Integrated circuit device and method of manufacturing the same

Abstract

Embodiments of the present application disclose an integrated circuit device and a method of manufacturing the same. The integrated circuit device includes a die, an interconnect at least partially overlapping the die, and a plurality of bumps in an area where the interconnect overlaps the die. The interconnect includes at least a first conductive layer and a second conductive layer, and the plurality of bumps includes first and second bumps spaced apart along a first direction. Each of the first and second conductive layers includes a plurality of signal conductors between the first and second bumps and a plurality of ground conductors between the first and second bumps. All of the signal conductors in each of the first and second conductive layers between the first and second bumps are between respective pairs of ground conductors in the respective conductive layer, and the pairs of ground conductors are continuously coupled from a first side of the plurality of signal conductors to a second side of the plurality of signal conductors within the first and second conductive layers.