Glass substrate and method for detecting glass substrate

Abstract

The present disclosure relates to the technical field of display, and discloses a glass substrate and a detection method of the glass substrate. The glass substrate comprises at least one first bump and at least one second bump, the thickness of the first bump and the second bump in a first direction is different, the first bump comprises a glass substrate, a semiconductor layer and a first bump layer, the first bump layer comprises at least one of a first conductive layer, a second conductive layer and a third conductive layer, the second bump comprises a glass substrate, a semiconductor layer and a second bump layer, the second bump layer comprises a first conductive layer, a second conductive layer and a third conductive layer, after a driving chip is bonded with the glass substrate, a first deformation length of conductive particles of a first anisotropic conductive adhesive is generated at the first bump, a second deformation length of conductive particles of a second anisotropic conductive adhesive is generated at the second bump, and whether the bonding of the driving chip and the glass substrate at the second bump is normal is determined according to the first deformation length and the second deformation length in the detection process.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and provides a glass substrate and a method for testing the glass substrate. Background Technology

[0002] In related technologies, during the bonding process between the driver chip and the glass substrate, specifically when the pins of the driver chip (ICBump) are attached to the PAD (PNL Bump) area of ​​the glass substrate, the downward pressure during attachment causes the ICBump to deform, thereby puncturing the ACF conductive particles. This allows the conductive gold balls within the conductive particles to contact the circuitry on the glass substrate, forming an electrical path. However, the varying thicknesses of the different film layers in the glass substrate result in poor surface flatness, leading to poor contact between the IC Bump and the PNL Bump during the bonding process. Summary of the Invention

[0003] This disclosure provides a glass substrate and a method for detecting the glass substrate, which is used to determine whether the bonding between the driver chip and the glass substrate at the second bump is normal based on the difference between the deformation lengths.

[0004] The specific technical solution provided in this disclosure is as follows: In a first aspect, embodiments of this disclosure provide a glass substrate, including: at least one first bump and at least one second bump, wherein the first bump and the second bump have different thicknesses in a first direction; The first bump includes: a glass substrate, a semiconductor layer disposed on the glass substrate, and a first bump layer disposed on the semiconductor layer. The first bump layer includes a portion of the following film layers stacked sequentially along a first direction: a first conductive layer, a second conductive layer, and a third conductive layer. The first direction is the direction from the glass substrate to the semiconductor layer. After the driver chip is bonded to the glass substrate, the conductive particles of the first anisotropic conductive adhesive generate a first deformation length along the first direction at the first bump. The second bump includes: a glass substrate, a semiconductor layer disposed on the glass substrate, and a second bump layer disposed on the semiconductor layer. The second bump layer includes a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially along a first direction. After the driver chip is bonded to the glass substrate, the conductive particles of the second anisotropic conductive adhesive generate a second deformation length along the first direction at the second bump.

[0005] In some possible implementations, it also includes: at least one third protrusion; The third bump includes a glass substrate and a semiconductor layer disposed on the glass substrate. After the driver chip is bonded to the glass substrate, the conductive particles of the third anisotropic conductive adhesive generate a deformation area at the third bump on a reference surface formed by the intersection of the second direction and the third direction. The second direction is parallel to the surface of the glass substrate, and the third direction is perpendicular to the first direction and the second direction, respectively.

[0006] In some possible implementations, each of the first bumps, each of the second bumps, and each of the third bumps are all located in the drive bonding region; The driver chip is bonded to multiple second bumps in the driver bonding area through multiple anisotropic conductive adhesive conductive particles.

[0007] In some possible implementations, the first bump layer includes a second conductive layer and a third conductive layer stacked sequentially along a first direction.

[0008] In some possible implementations, the third protrusion and the first protrusion are arranged adjacent to each other.

[0009] In some possible implementations, the third bump, the first bump, and the second bump are arranged in the drive bonding region along the second direction.

[0010] In some possible implementations, the driving bonding region includes a bonding input sub-region and multiple bonding output sub-regions, each of which is arranged in parallel along a third direction; The binding input sub-region includes at least one first convex point, at least one third convex point, and multiple second convex points; Each bonded output subregion includes at least one first bump, at least one third bump, and multiple second bumps.

[0011] In some possible implementations, the first conductive layer is a molybdenum-aluminum-molybdenum structure.

[0012] Secondly, this disclosure also provides a method for detecting glass substrates, applied to a metallographic microscope, comprising: After the driver chip is bonded to the glass substrate, the conductive particles of the first anisotropic conductive adhesive are obtained to generate a first deformation length along the first direction at the first bump, and the conductive particles of the second anisotropic conductive adhesive are obtained to generate a second deformation length along the first direction at the second bump. If the difference between the first deformation length and the second deformation length is within a preset range, then the bonding between the driver chip and the glass substrate at the second bump is determined to be abnormal. If the difference between the first deformation length and the second deformation length exceeds the preset range, it is determined that the bonding between the driver chip and the glass substrate at the second bump is normal.

[0013] In some possible implementations, including: If the number of breaks in the conductive particles of the third anisotropic conductive adhesive within the area corresponding to the deformation area is less than the set number, then the bonding between the driver chip and the glass substrate at the first bump, the second bump, and the third bump is determined to be normal.

[0014] The beneficial effects of this disclosure are as follows: In summary, this disclosure provides a glass substrate and a method for detecting the glass substrate. The glass substrate includes at least one first bump and at least one second bump, wherein the first bump and the second bump have different thicknesses in a first direction. The first bump includes a glass substrate, a semiconductor layer disposed on the glass substrate, and a first bump layer disposed on the semiconductor layer. The first bump layer includes at least one of a first conductive layer, a second conductive layer, and a third conductive layer sequentially stacked along a first direction, where the first direction is the direction from the glass substrate to the semiconductor layer. After the driver chip is bonded to the glass substrate, the conductive particles of the first anisotropic conductive adhesive undergo a first deformation along the first direction at the first bump. The second bump includes a glass substrate, a semiconductor layer disposed on the glass substrate, and a second bump layer disposed on the semiconductor layer. The second bump layer includes a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially along a first direction. After the driver chip is bonded to the glass substrate, the conductive particles of the second anisotropic conductive adhesive generate a second deformation length at the second bump along the first direction. Since the thicknesses of the first bump layer and the second bump layer are different, the first deformation length and the second deformation length should also be different. Based on this, during the detection process, the difference between the first deformation length and the second deformation length can be used to determine whether the bonding between the driver chip and the glass substrate at the second bump is normal.

[0015] Other features and advantages of this disclosure will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the disclosure. The objects and other advantages of this disclosure may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this disclosure and form part of this disclosure, illustrate exemplary embodiments of the present disclosure and are used to explain the disclosure, but do not constitute an undue limitation of the disclosure. In the drawings: Figure 1 This is a schematic diagram illustrating the bonding between an IC Bump and a PNL Bump via ACF conductive particles in a related technology. Figure 2 This is a schematic diagram of a PNL Bump structure in a glass substrate according to related technologies; Figure 3This is a cross-sectional view of a second convex point along a first direction in the related art; Figure 4 This is a cross-sectional view of a third convex point along a first direction in the related art; Figure 5 This is a schematic diagram of the initial state of an IC Bump and a PNL Bump after bonding in a related technology. Figure 6 This is a schematic diagram of the final state of an IC Bump and a PNL Bump after bonding in a related technology. Figure 7 This is a schematic diagram of the structure of a PNL Bump in a glass substrate according to an embodiment of the present disclosure; Figure 8 This is a cross-sectional view of the first type of first protrusion along a first direction in an embodiment of this disclosure; Figure 9 This is a cross-sectional view of the second type of first protrusion along the first direction in an embodiment of this disclosure; Figure 10 This is a cross-sectional view of the third type of first protrusion along the first direction in an embodiment of this disclosure; Figure 11 This is a flowchart of the first detection method applied to a glass substrate in the embodiments of this disclosure; Figure 12 This is a flowchart of a second detection method applied to a glass substrate in the embodiments of this disclosure. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the technical solutions of this disclosure, and not all embodiments. Based on the embodiments described in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the technical solutions of this disclosure.

[0018] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in sequences other than those illustrated or described herein.

[0019] In related technologies, during the bonding process between the driver chip and the glass substrate, specifically when the pins of the driver chip (ICBump) are attached to the PAD (PNL Bump) area of ​​the glass substrate, the downward pressure during attachment causes the ICBump to be deformed, thereby puncturing the ACF conductive particles. This allows the conductive gold balls within the conductive particles to contact the circuitry on the glass substrate, forming an electrical path. (See [reference needed]). Figure 1 As shown, after bonding, the IC Bump forms an electrical path with the PNL Bump through the ACF conductive particles. However, the thickness of each film layer in the glass substrate varies, resulting in poor flatness of the glass substrate surface. This can lead to poor contact between the IC Bump and the PNL Bump during the bonding process.

[0020] For the structure of the PNL Bump in the glass substrate in related technologies, please refer to [link / reference]. Figure 2 As shown, the driving bonding region in the glass substrate that bonds with the driving chip includes a bonding input sub-region and a bonding output sub-region. The bumps within the driving bonding region are of two types: second bumps and third bumps. It should be noted that the second bump is a valid bump for electrical signal transmission, while the third bump is an invalid bump for electrical signal transmission.

[0021] The structural composition of the second convex point mentioned above is described in the reference section. Figure 3 As shown, the second bump includes: a glass substrate, a semiconductor layer disposed on the glass substrate, and a second bump layer disposed on the semiconductor layer. The second bump layer includes a first conductive layer, a second conductive layer, and a third conductive layer sequentially stacked along a first direction. The bonding between the driver chip and the glass substrate is essentially the bonding between the driver chip and each of the second bumps within the bonding area, because the second bumps possess a complete film layer for electrical signal transmission.

[0022] The structural composition of the third convex point mentioned above is referred to Figure 4 As shown, the third bump consists only of a glass substrate and a semiconductor layer disposed on the glass substrate. Obviously, the third bump does not include a conductive layer; therefore, it does not have the capability to transmit electrical signals and is typically referred to as a dummy bump. The main purpose of the third bump is to observe whether the deformation area generated after the ACF conductive particles are punctured during the bonding process is acceptable, and to detect whether the number of punctures in the ACF conductive particles is less than a predetermined number. In other words, the third bump allows for a more direct observation of the bonding details between the IC bump and the PNL bump.

[0023] Additionally, it should be noted that during the bonding process of the IC Bump pressing down on the ACF conductive particles, rebound stress is generated. Under the action of this rebound stress, the ACF conductive particles will deform on the PNL Bump. (See also...) Figure 5 As shown, the rebound stress is relatively large in the initial state after bonding, and deformation occurs on the PNL Bump with a thickness of h1, as shown in the figure. Figure 5 As shown in deformation 1 in [1], deformation occurs on a PNL Bump with a thickness of h2, as follows: Figure 5 As shown in deformation 2 in [2], it is clear that deformation 1 is smaller on the thicker PNL Bump, while deformation 2 is larger on the thinner PNL Bump.

[0024] See Figure 6 As shown, in the final state after bonding, the rebound stress is reduced, and the deformation generated on the PNL Bump with thickness h1 becomes as follows. Figure 6 As shown in deformation 3 in [1], the deformation generated on the PNL Bump with a thickness of h2 becomes as follows: Figure 6 As shown in deformation 4 in [2], it can be seen that as the rebound stress weakens, for PNL Bump of the same thickness, deformation 3 is smaller than deformation 1, and deformation 4 is smaller than deformation 2.

[0025] Obviously, using a PNL Bump with a second and a third bump cannot directly detect whether the bonding is up to standard, and therefore cannot determine whether the electrical connection between the driver chip and each pin of the glass substrate is normal.

[0026] The preferred embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0027] See Figure 7 As shown in the embodiments of this application, a glass substrate includes at least one first bump and at least one second bump, wherein the first bump and the second bump have different thicknesses in a first direction.

[0028] First, it should be noted that the aforementioned first bump is also a detection bump, meaning it is also an invalid bump for electrical signal transmission. In the embodiments of this application, the first bump and the second bump have different thicknesses in the first direction. This difference in thickness is achieved by thinning at least one conductive layer, meaning that compared to the second bump, which is effective for electrical signal transmission, the first bump includes fewer conductive layers.

[0029] The aforementioned first bump specifically includes: a glass substrate 100, a semiconductor layer disposed on the glass substrate 100, and a first bump layer disposed on the semiconductor layer. The first bump layer includes at least one of a first conductive layer 500, a second conductive layer 600, and a third conductive layer 700 sequentially stacked along a first direction, where the first direction is the direction from the glass substrate 100 to the semiconductor layer. That is, to form the first bump, a semiconductor layer is first disposed on the surface of the glass substrate 100. For example, a buffer layer 200, a gate insulating layer 300, and an interlayer dielectric layer 400 are stacked on the surface of the glass substrate 100. Then, at least one of the first conductive layer 500, the second conductive layer 600, and the third conductive layer 700 is stacked on the surface of the semiconductor layer.

[0030] For example, the first conductive layer 500 is a Gate layer, the second conductive layer 600 is an SD layer, and the third conductive layer 700 is a PITO layer. It should be noted that the first conductive layer 500 can be a molybdenum-aluminum-molybdenum structure. This structure consists of three metal layers: a bottom layer of metallic molybdenum, a middle layer of metallic aluminum, and a top layer of metallic molybdenum. This structure has lower resistivity and lower contact resistance, making it more suitable for fabricating low-temperature polycrystalline silicon transistors.

[0031] For the first scenario, please refer to... Figure 8 As shown, the first bump specifically includes: a glass substrate 100, a semiconductor layer disposed on the surface of the glass substrate 100, and a second conductive layer 600 and a third conductive layer 700 stacked on the side of the semiconductor layer away from the glass substrate 100. That is, the thinning of the first bump is achieved by removing the first conductive layer 500.

[0032] For the second scenario, please refer to [the relevant documentation]. Figure 9 As shown, the first bump specifically includes: a glass substrate 100, a semiconductor layer disposed on the surface of the glass substrate 100, and a first conductive layer 500 and a third conductive layer 700 stacked on the side of the semiconductor layer away from the glass substrate 100. That is, the thinning of the first bump is achieved by removing the second conductive layer 600.

[0033] For the third scenario, please refer to [the relevant documentation]. Figure 10 As shown, the first bump specifically includes: a glass substrate 100, a semiconductor layer disposed on the surface of the glass substrate 100, and a first conductive layer 500 and a second conductive layer 600 stacked on the side of the semiconductor layer away from the glass substrate 100. That is, the thinning of the first bump is achieved by removing the third conductive layer 700.

[0034] It should be noted that the structural composition of the first convex point in the above three cases is only an example of some application scenarios. The composition of the first convex point in the detection process can be flexibly set according to the actual application scenario. The structural composition of the first convex point is not limited to the examples in the above three cases.

[0035] During the testing process, after the driver chip is bonded to the glass substrate, assuming the relative positions of the driver chip and the glass substrate during the bonding process are as follows... Figure 5 As shown, the downward rebound stress will act on the first protrusion, and correspondingly, the conductive particles of the first anisotropic conductive adhesive will generate a first deformation length along the first direction at the first protrusion.

[0036] The aforementioned second bump specifically includes: a glass substrate 100, a semiconductor layer disposed on the glass substrate 100, and a second bump layer disposed on the semiconductor layer. The second bump layer includes a first conductive layer 500, a second conductive layer 600, and a third conductive layer 700 sequentially stacked along a first direction. That is, to form the second bump, a semiconductor layer is first disposed on the surface of the glass substrate 100. For example, a buffer layer 200, a gate insulating layer 300, and an interlayer dielectric layer 400 are stacked on the surface of the glass substrate 100. Then, the first conductive layer 500, the second conductive layer 600, and the third conductive layer 700 are stacked on the surface of the semiconductor layer. In this embodiment, the sequentially stacked first conductive layer 500, second conductive layer 600, and third conductive layer 700 constitute the complete second bump layer.

[0037] During the testing process, after the driver chip is bonded to the glass substrate, assuming the relative positions of the driver chip and the glass substrate during the bonding process are as follows... Figure 5 As shown, the downward rebound stress will act on the second protrusion, and correspondingly, the conductive particles of the second anisotropic conductive adhesive will generate a second deformation length along the first direction at the second protrusion.

[0038] Since the thickness of the first bump and the second bump are different in the first direction, the first deformation length and the second deformation length generated along the first direction are theoretically also different. That is, the first deformation length is smaller and the second deformation length is larger. This is the detection result of normal bonding between the driver chip and the glass substrate at the second bump. If the first deformation length and the second deformation length are detected to be inconsistent with the above rules, it is determined that the bonding between the driver chip and the glass substrate at the second bump is abnormal.

[0039] Based on this, in this embodiment of the application, in order to quickly and easily detect whether the bonding between the driver chip and the glass substrate at the second bump is normal, the length difference between the first deformation length and the second deformation length is used to achieve rapid detection. Considering the differences in the actual process, and also to make the detection results more accurate, a preset range is set in advance during the detection process. Typically, the value of this preset range is very small (including zero). When the difference between the first deformation length and the second deformation length is within the preset range, it is determined that the first deformation length and the second deformation length are the same, and therefore the bonding between the driver chip and the glass substrate at the second bump is abnormal.

[0040] It should be noted that the above difference only includes the difference between the first deformation length and the second deformation length. If it is the difference between the second deformation length and the first deformation length, a negative sign must be added. Accordingly, the above preset range can be a range of values ​​from negative to positive.

[0041] For example, if during the testing process it is found that the difference between the lengths of the first deformation length and the second deformation length is 0, and this value is within the aforementioned preset range, then an adhesion abnormality between the driver chip and the glass substrate at the second bump can be determined. As another example, if during the testing process it is found that the length of the first deformation length is particularly long, while the length of the second deformation length is relatively short, i.e., the difference is a large value, and this value exceeds the aforementioned preset range, then an adhesion abnormality between the driver chip and the glass substrate at the second bump can also be determined.

[0042] The aforementioned first and second bumps are used to detect whether the bonding between the driver chip and the glass substrate at the second bump is normal, based on the deformation length along the first direction. Considering that the deformation between the anisotropic conductive adhesive particles and the driver chip during the bonding process between the driver chip and the glass substrate is three-dimensional—that is, during the compression deformation of the PNL bump, the anisotropic conductive adhesive particles may also burst due to compression, resulting in deformation—to detect whether the deformation caused by the burst is acceptable, the glass substrate in this embodiment further includes at least one third bump, see reference [reference missing]. Figure 7 As shown.

[0043] The aforementioned third bump includes a glass substrate 100 and a semiconductor layer disposed on the glass substrate 100. That is, the third bump, which is an invalid bump for electrical signal transmission, only includes the glass substrate 100 and a semiconductor layer disposed on the surface of the glass substrate 100. For example, a buffer layer (hereinafter referred to as Buffer layer) 200, a gate insulating layer (hereinafter referred to as GI layer) 300 and an interlayer dielectric layer (hereinafter referred to as ILD layer) 400 are stacked on the surface of the glass substrate 100. This makes it more advantageous to observe the aforementioned explosion using a metallographic microscope.

[0044] During the testing process, after the driver chip is bonded to the glass substrate, the conductive particles of the third anisotropic conductive adhesive at the third bump generate a deformation area on the reference surface formed by the intersection of the second and third directions. That is, the deformation caused by the aforementioned burst is considered from a planar perspective. The second direction is parallel to the surface of the glass substrate 100, and the third direction is perpendicular to both the first and second directions. Thus, the reference surface formed by the intersection of the second and third directions is a reference surface parallel to the glass substrate 100. After determining the reference surface, the deformation area generated by the conductive particles of the third anisotropic conductive adhesive at the third bump on this reference surface is observed using a metallographic microscope. This deformation area characterizes the bursting behavior of the conductive particles of the third anisotropic conductive adhesive during the bonding process.

[0045] Additionally, it should be noted that, to ensure greater accuracy in the testing process, please refer to [link / reference needed]. Figure 7 As shown, each first bump, each second bump, and each third bump are all set in the driver bonding area, that is, the number of first bumps, second bumps, and third bumps set in the driver bonding area on the driver chip is usually multiple.

[0046] Since the first and third bumps are both ineffective bumps for electrical signal transmission, while the second bump is an effective bump for electrical signal transmission, the driver chip is essentially bonded to multiple second bumps within the driving bonding area by multiple anisotropic conductive adhesive particles. That is, the electrical signals in the driver chip are only provided to the display panel through each of the second bumps. However, in order to detect the bonding status of the anisotropic conductive adhesive particles at the aforementioned second bumps, in this embodiment, anisotropic conductive adhesive particles are also provided at the aforementioned first bump and at the third bump. Furthermore, the initial morphology and other characteristics of the anisotropic conductive adhesive particles at the first, second, and third bumps are consistent, so as to serve as a reference for detecting the bonding status between the driver chip and the glass substrate at the second bump.

[0047] See Figure 7 As shown, the third protrusion and the first protrusion are arranged adjacent to each other. For example, the third protrusion is located at the outermost edge of the drive bonding area, the first protrusion is located adjacent to the third protrusion, and a second protrusion is located on the side of the first protrusion away from the third protrusion.

[0048] See Figure 7 As shown, the third protrusion, the first protrusion, and the second protrusion are arranged along the second direction in the drive bonding region. Figure 7 It can be seen that the multiple third bumps, first bumps and second bumps set in the driving bonding area are arranged in a straight line along the second direction. On the one hand, this facilitates the bonding of the driving chip with the glass substrate through the driving bonding area, and on the other hand, it facilitates the observation of the bonding state of each anisotropic conductive adhesive conductive particle at different bumps using a metallographic microscope.

[0049] In one embodiment, considering the large number of sub-pixels in the display panel and the typically large number of electrical signals required, the driving bonding area includes a bonding input sub-region and multiple bonding output sub-regions. The bonding input sub-region includes at least one first bump, at least one third bump, and multiple second bumps. See also... Figure 7 As shown, the binding input sub-region includes three third convex points, three first convex points, and six second convex points, arranged in the manner of one third convex point, one first convex point, and three second convex points, and repeated sequentially in the above arrangement.

[0050] Accordingly, each bonded output sub-region includes at least one first convex point, at least one third convex point, and multiple second convex points. See also Figure 7 As shown, the driving bonding region includes two bonding output sub-regions, each of which is arranged in parallel along a third direction. For example, see [link to documentation]. Figure 7 As shown, the arrangement of each bump in each drive bonding region is one third bump, one first bump, and three second bumps, and the arrangement is repeated in sequence.

[0051] Based on the same inventive concept, this disclosure provides a method for detecting glass substrates, applied to a metallographic microscope, see reference. Figure 11 As shown, it includes: Step 201: After bonding the driver chip to the glass substrate, obtain the first deformation length of the conductive particles of the first anisotropic conductive adhesive at the first bump along the first direction, and obtain the second deformation length of the conductive particles of the second anisotropic conductive adhesive at the second bump along the first direction.

[0052] First, it should be noted that, in order to inspect the bonding between the glass substrate and the driver chip, a metallographic microscope is provided in this embodiment. The metallographic microscope has a high magnification and has the ability to accurately observe the microscopic cross-sectional patterns of thin films, metals, etc.

[0053] During the testing process, after the driver chip is bonded to the glass substrate, i.e., after being subjected to elastic stress, the IC bump at the first bump comes into contact with the PNL bump through the conductive particles of the first anisotropic conductive adhesive, and generates a first deformation length along the first direction. The IC bump at the second bump comes into contact with the PNL bump through the conductive particles of the second anisotropic conductive adhesive, and generates a second deformation length along the first direction. The specific values ​​of the first deformation length and the second deformation length are obtained by the aforementioned metallographic microscope.

[0054] Step 202: If the difference between the first deformation length and the second deformation length is within a preset range, then the bonding between the driver chip and the glass substrate at the second bump is determined to be abnormal.

[0055] After obtaining the specific values ​​of the first deformation length and the second deformation length, the second deformation length is subtracted from the first deformation length to obtain the difference between the two deformation lengths. This difference can be positive, negative, or zero; typically, the values ​​represented by the preset range are relatively small. Further comparison is made to see if the obtained difference is within the preset range. Since the thickness of the first and second protrusions is different in the first direction, there should be a difference between the first and second deformation lengths, but the difference should not be too large to indicate that the bonding between the driver chip and the glass substrate is normal.

[0056] Based on this, if the above difference is determined to be within the preset range during the detection process, it means that the difference between the first deformation length and the second deformation length is too small, or even 0. In this case, it is determined that the bonding between the driver chip and the glass substrate at the second bump is abnormal.

[0057] Step 203: If the difference between the first deformation length and the second deformation length exceeds the preset range, it is determined that the bonding between the driver chip and the glass substrate at the second bump is normal.

[0058] During the testing process, if the difference between the first deformation length and the second deformation length exceeds the preset range, it means that the difference between the first deformation length and the second deformation length is consistent with the strain caused by the thickness difference between the first bump and the second bump. In this case, it is determined that the bonding between the driver chip and the glass substrate at the second bump is abnormal.

[0059] Considering that the second bump is an effective bump for electrical signal transmission, electrical signals can only be transmitted normally between the driver chip and each sub-pixel disposed on the glass substrate if the bonding between the driver chip and the glass substrate at the second bump is confirmed to be normal.

[0060] The difference between the first deformation length and the second deformation length reflects the bonding condition at the second protrusion along the first direction. To more comprehensively and accurately detect the bonding condition at the second protrusion, a method for detecting the bonding condition of a glass substrate is provided. (See attached document). Figure 12 As shown, it also includes: Step 204: If the number of breaks in the conductive particles of the third anisotropic conductive adhesive within the area corresponding to the deformation area is less than the set number, then it is determined that the bonding between the driver chip and the glass substrate at the first bump, the second bump, and the third bump is normal.

[0061] Considering that under elastic stress, the conductive particles of the third anisotropic conductive adhesive will generate multiple breaks after bursting, and the number of these breaks reflects the bonding condition between the driver chip and the glass substrate to a certain extent, during the testing process, after each anisotropic conductive adhesive conductive particle generates a deformation area at the corresponding bump along the reference surface formed by the intersection of the second and third directions, the number of breaks in the third anisotropic conductive adhesive conductive particles within the area corresponding to the deformation area is determined by metallographic microscopy. The number of breaks is then compared with a predetermined number. If the comparison determines that the number of breaks is less than the predetermined number, it indicates that the deformation of the third anisotropic conductive adhesive conductive particles during the bonding process is normal. Since the elastic stresses acting at the first, second, and third bumps are equal, it is further determined that the bonding between the driver chip and the glass substrate at the first, second, and third bumps is normal.

[0062] In summary, the embodiments of this disclosure provide a glass substrate and a method for detecting the glass substrate. The glass substrate includes at least one first bump and at least one second bump, wherein the first bump and the second bump have different thicknesses in a first direction. The first bump includes a glass substrate, a semiconductor layer disposed on the glass substrate, and a first bump layer disposed on the semiconductor layer. The first bump layer includes at least one of a first conductive layer, a second conductive layer, and a third conductive layer sequentially stacked along a first direction, where the first direction is the direction from the glass substrate to the semiconductor layer. After the driver chip is bonded to the glass substrate, the conductive particles of the first anisotropic conductive adhesive undergo a first deformation along the first direction at the first bump. The second bump includes a glass substrate, a semiconductor layer disposed on the glass substrate, and a second bump layer disposed on the semiconductor layer. The second bump layer includes a first conductive layer, a second conductive layer, and a third conductive layer stacked sequentially along a first direction. After the driver chip is bonded to the glass substrate, the conductive particles of the second anisotropic conductive adhesive generate a second deformation length at the second bump along the first direction. Since the thicknesses of the first bump layer and the second bump layer are different, the first deformation length and the second deformation length should also be different. Based on this, during the testing process, the difference between the first deformation length and the second deformation length can be used to determine whether the bonding between the driver chip and the glass substrate at the second bump is normal.

[0063] Those skilled in the art will understand that embodiments of this disclosure can be provided as methods, systems, or computer program product systems. Therefore, this disclosure can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this disclosure can take the form of a computer program product system implemented on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0064] This disclosure is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program product systems according to this disclosure. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0065] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0066] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0067] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A glass substrate, characterized in that, include: At least one first protrusion and at least one second protrusion, wherein the first protrusion and the second protrusion have different thicknesses in a first direction; The first bump includes: a glass substrate, a semiconductor layer disposed on the glass substrate, and a first bump layer disposed on the semiconductor layer. The first bump layer includes a portion of the following film layers stacked sequentially along a first direction: a first conductive layer, a second conductive layer, and a third conductive layer. The first direction is the direction from the glass substrate to the semiconductor layer. After the driver chip is bonded to the glass substrate, the conductive particles of the first anisotropic conductive adhesive generate a first deformation length along the first direction at the first bump. The second bump includes: the glass substrate, a semiconductor layer disposed on the glass substrate, and a second bump layer disposed on the semiconductor layer, wherein the second bump layer includes the first conductive layer, the second conductive layer, and the third conductive layer stacked sequentially along a first direction. After the driving chip is bonded to the glass substrate, the conductive particles of the second anisotropic conductive adhesive generate a second deformation length along the first direction at the second bump.

2. The glass substrate as described in claim 1, characterized in that, Also includes: At least one third convex point; The third bump includes: the glass substrate and a semiconductor layer disposed on the glass substrate. After the driving chip is bonded to the glass substrate, the conductive particles of the third anisotropic conductive adhesive generate a deformed area at the third bump on a reference surface formed by the intersection of the second direction and the third direction. The second direction is parallel to the surface of the glass substrate, and the third direction is perpendicular to the first direction and the second direction, respectively.

3. The glass substrate as described in claim 1, characterized in that, Each of the first bumps, each of the second bumps, and each of the third bumps are all disposed in the drive bonding area; The driver chip is bonded to multiple second bumps within the driver bonding area via multiple anisotropic conductive adhesive conductive particles.

4. The glass substrate as described in claim 1, characterized in that, The first bump layer includes the second conductive layer and the third conductive layer stacked sequentially along the first direction.

5. The glass substrate as described in claim 3, characterized in that, The third protrusion is arranged adjacent to the first protrusion.

6. The glass substrate as described in claim 3, characterized in that, The third protrusion, the first protrusion, and the second protrusion are arranged along the second direction in the drive bonding region.

7. The glass substrate as described in claim 6, characterized in that, The driving binding region includes a binding input sub-region and multiple binding output sub-regions, and each of the binding output sub-regions is arranged in parallel along the third direction; The bonding input sub-region includes at least one first bump, at least one third bump, and a plurality of second bumps; Each of the said bonding output sub-regions includes at least one first bump, at least one said third bump, and a plurality of second bumps.

8. The glass substrate as described in claim 1, characterized in that, The first conductive layer is a molybdenum-aluminum-molybdenum structure.

9. A method for detecting a glass substrate as described in any one of claims 1 to 8, characterized in that, Applications in metallurgical microscopes include: After the driver chip is bonded to the glass substrate, the first deformation length of the first anisotropic conductive adhesive conductive particles at the first bump along the first direction is obtained, and the second deformation length of the second anisotropic conductive adhesive conductive particles at the second bump along the first direction is obtained. If the difference between the first deformation length and the second deformation length is within a preset range, then it is determined that the bonding between the driving chip and the glass substrate at the second bump is abnormal. If the difference between the first deformation length and the second deformation length exceeds a preset range, it is determined that the bonding between the driving chip and the glass substrate at the second bump is normal.

10. The detection method as described in claim 9, characterized in that, include: If the number of breaks in the conductive particles of the third anisotropic conductive adhesive within the area corresponding to the deformation area is less than a set number, then it is determined that the bonding between the driving chip and the glass substrate at the first bump, the second bump, and the third bump is normal.

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