A method for manufacturing a high-temperature co-fired ceramic tube and a high-temperature co-fired ceramic tube

Abstract

The high-temperature co-fired ceramic tube preparation method provided by the application adopts the mode of green ceramic tape opening, metal slurry filling, green ceramic tape printing, green ceramic tape winding, glue removal and high-temperature sintering to manufacture the high-temperature co-fired ceramic tube, which can form an integrated metal structure inside the high-temperature co-fired ceramic tube and avoid cracking, open circuit, virtual connection and other phenomena caused by post-punching and post-metallization, solves the problems of difficult internal line forming, poor conduction and large deformation of the existing ceramic tube, and the manufactured high-temperature co-fired ceramic tube has high reliability, good yield, simple steps, easy implementation and is suitable for batch production, and can meet the needs of advanced packaging of high-end electronic components; the high-temperature co-fired ceramic tube provided by the application is manufactured by the above preparation method, has accurate external dimensions and good conduction reliability of the internal guide column and the line, and is suitable for advanced packaging of high-end electronic components.

Description

Technical Field

[0001] This invention belongs to the field of high-temperature co-fired ceramic technology, specifically relating to a method for preparing a high-temperature co-fired ceramic tube and a high-temperature co-fired ceramic tube. Background Technology

[0002] High-temperature co-fired ceramics (HTCC) are ceramic-metal integrated structures formed by co-firing high-purity alumina with conductive paste at high temperatures. They have advantages such as high temperature resistance, high mechanical strength, high thermal conductivity, and high reliability, and are the core packaging material for high-end electronic components.

[0003] Traditional high-temperature co-fired ceramics are basically in plate or box shape. For example, CN119542258A, CN120490806A, and CN120824273A disclose such high-temperature co-fired ceramic components, which are manufactured using a multi-layer lamination process. This process is difficult to use to manufacture tubular high-temperature co-fired ceramics. These ceramic tubes can only be manufactured using a post-drilling and post-metallization process, which has at least the following drawbacks: 1. Post-drilling can easily cause ceramic cracking, poor bonding force of the metallized hole wall, and low reliability of conduction.

[0004] 2. The connection between the circuit and the metal post inside the through hole is not firm, which can easily lead to open circuits and loose connections.

[0005] These defects result in poor yield and low reliability of high-temperature co-fired ceramic tubes, high prices, and difficulty in mass production, failing to meet the advanced packaging needs of high-end electronic components. Summary of the Invention

[0006] The purpose of this invention is to overcome one or more disadvantages in the prior art and to provide a method for preparing a high-temperature co-fired ceramic tube and a high-temperature co-fired ceramic tube.

[0007] To achieve the above objectives, the method employed in this invention is a method for preparing high-temperature co-fired ceramic tubes, comprising the following steps: S1. Prepare alumina-based green ceramic tape with a purity of 90%-99%, and open through holes at predetermined positions in the green ceramic tape; S2. High-temperature conductive metal slurry is filled into the through hole and dried to form a metal column; S3. Print circuits on the surface of the green ceramic tape, and the ends of the circuits must be precisely aligned with the metal posts; S4. The green ceramic strip is wound along its length to form a tubular green blank that overlaps with the metal column at the end of the circuit. S5. The tubular green body is debonded and sintered at high temperature under a reducing atmosphere to obtain a high-temperature co-fired ceramic tube.

[0008] Preferably, the thickness of the green ceramic strip in step S1 is 0.1-0.5 mm, the thickness of the printed circuit in step S2 is 10-30 μm, and the roundness of the tubular green body in step S4 does not exceed ±0.02 mm.

[0009] Preferably, the hole spacing accuracy when opening the through hole in step S1 does not exceed ±10μm, and the drying temperature in step S2 is controlled within the range of 80–120℃, and the drying time is controlled within 10–30min.

[0010] Preferably, in step S2, a high-temperature conductive metal paste is filled by screen printing, with porous stone support and vacuum assistance used during the filling process.

[0011] Preferably, the paste used for printing the circuit in step S3 has the same composition as the high-temperature conductive metal paste used in step S2. When printing the circuit in step S3, the line width of a single line is not less than the minimum value of the through-hole diameter in step S1, and the line spacing between adjacent lines is not less than the minimum value of the through-hole diameter in step S1.

[0012] Preferably, the winding in step S4 is a mandrel-oriented winding, and the tension during winding is controlled within the range of 0.1-0.5 MPa.

[0013] Preferably, between step S4 and step S5, a step of performing warm water isostatic pressing on the tubular green billet is included, with a pressure value of 100-200 MPa and a holding time of 3-10 min.

[0014] Preferably, the reducing atmosphere in step S5 is achieved by introducing a mixed gas of hydrogen and nitrogen. The debinding temperature in step S5 is 200-600℃, the holding time for debinding is 1-3h, the high-temperature sintering temperature is 1400-1600℃, the holding time for high-temperature sintering is 1-3h, and the heating rate for high-temperature sintering is 1-5℃ / min.

[0015] Preferably, after step S5, a step of gold plating is further included on the surface of the high-temperature co-fired ceramic tube. After gold plating, the coating thickness on the surface of the high-temperature co-fired ceramic tube is 0.1-1μm, and the coating adhesion is ≥5N.

[0016] To achieve the above objectives, the product in the technical solution adopted by this invention is a high-temperature co-fired ceramic tube, comprising: tube body; Guide posts and wiring located within the pipe body; The guide post has multiple ends, at least one of which has an end face flush with the outer surface of the tube body. The circuit is used to conduct the guide post. The inner and outer walls of the tube body have coiled residual ends. The high-temperature co-fired ceramic tube is made using the above-described preparation method.

[0017] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The high-temperature co-fired ceramic tube manufacturing method provided by this invention adopts the following steps: opening holes in green ceramic tape → filling holes with metal paste → printing circuits on green ceramic tape → winding green ceramic tape → glue removal and high-temperature sintering. This method can form an integrated metal structure inside the high-temperature co-fired ceramic tube and avoid cracking, open circuits, and loose connections caused by post-drilling and post-metallization. It solves the problems of difficult internal circuit formation, poor conductivity, and large deformation in existing ceramic tubes. The resulting high-temperature co-fired ceramic tube has high reliability and good yield. The steps are simple, easy to implement, and suitable for mass production, meeting the needs of advanced packaging for high-end electronic components. The high-temperature co-fired ceramic tube provided by this invention, manufactured using the above method, has precise dimensions and good conductivity between internal guide pillars and circuits, making it suitable for advanced packaging of high-end electronic components. Attached Figure Description

[0018] Figure 1 This is a front view schematic diagram of a preferred embodiment of the high-temperature co-fired ceramic tube in this invention.

[0019] Figure 2 yes Figure 1 Cross-sectional view along the AA direction.

[0020] Figure 3 yes Figure 1 Unwound diagram before winding.

[0021] Among them: 1. green ceramic strip; 2. metal column; 10. tube body; 11. winding residual end; 12. layered; 20. guide post; 30. circuit. Detailed Implementation

[0022] like Figures 1 to 3 As shown, the high-temperature co-fired ceramic tube provided by the present invention includes: a tube body 10, guide posts 20 disposed within the tube body 10, and wiring 30 disposed within the tube body 10; the tube body 10 is formed by winding and sintering a green ceramic tape 1, and both the inner and outer walls of the tube body 10 have winding residue ends 11. Before sintering, the interior of the tube body 10 has multi-component layers 12; there are two guide posts 20, located in... Figure 2 The upper guide post 20 is composed of multiple metal posts 2 stacked on the green ceramic belt 1, located in... Figure 2 The lateral guide post 20 is formed by a metal post 2 on the green ceramic belt 1, located in Figure 2 The outer end face of the upper guide post 20 is flush with the outer surface of the tube body 10; the line 30 is used to conduct the guide post 20.

[0023] This high-temperature co-fired ceramic tube has precise dimensions and good conductivity between its internal guide pillars and circuits, making it suitable for advanced packaging of high-end electronic components.

[0024] In this embodiment, the green ceramic tape 1 is selected from 92% alumina green ceramic tape with a thickness of 0.175mm, cut into strips of 225.43mm×18.87mm. Through holes are made in the green ceramic tape 1 and filled with high-temperature conductive metal paste. After drying, metal pillar 2 is formed. Laser drilling is used to make the through holes. The diameter of the through holes is preferably 50-500μm. Specifically, in this embodiment, the diameter of the through holes is 180μm and the hole position accuracy is ±5μm. The circuit 30 is made by screen printing. The line width of the circuit 30 is 2.4mm, the line length is 28.22mm, and the thickness of the circuit is 15μm. After printing, the green ceramic tape is wound through a φ9.38mm mandrel to form a φ12.59mm tubular green blank. The tension during winding is 0.2MPa.

[0025] The present invention also provides a method for preparing a high-temperature co-fired ceramic tube, which is used to produce the above-mentioned high-temperature co-fired ceramic tube. The preparation method includes the following steps: S1. Prepare alumina-based green ceramic tape with a purity of 90%-99%, and open through holes at predetermined positions in the green ceramic tape; S2. High-temperature conductive metal slurry is filled into the through hole and dried to form a metal column; S3. Print circuits on the surface of the green ceramic tape, and the ends of the circuits must be precisely aligned with the metal posts; S4. The green ceramic strip is wound along its length to form a tubular green blank that overlaps with the metal column at the end of the circuit. S5. The tubular green body is debonded and sintered at high temperature under a reducing atmosphere, so that the green ceramic strip, metal pillar and circuit are eutectic bonded together to obtain an integrated high-temperature co-fired ceramic tube.

[0026] This preparation method can form an integrated metal structure inside the high-temperature co-fired ceramic tube, and avoid cracking, open circuits, and loose connections caused by post-drilling and post-metallization. It solves the problems of difficult internal circuit formation, poor conductivity, and large deformation in existing ceramic tubes. The high-temperature co-fired ceramic tubes produced have low on-resistance, high reliability, high stability, and good yield. Moreover, the steps are simple, easy to implement, and suitable for mass production, which can meet the needs of advanced packaging of high-end electronic components.

[0027] Preferably, the thickness of the green ceramic strip in step S1 is 0.1-0.5 mm, the thickness of the printed circuit in step S2 is 10-30 μm, and the roundness of the tubular green body in step S4 does not exceed ±0.02 mm.

[0028] Preferably, the hole spacing accuracy when opening the through hole in step S1 does not exceed ±10μm, and the drying temperature in step S2 is controlled within the range of 80–120℃, and the drying time is controlled within 10–30min.

[0029] Preferably, in step S2, high-temperature conductive metal paste is filled by screen printing. This setting can ensure compatibility during high-temperature sintering and avoid interface cracking. In step S2, porous stone support is used and vacuum is used for assistance.

[0030] Preferably, the paste used for printing the circuit in step S3 has the same composition as the high-temperature conductive metal paste used in step S2. When printing the circuit in step S3, the line width of a single line is not less than the minimum value of the through-hole diameter in step S1, and the line spacing between adjacent lines is not less than the minimum value of the through-hole diameter in step S1.

[0031] Preferably, between step S4 and step S5, a step of hot water isostatic pressing is performed on the tubular green blank. The pressure value during the treatment is 100-200MPa, and the holding time is 3-10min. This setting can eliminate the internal voids of the tubular green blank, improve the density (≥95%) and bonding strength, suppress the deformation of the tubular green blank during high-temperature sintering, and ensure that the dimensional accuracy after high-temperature sintering meets the requirements.

[0032] Preferably, the winding in step S4 is a mandrel-oriented winding, and the tension during winding is controlled within the range of 0.1-0.5MPa. This setting can be combined with the isostatic pressing treatment of warm water to take into account both the forming accuracy and densification effect of the tubular green body.

[0033] Preferably, the reducing atmosphere in step S5 is achieved by introducing a mixed gas of hydrogen and nitrogen. High-temperature sintering in a reducing atmosphere can prevent oxidation of the tungsten and molybdenum mixed slurry and ensure conductivity. The debinding temperature in step S5 is 200-600℃, the holding time for debinding is 1-3h, the high-temperature sintering temperature is 1400-1600℃, the holding time for high-temperature sintering is 1-3h, and the heating rate for high-temperature sintering is 1-5℃ / min.

[0034] Preferably, after step S5, a step of gold plating is further included on the surface of the high-temperature co-fired ceramic tube. After gold plating, the coating thickness on the surface of the high-temperature co-fired ceramic tube is 0.1-1μm, and the coating adhesion is ≥5N. This setting can improve the solderability and oxidation resistance of the high-temperature co-fired ceramic tube and meet the assembly requirements of the device.

[0035] It should be noted that the through hole in step S1 can be achieved by laser drilling or mechanical punching. When drilling, the smoothness of the hole wall must meet the preset requirements. The high-temperature conductive metal paste in step S2 is a tungsten and molybdenum mixed conductive paste. When printing the circuit in step S3, the printing position must take into account the spatial displacement between the end of the wound circuit and the metal pillar to ensure that three-dimensional overlap can be achieved after winding.

[0036] The preparation method provided by this invention is adapted to the preparation of high-temperature co-fired ceramic tubes with different diameters and line densities, and can be widely used in high-end electronic fields such as aerospace, communications, and sensing.

[0037] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method for preparing a high-temperature co-fired ceramic tube, characterized in that, Includes the following steps: S1. Prepare alumina-based green ceramic tape with a purity of 90%-99%, and open through holes at predetermined positions in the green ceramic tape; S2. High-temperature conductive metal slurry is filled into the through hole and dried to form a metal column; S3. Print circuits on the surface of the green ceramic tape, and the ends of the circuits must be precisely aligned with the metal posts; S4. The green ceramic strip is wound along the length direction to form a tubular green blank that overlaps the end of the circuit with the metal column in three dimensions; S5. The tubular green body is debonded and sintered at high temperature under a reducing atmosphere to obtain a high-temperature co-fired ceramic tube.

2. The preparation method according to claim 1, characterized in that: In step S1, the thickness of the green ceramic strip is 0.1-0.5 mm; in step S2, the thickness of the printed circuit is 10-30 μm; and in step S4, the roundness of the tubular green body does not exceed ±0.02 mm.

3. The preparation method according to claim 1, characterized in that: In step S1, the hole spacing accuracy should not exceed ±10μm. In step S2, the drying temperature should be controlled within the range of 80–120℃, and the drying time should be controlled within 10–30min.

4. The preparation method according to claim 1, characterized in that: Step S2 involves filling a high-temperature conductive metal paste using screen printing, with porous stone support and vacuum assistance during the filling process.

5. The preparation method according to claim 1, characterized in that: In step S3, the paste used for printing the circuit has the same composition as the high-temperature conductive metal paste used in step S2. When printing the circuit in step S3, the line width of a single line is not less than the minimum value of the through hole diameter in step S1, and the line spacing between adjacent lines is not less than the minimum value of the through hole diameter in step S1.

6. The preparation method according to claim 1, characterized in that: In step S4, the winding is done by mandrel orientation winding, and the tension during winding is controlled within the range of 0.1-0.5 MPa.

7. The preparation method according to claim 1, characterized in that: Between steps S4 and S5, there is also a step of performing warm water isostatic pressing on the tubular green billet, with a pressure value of 100-200MPa and a holding time of 3-10min.

8. The preparation method according to claim 1, characterized in that: The reducing atmosphere in step S5 is achieved by introducing a mixture of hydrogen and nitrogen. The debinding temperature in step S5 is 200-600℃, the holding time for debinding is 1-3h, the high-temperature sintering temperature is 1400-1600℃, the holding time for high-temperature sintering is 1-3h, and the heating rate for high-temperature sintering is 1-5℃ / min.

9. The preparation method according to claim 1, characterized in that: Step S5 is followed by a step of gold plating the surface of the high-temperature co-fired ceramic tube. After gold plating, the coating thickness on the surface of the high-temperature co-fired ceramic tube is 0.1-1μm, and the coating adhesion is ≥5N.

10. A high-temperature co-fired ceramic tube, comprising: tube body; Guide posts and wiring located within the pipe body; Its features are: The guide post has multiple ends, at least one of which has an end face flush with the outer surface of the tube body. The circuit is used to conduct the guide post. The inner and outer walls of the tube body have coiled residual ends. The high-temperature co-fired ceramic tube is made by the preparation method described in any one of claims 1 to 9.

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