A radial manifold three-layer shunt-shaped microchannel heat sink

Abstract

The application discloses a radial manifold three-layer shunt type hanger-shaped microchannel heat dissipation device, and belongs to the technical field of chip heat dissipation. The device comprises an upper cover plate, a shunt plate and a lower bottom plate which are sealed and stacked from top to bottom. The upper cover plate is provided with a liquid inlet in the center and first and second liquid outlets on both sides, and a radial manifold is formed in the upper cover plate for pre-distributing the cooling liquid from the center liquid inlet area to the outside. A contraction flow guide area is formed on the shunt plate, and the flow area of the contraction flow guide area is smaller than that of the upstream manifold channel, so that the fluid speed is increased and the flow is rectified. The lower bottom plate is provided with a hanger-shaped microchannel which is communicated with the contraction flow guide area, so that the cooling liquid flows along a winding and returning path to prolong the heat exchange distance. The cooling liquid is discharged from the two side liquid outlets after being pre-distributed, contracted and speeded up and heat-exchanged in the hanger-shaped microchannel. The three-layer structure cooperates to realize uniform flow distribution and sufficient heat exchange under the condition of a lower pressure drop, and effectively improves the heat dissipation efficiency and temperature uniformity in the high heat flux density scene.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and in particular to a radial manifold three-layer shunt-type U-shaped microchannel heat dissipation device. Background Technology

[0002] With the rapid development of fields such as artificial intelligence, high-speed communication, new energy vehicles, and aerospace, electronic devices are continuously evolving towards higher power density and higher integration. Chip package sizes are shrinking, while heat generation per unit area is increasing significantly, making heat dissipation a growing concern. For high-power CPUs, GPUs, power modules, and other devices, if heat cannot be dissipated in time, it will lead to increased junction temperature, performance degradation, and even reliability issues such as package aging, solder joint fatigue, and parameter drift, seriously affecting the stability and lifespan of the entire device. Therefore, developing efficient heat dissipation technologies suitable for high heat flux density scenarios has become an important research direction in the field of electronic thermal management.

[0003] Existing heat dissipation methods mainly include natural cooling, forced air cooling, heat pipes, and liquid cooling. Natural cooling and forced air cooling are limited by the low thermal conductivity and weak convective heat transfer capacity of air, making it difficult to meet the heat dissipation requirements of devices with high heat flux density. Although heat pipes have a high equivalent thermal conductivity, their transport capacity and structural adaptability are limited under conditions of complex layout, dense local heat sources, and continuous high heat flux. In contrast, liquid cooling technology, with its higher heat transfer coefficient and heat transport capacity, shows greater advantages in heat dissipation for high-power electronic devices.

[0004] Microchannel liquid cooling plates, due to their large specific surface area, compact structure, and high integration, can significantly enhance heat transfer between the fluid and the wall within a limited space, and are considered one of the important solutions for high heat flux density heat dissipation. However, traditional microchannel structures still have several problems in practical applications: First, the fluid temperature rises significantly after absorbing heat along the path, and the temperature difference between the inlet and outlet sections is large, which can easily lead to uneven temperature distribution; second, the small hydraulic diameter of the microchannel results in high flow resistance and significant pressure drop; third, under high heat flux or boiling conditions, uneven flow distribution, local drying, backflow disturbances, and air blockage may occur, weakening heat transfer stability and reducing long-term operational reliability. For scenarios with multiple heat sources or non-uniform heat sources, a single flat direct current channel often cannot simultaneously achieve heat transfer intensity, flow uniformity, and pressure drop control.

[0005] To address the aforementioned issues, it is necessary to propose a radial manifold three-layer diversion U-shaped microchannel heat dissipation device. Summary of the Invention

[0006] The purpose of this invention is to provide a radial manifold three-layer diversion U-shaped microchannel heat dissipation device. The upper manifold structure realizes fluid pre-distribution, the middle diversion plate completes flow reduction, speed increase and rectification, and the lower U-shaped microchannel realizes detour heat exchange. It aims to improve heat dissipation uniformity and heat exchange efficiency under low pressure drop conditions, and meet the heat dissipation requirements of high power chips and high heat flux density electronic devices.

[0007] To achieve the above objectives, the present invention provides the following solution: a radial manifold three-layer diversion type U-shaped microchannel heat dissipation device, comprising an upper cover plate, a diversion plate, and a lower base plate, which are sealed and stacked sequentially from top to bottom; the upper cover plate has a liquid inlet at its center and a first liquid outlet and a second liquid outlet on both sides; a radial manifold is formed inside the upper cover plate, the radial manifold including a central liquid inlet area and a plurality of diversion manifold channels radiating outward from the liquid inlet area; a flow-constricting guide area is formed on the diversion plate, the flow-constricting guide area connecting the radial manifold and the lower base plate; a U-shaped microchannel is formed inside the lower base plate, the U-shaped microchannel being connected to the flow-constricting guide area, the coolant entering the U-shaped microchannel from the flow-constricting guide area and flowing along the U-shaped path, finally being discharged through the first liquid outlet and the second liquid outlet. The flow-constricting guide area is used to reduce the flow cross-sectional area when the fluid enters the lower base plate from the radial manifold, thereby increasing the fluid velocity and rectifying and distributing the flow.

[0008] The above structure aims to propose a radial manifold three-layer diversion U-shaped microchannel heat dissipation structure. The upper manifold structure realizes fluid pre-distribution, the middle diversion plate completes flow reduction, speed increase and rectification, and the lower U-shaped microchannel realizes detour heat exchange. It aims to improve heat dissipation uniformity and heat exchange efficiency under low pressure drop conditions, and meet the heat dissipation requirements of high power chips and high heat flux density electronic devices.

[0009] Optionally, each of the branch manifold channels of the radial manifold is evenly arranged circumferentially, and the center line of each branch manifold channel is coaxial with the center line of the inlet.

[0010] Optionally, the constriction and guiding zone includes an upper transition cavity, a lower transition cavity, and a constriction channel connecting the upper transition cavity and the lower transition cavity, wherein the minimum flow cross-sectional area of ​​the constriction channel is smaller than the flow cross-sectional areas of the upper transition cavity and the lower transition cavity.

[0011] Optionally, the flow divider plate is provided with multiple flow guide holes, flow guide grooves or flow guide windows, which are distributed circumferentially to further distribute the coolant to multiple inlet sections of the U-shaped microchannel.

[0012] Optionally, the U-shaped microchannel includes an outer ring microchannel, an inner ring microchannel, and several connecting segments connecting the outer ring microchannel and the inner ring microchannel, wherein the planar projections of the outer ring microchannel and the inner ring microchannel form a U-shape.

[0013] Optionally, the inlet of the U-shaped microchannel is located on the side close to the liquid inlet, and the outlet of the U-shaped microchannel is located on the side close to the first liquid outlet and the second liquid outlet, so that the coolant forms a zigzag flow from the inlet side to the outlet side within the lower base plate.

[0014] Optionally, a plurality of turbulence columns are provided in a local area of ​​the U-shaped microchannel, which are used to disturb the fluid boundary layer near the wall and promote local turbulence.

[0015] Optionally, the turbulence column is arranged in the central region of the inner ring microchannel of the U-shaped microchannel or at the bend of the flow channel.

[0016] Optionally, the cross-sectional shape of the turbulence column is cylindrical, elliptical, or rhomboid.

[0017] Optionally, the upper cover plate, the diversion plate, and the lower base plate are all made of copper, aluminum, or copper-aluminum composite materials.

[0018] Optionally, the upper cover plate, the diverter plate, and the lower base plate are sealed together by any one of vacuum brazing, diffusion welding, laser welding, or brazing.

[0019] Optionally, the outer surface of the lower base plate is configured as a heat exchange surface that is in direct contact with the heat source.

[0020] Optionally, the meandering path of the U-shaped microchannel is a multi-turn spiral involute structure or a serpentine path with multiple turns.

[0021] Optionally, the turbulence columns are arranged non-uniformly within the U-shaped microchannel according to the local heat source distribution, with a higher density in areas with higher heat flux density.

[0022] Optionally, the first liquid outlet and the second liquid outlet are symmetrically arranged on both sides of the upper cover plate relative to the liquid inlet.

[0023] Compared with the prior art, the present invention discloses at least the following beneficial effects: This invention utilizes a three-layer sealed stacked structure consisting of an upper cover plate, a flow divider plate, and a lower base plate to construct a synergistic flow path from fluid pre-distribution and flow reduction / increase to long-range heat exchange. Specifically, the liquid inlet at the center of the upper cover plate, combined with radial manifolds, allows the coolant to radiate and diffuse uniformly from the center outwards, effectively avoiding flow segregation caused by traditional single straight-through inlets and providing a uniform inlet flow distribution downstream. The flow reduction and guiding zone on the flow divider plate, by locally reducing the flow cross-sectional area, increases the flow velocity of the fluid before entering the microchannels, enhancing the coolant's scouring ability on the heat exchange wall. At the same time, the rectification effect eliminates turbulence and flow deviation, ensuring that the fluid enters the heat exchange area in a stable flow state. The U-shaped microchannels in the lower base plate, through a meandering and reversing path design, significantly extend the flow path and effective heat exchange time of the coolant within a limited planar area, allowing for sufficient heat exchange between the fluid and the wall. The three-layer structure forms a series connection in the flow path, allowing the coolant to undergo uniform distribution, velocity increase and full heat exchange in sequence. Overall, it achieves high heat exchange efficiency and good temperature uniformity under low pressure drop conditions, effectively improving the heat dissipation performance of the heat source surface under high heat flux density conditions. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of the layered disassembly structure of the radial manifold three-layer diversion U-shaped microchannel heat dissipation device provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the upper cover plate in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the flow divider in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the spiral-shaped microchannel inside the lower base plate in an embodiment of the present invention; Attached reference numerals: 1. Top cover plate; 2. Diverter plate; 3. Bottom plate; 4. Inlet; 51. First outlet; 52. Second outlet; 6. Radial manifold; 7. Constriction guide zone; 8. U-shaped microchannel; 9. Turbulence column. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Reference Figure 1 As shown, this embodiment of the invention provides a radial manifold three-layer diversion U-shaped microchannel heat dissipation device, including an upper cover plate 1, a diversion plate 2, and a lower base plate 3 stacked and sealed from top to bottom. The upper cover plate 1, the diversion plate 2, and the lower base plate 3 together define the complete flow path of the coolant from the inlet to the outlet, which is the basis for achieving efficient and uniform heat dissipation.

[0029] Specifically, the upper cover plate 1 has a liquid inlet 4 at its center and a first liquid outlet 51 and a second liquid outlet 52 on both sides. The coolant enters the device through the central liquid inlet 4 and is discharged through the first liquid outlet 51 and the second liquid outlet 52 on both sides after heat exchange is completed.

[0030] In one specific embodiment, such as Figure 1 and Figure 2 As shown, a radial manifold 6 is formed within the upper cover plate 1. This radial manifold 6 includes a central inlet 4 and several branch manifold channels extending radially outward from the inlet area. After the coolant enters the upper cover plate 1 through the inlet 4, it first flows through the radial manifold 6. Each branch manifold channel initially guides and distributes the coolant from the center outwards. This radial pre-distribution structure allows the coolant to rapidly diffuse outwards along each manifold channel, effectively avoiding flow segregation caused by traditional single straight-through inlets. Thus, the first uniform distribution is completed at the upper cover plate 1 level before the fluid enters the downstream structure.

[0031] Based on the above embodiment, the branch manifold channels of the radial manifold 6 are uniformly arranged circumferentially, and the center line of each branch manifold channel is coaxial or approximately coaxial with the center line of the inlet 4. This symmetrical and uniform arrangement further ensures the consistency of coolant distribution in all circumferential directions and avoids flow distribution deviations that may be caused by asymmetrical arrangement of manifold channels.

[0032] Reference Figure 1 and Figure 3As shown, the flow divider 2 is disposed between the upper cover plate 1 and the lower base plate 3, and a flow-constricting guide zone 7 is formed on the flow divider 2. This flow-constricting guide zone 7 is used to reduce the flow cross-sectional area of ​​the fluid when it enters the lower base plate 3 from the radial manifold 6, thereby increasing the flow velocity of the fluid and rectifying and distributing the fluid. When the coolant from the radial manifold 6 of the upper cover plate 1 flows through the flow-constricting guide zone 7, the flow area is suddenly reduced, the flow velocity is significantly increased, and the flow direction is regulated and guided, eliminating any possible turbulence or deflection, ensuring that the coolant enters the heat exchange area of ​​the lower base plate 3 with a high flow velocity and stable flow state, and enhancing the subsequent flushing effect on the heat exchange wall surface.

[0033] In one specific embodiment, the flow-constricting and guiding zone 7 of the aforementioned flow divider 2 specifically includes an upper transition cavity, a lower transition cavity, and a constricted channel connecting the upper and lower transition cavities. The minimum flow cross-sectional area of ​​the constricted channel is designed to be smaller than the flow cross-sectional areas of the upper and lower transition cavities, thereby forming a locally contracted acceleration zone at the location of the constricted channel, which increases the velocity of the coolant flowing through it.

[0034] In another specific embodiment, the manifold 2 is provided with multiple guide holes, guide grooves, or guide windows, which are distributed circumferentially. Coolant from the radial manifold 6 is further distributed to multiple inlet sections of the U-shaped microchannel 8 via these guide structures, thereby ensuring uniform flow distribution of the coolant when entering the microchannel. The specific number, size, and distribution density of the guide holes, guide grooves, or guide windows can be optimized according to the actual required flow distribution ratio and pressure drop requirements.

[0035] Reference Figure 1 and Figure 4 As shown, a U-shaped microchannel 8 is formed within the lower base plate 3. The U-shaped microchannel 8 is connected to the constriction and guide zone 7 on the flow divider plate 2. After entering the U-shaped microchannel 8 from the constriction and guide zone 7, the coolant flows along the U-shaped path and is finally discharged through the first outlet 51 and the second outlet 52. The meandering and reversible arrangement of the U-shaped microchannel 8 significantly increases the flow path length of the coolant within the lower base plate 3, prolonging the effective heat exchange time of the coolant in the heat exchange area. This allows the coolant to absorb heat more fully, thereby effectively improving heat exchange efficiency and enhancing the temperature uniformity of the heat source surface.

[0036] In one specific embodiment, the U-shaped microchannel 8 includes an outer ring microchannel, an inner ring microchannel, and several connecting segments connecting the outer ring microchannel and the inner ring microchannel. Its overall planar projection is in the shape of a "U" or approximately "U". The coolant flows repeatedly back and forth between the outer ring microchannel and the inner ring microchannel through the connecting segments, forming a meandering long-path flow pattern. This structure effectively increases the total length of the flow channel within a limited base plate area, thereby increasing the heat exchange area per unit volume.

[0037] Based on the above embodiment, the inlet of the U-shaped microchannel 8 is located on the side closer to the liquid inlet 4, while the outlet of the U-shaped microchannel 8 is located on the side closer to the two liquid outlets (i.e., the first liquid outlet 51 and the second liquid outlet 52). This staggered arrangement of the inlet and outlet ensures that the coolant must complete a zigzag flow from the inlet side to the outlet side along the U-shaped path within the lower base plate 3, maximizing the fluid's travel distance within the heat exchange area and avoiding flow short-circuiting between the fluid inlet and outlet.

[0038] Reference Figure 4 As shown, multiple turbulence-disrupting columns 9 are also provided in a local area of ​​the U-shaped microchannel 8. These columns 9 are used to disrupt the fluid boundary layer near the wall, promote local turbulence, enhance the mixing degree of the fluid during the flow process, thereby continuously renewing the thermal boundary layer and significantly improving the local heat transfer coefficient. The height, cross-sectional shape (e.g., cylindrical, elliptical, or rhomboid column), and distribution spacing of the turbulence-disrupting columns 9 can be optimized according to the specific heat source power and allowable flow pressure drop to achieve the best balance between heat transfer performance and flow resistance.

[0039] In another specific embodiment, the aforementioned turbulence column 9 can be arranged in the central region of the inner ring microchannel of the U-shaped microchannel 8, or at the bend of the flow channel. These regions are usually flow dead zones or areas where the thermal boundary layer is thick. By setting the turbulence column 9 at these key locations, local heat transfer can be enhanced more effectively, and the uniformity of the overall temperature distribution can be improved.

[0040] Regarding the materials and connection methods of the heat dissipation device, in one specific embodiment, the upper cover plate 1, the diversion plate 2, and the lower base plate 3 are all made of highly thermally conductive metal materials. These materials can be copper, aluminum, or copper-aluminum composite materials. Using highly thermally conductive materials to create a three-layer structure facilitates the rapid conduction of heat from the heat exchange surface of the lower base plate 3 to the microchannel wall, where it is carried away by the coolant flowing through the channel.

[0041] Based on the above embodiments, the upper cover plate 1, the flow divider plate 2, and the lower base plate 3 are connected in a sealed manner to form an integral liquid cooling plate. Specifically, this sealed connection method can be any one of vacuum brazing, diffusion welding, laser welding, or regular brazing. Using these highly reliable connection methods not only ensures the sealing performance of the device under high-pressure coolant conditions and prevents coolant leakage, but also minimizes the contact thermal resistance between layers, facilitating rapid heat conduction.

[0042] Regarding the heat exchange surface of the lower base plate 3, in one specific embodiment, the outer surface of the lower base plate 3 is configured to be in direct contact with the heat source (e.g., a high-power CPU, GPU, or IGBT power module). The bottom and sidewalls of the U-shaped microchannel 8 are directly subjected to the scouring of the coolant flowing through the channel. Heat is efficiently conducted from the heat source through the bottom surface of the lower base plate 3 to the microchannel wall, and then transferred to the coolant, achieving an efficient heat transfer path.

[0043] This invention also provides a method for heat dissipation using the above-described liquid cooling plate. In one specific embodiment, the heat dissipation method includes the following steps: First, the coolant enters the radial manifold 6 inside the upper cover plate 1 through the inlet 4, and is initially distributed within the radial manifold 6.

[0044] Then, the coolant flows through the constriction and guide zone 7 of the distributor plate 2, where the flow velocity is increased and secondary distribution is carried out.

[0045] Next, the coolant enters the U-shaped microchannel 8 in the lower base plate 3 and flows in a meandering manner along the U-shaped path, thereby increasing the effective heat exchange time of the coolant in the heat exchange area.

[0046] Finally, the coolant, after heat exchange, is discharged from the first outlet 51 and the second outlet 52 on both sides. The entire process achieves efficient heat dissipation from the heat source.

[0047] Based on the above heat dissipation methods, the coolant used can be deionized water, ethylene glycol aqueous solution, dielectric coolant, or other working fluids suitable for liquid cooling. The specific coolant selection can be determined comprehensively based on factors such as thermal conductivity, insulation performance, operating temperature range, and corrosion resistance requirements in the actual application scenario. For example, in environments with high requirements for electrical insulation, dielectric coolant can be used as the working fluid.

[0048] Throughout the entire operation, the coolant undergoes a synergistic heat dissipation path within the device: pre-distribution – constriction and acceleration – long-range heat transfer. The radial manifold 6 ensures initial uniformity of fluid distribution, the constriction and flow guiding zone 7 of the flow divider 2 increases local flow velocity and smooths the flow, the U-shaped microchannel 8 provides a sufficiently long effective heat transfer path, and the turbulence column 9 further disrupts the thermal boundary layer. These structural layers work together to achieve high overall heat transfer performance and good temperature uniformity under relatively low pressure drop conditions.

[0049] In another specific embodiment, the meandering and reversing arrangement of the U-shaped microchannel 8 can be modified according to actual heat dissipation requirements. For example, it can be designed as a multi-turn spiral involute structure or a serpentine path with multiple reversals. As long as its core function is to extend the flow path of the fluid within a limited area to increase the heat exchange time, it falls within the scope of this invention. At the same time, the turbulence columns 9 can also be arranged non-uniformly according to the location of local hot spots, that is, more densely packed turbulence columns 9 can be arranged in areas with higher heat flux density to achieve intelligent local heat exchange enhancement.

[0050] The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device provided in this invention has the following advantages compared with the prior art: First, the radial manifold structure inside the top cover plate can effectively pre-distribute the coolant, significantly improving the flow concentration problem in the traditional single inlet method and enhancing the flow uniformity between downstream flow paths.

[0051] Secondly, the flow divider plate located between the upper cover plate and the lower bottom plate increases the local flow velocity of the coolant when it enters the microchannel through the effects of flow reduction, speed increase and rectification, thereby enhancing the fluid's ability to scour the heat exchange wall and thus strengthening the local heat exchange effect.

[0052] Meanwhile, the meandering and reversible arrangement of the U-shaped microchannels inside the bottom plate effectively extends the flow path of the fluid in the heat exchange area, increases the contact time between the coolant and the wall, and the heat exchange area, so that the coolant can carry away heat more fully.

[0053] The three-layer structure forms a series connection along the fluid flow path, which together realizes the synergistic enhancement mechanism of "uniform distribution - local acceleration - long-range heat transfer". This allows the entire device to maintain a low flow pressure drop while taking into account high heat transfer efficiency and flow stability. It has good engineering application value and is especially suitable for the heat dissipation needs of high-power chips and high heat flux density electronic devices.

[0054] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0055] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A radial manifold three-layer diversion type U-shaped microchannel heat dissipation device, characterized in that, The system comprises a top cover plate (1), a diversion plate (2), and a bottom plate (3) that are sealed and stacked sequentially from top to bottom. The top cover plate (1) has a liquid inlet (4) at its center and a first liquid outlet (51) and a second liquid outlet (52) on both sides. A radial manifold (6) is formed within the top cover plate (1). The radial manifold (6) includes a central liquid inlet area and several diversion manifold channels extending radially outward from the liquid inlet area. The diversion plate (2) is formed with… There is a constriction and flow guiding zone (7), which connects the radial manifold (6) and the lower base plate (3); a U-shaped microchannel (8) is formed in the lower base plate (3), which is connected to the constriction and flow guiding zone (7). The coolant enters the U-shaped microchannel (8) from the constriction and flow guiding zone (7) and flows along the U-shaped path, and is finally discharged through the first outlet (51) and the second outlet (52).

2. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The radial manifold (6) has its branch manifold channels arranged uniformly in the circumferential direction, and the center line of each branch manifold channel is coaxial with the center line of the liquid inlet (4).

3. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The narrowing and guiding zone (7) includes an upper transition cavity, a lower transition cavity, and a narrowing channel connecting the upper transition cavity and the lower transition cavity. The minimum flow cross-sectional area of ​​the narrowing channel is smaller than the flow cross-sectional areas of the upper transition cavity and the lower transition cavity.

4. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The flow divider plate (2) is provided with multiple flow guide holes, flow guide grooves or flow guide windows, which are distributed circumferentially to further distribute the coolant to multiple inlet sections of the U-shaped microchannel (8).

5. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The U-shaped microchannel (8) includes an outer ring microchannel, an inner ring microchannel, and several connecting segments connecting the outer ring microchannel and the inner ring microchannel. The planar projections of the outer ring microchannel and the inner ring microchannel are U-shaped.

6. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 5, characterized in that, The inlet of the U-shaped microchannel (8) is located on the side close to the liquid inlet (4), and the outlet of the U-shaped microchannel (8) is located on the side close to the first liquid outlet (51) and the second liquid outlet (52), so that the coolant forms a zigzag flow from the inlet side to the outlet side in the lower base plate (3).

7. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The local area of ​​the U-shaped microchannel (8) is provided with multiple turbulence columns (9), which are used to disturb the fluid boundary layer near the wall and promote local turbulence.

8. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 7, characterized in that, The turbulence column (9) is arranged in the central area of ​​the inner ring microchannel of the U-shaped microchannel (8) or at the bend of the flow channel.

9. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 7, characterized in that, The cross-sectional shape of the turbulence column (9) is cylindrical, elliptical, or rhomboid.

10. The radial manifold three-layer diversion type U-shaped microchannel heat dissipation device according to claim 1, characterized in that, The upper cover plate (1), the diversion plate (2) and the lower base plate (3) are all made of copper, aluminum or copper-aluminum composite material.

Images