Micro-channel heat dissipation structure based on TPMS structure and liquid cooling plate

Abstract

The application belongs to the technical field of liquid cooling heat dissipation, and discloses a micro-channel heat dissipation structure based on a TPMS structure and a liquid cooling plate. The micro-channel heat dissipation structure comprises a first TPMS structure and a second TPMS structure which cooperate with each other. The first TPMS structure is arranged in a core heat source area, and the core heat source area corresponds to the arrangement position of a core chip with the highest heat flux density of a to-be-cooled component. The second TPMS structure is arranged in a non-heat source area, and the non-heat source area corresponds to a position where the core chip is not arranged on the to-be-cooled component. The gap of the second TPMS structure is arranged on the outer circumferential side of the first TPMS structure. The heat exchange performance of the first TPMS structure is greater than that of the second TPMS structure, and the flow resistance of the second TPMS structure is smaller than that of the first TPMS structure. The application can simultaneously meet the requirements of high-efficiency heat exchange, low flow resistance energy consumption and multiple core use of non-uniform heat source distribution of the to-be-cooled component, and expand the application range of heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and in particular to a microchannel heat dissipation structure and liquid cooling plate based on TPMS structure. Background Technology

[0002] Currently, for liquid cooling of core heat-generating components such as CPUs, GPUs, and accelerator cards in high-power-density rack servers, AI computing servers, and edge computing servers in data centers, conventional straight-slot, pin-fin, and columnar microchannel heat sinks are the mainstream liquid cooling structures. However, these structures have the following problems: 1) Limited heat exchange area and low heat transfer efficiency, making it impossible to quickly dissipate high heat flux density heat; 2) Dead zones and eddies easily form inside the flow channels, resulting in uneven flow field distribution and extremely poor local heat exchange capacity; 3) The simple flow channel structure cannot balance the contradiction between heat dissipation performance and flow resistance, leading to server performance degradation, decreased operational stability, and even shortened server lifespan and increased data center operation and maintenance costs.

[0003] To address the above issues, the Triple Period Minimal Surface (TPMS) structure is typically used as a microchannel heat dissipation structure. Specifically, the TPMS structure refers to a novel continuous porous interconnected structure based on implicit mathematical functions. Due to its unique topological advantages, it has become a research hotspot in the field of microchannel heat dissipation. The TPMS structure features a continuous and smooth surface, no sharp edges, a specific surface area far exceeding that of the mainstream liquid cooling structures mentioned above, excellent fluid connectivity, and uniform flow field distribution. This allows it to significantly enhance fluid disturbance, disrupt the thermal boundary layer, and significantly improve convective heat transfer efficiency.

[0004] However, since existing technologies typically employ a single type of TPMS structure for heat dissipation, there is a technical contradiction that is difficult to balance between efficient heat exchange, low flow resistance energy consumption, and adaptability to non-uniform heat source distribution, which greatly limits the applicability of the entire microchannel heat dissipation structure. Summary of the Invention

[0005] The purpose of this invention is to provide a microchannel heat dissipation structure and liquid cooling plate based on TPMS structure, which can achieve a synergistic balance between extreme heat exchange in high heat flux density areas and low resistance flow in low heat areas, so as to simultaneously meet the multiple core usage requirements of the heat dissipation components, such as high efficiency heat exchange, low flow resistance energy consumption, and adaptability to non-uniform heat source distribution, thereby expanding the heat dissipation application range of the microchannel heat dissipation structure based on TPMS structure.

[0006] To achieve this objective, the present invention adopts the following technical solution: A microchannel heat dissipation structure based on TPMS includes: The first TPMS structure is located in the core heat source region, which corresponds to the location of the core chip with the highest heat flux density of the component to be scaldredged. The second TPMS structure is located in a non-heat source area, which corresponds to the position where the core chip is not located on the heat dissipation component, and the gap of the second TPMS structure is located on the outer periphery of the first TPMS structure. The heat exchange performance of the first TPMS structure is greater than that of the second TPMS structure. Furthermore, the flow resistance of the second TPMS structure is less than that of the first TPMS structure, thereby reducing the flow pressure drop of the coolant in the second TPMS structure.

[0007] As an optional solution, the first TPMS structure is a high heat transfer type Diamond structure or a high heat transfer type Gyroid structure; And / or, the second TPMS structure is a low-flow-resistance Schwarz-P type structure.

[0008] As an optional solution, both the first TPMS structure and the second TPMS structure are flat square structures; And / or, the material of the first TPMS structure and the material of the second TPMS structure are both thermally conductive pure copper, and the first TPMS structure and the second TPMS structure are both integral structures formed by metal 3D printing.

[0009] As an optional solution, the shape and size of the first TPMS structure correspond to and match the shape and size of the core chip; along the first direction and the second direction, the gap between the first TPMS structure and the second TPMS structure at the junction is a1=0.1mm; the first direction is parallel to the flow direction of the coolant, and the second direction is perpendicular to the first direction.

[0010] As an optional embodiment, the first smallest cell unit of the first TPMS structure is c1×c1, where c1 = 1.5mm~3mm; the second smallest cell unit of the second TPMS structure is b1×b1, where b1 = 1.5mm~3mm.

[0011] As an alternative, the first TPMS structure extends along the second direction to the outer edge of the second TPMS structure on opposite sides; and along the first direction, the gap between the first TPMS structure and the second TPMS structure at the junction is a2=0.1mm.

[0012] As an optional embodiment, the first smallest cell unit of the first TPMS structure is c2×c2, where c2 = 1.5mm~3mm; the second smallest cell unit of the second TPMS structure is b2×b2, where b2 = 1.5mm~3mm.

[0013] As an optional solution, the first TPMS structure is provided with inclined flow guiding structures on opposite sides in the second direction. One of the inclined flow guiding structures is inclined upward from the first TPMS structure along the first inclined setting direction to the outer edge of the second TPMS structure, and the other inclined flow guiding structure is inclined downward from the first TPMS structure along the second inclined setting direction to the outer edge of the second TPMS structure. The inclined flow guiding structures are used to guide the coolant to the first TPMS structure. Furthermore, along the first direction, the gap between the first TPMS structure and the second TPMS structure at the junction, and along the second direction, the gap between the first TPMS structure and the inclined flow guide structure at the junction, are both a31=0.1mm; along the direction perpendicular to the first inclined setting direction and along the direction perpendicular to the second inclined setting direction, the gap between the inclined flow guide structure and the second TPMS structure at the junction is both a32=0.1mm. The inclined flow guiding structure includes multiple flow guiding plate groups arranged at intervals. Each flow guiding plate group includes multiple flow guiding plates arranged at intervals along the first inclined setting direction or the second inclined setting direction. In a flow guiding plate group, the ratio between the gap c0 between any two adjacent flow guiding plates and the length d of a single flow guiding plate is 1 / 3 to 1 / 6.

[0014] As an optional embodiment, the first smallest cell unit of the first TPMS structure is c3×c3, where c3 = 1.5mm~3mm; the second smallest cell unit of the second TPMS structure is b3×b3, where b3 = 1.5mm~3mm.

[0015] A liquid cooling plate includes a base, a cover plate, and a microchannel heat dissipation structure based on a TPMS structure as described above. The microchannel heat dissipation structure based on the TPMS structure is disposed inside the base. The cover plate covers the top opening of the base and has an inlet and an outlet spaced apart along a first direction. The inlet and outlet are respectively connected to the second TPMS structure.

[0016] The beneficial effects of this invention are: The microchannel heat dissipation structure based on TPMS (Triple Period Minimal Surface) structure of the present invention comprises: a first TPMS structure in the core heat source region, corresponding to the location of the core chip with the highest heat flux density in the heat-dissipating component; and a second TPMS structure in the non-heat source region, corresponding to the location of the heat-dissipating component (server) where the core chip is not located, with the gap between the second TPMS structures located on the outer periphery of the first TPMS structure; the heat transfer performance of the first TPMS structure is greater than that of the second TPMS structure to ensure efficient heat dissipation of the core chip with the highest heat flux density; and the flow resistance of the second TPMS structure is less than that of the first TPMS structure to reduce the pressure drop of the coolant within the second TPMS structure, thereby meeting the requirements of heat dissipation. For low flow resistance and energy consumption of heat dissipation components, the aforementioned microchannel heat dissipation structure based on TPMS structure is a microchannel heat dissipation structure designed with corresponding partition combinations based on various different types of TPMS structures, precisely adapting to the heat source distribution of the heat dissipation component. That is, by arranging various different types of TPMS structures in corresponding partitions, a synergistic balance can be achieved between extreme heat exchange in high heat flux density areas and low flow resistance in low heat areas. This can simultaneously meet the multiple core usage requirements of the heat dissipation component, such as high-efficiency heat exchange, low flow resistance and energy consumption, and adaptability to non-uniform heat source distribution, thereby effectively expanding the heat dissipation application range of the entire TPMS-based microchannel heat dissipation structure. It is especially suitable for liquid cooling scenarios where the heat dissipation component is a high-power density rack server, AI computing server, or edge computing server in a data center.

[0017] The liquid cooling plate of the present invention, due to including the microchannel heat dissipation structure based on the TPMS structure mentioned above, has a better liquid cooling effect on the heat dissipation component to be cooled, so as to simultaneously meet the multiple core usage requirements of the heat dissipation component, such as high-efficiency heat exchange, low flow resistance energy consumption, and adaptability to non-uniform heat source distribution, thereby effectively expanding the heat dissipation application range of the entire liquid cooling plate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 1 of the present invention; Figure 2 This is a top view of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 1 of the present invention; Figure 3 yes Figure 2 A magnified schematic diagram of the local structure at point E1; Figure 4 yes Figure 2 A magnified schematic diagram of the local structure at point E2; Figure 5 yes Figure 2 A magnified schematic diagram of the local structure at point E3; Figure 6 yes Figure 2 A magnified schematic diagram of the local structure at point E4; Figure 7 This is a schematic diagram of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 2 of the present invention; Figure 8 This is a top view of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 2 of the present invention; Figure 9 yes Figure 8 A magnified schematic diagram of the local structure at point F1; Figure 10 yes Figure 8 A magnified schematic diagram of the local structure at point F2; Figure 11 yes Figure 8 A magnified schematic diagram of the local structure at point F3; Figure 12 yes Figure 8 A magnified schematic diagram of the local structure at point F4; Figure 13 This is a schematic diagram of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 3 of the present invention; Figure 14 This is a schematic diagram of the two inclined flow guiding structures provided in Embodiment 3 of the present invention; Figure 15 This is a top view of the microchannel heat dissipation structure based on TPMS structure provided in Embodiment 3 of the present invention; Figure 16 yes Figure 15 A magnified schematic diagram of the local structure at point H1; Figure 17 yes Figure 15 A magnified schematic diagram of the local structure at point H2; Figure 18 yes Figure 15 A magnified schematic diagram of the local structure at point H3; Figure 19 yes Figure 15 A magnified schematic diagram of the structure at point H4 in the middle; Figure 20 yes Figure 15 A magnified schematic diagram of the structure at point H5 in the middle; Figure 21 yes Figure 15 A magnified schematic diagram of the structure at point H6 in the middle; Figure 22 yes Figure 15 A magnified schematic diagram of the structure at point H7 in the middle; Figure 23 yes Figure 15A magnified schematic diagram of the structure at point H8 in the middle; Figure 24 yes Figure 15 A magnified schematic diagram of the structure at point H9 in the middle; Figure 25 This is a schematic diagram of the liquid cooling plate provided in Embodiment 5 of the present invention; Figure 26 This is an exploded structural diagram of the liquid cooling plate provided in Embodiment 5 of the present invention.

[0019] In the picture: 10- Microchannel heat dissipation structure based on TPMS structure; 11-First TPMS structure; 111-First smallest cell unit; 12-Second TPMS structure; 121-Second smallest cell unit; 13-Inclined flow guide structure; 131-Flow guide plate assembly; 1311-Flow guide plate; 21-Base; 211-Top opening; 22-Cover plate; 221-Liquid inlet; 222-Liquid outlet. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Example 1 This embodiment provides a microchannel heat dissipation structure based on TPMS structure. This microchannel heat dissipation structure based on TPMS structure can ensure efficient heat dissipation of the component to be scald, and can achieve a synergistic balance between extreme heat exchange in high heat flux density areas and low resistance flow in low heat areas. This simultaneously meets the multiple core usage requirements of the component to be scald, such as efficient heat exchange, low flow resistance energy consumption, and adaptability to non-uniform heat source distribution. This expands the heat dissipation application range of the entire microchannel heat dissipation structure based on TPMS structure, and is especially suitable for liquid cooling scenarios where the component to be scald is a high power density rack server, AI computing server, or edge computing server in a data center.

[0025] It is worth noting that the main improvement of this embodiment lies in the overall structural layout improvement of the microchannel heat dissipation structure based on the TPMS structure. Therefore, the specific liquid cooling process of the heat sink will not be described in detail here; refer to the common liquid cooling process in the prior art. Specifically, the TPMS structure refers to a continuous porous surface defined by mathematical implicit functions, which is periodically repeated in three-dimensional space and has an average curvature of zero. After being solidified by metal 3D printing, it forms a heat dissipation medium composed of a solid skeleton and interconnected microchannels.

[0026] Specifically, such as Figure 1 and Figure 2As shown, the microchannel heat dissipation structure 10 based on the TPMS structure includes a first TPMS structure 11 and a second TPMS structure 12 that cooperate with each other. The first TPMS structure 11 is located in the core heat source region, which corresponds to the location of the core chip with the highest heat flux density in the component to be cooled. The core chip can refer to one or more components; here, the core chip represents the region with the highest heat flux density in the component to be cooled. That is, the solid skeleton of the first TPMS structure 11 is attached to the location corresponding to the core chip, so that the heat generated by the core chip can be directly absorbed through the solid skeleton (a highly thermally conductive metal material) of the first TPMS structure 11, and cooled during operation. As the liquid flows through the first flow channels (microchannels) of the first TPMS structure 11, it rapidly carries away heat from the solid skeleton, achieving efficient heat dissipation for the core chip. The second TPMS structure 12 is located in a non-heat source region, corresponding to the position where the core chip is not located on the heat-dissipating component, and the gaps in the second TPMS structure 12 are located on the outer periphery of the first TPMS structure 11. The heat transfer performance of the first TPMS structure 11 is greater than that of the second TPMS structure 12, and the flow resistance of the second TPMS structure 12 is less than that of the first TPMS structure 11, thereby reducing the pressure drop of the coolant in the second TPMS structure 12. In this embodiment, the heat dissipation process of the second TPMS structure 12 is basically similar to the heat dissipation process of the first TPMS structure 11 described above, and will not be described in detail here.

[0027] Compared to existing technologies, the microchannel heat dissipation structure 10 based on TPMS structure in this embodiment, while strictly adhering to the specific heat source distribution pattern of the component to be cooled, employs a combination of various different types of TPMS structures in a partitioned layout. A first TPMS structure 11 is set in the core heat source region, corresponding to the location of the core chip with the highest heat flux density in the component to be cooled. Simultaneously, a second TPMS structure 12 is set in the non-heat source region, corresponding to the location of the component (server) without a core chip, with the second TPMS structure 12 positioned at a gap on the outer periphery of the first TPMS structure 11. Furthermore, the heat transfer performance of the first TPMS structure 11 is greater than that of the second TPMS structure 12 to ensure efficient heat dissipation of the core chip with the highest heat flux density. At the same time, the flow resistance of the second TPMS structure 12 is less than that of the first TPMS structure 11. Dynamic resistance is reduced to decrease the flow pressure drop of the coolant in the second TPMS structure 12, thereby meeting the low flow resistance energy consumption requirement of the heat-dissipating component. In other words, the microchannel heat dissipation structure 10 based on the TPMS structure is a microchannel heat dissipation structure designed with corresponding partition combinations based on multiple different types of TPMS structures, precisely adapting to the heat source distribution of the heat-dissipating component. That is, by arranging multiple different types of TPMS structures in corresponding partitions, a synergistic balance between extreme heat exchange in high heat flux density areas and low-resistance flow in low heat areas can be achieved. This can simultaneously meet the multiple core usage requirements of the heat-dissipating component, such as high-efficiency heat exchange, low flow resistance energy consumption, and adaptability to non-uniform heat source distribution, thereby effectively expanding the heat dissipation application range of the entire microchannel heat dissipation structure 10 based on the TPMS structure. It is especially suitable for liquid cooling scenarios where the heat-dissipating component is a high-power density rack server, AI computing server, or edge computing server in a data center.

[0028] That is to say, such as Figure 1 and Figure 2 As shown, the microchannel heat dissipation structure 10 based on the TPMS structure in this embodiment is precisely divided into two functional areas: a core heat source area and a non-heat source area, according to the actual heat source distribution pattern of the component to be cooled. The core heat source area corresponds to the contact position of the core chip. This area has the highest heat flux density. The first TPMS structure 11 with excellent heat exchange performance can maximize the local heat exchange capacity and quickly remove the heat from the core chip. The heat dissipation of the non-heat source area is low and it mainly undertakes the function of coolant flow. Therefore, the second TPMS structure 12 with low flow resistance and smooth flow is adopted to effectively reduce the overall flow pressure drop and reduce the pump power consumption of the entire liquid cooling cycle system.

[0029] Furthermore, by placing the gap of the second TPMS structure 12 on the outer periphery of the first TPMS structure 11, that is, maintaining a small gap between the first TPMS structure 11 and the second TPMS structure 12, the solid skeletons of the first TPMS structure 11 and the second TPMS structure 12 do not contact each other at the junction, with a gap in between; this eliminates stress concentration at the junction between the solid skeletons of the first TPMS structure 11 and the second TPMS structure 12, allowing them to deform independently, significantly reducing the risk of fatigue cracking at the junction; moreover, this gap provides free expansion space. To prevent thermal deformation and mutual compression between the two structures, the gap effectively protects their respective structural integrity. Furthermore, this gap eliminates potential local hot spots or flow dead zones, resulting in more uniform heat transfer. Additionally, with this gap, the first TPMS structure 11 and the second TPMS structure 12 can be modeled independently and have their printing paths generated separately. During metal 3D printing, the path can simply be skipped at this gap, significantly reducing printing defects at the junction (such as incomplete fusion or stray particles). This, in turn, helps avoid various structural connection problems caused by direct contact between different types of TPMS structures.

[0030] Furthermore, the first TPMS structure 11 is a high heat transfer type Diamond structure or a high heat transfer type Gyroid structure; and / or, the second TPMS structure 12 is a low flow resistance Schwarz-P type structure.

[0031] By referencing and combining key operating parameters such as heat exchange performance and flow performance of various types of TPMS structures, two TPMS structures with complementary performance can be obtained to correspond to the core heat source area and non-heat source area mentioned above, thereby achieving optimized layout of functional zoning and performance coordination of the entire microchannel heat dissipation structure 10 based on the TPMS structure.

[0032] Specifically, the first TPMS structure 11, as a high-heat-transfer TPMS structure, preferably uses a high-heat-transfer Diamond structure or a high-heat-transfer Gyroid structure. These structures are high-disturbance, high-specific-surface-area TPMS structures with moderate internal surface tortuosity, enabling continuous disruption of the coolant's thermal boundary layer and enhancing coolant turbulence. This results in a convective heat transfer coefficient far exceeding other types of TPMS structures, and a specific surface area 3-5 times that of existing straight-groove microchannel heat sinks. This makes it particularly suitable for high-heat-flux-density regions where the core chip is located, ensuring that the high heat generated by the core chip can be quickly transferred to the coolant, preventing heat accumulation and a sudden temperature rise in the core chip. In this embodiment, the first TPMS structure 11 specifically uses a high-heat-transfer Diamond structure.

[0033] Furthermore, the second TPMS structure 12, as a low-flow-resistance TPMS structure, preferentially adopts a low-flow-resistance Schwarz-P type structure. This type of structure has a smooth and regular curved surface, small flow channel tortuosity, excellent internal connectivity, no dead flow corners or vortex regions, low fluid friction resistance coefficient, and high flow efficiency. While ensuring basic heat exchange capacity, it can minimize the flow pressure drop of coolant in the second TPMS structure 12. This TPMS structure is arranged in the non-heat source area. On the one hand, it can undertake basic heat dissipation for the non-heat source area. On the other hand, as a flow channel for coolant, it can ensure that coolant flows smoothly into the first TPMS structure 11 and then flows out smoothly, ensuring the flow stability and flow field uniformity of coolant in the entire microchannel heat dissipation structure 10 based on the TPMS structure.

[0034] Specifically, such as Figure 1 and Figure 2 As shown, both the first TPMS structure 11 and the second TPMS structure 12 are flat, square structures; and / or, both the first TPMS structure 11 and the second TPMS structure 12 are made of thermally conductive pure copper with ultra-high thermal conductivity and corrosion resistance, and both are integral structures formed by metal 3D printing. The specific outline and dimensions of the first TPMS structure 11 and the second TPMS structure 12 can be determined based on the actual installation space and specific working conditions; no limitations are specified here.

[0035] By making both the first TPMS structure 11 and the second TPMS structure 12 flat square structures, it is possible to better adapt to the shape of the core chip, reduce diffusion thermal resistance, achieve reasonable and compact integration, and facilitate metal 3D printing. Furthermore, by making both the first TPMS structure 11 and the second TPMS structure 12 integral structures formed by metal 3D printing, there are no splicing gaps, welding joints, or post-assembly processes, thus eliminating the risk of interface thermal resistance and leakage at the source. This ensures that both the first TPMS structure 11 and the second TPMS structure 12 have the characteristics of no interface thermal resistance, no risk of leakage, design freedom, uniform strength, and no need for assembly.

[0036] Furthermore, such as Figure 1 and Figure 2 As shown, the shape and size of the first TPMS structure 11 correspond to and match the shape and size of the core chip; that is, the partition boundaries of the first TPMS structure 11 are determined entirely according to the outer edge boundary of the core chip to be cooled; and, as Figure 3 and Figure 4As shown, along the first direction and the second direction, the gap between the first TPMS structure 11 and the second TPMS structure 12 at the junction is a1 = 0.1 mm. The first direction is parallel to the flow direction of the coolant, and the second direction is perpendicular to the first direction. Specifically, the first direction is shown as arrow A in the figure, and the second direction is shown as arrow B in the figure.

[0037] Specifically, such as Figure 2 , Figure 5 and Figure 6 As shown, the first smallest cell unit 111 of the first TPMS structure 11 is c1×c1, where c1 = 1.5mm~3mm; and the second smallest cell unit 121 of the second TPMS structure 12 is b1×b1, where b1 = 1.5mm~3mm.

[0038] like Figure 1 and Figure 2 As shown, by setting the first TPMS structure 11 and the second TPMS structure 12 of the above layout structure, on the one hand, the entire microchannel heat dissipation structure 10 based on the TPMS structure can be simple in structure, reasonable and compact in layout, and the partition boundaries can be easily determined (quickly determined according to the outer edge boundary of the core chip); on the other hand, it takes into account both basic heat exchange capacity and low flow resistance requirements, so that the overall flow channel structure is regular and without complex changes, which is conducive to improving the metal 3D printing molding efficiency.

[0039] Example 2 This embodiment provides a microchannel heat dissipation structure 10 based on a TPMS structure. This TPMS-based microchannel heat dissipation structure 10 is basically the same as the TPMS-based microchannel heat dissipation structure 10 in Embodiment 1 above, except that: Figure 7 and Figure 8 As shown, in this embodiment, the first TPMS structure 11 extends along the second direction to the outer edge of the second TPMS structure 12 on opposite sides. By extending the high-heat-transfer-performance first TPMS structure 11 corresponding to the core heat source region along the second direction, the effective heat transfer area of ​​the core heat source region is further increased, and the heat transfer performance is further increased, thereby better improving the heat transfer capability of the core heat source region, making it suitable for liquid cooling scenarios with higher requirements for heat dissipation performance. Figure 8 Because a small display deviation occurs during the conversion of the image, Figure 8 This is for illustrative purposes only and does not represent the actual structure of the microchannel heat dissipation structure 10 based on the TPMS structure.

[0040] And, as Figures 8 to 10 As shown, along the first direction, the gap between the first TPMS structure 11 and the second TPMS structure 12 at the junction is a2 = 0.1 mm; simultaneously, as Figure 8 , Figure 11 and Figure 12 As shown, the first smallest cell unit 111 of the first TPMS structure 11 is c2×c2, c2=1.5mm~3mm; the second smallest cell unit 121 of the second TPMS structure 12 is b2×b2, b2=1.5mm~3mm.

[0041] like Figure 7 and Figure 8 As shown, by setting the first TPMS structure 11 and the second TPMS structure 12 of the above layout structure, on the one hand, the structure of the entire microchannel heat dissipation structure 10 based on the TPMS structure is simple and the layout is reasonable and compact; on the other hand, while taking into account the low flow resistance requirement, the heat exchange capacity of the core heat source area is better improved, and it is also conducive to improving the metal 3D printing molding efficiency.

[0042] Example 3 This embodiment provides a microchannel heat dissipation structure 10 based on a TPMS structure. This TPMS-based microchannel heat dissipation structure 10 is basically the same as the TPMS-based microchannel heat dissipation structure 10 in Embodiment 1 above, except that: Figures 13 to 15 As shown, in this embodiment, the first TPMS structure 11 has inclined flow guiding structures 13 on opposite sides in the second direction. One inclined flow guiding structure 13 extends upward from the first TPMS structure 11 along the first inclined setting direction to the outer edge of the second TPMS structure 12, and the other inclined flow guiding structure 13 extends downward from the first TPMS structure 11 along the second inclined setting direction to the outer edge of the second TPMS structure 12. The inclined flow guiding structures 13 are used to guide the coolant to the first TPMS structure 11. Specifically, the first inclined setting direction is as follows... Figure 15 As shown by arrow D1 in the image, the second tilt setting direction is specifically as follows: Figure 15 As shown by arrow D2 in the diagram.

[0043] like Figures 13 to 15 As shown, by setting two inclined flow guiding structures 13, when the coolant flows through the two inclined flow guiding structures 13, a portion of the coolant will be guided by the inclined flow guiding structures 13 to the first TPMS structure 11, thereby improving the heat exchange capacity and further enhancing the effective heat dissipation of the core heat source area. At the same time, another portion of the coolant will continue to flow horizontally in the first direction after passing through the inclined flow guiding structure 13, so that this portion of the coolant can continue to provide effective heat dissipation for non-heat source areas. Since the microchannel heat dissipation structure 10 based on the TPMS structure further enhances the heat exchange of the core heat source area, it can be better suited for liquid cooling heat dissipation scenarios with high requirements for heat dissipation performance.

[0044] And, as Figures 15 to 17 As shown, along the first direction, the gap at the junction of the first TPMS structure 11 and the second TPMS structure 12, and along the second direction, the gap at the junction of the first TPMS structure 11 and the inclined flow guide structure 13, are both a31 = 0.1 mm; Figure 15 , Figures 18 to 21 As shown, the gap between the inclined flow guide structure 13 and the second TPMS structure 12 at the junction is a32=0.1mm in both the direction perpendicular to the first inclined setting direction and the direction perpendicular to the second inclined setting direction.

[0045] Furthermore, such as Figure 14 , Figure 15 and Figure 22 As shown, the inclined flow guiding structure 13 includes multiple spaced flow guiding plate groups 131. Each flow guiding plate group 131 includes multiple flow guiding plates 1311 spaced along a first inclined setting direction or a second inclined setting direction. In a flow guiding plate group 131, the ratio between the gap c0 between any two adjacent flow guiding plates 1311 and the length d of a single flow guiding plate 1311 is 1 / 3 to 1 / 6. This facilitates the coordinated balance between the flow of coolant to the first TPMS structure 11 and the flow to the outlet 222 described below, which is beneficial to ensuring the flow guiding effect of coolant. In this embodiment, a portion of the coolant will be guided to the first TPMS structure 11 along the first inclined setting direction or the second inclined setting direction through the space between two adjacent guide plate groups 131, so that the amount of coolant at the first TPMS structure 11 is larger, so as to better improve the heat exchange capability of the core chip and further enhance the effective heat dissipation of the core heat source area; at the same time, another portion of the coolant will continue to flow horizontally along the first direction through the gap between two adjacent guide plates 1311 to the outlet 222 described below.

[0046] Specifically, such as Figure 15 , Figure 23 and Figure 24 As shown, the first smallest cell unit 111 of the first TPMS structure 11 is c3×c3, where c3 = 1.5mm~3mm; the second smallest cell unit 121 of the second TPMS structure 12 is b3×b3, where b3 = 1.5mm~3mm.

[0047] like Figures 13 to 15 As shown, by setting the first TPMS structure 11 and the second TPMS structure 12 of the above layout structure, on the one hand, the structural complexity of the entire microchannel heat dissipation structure 10 based on the TPMS structure will not be increased; on the other hand, the heat exchange capacity of the core heat source area can be better improved, and the efficiency of metal 3D printing can be improved.

[0048] Example 4 This embodiment provides a microchannel heat dissipation structure 10 based on a TPMS structure. This microchannel heat dissipation structure 10 based on a TPMS structure is basically the same as the microchannel heat dissipation structure 10 based on a TPMS structure in the first embodiment above. The difference is that: in this embodiment, the first TPMS structure 11 extends along the first direction to the outer edge of the second TPMS structure 12 on both sides of the first direction. By extending the first TPMS structure 11 with high heat transfer performance corresponding to the core heat source area along the first direction, the effective heat transfer area of ​​the core heat source area is further increased, and the heat transfer performance is further increased. This can better improve the heat transfer capability of the core heat source area, which is suitable for liquid cooling heat dissipation scenarios with higher requirements for heat dissipation performance.

[0049] Furthermore, along the second direction, the gap between the first TPMS structure 11 and the second TPMS structure 12 at the junction is a4 = 0.1 mm; at the same time, the first smallest cell unit 111 of the first TPMS structure 11 is c4 × c4, c4 = 1.5 mm ~ 3 mm; the second smallest cell unit 121 of the second TPMS structure 12 is b4 × b4, b4 = 1.5 mm ~ 3 mm.

[0050] By setting the first TPMS structure 11 and the second TPMS structure 12 in the above layout, on the one hand, the entire microchannel heat dissipation structure 10 based on the TPMS structure can be made simple and the layout is reasonable and compact; on the other hand, while taking into account the low flow resistance requirement, the heat exchange capacity of the core heat source area can be better improved, and it can help improve the metal 3D printing molding efficiency.

[0051] The above-mentioned four different TPMS-based microchannel heat dissipation structures 10 are provided to allow for flexible selection of the specific TPMS-based microchannel heat dissipation structure 10 based on different scenarios, such as heat dissipation power requirements, liquid cooling system flow conditions, and production cost control objectives. This improves the overall flexibility and applicability of the TPMS-based microchannel heat dissipation structure 10. Furthermore, the four different TPMS-based microchannel heat dissipation structures 10 are simple in structure, have a reasonable and compact layout, are easy to model, and are convenient for direct metal 3D printing. The four structures are independently designed and do not interfere with each other, and can be flexibly selected according to performance requirements, processing accuracy, production costs, and actual liquid cooling application scenarios.

[0052] Example 5 This embodiment provides a liquid cooling plate, such as Figure 25 and Figure 26As shown, the liquid cooling plate includes a base 21, a cover plate 22, and a microchannel heat dissipation structure 10 based on the TPMS structure as described in Embodiment 1, Embodiment 2, Embodiment 3, or Embodiment 4. The microchannel heat dissipation structure 10 based on the TPMS structure is disposed inside the base 21. The cover plate 22 covers the top opening 211 of the base 21 to accommodate the microchannel heat dissipation structure 10 based on the TPMS structure between the base 21 and the cover plate 22. Furthermore, the cover plate 22 is provided with an inlet 221 and an outlet 222 that are spaced apart from each other along a first direction. The inlet 221 and the outlet 222 are respectively connected to the second TPMS structure 12. The coolant enters the second TPMS structure 12 through the inlet 221 and is discharged to the outside of the microchannel heat dissipation structure 10 based on the TPMS structure through the outlet 222.

[0053] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A microchannel heat dissipation structure based on TPMS, characterized in that, include: The first TPMS structure (11) is located in the core heat source region, which corresponds to the location of the core chip with the highest heat flux density of the heat-dissipating component. The second TPMS structure (12) is located in a non-heat source area, which corresponds to the position where the core chip is not located on the heat dissipation component, and the gap of the second TPMS structure (12) is located on the outer periphery of the first TPMS structure (11); The heat transfer performance of the first TPMS structure (11) is greater than that of the second TPMS structure (12); Furthermore, the flow resistance of the second TPMS structure (12) is less than that of the first TPMS structure (11), thereby reducing the flow pressure drop of the coolant in the second TPMS structure (12).

2. The microchannel heat dissipation structure based on TPMS structure according to claim 1, characterized in that, The first TPMS structure (11) is a high heat transfer type Diamond structure or a high heat transfer type Gyroid structure; And / or, the second TPMS structure (12) is a low-flow-resistance Schwarz-P type structure.

3. The microchannel heat dissipation structure based on TPMS structure according to claim 1, characterized in that, Both the first TPMS structure (11) and the second TPMS structure (12) are flat square structures; And / or, the material of the first TPMS structure (11) and the material of the second TPMS structure (12) are both thermally conductive pure copper, and the first TPMS structure (11) and the second TPMS structure (12) are both integrated structures formed by metal 3D printing.

4. The microchannel heat dissipation structure based on TPMS structure according to any one of claims 1-3, characterized in that, The shape and size of the first TPMS structure (11) correspond to and match the shape and size of the core chip; along the first direction and the second direction, the gap between the first TPMS structure (11) and the second TPMS structure (12) at the junction is a1=0.1mm; the first direction is parallel to the flow direction of the coolant, and the second direction is perpendicular to the first direction.

5. The microchannel heat dissipation structure based on TPMS structure according to claim 4, characterized in that, The first smallest cell unit (111) of the first TPMS structure (11) is c1×c1, c1=1.5mm~3mm; the second smallest cell unit (121) of the second TPMS structure (12) is b1×b1, b1=1.5mm~3mm.

6. The microchannel heat dissipation structure based on TPMS structure according to any one of claims 1-3, characterized in that, The first TPMS structure (11) extends along the second direction to the outer edge of the second TPMS structure (12) on both sides of the second direction; and along the first direction, the gap between the first TPMS structure (11) and the second TPMS structure (12) at the junction is a2=0.1mm.

7. The microchannel heat dissipation structure based on TPMS structure according to claim 6, characterized in that, The first smallest cell unit (111) of the first TPMS structure (11) is c2×c2, c2=1.5mm~3mm; the second smallest cell unit (121) of the second TPMS structure (12) is b2×b2, b2=1.5mm~3mm.

8. The microchannel heat dissipation structure based on TPMS structure according to any one of claims 1-3, characterized in that, The first TPMS structure (11) is provided with inclined flow guiding structures (13) on opposite sides in the second direction. One of the inclined flow guiding structures (13) is inclined upward from the first TPMS structure (11) along the first inclined setting direction to the outer edge of the second TPMS structure (12). The other inclined flow guiding structure (13) is inclined downward from the first TPMS structure (11) along the second inclined setting direction to the outer edge of the second TPMS structure (12). The inclined flow guiding structure (13) is used to guide the coolant to the first TPMS structure (11). Furthermore, along the first direction, the gap between the first TPMS structure (11) and the second TPMS structure (12) at the junction, and along the second direction, the gap between the first TPMS structure (11) and the inclined flow guide structure (13) at the junction are both a31=0.1mm; along the direction perpendicular to the first inclined setting direction and along the direction perpendicular to the second inclined setting direction, the gap between the inclined flow guide structure (13) and the second TPMS structure (12) at the junction are both a32=0.1mm. The inclined flow guiding structure (13) includes a plurality of spaced flow guiding plate groups (131), each flow guiding plate group (131) includes a plurality of flow guiding plates (1311) spaced along the first inclined setting direction or the second inclined setting direction. In a flow guiding plate group (131), the ratio between the gap c0 between any two adjacent flow guiding plates (1311) and the length d of a single flow guiding plate (1311) is 1 / 3 to 1 / 6.

9. The microchannel heat dissipation structure based on TPMS structure according to claim 8, characterized in that, The first smallest cell unit (111) of the first TPMS structure (11) is c3×c3, c3=1.5mm~3mm; the second smallest cell unit (121) of the second TPMS structure (12) is b3×b3, b3=1.5mm~3mm.

10. A liquid-cooled plate, characterized in that, The device includes a base (21), a cover plate (22), and a microchannel heat dissipation structure based on a TPMS structure as described in any one of claims 1-9. The microchannel heat dissipation structure based on a TPMS structure is disposed inside the base (21). The cover plate (22) covers the top opening (211) of the base (21), and the cover plate (22) is provided with an inlet (221) and an outlet (222) spaced apart from each other along a first direction. The inlet (221) and the outlet (222) are respectively connected to the second TPMS structure (12).

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