Substrate processing apparatus

Abstract

The present application relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus capable of sensing a residual electrostatic force at the time of desorption of an electrostatic chuck supporting a substrate, and preventing damage or breakage of the substrate or the like, the substrate processing apparatus including: a chamber providing a processing space for a substrate; an electrostatic chuck disposed on an inner side of the chamber to receive the substrate; a lift pin configured to penetrate the electrostatic chuck; a pin moving unit moving the lift pin up and down; and a first sensing portion sensing a load or torque applied by the lift pin.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, and more specifically to a substrate processing apparatus that can sense residual electrostatic force during the desorption of an electrostatic chuck supporting a substrate to prevent damage or breakage of the substrate. Background Technology

[0002] Typically, an electrostatic chuck is provided inside the cavity of the substrate processing apparatus to support and fix the substrate.

[0003] When a DC voltage is applied, such an electrostatic chuck can attract and fix the substrate to the chuck using electrostatic force, or unfold and fix a bent substrate flat using electrostatic force. This can improve the processing characteristics of the substrate in subsequent microprocessing.

[0004] However, when unloading the substrate, the DC voltage supply to the electrostatic chuck may be interrupted. In the case of the prior art device, even when the DC voltage supply to the electrostatic chuck is interrupted, electrostatic force may remain on the electrostatic chuck, and such residual electrostatic force may cause the substrate to continue to adhere to the electrostatic chuck.

[0005] At this time, if the lifting pin rises, the substrate will be adsorbed onto the electrostatic chuck by residual electrostatic force. Therefore, the lifting pin may cause damage or cracks on the substrate. Summary of the Invention

[0006] In order to solve the above problems, the present invention aims to provide a substrate processing device that can sense the electrostatic force remaining on the electrostatic chuck during the desorption of the electrostatic chuck, thereby preventing damage to the substrate.

[0007] The objective of the present invention can be achieved by a substrate processing apparatus, characterized by comprising: a cavity providing a processing space for the substrate; an electrostatic chuck disposed inside the cavity and on which the substrate is placed; a lifting pin configured to pass through the electrostatic chuck; a pin moving unit for moving the lifting pin up and down; and a first sensing unit for sensing the load or torque applied by the lifting pin.

[0008] Here, the pin moving unit may include: a lifting member connected to the lifting pin; a first lifting plate for moving the lifting member up and down; and a pin moving part for moving the first lifting plate up and down. The first sensing part includes: an extension rod extending from the lifting member; a first elastic member disposed between the extension rod and the first lifting plate to support the extension rod; and a first sensor part for sensing the distance from the extension rod.

[0009] Alternatively, the first sensing unit may further include: a first housing disposed on the first lifting plate and inserted into the lower end of the extension rod, and the first elastic member disposed on the inner side of the first housing.

[0010] Furthermore, the substrate processing apparatus may also include a first corrugated pipe surrounding the first housing between the first lifting plate and the cavity.

[0011] Alternatively, a through hole and a window that seals the through hole may be provided in the first lifting plate, and the first sensor unit may sense the distance from the extension rod through the through hole.

[0012] Alternatively, the elastic force of the first elastic component can be set to be less than the residual electrostatic force of the electrostatic chuck.

[0013] On the other hand, the objective of the present invention can be achieved by a substrate processing apparatus, characterized by comprising: a cavity providing a processing space for the substrate; an electrostatic chuck disposed inside the cavity and on which the substrate is placed; a lifting pin configured to pass through the electrostatic chuck; an up-down driving unit for moving the electrostatic chuck up and down; and a second sensing unit for sensing the load or torque applied by the lifting pin.

[0014] Here, the up-and-down driving unit may include: a second lifting plate connected to the electrostatic chuck; and an up-and-down moving part to move the second lifting plate up and down. The second sensing part includes: an extension rod extending from the electrostatic chuck; a second elastic member disposed between the extension rod and the second lifting plate to support the extension rod; and a second sensor part to sense the distance from the extension rod.

[0015] Alternatively, the second sensing unit may further include: a second housing disposed on the second lifting plate and inserted into the lower end of the extension rod, and the second elastic member disposed on the inner side of the second housing.

[0016] Furthermore, the substrate processing apparatus may also include a second bellows surrounding the second housing between the second lifting plate and the cavity.

[0017] Alternatively, the second lifting plate may also have a through hole and a window that seals the through hole, and the second sensor unit may sense the distance from the extension rod through the through hole.

[0018] In this case, the elastic force of the second elastic component can be set to be less than the magnitude of the residual electrostatic force of the electrostatic chuck.

[0019] According to the present invention having the aforementioned structure, when the electrostatic chuck is desorbed and the lifting pin is subjected to a load or torque exceeding a predetermined value by the electrostatic force remaining on the electrostatic chuck, the sensing unit can detect this, thereby preventing damage to the substrate. Attached Figure Description

[0020] Figure 1 This is a side view of a substrate processing apparatus according to an embodiment of the present invention. Figure 2 This is a side view of the substrate processing apparatus under conditions of residual electrostatic force during the desorption process of the electrostatic chuck. Figure 3 It is shown in Figure 1 as well as Figure 2 A diagram illustrating the operation of the central sensing unit. Figure 4 This is a side view showing a substrate processing apparatus according to another embodiment.

[0021] (Explanation of reference numerals in the attached image) 100: Cavity 110: Processing space 200: Gas Supply Department 300: Electrostatic chuck 310: Suction Cup Electrode 400: Lifting pin 510: Lifting component 520: Pin Moving Unit 522: First lift plate 524: Sales and Mobile Department 526: First Drive Unit 540: First elastic component 570: First Corrugated Pipe 580: First Casing 620: Up and down drive unit 622: Second lifting plate 624: Vertical moving part 626: Second Drive Unit 640: Second elastic component 670: Second bellows 680: Second housing 1000: Substrate processing apparatus Detailed Implementation Hereinafter, the structure of the substrate processing apparatus according to an embodiment of the present invention will be observed in detail with reference to the accompanying drawings.

[0022] Figure 1 This is a side view of a substrate processing apparatus 1000 according to an embodiment of the present invention.

[0023] Reference Figure 1 The substrate processing apparatus 1000 may include a cavity 100 providing a processing space 110 for the substrate W, an electrostatic chuck 300 disposed inside the cavity 100 and on which the substrate W is placed, a lifting pin 400 configured to pass through the electrostatic chuck 300, a pin moving unit 520 for moving the lifting pin 400 up and down, and a first sensing unit 530 for sensing the load or torque applied by the lifting pin 400.

[0024] First, the cavity 100 can provide a processing space 110 capable of performing various processing techniques on the substrate W, such as vapor deposition and etching.

[0025] A gas supply section 200 for supplying various process gases toward the substrate W may be provided on the upper inner side of the cavity 100. For example, the gas supply section 200 may be composed of a nozzle, but is not limited thereto.

[0026] On the other hand, an electrostatic chuck 300 for placing the substrate W can be provided on the lower inner side of the cavity 100.

[0027] Alternatively, the electrostatic chuck 300 may include chuck electrodes 310, to which a DC voltage is applied via a DC voltage source (not shown). In this case, the substrate W can be attracted and fixed to the electrostatic chuck 300 by the electrostatic force of the chuck electrodes 310, or the bent substrate W can be unfolded and fixed flat by the electrostatic force. This can improve the processing characteristics of the substrate W in subsequent microprocessing. A drive rod 320 may extend below the electrostatic chuck 300.

[0028] On the other hand, the substrate processing apparatus 1000 may include a plurality of lifting pins 400 configured to pass through the electrostatic chuck 300. The number of lifting pins 400 may be, for example, three, but is not limited thereto.

[0029] The lifting pin 400 can be configured to pass through the through hole 312 of the electrostatic chuck 300. In this case, the lifting pin 400 can be configured to move relative to the electrostatic chuck 300.

[0030] That is, such as Figure 1 As shown, the lifting pin 400 can also be configured to move directly up and down, or the electrostatic chuck 300 can be configured to move up and down. Figure 4 The structure of the electrostatic chuck 300, which can move up and down, is observed.

[0031] The pin moving unit 520, which moves the lifting pin 400 up and down, may include a lifting member 510 connected to the lower end of the lifting pin 400, a first lifting plate 522 that moves the lifting member 510 up and down, and a pin moving part 524 that moves the first lifting plate 522 up and down. Furthermore, the pin moving part 524 may receive driving force from the first driving part 526.

[0032] At this time, the lower end of the lifting pin 400 can be connected to the lifting component 510.

[0033] The pin moving part 524 may be composed of an LM (Linear Motion) guide or the like, and is not limited thereto. The pin moving part 524 may be connected to the lower outer side of the base 102 of the cavity 100.

[0034] The first drive unit 526 can be connected to the pin moving unit 524 to provide driving force to the pin moving unit 524.

[0035] Therefore, in the aforementioned structure, the first lifting plate 522 can move up and down by the drive of the pin moving part 524, thereby the lifting member 510 and the lifting pin 400 can also move up and down.

[0036] In the aforementioned structure, when the substrate W is unloaded from the electrostatic chuck 300, the DC voltage supply to the chuck electrode 310 can be interrupted, the lifting member 510 rises and the lifting pin 400 protrudes from the through hole 312, thereby causing the substrate W to rise.

[0037] However, in the case of the device according to the prior art, even when the DC voltage supply to the suction cup electrode 310 is interrupted, electrostatic force may remain on the electrostatic suction cup 300. Since such residual electrostatic force may cause the substrate W to continue to be attracted to the electrostatic suction cup 300.

[0038] At this time, if the lifting pin 400 rises, the substrate W is adsorbed onto the electrostatic chuck 300 by residual electrostatic force. Therefore, the lifting pin 400 may cause damage or cracks to the substrate W.

[0039] The present invention aims to solve the aforementioned problem by sensing the electrostatic force remaining in the electrostatic chuck 300 when the substrate W is de-chucking, such as when the DC voltage supply to the electrostatic chuck 300 is interrupted.

[0040] Reference Figure 1The first sensing unit 530 may include an extension rod 512 extending from the lifting member 510, a first elastic member 540 disposed between the extension rod 512 and the first lifting plate 522 to support the extension rod 512, and a first sensor unit 550 for sensing the distance from the extension rod 512.

[0041] The extension rod 512 can extend downward from the lifting member 510 and can extend through the base 102 of the cavity 100.

[0042] In this case, a first housing 580 may be provided on the first lifting plate 522, and the lower end of the extension rod 512 may be inserted into the interior of the first housing 580. The first housing 580 may be configured to penetrate the base 102. In this case, the first housing 580 may be raised or lowered by penetrating the base 102 through the operation of the first lifting plate 522.

[0043] Alternatively, although not shown in the accompanying drawings, the entire first housing 580 can also be disposed outside the cavity 100, above the first lifting plate 522. In this case, the extension rod 512 can protrude downwards from the cavity 100 and be inserted into the inside of the first housing 580.

[0044] Furthermore, to maintain the pressure inside the cavity 100, a first bellows 570 can be provided between the first lifting plate 522 and the cavity 100, surrounding the first housing 580. The upper end of the first bellows 570 can be connected to the lower outer side of the base 102 of the cavity 100, and the lower end of the first bellows 570 can be connected to the first lifting plate 522. The first bellows 570 can be configured to extend and retract, thereby maintaining the pressure inside the cavity 100 even during the lifting operation of the first lifting plate 522.

[0045] On the other hand, in order to maintain the pressure inside the cavity 100, at least one flange 513, 514 can be formed on the extension rod 512. Figure 1 The diagram shows two flange portions 513 and 514, but is not limited thereto. Lip seals 515 and 516 for sealing can be configured on the flange portions 513 and 514. Therefore, when the extension rod 512 moves up and down within the first housing 580, the pressure inside the cavity 100 can be maintained.

[0046] The first elastic member 540 can be disposed inside the first lifting plate 522 within the first housing 580. That is, the first elastic member 540 can be disposed between the first lifting plate 522 and the extension rod 512, supporting the extension rod 512 and applying pressure upward.

[0047] On the other hand, in the aforementioned structure, if the substrate W remains adsorbed to the electrostatic chuck 300 due to the residual electrostatic force of the electrostatic chuck 300 when the substrate W is desorbed, then the lifting pin 400 cannot rise even when the first lifting plate 522 and the first housing 580 are raised. In this case, a load or torque can be applied downwards through the lifting pin 400, the lifting member 510, and the extension rod 512, thereby reducing the distance between the extension rod 512 and the first lifting plate 522 despite the elastic force of the first elastic member 540.

[0048] That is, when the substrate W is desorbed, the first sensor unit 550 can sense the distance from the extension rod 512 and thus sense whether there is residual electrostatic force on the electrostatic chuck 300.

[0049] Specifically, the first sensor unit 550 may be composed of a sensor capable of measuring distance, such as a laser sensor, but is not limited thereto.

[0050] The first sensor unit 550 can be disposed below the first lifting plate 522. In this case, the first sensor unit 550 can be connected to the first lifting plate 522 by means of a fixing device (not shown). That is, the first sensor unit 550 can move up and down in conjunction with the first lifting plate 522 while maintaining a certain distance from it.

[0051] At this time, a through hole 523 and a window 560 sealing the through hole 523 can be provided in the first lifting plate 522. The first sensor unit 550 can pass through the through hole 523 to measure the distance from the lower end of the extension rod 512. An O-ring 562 for sealing can be arranged in the window 560.

[0052] The operation of the first sensing unit 530 in the substrate processing apparatus 1000 having the aforementioned structure will be observed below.

[0053] Figure 1 This shows the state of the first lifting plate 522 before it rises when the substrate W desorbs. Figure 2 The diagram shows the state in which the first lifting plate 522 is raised under the residual electrostatic force of the electrostatic chuck 300. Figure 3 Is Figure 1 as well as Figure 2 The side view shows the first sensing unit 530 in a larger magnified manner. Figure 3 (A) shows Figure 1 First sensing unit 530, Figure 3 (B) shows Figure 2 The first sensing unit 530.

[0054] Reference Figure 1 as well as Figure 3 In (A), before the first lifting plate 522 rises, the first sensor unit 550 can pass through the through hole 523 to measure a first distance L1 from the lower end of the extension rod 512. The first distance L1 can be stored in the control unit (not shown) of the substrate processing apparatus 1000, etc.

[0055] Next, refer to Figure 2 as well as Figure 3 (B) The first lifting plate 522 and the first housing 580 can be raised by the drive of the pin moving part 524.

[0056] At this time, if the electrostatic force remains on the electrostatic chuck 300 and the substrate W is still attached to the electrostatic chuck 300, the lifting pin 400 will not be able to rise even when the first lifting plate 522 and the first housing 580 are raised.

[0057] Therefore, the lifting pin 400, the lifting member 510 and the extension rod 512 can apply a load or torque downwards, so that the extension rod 512 does not rise despite the elastic force of the first elastic member 540, and the distance between the lower end of the extension rod 512 and the first lifting plate 522 is reduced.

[0058] At this time, the elastic force of the first elastic member 540 can be set to be less than the magnitude of the residual electrostatic force of the electrostatic chuck 300. For example, it can be that the magnitude of the residual electrostatic force on the electrostatic chuck 300 is repeatedly measured, and the elastic force of the first elastic member 540 is set to be less than the minimum value of the residual electrostatic force measured in this manner.

[0059] On the other hand, when the pin moving part 524 is working, the first sensor part 550 can continue to measure the distance from the extension rod 512. For example, when the distance measured by the first sensor part 550 corresponds to the second distance L2 and decreases to a critical value or higher than the first distance L1, the control part can determine that there is residual electrostatic force in the electrostatic chuck 300.

[0060] At this time, the control unit of the substrate processing apparatus 1000 can determine that it is in an abnormal state and perform a process to remove the residual static electricity of the electrostatic chuck 300, or interrupt the process and notify the operator through an alarm clock or the like.

[0061] on the other hand, Figure 4 This is a side view showing a substrate processing apparatus 2000 according to another embodiment.

[0062] exist Figure 4 The structure does not allow the lifting pin 400 to move directly up and down, but rather moves up and down in response to the electrostatic chuck 300. The same reference numerals are used for components identical to those in the previous embodiment.

[0063] Reference Figure 4 The substrate processing apparatus 2000 may include a cavity 100 providing a processing space 110 for the substrate W, an electrostatic chuck 300 disposed inside the cavity 100 and capable of moving up and down, a lifting pin 400 configured to pass through the electrostatic chuck 300, a vertical drive unit 620 for moving the electrostatic chuck 300 up and down, and a second sensing unit 630 for sensing the load or torque applied by the lifting pin 400.

[0064] Here, the up-and-down driving unit 620 may include a second lifting plate 622 connected to the electrostatic chuck 300 and an up-and-down moving part 624 for raising and lowering the second lifting plate 622. Furthermore, the up-and-down moving part 624 may receive driving force from the second driving unit 626.

[0065] The vertical moving part 624 may be composed of an LM (Linear Motion) guide or the like, and is not limited thereto. The vertical moving part 624 may be connected to the lower outer side of the base 102 of the cavity 100.

[0066] The second drive unit 626 can be connected to the up-down moving part 624 to provide driving force to the up-down moving part 624.

[0067] Therefore, in the aforementioned structure, the second lifting plate 622 can move up and down by driving the up and down moving part 624, thereby the electrostatic chuck 300 can also move up and down.

[0068] Here, the second sensing unit 630 may include a drive rod 320 extending from the electrostatic chuck 300, a second elastic member 640 disposed between the drive rod 320 and the second lifting plate 622 to support the drive rod 320, and a second sensor unit 650 for sensing the distance from the drive rod 320.

[0069] The drive rod 320 can extend downward from the electrostatic chuck 300 and can extend through the base 102 of the cavity 100.

[0070] In this case, a second housing 680 may be provided on the second lifting plate 622, and the lower end of the drive rod 320 may be inserted into the interior of the second housing 680. The second housing 680 may be disposed outside the cavity 100 on top of the second lifting plate 622. In this case, the drive rod 320 may protrude downwards from the cavity 100 and be inserted into the interior of the second housing 680.

[0071] Alternatively, although not shown in the accompanying drawings, the second housing 680 may be configured to penetrate the base 102. In this case, the second housing 680 can be raised and lowered by operating the second lifting plate 622 through the base 102.

[0072] Furthermore, to maintain the pressure inside the cavity 100, a second bellows 670 can be provided between the second lifting plate 622 and the cavity 100, surrounding the second housing 680. The upper end of the second bellows 670 can be connected to the lower outer side of the base 102 of the cavity 100, and the lower end of the second bellows 670 can be connected to the second lifting plate 622. The second bellows 670 can be configured to extend and retract, thereby maintaining the pressure inside the cavity 100 even during the lifting operation of the second lifting plate 622.

[0073] On the other hand, in order to maintain the pressure inside the cavity 100, at least one flange 613, 614 can be formed in the drive rod 320. Figure 4 The diagram shows two flange portions 613 and 614, but is not limited thereto. Lip seals 615 and 616 for sealing can be configured on the flange portions 613 and 614. Therefore, when the drive rod 320 moves up and down within the second housing 680, the pressure inside the cavity 100 can be maintained.

[0074] The second elastic member 640 can be disposed inside the second housing 680 within the second lifting plate 622. That is, the second elastic member 640 can be configured between the second lifting plate 622 and the drive rod 320, supporting the drive rod 320 and applying pressure upwards.

[0075] On the other hand, the second sensor unit 650 may be composed of a sensor capable of measuring distance, such as a laser sensor, but is not limited thereto.

[0076] The second sensor unit 650 can be disposed below the second lifting plate 622. In this case, the second sensor unit 650 can be connected to the second lifting plate 622 by means of a fixing device (not shown). That is, the second sensor unit 650 can move up and down in conjunction with the second lifting plate 622 while maintaining a certain distance from it.

[0077] At this time, a through hole 623 and a window 660 sealing the through hole 623 can be provided in the second lifting plate 622. The second sensor part 650 can pass through the through hole 623 to measure the distance from the lower end of the drive rod 320. An O-ring 662 for sealing can be arranged in the window 660.

[0078] exist Figure 4 In the embodiment, the operation of the second sensing unit 630 is the same as described above. Figure 1 as well as Figure 2 The embodiments are similar, so repeated descriptions are omitted.

[0079] The present invention has been described above with reference to preferred embodiments. However, those skilled in the art can make various modifications and alterations to the present invention without departing from the concept and scope of the invention as set forth in the appended claims. Therefore, if any modified implementation substantially includes the constituent elements of the claims of the present invention, it should be considered to be entirely included within the technical scope of the present invention.

Claims

1. A substrate processing apparatus, characterized in that, have: The cavity provides space for processing the substrate; An electrostatic chuck is disposed inside the cavity to hold the substrate; The lifting pin is configured to pass through the electrostatic chuck. The pin moving unit causes the lifting pin to move up and down. as well as The first sensing unit senses the load or torque applied by the lifting pin.

2. The substrate processing apparatus according to claim 1, characterized in that, The pin moving unit includes: The lifting component is connected to the lifting pin; A first lifting plate causes the lifting component to move up and down; and The pin moves, causing the first lifting plate to rise or fall. The first sensing unit includes: An extension rod extends from the lifting member; A first elastic member, disposed between the extension rod and the first lifting plate, supports the extension rod; and The first sensor unit senses the distance from the extension rod.

3. The substrate processing apparatus according to claim 2, characterized in that, The first sensing unit also includes: A first housing is disposed on the first lifting plate and inserted into the lower end of the extension rod. The first elastic member is disposed on the inner side of the first housing.

4. The substrate processing apparatus according to claim 3, characterized in that, The substrate processing apparatus further comprises: A first bellows surrounds the first housing between the first lifting plate and the cavity.

5. The substrate processing apparatus according to claim 2, characterized in that, The first lifting plate is also provided with a through hole and a window to seal the through hole. The first sensor unit senses the distance from the extension rod through the through hole.

6. The substrate processing apparatus according to claim 2, characterized in that, The elastic force of the first elastic component is set to be less than the residual electrostatic force of the electrostatic chuck.

7. A substrate processing apparatus, characterized in that, have: The cavity provides space for processing the substrate; An electrostatic chuck is disposed inside the cavity to hold the substrate; The lifting pin is configured to pass through the electrostatic chuck. The up-down drive unit causes the electrostatic chuck to move up and down; as well as The second sensing unit senses the load or torque applied by the lifting pin.

8. The substrate processing apparatus according to claim 7, characterized in that, The up and down driving unit includes: The second lifting plate is connected to the electrostatic chuck; and The vertical moving part causes the second lifting plate to rise and fall. The second sensing unit includes: An extension rod extends from the electrostatic chuck; A second elastic member is disposed between the extension rod and the second lifting plate to support the extension rod; and The second sensor unit senses the distance from the extension rod.

9. The substrate processing apparatus according to claim 8, characterized in that, The second sensing unit also includes: The second housing is disposed on the second lifting plate and inserted into the lower end of the extension rod. The second elastic member is disposed on the inner side of the second housing.

10. The substrate processing apparatus according to claim 9, characterized in that, The substrate processing apparatus further comprises: A second corrugated pipe surrounds the second housing between the second lifting plate and the cavity.

11. The substrate processing apparatus according to claim 8, characterized in that, The second lifting plate is also provided with a through hole and a window to seal the through hole. The second sensor unit senses the distance from the extension rod through the through hole.

12. The substrate processing apparatus according to claim 8, characterized in that, The elastic force of the second elastic component is set to be less than the residual electrostatic force of the electrostatic chuck.

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