Heat dissipation adjustable thermoelectric refrigerator structure and heat dissipation method

Abstract

The application discloses a heat dissipation adjustable thermoelectric refrigerator structure and a heat dissipation method, and aims to solve the problem that the surface of a chip is in contact with the cold end of a thermoelectric refrigerator to dissipate heat, and the chip only has one surface in contact with the cold end of the thermoelectric refrigerator, and the heat dissipation effect is poor. The application comprises a thermoelectric refrigerator body, a heat source is attached to the cold surface of the thermoelectric refrigerator body, heat dissipation blocking strips are arranged around the heat source, the heat dissipation blocking strips are in close contact with the side walls of the heat source, and the heat dissipation blocking strips are movably connected to the cold surface of the thermoelectric refrigerator body. The thermoelectric refrigerator of the application can make the end surface and the side wall of the heat source in contact with the cold end of the thermoelectric refrigerator to dissipate heat, increase the heat dissipation area, and improve the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to the field of thermoelectric semiconductor technology, and more specifically, to a heat dissipation adjustable thermoelectric cooler structure and heat dissipation method. Background Technology

[0002] Traditional thermoelectric coolers typically only have one side in contact with the heat source during operation, leading to low heat dissipation efficiency, especially when the heat source is high, significantly increasing the power consumption of the thermoelectric cooler. Furthermore, when the heat source area is small and placed on the designed cold surface of the thermoelectric cooler, the actual cooling effect deviates significantly from the calculated value. Chinese patent application number 2013102177745 discloses a high-density integrated micro / nano optoelectronic chip heat dissipation device based on a thermoelectric cooler. The thermoelectric cooler is mounted on top of the chip, with its cold end contacting the chip surface to dissipate heat. However, since only one side of the chip is in contact with the cold end of the thermoelectric cooler, the heat dissipation effect is poor. Summary of the Invention

[0003] To overcome the above shortcomings, the present invention provides a heat dissipation adjustable thermoelectric cooler structure and heat dissipation method, in which the heat source end face and side wall can contact the cold end of the thermoelectric cooler for heat dissipation, thereby increasing the heat dissipation area and achieving good heat dissipation effect.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a heat dissipation adjustable thermoelectric cooler structure, including a thermoelectric cooler body, a heat source being attached to the cold surface of the thermoelectric cooler body, a heat dissipation baffle being arranged around the heat source, the heat dissipation baffle being abutted against the side wall of the heat source, and the heat dissipation baffle being movably connected to the cold surface of the thermoelectric cooler body.

[0005] In a thermoelectric cooler, the cold surface contacts the heat source. When the cooler is powered on, the cold surface cools, thus dissipating heat from the heat source. The heat source not only has its end face in contact with the cold surface, but its sidewalls also contact the heat dissipation baffles. These baffles are mounted on the cold surface, so the sidewalls of the heat source also experience cooling, increasing the heat dissipation area and improving the heat dissipation effect. The heat dissipation baffles are movably connected to the cold surface of the thermoelectric cooler body, allowing their position to be adjusted according to heat sources of different sizes, making the thermoelectric cooler adaptable to various heat sources and offering good versatility.

[0006] The thermoelectric cooler of this application allows both the heat source end face and the side wall to contact the cold end of the thermoelectric cooler for heat dissipation, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0007] Preferably, a guide groove corresponding to the heat dissipation baffle is provided on the cold surface of the thermoelectric cooler body, and a guide block is provided on the heat dissipation baffle, with the guide block slidably connected to the guide groove.

[0008] When the heat dissipation baffle moves to adjust its position, the guide block on the heat dissipation baffle slides along the guide groove on the cold surface of the thermoelectric cooler body to ensure the smoothness and reliability of the heat dissipation baffle movement.

[0009] Preferably, both the guide groove and the guide block are inverted T-shaped structures.

[0010] The inverted T-shaped guide groove and guide block ensure smooth and reliable sliding, preventing the heat dissipation baffle from longitudinally detaching from the thermoelectric cooler during the sliding process.

[0011] Preferably, the cold surface of the thermoelectric cooler body is provided with several spaced mounting slots, and the heat dissipation baffles are inserted into the mounting slots.

[0012] The heat dissipation baffle is fitted and plugged into the mounting slot to ensure the stability of the heat dissipation baffle connection and reliable contact between the heat dissipation baffle and the cold surface of the thermoelectric cooler. The heat conduction effect is good, thereby ensuring the cooling and heat dissipation effect of the heat dissipation baffle on the heat source side wall.

[0013] Preferably, a recessed groove is provided at the intersection of the bottom surfaces of the mounting groove and the guide groove. The recessed groove is adapted to the guide block, the bottom surface of the heat dissipation baffle is in contact with the bottom surface of the mounting groove, the heat dissipation baffle is higher than the opening end of the mounting groove, and the side of the heat dissipation baffle is in contact with the side of the mounting groove.

[0014] After the heat dissipation strip slides to the corresponding mounting slot position, press the heat dissipation strip downwards so that the lower end face of the heat dissipation strip contacts the bottom surface of the mounting slot. The lower end of the guide block is inserted into the recessed groove. At this time, not only is the heat dissipation strip limited, but the contact area between the heat dissipation strip and the cold surface is also large, ensuring the cooling and heat dissipation effect of the heat dissipation strip on the heat source side wall.

[0015] Preferably, the heat source has a rectangular structure, and heat dissipation baffles are connected to all four sides of the heat source. The heat dissipation baffles have a straight structure.

[0016] The rectangular heat source has heat dissipation baffles on all four sides to ensure the heat dissipation effect of the heat source sidewalls.

[0017] Another option is that the heat source is circular and the heat dissipation baffles are arc-shaped. Several heat dissipation baffles are arranged circumferentially to form a circle and abut against the outer wall of the heat source.

[0018] The circular heat source has good contact with the arc-shaped heat dissipation strips, and several heat dissipation strips are arranged in a circle and close to the outer wall of the heat source, resulting in a large contact area and good heat dissipation effect.

[0019] Preferably, the thermoelectric cooler body is provided with several cooling and heat dissipation zones spaced apart from the center to the periphery, and each cooling and heat dissipation zone is provided with an independently controlled semiconductor cooling unit.

[0020] The semiconductor refrigeration units in several cooling and heat dissipation zones are independently controlled, and the cooling temperature of different cooling and heat dissipation zones can be adjusted individually as needed. The cooling and heat dissipation zone where the heat source is installed has a low cooling temperature, while the cooling and heat dissipation zone around the heat source can have its cooling temperature appropriately increased. By concentrating energy consumption in the semiconductor refrigeration units of the cooling and heat dissipation zone in contact with the heat source, it is beneficial to improve the heat dissipation effect on the heat source.

[0021] A heat dissipation method for a heat-adjustable thermoelectric cooler, comprising the following steps: S1, attaching a heat source to the cold surface of the thermoelectric cooler body; S2, installing a heat dissipation baffle on the cold surface of the thermoelectric cooler body, the heat dissipation baffle abutting against the outer wall of the heat source; S3, the thermoelectric cooler operates to dissipate heat from the heat source.

[0022] The heat source uses a thermoelectric cooler for heat dissipation. The end face of the heat source is in contact with the cold surface of the thermoelectric cooler, while the side wall of the heat source is in contact with a heat dissipation baffle. The heat dissipation baffle is connected to the cold surface of the thermoelectric cooler, and the heat dissipation baffle forms the heat transfer medium between the cold surface and the side wall of the heat source. Since both the end face and side wall of the heat source serve as heat dissipation surfaces, the increased heat dissipation area improves the heat dissipation effect.

[0023] Preferably, in step S3, the heat source is cooled in different areas according to the contact position between the heat source and the cold surface of the thermoelectric cooler. The cold surface of the thermoelectric cooler is divided into several cooling and heat dissipation areas at intervals from the heat source outwards. The cooling and heat dissipation area in contact with the heat source has the lowest cooling temperature, and the cooling and heat dissipation areas increase in temperature from the inside to the outside.

[0024] Different cooling and heat dissipation zones can have their cooling temperatures adjusted individually as needed. The cooling and heat dissipation zone where the heat source is installed has a lower cooling temperature, while the cooling and heat dissipation zone around the heat source can have its cooling temperature appropriately increased. This concentrates energy consumption in the semiconductor refrigeration unit of the cooling and heat dissipation zone that is in contact with the heat source, which is beneficial for improving the heat dissipation effect on the heat source.

[0025] Compared with the prior art, the beneficial effects of the present invention are: (1) The thermoelectric cooler structure of the present application allows the heat source end face and side wall to contact the cold surface of the thermoelectric cooler for heat dissipation, increasing the heat dissipation area of ​​the heat source and improving the heat dissipation effect; (2) The heat dissipation baffle is movably connected to the cold surface of the thermoelectric cooler body, and the position of the heat dissipation baffle can be adjusted according to the heat source of different sizes, so that the thermoelectric cooler can adapt to heat sources of various sizes and has good versatility; (3) The semiconductor cooling units of several cooling and heat dissipation zones are independently controlled, and the cooling temperature of different cooling and heat dissipation zones can be adjusted separately as needed. The cooling temperature of the cooling and heat dissipation zone where the heat source is installed is low, while the cooling temperature of the cooling and heat dissipation zone around the heat source can be appropriately increased, concentrating the energy consumption in the semiconductor cooling unit of the cooling and heat dissipation zone in contact with the heat source, which is beneficial to improving the heat dissipation effect of the heat source. Attached Figure Description

[0026] Figure 1 This is a structural diagram of Embodiment 1 of the present invention.

[0027] Figure 2 This is a structural diagram of Embodiment 2 of the present invention.

[0028] Figure 3 This is a structural diagram of Embodiment 3 of the present invention.

[0029] Figure 4 This is a structural diagram of Embodiment 4 of the present invention.

[0030] Figure 5 This is a distribution diagram of the cooling and heat dissipation area in Embodiment 5 of the present invention.

[0031] In the diagram: 1. Thermoelectric cooler body, 2. Base plate, 3. Thermoelectric particles, 4. Heat source, 5. Heat dissipation baffle, 6. Guide groove, 7. Guide block, 8. Mounting groove, 9. Recessed groove, 10. Baffle body, 11. Adjustment plate, 12. Cooling and heat dissipation area. Detailed Implementation

[0032] The technical solution of the present invention will be further described in detail below through specific embodiments and with reference to the accompanying drawings: Example 1: A heat dissipation adjustable thermoelectric cooler structure (see Figure 1 The thermoelectric cooler body 1 includes two substrates 2 and multiple pairs of thermoelectric particles 3 connected between the two substrates 2. Each pair of thermoelectric particles 3 is divided into P-type particles and N-type particles. The two ends of the P-type particles and N-type particles are connected to form a cold end and a hot end, respectively. The cold end is connected to one substrate 2 and the hot end is connected to the other substrate 2, thereby forming a cold surface and a hot surface on the two substrates 2 of the thermoelectric cooler body 1, respectively.

[0033] The cold surface of the thermoelectric cooler body 1 is attached to the heat source 4. The heat source 4 is bonded to the cold surface with thermally conductive adhesive. A heat dissipation baffle 5 is provided around the heat source 4. The heat dissipation baffle 5 is close to the side wall of the heat source 4 and is movably connected to the cold surface of the thermoelectric cooler body 1.

[0034] A guide groove 6 corresponding to the heat dissipation baffle 5 is provided on the cold surface of the thermoelectric cooler body 1. A guide block 7 is provided on the heat dissipation baffle 5, and the guide block 7 is slidably connected to the guide groove 6. Both the guide groove 6 and the guide block 7 have an inverted T-shaped structure. When the heat dissipation baffle 5 moves to adjust its position, the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 on the cold surface of the thermoelectric cooler body 1, ensuring the smoothness and reliability of the movement of the heat dissipation baffle 5. The inverted T-shaped structure of the guide groove 6 and the guide block 7 ensures smooth and reliable sliding, preventing the heat dissipation baffle 5 from longitudinally disengaging from the thermoelectric cooler during the sliding process.

[0035] The cold surface of the thermoelectric cooler body 1 is provided with several spaced mounting slots 8, and the heat dissipation baffle 5 is inserted into the mounting slots 8. The heat dissipation baffle 5 and the mounting slot 8 are fitted and inserted to ensure the stability of the connection of the heat dissipation baffle 5, and at the same time ensure reliable contact between the heat dissipation baffle 5 and the cold surface of the thermoelectric cooler, resulting in good heat conduction and thus ensuring the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4. A recessed groove 9 is provided at the intersection of the bottom surfaces of the mounting slot 8 and the guide groove 6. The recessed groove 9 is fitted with the guide block 7, the bottom surface of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting slot 8, the heat dissipation baffle 5 is higher than the opening end of the mounting slot 8, and the side of the heat dissipation baffle 5 is in contact with the side of the mounting slot 8. After the heat dissipation baffle 5 slides to the corresponding mounting groove 8, the heat dissipation baffle 5 is pressed down so that the lower end face of the heat dissipation baffle 5 contacts the bottom surface of the mounting groove 8. The lower end of the guide block 7 is inserted into the recessed groove 9. At this time, not only is the heat dissipation baffle 5 limited, but the contact area between the heat dissipation baffle 5 and the cold surface is large, which ensures the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4.

[0036] When the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6, the heat dissipation baffle 5 is positioned above the cold surface. After the heat dissipation baffle 5 slides to the position of the mounting groove 8, the heat dissipation baffle 5 is inserted downward into the mounting groove 8, and the guide block 7 is inserted into the recessed groove 9. At this time, the lower end face of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting groove 8, and the height of the upper end of the heat dissipation baffle 5 above the cold surface is not less than the thickness of the heat source 4, ensuring that the side of the heat source 4 can be completely covered by the heat dissipation baffle 5.

[0037] The thermoelectric cooler body 1 has a rectangular structure, and the heat source 4 has a rectangular structure. Each of the four sides of the heat source 4 is connected to a heat dissipation baffle 5, which is a straight strip. Each heat dissipation baffle 5 is provided with a guide groove 6 and two spaced-apart mounting grooves 8. The outer mounting groove 8 is longer than the inner mounting groove 8, and the heat dissipation baffle 5 is adapted to the mounting groove 8. The mounting grooves 8 are perpendicular to the guide grooves 6. The cold surface of the thermoelectric cooler is in contact with the heat source 4. After the thermoelectric cooler is powered on, the cold surface cools, thus dissipating heat from the heat source 4. The heat source 4 not only has its end face in contact with the cold surface, but its sidewalls also contact the heat dissipation baffles 5. Since the heat dissipation baffles 5 are mounted on the cold surface, the sidewalls of the heat source 4 also achieve cooling and heat dissipation, increasing the heat dissipation area and improving the heat dissipation effect. The heat dissipation baffles 5 are movably connected to the cold surface of the thermoelectric cooler body 1. Different lengths of heat dissipation baffles 5 can be selected and installed in different positions according to different sizes of heat sources 4, making the thermoelectric cooler adaptable to various sizes of heat sources 4 and providing good versatility.

[0038] A heat dissipation method for an adjustable thermoelectric cooler, employing an adjustable thermoelectric cooler structure for heat dissipation, includes the following steps: S1, attaching a heat source 4 to the cold surface of the thermoelectric cooler body 1 near its center; S2, selecting a heat dissipation baffle 5 of appropriate length according to the size of the heat source 4, generally selecting a heat dissipation baffle 5 whose length is consistent with the corresponding side length of the heat source 4, and installing the heat dissipation baffle 5 onto the cold surface of the thermoelectric cooler body 1. After the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 to the mounting groove 8, it presses the heat dissipation baffle 5 downward, causing the heat dissipation baffle 5 to abut against the outer wall of the heat source 4; S3, the thermoelectric cooler operates to dissipate heat from the heat source 4, with the cold surface of the thermoelectric cooler absorbing heat to achieve heat dissipation from the heat source 4.

[0039] Heat source 4 uses a thermoelectric cooler for heat dissipation. The end face of heat source 4 is in contact with the cold surface of the thermoelectric cooler, while the side wall of heat source 4 is in contact with the heat dissipation baffle 5. The heat dissipation baffle 5 is connected to the cold surface of the thermoelectric cooler, and the heat dissipation baffle 5 forms the heat transfer medium for heat conduction between the cold surface and the side wall of heat source 4. Since both the end face and side wall of heat source 4 serve as heat dissipation surfaces, the increased heat dissipation area is beneficial for improving the heat dissipation effect.

[0040] Example 2: A heat dissipation adjustable thermoelectric cooler structure (see Figure 2 Its structure is similar to that of Embodiment 1, the main difference being that in this embodiment, each heat dissipation baffle 5 is provided with a guide groove 6 and three spaced mounting grooves 8, the outer mounting groove 8 being longer than the inner mounting groove 8, and the heat dissipation baffle 5 fitting into the mounting groove 8. By selecting heat dissipation baffles 5 of different widths, it can accommodate the installation of heat sources 4 of more sizes and specifications, improving versatility. Other structures are the same as in Embodiment 1. The heat dissipation method of the adjustable thermoelectric cooler in this embodiment is the same as that in Embodiment 1.

[0041] Example 3: A heat dissipation adjustable thermoelectric cooler structure (see Figure 3 The thermoelectric cooler body 1 includes two substrates 2 and multiple pairs of thermoelectric particles 3 connected between the two substrates 2. Each pair of thermoelectric particles 3 is divided into P-type particles and N-type particles. The two ends of the P-type particles and N-type particles are connected to form a cold end and a hot end, respectively. The cold end is connected to one substrate 2 and the hot end is connected to the other substrate 2, thereby forming a cold surface and a hot surface on the two substrates 2 of the thermoelectric cooler body 1, respectively.

[0042] The cold surface of the thermoelectric cooler body 1 is attached to the heat source 4. The heat source 4 is bonded to the cold surface with thermally conductive adhesive. A heat dissipation baffle 5 is provided around the heat source 4. The heat dissipation baffle 5 is close to the side wall of the heat source 4 and is movably connected to the cold surface of the thermoelectric cooler body 1.

[0043] A guide groove 6 corresponding to the heat dissipation baffle 5 is provided on the cold surface of the thermoelectric cooler body 1. A guide block 7 is provided on the heat dissipation baffle 5, and the guide block 7 is slidably connected to the guide groove 6. Both the guide groove 6 and the guide block 7 have an inverted T-shaped structure. When the heat dissipation baffle 5 moves to adjust its position, the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 on the cold surface of the thermoelectric cooler body 1, ensuring the smoothness and reliability of the movement of the heat dissipation baffle 5. The inverted T-shaped structure of the guide groove 6 and the guide block 7 ensures smooth and reliable sliding, preventing the heat dissipation baffle 5 from longitudinally disengaging from the thermoelectric cooler during the sliding process.

[0044] The cold surface of the thermoelectric cooler body 1 is provided with several spaced mounting slots 8, and the heat dissipation baffle 5 is inserted into the mounting slots 8. The heat dissipation baffle 5 and the mounting slot 8 are fitted and inserted to ensure the stability of the connection of the heat dissipation baffle 5, and at the same time ensure reliable contact between the heat dissipation baffle 5 and the cold surface of the thermoelectric cooler, resulting in good heat conduction and thus ensuring the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4. A recessed groove 9 is provided at the intersection of the bottom surfaces of the mounting slot 8 and the guide groove 6. The recessed groove 9 is fitted with the guide block 7, the bottom surface of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting slot 8, the heat dissipation baffle 5 is higher than the opening end of the mounting slot 8, and the side of the heat dissipation baffle 5 is in contact with the side of the mounting slot 8. After the heat dissipation baffle 5 slides to the corresponding mounting groove 8, the heat dissipation baffle 5 is pressed down so that the lower end face of the heat dissipation baffle 5 contacts the bottom surface of the mounting groove 8. The lower end of the guide block 7 is inserted into the recessed groove 9. At this time, not only is the heat dissipation baffle 5 limited, but the contact area between the heat dissipation baffle 5 and the cold surface is large, which ensures the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4.

[0045] When the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6, the heat dissipation baffle 5 is positioned above the cold surface. After the heat dissipation baffle 5 slides to the position of the mounting groove 8, the heat dissipation baffle 5 is inserted downward into the mounting groove 8, and the guide block 7 is inserted into the recessed groove 9. At this time, the lower end face of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting groove 8, and the height of the upper end of the heat dissipation baffle 5 above the cold surface is not less than the thickness of the heat source 4, ensuring that the side of the heat source 4 can be completely covered by the heat dissipation baffle 5.

[0046] The heat dissipation baffle 5 includes a baffle body 10 and an adjusting plate 11. The adjusting plate 11 is positioned between the baffle body 10 and the heat source 4. The length of the adjusting plate 11 is the same as the side length of the heat source 4. The adjusting plate 11 is attached to the cold surface of the thermoelectric cooler body 1. The two side walls of the adjusting plate 11 abut against the side walls of the baffle body 10 and the heat source 4, respectively. The baffle body 10 is adapted to the mounting groove 8, and the guide block 7 is located at the lower part of the baffle body 10. When there is a gap between the baffle body 10 and the heat source 4, the adjusting plate 11 is installed between the baffle body 10 and the heat source 4 to ensure that the side wall of the heat source 4 can be contacted for heat dissipation. By changing the width of the adjusting plate 11, it can accommodate the installation of heat sources 4 of various sizes.

[0047] The thermoelectric cooler body 1 has a rectangular structure, and the heat source 4 has a rectangular structure. Each of the four sides of the heat source 4 is connected to a heat dissipation baffle 5, which is a straight strip. Each heat dissipation baffle 5 corresponds to a guide groove 6 and at least two spaced mounting grooves 8. The outer mounting groove 8 is longer than the inner mounting groove 8, and the heat dissipation baffle 5 is adapted to the mounting groove 8. The mounting grooves 8 are perpendicular to the guide grooves 6. The cold surface of the thermoelectric cooler is in contact with the heat source 4. After the thermoelectric cooler is powered on, the cold surface cools, thus dissipating heat from the heat source 4. The heat source 4 not only has its end face in contact with the cold surface, but its sidewalls also contact the heat dissipation baffles 5. Since the heat dissipation baffles 5 are mounted on the cold surface, the sidewalls of the heat source 4 also achieve cooling and heat dissipation, increasing the heat dissipation area and improving the heat dissipation effect. The heat dissipation baffles 5 are movably connected to the cold surface of the thermoelectric cooler body 1. Different lengths of heat dissipation baffles 5 can be selected and installed in different positions according to different sizes of heat sources 4, making the thermoelectric cooler adaptable to various sizes of heat sources 4 and providing good versatility.

[0048] A heat dissipation method for an adjustable thermoelectric cooler, employing an adjustable thermoelectric cooler structure for heat dissipation, includes the following steps: S1, attaching the heat source 4 to the cold surface of the thermoelectric cooler body 1 near the center; S2, selecting a heat dissipation baffle 5 of appropriate length according to the size of the heat source 4, and confirming whether an adjustment plate 11 is needed, then installing the heat dissipation baffle 5 onto the cold surface of the thermoelectric cooler body 1. After the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 to the mounting groove 8, the heat dissipation baffle 5 is pressed down, and the heat dissipation baffle 5 abuts against the outer wall of the heat source 4. If the adjustment plate 11 is selected, the side wall of the adjustment plate 11 abuts against the side wall of the heat source 4; if the adjustment plate 11 is not selected, the side wall of the baffle body 10 is directly abutted against the side wall of the heat source 4; S3, the thermoelectric cooler operates to dissipate heat from the heat source 4, and the cold surface of the thermoelectric cooler absorbs heat to achieve heat dissipation from the heat source 4.

[0049] Heat source 4 uses a thermoelectric cooler for heat dissipation. The end face of heat source 4 is in contact with the cold surface of the thermoelectric cooler, while the side wall of heat source 4 is in contact with the heat dissipation baffle 5. The heat dissipation baffle 5 is connected to the cold surface of the thermoelectric cooler, and the heat dissipation baffle 5 forms the heat transfer medium for heat conduction between the cold surface and the side wall of heat source 4. Since both the end face and side wall of heat source 4 serve as heat dissipation surfaces, the increased heat dissipation area is beneficial for improving the heat dissipation effect.

[0050] Example 4: A heat dissipation adjustable thermoelectric cooler structure (see Figure 4The thermoelectric cooler body 1 includes two substrates 2 and multiple pairs of thermoelectric particles 3 connected between the two substrates 2. Each pair of thermoelectric particles 3 is divided into P-type particles and N-type particles. The two ends of the P-type particles and N-type particles are connected to form a cold end and a hot end, respectively. The cold end is connected to one substrate 2 and the hot end is connected to the other substrate 2, thereby forming a cold surface and a hot surface on the two substrates 2 of the thermoelectric cooler body 1, respectively.

[0051] The cold surface of the thermoelectric cooler body 1 is attached to the heat source 4. The heat source 4 is bonded to the cold surface with thermally conductive adhesive. A heat dissipation baffle 5 is provided around the heat source 4. The heat dissipation baffle 5 is close to the side wall of the heat source 4 and is movably connected to the cold surface of the thermoelectric cooler body 1.

[0052] A guide groove 6 corresponding to the heat dissipation baffle 5 is provided on the cold surface of the thermoelectric cooler body 1. A guide block 7 is provided on the heat dissipation baffle 5, and the guide block 7 is slidably connected to the guide groove 6. Both the guide groove 6 and the guide block 7 have an inverted T-shaped structure. When the heat dissipation baffle 5 moves to adjust its position, the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 on the cold surface of the thermoelectric cooler body 1, ensuring the smoothness and reliability of the movement of the heat dissipation baffle 5. The inverted T-shaped structure of the guide groove 6 and the guide block 7 ensures smooth and reliable sliding, preventing the heat dissipation baffle 5 from longitudinally disengaging from the thermoelectric cooler during the sliding process.

[0053] The cold surface of the thermoelectric cooler body 1 is provided with several spaced mounting slots 8, and the heat dissipation baffle 5 is inserted into the mounting slots 8. The heat dissipation baffle 5 and the mounting slot 8 are fitted and inserted to ensure the stability of the connection of the heat dissipation baffle 5, and at the same time ensure reliable contact between the heat dissipation baffle 5 and the cold surface of the thermoelectric cooler, resulting in good heat conduction and thus ensuring the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4. A recessed groove 9 is provided at the intersection of the bottom surfaces of the mounting slot 8 and the guide groove 6. The recessed groove 9 is fitted with the guide block 7, the bottom surface of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting slot 8, the heat dissipation baffle 5 is higher than the opening end of the mounting slot 8, and the side of the heat dissipation baffle 5 is in contact with the side of the mounting slot 8. After the heat dissipation baffle 5 slides to the corresponding mounting groove 8, the heat dissipation baffle 5 is pressed down so that the lower end face of the heat dissipation baffle 5 contacts the bottom surface of the mounting groove 8. The lower end of the guide block 7 is inserted into the recessed groove 9. At this time, not only is the heat dissipation baffle 5 limited, but the contact area between the heat dissipation baffle 5 and the cold surface is large, which ensures the cooling and heat dissipation effect of the heat dissipation baffle 5 on the side wall of the heat source 4.

[0054] When the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6, the heat dissipation baffle 5 is positioned above the cold surface. After the heat dissipation baffle 5 slides to the position of the mounting groove 8, the heat dissipation baffle 5 is inserted downward into the mounting groove 8, and the guide block 7 is inserted into the recessed groove 9. At this time, the lower end face of the heat dissipation baffle 5 is in contact with the bottom surface of the mounting groove 8, and the height of the upper end of the heat dissipation baffle 5 above the cold surface is not less than the thickness of the heat source 4, ensuring that the side of the heat source 4 can be completely covered by the heat dissipation baffle 5.

[0055] The heat source 4 has a circular structure, and the heat dissipation baffles 5 have an arc-shaped structure. Several heat dissipation baffles 5 arranged at intervals around the circumference form a circle and abut against the outer wall of the heat source 4. The thermoelectric cooler body 1 is square, with four heat dissipation baffles 5 evenly distributed around the circumference. Each heat dissipation baffle 5 is provided with a guide groove 6 and at least two spaced mounting grooves 8. The length of the outer mounting groove 8 is greater than the length of the inner mounting groove 8, and the heat dissipation baffle 5 is adapted to the mounting groove 8. The mounting grooves 8 are arranged circumferentially, and the guide grooves 6 are arranged radially. The cold surface of the thermoelectric cooler is in contact with the heat source 4. After the thermoelectric cooler is powered on, the cold surface cools, thereby achieving heat dissipation of the heat source 4. The heat source 4 not only has its end face in contact with the cold surface, but also its side wall is in contact with the heat dissipation baffles 5. The heat dissipation baffles 5 are installed on the cold surface, so the side wall of the heat source 4 also achieves cooling and heat dissipation, increasing the heat dissipation area and improving the heat dissipation effect of the heat source 4. The heat dissipation baffle 5 is movably connected to the cold surface of the thermoelectric cooler body 1. Different lengths of heat dissipation baffle 5 can be selected and installed in different positions according to different sizes of heat sources 4, so that the thermoelectric cooler can adapt to heat sources 4 of various sizes and has good versatility.

[0056] A heat dissipation method for an adjustable thermoelectric cooler, employing an adjustable thermoelectric cooler structure for heat dissipation, includes the following steps: S1, attaching a heat source 4 to the cold surface of the thermoelectric cooler body 1 near its center; S2, selecting appropriate length heat dissipation baffles 5 according to the size of the heat source 4, ensuring that the inner diameter of the four heat dissipation baffles 5 forming a circle matches the outer diameter of the heat source 4, and installing the heat dissipation baffles 5 onto the cold surface of the thermoelectric cooler body 1. After the guide block 7 on the heat dissipation baffle 5 slides along the guide groove 6 to the mounting groove 8, it presses down on the heat dissipation baffle 5, causing the heat dissipation baffle 5 to abut against the outer wall of the heat source 4; S3, the thermoelectric cooler operates to dissipate heat from the heat source 4, with the cold surface of the thermoelectric cooler absorbing heat to achieve heat dissipation from the heat source 4.

[0057] Heat source 4 uses a thermoelectric cooler for heat dissipation. The end face of heat source 4 is in contact with the cold surface of the thermoelectric cooler, while the side wall of heat source 4 is in contact with the heat dissipation baffle 5. The heat dissipation baffle 5 is connected to the cold surface of the thermoelectric cooler, and the heat dissipation baffle 5 forms the heat transfer medium for heat conduction between the cold surface and the side wall of heat source 4. Since both the end face and side wall of heat source 4 serve as heat dissipation surfaces, the increased heat dissipation area is beneficial for improving the heat dissipation effect.

[0058] Example 5: A heat dissipation adjustable thermoelectric cooler structure (see Figure 5The structure is similar to any one of embodiments 1 to 4, with the main difference being that in this embodiment, the thermoelectric cooler body 1 is provided with several cooling and heat dissipation zones 12 spaced apart from the center to the periphery, and each cooling and heat dissipation zone 12 is provided with an independently controlled semiconductor cooling unit. The semiconductor cooling unit includes multiple pairs of thermoelectric particles 3, each pair of thermoelectric particles 3 being divided into P-type particles and N-type particles. The two ends of the P-type particles and N-type particles are connected to form a cold end and a hot end, respectively. The cold end is connected to one substrate 2, and the hot end is connected to another substrate 2, thereby forming a cold surface and a hot surface on the two substrates 2 of the thermoelectric cooler body 1, respectively. The cold surface is divided into multiple cooling and heat dissipation zones 12 from the center to the periphery. The cooling temperature of each cooling and heat dissipation zone 12 is individually controlled by the semiconductor cooling unit. The cooling temperature can be controlled by controlling the magnitude of the current passing through the thermoelectric particles 3. The cooling and heat dissipation zone 12 where the heat source 4 is installed has a low cooling temperature, while the cooling and heat dissipation zone 12 around the heat source 4 can have a higher cooling temperature. This concentrates the energy consumption in the semiconductor cooling unit of the cooling and heat dissipation zone 12 in contact with the heat source 4, which is beneficial to improving the heat dissipation effect on the heat source 4. The other structures are the same as any one of Examples 1 to 4.

[0059] A heat dissipation method for an adjustable thermoelectric cooler, employing an adjustable thermoelectric cooler structure, includes the following steps: S1, attaching a heat source 4 to the cold surface of the thermoelectric cooler body 1; S2, selecting a suitable heat dissipation baffle 5 based on the size of the heat source 4, and installing the heat dissipation baffle 5 onto the cold surface of the thermoelectric cooler body 1, with the baffle 5 abutting against the outer wall of the heat source 4; S3, the thermoelectric cooler operates to dissipate heat from the heat source 4. Heat dissipation from the heat source 4 is divided into zones based on the contact position between the heat source 4 and the cold surface of the thermoelectric cooler. Several cooling and heat dissipation zones 12 are spaced outwards from the heat source 4, with the cooling and heat dissipation zone 12 in contact with the heat source 4 having the lowest cooling temperature, and the cooling and heat dissipation zones 12 increasing in temperature from the inside out. The cooling temperature is adjusted by controlling the current of the semiconductor cooling unit; the higher the current, the lower the cooling temperature.

[0060] Different cooling and heat dissipation zones 12 can have their cooling temperatures adjusted individually as needed. The cooling and heat dissipation zone 12 where the heat source 4 is installed has a low cooling temperature, while the cooling and heat dissipation zone 12 around the heat source 4 can have its cooling temperature appropriately increased. This concentrates energy consumption in the semiconductor cooling unit of the cooling and heat dissipation zone 12 that is in contact with the heat source 4, which is beneficial for improving the heat dissipation effect on the heat source 4.

[0061] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications may be made without departing from the technical solutions described in the claims.

Claims

1. A heat dissipation adjustable thermoelectric cooler structure, characterized in that, It includes a thermoelectric cooler body, the cold side of the thermoelectric cooler body is attached to a heat source, a heat dissipation baffle is set around the heat source, the heat dissipation baffle is close to the side wall of the heat source, and the heat dissipation baffle is movably connected to the cold side of the thermoelectric cooler body.

2. The adjustable heat dissipation thermoelectric cooler structure according to claim 1, characterized in that, A guide groove corresponding to the heat dissipation baffle is provided on the cold surface of the thermoelectric cooler body, and a guide block is provided on the heat dissipation baffle, with the guide block slidingly connected to the guide groove.

3. The adjustable heat dissipation thermoelectric cooler structure according to claim 2, characterized in that, Both the guide groove and the guide block have an inverted T-shaped structure.

4. The adjustable heat dissipation thermoelectric cooler structure according to claim 2, characterized in that, The cold surface of the thermoelectric cooler body has several spaced mounting slots, and the heat dissipation baffles are inserted into the mounting slots.

5. The adjustable heat dissipation thermoelectric cooler structure according to claim 4, characterized in that, A recessed groove is provided at the intersection of the bottom surfaces of the mounting groove and the guide groove. The recessed groove and the guide block are adapted to each other. The bottom surface of the heat dissipation baffle is in contact with the bottom surface of the mounting groove. The heat dissipation baffle is higher than the opening end of the mounting groove. The side of the heat dissipation baffle is close to the side of the mounting groove.

6. The adjustable heat dissipation thermoelectric cooler structure according to claim 1, characterized in that, The heat source has a rectangular structure, and heat dissipation baffles are connected to all four sides of the heat source. The heat dissipation baffles have a straight structure.

7. The adjustable heat dissipation thermoelectric cooler structure according to claim 1, characterized in that, The heat source has a circular structure, and the heat dissipation baffles have an arc structure. Several heat dissipation baffles are arranged circumferentially to form a circle and abut against the outer wall of the heat source.

8. A heat dissipation adjustable thermoelectric cooler structure according to any one of claims 1 to 7, characterized in that, The thermoelectric cooler body is divided into several cooling and heat dissipation zones at intervals from the center to the periphery, and each cooling and heat dissipation zone is equipped with an independently controlled semiconductor cooling unit.

9. A heat dissipation method for a heat-adjustable thermoelectric cooler, employing the heat dissipation adjustable thermoelectric cooler structure according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1, attach the heat source to the cold surface of the thermoelectric cooler body; S2, install the heat dissipation strip on the cold surface of the thermoelectric cooler body, and the heat dissipation strip is pressed against the outer wall of the heat source; S3, the thermoelectric cooler works to dissipate heat from the heat source.

10. The heat dissipation method for the adjustable thermoelectric cooler according to claim 9, characterized in that, In S3, the heat source is cooled in different areas according to the contact position between the heat source and the cold surface of the thermoelectric cooler. The cold surface of the thermoelectric cooler is divided into several cooling and heat dissipation areas with the heat source as the center and spaced outwards. The cooling and heat dissipation area in contact with the heat source has the lowest cooling temperature, and the cooling and heat dissipation areas increase in temperature from the inside to the outside.

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