Substrate holding device and substrate bonding device

Abstract

A substrate holding device and a substrate bonding device are provided. In a first aspect, a substrate holding device is provided. The substrate holding device can include a holding plate having a holding surface that holds a substrate. The substrate holding device can include a plurality of actuators coupled to the holding plate to deform the holding plate in at least a normal direction of the holding surface. The substrate holding device can include a base plate that supports the plurality of actuators. In the substrate holding device, the holding surface can have a predetermined concave-convex shape in a state in which the plurality of actuators are not actuated.

Description

[0001] This application claims priority to Japanese Patent Application No. 2025-062497, filed on April 4, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to a substrate holding device and a substrate bonding device. Background Technology

[0003] Japanese Patent Application Publication No. 2013-8804 describes a method for positioning a pair of substrates 121 in a positioning section 170, where alignment marks 128 on opposing substrates 121 are observed using microscopes 231 and 251, and the relative positions of the substrates 121 are measured. Furthermore, a micro-stage 230 is moved to eliminate any deviation in the measured relative positions, thereby enabling the substrates 121 to be aligned (paragraph 0055). Summary of the Invention

[0004] In a first embodiment, a substrate holding device is provided. The substrate holding device may include a holding plate having a holding surface for holding a substrate. The substrate holding device may include a plurality of actuators connected to the holding plate, causing the holding plate to deform at least in the normal direction of the holding surface. The substrate holding device may include a base plate supporting the plurality of actuators. In the substrate holding device, the holding surface may have a predetermined uneven shape when the plurality of actuators are not activated.

[0005] In the aforementioned substrate holding device, the predetermined concave-convex shape may be a shape in which the center is more convex than the periphery.

[0006] In the above-described substrate holding device, when the plurality of actuators are not activated, the side of the holding plate opposite to the holding surface can be flat.

[0007] In the above-described substrate holding device, the holding surface can be made flat by the operation of the above-described plurality of actuators.

[0008] In the above-described substrate holding device, the plurality of actuators can be arranged in a concentric circle relative to the holding plate.

[0009] The substrate holding device described above may also include a leaf spring that connects the base plate and the holding plate.

[0010] In the aforementioned substrate holding device, the holding plate may have multiple through holes. The substrate holding device may also include a connecting member that is inserted into each of the multiple through holes and connects with a corresponding actuator among the multiple actuators.

[0011] In the aforementioned substrate holding device, the connecting member may have a linkage mechanism that is movable relative to the holding plate in the surface direction and transmits the displacement of the actuator in the normal direction.

[0012] In the above-described substrate holding device, the holding plate may have a through hole. The substrate holding device may also have an upper pusher that enters and exits the through hole for temporarily holding the substrate.

[0013] In a second embodiment, a substrate bonding apparatus is provided. This substrate bonding apparatus may include a substrate holding portion for holding other substrates. The substrate bonding apparatus moves at least one of the substrate holding portion and the substrate holding portion to approach the other substrate, thereby bonding the substrate to the other substrate.

[0014] In the above-described substrate bonding apparatus, the substrate holding device is movable along the surface direction of the substrate.

[0015] The above summary of the invention does not list all the features of the invention. Sub-combinations of these feature groups can also constitute inventions.

[0016] The above and other objects, features, and effects of the present invention become clear from the following description of embodiments with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the laminate manufacturing system 100.

[0018] Figure 2 A schematic longitudinal sectional view showing the substrate bonding apparatus 170.

[0019] Figure 3 A schematic cross-sectional view showing the substrate bonding apparatus 170.

[0020] Figure 4 This illustrates an example of a laminate manufacturing system 100 bonding a substrate 121.

[0021] Figure 5 A conceptual perspective view showing a pair of substrates 121 facing each other for bonding.

[0022] Figure 6 This is a schematic plan view of the holding section 220 and the micro-motion stage 230.

[0023] Figure 7 This is a schematic AA cross-sectional view of the holding section 220 and the micro-motion stage 230.

[0024] Figure 8 A schematic BB cross-sectional view showing the retaining part 220.

[0025] Figure 9 A schematic CC cross-sectional view showing the retaining part 220.

[0026] Figure 10 express Figure 9 A schematic enlarged view of the part indicated by the dashed line.

[0027] Figure 11 A schematic CC cross-sectional view showing the retaining part 220.

[0028] Figure 12 A schematic CC cross-sectional view showing the retaining part 220. Detailed Implementation

[0029] The following embodiments do not limit the scope of patent protection. The combinations of features described in the embodiments are not necessarily all necessary for the solution of the invention.

[0030] Figure 1 This is a structural diagram illustrating the laminate manufacturing system 100 of this embodiment. The laminate manufacturing system 100 includes a housing 106, a substrate housing 120, a first transport robot 132, a substrate buffer 161, a substrate position adjustment unit 163, a second transport robot 134, an activation device 165, a cleaning device 167, a substrate bonding device 170, and a control device 110. The laminate manufacturing system 100 manufactures a laminate 123 formed by stacking multiple substrates 121. The substrate 121 is, for example, a circular silicon substrate with circuit patterns, alignment marks, electrodes, etc. The laminate manufacturing system 100 can also stack unprocessed substrates, compound semiconductor substrates, printed circuit boards, glass substrates, etc. Substrates with circuit patterns, etc., can be stacked with unprocessed substrates, or substrates with circuit patterns and unprocessed substrates of the same type can be stacked together. The stacked substrate 121 can also be a substrate formed by stacking multiple substrates. Furthermore, the stacked substrate 121 is not limited to a circular substrate, but can also be a square substrate.

[0031] The substrate housing 120 is a housing capable of accommodating the substrate 121, which contains the substrate 121 on which circuit patterns are formed. A first transport robot 132 removes the substrate 121 from the substrate housing 120 and transports the substrate 121 to a substrate buffer 161 or a substrate position adjustment unit 163. The substrate buffer 161 temporarily stores the substrate 121. The substrate position adjustment unit 163 pre-aligns the substrate 121 before transporting it to various devices such as an activation device 165, a cleaning device 167, and a substrate bonding device 170. A second transport robot 134 transports the substrate 121 between the substrate buffer 161, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0032] The activation device 165 activates the surface of the substrate 121. Specifically, activation is achieved by plasma treatment of the surface of the substrate 121. The cleaning device 167 cleans the substrate 121 after activation by the activation device 165. The cleaned substrate 121 is then conveyed to the substrate bonding device 170. The substrate bonding device 170 stacks (bonds) two substrates 121.

[0033] The control device 110 has arithmetic processing circuits such as a CPU, and memory such as ROM and RAM, and executes a predetermined program to realize its functions. The control device 110 is, for example, a computer, which uniformly controls all parts of the laminate manufacturing system 100. The control device 110 controls the driving of the first transport robot 132, the second transport robot 134, the substrate position adjustment unit 163, the activation device 165, the cleaning device 167, and the substrate bonding device 170.

[0034] The laminate manufacturing system 100 includes a substrate bonding device 170 disposed within a housing 106. The laminate manufacturing system 100 manufactures a laminate 123 by bonding multiple substrates 121 together.

[0035] The laminate 123 manufactured in the laminate manufacturing system 100 is housed in another substrate housing 120 and removed from the laminate manufacturing system 100. In this way, by using the substrate housing 120, multiple substrates 121 can be loaded together in the laminate manufacturing system 100, and multiple laminates 123 can be removed together from the laminate manufacturing system 100.

[0036] A first transport robot 132, positioned facing the substrate housing 120, removes the substrate 121 to be bonded from the substrate housing 120. Additionally, the first transport robot 132 transports the manufactured laminate 123 into the substrate housing 120. Thus, the first transport robot 132 directly transports either the substrate 121 or the laminate 123.

[0037] The substrate bonding apparatus 170 includes a fixed stage 250 and a movable stage 240 disposed inside the frame 210. The fixed stage 250 is fixed relative to the frame 210. The movable stage 240 includes a micro-motion stage 230 that moves relative to the fixed stage 250. A holding part 220 is provided on the micro-motion stage 230. When the holding part 220 holds the substrate 121, the movable stage 240 moves relative to the fixed stage 250.

[0038] The outer surface of the frame 210 is enclosed by the wall member 212, isolating it from the influence of radiant heat from the surrounding environment on the substrate bonding device 170. The micro-stage 230 is equipped with a reflector 224. An interferometer 222 is disposed inside the wall member 212. The interferometer 222 uses the reflector 224 to measure the position of the micro-stage 230 with high precision. As a result, the substrate 121 held by the holding part 220 can be positioned with high precision relative to the substrate 121 held by the holding part 252 of the fixed stage part 250. In other words, the reflector 224 can also be regarded as an indicator for detecting the position of the micro-stage 230.

[0039] After positioning, the micro-motion stage 230 moves toward the fixed stage 250, and the laminate manufacturing system 100 laminates the substrates 121 together to form a laminate 123. The laminate 123 is then handed over to the second transport robots 134 and 132 and recycled into the substrate housing 120.

[0040] In addition, the control device 110 includes an operation unit that the user can operate externally when the power to the laminate manufacturing system 100 is turned on and various settings and information are input, as well as a display unit that transmits information to the user. Furthermore, the control device 110 may also include a connection unit that connects to other additionally equipped devices.

[0041] Figure 2 This is a schematic longitudinal sectional view of the substrate bonding apparatus 170. The mounting stage 250 is suspended downwards from the top surface of the frame 210 via multiple load sensors 254. The mounting stage 250 includes a holding portion 252. The holding portion 252 can be a vacuum suction cup. The holding portion 252 holds the substrate 121 vertically downwards. The load sensors 254 detect the vertically downward force acting on the mounting stage 250.

[0042] A vertically downward microscope 251 is disposed on the top surface of the frame 210, next to the stage 250. The microscope 251 observes the surface of the substrate 121 held by the holding part 220. The microscope 251 is fixed to the frame 210, so the relative position of the microscope 251 and the stage 250 does not change.

[0043] The movable stage 240 includes a movable platform 242, a coarse motion stage 244, a gravity counteracting unit 246, a spherical base 248, and a fine motion stage 230. The movable platform 242, which houses the coarse motion stage 244, the gravity counteracting unit 246, and the fine motion stage 230, moves along a guide rail 241 fixed to the inner bottom surface of the frame 210. Through the movement of the movable platform 242, the movable stage 240 moves between a position directly below the fixed stage 250 and a position offset from directly below the fixed stage 250.

[0044] The coarse stage 244 moves relative to the moving platform 242 in a horizontal direction that includes the X and Y direction components shown by the arrows in the figure. When it moves relative to the moving platform 242, the fine stage 230 also moves along with the coarse stage 244.

[0045] The gravity cancellation unit 246 extends and retracts while detecting the minute displacement of the micro stage 230, thereby reducing the apparent weight of the micro stage 230. This reduces the load on the actuator that moves the micro stage 230, thus improving position control accuracy.

[0046] A holding section 220 is disposed on a micro-motion stage 230. The holding section 220 holds the substrate 121 for bonding. During the positioning operation of the substrate 121, the micro-motion stage 230 moves along with the movement platform 242 and the coarse motion stage 244 provided on the movement platform 242. In the next stage, the micro-motion stage 230 is displaced relative to the coarse motion stage 244. The displacement of the micro-motion stage 230 relative to the coarse motion stage 244 includes translation and rotation relative to all X, Y, and Z axes. The displacement of the micro-motion stage 230 is small enough that even if the micro-motion stage 230 is displaced, it will not come into contact with the upper pusher 623 described later. In other words, with the above structure, the movement stage 240 can move at least in the surface direction of the substrate 121. The positioning control unit 112 controls the displacement of the movement platform 242, the coarse motion stage 244, and the micro-motion stage 230.

[0047] Additionally, the microstage 230 includes a microscope 231 fixed to the side. The microscope 231 is fixed relative to the microstage 230, thus maintaining the relative positions of the microstage 230 and the microscope 231. The microscope 231 observes the surface of the substrate 121 held on the fixed stage 250. The substrate bonding apparatus 170 uses the observations from the microscopes 231 and 251 to measure the relative positions of the substrates 121.

[0048] Figure 3 This is a schematic cross-sectional view of the substrate bonding apparatus 170. (Regarding...) Figure 2 Common elements are labeled with the same reference numerals and repeated descriptions are omitted.

[0049] The mobile platform 242 and the retaining part 220 on the mobile platform 242 move along the guide rail 241.

[0050] The moving platform 242 moves along the guide rail 241, so that the substrate 121 held by the holding part 252 is opposite to the substrate 121 held by the holding part 220. After positioning the pair of substrates 121, the micro-motion stage 230 is raised, so that the pair of substrates 121 are brought closer to each other.

[0051] Figure 4 This illustrates an example of a laminate manufacturing system 100 bonding a substrate 121. Figure 4In the example shown, the holding portion 220 and the substrate 121 held by the holding portion 220 are deformed into a shape where the center is more raised than the periphery. The holding portion 252 has a pressing protrusion 641 at its center. The pressing protrusion 641 is displaced in the vertical direction. First, the pressing protrusion 641 is displaced from the center of the holding portion 252 in the vertical direction, pressing down on the center of the substrate 121 held by the holding portion 252. Then, the substrate 121 held by the holding portion 220 approaches the substrate 121 held by the holding portion 252.

[0052] Since the surface of substrate 121 is activated, when the central portions come into contact with each other, adjacent regions spontaneously attract and bond together through the intermolecular forces between the substrates 121. After a portion of substrate 121 comes into contact with each other, the holding portion 252 releases the substrate 121 from its holding position. The bonded areas of substrate 121 extend sequentially from the contacting portions to the adjacent regions. As a result, a bonding wave (sometimes called a bonding wave) is generated, with the contacting areas expanding sequentially, and the bonding of substrate 121 progresses. The bonding wave travels from the center of substrate 121 towards the ends in the direction of the arrow. Soon, substrate 121 comes into contact with and bonds across the entire surface of each other. Thus, substrate 121 forms a laminate 123.

[0053] Figure 5 This is a conceptual perspective view of a pair of substrates 121 facing each other for bonding. The dashed line connecting the two ends of the two substrates 121 indicates that the two substrates 121 are facing each other for bonding. The substrates 121 have a circular plate shape with a portion missing due to the notch 124, and have multiple element regions 126 and alignment marks 128 on their surfaces.

[0054] The notch 124 is formed in accordance with the crystal orientation of the substrate 121. Therefore, when processing the substrate 121, the orientation of the substrate 121 is determined by the notch 124.

[0055] Multiple component regions 126 are disposed on the surface of substrate 121. Semiconductor devices formed by processing substrate 121 using photolithography or the like are mounted in each component region 126. In addition, each component region 126 also includes pads, etc., which serve as connection terminals when substrate 121 is bonded to other substrates 121.

[0056] Furthermore, there are blank areas between the multiple component regions 126 where no functional elements such as components or circuits are configured. In these blank areas, cutting grooves 122 are provided for cutting when the substrate 121 is cut according to each component region 126.

[0057] Furthermore, alignment marks 128 are provided on the dicing track 122 as indicators for positioning the substrate 121. The dicing track 122 disappears as a slit during the process of cutting the substrate 121 to form a chip, so by providing the alignment marks 128, the effective area of ​​the substrate 121 is not encroached upon.

[0058] Furthermore, while the component regions 126 and alignment marks 128 are depicted as large in the figures, the number of component regions 126 formed on a substrate 121 with a diameter of 300 mm sometimes reaches several hundred or more. In addition, wiring patterns formed on the component regions 126 are sometimes used as alignment marks 128.

[0059] When positioning a pair of substrates 121 to be bonded in the substrate bonding apparatus 170, the alignment marks 128 of the opposing substrates 121 are observed through microscopes 231 and 251, and the substrate bonding apparatus 170 measures the relative positions of the substrates 121. Furthermore, in order to eliminate any deviation in the measured relative positions, the micro-stage 230 is moved, thereby adjusting the respective positions of the substrates 121 by the substrate bonding apparatus 170.

[0060] Figures 6 to 9 The retaining part 220 and the micro-motion stage 230 are shown. Figures 6 to 12 For simplicity, the illustration of substrate 121 is omitted.

[0061] Figure 6 This is a schematic plan view of the holding section 220 and the micro-motion stage 230. Figure 6 The circle 647 shown by the dashed line represents the outer diameter of the substrate 121 when the substrate 121 is held. Figure 7 It is the maintenance unit 220 and the micro-motion stage 230. Figure 6 The schematic AA cross-sectional view shown by line AA. Figure 8 It is the 220th part of the maintenance department. Figure 6 The schematic cross-sectional view of BB is shown in the figure. Figure 9 It is the 220th part of the maintenance department. Figure 6 The schematic CC cross-sectional view shown is shown.

[0062] Figures 6 to 9 The holding part 220 indicates that the actuator 615 is not activated. Additionally, in Figure 7 Reflector 224 was omitted thereafter. Additionally, in... Figure 8 The micro-motion stage 230 was omitted from the list.

[0063] The micro-motion stage 230 includes a reflector 224 and a support 601. The holding part 220 includes a base plate 603, a leaf spring 605, a holding plate 607, an actuator 615, a valve 629, a negative pressure source 633, a holding control part 631, and a deformation control part 637. The holding plate 607 has an attraction part 609, a support protrusion 611, a holding surface 613, a surface 635 opposite to the holding surface, a through hole 619, and a through hole 625. Furthermore, in Figure 6 In the figure, only one of the circles corresponding to the support protrusion 611 and the through hole 625 is shown as a reference numeral, but multiple such circles are provided on the retaining plate 607. Circles of the same shape as those indicating the reference numerals similarly represent the support protrusion 611 and the through hole 625. The retaining plate 607 is made of, for example, alumina. The actuator 615 has a linkage mechanism 617 and a shaft 627. The gravity counteracting part 246 supports the actuation mechanism 621 and includes a temporary holding control part 639. The actuation mechanism 621 has an upper pusher 623.

[0064] like Figure 6 and Figure 7 As shown, the micro-stage 230 has multiple support portions 601 directly below the end of the base plate 603. The support portions 601 support the base plate 603. The base plate 603 supports multiple actuators 615. The base plate 603 is made of, for example, aluminum. The retaining portion 220 has leaf springs 605 around its perimeter. Each leaf spring 605 is threadedly fixed to the base plate 603 and the retaining plate 607, connecting the base plate 603 and the retaining plate 607.

[0065] like Figure 6 As shown, the retaining plate 607 has multiple (in) inside the circle shown by the dashed line. Figure 8 In this example, there are two through holes 619. A gravity-counteracting part 246 supports the push mechanism 621 below each through hole 619. The upper pusher 623 passes through them in a manner that does not contact the micro-motion stage 230 or the base plate 603. This suppresses the transmission of heat and vibration from the upper pusher 623 to the micro-motion stage 230. A temporary holding control part 639 controls each push mechanism 621, which causes the upper pusher 623 to move vertically in and out of the through holes 619. The push mechanism 621 is, for example, a ball screw.

[0066] With the substrate 121 not held by the holding surface 613, the pushing mechanism 621 pushes out the upper pusher 623, causing the upper end of the upper pusher 623 to be higher than the holding surface 613. The substrate 121 is then placed onto the upper pusher 623 by the second transport robot 134, and the upper pusher 623 temporarily holds the substrate 121. When the pushing mechanism 621 causes the upper pusher 623, which temporarily holds the substrate 121, to retract vertically downward from the holding surface 613, the holding surface 613 takes over the role of supporting the substrate 121 from the upper pusher 623. The upper pusher 623 is also used in cases where the substrate 121 held by the holding surface 613 is retracted through a process substantially the opposite of the above.

[0067] The holding plate 607 has an attraction portion 609 and multiple support protrusions 611 inside the circle shown by the dashed line. A virtual surface defined by the front ends of the multiple support protrusions 611 forms a holding surface 613. The support protrusions 611 support the substrate 121. The attraction portion 609 is connected to the negative pressure source 633 via a valve 629. The holding control unit 631 controls the opening and closing of the valve 629. When the holding control unit 631 releases the valve 629, the attraction portion 609 communicates with the negative pressure source 633. The support protrusions 611 support the substrate 121, and the holding control unit 631 releases the valve 629, thereby depressurizing the space between the holding plate 607 and the substrate 121, causing the holding plate 607 to attract and hold the substrate 121. In addition, the holding plate 607 and the holding control unit 631 constitute a vacuum chuck for holding the substrate 121.

[0068] The 607 retainer is still there. Figure 6 The circle shown by the dashed line has a through hole 625 inside. (As shown...) Figure 9 As shown, the holding portion 220 has actuators 615 below each through hole 625. The through holes 625 and the actuators 615 are arranged in a concentric circle relative to the holding plate 607.

[0069] The through hole 619 is not positioned in the center of the retaining plate 607. When the substrate 121 is joined by a bonding wave, the bonding offset of the substrate 121 is suppressed because the through hole 619 is not positioned in the center of the retaining plate 607, i.e., not at the ideal starting point of the bonding wave.

[0070] Figure 10 yes Figure 9 A schematic enlarged view of the portion shown by the dashed line. Actuator 615 is engaged with shaft 627, which extends vertically upward. The end of shaft 627 not engaged with actuator 615 is threadedly fastened to linkage mechanism 617. The unthreaded end of linkage mechanism 617, fixed to shaft 627, contacts the lower surface of retaining plate 607. Actuator 615 displaces retaining plate 607 vertically upward via shaft 627 and linkage mechanism 617.

[0071] The through hole 625 has a countersunk hole in which a bolt 643 is disposed. The bolt 643 disposed in the countersunk hole is embedded in the linkage mechanism 617, and the bolt 643 threadedly fastens the retaining plate 607 to the linkage mechanism 617. The actuator 615 is connected to the retaining plate 607 via the shaft 627 and the linkage mechanism 617. Thus, the actuator 615 causes the retaining plate 607 to be displaced vertically downward.

[0072] Alternatively, it can be said that the shaft 627, the linkage mechanism 617, and the bolt 643 together constitute the connecting component 645. In this case, the connecting component 645 is inserted into a plurality of through holes 625 and engages with the corresponding actuator 615 among a plurality of actuators 615.

[0073] The deformation control unit 637 individually controls each actuator 615. The deformation control unit 637 controls the actuator 615, with the shaft 627 positioned in the normal direction of the holding surface 613 (i.e., Figures 7 to 10 The actuator 615 causes the retaining plate 607 to deform in the normal direction of the retaining surface 613 by displacing it vertically (in the vertical direction). The retaining surface 613 has a predetermined uneven shape when the actuator 615 is not activated. Figure 9 In the example shown, the predetermined concave-convex shape is one where the center is more convex than the periphery.

[0074] The surface 635 opposite to the retaining surface 613 in the retaining plate 607 is flat when the actuator 615 is not activated. As a result, it is easy to thread the linkage mechanism 617 into the corresponding through hole 625, and the assembly of the retaining part 220 becomes easy.

[0075] Figure 11 and Figure 12 Indicates in relation to Figure 9 In the same CC cross section, the holding part 220 holds the actuator 615 in the state of operation. For the same... Figures 7 to 10 Common elements are labeled with the same reference numerals and repeated descriptions are omitted.

[0076] Figure 11 This indicates that the retaining surface 613 is deformed to a ratio Figure 9 An example of large curvature. In this case, actuator 615 causes retaining plate 607 to deform vertically upwards to become more convex.

[0077] In this case, the deformation control unit 637 controls the actuator 615 so that the actuator 615 closer to the center moves more vertically upward. Alternatively, the actuator 615 closer to the center can move more vertically upward, or, in addition, the actuator 615 farther from the center can move more vertically downward.

[0078] The retaining plate 607 deforms not only in the vertical direction but also in its planar direction. The leaf spring 605 holds the retaining plate 607 in such a way that its central position does not shift even when deformed in its planar direction. Since the bending stiffness of the leaf spring 605 is sufficiently greater than that of the linkage 617, the central position of the retaining plate 607 can be maintained by the bending of the linkage 617 even when deformed in its planar direction. In other words, the linkage 617 can move relative to the retaining plate 607 in the planar direction.

[0079] Figure 12 This illustrates an example where the actuator 615 deforms the holding surface 613 to a flat surface. The deformation control unit 637 controls the actuator 615 such that the closer the actuator 615 is to the center, the more significantly it is displaced vertically downwards. In other words, the holding surface 613 becomes flattened through the action of multiple actuators 615. Alternatively, the actuator 615 closer to the center may be displaced vertically downwards, or, in addition, the actuator 615 further from the center may be displaced vertically upwards.

[0080] When the actuator 615 deforms the retaining plate 607, undesirable deformation sometimes occurs. For example, when the retaining plate 607 has through holes 619 and 625, stress concentrates in the portion near the through holes 619 or 625, making these portions more prone to deformation compared to other portions of the retaining plate 607. Therefore, the greater the deformation of the retaining plate 607, the more unevenly the portion near the through holes 619 or 625 deforms relative to the retaining plate 607 as a whole.

[0081] In this embodiment, the retaining surface 613 has a predetermined uneven shape when the actuator 615 is not activated. Therefore, even if the actuator 615 is activated and deforms the retaining surface, the amount of deformation of the retaining plate 607 from the state where the actuator 615 is not activated is small. As a result, uneven deformation of the retaining plate 607 is suppressed, and the accuracy of the bonding of the substrate 121 is improved.

[0082] Furthermore, the predetermined concave-convex shape can be formed by the central value of the concave-convex shape when the retaining surface 613 is deformed in a desired amount. For example, when the retaining surface 613 is most convex... Figure 11 The most concave state is Figure 12 In this state, the predetermined concave-convex shape is preferably taken as their center value. Figure 9 The state of the concave and convex shape. In addition, the predetermined concave and convex shape can also be a shape other than one in which the center is more convex than the periphery. For example, it can be asymmetrical with respect to an axis in the vertical direction passing through the center of the retaining surface 613, or with respect to an axis in the in-plane direction of the retaining plate 607.

[0083] The base plate 603 can be made of a metallic material other than aluminum. The base plate 603 can also be made of a ceramic material. The base plate 603 can be made of alumina, SiC (silicon carbide), or low thermal expansion ceramic. The retaining plate 607 can be made of a ceramic material other than alumina. The retaining plate 607 can be made of SiC (silicon carbide) or low thermal expansion ceramic.

[0084] A shape that is more convex in the center than at the periphery can be defined as any shape that is macroscopically more raised near the center than at the periphery. For example, it also includes shapes where a portion of the periphery is raised. Furthermore, it can contain microscopically minute bumps and depressions.

[0085] The flatness of the surface 635 on the opposite side of the maintaining surface 613 means that the vertical amplitude of the surface is small enough relative to the size of the surface 635 on the opposite side of the maintaining surface 613. For example, there may be microscopically minute bumps and depressions.

[0086] The actuator 615 can deform the holding plate 607 before the holding plate 607 holds the substrate 121. Alternatively or on this basis, the actuator 615 can deform the holding plate 607 after the holding plate 607 holds the substrate 121.

[0087] Furthermore, multiple actuators 615 can be controlled individually. Thus, within the movable range of the actuators 615, the concave and convex shape of the holding surface 613 can be deformed into any shape.

[0088] The embodiments described above are for illustrative purposes only; however, the scope of the present invention is not limited to those described herein. It will be apparent to those skilled in the art that various modifications or alterations can be made to the embodiments described above. As can be seen from the patent protection scope, such modifications or alterations are also included within the scope of the present invention.

[0089] Regarding the execution order of actions, sequences, steps, and stages in the apparatus, system, program, and method shown in the patent scope, specification, and drawings, they can be implemented in any order unless explicitly stated as "before" or "prior to," or the output of a previous process is not used in a subsequent process. Even if the flow of actions in the patent scope, specification, and drawings is described using terms such as "firstly" or "next" for convenience, it does not mean that they must be implemented in that order.

Claims

1. A substrate holding device, characterized in that, have: A retaining plate having a retaining surface for holding the substrate; Multiple actuators connected to the retaining plate cause the retaining plate to deform at least in the normal direction of the retaining surface; as well as The base plate supports the plurality of actuators. When the plurality of actuators are not activated, the retaining surface has a predetermined concave-convex shape.

2. The substrate holding device according to claim 1, characterized in that, The predetermined concave-convex shape is one in which the center is more convex than the periphery.

3. The substrate holding device according to claim 1, characterized in that, The side of the retaining plate opposite to the retaining surface is flat when the plurality of actuators are not activated.

4. The substrate holding device according to claim 3, characterized in that, The retaining surface becomes flat by the action of the plurality of actuators.

5. The substrate holding device according to claim 1, characterized in that, The plurality of actuators are arranged concentrically relative to the retaining plate.

6. The substrate holding device according to claim 1, characterized in that, The substrate holding device further includes a leaf spring that connects the base plate to the holding plate.

7. The substrate holding device according to claim 1, characterized in that, The retaining plate has multiple through holes. The substrate holding device further includes a coupling component that is inserted into each of the plurality of through holes and coupled to a corresponding actuator among the plurality of actuators.

8. The substrate holding device according to claim 7, characterized in that, The connecting component has a linkage mechanism that is movable relative to the retaining plate in the planar direction and transmits the displacement of the actuator in the normal direction.

9. The substrate holding device according to claim 1, characterized in that, The retaining plate has a through hole. The substrate holding device also includes an upper pusher that enters and exits the through hole to temporarily hold the substrate.

10. A substrate bonding apparatus, characterized in that, have: The substrate holding device according to any one of claims 1 to 9; and A substrate holding section that holds other substrates. At least one of the substrate holding device and the substrate holding portion moves to approach the other, thereby bringing the substrate into contact with the other substrate.

11. The substrate bonding apparatus according to claim 10, characterized in that, The substrate holding device is movable along the surface direction of the substrate.

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