Glass package substrate edge filling method and glass package substrate

Abstract

The application discloses a glass packaging substrate edge filling method and a glass packaging substrate. The method comprises the following steps: dividing a glass substrate into a plurality of mutually spaced unit units, and exposing the side wall of each unit unit to the side of a glass core plate; the glass substrate comprises a glass core plate and a multilayer wiring build-up structure formed on the surface of the glass core plate; an edge connection structure is prepared in the gap region between adjacent unit units, the edge connection structure is a pure edge sealing resin structure, or a structure composed of an edge sealing metal layer and an edge sealing resin layer, and the adjacent unit units are connected through the edge connection structure; and the edge connection structure is cut along a preset cutting track, and a plurality of glass packaging substrate unit units with edge sealing structures are separated. The application can balance the edge stress of the substrate, avoid glass edge cracking, and support industrialized mass production.

Description

Technical Field

[0001] This invention relates to the field of glass-based encapsulation substrate manufacturing technology, and in particular to a method for filling the edges of a glass encapsulation substrate with adhesive and a glass encapsulation substrate. Background Technology

[0002] With the evolution of semiconductor technology in the post-Moore era, technologies such as AI high-computing chips, chiplet integration, and high-speed optical interconnects are rapidly iterating. Advanced packaging is developing towards ultra-large size, high-density ultra-fine lines, and high-frequency and high-speed signal transmission, which puts forward stringent requirements on the dimensional stability, high-frequency electrical performance, and large-size process yield of the packaging substrate.

[0003] Traditional ABF organic packaging substrates are limited by the characteristics of the materials themselves, resulting in inherent shortcomings such as a high coefficient of thermal expansion, large dielectric loss, and significant warping in large-size processes, making it difficult to meet the development needs of next-generation high-end packaging.

[0004] Glass materials possess inherent advantages such as low coefficient of thermal expansion, excellent dielectric properties, ultra-high surface flatness, and good insulation. Glass-based packaging substrates can achieve micron-level fine wiring, effectively alleviate the thermal stress deformation problem caused by multi-core stacking, and reduce high-speed signal transmission loss. They are the core carrier for next-generation advanced packaging, and the global industry is currently promoting related process development and production line verification.

[0005] However, the manufacturing process of glass-based packaging substrates faces a difficult-to-overcome reliability bottleneck. Due to significant differences in thermal expansion coefficients, Tg, modulus, thermal conductivity, and water absorption between the glass substrate and the dielectric, circuit, and resin layers in the substrate, internal structural stress tends to concentrate at the edges. This makes the glass substrate edges highly susceptible to cracking and delamination, which in severe cases can lead to board explosion and ultimately product failure.

[0006] To date, there is no mature processing technology in the field that can enable finished glass-based packaging substrates to meet the reliability requirements of mass production. There is also a lack of processing solutions that are simple to implement, have controllable production costs, and can effectively suppress the generation and propagation of cracks at the substrate edges. The industrial mass production of glass-based packaging substrates has always been limited by edge failure issues. There is a continuous technical demand in the field for processing methods that can improve the edge reliability of glass substrates. Summary of the Invention

[0007] The main objective of this invention is to provide a method for filling the edge of a glass encapsulation substrate with adhesive and a glass encapsulation substrate, thereby filling the technical gap in the reliability of glass-based encapsulation substrates, balancing the edge stress of the substrate, preventing cracking of the glass edge, and supporting its industrial mass production.

[0008] The technical solution adopted in this invention is: a method for filling the edge of a glass encapsulation substrate with adhesive, comprising: The glass substrate is divided into multiple spaced-apart unit units, with the sidewalls of each unit unit exposed on the side of the glass core plate; the glass substrate includes a glass core plate and a multilayer wiring layer structure formed on the surface of the glass core plate. An edge connection structure is made in the gap area between adjacent unit units. The edge connection structure is a pure edge sealing resin structure or a structure composed of an edge sealing metal layer and an edge sealing resin layer. The adjacent unit units are connected through the edge connection structure. The edge connection structure is cut along a preset cutting trajectory to separate multiple glass encapsulation substrate unit units with edge sealing structures.

[0009] According to the above technical solution, when the edge connection structure is a composite structure of an edge sealing metal layer and an edge sealing resin layer, the edge sealing metal layer is disposed in the gap between adjacent unit units, the edge sealing resin layer covers the outside of the edge sealing metal layer, and the edge sealing metal layer is attached to the exposed glass core board side of the unit unit or embedded in the edge sealing resin layer.

[0010] According to the above technical solution, the edge sealing metal layer located in the gap between adjacent unit units extends from the side of the glass core board to the multi-layer wiring superposition structure and overlaps on the wiring layers of the superposition structure.

[0011] According to the above technical solution, when the edge connection structure is a pure edge sealing resin structure, the edge sealing resin fills the gap between adjacent unit units and covers the exposed glass core board side of the unit unit.

[0012] According to the above technical solution, the edge sealing metal layer is selected from one of copper layer, nickel layer, and titanium layer.

[0013] According to the above technical solution, the edge sealing resin layer is one of epoxy resin, bottom filler adhesive, and ABF film.

[0014] According to the above technical solution, the method of manufacturing the edge connection structure is selected from one of dispensing, pressing, and spraying.

[0015] According to the above technical solution, the cutting method for severing the edge connection structure is either wheel cutting or laser cutting.

[0016] Another aspect of the present invention provides a glass encapsulation substrate, including a glass core plate, a multilayer wiring layer structure formed on the surface of the glass core plate, and an edge sealing structure disposed on the side of the glass core plate. The glass encapsulation substrate is a segmented independent unit, with the sidewall of each unit exposed on the side of the glass core board; the edge sealing structure is formed by cutting and retaining the edge connection structure in the gap between adjacent unit units, and the edge sealing structure is a pure edge sealing resin structure, or a structure composed of an edge sealing metal layer and an edge sealing resin layer.

[0017] According to the above technical solution, when the edge connection structure is a composite structure of an edge sealing metal layer and an edge sealing resin layer, the edge sealing metal layer is disposed in the gap between adjacent unit units, the edge sealing resin layer covers the outside of the edge sealing metal layer, and the edge sealing metal layer is attached to the exposed glass core board side of the unit unit or embedded in the edge sealing resin layer.

[0018] The beneficial effects of this invention are as follows: By dividing the glass substrate into multiple spaced-apart unit units, exposing the sidewalls of the unit units to the glass core board, and then creating an edge connection structure in the gap area between adjacent unit units to interconnect the units, the edge connection structure is finally cut off to separate the finished unit units. This process sequence can integrally form the edge sealing structure in the unit gaps, and retain it completely at the edge of the finished unit after secondary cutting, avoiding the problem of damage and failure during the cutting process of the pre-embedded edge sealing scheme of large boards. The edge connection structure supports two forms: pure edge sealing resin structure and composite structure of edge sealing metal layer and edge sealing resin layer. The scheme selection is flexible. The composite structure takes into account both rigid support and buffer insulation, effectively reducing the risk of cracking at the edge of the glass encapsulation substrate unit unit. The process route is simple and suitable for industrial production applications.

[0019] Furthermore, in the composite edge sealing structure of the present invention, the edge sealing metal layer can be attached to the exposed glass core board side of the unit or embedded in the edge sealing resin layer, and the resin layer covers the metal layer; the metal provides rigid support to balance stress, and the resin achieves buffer insulation. The two work together to improve the edge protection capability, while the structure is flexible and adaptable to different working conditions.

[0020] Furthermore, the edge-sealing metal layer located in the gap of the present invention extends from the side of the glass core board to the multilayer wiring overlay structure and overlaps on different wiring layers of the overlay structure; this design can flexibly adjust the connection position according to the stress distribution inside the substrate, balance the interface stress between the glass core board and the overlay, and reduce the risk of delamination and edge cracking.

[0021] Furthermore, in the pure edge-sealing resin structure of the present invention, the edge-sealing resin fills the gap between adjacent unit units and covers the exposed glass core board side of the unit unit; it achieves basic protection of the glass edge at a lower cost and is suitable for glass encapsulation substrates with lower stress requirements. Attached Figure Description

[0022] Figure 1This is a flowchart of the glass encapsulation substrate edge filling method according to an embodiment of the present invention; Figure 2 This is a cross-sectional view of the glass substrate according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of the glass substrate after its initial cutting, according to an embodiment of the present invention. Figure 4 This is a cross-sectional view of the glass substrate of an embodiment of the present invention after being sealed with pure resin; Figure 5 This is a cross-sectional view of the glass substrate of an embodiment of the present invention after the metal layer and resin layer are laminated and sealed. Figure 6 This is a cross-sectional view of a glass substrate after the metal layer and resin layer are laminated and sealed, according to another embodiment of the present invention. Figure 7 This is a cross-sectional view of the glass substrate with pure resin edge sealing after molding and cutting according to an embodiment of the present invention; Figure 8 This is a cross-sectional view of the glass substrate after molding and cutting, which is sealed with a composite metal layer and resin layer according to an embodiment of the present invention. Figure 9 Cross-sectional view of a glass substrate with composite edge sealing of metal layer and resin layer according to the second embodiment of the present invention after molding and cutting; Figure 10 Cross-sectional view of a glass substrate with composite edge sealing of metal layer and resin layer according to the third embodiment of the present invention after molding and cutting; Figure 11 Cross-sectional view of a glass substrate with composite edge sealing of metal layer and resin layer according to the fourth embodiment of the present invention after molding and cutting; Figure 12 Cross-sectional view of a glass substrate with composite edge sealing of metal layer and resin layer according to the fifth embodiment of the present invention after molding and cutting; Figure 13 A cross-sectional view of a glass substrate after molding and cutting, which is a composite edge-sealed glass substrate with a metal layer and a resin layer according to the sixth embodiment of the present invention.

[0023] Reference numerals: 1. Addition layer material; 2. Circuit layer; 3. TGV via; 4. Glass core board; 5. Resin layer; 6. Metal layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0025] Example 1 This embodiment provides a method for filling the edge of a glass encapsulation substrate with adhesive, the process of which is as follows: Figure 1 As shown, the steps include: S1. The glass substrate is divided into multiple spaced-apart unit units, and the sidewalls of each unit unit are exposed on the side of the glass core plate 4. The glass substrate includes the glass core plate 4 and a multilayer wiring layer structure formed on the surface of the glass core plate 4. The multilayer wiring layer structure includes a layer material 1 and a circuit layer 2. The glass core plate 4 is provided with TGV holes 3 inside.

[0026] S2. An edge connection structure is made in the gap area between adjacent unit units. The edge connection structure is a pure edge sealing resin structure or a structure composed of a metal layer 6 and a resin layer 5. The adjacent unit units are connected through the edge connection structure.

[0027] Furthermore, when the edge connection structure fabricated in S2 is a composite structure of metal layer 6 and resin layer 5, the metal layer 6 is disposed in the gap between adjacent unit units, the resin layer 5 covers the outside of the metal layer 6, and the metal layer 6 is attached to the exposed side of the glass core plate 4 of the unit unit or embedded in the resin layer 5.

[0028] Furthermore, the metal layer 6 located in the gap between adjacent unit cells extends from the side of the glass core board 4 into the multilayer wiring stack-up structure and overlaps on different line layers 2 within the stack-up structure.

[0029] Furthermore, when the edge connection structure made in S2 is a pure edge sealing resin structure, the resin layer 5 fills the gap between adjacent unit units and covers the exposed glass core plate 4 side of the unit unit.

[0030] Furthermore, the metal layer 6 can be selected from one of copper layer, nickel layer, and titanium layer; the resin layer 5 can be one of epoxy resin, bottom filler adhesive, and ABF film.

[0031] Furthermore, the method for creating the edge connection structure of S2 can be selected from one of dispensing, pressing, or spraying.

[0032] Furthermore, the coverage ratio of the edge connection structure along the sidewall of the unit directly affects the edge protection effect. Preferably, the edge connection structure covers 50% to 100% of the sidewall of the unit. The higher the coverage ratio, the more complete the edge sealing structure's coverage and constraint of the unit edge, the more significant the edge stress balance effect, and the stronger the ability to suppress glass edge cracking. When the edge connection structure covers the entire height of the unit sidewall, i.e., the coverage ratio is 100%, the exposed glass core plate 4 sides of the unit and its adjacent add-on structure are completely covered by the edge sealing structure, which is the optimal embodiment of the present invention.

[0033] S3. Cut the edge connection structure along the preset cutting trajectory to separate multiple glass encapsulation substrate unit units with edge sealing structures.

[0034] Furthermore, S3 cuts off the edge connection structure by using a cutting wheel or laser cutting.

[0035] Based on the above method, this embodiment also provides a glass encapsulation substrate. The glass encapsulation substrate includes a glass core plate 4, a multilayer wiring add-on structure formed on the surface of the glass core plate 4, and an edge sealing structure disposed on the side of the glass core plate 4. The multilayer wiring add-on structure includes add-on material 1 and a circuit layer 2. TGV holes 3 are provided within the glass core plate 4. The glass encapsulation substrate is a segmented independent unit unit, with the sidewalls of each unit unit exposed on the side of the glass core plate 4. The edge sealing structure is formed by retaining the edge connection structure within the gap between adjacent unit units after cutting. The edge sealing structure is a pure resin layer 5 structure, or a structure composed of a metal layer 6 and a resin layer 5.

[0036] Furthermore, when the edge sealing structure is a composite structure of metal layer 6 and resin layer 5, the metal layer 6 is disposed in the gap between adjacent unit units, the resin layer 5 covers the outside of the metal layer 6, and the metal layer 6 is attached to the exposed side of the glass core plate 4 of the unit unit or embedded in the resin layer 5.

[0037] Example 2 Based on the edge filling method of the glass encapsulation substrate described in Example 1, this example provides a specific implementation of a 6-layer glass-based encapsulation substrate.

[0038] like Figure 2 As shown, the glass substrate includes a glass core plate 4, the glass core plate 4 has TGV holes 3 inside, and the upper and lower surfaces of the glass core plate 4 are formed with a 6-layer multilayer wiring addition structure, the multilayer wiring addition structure includes addition material 1 and circuit layer 2.

[0039] like Figure 3 As shown, the glass substrate is cut for the first time to divide it into multiple spaced-apart unit units, with the sidewalls of each unit unit exposed on the side of the glass core plate 4.

[0040] like Figure 4 As shown, when the edge connection structure is a pure resin layer 5 structure, the resin layer 5 fills the gap between adjacent unit units and covers the exposed glass core plate 4 side of the unit unit.

[0041] like Figure 5 and Figure 6As shown, when the edge connection structure is a composite structure of a metal layer 6 and a resin layer 5, the metal layer 6 is disposed within the gap between adjacent unit units, and the resin layer 5 covers the outside of the metal layer 6. Figure 5 The shape of the metal layer 6 attached to the exposed glass core plate 4 side of the unit is shown; Figure 6 The metal layer 6 is shown to be embedded within the resin layer 5.

[0042] Furthermore, combined Figure 5 and Figure 6 The metal layer 6, located in the gap between adjacent unit cells, extends from the side of the glass core board 4 into the 6-layer multilayer wiring add-on structure and overlaps with different circuit layers 2 within the add-on structure. For a 6-layer glass substrate packaging substrate, the metal layer 6 can be selectively overlapped with any one or more circuit layers 2 from the 1st to the 6th layer, depending on the internal stress distribution.

[0043] like Figures 7 to 13 As shown, the edge connection structure is cut along a preset cutting trajectory to separate multiple glass encapsulation substrate unit units with edge sealing structures.

[0044] in, Figure 7 It shows Figure 4 The shape of a pure resin edge-sealing structure after cutting; Figure 8 It shows Figure 5 The shape of the metal layer 6 bonded to the glass core board 4 after cutting; Figure 9 It shows Figure 6 The metal layer 6 is embedded in the resin layer 5 after being cut; Figures 10 to 13 The following are shown as the forming forms of various composite edge sealing structures after cutting, where different circuit layers 2 overlap in the 6-to-6-layer metal layer stacking structure. All of the above forms can be adapted to the 6-layer glass substrate packaging substrate of this embodiment.

[0045] In summary, the present invention provides a method for filling the edges of a glass encapsulation substrate with adhesive and a glass encapsulation substrate, which can balance the stress at the edge of the substrate, prevent cracking at the glass edge, and support its industrial mass production.

[0046] It should be noted that, depending on the implementation needs, the various steps / components described in this application can be broken down into more steps / components, or two or more steps / components or parts of the operation of steps / components can be combined into new steps / components to achieve the purpose of this invention.

[0047] The order of the steps in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0048] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for filling the edge of a glass encapsulation substrate with adhesive, characterized in that, include: The glass substrate is divided into multiple spaced-apart unit units, with the sidewalls of each unit unit exposed on the side of the glass core board. The glass substrate includes a glass core and a multilayer wiring layer structure formed on the surface of the glass core. An edge connection structure is made in the gap area between adjacent unit units. The edge connection structure is a pure edge sealing resin structure or a structure composed of an edge sealing metal layer and an edge sealing resin layer. The adjacent unit units are connected through the edge connection structure. The edge connection structure is cut along a preset cutting trajectory to separate multiple glass encapsulation substrate unit units with edge sealing structures.

2. The method for filling the edge of a glass encapsulation substrate with adhesive according to claim 1, characterized in that, When the edge connection structure is a composite structure of an edge sealing metal layer and an edge sealing resin layer, the edge sealing metal layer is located in the gap between adjacent unit units, the edge sealing resin layer covers the outside of the edge sealing metal layer, and the edge sealing metal layer is attached to the exposed glass core board side of the unit unit or embedded in the edge sealing resin layer.

3. The method for filling the edge of a glass encapsulation substrate according to claim 2, characterized in that, The edge sealing metal layer located in the gap between adjacent unit cells extends from the side of the glass core board to the multi-layer wiring overlay structure and overlaps on different wiring layers of the overlay structure.

4. The method for filling the edge of a glass encapsulation substrate according to claim 1, characterized in that, When the edge connection structure is a pure edge sealing resin structure, the edge sealing resin fills the gap between adjacent unit units and covers the exposed glass core board side of the unit unit.

5. The method for filling the edge of a glass encapsulation substrate with adhesive according to claim 1, characterized in that, The edge-sealing metal layer is selected from one of the following: copper layer, nickel layer, and titanium layer.

6. The method for filling the edge of a glass encapsulation substrate with adhesive according to claim 1, characterized in that, The edge sealing resin layer is made of one of epoxy resin, bottom filler adhesive, or ABF film.

7. The method for filling the edge of a glass encapsulation substrate according to claim 2, characterized in that, The method for creating the edge connection structure is selected from one of the following: dispensing, pressing, or spraying.

8. The method for filling the edge of a glass encapsulation substrate according to claim 1, characterized in that, The cutting method for severing the edge connection structure is either wheel cutting or laser cutting.

9. A glass encapsulation substrate, characterized in that, It includes a glass core board, a multilayer wiring layer structure formed on the surface of the glass core board, and an edge sealing structure provided on the side of the glass core board; The glass encapsulation substrate is a segmented independent unit, with the sidewall of each unit exposed on the side of the glass core board; the edge sealing structure is formed by cutting and retaining the edge connection structure in the gap between adjacent unit units, and the edge sealing structure is a pure edge sealing resin structure, or a structure composed of an edge sealing metal layer and an edge sealing resin layer.

10. The glass encapsulation substrate according to claim 9, characterized in that, When the edge connection structure is a composite structure of an edge sealing metal layer and an edge sealing resin layer, the edge sealing metal layer is located in the gap between adjacent unit units, the edge sealing resin layer covers the outside of the edge sealing metal layer, and the edge sealing metal layer is attached to the exposed glass core board side of the unit unit or embedded in the edge sealing resin layer.

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