Electronic device and method of manufacturing an electronic device

Abstract

Electronic devices and methods of manufacturing electronic devices. In one example, an electronic device includes a substrate including a first side and a second side. An antenna structure includes an antenna feed structure connected to the first side and an antenna pattern. An encapsulant covers the antenna feed structure and the first side and includes an outer side and a recess extending inward from the outer side. The recess includes an underside below the outer side. The antenna feed structure includes a first antenna feed structure and a second antenna feed structure. The antenna pattern includes a first antenna pattern adjacent to the underside and connected to the first antenna feed structure and a second antenna pattern adjacent to the outer side and coupled to the second antenna feed structure. An electronic component is connected to the substrate at the second side and coupled to the antenna feed structure. Other examples and related methods are also disclosed herein.

Description

Technical Field

[0001] This disclosure generally relates to electronic devices, and more specifically to semiconductor devices and methods of manufacturing semiconductor devices. Background Technology

[0002] Previous semiconductor packaging methods and methods for forming semiconductor packages are unsuitable, for example, resulting in excessive costs, reduced reliability, relatively low performance, or excessively large package sizes. By comparing such methods with this disclosure and referring to the drawings, those skilled in the art will understand other limitations and disadvantages of conventional and traditional methods. Summary of the Invention

[0003] This specification relates to an electronic device comprising: a substrate including: a first side of the substrate; a second side of the substrate opposite to the first side of the substrate; and a conductive structure; an antenna structure including: an antenna feed structure coupled to the first side of the substrate; and antenna patterns, each antenna pattern coupled to one of the antenna feed structures; a top enclosure covering the antenna feed structure and the first side of the substrate and including: an outer side of the top enclosure; and a first recess extending from the top... The encapsulation extends inward from the outer side, and the first recess includes a lower side of the first recess below the outer side of the top encapsulation, wherein: the antenna feed structure includes a first antenna feed structure and a second antenna feed structure; and the antenna pattern includes: a first antenna pattern adjacent to the lower side of the first recess and coupled to the first antenna feed structure; and a second antenna pattern adjacent to the outer side of the top encapsulation and coupled to the second antenna feed structure; and an electronic component coupled to the substrate and coupled to the antenna feed structure at the second side of the substrate. The electronic device further includes: an external interconnect; and a bottom encapsulation covering portions of the electronic component, the second side of the substrate, and the external interconnect. In the electronic device, the first antenna feed structure includes a molded antenna feed structure, the molded antenna feed structure including a first conductive feed portion embedded in a dielectric. In the electronic device, the molded antenna feed structure includes a second conductive feed portion embedded in the dielectric; and the antenna pattern includes a third conductive pattern coupled to the second conductive feed portion. In the electronic device, the molded antenna feed structure includes a second conductive feed portion embedded in the dielectric and coupled to the first antenna pattern. In the electronic device, the first antenna feed structure includes a preformed pillar antenna feed structure. In the electronic device, the first antenna feed structure includes a plated pillar antenna feed structure. In the electronic device, the first antenna feed structure includes a wire antenna feed structure. In the electronic device, the first antenna feed structure and the second antenna feed structure include different antenna feed structures.The electronic device further includes: a plurality of recesses extending inwardly from the outside of the top encapsulation, including: a first recess, wherein a lower side of the first recess extends to a first depth below the outside of the top encapsulation; and a second recess extending inwardly from the outside of the top encapsulation, the second recess including a lower side extending to a second depth different from the first depth below the outside of the top encapsulation; a third antenna feed structure coupled to a first side of the substrate and covered by the top encapsulation; and a third antenna pattern adjacent to the lower side of the second recess and coupled to the third antenna feed structure, wherein the electronic device includes a multi-band antenna.

[0004] In an example, an electronic device includes: a substrate comprising: a first side of the substrate; a second side of the substrate opposite to the first side of the substrate; a dielectric structure; and a conductive structure within the dielectric structure; a plurality of antenna feed structures coupled to the conductive structure at the first side of the substrate, and including a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure; a top enclosure covering the plurality of antenna feed structures and the first side of the substrate and including: an outer side of the top enclosure; and a plurality of recessed regions extending inwardly from the outer side of the top enclosure. The device includes a first recessed region, a second recessed region, and a third recessed region, wherein the first recessed region includes a first lower side, the second recessed region includes a second lower side, and the third recessed region includes a third lower side; a plurality of antenna patterns, including a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, and a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure; an electronic component coupled to the conductive structure at a second side of the substrate; and a bottom encapsulation covering the electronic component and the second side of the substrate. In the electronic device, the plurality of recessed regions include steps, each step including an increasing thickness from a first side of the electronic device to an opposite second side of the electronic device, wherein: the first recessed region defines a first step; the second recessed region defines a second step; the third recessed region defines a third step; and the outer side of the top encapsulation defines a fourth step. In the electronic device, the plurality of antenna feed structures include a fourth antenna feed structure; and the plurality of antenna patterns include a fourth antenna pattern on the fourth step and coupled to the fourth antenna feed structure. In the electronic device, one or more of the first antenna pattern, the second antenna pattern, or the third antenna pattern are embedded within the top encapsulation. The electronic device further includes an external interconnect coupled to the conductive structure at a second side of the substrate, wherein the bottom encapsulation covers a first portion of the external interconnect, and a second portion of the external interconnect protrudes outward from the bottom encapsulation.

[0005] In an example, a method of manufacturing an electronic device includes: providing a substrate, the substrate including: a first side of the substrate; a second side of the substrate opposite to the first side of the substrate; a dielectric structure; and a conductive structure within the dielectric structure; providing a plurality of antenna feed structures coupled to the conductive structure at the first side of the substrate, and including a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure; providing a top enclosure covering the plurality of antenna feed structures and the first side of the substrate and including: an outer side of the top enclosure; and a plurality of recessed regions extending inward from the outer side of the top enclosure. The device extends and includes a first recessed region, a second recessed region, and a third recessed region, the first recessed region including a first lower side, the second recessed region including a second lower side, and the third recessed region including a third lower side; provides a plurality of antenna patterns, the plurality of antenna patterns including a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, and a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure; provides an electronic component coupled to the conductive structure at a second side of the substrate; and provides a bottom encapsulation covering the electronic component and the second side of the substrate. In the method, providing the top encapsulation includes providing the plurality of recessed regions including steps, each step including an increasing thickness from a first side of the electronic device to an opposite second side of the electronic device, wherein: the first recessed region defines a first step; the second recessed region defines a second step; the third recessed region defines a third step; and the outer side of the top encapsulation defines a fourth step. In the method, providing the plurality of antenna feed structures includes providing a fourth antenna feed structure; and providing the plurality of antenna patterns includes providing a fourth antenna pattern on the fourth step and coupled to the fourth antenna feed structure. In the method, providing the plurality of antenna patterns includes providing one or more of the first antenna pattern, the second antenna pattern, or the third antenna pattern embedded within the top encapsulation. The method further includes providing an external interconnect coupled to the conductive structure at a second side of the substrate, wherein: the bottom encapsulation includes a first portion covering the external interconnect, and a second portion of the external interconnect protrudes outward from the bottom encapsulation. Attached Figure Description

[0006] Figure 1 A cross-sectional view of an example electronic device is shown.

[0007] Figure 2A , Figure 2B , Figure 2C , Figure 2D and Figure 2E A cross-sectional view is shown of an example method for manufacturing an example electronic device.

[0008] Figure 3 A cross-sectional view of an example electronic device is shown.

[0009] Figure 4A , Figure 4B , Figure 4C , Figure 4D and Figure 4E A cross-sectional view is shown of an example method for manufacturing an example electronic device.

[0010] Figure 5 A cross-sectional view of an example electronic device is shown.

[0011] The following discussion presents various examples of semiconductor devices and methods of manufacturing semiconductor devices. These examples are not limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0012] The figures illustrate general construction methods and may omit descriptions and details of well-known features and techniques to avoid unnecessarily obscuring this disclosure. Elements in the figures are not necessarily drawn to scale. For example, some elements in the figures may be enlarged relative to other elements to aid in understanding the examples discussed in this disclosure. The same reference numerals in different figures denote the same elements.

[0013] The term "or" refers to any one or more items in a list connected by "or". As an example, "x or y" means any element in the three-element set {(x), (y), (x, y)}. As another example, "x, y or z" means any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}.

[0014] The terms “comprises / comprising” and “includes / including” are “open” terms that specify the presence of the stated feature but do not exclude the presence or addition of one or more other features.

[0015] Various elements may be described using terms such as "first," "second," etc., and these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, for example, without departing from the teachings of this disclosure, the first element discussed in this disclosure may be referred to as the second element.

[0016] Unless otherwise specified, the term "coupled" can be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly connected by one or more other elements. For example, if element A is coupled to element B, then element A can be in direct contact with element B or indirectly connected to element B by intervening element C. Similarly, the terms "above" or "on" can be used to describe two elements that are in direct contact with each other or to describe two elements that are indirectly connected by one or more other elements. Unless otherwise specified, the term "coupled" can refer to mechanical coupling or electrical coupling. Detailed Implementation

[0017] Wireless and portable handheld communication applications are examples of applications that continue to grow and evolve as efforts increase to integrate more electronic functionality into smaller, lighter, thinner, and lower-cost solutions. One of the ongoing challenges for these applications is improving and integrating effective antennas, such as multi-band antennas, into various product platforms to support applications such as 5G NR millimeter-wave (mmWave) and sub-6 GHz RF modules for smartphones or other mobile devices. Such platforms can include, for example, antenna-in-package (AiP) or antenna-on-package (AoP) configurations.

[0018] Among other features, this specification also includes structures and associated methods for electronic devices using integrated antenna structures such as multi-band AiP or AoP structures. More specifically, structures and methods incorporating recessed or stepped encapsulation structures to support multiple bands within a single package are described. These methods and structures provide improved grounding, improved beam control, and better separation between frequency bands. Furthermore, the structures and methods in this specification incorporate existing manufacturing techniques, resulting in cost savings.

[0019] In one example, an electronic device includes a substrate comprising a first side of the substrate, a second side of the substrate opposite to the first side of the substrate, and a conductive structure. An antenna structure includes an antenna feed structure coupled to the first side of the substrate and antenna patterns each coupled to one of the antenna feed structures. A top encapsulation covers the antenna feed structures and the first side of the substrate, and includes an outer side of the top encapsulation and a first recess extending inwardly from the outer side of the top encapsulation. The first recess includes a lower side below the outer side of the top encapsulation. The antenna feed structures include a first antenna feed structure and a second antenna feed structure. The antenna patterns include a first antenna pattern adjacent to the lower side of the first recess and coupled to the first antenna feed structure, and a second antenna pattern adjacent to the outer side of the top encapsulation and coupled to the second antenna feed structure. An electronic component is coupled to the substrate and to the antenna feed structure at the second side of the substrate.

[0020] In one example, an electronic device includes a substrate comprising a first side of the substrate, a second side of the substrate opposite to the first side, a dielectric structure, and a conductive structure within the dielectric structure. A plurality of antenna feed structures are coupled to the conductive structure at the first side of the substrate and include a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure. A top encapsulation covers the plurality of antenna feed structures and the first side of the substrate and includes an outer side of the top encapsulation and a plurality of recessed regions extending inward from the outer side of the top encapsulation and including a first recessed region, a second recessed region, and a third recessed region, the first recessed region including a first lower side, the second recessed region including a second lower side, and the third recessed region including a third lower side. A plurality of antenna patterns include a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, and a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure. Electronic components are coupled to the conductive structure at the second side of the substrate. The bottom encapsulation covers the electronic components and the second side of the substrate.

[0021] In one example, a method of manufacturing an electronic device includes providing a substrate comprising a first side of the substrate, a second side of the substrate opposite to the first side of the substrate, a dielectric structure, and a conductive structure within the dielectric structure. The method includes providing a plurality of antenna feed structures coupled to the conductive structure at the first side of the substrate, and including a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure. The method includes providing a top encapsulation covering the plurality of antenna feed structures and the first side of the substrate, and including an outer side of the top encapsulation and a plurality of recessed regions extending inwardly from the outer side of the top encapsulation and including a first recessed region, a second recessed region, and a third recessed region, the first recessed region including a first lower side, the second recessed region including a second lower side, and the third recessed region including a third lower side. The method includes providing a plurality of antenna patterns, including a first antenna pattern adjacent to a first lower side and coupled to a first antenna feed structure, a second antenna pattern adjacent to a second lower side and coupled to a second antenna feed structure, and a third antenna pattern adjacent to a third lower side and coupled to a third antenna feed structure. The method also includes providing an electronic component coupled to a conductive structure at a second side of a substrate. Finally, the method includes providing a bottom encapsulation covering the electronic component and the second side of the substrate.

[0022] This disclosure contains other examples. Such examples can be found in the figures, claims, or description of this disclosure.

[0023] Figure 1 A cross-sectional view of an example electronic device 100 is shown. In this example, electronic device 100 is provided in an example AiP / AoP configuration. Figure 1In the example shown, electronic device 100 may include substrate 110, electronic component 120, electronic component 120a, top enclosure 130, bottom enclosure 140, antenna 150, and external interconnect 160. Antenna 150 may include one or more antenna structures.

[0024] In some instances, substrate 110 may include a first side 111, a second side 112 opposite to the first side 111, a lateral side 115 connecting the first side 111 to the second side 112, a dielectric structure 113, and a conductive structure 114. Conductive structure 114 may include component terminals 114a, external interconnect terminals 114b, and antenna terminals 114c. The first side 111 may include, or be referred to as a first side of the substrate, and the second side 112 may include, or be referred to as a second side of the substrate.

[0025] In some instances, electronic component 120 may include a first side 121, a second side 122 opposite to the first side 121, a contact pad 123 adjacent to the first side 121, and a connector 124 coupling electronic component 120 to component terminal 114a. In some instances, electronic component 120a may include contact pad 123 and connector 124 coupling electronic component 120a to component terminal 114a.

[0026] The top encapsulation 130 is located above the second side 112 of the substrate 110 and may include a top encapsulation outer side 131, a top encapsulation inner side 132 opposite to the top encapsulation outer side 131, and a top encapsulation lateral side 133 connecting the top encapsulation outer side 131 to the top encapsulation inner side 132. In this example, the top encapsulation outer side 131 is located away from the second side 112 of the substrate 110, and the top encapsulation inner side 132 is located close to the second side 112 of the substrate 110. In this example, the top encapsulation 130 includes a thickness that varies in its lateral width. According to this specification, this variation in thickness is determined based on the operating frequencies of the different antennas 150 of the electronic device 100. In some examples, recesses 130a extending inward from the top encapsulation outer side 131 may be provided, such that the top encapsulation 130 includes varying degrees of thin and thick portions. In this example, each of the recesses 130a includes a lower side below the top encapsulation outer side 131. It should be understood that the lower side of the recess 130a may be in different locations and include different depths below the outer side 131 of the top encapsulation. The recess 130a is an example of a plurality of recessed areas extending inward from the outer side 131 of the top encapsulation.

[0027] In some instances, the external interconnect 160 is coupled to an external interconnect terminal 114b adjacent to a first side 111 of the substrate 110. In some instances, a bottom encapsulation 140 is adjacent to the first side 111 of the substrate 110 and may cover the exposed portions of the electronic component 120, electronic component 120a, the second side 112 of the substrate 110, and portions of the external interconnect 160. The bottom encapsulation 140 may include an inner bottom encapsulation 141, an outer bottom encapsulation 142 opposite to the inner bottom encapsulation 141, and a lateral side 143 connecting the inner bottom encapsulation 141 to the outer bottom encapsulation 142. In this example, the inner bottom encapsulation 141 is adjacent to the first side 111 of the substrate 110, and the outer bottom encapsulation 142 is away from the first side 111 of the substrate 110. In this example, a portion of the external interconnect 160 is exposed from and protrudes outward from the outer side 142 of the bottom enclosure (e.g., downward or upward depending on the orientation of the electronics 100), the outer side of the bottom enclosure being positioned inward relative to the lower end region of the external interconnect 160.

[0028] Antenna 150 may include an antenna feed structure 151 and an antenna pattern 153. In some instances, the antenna pattern 153 is above the outer side 131 of the top enclosure or within a recess 130a of the top enclosure 130. In this example, the antenna feed structure 151 may include different configurations, including, but not limited to, a molded antenna feed structure 151a covered by a dielectric 152, a preformed pillar antenna feed structure 151b, a plated pillar antenna feed structure 151c, or a wire antenna feed structure 151d. In some instances, the proximal end of the antenna feed structure 151 is coupled to an antenna terminal 114c adjacent to a second side 112 of the substrate 110. In some instances, the proximal end of the molded antenna feed structure 151a or the preformed pillar antenna feed structure 151b is coupled to the antenna terminal 114c using a conductive interface material 161 (e.g., solder). The antenna feed structure 151 is configured to transmit and receive signals between the electronic components 120, electronic components 120a and antenna pattern 153 via the conductive structure 114 of the substrate 110.

[0029] In this example, the electronic device 100 may be provided with individual antenna patterns 153, including, for example, antenna patterns 153a, 153b, 153c, 153d, 153e, 153f, and 153g. It should be understood that antenna patterns 153 can be extended to... Figure 1 The radiation pattern may be the same or different depending on whether it is inside or outside the cross-sectional view of the electronic device 100, and depending on the operating frequency requirements of the electronic device 100.

[0030] In some instances, the top enclosure 130 covers the lateral or side portions of the antenna feed structure 151 (or the dielectric 152 of the molded antenna feed structure 151a), and the distal end of the antenna feed structure 151 may be exposed from the outside of the top enclosure 131 and coupled to the antenna pattern 153. In some instances, each antenna feed structure 151 is coupled to a single one of the antenna patterns 153 (e.g., antenna patterns 153a, 153b, 153c, 153d, 153e) to provide a multi-band antenna configuration.

[0031] The substrate 110, top encapsulation 130, bottom encapsulation 140, and external interconnects 160 can be referred to as a semiconductor package, and the package protects the electronic components 120, 120a, and antenna feed structure 151 from external components and / or external exposure. The semiconductor package can provide electrical coupling between the electronic components 120, 120a, and antenna 150, and between the electronic device 100 and external electronic components.

[0032] Figure 2A , Figure 2B , Figure 2C , Figure 2D and Figure 2E A cross-sectional view is shown of an example method for manufacturing an electronic device, such as electronic device 100.

[0033] Figure 2A A cross-sectional view of the electronic device 100 during its early manufacturing stages is shown. Figure 2A In the illustrated example, a substrate 110 may be provided. In some embodiments, the substrate 110 may include a first side 111, a second side 112 opposite to the first side 111, a lateral side 115 connecting the first side 111 to the second side 112, a dielectric structure 113 between the first side 111 and the second side 112, and a conductive structure 114 between the first side 111 and the second side 112. The first side 111 may be the lower (or upper) side of the dielectric structure 113. The second side 112 may be the upper (or lower) side of the dielectric structure 113.

[0034] The dielectric structure 113 may include one or more layers of dielectric material interleaved between the layers of the conductive structure 114. The dielectric structure 113 may include, or be referred to as, a dielectric, an insulator, or a passivation. In some instances, the dielectric structure 113 may include polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), resin, Ajinomoto film (ABF), epoxy resin, or ceramic.

[0035] Conductive structure 114 may include one or more conductive layers defining signal distribution elements. Signal distribution elements may include, or be referred to as, traces, vias, pads, conductive paths, and under-bump metal (UBM). In some instances, conductive structure 114 may include copper, copper alloys, aluminum, aluminum alloys, gold, gold alloys, silver, silver alloys, nickel, nickel alloys, palladium, palladium alloys, tin-silver, combinations thereof, or other conductive materials known to those skilled in the art.

[0036] In some instances, conductive structure 114 may include component terminals 114a. Component terminals 114a may be exposed at a first side 111 of substrate 110. Electronic components 120 and 120a may then be coupled to component terminals 114a. Component terminals 114a may include, or be referred to as, pads, connection pads, UBMs, or pillars. Conductive structure 114 may include external interconnect terminals 114b exposed at the first side 111 to which external interconnects 160 may then be coupled. External interconnect terminals 114b may include, or be referred to as, pads, connection pads, UBMs, or pillars. Conductive structure 114 may further include antenna terminals 114c exposed at a second side 112 of substrate 110. Antenna 150 may then be coupled to antenna terminals 114c. Conductive structure 114 provides horizontal and vertical electrical interconnects through dielectric structure 113. Conductive structure 114 provides electrical interconnects between component terminals 114a, external interconnect terminals 114b, and antenna terminals 114c.

[0037] In some instances, the exposed area of ​​component terminal 114a or external interconnect terminal 114b may be coplanar with the first side 111 of dielectric structure 113. In other instances, the exposed area of ​​component terminal 114a or external interconnect terminal 114b may be located at a location different from (e.g., above or below) the first side 111.

[0038] In some instances, the total thickness of the substrate 110 can range from about 10 μm to about 2000 μm. In this way, the substrate 110, including the dielectric structure 113 and the conductive structure 114, can be configured to support the electronic components 120, 120a and the antenna 150, while interconnecting the electronic components 120, 120a and the antenna 150 to external devices.

[0039] In some instances, substrate 110 may be a preformed (or laminated) substrate. The preformed substrate may be fabricated prior to attachment to an electronic device and may include a dielectric layer between corresponding conductive layers. In some instances, the conductive layer may include copper and may be formed using an electroplating process. The dielectric layer may be a relatively thick, non-photographically definable layer and may be attached in the form of a preformed film rather than a liquid, and may contain a resin with fillers such as strands, fabrics, or other inorganic particles for rigid or structural support. Because the dielectric layer is not photographically imageable, features such as vias or openings can be formed using drilling or lasers. In some instances, the dielectric layer may include a prepreg material or an ajinomoto deposited film (ABF). The preformed substrate may include a permanent core structure or carrier, such as a dielectric material comprising bismaleimide triazine (BT) or FR4, and the dielectric and conductive layers may be formed on the permanent core structure. In other examples, the preformed substrate may be a coreless substrate omitting the permanent core structure, and the dielectric and conductive layers may be formed on a sacrificial carrier, which is removed after the dielectric and conductive layers are formed and before attachment to an electronic device. The preformed substrate may be referred to as a printed circuit board (PCB) or a laminated substrate. Such preformed substrates can be formed using semi-additive or modified semi-additive processes.

[0040] In some instances, substrate 110 may be a redistribution layer (“RDL”) substrate. The RDL substrate may include (a) one or more conductive redistribution layers and one or more dielectric layers that may be formed layer-by-layer over an electronic device coupled to the RDL substrate, or (b) over a carrier that may be completely or at least partially removed after the electronic device and the RDL substrate are coupled together. The RDL substrate may be fabricated layer-by-layer on a circular wafer using a wafer-level process as a wafer-level substrate, or layer-by-layer on a rectangular or square panel carrier using a panel-level process as a panel-level substrate. The RDL substrate may be formed using an additive stacking process and may include one or more dielectric layers stacked alternately with one or more conductive layers, defining corresponding conductive redistribution patterns or traces configured to collectively (a) fan out of the occupied area of ​​the electronic device and / or (b) fan in into the occupied area of ​​the electronic device. The conductive patterns may be formed using plating processes such as electroplating or electroless plating. The conductive patterns may contain conductive materials, such as copper or other platingable metals. The location of conductive patterns can be created using photolithography processes, such as photolithography and photoresist materials used to form photomasks. The dielectric layer of an RDL substrate can be patterned using photolithography processes, which may include a photomask where light is exposed to desired features of the photopattern, such as vias in the dielectric layer. Therefore, the dielectric layer can be made of photodeterminable organic dielectric materials such as polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), resin, or ajinomoto deposited film (ABF). Such dielectric materials can be spin-coated or otherwise coated in liquid form, rather than attached as a preform. To allow the desired photodeterminable features to be properly formed, such photodeterminable dielectric materials may omit structural reinforcing agents, or may be filler-free, and free of strands, fabrics, or other particles that could interfere with light from the photopatterning process. In some instances, this filler-free characteristic of filler-free dielectric materials can result in a reduced thickness of the resulting dielectric layer. Although the photodeterminable dielectric material described above can be an organic material, in other instances, the dielectric material of the RDL substrate can include one or more inorganic dielectric layers. Some examples of inorganic dielectric layers can include silicon nitride (Si3N4), silicon oxide (SiO2), and / or silicon oxynitride (SiON). The inorganic dielectric layer may be formed not by using a photodeterminable organic dielectric material, but by growing the inorganic dielectric layer using an oxidation or nitridation process. Such inorganic dielectric layers can be filler-free, without strands, fabrics, or other different inorganic particles. In some instances, the RDL substrate may omit the permanent core structure typically associated with a preformed laminate substrate (e.g., a dielectric core comprising bismaleimide triazine (BT) or FR4).

[0041] Figure 2BA cross-sectional view of the electronic device 100 at a later stage of manufacturing is shown. Figure 2B In the example shown, electronic component 120 may be disposed on a first side 111 of substrate 110. In some examples, electronic component 120 may be coupled to a conductive structure 114 of substrate 110. For example, electronic component 120 may be coupled to component terminal 114a using connector 124.

[0042] In some instances, electronic component 120 may each include, or be referred to as, one or more dies, chips, or packages. In some instances, electronic component 120 may include memory, a digital signal processor (DSP), a microprocessor, a network processor, a power management processor, an audio processor, RF circuitry, a wireless baseband system-on-a-chip (SoC) processor, a sensor, or an application-specific integrated circuit (ASIC). Electronic component 120 may have variable dimensions.

[0043] Electronic component 120 includes a first side 121 and a second side 122 opposite to the first side 121. In some instances, the first side 121 may include an active side, and the second side 122 may be an active side or a non-active side.

[0044] In some instances, electronic component 120 may include contact pads 123 above a first side 121 and connectors 124 coupling the contact pads 123 to component terminals 114a. Contact pads 123 may be positioned adjacent to the first side 121 of electronic component 120 and spaced apart from each other in a row or column direction. Contact pads 123 may be referred to as bonding pads, pads, or UBM pads, and may be exposed by an inorganic material (e.g., SiO2 or Si3N4) or as redistribution layer (RDL) pads exposed by a dielectric layer.

[0045] In some instances, connector 124 may include, or be referred to as, component interconnects, component terminals, bumps, posts, pads, or solder balls. Connector 124 may be configured as an electrical contact between electronic component 120 and substrate 110. Connector 124 may be coupled to conductive structure 114. For example, connector 124 may be coupled to component terminals 114a of conductive structure 114 via a large-scale reflow process, thermocompression process, or laser bonding process. In some instances, connector 124 may include copper (Cu), lead (Pb), tin (Sn), aluminum (Al), palladium (Pd), titanium (Ti), tungsten (W), titanium / tungsten (Ti / W), nickel (Ni), gold (Au), or silver (Ag). In other instances, connector 124 may be disposed on the first side 121 of electronic component 120 via electroplating, electroless plating, sputtering, PVD, CVD, MOCVD, ALD, LPCVD, or PECVD. For example, after providing a photoresist pattern for exposing the contact pads 123 of the electronic component 120, a connector 124 can be provided to contact the exposed contact pads 123 on a first side 121 of the electronic component 120. In some instances, the thickness of the connector 124 can be in the range of about 1 μm to about 2 μm, and the width and pitch of the connector 124 can be in the range of about 5 μm to about 10 μm.

[0046] In some instances, the pick-and-place device can pick up the electronic component 120 and place it on a first side 111 of the substrate 110. The connector 124 of the electronic component 120 can be located on a component terminal 114a of the substrate 110. In some instances, the overall thickness of the electronic component 120 can range from about 0.3 mm to about 9 mm, and the area of ​​the electronic component 120 can range from about 0.5 mm x 0.5 mm to about 70 mm x 70 mm.

[0047] In some instances, electronic component 120a may be disposed on a first side 111 of substrate 110. Electronic component 120a may include contact pads 123 and connectors 124. In some instances, electronic component 120a, contact pads 123, and connectors 124 may have corresponding elements, features, materials, or manufacturing methods similar to those of electronic component 120. Electronic component 120a may include, or be referred to as, a die, chip, package, or passive component. For example, electronic component 120a may include a capacitor, resistor, or inductor. In some instances, electronic component 120a may include an active die or package containing active and / or passive devices. In some instances, the thickness of electronic component 120a may range from about 50 μm to about 2000 μm. Electronic component 120a may be attached to substrate 110 in a manner similar to that described with respect to attaching electronic component 120.

[0048] External interconnect 160 may be coupled to external interconnect terminals 114b of conductive structure 114. In some instances, external interconnect 160 may include solder balls, bumps, pillars, posts, solder-coated copper core balls, wires, or any other suitable interconnect structure. The width of external interconnect 160 may range from about 0.01 mm to about 10 mm. External interconnect 160 may be configured to couple electronic device 100 to next-level components or external devices.

[0049] A bottom encapsulation 140 may be disposed over a first side 111 of the substrate 110, electronic components 120, electronic components 120a, and external interconnects 160. The bottom encapsulation 140 may cover and / or contact the first side 111 of the substrate 110, electronic components 120, electronic components 120a, and external interconnects 160. The bottom encapsulation 140 may include an inner bottom encapsulation 141, an outer bottom encapsulation 142 opposite to the inner bottom encapsulation 141, and a lateral side 143 connecting the inner bottom encapsulation 141 to the outer bottom encapsulation 142. In this example, the inner bottom encapsulation 141 is adjacent to the first side 111 of the substrate 110, and the outer bottom encapsulation 142 is distant from the first side 111 of the substrate 110. In this example, a portion of the external interconnect 160 is exposed from the outer side 142 of the bottom enclosure and protrudes outward from the outer side 142 of the bottom enclosure (e.g., downward or upward depending on the orientation of the electronics 100).

[0050] The bottom encapsulation 140 may include, or be referred to as, an epoxy molding compound, resin, filler-reinforced polymer, Class B compression film, or gel. In some instances, portions of the external interconnect 160 may be exposed or protrude outward from the bottom encapsulation 140. In some instances, the bottom encapsulation 140 may completely cover electronic components 120 and 120a, such that electronic components 120 and 120a are not exposed from the bottom encapsulation 140. In other instances, one or more of electronic components 120 or 120a may be exposed from the outer side 142 of the bottom encapsulation. In some instances, for example, a second side 122 of one or more electronic components 120 may be exposed from the outer side 142 of the bottom encapsulation and substantially coplanar with the outer side 142 of the bottom encapsulation. The thickness of the bottom encapsulation 140 may range from about 0.02 mm to about 10 mm. The bottom encapsulation 140 protects electronic components 120, 120a, or the external interconnect 160 from external environmental influences.

[0051] Figure 2C A cross-sectional view of the electronic device 100 at a later stage of manufacturing is shown. Figure 2C In the example shown, an antenna feed structure 151 can be provided and coupled to a conductive structure 114 at a second side 112 of the substrate 110.

[0052] In this example, various structures of the antenna feed structure 151 are described, including a molded antenna feed structure 151a covered by a dielectric 152, a preformed post antenna feed structure 151b, a plated post antenna feed structure 151c, or a wire antenna feed structure 151d.

[0053] In this example, the molded antenna feed structure 151a includes a conductive feed portion embedded within or laterally surrounded or covered by the dielectric 152, wherein opposing end surfaces are exposed from the dielectric 152. In some examples, the molded antenna feed structure 151a can be provided by forming a conductive structure, such as a copper pillar, elongated pillar, plated pillar, or elongated plated pillar, on a temporary carrier, providing a molded encapsulation around the conductive structure, removing the temporary carrier, and separating the molded conductive structure. In some examples, the dielectric 152 may include, or is referred to as, a molding or encapsulation. For example, the dielectric 152 may include molding materials such as epoxy molding compounds (EMC), resins, filler-reinforced polymers, Class B pressed films or gels, or organic or inorganic dielectric materials. The dielectric 152 can be provided by compression molding, transfer molding, liquid molding, vacuum lamination, paste printing, or film-assisted molding. The molded antenna feed structure 151a may include one or more feed conductors. In some instances, the molded antenna feed structure 151a can be coupled to the antenna terminal 114c of the substrate 110 using a conductive interface material 161.

[0054] In some instances, a preformed pillar antenna feed structure 151b can be provided by coupling the lower end of the preformed conductive pillar to the antenna terminal 114c of the substrate 110 using a conductive interface material 161. In some instances, the preformed pillar antenna feed structure 151b may include, or be referred to as, a copper pillar or pillar.

[0055] In some instances, the plated pillar antenna feed structure 151c can be provided by plating a conductive material (e.g., copper) onto the antenna terminal 114c to form a conductive pillar coupled to the antenna terminal 114c. For example, a plating mask can be provided over a second side 112 of the substrate 110, the plating mask being patterned to provide openings exposing the antenna terminal, and the plated pillar antenna feed structure 151c can then be formed in the openings using plating (e.g., electroless plating or electroplating). In other instances, the plated pillar feed structure may include through-hole molding and can be provided after the top encapsulation 130 is provided.

[0056] In some instances, the wire antenna feed structure 151d may include gold, silver, or copper wire. In some instances, the wire antenna feed structure 151d may be provided by ball-soldering the lower end of the wire to the antenna terminal 114c of the substrate 110 and then cutting off the upper end of the wire.

[0057] In some instances, the antenna feed structure 151 may have different heights. In some instances, steps may exist between adjacent antenna feed structures 151. In some instances, the antenna feed structures 151 may be positioned laterally spaced from each other. In some instances, the height of the antenna feed structure 151 may range from approximately 0.01 mm to approximately 10 mm. The antenna feed structure 151 may be configured as a signal pin or a ground pin.

[0058] Figure 2D A cross-sectional view of the electronic device 100 at a later stage of manufacturing is shown. Figure 2D In the example shown, a top cover 130 may be provided.

[0059] In some instances, the top encapsulation 130 may be disposed over the second side 112 of the antenna feed structure 151 and the substrate 110. In some instances, the top encapsulation 130 may cover and / or contact the second side 112 of the substrate 110 and the antenna feed structure 151 (or the dielectric 152 of the molded antenna feed structure 151a). The top encapsulation 130 may include a top encapsulation outer side 131, a top encapsulation inner side 132 opposite to the top encapsulation outer side 131, and a top encapsulation lateral side 133 connecting the top encapsulation outer side 131 to the top encapsulation inner side 132. In this example, the top encapsulation 130 includes a thickness that varies in its lateral width. According to this specification, such variation in thickness may be determined, for example, based on the operating frequencies of different antennas 150 of the electronic device 100. In some instances, a recess 130a extending inward from the top encapsulation outer side 131 may be provided, such that the top encapsulation 130 includes a thin portion and a thick portion. Each of the recesses 130a may be recessed to the same or different depths. Recesses 130a may include, or be referred to as, stepped recesses, stepped portions, grooves, or channels. In some embodiments, at least one recess 130a may be provided. In some embodiments, the distal ends of the antenna feed structures 151a-151d may be exposed from the outer side of the top enclosure 131 or the lower side of the recess 130a and substantially coplanar with the outer side of the top enclosure 131 or the lower side of the recess 130a, for example, as... Figure 2D As shown.

[0060] The top encapsulation 130 may include, or be referred to as, an epoxy molding compound, resin, filler-reinforced polymer, Class B compression film, or gel. In some instances, the encapsulation of the top encapsulation 130 and the dielectric 152 of the molded antenna feed structure 151a may include similar or different materials. In some instances, the top encapsulation 130 may be provided by compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, paste printing, or film-assisted molding. For example, compression molding may be a method in which a fluid resin is pre-supplyed into a mold and then the electronic device 100 is placed into the mold to cure the fluid resin, and transfer molding may be a method in which a fluid resin is supplied from a gate (supply port) of the mold to an area surrounding the electronic device 100 and cured. In some instances, the upper profile or morphology of the top encapsulation 130 may be provided in situ during the molding process. For example, the upper profile may be provided as part of an upper mold cavity. In other examples, laser thinning or photolithography and etching / milling processes can be used to provide the upper profile of the top encapsulation 130. For example, after providing the top encapsulation 130, an etch mask can be provided and patterned to include an opening in which the recess 130a will be formed. After providing the opening, a portion of the top encapsulation 130 can be chemically or physically removed to form the recess 130a. In some examples, the thickness of the top encapsulation 130 can range from about 100 μm to about 2000 μm, and this thickness can vary across the lateral width of the top encapsulation 130. In some examples, the thickness of the top encapsulation 130 can be about 300 μm for a 28 GHz antenna pattern; about 200 μm for a 40 GHz antenna pattern; and about 800 μm for a 10 GHz antenna pattern. In an example where the 40 GHz antenna pattern and the 28 GHz antenna pattern are placed adjacent to each other on the top enclosure 130, the depth of the recess 130a will be approximately 100 micrometers, with the 40 GHz antenna pattern on the lower surface of the recess 130a. In an example where the 10 GHz antenna pattern and the 28 GHz antenna pattern are placed adjacent to each other on the top enclosure 130, the depth of the recess 130a will be approximately 500 micrometers, with the 28 GHz antenna pattern on the lower surface of the recess 130a. The top enclosure 130 can integrate different antenna feed structures 151 spaced apart from each other and can protect the antenna feed structures 151 and the substrate 110 from the influence of the external environment.

[0061] Figure 2E A cross-sectional view of the electronic device 100 at a later stage of manufacturing is shown. Figure 2E In the example shown, antenna pattern 153 can be provided.

[0062] Antenna pattern 153, including, for example, antenna pattern 153a, antenna pattern 153b, antenna pattern 153c, antenna pattern 153d, antenna pattern 153e, antenna pattern 153f, or antenna pattern 153g, can be disposed on the outer side 131 of the top enclosure 130 or within the recess 130a. Antenna pattern 153 can be coupled to antenna feed structure 151. In this example, antenna pattern 153a is coupled to the exposed far end of the molded antenna feed structure 151a at a first position on the outer side 131 of the top enclosure; antenna pattern 153b is coupled to the exposed far end of another molded antenna feed structure 151a within the first recess 130a; antenna pattern 153c is coupled to the exposed far end of the preformed post antenna feed structure 151b at a second position on the outer side 131 of the top enclosure; antenna pattern 153d is coupled to the exposed far end of another preformed post antenna feed structure 151b within the second recess 130a; antenna pattern 153e is coupled to the exposed far end of the coated post antenna feed structure 151c at a third position on the outer side 131 of the top enclosure; antenna pattern 153f is coupled to another coated post antenna feed structure 151c within the third recess 130a; and antenna pattern 153g is coupled to the exposed far end of the wire antenna feed structure 151d at a fourth position on the outer side 131 of the top enclosure.

[0063] In this example, antenna patterns 153a, 153c, 153e and 153d are located within a first horizontal plane generally defined by the outer side 131 of the top enclosure, and antenna patterns 153b, 153d and 153f are located within a second horizontal plane generally defined by the lower surface of the recess 130a, which is below the first horizontal plane.

[0064] In some instances, the antenna pattern 153 may include copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, silver alloy, nickel, nickel alloy, palladium, palladium alloy, or tin-silver. In some instances, the antenna pattern 153 may be provided by spraying, plating, evaporation, or sputtering. In some instances, the antenna pattern 153 may be provided by spraying, plating, evaporation, or sputtering a conductive material after a patterned photomask, metal mask, or template has been provided on the top encapsulation 130. After the antenna pattern 153 has been provided, the mask or template may be removed from the top encapsulation 130, leaving the antenna pattern 153 formed in the pattern provided by the photomask, metal mask, or template. Each of the antenna patterns 153a-153g may be the same or different radiation patterns and includes spiral, square, rectangular, circular, dipole, elliptical, triangular, disk sector, ring, annular sector, or other shapes known to those skilled in the art.

[0065] Antenna feed structure 151, including, for example, antenna feed structures 151a-151d, is configured to transmit and receive signals between electronic component 120, electronic component 120a, and antenna patterns 153a-153g via conductive structures 114 of substrate 110. In some instances, electronic device 100 may include the same antenna feed structure (e.g., the antenna feed structure is one of antenna feed structures 151a-151d), or the antenna feed structures may be different (e.g., any combination selected from antenna feed structures 151a-151d).

[0066] In this way, the present disclosure provides improved antenna 150 performance for electronic device 100 by adjusting various lengths of the grounding wire, the signal wire, and the spacing of the antenna 150. According to the present disclosure, the characteristics of antenna 150 can be easily adjusted by providing steps or recesses of various thicknesses in the top enclosure 130 and providing antenna patterns 153 on the corresponding steps or recesses. According to the present disclosure, antenna 150 can be provided while changing the shape or morphology of the outer side 131 of the top enclosure in various ways, thereby facilitating the design of multi-band antennas and making it easier to achieve inter-band separation performance and beam control.

[0067] Although the electronic device 100 is shown with the distal end of the dielectric 152 exposed outside the top enclosure 130, it is conceivable and understood that the distal end of the dielectric 152 may be at least partially covered by the top enclosure 130, and an opening may be provided in the top enclosure 130 to expose the distal end of the molded antenna feed structure 151a. Antenna patterns 153a or 153b may then extend into the opening to couple with the distal end of the molded antenna feed structure 151a.

[0068] Figure 3 A cross-sectional view of example electronic device 100A is shown. In this example, electronic device 100A is provided in an example AiP / AoP configuration. Figure 3 The electronic device 100A is structurally similar to Figure 1 The electronic devices 100 share some similarities, which will not be repeated here. In this regard, only the differences between the two electronic devices will be discussed below.

[0069] In electronic device 100A, the top enclosure 130 and antenna 150 are provided in the form of steps, such as steps 131a, 131b, 131c, and 131d. (See figure...) Figure 3As shown, the thickness of steps 131a-131d gradually increases from one side of the electronic device 100A to the opposite side. In some instances, the outer side 131 of the top enclosure on which antenna patterns 153a-153g are disposed can be generally arranged in the form of steps 131a, 131b, 131c, and 131d. In some instances, the thickness or length of the antenna feed structure 151a-151d can be along the width direction of the substrate 110 (e.g., in...). Figure 3 The steps 131a, 131b, 131c, and 131d may include, or be referred to as, step recesses, step areas, recesses, or step cavities, each including a lower side extending inward from the outer side 131 of the top enclosure to a different depth. The lower side is configured as a receiving antenna pattern. Steps 131a, 131b, 131c, and 131d are an example of a plurality of recesses extending inward from the outer side 131 of the top enclosure.

[0070] In some instances, step 131a is an example of defining a first recessed area of ​​a first step, step 131b is an example of defining a second recessed area of ​​a second step, step 131c is an example of defining a third recessed area of ​​a third step, and step 131d is an example of defining a fourth step on the outer side 131 of the top enclosure.

[0071] Figure 4A , Figure 4B , Figure 4C , Figure 4D and Figure 4E A cross-sectional view is shown of an example method for manufacturing an electronic device including, for example, electronic device 100A. Figures 4A to 4E The manufacturing method described in the text and Figures 2A to 2E The manufacturing methods of these two products share certain similarities, and these similarities will not be repeated here. In this regard, the following discussion will focus solely on the differences between the methods.

[0072] Figure 4A A cross-sectional view of the electronic device 100A during its early manufacturing stages is shown. Figure 4A In the example shown, it can be used in a way similar to that described above. Figure 2A The substrate 110 is provided in the manner described in the steps of providing the substrate 110. Then, before providing the electronic component 120, electronic component 120a, or external interconnect 160 on the first side 111 of the substrate 110, an antenna feed structure 151 may be provided on the second side 112 of the substrate 110. In some instances, at least one of the antenna feed structures 151 may be provided on the second side 112 of the substrate 110 before any components are provided on the first side 111 of the substrate 110.

[0073] In this example, the antenna feed structure 151 may include a molded antenna feed structure 151a, a preformed pillar antenna feed structure 151b, a plated pillar antenna feed structure 151c, or a wire antenna feed structure 151d covered by a dielectric 152. In some examples, the proximal end of the antenna feed structure 151 is coupled to an antenna terminal 114c adjacent to a first side 111 of the substrate 110. In some examples, the proximal end of the molded antenna feed structure 151a or the preformed pillar antenna feed structure 151b is coupled to the antenna terminal 114c using a conductive interface material 161 (e.g., solder). In this example, the molded antenna feed structure 151 is an example of a molded antenna feed structure having multiple molded antenna feed structures 151a within a single or integrated dielectric 152.

[0074] Figure 4B A cross-sectional view of the electronic device 100A during a later manufacturing stage is shown. In some instances, a top enclosure 130 may be disposed above the antenna feed structure 151 and the second side 112 of the substrate 110. Figure 4B In the example shown, a top encapsulation 130 is provided, and then components for the bottom assembly can be provided first over the second side 112 of the substrate 110. In some examples, the top encapsulation 130 may cover and / or contact the second side 112 of the substrate 110 and the antenna feed structure 151 (or the dielectric 152 of the molded antenna feed structure 151a). The top encapsulation 130 may include a top encapsulation outer side 131, a top encapsulation inner side 132 opposite to the top encapsulation outer side 131, and a top encapsulation lateral side 133 connecting the top encapsulation outer side 131 to the top encapsulation inner side 132. In this example, the top encapsulation 130 includes a thickness varying across its lateral width in the form of steps 131a, 131b, 131c, and 131d. According to this specification, such variation in thickness may be determined, for example, based on the operating frequencies of different antennas 150 of the electronic device 100A.

[0075] The top encapsulation 130 may include, or be referred to as, an epoxy molding compound, resin, filler-reinforced polymer, Class B compression film, or gel. In some instances, the encapsulation of the top encapsulation 130 and the dielectric 152 of the molded antenna feed structure 151a may include similar or different materials. In some instances, the top encapsulation 130 may be provided by compression molding, transfer molding, liquid encapsulation molding, vacuum lamination, paste printing, or film-assisted molding. For example, compression molding may be a method in which a fluid resin is pre-supplied into a mold and then the electronic device 100A is placed into the mold to cure the fluid resin, and transfer molding may be a method in which a fluid resin is supplied from a gate (supply port) of the mold to an area surrounding the electronic device 100 and cured. In some instances, the upper profile or morphology of the top encapsulation 130 may be provided in situ during the molding process. For example, the upper profile may be provided as a portion of the upper mold cavity, corresponding to the stepped profile of the top encapsulation 130 in the electronic device 100A. In other instances, laser thinning or photolithography and etching / milling processes can be used to provide the upper profile of the top encapsulation 130. For example, after providing the top encapsulation 130, an etching mask can be provided and patterned to include openings in which steps 131a, 131b, and 131c will be formed. After providing the openings, portions of the top encapsulation 130 can be chemically or physically removed to form the steps.

[0076] Figure 4C A cross-sectional view of the electronic device 100A during a later manufacturing stage is shown. In this example, the antenna pattern 153 may be positioned above the outer side 131 of the top enclosure and coupled to the distal end of the antenna feed structure 151. Figure 4C In the example shown, the antenna pattern 153 may be provided above the first side 111 of the substrate 110 before the components for the bottom assembly are provided. In some instances, antenna pattern 153a is positioned above step 131a and coupled to the far end of the first coated post antenna feed structure 151c; antenna pattern 153b is positioned above step 131b and coupled to the far end of the second coated post antenna feed structure 151c; antenna pattern 153c is also positioned above step 131b and coupled to the far end of the third coated post antenna feed structure 151c; antenna pattern 153d is positioned above step 131c and coupled to the far end of the first molded antenna feed structure 151a; antenna pattern 153e is also positioned above step 131c and coupled to the far end of the second molded antenna feed structure 151a; antenna pattern 153f is positioned above step 131d and coupled to the far end of the preformed post antenna feed structure 151b; and antenna pattern 153g is also positioned above step 131d and coupled to the far end of the wire antenna feed structure 151d. In this example, step 131d is located on the outside of the top enclosure 131.

[0077] In some instances, antenna patterns 153b and 153c located on step 131b can be separate antenna patterns or portions of the same antenna pattern. In instances where antenna patterns 153b and 153c are portions of the same antenna pattern, one of the first and second plated post antenna feed structures 151c can be a signal feed, while the other can be a ground feed. This configuration can also be applied, for example, to antenna patterns 153d and 153e located on step 131c, or to antenna patterns 153f and 153g located on step 131d.

[0078] Figure 4D A cross-sectional view of the electronic device 100A during the later stages of manufacturing is shown. Figure 4D In the example shown, the components for the bottom assembly can be disposed on the first side 111 of the substrate 110. Similar to... Figure 2B As described, electronic components 120, 120a and external interconnect 160 can be coupled to a first side 111 of substrate 110. Similarly, the contact pads 123 of electronic components 120 and 120a can be coupled to component terminals 114a of substrate 110 via connector 124, and external interconnect 160 can be coupled to external interconnect terminals 114b of substrate 110.

[0079] Figure 4E A cross-sectional view of the electronic device 100A during the later stages of manufacturing is shown. Figure 4E In the illustrated example, a bottom encapsulation 140 may be disposed over a first side 111 of the substrate 110, electronic components 120, electronic components 120a, and external interconnects 160. The bottom encapsulation 140 may cover and / or contact the first side 111 of the substrate 110, electronic components 120, electronic components 120a, and external interconnects 160. The bottom encapsulation 140 may include an inner bottom encapsulation 141, an outer bottom encapsulation 142 opposite to the inner bottom encapsulation 141, and a lateral side 143 connecting the inner bottom encapsulation 141 to the outer bottom encapsulation 142. In this example, the inner bottom encapsulation 141 is adjacent to the first side 111 of the substrate 110, and the outer bottom encapsulation 142 is distant from the first side 111 of the substrate 110. In some instances, portions of the external interconnect 160 are exposed from the outer side 142 of the bottom enclosure and protrude outward from the outer side 142 of the bottom enclosure (e.g., downward or upward depending on the orientation of the electronics 100).

[0080] Although a bottom encapsulation covering the electronic component 120 and the back side of the electronic component 120 is shown, it is conceivable and understood that in some instances, one or more of the electronic components 120 and / or one or more of the electronic components 120a may be exposed through the bottom encapsulation 140, such that the electronic components 120 and / or the electronic components 120a may be coplanar with the outer side 142 of the bottom encapsulation.

[0081] Antenna feed structure 151, including, for example, antenna feed structures 151a-151d, may include conductors and is configured to transmit and receive signals between electronic components 120, electronic components 120a, and antenna pattern 153 via conductive structures 114 of substrate 110, said antenna pattern 153 including, for example, antenna patterns 153a-153g.

[0082] Figure 5 A cross-sectional view of example electronic device 100B is shown. In this example, electronic device 100B is provided in an example AiP / AoP configuration. Figure 5 The electronic device 100B is constructed similarly to Figure 3 The electronic device 100A shares some similarities with the other device, and these similarities will not be repeated here. In this regard, only the differences between the two electronic devices will be discussed below.

[0083] In electronic device 100B, antenna pattern 153 can be associated with... Figure 3 The antenna pattern 153 described herein is configured differently. In some instances, the antenna pattern 153 may include antenna patterns 153a', 153b', 153c', and 153g' (or portions thereof) embedded within the top enclosure 130. In some instances, the top sides of antenna patterns 153a', 153b', 153c', and 153g' (or portions thereof) may be coplanar with the top sides of steps 131a, 131b, or 131d positioned in the electronic device 100B. In some instances, the antenna pattern 153 may include an antenna pattern 153f' partially embedded within the top enclosure 130, such that a portion of the antenna pattern 153f' extends upward or protrudes along step 131d. In some instances, the top enclosure 130 may be provided such that a portion of the enclosure 130 is above the antenna feed structure 151. Then, a portion of the top encapsulation 130 can be removed using masking and etching processes to provide a patterned recess above the far end of the antenna feed structure 151. Antenna patterns 153a', 153b', 153c', 153f', and 153g' can then be set within the recess in a manner similar to that described in the formation of antenna pattern 153.

[0084] In some instances, the masking patterns used to pattern the top encapsulation 130 correspond to the respective antenna patterns 153a', 153b', 153c', 153f', and 153g', and are provided in the form of patterned recesses. Conductive material for the antenna patterns can then be provided over the top encapsulation 130 and within the patterned recesses. The conductive material can be partially removed or planarized using etch-back processes, planarization processes, combinations thereof, or other processes known to those skilled in the art. For antenna pattern 153f', another masking and etching process can be used to form the partially recessed pattern.

[0085] Antenna pattern 153 may also include antenna patterns 153d' and 153e' coupled to the molded antenna feed structure 151a. In this example, the molded antenna feed structure 151a may be recessed below the exposed outer surface of the dielectric 152, and antenna patterns 153d' and 153e' may contact the molded antenna feed structure 151a within the recess. In some examples, antenna pattern 153d' may be partially recessed within the dielectric 152. In some examples, antenna pattern 153e' may be completely recessed within the dielectric 152 (e.g., no portion of antenna pattern 153e' extends out of the recess and overlaps the exposed outer surface of the dielectric 12), such that the top side is coplanar with the exposed outer surface of the dielectric 152. In some examples, the distal end of the molded antenna feed structure 151a may be recessed after the dielectric 152 is exposed from the top enclosure 130. In other instances, the distal end of the molded antenna feed structure 151a may be pre-formed as a recess before the top encapsulation 130 is provided.

[0086] In summary, structures and methods for electronic devices involving integrated antenna structures using, for example, multi-band AiP or AoP structures have been described. More specifically, structures and methods incorporating recessed or stepped top encapsulation structures have been described. The top encapsulation structure may be above a substrate and may cover the antenna feed structure. Antenna patterns may be disposed within the recess or on the step and may be coupled to different configurations of the antenna feed structure to provide different antennas. Antenna characteristics can be modified by varying the thickness of the top encapsulation structure and by adjusting the height of the antenna feed structure to facilitate the design of multi-band antenna configurations in a single electronic device or a single package structure. The described structures and methods provide improved grounding, improved beam control, and better separation between frequency bands for improved inter-band separation performance. Furthermore, the described structures and methods incorporate existing manufacturing techniques, resulting in cost savings.

[0087] In some instances, the antenna feed structure may include a molded antenna feed structure, a preformed post antenna feed structure, a plated post antenna feed structure, or a wire antenna feed structure. The antenna feed structure may be configured as a signal line or a ground line. In some instances, the antenna pattern may be located on top of the top enclosure structure. In some instances, the antenna pattern may be embedded within the top enclosure structure.

[0088] In some instances, electronic components can be coupled to the substrate and the antenna feed structure.

[0089] This disclosure contains references to certain examples; however, those skilled in the art will understand that various changes and substitutions can be made without departing from the scope of this disclosure. Modifications can be made to the disclosed examples without departing from the scope of this disclosure. Therefore, it is intended that this disclosure be limited to the disclosed examples, but will include all examples falling within the scope of the appended claims.

Claims

1. An electronic device, the electronic device comprising: Substrate, the substrate comprising: First side of the substrate; The second side of the substrate, which is opposite to the first side of the substrate; and Conductive structure; Antenna structure, the antenna structure comprising: Antenna feed structure, said antenna feed structure being coupled to a first side of the substrate; and Antenna patterns, each antenna pattern being coupled to one of the antenna feed structures in the antenna feed structure; A top encapsulation, the top encapsulation covering the antenna feed structure and the first side of the substrate and comprising: The outside of the top encapsulation; and A first recess extends inward from the outside of the top encapsulation, and the first recess includes a lower side below the outside of the top encapsulation, wherein: The antenna feeding structure includes a first antenna feeding structure and a second antenna feeding structure; and The antenna pattern includes: A first antenna pattern, the first antenna pattern being adjacent to the lower side of the first recess and coupled to the first antenna feed structure; and A second antenna pattern, the second antenna pattern being adjacent to the outside of the top enclosure and coupled to the second antenna feed structure; and An electronic component, which is coupled to the substrate at a second side of the substrate and to the antenna feed structure.

2. The electronic device according to claim 1, further comprising: External interconnects; as well as A bottom encapsulation that covers portions of the electronic components, the second side of the substrate, and the external interconnects.

3. The electronic device according to claim 1, wherein: The first antenna feeding structure includes a molded antenna feeding structure, wherein the molded antenna feeding structure includes a first conductive feeding portion embedded in a dielectric.

4. The electronic device according to claim 3, wherein: The molded antenna feed structure includes a second conductive feed portion embedded within the dielectric; and The antenna pattern includes a third conductive pattern coupled to the second conductive feed portion.

5. The electronic device according to claim 3, wherein: The molded antenna feed structure includes a second conductive feed portion embedded in the dielectric and coupled to the first antenna pattern.

6. The electronic device according to claim 1, wherein: The first antenna feeding structure includes a preformed column antenna feeding structure.

7. The electronic device according to claim 1, wherein: The first antenna feeding structure includes a plated pillar antenna feeding structure.

8. The electronic device according to claim 1, wherein: The first antenna feeding structure includes a wire antenna feeding structure.

9. The electronic device according to claim 1, wherein: The first antenna feeding structure and the second antenna feeding structure include different antenna feeding structures.

10. The electronic device according to claim 1, further comprising: Multiple recesses, extending inward from the outside of the top encapsulation, including: The first recess, wherein the lower side of the first recess extends to a first depth below the outer side of the top encapsulation; and The second recess extends inward from the outside of the top encapsulation, and the second recess includes a lower side that extends below the outside of the top encapsulation to a second depth different from the first depth. A third antenna feed structure, said third antenna feed structure being coupled to a first side of the substrate and covered by the top encapsulation; and A third antenna pattern is located adjacent to the lower side of the second recess and coupled to the third antenna feed structure, wherein the electronic device includes a multi-band antenna.

11. An electronic device, the electronic device comprising: Substrate, the substrate comprising: First side of the substrate; The second side of the substrate is opposite to the first side of the substrate; Dielectric structure; and A conductive structure, wherein the conductive structure is located within the dielectric structure; Multiple antenna feed structures are coupled to the conductive structure at a first side of the substrate, and include a first antenna feed structure, a second antenna feed structure, and a third antenna feed structure. A top encapsulation, the top encapsulation covering the plurality of antenna feed structures and the first side of the substrate and comprising: The outside of the top encapsulation; and Multiple recessed areas, the multiple recessed areas extending inward from the outside of the top encapsulation and including a first recessed area, a second recessed area and a third recessed area, the first recessed area including a first lower side, the second recessed area including a second lower side, and the third recessed area including a third lower side; Multiple antenna patterns, including a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, and a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure; Electronic components, said electronic components being coupled to the conductive structure at a second side of the substrate; and A bottom encapsulation that covers the electronic component and the second side of the substrate.

12. The electronic device according to claim 11, wherein: The plurality of recessed areas include steps, each step comprising an increasing thickness from a first side of the electronic device to an opposite second side of the electronic device, wherein: The first recessed area defines the first step; The second recessed area defines the second step; The third recessed area defines the third step; and The outer side of the top enclosure defines a fourth step.

13. The electronic device according to claim 12, wherein: The plurality of antenna feeding structures includes a fourth antenna feeding structure; and The plurality of antenna patterns include a fourth antenna pattern on the fourth step and coupled to the fourth antenna feed structure.

14. The electronic device according to claim 11, wherein: One or more of the first antenna pattern, the second antenna pattern, or the third antenna pattern are embedded within the top encapsulation.

15. The electronic device of claim 11, further comprising: An external interconnect coupled to the conductive structure at a second side of the substrate, wherein a bottom encapsulation covers a first portion of the external interconnect and a second portion of the external interconnect protrudes outward from the bottom encapsulation.

16. A method of manufacturing an electronic device, the method comprising: A substrate is provided, the substrate comprising: First side of the substrate; The second side of the substrate is opposite to the first side of the substrate; Dielectric structure; and A conductive structure, wherein the conductive structure is located within the dielectric structure; A plurality of antenna feed structures are provided, the plurality of antenna feed structures being coupled to the conductive structure at a first side of the substrate, and including a first antenna feed structure, a second antenna feed structure and a third antenna feed structure; A top encapsulation is provided, the top encapsulation covering the plurality of antenna feed structures and the first side of the substrate and comprising: The outside of the top encapsulation; and Multiple recessed areas, the multiple recessed areas extending inward from the outside of the top encapsulation and including a first recessed area, a second recessed area and a third recessed area, the first recessed area including a first lower side, the second recessed area including a second lower side, and the third recessed area including a third lower side; A plurality of antenna patterns are provided, the plurality of antenna patterns including a first antenna pattern adjacent to the first lower side and coupled to the first antenna feed structure, a second antenna pattern adjacent to the second lower side and coupled to the second antenna feed structure, and a third antenna pattern adjacent to the third lower side and coupled to the third antenna feed structure; Provide an electronic component coupled to the conductive structure at a second side of the substrate; and A bottom encapsulation is provided that covers the electronic component and the second side of the substrate.

17. The method of claim 16, wherein: Providing the top encapsulation includes providing the plurality of recessed areas comprising steps, each step comprising an increasing thickness from a first side of the electronic device to an opposite second side of the electronic device, wherein: The first recessed area defines the first step; The second recessed area defines the second step; The third recessed area defines the third step; and The outer side of the top enclosure defines a fourth step.

18. The method of claim 17, wherein: Providing the plurality of antenna feeding structures includes providing a fourth antenna feeding structure; and Providing the plurality of antenna patterns includes providing a fourth antenna pattern on the fourth step and coupled to the fourth antenna feed structure.

19. The method of claim 16, wherein: Providing the plurality of antenna patterns includes providing one or more of the first antenna pattern, the second antenna pattern, or the third antenna pattern embedded within the top enclosure.

20. The method of claim 16, further comprising: An external interconnect coupled to the conductive structure at a second side of the substrate is provided, wherein: The bottom encapsulation is provided, including a first portion covering the external interconnect, and a second portion of the external interconnect protruding outward from the bottom encapsulation.

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