furthermore, in the first embodiment, the lifting pin 38, lifting mechanism 39, tilting mechanism 7, support portion 32b, and mounting platform 32 are configured to be fully separated and independently, and are designed to be unaffected by their tilting movements, although they can also be configured to be affected by their tilting movements. Specifically, when the lifting plate 39a and lifting mechanism 39 are, for example, constrained in the lifting direction by the support portion 32b along the support portion 32b, it is conceivable that the lifting plate 39a, lifting mechanism 39, and support portion 32b tilt in conjunction with their tilting. Even in this case, as long as the lifting pin 38 can properly receive the substrate W without causing the substrate W to fall when the mounting platform 32 tilts, the substrate W can be disposed within the surface of the mounting surface 33.

[0110] Furthermore, as another structural example for raising and lowering the lifting pin 38, it is considered that no lifting pin 38 is provided. Figure 4 , Figure 6 The lifting plate 39a and lifting mechanism 39 shown are, for example, in the case where each lifting pin 38 is suspended from the mounting platform 32. In this case, the multiple lifting pins 38 are arranged such that they independently pass through the through holes of the mounting platform 32. Furthermore, the lifting pins 38 are configured with an expanded upper diameter, which is locked into the through holes of the mounting platform 32 to suspend them from the mounting platform 32. For example, when each actuator 78 is extended to the same width and the mounting platform 32 is positioned in the upper position, the lifting pins 38 remain suspended from the mounting platform 32 and do not protrude from the mounting surface 33. On the other hand, for example, when each actuator 78 is retracted to the same width and the mounting platform 32 is positioned in the lower position, the lower end of the lifting pin 38 abuts against the bottom of the processing container 31 and is lifted, protruding from the mounting surface 33.

[0111] (Second Implementation)

[0112] In the second embodiment, instead of the method of sliding the substrate W toward a stationary position by placing the substrate W on an inclined mounting stage 32 in the first embodiment, the substrate W is slid by placing it on a horizontal mounting surface 33 in an inclined state. Figure 12This is a longitudinal sectional side view of the film-forming module according to the second embodiment. Regarding the second embodiment, the differences from the first embodiment will be mainly explained, and the reference numerals of the structures in the first embodiment will be used, omitting repeated descriptions. In the film-forming module 104A of the second embodiment, the tilting mechanism 7 and the lifting plate 39a are not provided, and the lifting pins 38 are raised and lowered individually relative to the fixed mounting stage 32. Therefore, for example, individual lifting mechanisms 39 are provided at the lower part of each lifting pin 38. Thus, when the substrate W is handed over to the mounting surface 33 (step S12), the substrate W is placed in an inclined state by varying the height positions of the lifting pins 38. As a result, due to the influence of the gas present between the substrate W and the mounting surface 33, the substrate W is pushed out, allowing the substrate W to slide in the first reference direction to the third reference direction. Furthermore, similar to the first embodiment, in the example of the second embodiment, the centers C1 to C3 of the substrate at a specific resting position can also be determined.

[0113] Figure 13A , Figure 13B This is a partial longitudinal sectional side view of the mounting stage 32, showing a specific operation of the transfer target position in the second embodiment. Here, it shows an example of sliding the substrate W at an angle in the Y' direction. When transferring the substrate W to the mounting surface 33 (step S12), firstly, the three lifting pins 38 are positioned above each other at the same height, receiving the horizontally oriented substrate W from the holding part 16. Then, as... Figure 13A As shown, the two lifting pins 38 positioned on the Y' axis side begin to descend first. When the substrate W tilts to a certain degree, the other lifting pin 38 positioned on the opposite side of the Y' axis begins to descend. The descent speed of the three lifting pins 38 is set to be the same, for example. Thus, the three lifting pins 38 can transfer the substrate W, which is tilted towards the Y' direction, to the mounting surface 33.

[0114] like Figure 13B As shown, the end of the substrate W (dashed line) inclined in the Y' direction first contacts the mounting surface 33 on the Y' axis side, and then the end on the opposite direction of the Y' axis descends. At this time, the substrate W is pushed out by the gas between the lower surface of the substrate W on the opposite direction of the Y' axis and the mounting surface 33, and slides in the Y' direction. Furthermore, similar to the first embodiment, the substrate W (dashed line) can slide specifically in the Y' direction and remain in a stationary position. Figure 13B The position of the center C1 of the solid line.

[0115] When sliding the substrate W in the reference directions of 120° and 240° in the same manner as in the first embodiment, it is sufficient to first lower the two lifting pins 38 on the opposite side of the Y' axis and the two lifting pins 38 on the opposite side of the Y' axis and the two lifting pins 38 on the opposite side of the Y' axis and the two lifting pins 38 on the opposite side of the Y' axis and the two lifting pins 38 on the opposite side of the Y' axis. Furthermore, when the three reference directions are each set towards the direction where the lifting pins 38 are arranged, if one of the three lifting pins 38 on the reference direction side is lowered first, followed by the remaining two lifting pins, the substrate W can be tilted and slid in the reference direction. Moreover, the lowering timing can be set separately for each of the three lifting pins 38 with different height positions. Furthermore, as described above, it is also possible not to set a difference in the lowering timing of the three lifting pins 38, but to tilt the substrate W and slide it on the mounting surface 33 by setting a difference in the lowering speed of the lifting pins 38. Four or more lifting pins 38 may also be provided. Furthermore, the specific action of the target position of this disclosure can also be achieved by combining the tilting of the substrate W by the lifting pin 38 of the second embodiment and the tilting of the mounting stage 32 of the first embodiment.

[0116] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, modified, and combined in various ways without departing from the appended claims and their spirit.

Claims

1. A teaching method for a substrate conveying device, wherein, In the teaching method of this substrate conveying device, The substrate conveying device includes: a conveying arm for conveying substrates; A drive mechanism that moves the conveyor arm; and a drive control unit that controls the drive mechanism to move the conveyor arm to a preset position. The mounting stage includes: a mounting surface for mounting a substrate; an edge portion that protrudes from the mounting surface along its periphery; and at least three lifting pins configured to protrude from and retract into the mounting surface to hold the substrate for transfer with the transport arm. When transporting the substrate relative to the mounting stage using the transport arm, the following steps are included: For at least three reference directions that are set to extend in mutually different directions from the central side of the mounting surface toward the peripheral side, a cycle consisting of the following steps (a) to (d) is executed respectively; (a) Process: Incise at least one of the mounting surface and the substrate held by the lifting pin along a reference direction selected from at least three of the reference directions, such that the height position of the peripheral side is lower than the height position of the central side; (b) Process: Lower the lifting pin to transfer the substrate to the mounting platform; (c) Process: The substrate delivered to the mounting table moves along the reference direction on the mounting surface, and after reaching the inner periphery of the edge, the lifting pin is raised so that the conveying arm receives the substrate. (d) Process: Detecting the position of the substrate received from the loading stage by the conveyor arm; Based on the results of detecting the position of the substrate after moving along all the reference directions, a target position for handing over the substrate from the transport arm relative to the mounting stage is determined; as well as The drive control unit sets the target position as the set position of the conveyor arm.

2. The teaching method of the substrate conveying device according to claim 1, wherein, The platform is equipped with a tilt adjustment mechanism for adjusting the tilt. In step (a), the mounting surface is tilted by adjusting the tilt of the mounting platform using the tilt adjustment mechanism.

3. The teaching method of the substrate conveying device according to claim 1, wherein, At least three of the lifting pins are equipped with lifting mechanisms to adjust the height position of each lifting pin. In step (a), the substrate is tilted by using the lifting mechanism to keep the various lifting pins at different heights.

4. The teaching method of the substrate conveying device according to claim 1, wherein, The platform has a circular planar shape.

5. The teaching method of the substrate conveying device according to claim 4, wherein, The substrate has a circular planar shape. In the process of determining the target position, the target position is determined in such a way that the center of the substrate is aligned with the center of the mounting stage.

6. The teaching method of the substrate conveying device according to claim 5, wherein, The substrate has a circular planar shape. In step (d), the center of the substrate held in the transport arm is determined, and the center of the mounting stage as the target position is determined based on the circle connecting the centers of the substrates that move along all the reference directions.

7. The teaching method of the substrate conveying device according to claim 1, wherein, The mounting stage is disposed within the processing container that processes the substrate.

8. The teaching method of the substrate conveying device according to claim 7, wherein, The processing container contains a film-forming processing module for forming a film on the substrate.

9. The teaching method of the substrate conveying device according to claim 8, wherein, The teaching method is implemented during a period when the substrate is not being processed.

10. A substrate processing apparatus for processing a substrate, wherein, The substrate processing apparatus includes: a processing module having a processing container for processing the substrate; A conveying module includes a conveying arm that moves and conveys the substrate using a drive mechanism; a drive control unit that controls the drive mechanism; a position detection mechanism that detects the position of the substrate held on the conveying arm; and a control unit. A mounting platform is provided within the processing container. The mounting platform has: a mounting surface for mounting a substrate; an edge protruding from the mounting surface along its periphery; and at least three lifting pins configured to protrude from and retract into the mounting surface for transferring the substrate between the platform and the conveyor arm. When the substrate is transported using the transport arm, the control unit is configured to output control signals for performing the following steps: For at least three reference directions that are set to extend in mutually different directions through the central side and the peripheral side of the mounting surface, a cycle consisting of each of the steps (a) to (d) below is executed respectively; (a) Incline at least one of the mounting surface and the substrate held by the lifting pin along a reference direction selected from at least three of the reference directions, such that the height position of the peripheral side is lower than the height position of the central side; (b) Lower the lifting pin to transfer the substrate to the mounting platform; (c) The substrate handed over to the mounting stage moves along the reference direction on the mounting surface, and after reaching the inner periphery of the edge, the lifting pin is raised and the substrate is received by the conveying arm. (d) Detecting the position of the substrate received from the mounting stage by the conveyor arm; Based on the results of detecting the position of the substrate after moving along all the reference directions, a target position for handing over the substrate from the transport arm relative to the mounting stage is determined; as well as The drive control unit sets the target position as the set position of the conveyor arm.

11. The substrate processing apparatus according to claim 10, wherein, The platform is equipped with a tilt adjustment mechanism for adjusting the tilt. In (a), the mounting surface is tilted by adjusting the tilt of the mounting platform using the tilt adjustment mechanism.

12. The substrate processing apparatus according to claim 10, wherein, At least three of the lifting pins are equipped with lifting mechanisms to adjust the height position of each lifting pin. In (a), the substrate is tilted by using the lifting mechanism to keep the various lifting pins at different heights.

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