Substrate holding device and substrate bonding device

Abstract

The present application provides a substrate holding device including: a holding plate that holds a substrate on a holding surface; a plurality of actuators that are connected to the holding plate and deform the holding plate at least in the normal direction of the holding surface; a base plate that supports the plurality of actuators; a table body that supports the base plate; and a mechanism that is disposed between the table body and the base plate and deforms in accordance with reaction forces of the plurality of actuators generated in the base plate. A substrate bonding device can also be provided that includes the substrate holding device and a substrate holding portion that holds another substrate, and moves at least one of the substrate holding device and the substrate holding portion in a manner that approaches the other to bond the substrate and the other substrate.

Description

[0001] Related applications

[0002] This application claims priority based on Japanese Patent Application No. 2025-062532, filed on April 4, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a substrate holding device and a substrate bonding device. Background Technology

[0004] Japanese Patent Application Publication No. 2013-8804 describes a method for aligning substrates 121 in a positioning section 170 by observing alignment marks 128 on opposing substrates 121 using microscopes 231 and 251 and measuring their relative positions. Furthermore, a micro-motion stage 230 is moved to eliminate any deviation in the measured relative positions, thereby enabling the substrates 121 to be aligned. (Section 0055) Summary of the Invention

[0005] In a first embodiment, a substrate holding device is provided, comprising: a holding plate that holds a substrate on a holding surface; a plurality of actuators connected to the holding plate that deform the holding plate at least in the normal direction of the holding surface; a base plate that supports the plurality of actuators; a worktable body that supports the base plate; and a mechanism disposed between the worktable body and the base plate and deformable according to the reaction force of the plurality of actuators generated on the base plate.

[0006] In the aforementioned substrate holding device, the mechanism may include: a fixed support portion that fixes and supports a base plate and a worktable body; and a damper disposed between the base plate and the worktable body. Alternatively, the fixed support portion may be disposed in a region overlapping the center of the base plate, and multiple dampers may be disposed in regions overlapping the edges of the base plate.

[0007] In the aforementioned substrate holding device, the mechanism may also have a hinge that suppresses deformation of the worktable body relative to the base plate. Alternatively, the hinge may deform according to at least one of the tilting of the base plate and radial movement.

[0008] In the aforementioned substrate holding device, a leaf spring may also be included to connect the base plate and the holding plate.

[0009] In the aforementioned substrate holding device, multiple actuators may each have a linkage mechanism that can move relative to the holding plate in the surface direction and transmit the displacement of the actuator in the normal direction.

[0010] In the aforementioned substrate holding device, there may also be an indicator disposed on the worktable body and used to detect the position of the worktable body.

[0011] In a second embodiment, a substrate bonding apparatus is provided. The substrate bonding apparatus includes a substrate holding portion for holding other substrates. The substrate bonding apparatus bonds the substrate to the other substrates by moving at least one of the substrate holding portion and the substrate holding portion in a manner close to the other.

[0012] In any of the above-mentioned substrate bonding apparatuses, the substrate holding device is movable in the surface direction of the substrate.

[0013] The above description of the invention does not list all the features of the invention. Sub-combinations of these feature groups can also constitute an invention.

[0014] The above-described or other objects, features, and effects of this invention will become clear from the following description of embodiments with reference to the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a schematic top view representing the laminate manufacturing system 100.

[0016] Figure 2 This is a schematic longitudinal sectional view showing the substrate bonding apparatus 170.

[0017] Figure 3 This is a schematic cross-sectional view showing the substrate bonding apparatus 170.

[0018] Figure 4 This illustrates an example of a laminate manufacturing system 100 bonding a substrate 121.

[0019] Figure 5 This is a conceptual perspective view of a pair of substrates 121 that are placed opposite each other and used for joining.

[0020] Figure 6 This is a schematic top view showing the holding section 220 and the micro-motion stage 230.

[0021] Figure 7 This is a schematic AA cross-sectional view showing the holding part 220 and the micro-movement stage 230.

[0022] Figure 8 This is a schematic BB cross-sectional view representing the retaining part 220.

[0023] Figure 9 This is a schematic CC cross-sectional view representing the retaining part 220.

[0024] Figure 10 It means Figure 9 A schematic enlarged view of the part indicated by the dashed line.

[0025] Figure 11This is a schematic CC cross-sectional view representing the retaining part 220.

[0026] Figure 12 The hinge 650, which serves as a support, is schematically shown.

[0027] Figure 13 The fixed support 670 and the damper 672, which serve as support components, are schematically shown. Detailed Implementation

[0028] The following embodiments do not limit the invention as described in the claims. All combinations of features described in the embodiments are not necessarily necessary for the solution of the invention.

[0029] Figure 1 This is a structural diagram illustrating the laminate manufacturing system 100 of this embodiment. The laminate manufacturing system 100 includes a housing 106, a substrate housing 120, a first transport robot 132, a substrate buffer 161, a substrate position adjustment unit 163, a second transport robot 134, an activation device 165, a cleaning device 167, a substrate bonding device 170, and a control device 110. The laminate manufacturing system 100 manufactures a laminate 123 formed by stacking multiple substrates 121. The substrate 121 is, for example, a circular silicon substrate with circuit patterns, alignment marks, electrodes, etc. The laminate manufacturing system 100 can also stack unprocessed substrates, compound semiconductor substrates, printed circuit boards, glass substrates, etc. Substrates with circuit patterns, etc., can be stacked with unprocessed substrates, or substrates with circuit patterns and unprocessed substrates of the same type can be stacked together. The stacked substrate 121 itself can also be a substrate formed by stacking multiple substrates. Furthermore, the stacked substrate 121 is not limited to a circular substrate, but can also be a square substrate.

[0030] The substrate housing 120 is a housing capable of housing the substrate 121, which has circuit patterns or the like formed on it. A first transport robot 132 removes the substrate 121 from the substrate housing 120 and transports it to a substrate buffer 161 or a substrate position adjustment unit 163. The substrate buffer 161 temporarily stores the substrate 121. The substrate position adjustment unit 163 pre-aligns the substrate 121 before transporting it to various devices such as the activation device 165, the cleaning device 167, and the substrate bonding device 170. A second transport robot 134 transports the substrate 121 between the substrate buffer 161, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0031] The activation device 165 activates the surface of the substrate 121. Specifically, activation is achieved by plasma treatment of the surface of the substrate 121. The cleaning device 167 cleans the substrate 121 that has been activated by the activation device 165. The cleaned substrate 121 is then transferred to the substrate bonding device 170. The substrate bonding device 170 stacks (bonds) two substrates 121.

[0032] The control device 110 has arithmetic processing circuits such as a CPU, and memory such as ROM and RAM, and executes a predetermined program to realize its functions. The control device 110 is, for example, a computer, which uniformly controls all parts of the laminate manufacturing system 100. The control device 110 controls the driving of the first handling robot 132, the second handling robot 134, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0033] The laminate manufacturing system 100 includes a substrate bonding device 170 disposed within a housing 106. The laminate manufacturing system 100 bonds multiple substrates 121 together to manufacture a laminate 123.

[0034] The laminate 123 manufactured in the laminate manufacturing system 100 is housed in another substrate housing 120 and removed from the laminate manufacturing system 100. In this way, by using the substrate housing 120, multiple substrates 121 can be loaded into the laminate manufacturing system 100 together, and multiple laminates 123 can be removed from the laminate manufacturing system 100 together.

[0035] A first handling robot 132, positioned facing the substrate housing 120, removes the bonded substrate 121 from the substrate housing 120. Additionally, the first handling robot 132 moves the manufactured laminate 123 into the substrate housing 120. Thus, the first handling robot 132 directly handles either the substrate 121 or the laminate 123.

[0036] The substrate bonding apparatus 170 includes a fixed stage 250 and a movable stage 240 disposed inside the frame 210. The fixed stage 250 is fixed to the frame 210. The movable stage 240 includes a micro-motion mounting stage 230 that moves relative to the fixed stage 250. A holding part 220 is disposed on the micro-motion mounting stage 230. When the holding part 220 holds the substrate 121, the movable stage 240 moves relative to the fixed stage 250.

[0037] The outer surface of the frame 210 is sealed by the wall material 212, blocking the influence of radiant heat from the surrounding environment on the substrate bonding device 170. The micro-motion stage 230 is equipped with a reflector 224. An interferometer 222 is disposed inside the wall material 212. The interferometer 222 uses the reflector 224 to measure the position of the micro-motion stage 230 with high precision. As a result, the substrate 121 held by the holding part 220 can be positioned with high precision relative to the substrate 121 held by the holding part 252 of the fixed stage part 250. In other words, the reflector 224 can also be regarded as an indicator for detecting the position of the micro-motion stage 230.

[0038] After positioning, the micro-motion stage 230 moves toward the fixed stage 250, and the laminate manufacturing system 100 attaches the substrates 121 together to form a laminate 123. The laminate 123 is then handed over to the second handling robots 134 and 132 and recycled into the substrate housing 120.

[0039] In addition, the control device 110 includes an operation unit that the user can operate externally when the power supply to the input laminate manufacturing system 100 is turned on, various settings are set, information is received, etc., and a display unit that transmits information to the user. Moreover, the control device 110 may also include a connection unit that connects to other additionally equipped equipment.

[0040] Figure 2 This is a schematic longitudinal sectional view of the substrate bonding apparatus 170. The mounting stage 250 is suspended downwards from the top surface of the frame 210 via multiple force sensors 254. The mounting stage 250 includes a holding section 252. The holding section 252 may be a vacuum chuck. The holding section 252 holds the substrate 121 vertically downwards. The force sensors 254 detect the vertically downward force acting on the mounting stage 250.

[0041] A vertically downward microscope 251 is disposed on the top surface of the frame 210, on the side of the stage 250. The microscope 251 observes the surface of the substrate 121 held by the holding part 220. The microscope 251 is fixed to the frame 210, so the relative position of the microscope 251 and the stage 250 does not change.

[0042] The movable stage 240 includes a movable platform 242, a coarse-motion mounting stage 244, a gravity-counteracting unit 246, a spherical seat 248, and a fine-motion mounting stage 230. The movable platform 242, carrying the coarse-motion mounting stage 244, the gravity-counteracting unit 246, and the fine-motion mounting stage 230, moves along a guide rail 241 fixed to the inner bottom surface of the frame 210. Through the movement of the movable platform 242, the movable stage 240 moves between a position directly below the fixed stage 250 and a position offset from directly below the fixed stage 250.

[0043] The coarse-motion stage 244 moves relative to the moving platform 242 in a horizontal direction that includes the X and Y direction components shown by the arrows in the figure. When moving relative to the moving platform 242, the fine-motion stage 230 also moves along with the coarse-motion stage 244.

[0044] The gravity cancellation unit 246 extends and retracts while detecting the minute displacement of the micro-motion stage 230, thereby reducing the apparent weight of the micro-motion stage 230. This reduces the load on the actuator that displaces the micro-motion stage 230, thus improving position control accuracy.

[0045] A holding unit 220 is disposed on a micro-motion stage 230. The holding unit 220 holds the substrate 121 for bonding. During the positioning operation of the substrate 121, the micro-motion stage 230 moves along with the movement platform 242 and the coarse motion stage 244 provided on the movement platform 242. In the next stage, the micro-motion stage 230 is displaced relative to the coarse motion stage 244. The displacement of the micro-motion stage 230 relative to the coarse motion stage 244 includes translation and rotation relative to all X, Y, and Z axes. The displacement of the micro-motion stage 230 is small enough that even if the micro-motion stage 230 is displaced, it does not come into contact with the top pusher 623 described later. In other words, with the above structure, the movement stage 240 can move at least in the surface direction of the substrate 121. The positioning control unit 112 controls the displacement of the movement platform 242, the coarse motion stage 244, and the micro-motion stage 230.

[0046] Additionally, the micro-motion stage 230 includes a microscope 231 fixed to the side. Since the microscope 231 is fixed relative to the micro-motion stage 230, the relative positions of the micro-motion stage 230 and the microscope 231 do not change. The microscope 231 observes the surface of the substrate 121 held on the fixed stage 250. The substrate bonding apparatus 170 uses the observation results from the microscopes 231 and 251 to measure the relative positions of the substrates 121.

[0047] Figure 3 This is a schematic cross-sectional view of the substrate bonding apparatus 170. (Regarding...) Figure 2 The same elements are labeled with the same reference numerals and repeated descriptions are omitted.

[0048] The mobile platform 242 and the retaining part 220 on the mobile platform 242 move along the guide rail 241.

[0049] The moving platform 242 moves along the guide rail 241, so that the substrate 121 held by the holding part 252 is opposite to the substrate 121 held by the holding part 220. After positioning the pair of substrates 121, the micro-motion stage 230 is raised, and the pair of substrates 121 approach each other.

[0050] Figure 4 This illustrates an example of a laminate manufacturing system 100 bonding a substrate 121. Figure 4 In the example shown, the holding portion 220 and the substrate 121 held by the holding portion 220 are deformed into a shape where the center is more prominent than the periphery. The holding portion 252 has a pressing protrusion 641 at its center. The pressing protrusion 641 is displaced in the vertical direction. First, the pressing protrusion 641 is displaced vertically downward from the center of the holding portion 252, pressing down on the center of the substrate 121 held by the holding portion 252. Then, the substrate 121 held by the holding portion 220 approaches the substrate 121 held by the holding portion 252.

[0051] Because the surfaces of substrate 121 are activated, when the central portions come into contact with each other, adjacent regions spontaneously adsorb and bond to each other through intermolecular forces between the substrates 121. After a portion of substrate 121 comes into contact with each other, the holding portion 252 releases the substrate 121 from its holding position. The bonded areas of substrate 121 extend sequentially from the contacting portions to the adjacent areas. As a result, a bonding wave (sometimes called a bonding wave) is generated, extending the contacting areas sequentially, and the substrates 121 bond to each other. The bonding wave travels from the center of substrate 121 toward the ends in the direction of the arrow. Finally, substrates 121 come into contact with each other and bond over their entire surfaces. Thus, substrate 121 forms a laminate 123.

[0052] Figure 5 This is a conceptual perspective view of a pair of substrates 121 facing each other for bonding. The dashed line connecting the two ends of the two substrates 121 indicates that the two substrates 121 are facing each other for bonding. The substrates 121 have a circular plate shape that is partially missing due to the notch 124, and have a plurality of element regions 126 and alignment marks 128 on their surfaces.

[0053] The notch 124 is formed in a manner corresponding to the crystal orientation of the substrate 121. Therefore, when processing the substrate 121, the orientation of the substrate 121 is determined by using the notch 124 as an indicator.

[0054] Multiple component regions 126 are disposed on the surface of substrate 121. Semiconductor devices formed by processing substrate 121 using photolithography or the like are mounted on component regions 126. In addition, each component region 126 also includes pads, etc., which serve as connection terminals when substrate 121 is attached to other substrates 121.

[0055] Furthermore, there are blank areas between the multiple component regions 126 where no functional elements such as components or circuits are configured. In these blank areas, scribe lines 122 are provided, which are cut when the substrate 121 is divided into each component region 126.

[0056] Furthermore, alignment marks 128 are provided on the dicing line 122 to mark the positioning of the substrate 121. The dicing line 122 disappears as a saw edge during the process of cutting the substrate 121 to become a bare chip, so by providing the alignment marks 128, the effective area of ​​the substrate 121 is not compressed.

[0057] Furthermore, while the component regions 126 and alignment marks 128 are depicted as large in the figures, the number of component regions 126 formed on a substrate 121 with a diameter of 300 mm sometimes reaches several hundred or more. In addition, wiring patterns formed on the component regions 126 are sometimes used as alignment marks 128.

[0058] When positioning a pair of substrates 121 to be bonded in the substrate bonding apparatus 170, the alignment marks 128 of the opposing substrates 121 are observed through microscopes 231 and 251, and the substrate bonding apparatus 170 measures the relative positions of the substrates 121. Furthermore, in order to eliminate the offset of the measured relative positions, the micro-motion stage 230 is moved, thereby adjusting the position of each substrate 121.

[0059] Figures 6 to 9 This indicates the holding section 220 and the micro-motion stage 230. Figures 6 to 12 For simplicity, the illustration of substrate 121 is omitted.

[0060] Figure 6 This is a schematic top view of the holding section 220 and the micro-motion stage 230. Figure 6 The circle 647 shown by the dashed line represents the outer diameter of the substrate 121 when the substrate 121 is held. Figure 7 It is the retaining part 220 and the micro-motion mounting stage 230 Figure 6 The schematic AA cross-sectional view shown in AA. Figure 8 It is the 220th part of the maintenance department. Figure 6 The schematic BB cross-sectional view shown. Figure 9 It is the 220th part of the maintenance department. Figure 6 The schematic CC cross-sectional view shown.

[0061] Figures 6 to 9 The holding part 220 indicates that the actuator 615 is not activated. Additionally, in Figure 7 and Figure 8 The reflector 224 and the micro-motion stage 230 are omitted.

[0062] The micro-motion stage 230 includes a reflector 224 and a support 601. The holding part 220 includes a base plate 603, a leaf spring 605, a holding plate 607, an actuator 615, a valve 629, a negative pressure source 633, a holding control part 631, and a deformation control part 637. The holding plate 607 has an attraction part 609, a support protrusion 611, a holding surface 613, a surface 635 opposite to the holding surface, a through hole 619, and a through hole 625. Furthermore, in... Figure 6 In the diagram, only one of the circles corresponding to the support protrusion 611 and the through hole 625 is labeled, but multiple of them are provided on the retaining plate 607. The support protrusion 611 and the through hole 625 are also represented by circles of the same shape as those representing the symbols. The retaining plate 607 is made of, for example, alumina. The actuator 615 has a linkage mechanism 617 and a shaft 627. The gravity counteracting part 246 supports the pushing mechanism 621 and has a temporary holding control part 639. The pushing mechanism 621 has a push pin 623.

[0063] like Figure 6 and Figure 9 As shown, the micro-motion stage 230 has multiple support portions 601 directly below the end of the base plate 603. The support portions 601 support the base plate 603. The base plate 603 supports multiple actuators 615. The base plate 603 is made of, for example, aluminum. The retaining portion 220 has leaf springs 605 on its four sides. Each leaf spring 605 is threaded to the base plate 603 and the retaining plate 607, connecting the base plate 603 and the retaining plate 607.

[0064] like Figure 6 As shown, the retaining plate 607 has multiple (in) inside the circle shown by the dashed line. Figure 8 In this example, there are two through holes 619. A gravity-counteracting part 246 supports a pushing mechanism 621 below each through hole 619. A top pusher 623 passes through them without contacting the micro-motion stage 230 and the base plate 603. This suppresses the transmission of heat and vibration from the top pusher 623 to the micro-motion stage 230. A temporary holding control part 639 controls each pushing mechanism 621, which causes the top pusher 623 to move vertically relative to the through holes 619. The pushing mechanism 621 is, for example, a ball screw.

[0065] With the substrate 121 not held by the holding surface 613, the pushing mechanism 621 extends the top pusher 623 such that its upper end is higher than the holding surface 613. The substrate 121 is placed on the top pusher 623 by the second handling robot 134, and the top pusher 623 temporarily holds the substrate 121. When the pushing mechanism 621 causes the top pusher 623, which temporarily holds the substrate 121, to retract vertically downward from the holding surface 613, the holding surface 613 supports the substrate 121 instead of the top pusher 623. The top pusher 623 is also used when the substrate 121 held on the holding surface 613 is retracted by a process substantially the opposite of the above.

[0066] The holding plate 607 has an attraction portion 609 and multiple support protrusions 611 inside the circle shown by the dashed line. The imaginary surfaces defined at the front ends of the multiple support protrusions 611 form a holding surface 613. The support protrusions 611 support the substrate 121. The attraction portion 609 is connected to a negative pressure source 633 via a valve 629. The holding control unit 631 controls the opening and closing of the valve 629; when the holding control unit 631 opens the valve 629, the attraction portion 609 communicates with the negative pressure source 633. The support protrusions 611 support the substrate 121, and the holding control unit 631 opens the valve 629, thereby reducing the pressure between the holding plate 607 and the substrate 121, causing the holding plate 607 to attract and hold the substrate 121. In other words, the holding plate 607 and the holding control unit 631 constitute a vacuum clamp for holding the substrate 121.

[0067] The 607 retainer is still there. Figure 6 The circle shown by the dashed line has a through hole 625 inside. (As shown...) Figure 9 As shown, the holding portion 220 has actuators 615 below each through hole 625. The through holes 625 and the actuators 615 are arranged in a concentric circle relative to the holding plate 607.

[0068] The through hole 619 is not positioned at the center of the retaining plate 607. When the substrate 121 is joined by a bonding wave, the through hole 619 is not positioned at the center of the retaining plate 607, i.e., the ideal starting point of the bonding wave, thereby suppressing the bonding offset of the substrate 121.

[0069] Figure 10 yes Figure 9 A schematic enlarged view of the portion shown by the dashed line. Actuator 615 is coupled to shaft 627, which extends vertically upwards. The end of shaft 627 not coupled to actuator 615 is threadedly fixed to linkage mechanism 617. The unthreaded end of linkage mechanism 617, fixed to shaft 627, is in contact with the lower surface of retaining plate 607. Actuator 615 displaces retaining plate 607 vertically upwards via shaft 627 and linkage mechanism 617.

[0070] The through hole 625 has a countersunk hole in which a bolt 643 is disposed. The bolt 643 disposed in the countersunk hole is embedded in the linkage mechanism 617, and the bolt 643 threadedly fixes the retaining plate 607 to the linkage mechanism 617. The actuator 615 is connected to the retaining plate 607 via the shaft 627 and the linkage mechanism 617. Thus, the actuator 615 causes the retaining plate 607 to move vertically downward.

[0071] In other words, the shaft 627, the linkage mechanism 617, and the bolt 643 together constitute the connecting component 645. At this time, the connecting component 645 is inserted into multiple through holes 625 and engages with the corresponding actuator 615 among multiple actuators 615.

[0072] The deformation control unit 637 individually controls each actuator 615. The deformation control unit 637 controls the actuator 615, with the shaft 627 positioned in the normal direction of the holding surface 613 (i.e., Figures 7 to 10 The actuator 615 causes the retaining plate 607 to deform in the normal direction of the retaining surface 613 by displacing it vertically (in the vertical direction). The retaining surface 613 has a predetermined uneven shape when the actuator 615 is not activated. Figure 9 In the example shown, the predetermined concave-convex shape is a shape where the periphery is more convex than the center.

[0073] The surface 635 opposite to the retaining surface 613 in the retaining plate 607 is flat when the actuator 615 is not activated. As a result, the linkage mechanism 617 can be easily threaded into the corresponding through hole 625, and the assembly of the retaining part 220 becomes easy.

[0074] Figure 11 The holding part 220 indicates the state of the actuator 615 in operation within the CC section. (Regarding...) Figures 7 to 10 Common elements are labeled with the same reference numerals and repeated descriptions are omitted. Figure 11 This indicates that the retaining surface 613 is deformed to a ratio Figure 9 An example of large curvature. In this case, actuator 615 causes retaining plate 607 to deform more convexly in the vertical direction.

[0075] When the actuator 615 actuates and applies a force that deforms the retaining plate 607, its reaction force acts on the base plate 603. For example, in Figure 11 In the example shown, actuator 615 pushes up the center of retaining plate 607, thus exerting a reaction force on base plate 603 that presses down the center.

[0076] When the base plate 603 deforms due to the reaction force, this deformation may further deform the micro-motion stage 230 via the support portion 601. For example, in Figure 11In the example shown, due to the reaction force, the center of the base plate 603 is concave, meaning the periphery deforms by being relatively lifted. Here, for example, if the support portion 601 is a rigid solid block, the deformation of the base plate 603 is caused by the force acting on the support portion 601, which lifts the periphery of the micro-movement platform 230 relative to it. In such a case, a vertically upward force acts on the support portion 601, and a horizontal force is applied by the center of the base plate 603.

[0077] When the micro-motion stage 230 deforms, the reflector 224 mounted on it tilts. When the reflector 224 is tilted, the position where the light from the interferometer 222 illuminates the reflector 224 differs from when it is upright; therefore, the interferometer 222 may misdetect the position of the micro-motion stage 230. Furthermore, due to the deformation of the micro-motion stage 230, the reflector 224 may displace in the direction of movement of the micro-motion stage 230, such as in the horizontal direction, which could also lead to misdetection.

[0078] Therefore, in this embodiment, a mechanism that deforms according to the reaction force of the actuator 615 generated in the base plate 603 is provided between the micro-motion stage 230 and the base plate 603. The deformation of this mechanism prevents deformation of the micro-motion stage 230.

[0079] Figure 12 The hinge 650, which serves as a support 601, is schematically shown. The hinge 650 is formed by... Figure 6 The dashed lines in the figure indicate the four positions of the support 601 located between the base plate 603 and the micro-motion mounting stage 230. Figure 6 In the example shown, a hinge 650 is provided at the location where the leaf spring 605 is located, but it can also be provided at other locations.

[0080] The hinge 650 has a plate-shaped hinge portion 652 and a cylindrical inclined hinge portion 660 disposed on the hinge portion 652. The hinge portion 652 is threadedly fixed to the micro-motion mounting stage 230. The inclined hinge portion 660 is threadedly fixed to the base plate 603.

[0081] The hinge portion 652 has four slots on its upper surface surrounding the inclined hinge portion 660. Figure 12Only slots 654, 655, and 656 are shown in the diagram, but another slot is hidden within the inclined hinge portion 660. Specifically, there is another slot opposite slot 654, such that slots 655 and 656 are opposite each other across the inclined hinge portion 660. The four slots, including slots 654, 655, and 656, extend in a direction orthogonal to the radial direction of the substrate 121 or the holding plate 607. The four slots, including slots 654, 655, and 656, each have a "[" (square bracket) shape. The inclined hinge portion 660 is movable in the horizontal direction, particularly in the radial direction of the substrate 121 or the holding plate 607, via the four slots including slots 654, 655, and 656. Therefore, the hinge 650 deforms according to the radial movement of the base plate 603 relative to the micro-motion stage 230. Therefore, even if the base plate 603 deforms radially due to the reaction force of the actuator 615, the hinge 650 deforms accordingly, preventing deformation of the micro-motion stage 230. Furthermore, the number and shape of the slots in the hinge portion 652 are just one example. It is not limited to this.

[0082] The inclined hinge portion 660 has four slots on its side. Figure 12 Only slots 662, 663, and 664 are shown in the diagram, but another slot exists on the back side of the tilting hinge portion 660. Through slots 662 and 663, the tilting hinge portion 660 can deform in a rotational direction about the radial axis of the substrate 121. Furthermore, through slot 664 and another slot (not shown), the tilting hinge portion 660 can deform in a rotational direction about a direction orthogonal to the radial axis of the substrate 121. Thus, even if the base plate 603 is tilted relative to the surface of the substrate 121 due to the reaction force of the actuator 615, the tilting hinge portion 660 deforms according to this tilt, preventing deformation of the micro-motion stage 230. Additionally, the number of slots in the tilting hinge portion 660 is an example, and is not limited to four.

[0083] As described above, hinge 650 functions as a mechanism that deforms according to the reaction force of actuator 615 generated in base plate 603. In other words, hinge 650 can be said to suppress the deformation of micro-motion stage 230 relative to base plate 603. It can also be said to prevent the reaction force of actuator 615 from being transmitted to micro-motion stage 230.

[0084] Figure 13 The structure for preventing deformation of the micro-motion stage 230 is shown, instead of Figure 12 The hinge 650 serves as the support part 601. Figure 13The fixed support 670 and damper 672, serving as supporting components, are schematically shown. The fixed support 670 is positioned corresponding to the center of the retaining plate 607. In other words, the fixed support 670 can be described as being positioned in the region overlapping the center of the base plate 603. The fixed support 670 is, for example, a solid block component with high rigidity, and is threadedly fixed to the base plate 603 and the micro-motion mounting stage 230, respectively, providing fixed support for them.

[0085] Damper 672 in Figure 6 Four locations, indicated by the support portion 601, are arranged between the base plate 603 and the micro-motion mounting stage 230, and connect them. Figure 6 In the example shown, a damper 672 is provided corresponding to the location where the leaf spring 605 is located. In other words, multiple dampers 672 can be arranged in the area overlapping the edge of the base plate 603. Furthermore, the dampers 672 can also be located in other positions, and the number of dampers 672 is not limited to four.

[0086] exist Figure 13 In this configuration, the base plate 603 is fixedly supported at a certain point by the fixed support portion 670. Therefore, even if the base plate 603 deforms, the deformation is difficult to transmit to the micro-motion stage 230.

[0087] Furthermore, the damper 672 also supports the base plate 603 on the micro-motion stage 230. Here, the damper 672 absorbs the deformation of the base plate 603. Therefore, the damper 672 functions as a mechanism that deforms according to the reaction force of the actuator 615 generated on the base plate 603. In other words, the damper 672 and the fixed support 670 suppress the deformation of the micro-motion stage 230 relative to the base plate 603. This can also be described as preventing the reaction force of the actuator 615 from being transmitted to the micro-motion stage 230.

[0088] The base plate 603 can be made of a metallic material other than aluminum. The base plate 603 can also be made of a ceramic material. Specifically, the base plate 603 can be made of alumina, SiC (silicon carbide), or a low-thermal-expansion ceramic. The retaining plate 607 can be made of a ceramic material other than alumina. The retaining plate 607 can also be made of SiC (silicon carbide) or a low-thermal-expansion ceramic.

[0089] Apart from Figure 12 or Figure 13 In addition to the structural integrity, deformation of the micro-motion stage 230 can be suppressed by increasing the rigidity of at least one of the base plate 603 and the micro-motion stage 230. Methods to increase rigidity include increasing the thickness and using materials with high rigidity.

[0090] In addition, Figure 12 or Figure 13In addition to the structural integrity, the detection results of the interferometer 222 can be corrected based on the deformation of the micro-motion stage 230 caused by the reaction force of the actuator 615. In this case, the extent to which the reflector 224 deforms due to the drive of the actuator 615 can be determined through analysis and actual measurement, and the position of the micro-motion stage 230 can be corrected based on the amount of drive of the actuator 615.

[0091] The embodiments described above are for illustrative purposes only; however, the scope of the present invention is not limited to those described in the above embodiments. It will be apparent to those skilled in the art that various modifications or alterations can be made to the above embodiments. As can be seen from the claims, such modifications or alterations can also be included within the scope of the present invention.

[0092] It should be noted that the execution order of actions, processes, steps, and stages in the apparatus, systems, programs, and methods shown in the claims, specification, and drawings is not specifically specified as "before" or "prior to." As long as the output of a previous process is not used in a later process, it can be implemented in any order. Even if terms such as "firstly" or "next" are used for convenience in describing the flow of actions in the claims, specification, and drawings, it does not mean that the actions must be performed in that order.

Claims

1. A substrate holding device, characterized in that, have: A retaining plate that holds the substrate on a retaining surface; Multiple actuators connected to the retaining plate cause the retaining plate to deform at least in the normal direction of the retaining surface; A base plate that supports the plurality of actuators; The main body of the workbench supports the base plate; as well as A mechanism disposed between the worktable body and the base plate and deformable according to the reaction force of the plurality of actuators generated on the base plate.

2. The substrate holding device according to claim 1, characterized in that, The mechanism has: A fixed support portion, which provides fixed support for the base plate and the main body of the worktable; and A damper is disposed between the base plate and the main body of the worktable.

3. The substrate holding device according to claim 2, characterized in that, The fixed support portion is positioned in the area overlapping the center of the base plate. Multiple dampers are arranged in the area overlapping the edge of the base plate.

4. The substrate holding device according to claim 1, characterized in that, The mechanism has a hinge that inhibits deformation of the worktable body relative to the base plate.

5. The substrate holding device according to claim 4, characterized in that, The hinge deforms according to at least one of the tilting and radial movement of the base plate.

6. The substrate holding device according to claim 1, characterized in that, It also includes a leaf spring that connects the base plate to the retaining plate.

7. The substrate holding device according to claim 1, characterized in that, Each of the plurality of actuators has a linkage mechanism that is movable relative to the retaining plate in the planar direction and transmits displacement of the actuator in the normal direction.

8. The substrate holding device according to any one of claims 1 to 7, characterized in that, It also has an identifier configured on the main body of the workbench and for detecting the position of the main body of the workbench.

9. A substrate bonding device, characterized in that, have: The substrate holding device according to claim 1; and The substrate holding section that holds other substrates. At least one of the substrate holding device and the substrate holding portion moves toward the other, thereby bringing the substrate into contact with the other substrate.

10. The substrate bonding apparatus according to claim 9, characterized in that, The substrate holding device is movable in the surface direction of the substrate.

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