MOS tube heat dissipation assembly and heat dissipation method thereof

Abstract

The application discloses a MOS tube heat dissipation assembly and a heat dissipation method thereof, and relates to the technical field of electronic device heat dissipation. The MOS tube heat dissipation assembly comprises an electrode plate and a plurality of MOS tube bodies, the MOS tube bodies are installed on the electrode plate, the electrode plate is provided with a mounting base frame on the side close to the MOS tube bodies, a trigger frame is fixedly installed on one side of the top end of the mounting base frame, a heat receiving and triggering assembly is arranged between the mounting base frame and the trigger frame, a positive heat dissipation assembly is arranged on the top end of the trigger frame, a self-adaptive fitting assembly is arranged at the bottom of the mounting base frame, the heat receiving and triggering assembly comprises a reaction cylinder which is fixedly installed on the middle part of the top end of the mounting base frame through a hoop, and a sealing piston is slidably arranged on the inner wall of the reaction cylinder. The MOS tube working heat is transmitted to the thermal expansion and contraction medium through the heat receiving and triggering assembly, the medium thermal expansion and contraction is utilized to drive the related components to act, the conductive contact and the conductive sheet are switched on and off, the positive heat dissipation start and stop are automatically controlled, and the MOS tube temperature rise self-adaptive triggering positive heat dissipation is realized.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, specifically to a heat dissipation assembly for a MOS transistor and its heat dissipation method. Background Technology

[0002] In power electronic devices such as motor drives and power conversion, multiple MOSFETs of the same specification are usually installed in rows on the electrode plate to meet the high current operating requirements. These MOSFETs generate significant heat under continuous high power conditions, and if heat dissipation is not timely, they are prone to overheating and damage. Traditional MOSFET heat dissipation methods mostly adopt passive heat dissipation or continuous direct fan blowing: passive heat dissipation is insufficient under high load and cannot suppress temperature rise; long-term fan operation results in high energy consumption and noise, while heat dissipation devices with electronic temperature control rely on sensors and control circuits, which are complex in structure and expensive, and are difficult to adaptively start and stop active heat dissipation based on the actual temperature rise of the MOSFET. Different circuit boards use different MOSFET specifications, and existing heat dissipation devices have poor universality and cannot be quickly adapted and installed for multiple rows of MOSFETs of the same specification on the same circuit board, further limiting the heat dissipation effect and application scenarios. In order to solve the above problems, the inventors propose a MOSFET heat dissipation component and its heat dissipation method. Summary of the Invention

[0003] To address the issues of automatic temperature-triggered active heat dissipation of MOSFETs and adaptive bonding of multi-row MOSFETs of the same specification, the present invention aims to provide a MOSFET heat dissipation component and its heat dissipation method.

[0004] To solve the above technical problems, the present invention adopts the following technical solution: a MOS transistor heat dissipation assembly, including an electrode plate and a plurality of MOS transistor bodies, wherein the MOS transistor bodies are mounted on the electrode plate, a mounting base frame is provided on the side of the electrode plate near the MOS transistor bodies, a trigger frame is fixedly mounted on the top side of the mounting base frame, a heat-triggered assembly is provided between the mounting base frame and the trigger frame, an active heat dissipation assembly is provided at the top of the trigger frame, and an adaptive bonding assembly is provided at the bottom of the mounting base frame. The heat-triggered assembly includes a reaction cylinder, which is fixedly mounted to the top center of the mounting base frame by a clamp. A sealing piston is slidably mounted on the inner wall of the reaction cylinder. A piston rod is fixedly mounted on the middle of one end of the sealing piston near the trigger frame, and the piston rod slides through the reaction cylinder. Fixing pins are fixedly mounted on both sides of the piston rod end. A fixing shaft is fixedly mounted on the side of the trigger frame near the fixing pins. A swing trigger rod is rotatably sleeved on the middle of the fixing shaft. The swing trigger rod has a groove that cooperates with the fixing pins, and the fixing pins slide in the groove. Inside the reaction cylinder, on the side away from the piston rod, two pairs of... The reaction cylinder has C-shaped heat-conducting plates distributed in a specific pattern. Conductive plates are fixedly installed on the outer wall of the C-shaped heat-conducting plates, and the other end of the conductive plates is fixedly connected to the upper surface of the heat-conducting plate. The side of the reaction cylinder near the C-shaped heat-conducting plates is filled with a thermally expanding and contracting medium, which is used to push the sealed piston to move when heated. A conductive contact is fixedly connected to the top of the swing trigger rod. A connecting plate is fixedly installed on the inner wall of the trigger frame. A conductive plate that works with the conductive contact is fixedly installed on the connecting plate. A limiting rod that works with the swing trigger rod is fixedly installed on the inner wall of the trigger frame. Six vents are distributed in a ring array at the end of the reaction cylinder away from the C-shaped heat-conducting plates. Preferably, the adaptive bonding component includes a heat-conducting plate, two symmetrically distributed guide rods are fixedly installed at the top of the heat-conducting plate, and the guide rods are vertically slidably connected to the mounting base frame. A reset spring is sleeved on the outer wall of the guide rod, and the two ends of the reset spring are respectively connected to the inner wall of the mounting base frame and the top of the heat-conducting plate. A limit plate is fixedly installed at the top of the guide rod, and several equidistantly distributed heat dissipation fins are fixedly installed at the upper end of the heat-conducting plate. The lower end surface of the heat-conducting plate is coated with thermal conductive gel.

[0005] Preferably, the active heat dissipation component includes a wind chamber and a drive motor. The wind chamber is fixedly installed on the top of the mounting base frame, and the drive motor is fixedly installed on the trigger frame near the wind chamber. An impeller is fixedly installed on the drive end of the drive motor and rotates in the wind chamber. An air guide pipe is connected to the exhaust end of the wind chamber, and a heat dissipation frame is connected to the other end of the air guide pipe. The other end of the heat dissipation frame is fixedly connected to the mounting base frame through a support plate.

[0006] Preferably, the conductive contact and the conductive sheet cooperate to form a cooling fan control switch, and the conductive contact and the conductive sheet are electrically connected to the drive motor and the external power supply module respectively, for controlling the power on and power off of the drive motor.

[0007] A heat dissipation method for a MOSFET heat dissipation assembly includes the following steps: S1. First, fix the mounting base frame in place. Under the action of the reset spring, the heat conduction plate is tightly attached to the MOSFET body through the thermal conductive gel. Initially, it relies on the heat dissipation fins for passive heat dissipation. S2. The heat generated by the operation of the MOS transistor is transferred to the thermal expansion medium in the reaction cylinder through the heat conduction plate and conductive plate, thus completing the heat conduction. S3. The thermal expansion medium inside the reaction cylinder expands due to heat, pushing the sealed piston to move, causing the conductive contacts to close, connecting the drive motor circuit, and driving the impeller to rotate to generate airflow. S4. The generated airflow is delivered to the heat sink frame through the air cavity and air duct, and blown onto the heat sink fins to achieve forced air cooling. After the temperature drops, the thermal expansion medium contracts, all components reset, the drive motor stops working, and the passive cooling state is restored.

[0008] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention sets up a heat-triggered component to transfer the working heat of the MOSFET to the thermal expansion and contraction medium. The thermal expansion and contraction of the medium drives the relevant components to move, so as to open and close the conductive contacts and the conductive sheet, thereby automatically controlling the start and stop of active heat dissipation and realizing adaptive triggering of active heat dissipation for MOSFET temperature rise. 2. This invention, by setting an adaptive bonding component, utilizes the elastic effect of the reset spring to make the heat-conducting plate and thermally conductive gel adaptively and tightly bond with the body of multiple rows of MOS transistors of the same specification, effectively eliminating contact gaps, reducing contact thermal resistance, ensuring uniform heat dissipation, and avoiding local overheating. 3. This invention sets up an active heat dissipation component that works in synergy with the heat-triggered component. When the temperature control circuit is connected, the drive motor is powered on and drives the impeller to rotate at high speed, generating a directional airflow that evenly blows on the heat dissipation fins, achieving efficient forced air cooling and significantly improving the overall heat dissipation efficiency of multi-row MOSFETs under high-power conditions. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the overall front structure of the present invention; Figure 2 This is a schematic diagram of the overall disassembled structure of the present invention; Figure 3 This is a schematic diagram of the overall side profile of the present invention; Figure 4 This is a schematic diagram of the structure of the heat-triggered component in this invention; Figure 5 This is a schematic diagram of the structure of the heat-triggered component in this invention; Figure 6 This is a schematic diagram of the active heat dissipation component in this invention; Figure 7 for Figure 3Enlarged structural diagram at point A; Figure 8 for Figure 4 Enlarged schematic diagram of the structure at point B.

[0011] In the diagram: 1. Electrode plate; 2. MOS transistor body; 3. Mounting base frame; 4. Trigger frame; 5. Heated trigger assembly; 501. Reaction cylinder; 502. Sealed piston; 503. Piston rod; 504. C-shaped heat-conducting sheet; 505. Conductive sheet; 506. Fixing pin; 507. Fixing shaft; 508. Swing trigger rod; 509. Conductive contact; 510. Connecting plate; 511. Conductive sheet; 512. Limiting rod; 513. Air hole; 6. Active heat dissipation assembly; 601. Air cavity; 602. Drive motor; 603. Impeller; 604. Heat dissipation frame; 605. Air duct; 7. Adaptive bonding assembly; 701. Heat-conducting plate; 702. Guide rod; 703. Reset spring; 704. Limiting plate; 705. Heat dissipation fins. Detailed Implementation

[0012] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0013] Example: Figure 1-8 As shown, the present invention provides a technical solution: a MOSFET heat dissipation assembly, including an electrode plate 1 and a plurality of MOSFET bodies 2, the MOSFET bodies 2 are mounted on the electrode plate 1, a mounting base frame 3 is provided on the side of the electrode plate 1 near the MOSFET bodies 2, a trigger frame 4 is fixedly mounted on the top side of the mounting base frame 3, a heat-triggered component 5 is provided between the mounting base frame 3 and the trigger frame 4, an active heat dissipation component 6 is provided at the top of the trigger frame 4, and an adaptive bonding component 7 is provided at the bottom of the mounting base frame 3; The heat-triggered assembly 5 includes a reaction cylinder 501, which is fixedly installed at the top center of the mounting base frame 3 by a clamp. A sealing piston 502 is slidably provided on the inner wall of the reaction cylinder 501. A piston rod 503 is fixedly installed at the center of one end of the sealing piston 502 near the trigger frame 4, and the piston rod 503 slides through the reaction cylinder 501. Fixing pins 506 are fixedly installed on both sides of the end of the piston rod 503. A fixing shaft 507 is fixedly installed on the side of the trigger frame 4 near the fixing pin 506. A swing trigger rod 508 is rotatably sleeved in the middle of the fixing shaft 507. A sliding groove is opened on the swing trigger rod 508 to cooperate with the fixing pin 506, and the fixing pin 506 slides in the sliding groove. By adopting the above technical solution, the linear movement of the piston rod 503 is converted into the rotation of the swing trigger rod 508 by utilizing the sliding fit between the fixed pin 506 and the slide groove.

[0014] The adaptive bonding component 7 includes a heat-conducting plate 701. Two symmetrically distributed guide rods 702 are fixedly installed at the top of the heat-conducting plate 701, and the guide rods 702 are vertically slidably connected to the mounting base frame 3. A reset spring 703 is sleeved on the outer wall of the guide rod 702, and the two ends of the reset spring 703 are respectively connected to the inner wall of the mounting base frame 3 and the top of the heat-conducting plate 701. A limit plate 704 is fixedly installed at the top of the guide rod 702.

[0015] By adopting the above technical solution, the elastic force of the reset spring 703 is used to push the heat conduction plate 701 to always be in close contact with the MOS tube body 2, and the limiting plate 704 can prevent the guide rod 702 from falling out of the mounting base frame 3, so as to realize the self-adaptive contact of the heat conduction plate 701.

[0016] The active heat dissipation component 6 includes a wind chamber 601 and a drive motor 602. The wind chamber 601 is fixedly installed on the top of the mounting base 3, and the drive motor 602 is fixedly installed on the trigger frame 4 near the wind chamber 601. An impeller 603 is fixedly installed on the drive end of the drive motor 602, and the impeller 603 rotates in the wind chamber 601. The exhaust end of the wind chamber 601 is connected to an air guide pipe 605, and the other end of the air guide pipe 605 is connected to a heat dissipation frame 604. The other end of the heat dissipation frame 604 is fixedly connected to the mounting base 3 through a support plate.

[0017] By adopting the above technical solution, the air cavity 601 can collect and guide the airflow generated by the impeller 603, and the air guide pipe 605 can stably deliver the airflow to the heat dissipation frame 604. The heat dissipation frame 604 can make the airflow blow evenly onto the heat dissipation fins 705, thereby expanding the heat dissipation area and improving the heat dissipation efficiency.

[0018] Inside the reaction cylinder 501, on the side away from the piston rod 503, two symmetrically distributed C-shaped heat-conducting plates 504 are embedded and installed. A conductive plate 505 is fixedly installed on the outer wall of the C-shaped heat-conducting plate 504, and the other end of the conductive plate 505 is fixedly connected to the upper surface of the heat-conducting plate 701.

[0019] By adopting the above technical solution and utilizing the structural advantages of the C-shaped heat-conducting sheet 504, the contact area with the thermally expanding and contracting medium inside the reaction cylinder 501 is increased. The heat-conducting sheet 505 quickly transfers the heat on the heat-conducting plate 701 to the C-shaped heat-conducting sheet 504, and then conducts it into the medium, thereby achieving efficient heat conduction.

[0020] The side of the reaction cylinder 501 near the C-shaped heat-conducting plate 504 is filled with a thermal expansion and contraction medium. The thermal expansion and contraction medium is a phase change material or expansion medium with significant thermal expansion and contraction characteristics. Preferably, it is one of paraffin, composite phase change material, thermally conductive expansion gel or inert gas, which is used to push the sealed piston 502 to move when heated and expanded.

[0021] By adopting the above technical solution, the heat is converted into mechanical thrust by utilizing the physical properties of thermal expansion and contraction media, and the automatic movement of the sealing piston 502 can be achieved without additional power drive.

[0022] The reaction cylinder 501 has six annularly arranged vents 513 at the end away from the C-shaped heat-conducting plate 504.

[0023] By adopting the above technical solution, the vent 513 can achieve pressure balance between the inside of the reaction cylinder 501 and the outside, ensuring the stability of the movement of the sealed piston 502.

[0024] A conductive contact 509 is fixedly connected to the top of the swing trigger rod 508, and a connecting plate 510 is fixedly installed on the inner wall of the trigger frame 4. A conductive sheet 511 that works in conjunction with the conductive contact 509 is fixedly installed on the connecting plate 510.

[0025] By adopting the above technical solution, when the swing trigger rod 508 rotates, it drives the conductive contact 509 to move synchronously. Through the contact and separation of the conductive contact 509 and the conductive sheet 511, the circuit on / off control is realized.

[0026] The conductive contact 509 and the conductive sheet 511 work together to form a cooling fan control switch. The conductive contact 509 and the conductive sheet 511 are electrically connected to the drive motor 602 and the external power supply module, respectively, to control the power on and power off of the drive motor 602.

[0027] By adopting the above technical solution, the conductive contact 509 is connected to one terminal of the drive motor 602 via a wire, and the other terminal of the drive motor 602 is directly connected to the external power supply module; the conductive sheet 511 is connected to the other output terminal of the external power supply module via a wire. When the conductive contact 509 contacts the conductive sheet 511, the external power supply module, the conductive sheet 511, the conductive contact 509 and the drive motor 602 form a complete power supply circuit, and the drive motor 602 is energized and runs; when the two are separated, the circuit is broken, the drive motor 602 stops working, and a purely mechanical automatic on / off control is realized.

[0028] Several equidistant heat dissipation fins 705 are fixedly installed on the upper end of the heat conduction plate 701. The lower end surface of the heat conduction plate 701 is coated with thermal conductive gel. The thermal conductive gel can fill the micro gap between the heat conduction plate 701 and the MOSFET body, remove the air in the gap, and reduce the contact thermal resistance.

[0029] By adopting the above technical solution, the heat dissipation fins 705 can significantly increase the heat dissipation area of ​​the heat conduction plate 701, accelerate the dissipation of heat into the air, and improve the passive heat dissipation efficiency.

[0030] A limit rod 512, which works in conjunction with the swing trigger rod 508, is fixedly installed on the inner wall of the trigger frame 4.

[0031] By adopting the above technical solution, the limiting rod 512 can limit the swing angle of the swing trigger rod 508 to prevent excessive swing.

[0032] A heat dissipation method for a MOSFET heat dissipation assembly includes the following steps: S1. First, fix the mounting base frame 3 in place. Under the action of the reset spring 703, the heat conduction plate 701 is tightly attached to the MOS tube body 2 through the thermal conductive gel, and initially relies on the heat dissipation fins 705 for passive heat dissipation. The heat generated by the operation of S2 and MOS transistor 2 is transferred to the thermal expansion medium in reaction cylinder 501 through heat conduction plate 701 and conductive plate 505, thus completing the heat conduction. S3. The thermal expansion medium in the reaction cylinder 501 expands due to heat, pushing the sealed piston 502 to move, causing the conductive contact 509 to close, connecting the circuit of the drive motor 602, and driving the impeller 603 to rotate to generate airflow. S4. The generated airflow is delivered to the heat dissipation frame 604 through the air cavity 601 and the air guide pipe 605, and blows onto the heat dissipation fins 705 to achieve forced air cooling. After the temperature drops, the thermal expansion medium contracts, all components reset, the drive motor 602 stops working, and the passive heat dissipation state is restored.

[0033] Working principle: In actual use, the mounting base frame 3 is first fixed on the electrode plate 1 where the multi-row MOSFET body 2 is located. Before installation, thermal conductive gel is applied to the bottom of the heat-conducting plate 701. Under the elastic force of the reset spring 703, the heat-conducting plate 701 adaptively adheres to all the arranged MOSFET bodies 2 through the bottom thermal conductive gel. When the multi-row MOSFET body 2 continuously operates at high current, the heat is transferred to the heat-conducting plate 701 through the thermal conductive gel. The heat is passively dissipated by the heat dissipation fins 705 at the top of the heat-conducting plate 701, and the basic heat generated by the MOSFET operation is quickly dissipated into the air. During this process, the heat on the heat-conducting plate 701 is efficiently transferred to the thermally expanding and contracting medium in the reaction cylinder 501 through the conductive plate 505 and the C-shaped heat-conducting plate 504, causing the medium temperature to gradually rise. When the medium temperature reaches the set threshold, it expands due to heat, pushing the sealing piston 502 to slide along the inner wall of the reaction cylinder 501, and driving the piston rod 503 to extend outward. The piston rod 503 cooperates with the sliding groove of the swing trigger rod 508 through the end fixing pin 506, converting the linear motion into the rotation of the swing trigger rod 508 around the fixed shaft 507 until the conductive contact 509 contacts and closes with the conductive plate 511, connecting the power supply circuit of the drive motor 602. After the drive motor 602 is powered on, it drives the impeller 603 to rotate at high speed in the air chamber 601. The resulting airflow is transported to the heat dissipation frame 604 through the air guide pipe 605 and blown evenly onto the heat dissipation fins 705 covering multiple rows of MOSFETs. This quickly removes the heat from the fins, achieving forced air cooling of the entire row of MOSFETs and suppressing the MOSFET temperature from rising further. When the load on the MOSFETs decreases and the temperature drops, the thermal expansion and contraction medium in the reaction cylinder 501 cools and contracts. The sealing piston 502, piston rod 503, and swing trigger rod 508 reset in sequence, the conductive contact 509 separates from the conductive plate 511, the drive motor 602 is powered off and stops working, and the device returns to the passive heat dissipation state, completing one complete heat dissipation cycle.

[0034] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A MOSFET heat dissipation assembly, comprising an electrode plate (1) and a plurality of MOSFET bodies (2), characterized in that: The MOS transistor body (2) is mounted on the electrode plate (1). The electrode plate (1) is provided with a mounting base frame (3) on the side close to the MOS transistor body (2). A trigger frame (4) is fixedly mounted on the top side of the mounting base frame (3). A heat-triggered component (5) is provided between the mounting base frame (3) and the trigger frame (4). An active heat dissipation component (6) is provided at the top of the trigger frame (4). An adaptive bonding component (7) is provided at the bottom of the mounting base frame (3). The heat-triggered assembly (5) includes a reaction cylinder (501), which is fixedly installed on the top center of the mounting base frame (3) by a clamp. A sealing piston (502) is slidably provided on the inner wall of the reaction cylinder (501). A piston rod (503) is fixedly installed on the middle of one end of the sealing piston (502) near the trigger frame (4), and the piston rod (503) slides through the reaction cylinder (501). Fixing pins (506) are fixedly installed on both sides of the end of the piston rod (503). A fixing shaft (507) is fixedly installed on the side of the trigger frame (4) near the fixing pin (506). A swing trigger rod (508) is rotatably sleeved in the middle of the fixing shaft (507). A sliding groove is opened on the swing trigger rod (508) to cooperate with the fixing pin (506), and the fixing pin (506) slides in the sliding groove. The adaptive bonding component (7) includes a heat-conducting plate (701), and two symmetrically distributed guide rods (702) are fixedly installed on the top of the heat-conducting plate (701). The guide rods (702) are vertically slidably connected to the mounting base frame (3). A reset spring (703) is sleeved on the outer wall of the guide rod (702), and the two ends of the reset spring (703) are respectively connected to the inner wall of the mounting base frame (3) and the top of the heat-conducting plate (701). A limit plate (704) is fixedly installed on the top of the guide rod (702).

2. The MOSFET heat dissipation assembly as described in claim 1, characterized in that, The active heat dissipation component (6) includes a wind chamber (601) and a drive motor (602). The wind chamber (601) is fixedly installed on the top of the mounting base frame (3). The drive motor (602) is fixedly installed on the side of the trigger frame (4) near the wind chamber (601). An impeller (603) is fixedly installed on the drive end of the drive motor (602), and the impeller (603) rotates in the wind chamber (601). The exhaust end of the wind chamber (601) is connected to a duct pipe (605). The other end of the duct pipe (605) is connected to a heat dissipation frame (604), and the other end of the heat dissipation frame (604) is fixedly connected to the mounting base frame (3) through a support plate.

3. The MOSFET heat dissipation assembly as described in claim 1, characterized in that, Inside the reaction cylinder (501), on the side away from the piston rod (503), two symmetrically distributed C-shaped heat-conducting plates (504) are embedded and installed. A conductive plate (505) is fixedly installed on the outer wall of the C-shaped heat-conducting plate (504), and the other end of the conductive plate (505) is fixedly connected to the upper surface of the heat-conducting plate (701).

4. The MOSFET heat dissipation assembly as described in claim 1, characterized in that, The reaction cylinder (501) is filled with a thermal expansion and contraction medium on the side near the C-shaped heat-conducting plate (504) for thermal expansion to push the sealed piston (502) to move.

5. A MOS transistor heat dissipation assembly as described in claim 1, characterized in that, The reaction cylinder (501) has six annularly arranged air holes (513) at the end away from the C-shaped heat-conducting plate (504).

6. The MOSFET heat dissipation assembly as described in claim 1, characterized in that, The top of the swing trigger rod (508) is fixedly connected to a conductive contact (509), and a connecting plate (510) is fixedly installed on the inner wall of the trigger frame (4). A conductive sheet (511) that works in conjunction with the conductive contact (509) is fixedly installed on the connecting plate (510).

7. A MOS transistor heat dissipation assembly as described in claim 6, characterized in that, The conductive contact (509) and the conductive sheet (511) work together to form a cooling fan control switch. The conductive contact (509) and the conductive sheet (511) are electrically connected to the drive motor (602) and the external power supply module, respectively, to control the power on and power off of the drive motor (602).

8. A MOS transistor heat dissipation assembly as described in claim 1, characterized in that, The upper end of the heat-conducting plate (701) is fixedly equipped with several equidistant heat dissipation fins (705), and the lower end surface of the heat-conducting plate (701) is coated with thermal conductive gel.

9. A MOS transistor heat dissipation assembly as described in claim 1, characterized in that, The inner wall of the trigger frame (4) is fixedly installed with a limiting rod (512) that works in conjunction with the swing trigger rod (508).

10. A heat dissipation method used in a MOS transistor heat dissipation assembly as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. First, fix the mounting base frame (3) in place. Under the action of the reset spring (703), the heat conduction plate (701) is tightly attached to the MOS tube body (2) through the thermal conductive gel. Initially, it relies on the heat dissipation fins (705) for passive heat dissipation. S2, the heat generated by the operation of the MOS transistor body (2) is transferred to the thermal expansion medium in the reaction cylinder (501) through the heat conduction plate (701) and the conductive plate (505) to complete the heat conduction; S3. The thermal expansion medium in the reaction cylinder (501) expands due to heat, pushing the sealed piston (502) to move, causing the conductive contact (509) to close, connecting the circuit of the drive motor (602), and driving the impeller (603) to rotate to generate airflow. S4. The generated airflow is delivered to the heat sink frame (604) through the air cavity (601) and air guide pipe (605), and blows onto the heat sink fins (705) to achieve forced air cooling. After the temperature drops, the thermal expansion medium contracts, each component resets, the drive motor (602) stops working, and the passive heat dissipation state is restored.

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