Wafer loading and unloading device and semiconductor etching apparatus

Abstract

The application provides a wafer loading and unloading device and a semiconductor etching equipment. The device comprises a pin module and a compression ring module. The pin module comprises a pin assembly and a pin cylinder for driving the pin assembly to move up and down. The compression ring module comprises a compression ring assembly and a compression ring cylinder for driving the compression ring assembly to move up and down. In the horizontal direction, the compression ring bellows compression ring cylinder and the compression ring bellows pin cylinder are arranged in a staggered manner, and the compression ring bellows compression ring cylinder is arranged away from the central axis of the electrostatic chuck. The compression ring bellows can obtain a larger vertical installation space to increase its original length, and the compression ring bellows compression ring cylinder can reduce the compression and rebound force of the bellows, thereby avoiding the risk of wafer damage caused by the sudden drop of the pin or the impact of the compression ring.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and particularly relates to a wafer loading and unloading device and a semiconductor etching device. Background Technology

[0002] In semiconductor manufacturing processes, wafer transfer and loading / unloading are typically performed in a vacuum environment. After a robotic arm transfers the wafer from the vacuum transfer platform to the process chamber, it needs to be moved to the upper surface of an electrostatic chuck (ESC) using a lifting pin. The lifting pin typically has a 3-pin or 4-pin structure and is positioned directly below the wafer. A retaining ring (WECR) is positioned above the wafer. After the wafer falls onto the ESC, the retaining ring descends and presses firmly against the wafer surface to improve wafer etching uniformity and protect the ESC and the chamber from contamination and damage.

[0003] For 6-inch and 8-inch etching equipment, the molecular pump is typically designed at the rear of the cavity, while the ejector pin and clamping ring mechanism are mounted on the outside of the cavity, directly below the electrostatic chuck. While this layout facilitates adjustment of the ejector pin's level and improves transfer accuracy, the misalignment of the molecular pump with the process cavity leads to an uneven flow field within the cavity, negatively impacting process uniformity.

[0004] To address this, the 12-inch etching stage moved the molecular pump directly beneath the electrostatic chuck to ensure uniform flow within the cavity. However, this necessitated a repositioning of the ejector pin and retaining ring. Currently, the common practice is to store the ejector pin and retaining ring in a drawer, which can be pulled out from the rear of the cavity for maintenance.

[0005] like Figure 1 As shown, in this type of layout, the lifting and lowering movements of the ejector pin and the pressure ring within the cavity are both sealed by the compression deformation of the bellows. In the traditional layout, the projections of the ejector pin bellows and the pressure ring bellows on the horizontal plane overlap. Specifically, when the two cylinders are arranged coaxially or stacked vertically, the axial installation length of each bellows (bellows blades) is forced to shorten. After the bellows are shortened axially, the compression of their bellows during the lifting and lowering movements increases, and the rebound force generated by the compression increases sharply. This rebound force has an adverse effect on the lifting and lowering movements: when the ejector pin descends, the rebound force may cause the ejector pin to suddenly drop, causing the wafer to fall onto the surface of the electrostatic chuck 3 due to loss of support, resulting in damage to both the wafer and the electrostatic chuck 3; when the pressure ring descends, the rebound force may cause the pressure ring to fall onto the wafer with a large impact force, causing wafer damage. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer loading / unloading device and a semiconductor etching apparatus. By horizontally offsetting the pressure ring cylinder and the ejector cylinder, the pressure ring bellows gains more vertical mounting space, increasing its original length and reducing the compression and rebound force of the bellows, thus avoiding the risk of sudden ejector pin descent or pressure ring damaging the wafer. The technical solution adopted is as follows: A wafer loading and unloading device, comprising: The ejector module includes an ejector assembly and an ejector cylinder 2 for driving the ejector assembly to rise and fall; and a pressure ring module, including a pressure ring assembly and a pressure ring cylinder 1 for driving the pressure ring assembly to rise and fall; In the horizontal direction, the ring-pressing cylinder 1 and the ejector cylinder 2 are staggered, and the ring-pressing cylinder 1 is set off from the central axis of the electrostatic chuck 3.

[0007] Preferably, the pressure ring assembly includes: The cylinder 1 is a ring-pressing cylinder, the cylinder body of which is fixed to the base 9. Its piston rod extends upward and is connected to the adjusting plate 8. The adjusting plate 8 is connected to the upper end of the ring-pressing bellows 7, and the lower end of the ring-pressing bellows 7 is connected to the ring-pressing base plate 6. The pressure ring bellows 7 is sleeved inside the pressure ring bellows bushing 10, and the pressure ring bellows bushing 10 is connected to the base 9; the base 9 is located above the pressure ring base plate 6; the pressure ring bellows bushing 10 is located on one side of the pressure ring cylinder 1. The pressure ring support column 5 has its lower end connected to the pressure ring base plate 6 and its upper end connected to the pressure ring 4, and is located outside the base 9.

[0008] Preferably, the pressure ring bellows 7 includes a rod 71 and a pressure ring bellows 72 sleeved on the rod 71. The upper end of the rod 71 is threadedly connected to a pressure ring adjusting post 11, and the lower end of the rod 71 is connected to a pressure ring base plate 6. The pressure ring adjusting post 11 is threadedly connected to an adjusting plate 8.

[0009] Preferably, a sealing structure is provided between the rod 71 and the pressure ring corrugated bushing 10, and the sealing structure is a double O-ring seal 15.

[0010] Preferably, the ejector pin assembly includes: Ejector pin 12, which mates with the ejector pin hole on the electrostatic chuck 3; And the ejector bellows unit, which connects the ejector pin 12 and the ejector base plate 13; The ejector base plate 13 is connected to the piston rod of the ejector cylinder 2, and the cylinder body of the ejector cylinder 2 is connected to the adapter plate 14; the base 9, bottom support ring 21, bottom insulating ring 22, adapter plate 14, and electrostatic chuck 3 are connected in sequence from bottom to top. Along the horizontal direction, the ejector cylinder 2 is located on one side of the ejector bellows unit.

[0011] Preferably, the ejector pin bellows unit includes: The ejector bellows 16, ejector support column 17, floating connector 18, and ejector adjustment column 19 are connected sequentially from top to bottom; Among them, the ejector pin corrugated tube 16 is fitted inside the ejector pin corrugated bushing 20; The upper section of the ejector pin support column 17 is sleeved inside the ejector pin corrugated tube 16 and connected to the ejector pin 12, while the lower section is in contact with the inner wall of the ejector pin corrugated bushing 20. The ejector pin adjusting column 19 is threadedly connected to the ejector pin base plate 13.

[0012] Preferably, the electrostatic chuck 3 is provided with an edge ring around its periphery; the lower surface of the pressure ring 4 is provided with an annular groove, and the upper surface of the edge ring is provided with an annular step. The annular groove is movably fitted on the outside of the annular step to guide the pressure ring 4 to move vertically up and down.

[0013] A semiconductor etching apparatus includes the aforementioned wafer loading and unloading device, and further includes a molecular pump disposed below the wafer loading and unloading device.

[0014] Compared with the prior art, the advantages of the present invention are: 1. By staggering the pressure ring cylinder 1 and the ejector cylinder 2 in the horizontal direction and making the pressure ring cylinder 1 deviate from the central axis of the electrostatic chuck 3, a larger vertical arrangement space is provided for the pressure ring bellows 7 in a limited space, thereby increasing the effective length of the pressure ring bellows 72, reducing the compression and rebound force of the pressure ring bellows 72, and avoiding sudden drop of the ejector or damage to the wafer by the pressure ring.

[0015] 2. The piston rod of cylinder 1 is fixed to the adjusting plate 8. The piston rod drives the pressure ring base plate 6 to rise and fall through the rod 71 of the pressure ring bellows 7, and drives the pressure ring 4 to rise and fall through the pressure ring support column 5. The structure is compact and the transmission is reliable.

[0016] 3. The pressure ring bellows 7 and the pressure ring bellows bushing 10 are sealed with double O-rings to ensure reliable sealing during the expansion and contraction of the bellows and prevent residual process gas in the cavity from entering and corroding the bellows.

[0017] 4. A step and groove guide structure is set between the pressure ring 4 and the edge ring to ensure that the pressure ring remains horizontal during the lifting and lowering process and to prevent the pressure ring from tilting due to the offset arrangement.

[0018] 5. The lower end of the ejector pin support column 17 is connected to the ejector pin adjustment column 19 through the floating joint 18, which effectively compensates for tilting caused by installation error or processing error and avoids the ejector pin 12 from rubbing against the electrostatic chuck 3. Attached Figure Description

[0019] Figure 1 This is a diagram showing the state of the drawer during maintenance in the existing technology; Figure 2 This is a top view of the wafer loading and unloading equipment; Figure 3 for Figure 2 A three-dimensional image; Figure 4 A cross-sectional view of the wafer loading and unloading device, the bottom support ring, and the bottom insulating ring as a whole; Figure 5 This is a cross-sectional view of the ejector pin module; Figure 6 This is a cross-sectional view of the pressure ring module; Figure 7 for Figure 6 Color renderings; Figure 8 This is a diagram showing the fit between the insulating ring and the pressure ring; Figure 9 for Figure 8 Color renderings; Figure 10 This is a schematic diagram showing the connection between the pressure ring support ring and the pressure ring; Figure 11 A diagram showing the relative positions of the electrostatic chuck, the upper insulating ring, and the edge ring; Figure 12 A diagram showing the relative positions of the base, the pressure ring base plate, and the pressure ring support column; Figure 13 for Figure 12 Another perspective rendering; Figure 14 A perspective view including the pressure ring bellows and the fixing ring; Figure 15 This is a three-dimensional view of the pressure ring; Figure 16 This is a 3D view of the bottom support ring.

[0020] Among them, 1-pressure ring cylinder, 2-ejector cylinder, 3-electrostatic chuck. 4-Pressure ring, 5-Pressure ring support column, 6-Pressure ring base plate 7-Pressure ring corrugated pipe, 71-Bar, 72-Pressure ring corrugated sheet; 8-Adjusting plate, 9-Base, 10-Pressure ring corrugated bushing, 11-Pressure ring adjusting column, 12-Ejector pin, 13-Ejector pin base plate, 14-Adapter plate, 15-Double O-ring seal; 16-Ejector bellows, 17-Ejector support post, 18-Floating connector, 19-Ejector adjusting post, 20-Ejector bellows bushing, 21-Bottom support ring, 22-Bottom insulating ring, 23-Fixing ring. Detailed Implementation

[0021] The wafer loading / unloading apparatus and semiconductor etching equipment of the present invention will now be described in more detail with reference to the schematic diagrams, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0022] like Figures 2-16 In this embodiment, the adapter plate 14 is fixed along the height direction (vertical direction), while the adjusting plate 8 moves up and down with the lifting and lowering of the pressure ring cylinder 1.

[0023] The central axis of the electrostatic chuck 3: the center line extending along the height direction.

[0024] A wafer loading and unloading device includes: a pin module, a pressure ring module, and an electrostatic chuck 3.

[0025] The ejector module includes an ejector assembly and an ejector cylinder 2 for driving the ejector assembly to rise and fall; A pressure ring module, including a pressure ring assembly and a pressure ring cylinder 1 for driving the pressure ring assembly to rise and fall; like Figures 2-3 As shown, in the horizontal direction, the ring-pressing cylinder 1 and the ejector cylinder 2 are staggered, and the ring-pressing cylinder 1 is set off from the central axis of the electrostatic chuck 3.

[0026] In the horizontal direction, the pressure ring cylinder 1 is located to one side of the ejector cylinder 2, another component. This staggered arrangement ensures that the pressure ring cylinder 1 and the ejector cylinder 2 do not interfere with each other in the limited space below the electrostatic chuck 3, providing more vertical arrangement space for their respective bellows.

[0027] form Figure 4 The cutting line is not along the center of the pressure ring bellows 7, therefore Figure 4 The visual effect of the middle rod 71 and Figure 6 The visual effect of the middle rod 71 is different.

[0028] like Figure 6 , Figure 7 As shown, the pressure ring assembly includes: an adjusting plate 8, a pressure ring base plate 6, a pressure ring support column 5, a pressure ring bellows 7, a pressure ring bellows bushing 10, and a base 9.

[0029] The ring-pressing cylinder 1 is fixed on the base 9, and its piston rod extends upward. The adjusting plate 8 is connected to the piston rod of the ring-pressing cylinder 1.

[0030] The pressure ring support column 5 has its lower end threadedly connected to the pressure ring base plate 6, and its upper end is detachably connected to the pressure ring 4; the pressure ring support column 5 is located outside the bottom support ring 21.

[0031] like Figure 10 As shown, the upper end of the pressure ring support column 5 is threaded with a connector, which is embedded in the pressure ring 4.

[0032] The pressure ring 4 is a ring structure, positioned above the electrostatic chuck 3 and arranged around the outer periphery of the electrostatic chuck 3. The pressure ring 4 is used to descend after the wafer falls onto the electrostatic chuck 3 to improve the uniformity of wafer etching, while protecting the electrostatic chuck 3 and the cavity.

[0033] When the piston rod of the pressure ring cylinder 1 retracts downward, it drives the rod 71 to move downward. The rod 71 drives the pressure ring base plate 6 to move downward. The pressure ring base plate 6 drives the pressure ring 4 to move downward through the pressure ring support column 5, so that the pressure ring 4 falls on the outer edge surface of the wafer.

[0034] The pressure ring bellows 7 is sleeved inside the pressure ring bellows bushing 10 and is fixedly connected to the pressure ring bellows bushing 10 by a fixing ring 23 (by screws or bolts). Its upper end is connected to the adjusting plate 8, and its lower end is connected to the pressure ring base plate 6 by screws or bolts. The pressure ring bellows bushing 10 is located on one side of the pressure ring cylinder 1 and is fixedly mounted on the base 9 by fasteners. The pressure ring bellows 7 includes a rod 71 and a pressure ring bellows 72 sleeved on the rod 71. The upper end of the rod 71 is threadedly connected to a pressure ring adjusting column 11.

[0035] Specifically, the lower end of the pressure ring corrugated sheet 72 is welded and fixed to the rod 71, and the upper end of the pressure ring corrugated sheet 72 is welded and fixed to the fixing ring 23. The fixing ring 23 and the pressure ring bushing 10 are connected by fasteners.

[0036] When the pressure ring base plate 6 moves downward, the pressure ring corrugated sheet 72 is stretched, generating a contraction and rebound force. This rebound force is directed upward, partially offsetting the downward thrust of the piston rod and buffering the downward pressing action of the pressure ring 4, preventing the pressure ring 4 from damaging the wafer.

[0037] The base 9 is located above the pressure ring base plate 6. The upper end of the pressure ring support column 5 extends upward to connect to the pressure ring 4, and the lower end of the pressure ring support column 5 connects to the pressure ring base plate 6.

[0038] like Figure 6 , Figure 12 As shown, the upper end of the rod 71 of the pressure ring bellows 7 is threaded with a pressure ring adjusting column 11, which is threaded to the adjusting plate 8. By rotating the pressure ring adjusting column 11, the relative position between the upper end of the pressure ring bellows 7 and the adjusting plate 8 can be finely adjusted, thereby adjusting the descent stroke of the pressure ring 4 and preventing the pressure ring 4 from damaging the wafer after descending.

[0039] like Figures 6-7As shown, a sealing structure is provided between the rod 71 of the pressure ring bellows 7 and the pressure ring bellows bushing 10. The sealing structure is a double O-ring seal 15. The two O-ring seals are vertically spaced between the outer wall of the pressure ring bellows 7 and the inner wall of the pressure ring bellows bushing 10, forming a side sealing structure. When the pressure ring bellows 7 is raised or lowered, the double O-ring seal 15 ensures reliable sliding sealing between the pressure ring bellows 7 and the pressure ring bellows bushing 10, avoiding the cavity ( Figure 1 The residual process gas inside (as shown) enters and corrodes the corrugated sheet.

[0040] like Figures 8-9 As shown, the electrostatic chuck 3 has an edge ring (not separately labeled in the figure) around its periphery. The lower surface of the pressure ring 4 has an annular groove, and the upper surface of the edge ring has an annular step. The annular groove is movably fitted onto the outside of the annular step. When the pressure ring 4 rises and falls, the annular groove slides along the annular step, forming a sliding guide pair, guiding the pressure ring 4 to rise and fall vertically in the vertical direction, preventing the pressure ring 4 from tilting due to the offset arrangement of the pressure ring cylinder 1.

[0041] As is known from the prior art, the edge ring is sleeved on the outer edge of the electrostatic chuck 3 and is arranged coaxially with the electrostatic chuck 3.

[0042] In this embodiment, the number of ejector pin assemblies is 3. That is, three ejector pins 12 are evenly distributed in the circumferential direction of the electrostatic chuck 3 and correspond to the ejector pin holes on the electrostatic chuck 3.

[0043] like Figure 3 , Figure 4 As shown, the ejector assembly includes: ejector 12 and ejector bellows unit.

[0044] The ejector pin 12 engages with the ejector pin hole on the electrostatic chuck 3; the ejector pin 12 engages with the ejector pin hole on the electrostatic chuck 3 and can extend or retract relative to the electrostatic chuck 3.

[0045] And the ejector bellows unit, which connects the ejector pin 12 and the ejector base plate 13; The ejector base plate 13 is located inside the base 9 and is threadedly connected to the piston rod of the ejector cylinder 2. The ejector cylinder 2 is connected to the adapter plate 14. The base 9, bottom support ring 21, bottom insulating ring 22, adapter plate 14, and electrostatic chuck 3 are connected sequentially from bottom to top. The base 9, bottom support ring 21, and bottom insulating ring 22 form a closed space, which is atmospheric. Horizontally, the ejector cylinder 2 is located on one side of the ejector bellows unit.

[0046] Bottom support ring 21 is used to hold Figure 4 The air pipes and water pipes used by the internal components are connected to the external auxiliary equipment of the cavity.

[0047] Specifically: The electrostatic chuck 3 is fixed to the adapter plate 14 by screws, and the adapter plate 14 is fastened to the bottom insulating ring 22 by screws or bolts.

[0048] When the piston rod of the ejector cylinder 2 retracts upward, it pushes the ejector base plate 13 to move upward. The ejector base plate 13 pushes the ejector pin 12 upward through the ejector bellows unit, so that the ejector pin 12 extends from the surface of the electrostatic chuck 3 and lifts the wafer.

[0049] like Figure 5 As shown, the ejector bellows unit includes: ejector bellows 16, ejector bellows bushing 20, ejector support column 17, floating joint 18, and ejector adjustment column 19.

[0050] The ejector bellows 16, ejector support column 17, floating joint 18, and ejector adjustment column 19 are connected sequentially from top to bottom. Specifically, the ejector bellows 16 is connected to the ejector support column 17 by fasteners, and the ejector support column 17, floating joint 18, and ejector adjustment column 19 are all threaded together.

[0051] The ejector bellows 16 is sleeved inside the ejector bellows bushing 20, and there is a radial gap between the inner wall of the ejector bellows bushing 20 and the outer wall of the ejector bellows 16; the ejector bellows 16 is located inside the ejector bellows bushing 20, and the upper end of the ejector bellows 16 and the ejector bellows bushing 20 are both fixed to the adapter plate 14. The ejector bellows bushing 20 is used to constrain the vertical expansion and contraction of the ejector bellows 16, preventing the ejector pin 12 from deflecting. Specifically, the radial clearance between the ejector bellows 16 and the ejector bellows bushing 20 is less than the allowable radial deformation of the ejector bellows 16, thus constraining the vertical expansion and contraction of the ejector bellows 16 and preventing radial sway. In this embodiment, the ejector pin bellows 16 has the same structure as the pressure ring bellows 7. The bellows of the ejector pin bellows 16 are connected to the adapter plate 14 via a fixing ring. The bellows of the ejector pin bellows 16 are connected to the fixing ring and the rod of the ejector pin bellows 16.

[0052] The ejector pin support column 17 has its upper section fitted inside the ejector pin corrugated tube 16 and connected to the ejector pin 12, and its lower section in contact with the inner wall of the ejector pin corrugated bushing 20; the ejector pin 12 is used to lift or lower the wafer from the surface of the electrostatic chuck 3 so that the robot can pick up and place the wafer.

[0053] Regarding the connection method between ejector pin 12 and ejector pin support column 17: ejector pin support column 17 is threadedly connected to ejector pin connection part, and ejector pin 12 is embedded in ejector pin connection part.

[0054] The ejector pin adjusting post 19 is threadedly connected to the ejector pin base plate 13. By rotating the ejector pin adjusting post 19, the height of the ejector pin 12 protruding from the surface of the electrostatic chuck 3 can be finely adjusted to ensure that the height of the three ejector pins 12 is consistent.

[0055] The floating connector 18 is used to compensate for the angular deviation of the ejector pin 12 during installation or processing. When the ejector pin support column 17 is slightly tilted due to installation or processing errors, the floating connector 18 (prior art) allows the lower end of the ejector pin support column 17 to have a certain angle relative to the upper end of the ejector pin adjustment column 19, thereby preventing the ejector pin 12 from rubbing against the electrostatic chuck 3 and protecting the electrostatic chuck 3 and the ejector pin 12 from damage.

[0056] A semiconductor etching apparatus includes a cavity, an electrostatic chuck 3 disposed within the cavity, and a molecular pump (not shown in the figure) disposed directly below the electrostatic chuck 3. The molecular pump is located outside the cavity.

[0057] A molecular pump is used to maintain a vacuum environment within the cavity and ensure the uniformity of the flow field during the etching process. Since the molecular pump occupies the central space directly below the electrostatic chuck 3, the pressure ring cylinder 1 and the ejector cylinder 2 in the wafer loading and unloading device are arranged in a staggered manner as described above, which enables reliable lifting and lowering of the pressure ring 4 and the ejector 12 within a limited space.

[0058] Specifically: such as Figure 1 As shown, because the 12-inch etching equipment places the molecular pump directly below the electrostatic chuck 3, the molecular pump occupies the central space directly below the electrostatic chuck 3. This forces the ejector cylinder and the pressure ring cylinder, which could originally be installed directly below the electrostatic chuck, to be centrally arranged in the drawer below the side of the electrostatic chuck. In the conventional layout, the installation length of the pressure ring bellows 7 is determined by the available space in the drawer. The two bellows completely or partially overlap in the horizontal plane, limiting the vertical installation height they can occupy, and the bellows are installed under axial compression.

[0059] In this embodiment, the compression ring cylinder 1 and the ejector cylinder 2 are staggered in the horizontal direction, that is, their projections on the horizontal plane do not overlap.

[0060] Specifically: On the pressure ring side, the cylinder body of the pressure ring cylinder 1 is fixed to the base 9, and the piston rod of the pressure ring cylinder 1 is connected to the adjusting plate 8. Because the pressure ring cylinder 1 is offset horizontally from the central axis of the electrostatic chuck 3, the pressure ring bellows 7 gains greater installation space vertically, and its installation length (original length) relative to... Figure 1 The forced shortening state in the traditional layout is significantly increased, thereby reducing the compression of the bellows during the lifting process and the resulting rebound force. That is, under this misaligned layout, the pressure ring bellows 7 can obtain a first length L1 (original length) in the vertical direction, which is greater than the second length L2 (original length) that the pressure ring bellows can have under the traditional coaxial or overlapping layout.

[0061] In this embodiment, the model of the pressure ring bellows 7 is the same as... Figure 1The same as in [the previous sentence]. The initial position of the pressure ring 4 is the same as [the previous sentence]. Figure 1 The same as in [the previous sentence]. The height difference between the pressure ring and the electrostatic chuck 3 is [the same as in the previous sentence]. Figure 1 The same as in.

[0062] In this embodiment and Figure 1 In the middle, when the pressure ring 4 is in the initial position, the pressure ring corrugated sheet 72 is in its original length state.

[0063] Because the corrugated ring 7 achieves a longer installation length through its staggered layout, the stretching of its corrugated ring sheet 72 is significantly reduced compared to the traditional layout. During the descent of the pressure ring 4, the upward rebound force generated by the stretching of the corrugated ring sheet 72 of the pressure ring 7 is also reduced. This reduced rebound force makes the downward pressing action of the pressure ring 4 more stable and controllable, avoiding the pressure ring 4 from contacting the wafer surface at a high impact velocity due to excessive rebound force, thereby reducing the risk of damaging the wafer. Simultaneously, during the ascent, the reduced rebound force also prevents the pressure ring 4 from suddenly bouncing up due to excessive auxiliary force, reducing the risk of particulate matter falling off.

[0064] Similarly, the ejector pin bellows 16 also gains a larger vertical arrangement space due to the staggered arrangement of the pressure ring cylinder 1 and the ejector pin cylinder 2. Its vertical length (installation length) is increased, and the tensile rebound force is reduced accordingly, avoiding the risk of damaging the wafer due to the sudden drop in rebound force during the lifting and lowering of the ejector pin 12.

[0065] Working principle: After the wafer is transferred from the vacuum transfer platform to the process chamber by the robot, it is positioned above the electrostatic chuck 3.

[0066] At this time, the ejector cylinder 2 drives the ejector pin 12 to extend from the surface of the electrostatic chuck 3 and hold the wafer.

[0067] After the robotic arm retracts, the ejector cylinder 2 drives the ejector pin 12 to retract, and the wafer falls onto the surface of the electrostatic chuck 3.

[0068] Subsequently, the piston rod of the compression ring cylinder 1 retracts downward and extends, pushing the compression ring base plate 6 downward. The compression ring base plate 6 drives the compression ring 4 to move downward from the initial position through the compression ring support column 5.

[0069] During the downward movement of the pressure ring 4, the pressure ring bellows 7 is stretched and generates a contraction and rebound force, which buffers the downward pressing action of the pressure ring 4.

[0070] After the etching process is completed, the piston rod of the ring cylinder 1 extends upward, the ring 4 rises away from the wafer surface, and the ejector cylinder 2 drives the ejector pin 12 to extend, lifting the wafer for the robot to take away.

[0071] Throughout the entire operation: the double O-ring 15 between the pressure ring bellows 7 and the pressure ring bellows bushing 10 ensures reliable sealing; the step and groove guide structure between the pressure ring 4 and the edge ring ensures that the pressure ring 4 rises and falls smoothly and horizontally; the floating joint 18 compensates for the installation error of the ejector pin 12 and ensures that the ejector pin 12 does not rub against the electrostatic chuck 3.

[0072] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.

Claims

1. A wafer loading and unloading device, characterized in that, include: The ejector module includes an ejector assembly and an ejector cylinder (2) for driving the ejector assembly to rise and fall. And a pressure ring module, including a pressure ring assembly and a pressure ring cylinder (1) for driving the pressure ring assembly to rise and fall. In the horizontal direction, the ring-pressing cylinder (1) and the ejector cylinder (2) are staggered, and the ring-pressing cylinder (1) is set off from the central axis of the electrostatic chuck (3).

2. The wafer loading and unloading device according to claim 1, characterized in that, The pressure ring assembly includes: The cylinder (1) is a pressure ring cylinder, whose cylinder body is fixed to the base (9), whose piston rod extends upward and is connected to the adjusting plate (8), the adjusting plate (8) is connected to the upper end of the pressure ring bellows (7), and the lower end of the pressure ring bellows (7) is connected to the pressure ring bottom plate (6). The pressure ring corrugated pipe (7) is sleeved inside the pressure ring corrugated bushing (10), and the pressure ring corrugated bushing (10) is connected to the base (9); the base (9) is located above the pressure ring bottom plate (6); the pressure ring corrugated bushing (10) is located on one side of the pressure ring cylinder (1); The pressure ring support column (5) is connected at its lower end to the pressure ring base plate (6) and at its upper end to the pressure ring (4), and is located outside the base (9).

3. The wafer loading and unloading device according to claim 2, characterized in that, The pressure ring corrugated pipe (7) includes a rod (71) and a pressure ring corrugated sheet (72) sleeved on the rod (71). The upper end of the rod (71) is threadedly connected to a pressure ring adjusting column (11), and the lower end of the rod (71) is connected to a pressure ring base plate (6). The pressure ring adjusting column (11) is threadedly connected to an adjusting plate (8).

4. The wafer loading and unloading device according to claim 3, characterized in that, A sealing structure is provided between the rod (71) and the pressure ring corrugated bushing (10), and the sealing structure is a double O-ring seal (15).

5. The wafer loading and unloading device according to claim 2, characterized in that, The ejector pin assembly includes: The ejector pin (12) engages with the ejector pin hole on the electrostatic chuck (3); and ejector bellows unit, which connects ejector pin (12) and ejector base plate (13); The ejector base plate (13) is connected to the piston rod of the ejector cylinder (2), and the cylinder body of the ejector cylinder (2) is connected to the adapter plate (14); the base (9), bottom support ring (21), bottom insulating ring (22), adapter plate (14), and electrostatic chuck (3) are connected in sequence from bottom to top. Along the horizontal direction, the ejector cylinder (2) is located on one side of the ejector bellows unit.

6. The wafer loading and unloading device according to claim 5, characterized in that, The ejector pin bellows unit includes: The ejector bellows (16), ejector support column (17), floating joint (18), and ejector adjustment column (19) are connected in sequence from top to bottom; Among them, the ejector pin corrugated tube (16) is sleeved inside the ejector pin corrugated bushing (20); The upper section of the ejector pin support column (17) is sleeved inside the ejector pin corrugated tube (16) and connected to the ejector pin (12), while the lower section is in contact with the inner wall of the ejector pin corrugated bushing (20). The adjusting pin (19) is threadedly connected to the pin base plate (13).

7. The wafer loading and unloading device according to claim 2, characterized in that, The electrostatic chuck (3) is provided with an edge ring on its periphery; the lower surface of the pressure ring (4) is provided with an annular groove, and the upper surface of the edge ring is provided with an annular step. The annular groove is movably fitted on the outside of the annular step to guide the pressure ring (4) to rise and fall vertically.

8. A semiconductor etching apparatus, comprising the wafer loading and unloading device according to any one of claims 1 to 7, characterized in that, It also includes a molecular pump located below the wafer loading and unloading device.

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