High-precision, high-lean chip eutectic device and method

Abstract

The application belongs to the technical field of semiconductor manufacturing, and particularly relates to a high-precision and high-lean chip eutectic device and method, which comprises a mounting area; the mounting area comprises a main bonding head device, a first auxiliary bonding head device and a second auxiliary bonding head device; the substrate feeding device is located on the right side of the device; the first auxiliary bonding head device undertakes the functions of substrate feeding and finished product discharging, the second auxiliary bonding head device undertakes the functions of chip feeding and initial positioning and feeding, and the main bonding head device undertakes the core function of precise chip mounting; through adoption of a lean and simple layout design, the substrate feeding device, the chip feeding device, the eutectic area and the finished product discharging device are all located on one side of the mounting area and are sequentially arranged, the layout is compact and simple, the overall structural layout and logistics scheme of the device are that the two sides synchronously converge to the middle part, and then the lean and simple scheme is output from the middle part, which is beneficial to guaranteeing the precision of the device, improving the safety of products, facilitating personnel operation, reducing the size of the device and reducing the cost of the device.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically a high-precision, high-efficiency chip eutectic equipment and method. Background Technology

[0002] The eutectic bonding process is an advanced packaging technology that precisely places a chip on a substrate and heats the contact surfaces of the substrate and the chip to form eutectic points between different metals on the closely contacting substrate and chip surfaces, thereby achieving a precise connection.

[0003] With the booming development of the semiconductor industry, the chip packaging process has placed stricter and more comprehensive requirements on core equipment, such as eutectic machines, in terms of precision, efficiency, cost, and size.

[0004] However, in the existing technology, the overall hardware architecture of the equipment is not compact, the process actions are not continuous, and the material and product transfer paths are not lean, resulting in losses in equipment accuracy, efficiency, and cost. At the same time, the various process function modules inside the equipment are scattered, and the motion function modules have intersecting motion paths and complex structures, resulting in excessively long motion paths and long waiting times, which in turn leads to decreased accuracy, reduced efficiency, and excessively large equipment size, affecting production line layout and equipment maintenance. Therefore, this invention provides a high-precision and high-efficiency chip eutectic equipment and method. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0006] The technical solution adopted by this invention to solve its technical problem is as follows: A high-precision, high-efficiency chip eutectic bonding device, comprising a mounting area; the mounting area includes a main bonding head device, a first auxiliary bonding head device, and a second auxiliary bonding head device; a substrate loading device is located on the right side of the device; a chip loading device is located on the left side of the device; the eutectic bonding area is located in the middle of the device; the eutectic bonding area includes a transfer station device, a eutectic bonding stage device, and a lower camera device; a finished product unloading device is located at the front of the device; the first auxiliary bonding head device takes a substrate from the substrate loading device and transfers it onto the eutectic bonding stage device; the second auxiliary bonding head device takes a chip from the chip loading device and transfers it onto the transfer station device for initial positioning; the main bonding head device takes a chip from the transfer station device and, after detection by the lower camera device, mounts it onto the substrate on the eutectic bonding stage device for eutectic heating; the first auxiliary bonding head device takes the eutectic-bonded finished chip and places it onto the finished product unloading device.

[0007] Preferably, the main mounting surface of each module of the equipment is made of natural marble, with a flatness accuracy of not less than 5µm.

[0008] Preferably, the motion repeatability of the main head assembly, the first auxiliary head assembly, and the second auxiliary head assembly is ±1µm, and their motion trajectories are consistent in layout design.

[0009] Preferably, the transfer station device consists of a transfer station base and a transfer station adsorption plate; the transfer station adsorption plate is made of precision microporous ceramic material; the transfer station adsorption plate is embedded in the transfer station base.

[0010] Preferably, the main bonding head device has a main bonding head camera module on its side wall; the first auxiliary bonding head device has a first auxiliary bonding head camera module on its side wall; the second auxiliary bonding head device has a second auxiliary bonding head camera module on its side wall; the eutectic region has a lower camera module; and the visual detection accuracy is above ±1µm.

[0011] Preferably, the main head device is equipped with a main head height measuring module on its side wall; the first auxiliary head device is equipped with a first auxiliary head height measuring module on its side wall; the second auxiliary head device is equipped with a second auxiliary head height measuring module on its side wall; and the detection accuracy is ±5µm.

[0012] Preferably, the eutectic stage device includes a eutectic stage base, a eutectic stage cover, and a eutectic stage temperature control plate; the eutectic stage temperature control plate is made of aluminum nitride material, with a temperature control accuracy of ±3℃ and a surface temperature uniformity of ±5℃.

[0013] Preferably, a second eutectic stage device is installed in the eutectic region; the second eutectic stage device is configured the same as the eutectic stage device; when the eutectic stage device performs eutectic operation, the second eutectic stage device performs substrate loading operation or chip finished product unloading operation.

[0014] Preferably, the first sub-bonding device is equipped with at least two sub-bonding modules, which independently handle the loading and unloading of substrate materials and finished chips.

[0015] A high-precision, high-efficiency chip eutectic method, applied to the high-precision, high-efficiency chip eutectic equipment described in any one of the above-mentioned methods, includes the following steps: Step 1: The first auxiliary bonding device moves above the substrate feeding device to pick up the substrate material, conveys it and places it on the eutectic stage device, which then activates vacuum adsorption to fix the substrate material. Step 2: The second auxiliary bonding device moves above the chip feeding device to pick up the chip material, conveys it and places it on the transfer table adsorption plate of the transfer table device. The transfer table device starts vacuum adsorption to fix the chip material for initial positioning. Step 3: The main bonding head device moves above the transfer station device to pick up the chip material, transmits it to the lower camera device for position detection, and then accurately places it on the substrate material surface on the eutectic stage device and presses it to hold it. Step 4: The eutectic stage device performs eutectic heating according to the set heating, holding and cooling parameters to complete the chip eutectic process; Step 5: During the eutectic process, the first bonding head device simultaneously picks up substrate material from the substrate loading device and places it on the second eutectic stage device; the second bonding head device simultaneously picks up chip material from the chip loading device and places it on the transfer station device. Step Six: After the eutectic process is completed, the main bonding head device picks up the next chip material and repeats steps three and four. At the same time, the first auxiliary bonding head device picks up the finished chip from the eutectic stage device that has completed the eutectic process, and transfers and places it in the finished product unloading device.

[0016] The beneficial effects of this invention are as follows: 1. The high-precision and lean chip eutectic bonding equipment and method described in this invention adopts a lean and minimalist layout design. The substrate loading device, chip loading device, eutectic bonding area, and finished product unloading device are all located on one side of the mounting area and arranged in sequence. The layout is compact and simple. The overall equipment architecture layout and logistics scheme are a lean and minimalist scheme in which both sides converge towards the middle and then output from the middle. This helps to ensure equipment accuracy, improve product safety, facilitate personnel operation, reduce equipment size, and reduce equipment cost.

[0017] 2. The high-precision and high-efficiency chip eutectic equipment and method described in this invention utilizes natural marble material, which has excellent structural stability and deformation resistance. This ensures that the equipment base platform maintains high flatness over a long period, providing a stable and reliable installation reference for each motion module and reducing precision loss caused by base deformation. Attached Figure Description

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the overall layout of the die bonding equipment in this invention; Figure 2 This is a schematic diagram of the structure of the main head height measuring module in this invention; Figure 3 This is a schematic diagram of the structure of the first auxiliary head height measuring module in this invention; Figure 4 This is a schematic diagram of the structure of the second auxiliary head height measuring module in this invention; Figure 5 This is a schematic diagram of the substrate loading motion module in this invention; Figure 6 This is a schematic diagram of the chip loading motion module in this invention; Figure 7 This is a schematic diagram of the structure of the transfer platform in this invention; Figure 8 This is a schematic diagram of the structure of the compositing platform of the present invention; Figure 9 This is a schematic diagram of the lower camera mount in this invention; Figure 10 This is a schematic diagram of the method flow in this invention.

[0020] In the diagram: 1. Main bonding head device; 2. First sub-bonding head device; 3. Second sub-bonding head device; 4. Substrate loading device; 5. Chip loading device; 6. Transfer station device; 7. First eutectic stage device; 7. Second eutectic stage device; 8. Lower camera device; 9. Finished product unloading device; 11. Main bonding head height measurement module; 12. Main bonding head upper camera module; 13. Main bonding head module; 21. First sub-bonding head height measurement module; 22. First sub-bonding head upper camera module; 23. 31. First sub-mount module; 32. Second sub-mount height measurement module; 33. Second sub-mount upper camera module; 44. Second sub-mount module; 45. Substrate loading motion module; 46. Substrate loading tray module; 57. Chip loading motion module; 58. Chip loading tray module; 69. Transfer station base; 60. Transfer station adsorption tray; 71. Eutectic stage base; 72. Eutectic stage outer cover; 73. Eutectic stage temperature control board; 84. Lower camera base; 85. Lower camera module. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0022] like Figure 1-9As shown in the embodiment of the present invention, a high-precision, high-efficiency chip eutectic bonding equipment includes a mounting area; the mounting area includes a main bonding head device 1, a first sub-bonding head device 2, and a second sub-bonding head device 3; a substrate loading device 4 is located on the right side of the equipment; a chip loading device 5 is located on the left side of the equipment; the eutectic bonding area is located in the middle of the equipment; the eutectic bonding area includes a transfer station device 6, a eutectic bonding stage device 7, and a lower camera device 8; a finished product unloading device 9 is located at the front of the equipment; the first sub-bonding head device 2 takes the substrate from the substrate loading device 4. The first substrate is placed on the eutectic stage device 7; the second auxiliary bonding head device 3 takes the chip from the chip loading device 5 and places it on the transfer station device 6 for initial positioning; the main bonding head device 1 takes the chip from the transfer station device 6 and, after being detected by the lower camera device 8, mounts it onto the substrate on the eutectic stage device 7 for eutectic heating; the first auxiliary bonding head device 2 takes the finished chip after eutectic bonding and places it on the finished product unloading device 9; in use, the first auxiliary bonding head device 2 performs the dual functions of substrate loading and finished product unloading. The substrate is picked up from the right-side substrate loading device 4 and precisely transferred to the central eutectic stage device 7. After the chip eutectic bonding is completed, the finished chip is removed from the eutectic stage and transferred to the output device of the front finished product unloading device 9. The second auxiliary bonding head device 3 is responsible for chip loading and initial positioning feeding functions. It picks up the chip from the left-side chip loading device 5 and transfers it to the central transfer station device 6 to complete the chip position correction and provide standardized feeding for the main bonding head device 1. The main bonding head device 1 is responsible for the core function of chip precision mounting. It picks up the initially positioned chip from the transfer station and passes it through the lower camera device 8. After completing the chip orientation and position detection, the chip is accurately mounted on the substrate of the eutectic stage, triggering the eutectic heating process. In this process, through the adoption of a lean and minimalist layout design, the substrate loading device 4, chip loading device 5, eutectic area, and finished product unloading device 9 are all located on one side of the mounting area and arranged in sequence. The layout is compact and simple. The overall equipment architecture layout and logistics plan are a lean and minimalist solution that converges from both sides to the middle and then outputs from the middle. This helps to ensure equipment accuracy, improve product safety, facilitate personnel operation, reduce equipment size, and reduce equipment costs.

[0023] like Figure 1-9As shown, the main mounting surface of each module of the equipment is made of natural marble, with a flatness accuracy of not less than 5µm. During use, the main mounting surface of each functional module of the equipment is made of natural marble. Utilizing the material characteristics of marble, such as high rigidity, low deformation, and low coefficient of thermal expansion, the flatness accuracy of the main mounting surface is guaranteed to be not less than 5µm. This provides a unified, stable, and deformation-free installation benchmark for all modules, eliminating accuracy deviations caused by base deformation and vibration from the foundation level, and solidifying the overall accuracy foundation of the equipment. In this process, the natural marble material has excellent structural stability and anti-deformation ability, which can ensure that the equipment foundation platform maintains high flatness for a long time, providing a stable and reliable installation benchmark for each moving module and reducing accuracy loss caused by foundation deformation.

[0024] like Figure 1-9 As shown, the main mounting head device 1, the first auxiliary mounting head device 2, and the second auxiliary mounting head device 3 have a motion repeatability of ±1µm, and their motion trajectories are designed to overlap in layout. In use, the main mounting head device 1, the first auxiliary mounting head device 2, and the second auxiliary mounting head device 3 all adopt high-precision structural design and precision component assembly, achieving a motion repeatability of ±1µm. Furthermore, the overlapping motion trajectory layout of the three reduces the cumulative motion error caused by trajectory intersections and inconsistent references among multiple motion modules, significantly reducing positioning deviations and ensuring the positional accuracy of the entire chip picking, transfer, and mounting process. During this process, through the adoption of a simple and precise structural design and high-precision component assembly, all three mounting head devices achieve sub-micron level motion repeatability. Simultaneously, the spatially overlapping motion trajectories of the three effectively reduce reference errors and relative motion errors between motion modules, further improving overall mounting accuracy.

[0025] like Figure 1-9 As shown, the transfer station device 6 consists of a transfer station base 61 and a transfer station adsorption plate 62; the transfer station adsorption plate 62 is made of precision microporous ceramic material; the transfer station adsorption plate 62 is embedded in the transfer station base 61; in use, the transfer station device 6 consists of the transfer station base 61 and the precision microporous ceramic adsorption plate 62, with the adsorption plate 62 embedded in the transfer station base 61. Assembly accuracy is ensured through overall precision machining. The precision microporous ceramic adsorption plate can achieve uniform vacuum adsorption of chips, reducing chip adsorption offset and deformation. The chip passes through the transfer station base 61... The turntable completes the initial positioning calibration, correcting random positional deviations after chip loading and reducing the difficulty of main bonding head placement. The adsorption plate has a detachable structure and can be quickly replaced when worn or when chip specifications change, adapting to the initial positioning requirements of different chips. During this process, the precision microporous ceramic material has high flatness, high wear resistance and uniform pore distribution, which can achieve vacuum adsorption of the chip while completing the initial positioning. When the turntable adsorption plate 62 wears or the chip specifications change, the entire turntable device 6 can be easily replaced or the configuration quantity can be adjusted, thereby ensuring the chip positioning accuracy before placement.

[0026] like Figure 1-9 As shown, the main bonding head device 1 has a main bonding head camera module 12 configured on its side wall; the first auxiliary bonding head device 2 has a first auxiliary bonding head camera module 22 configured on its side wall; the second auxiliary bonding head device 3 has a second auxiliary bonding head camera module 32 configured on its side wall; a lower camera module 82 is provided in the eutectic region; the visual inspection accuracy is above ±1µm; in use, the device adopts a dual-vision collaborative inspection architecture to achieve closed-loop control of accuracy throughout the entire process. The main bonding head camera module 12, the first auxiliary bonding head camera module 22, and the second auxiliary bonding head camera module 32 detect the pickup position and orientation of the substrate and chip in real time. The lower camera module 82 in the crystal area performs precise position and orientation detection on the chip picked up by the main bonding head, with a visual inspection accuracy of ±1μm. The system acquires the detection data in real time, automatically calculates the position deviation, and performs dynamic error compensation for the bonding head movement to ensure the matching accuracy between the chip mounting position and the substrate. In this process, the main bonding head camera module 12, the first sub-bonding head camera module 22, and the second sub-bonding head camera module 32 are used to perform visual inspection and confirmation of the materials, while the lower camera module 82 is used to perform precise position detection on the chip. The two work together to perform error detection and compensation in a timely and accurate manner, ensuring the chip mounting position accuracy.

[0027] like Figure 1-9 As shown, the main bonding head device 1 has a main bonding head height measurement module 11 configured on its side wall; the first auxiliary bonding head device 2 has a first auxiliary bonding head height measurement module 21 configured on its side wall; and the second auxiliary bonding head device 3 has a second auxiliary bonding head height measurement module 31 configured on its side wall. The detection accuracy is ±5µm. In use, the substrate loading device 4, chip loading device 5, and eutectic stage are detected in real time by the ±5µm high-precision height measurement of the main bonding head height measurement module 11, the first auxiliary bonding head height measurement module 21, and the second auxiliary bonding head height measurement module 31. The working surface flatness and height parameters of device 7 are automatically compensated for height deviation, reducing uneven chip mounting pressure and excessive mounting height caused by uneven surface, ensuring tight bonding between the chip and the substrate, and providing a stable foundation for the eutectic process. During this process, the height measurement module can accurately detect the flatness of the working surfaces of substrate loading device 4, chip loading device 5, and eutectic stage device 7, and perform height compensation before mounting to reduce uneven mounting pressure or positional deviation caused by surface height differences, thereby improving mounting accuracy.

[0028] like Figure 1-9As shown, the eutectic stage device 7 includes a eutectic stage base 71, a eutectic stage outer cover 72, and a eutectic stage temperature control plate 73. The eutectic stage temperature control plate 73 is made of aluminum nitride material, with a temperature control accuracy of ±3℃ and a surface temperature uniformity of ±5℃. In use, the eutectic stage device 7 adopts a composite structure design of a high-performance alloy base, a heat-insulating outer cover, and an aluminum nitride temperature control plate. The eutectic stage base 71 is made of a thermally stable high-performance alloy to ensure structural rigidity and long-term thermal stability. The eutectic stage outer cover 72 effectively isolates heat conduction and heat radiation, reducing heat interference with other precision modules of the equipment. The aluminum nitride eutectic stage temperature control plate 73 has excellent heat conduction performance, achieving rapid temperature uniformity. Uniform heat transfer and precise temperature control system execute heating, holding, and cooling process parameters with a temperature control accuracy of ±3℃ and a surface temperature uniformity of ±5℃. This ensures the stable formation of eutectic points on the metal or alloy contact surfaces between the chip and the substrate, guaranteeing eutectic connection strength and process reliability. During this process, the eutectic stage 71 is made of high-performance alloy material with stable thermal performance. The eutectic stage cover 72 effectively isolates heat conduction and radiation, ensuring operational safety and reducing the thermal impact on the equipment environment. The aluminum nitride eutectic stage temperature control board 73 has excellent thermal conductivity, enabling high-precision and high-uniformity temperature control to meet the stringent temperature profile requirements of different eutectic processes.

[0029] like Figure 1-9 As shown, a second eutectic stage device 74 is installed in the eutectic region; the second eutectic stage device 74 is configured identically to the eutectic stage device 7; when the eutectic stage device 7 performs eutectic operation, the second eutectic stage device 74 performs substrate loading or chip unloading operations; in use, the eutectic region is equipped with a second eutectic stage device 74 that is exactly the same as the eutectic stage device 7, and a parallel operation mode is adopted to break the capacity bottleneck. When the eutectic stage device 7 performs the core process of chip eutectic heating, the second eutectic stage device 74 simultaneously performs the auxiliary process of substrate loading or finished product unloading. The two eutectic stages work alternately without process waiting time, and the actions do not overlap, resulting in a smooth and efficient process that greatly improves the overall output efficiency of the equipment. In this process, the waiting time of the eutectic heating process is effectively eliminated through the parallel operation mode of the dual eutectic stages, greatly improving the output efficiency of the equipment. When one eutectic stage is heating, the other eutectic stage can simultaneously perform substrate loading, chip mounting, or finished product unloading, realizing streamlined parallel processing.

[0030] like Figure 1-9As shown, the first sub-mounting device 2 is equipped with at least two sets of sub-mounting modules, which independently handle the picking and placing of substrate materials and finished chips. In use, the first sub-mounting device 2 is equipped with at least two independent sub-mounting modules. The two modules work independently and synchronously. One sub-mounting module is dedicated to picking up and loading substrate materials, while the other sub-mounting module is dedicated to picking up and unloading finished chips. The two modules do not have any action conflicts or waiting intervals, and synchronously complete the substrate loading and finished chip unloading, further shortening the process cycle and improving equipment operating efficiency. In this process, the first sub-mounting device 2 undertakes the dual tasks of substrate loading and finished chip unloading. By configuring at least two sets of independently moving sub-mounting modules, parallel operation of substrate picking and placing and finished chip picking and placing can be realized, reducing the serial waiting time of a single mounting module and further improving equipment efficiency.

[0031] like Figure 10 As shown, a high-precision, high-efficiency chip eutectic method is applied to the high-precision, high-efficiency chip eutectic equipment described in any one of the above-mentioned methods. The method includes the following steps: Step 1: The first auxiliary bonding device 2 moves above the substrate feeding device 4 to pick up the substrate material, conveys it and places it on the eutectic stage device 7. The eutectic stage device 7 starts vacuum adsorption to fix the substrate material. Step 2: The second auxiliary bonding device 3 moves above the chip feeding device 5 to pick up the chip material, conveys it and places it on the transfer platform adsorption plate 62 of the transfer platform device 6. The transfer platform device 6 starts vacuum adsorption to fix the chip material for initial positioning. Step 3: The main bonding head device 1 moves above the transfer station device 6 to pick up the chip material, transfers it to the lower camera device 8 for position detection, and then accurately places it on the substrate material surface on the eutectic stage device 7 and presses it to hold it. Step 4: The eutectic stage device 7 performs eutectic heating according to the set heating, holding and cooling parameters to complete the chip eutectic process; Step 5: During the eutectic process, the first sub-bonding device 2 simultaneously picks up substrate material from the substrate loading device 4 and places it on the second eutectic stage device 74; the second sub-bonding device 3 simultaneously picks up chip material from the chip loading device 5 and places it on the transfer station device 6. Step Six: After the eutectic process is completed, the main bonding head device 1 picks up the next chip material and repeats steps three and four. At the same time, the first auxiliary bonding head device 2 picks up the finished chip from the eutectic stage device 7 that has completed the eutectic process, and transfers and places it in the finished product unloading device 9.

[0032] During operation, the first bonding head device 2 performs dual functions of substrate loading and finished product unloading. It picks up the substrate from the right-side substrate loading device 4 and accurately transfers it to the central eutectic stage device 7. After the chip eutectic bonding is completed, the finished chip is removed from the eutectic stage and transferred to the output device 9 at the front. The second bonding head device 3 performs chip loading and initial positioning feeding functions. It picks up the chip from the left-side chip loading device 5 and transfers it to the central transfer station device 6 to complete chip position correction, providing standardized feeding for the main bonding head device 1. The main bonding head device 1 performs the core function of precise chip mounting. It picks up the initially positioned chip from the transfer station, and the lower camera device 8 completes chip attitude and position detection, accurately mounting the chip onto the substrate of the eutectic stage, triggering the eutectic heating process. During use, the main mounting platform for each functional module of the equipment is made of natural marble. Utilizing the high rigidity, low deformation, and low coefficient of thermal expansion of marble, the flatness accuracy of the main platform is guaranteed to be no less than 5μm. This provides a unified, stable, and deformation-free mounting reference for all modules, eliminating accuracy deviations caused by base deformation and vibration at the foundation level, thus solidifying the overall accuracy foundation of the equipment. During use, the main mounting head device 1, the first auxiliary mounting head device 2, and the second auxiliary mounting head device 3 all employ high-precision structural design and precision component assembly, achieving a motion repeatability accuracy of ±1μm. Furthermore, the motion trajectory layout of the three devices is consistent, reducing the cumulative motion error caused by trajectory intersections and inconsistent references among multiple motion modules, significantly reducing positioning deviations and ensuring chip pickup accuracy. To ensure precise positioning throughout the entire process of picking, transferring, and mounting, the transfer station device 6 consists of a transfer station base 61 and a precision microporous ceramic adsorption plate 62. The adsorption plate 62 is embedded in the transfer station base 61, and the assembly accuracy is ensured through overall precision machining. The precision microporous ceramic adsorption plate can achieve uniform vacuum adsorption of chips, reducing chip adsorption offset and deformation. The chips undergo initial positioning correction via the transfer station, correcting random positional deviations after chip loading and reducing the difficulty of main bonding head mounting. The adsorption plate is detachable and can be quickly replaced when worn or when chip specifications change, adapting to the initial positioning requirements of different chips. During use, the equipment adopts a dual-vision collaborative detection architecture to achieve closed-loop control of accuracy throughout the entire process. The main bonding head camera module 1... 2. The first sub-mount camera module 22 and the second sub-mount camera module 32 detect the pickup position and orientation of the substrate and chip in real time. The camera module 82 in the eutectic zone performs precise position and orientation detection on the chip picked up by the main mounting head, achieving a visual detection accuracy of ±1μm. The system acquires detection data in real time, automatically calculates positional deviations, and performs dynamic error compensation for the mounting head movement to ensure the matching accuracy between the chip mounting position and the substrate. During use, the ±5µm high-precision height measurement of the main mounting head height measurement module 11, the first sub-mount height measurement module 21, and the second sub-mount height measurement module 31 detects the flatness and height parameters of the working surfaces of the substrate loading device 4, the chip loading device 5, and the eutectic stage device 7 in real time, automatically compensating for height deviations.To reduce uneven chip mounting pressure and excessive mounting height caused by surface unevenness, ensuring tight bonding between the chip and the substrate, and providing a stable foundation for the eutectic bonding process, the eutectic stage device 7 employs a composite structure design of a high-performance alloy base, a heat-insulating outer cover, and an aluminum nitride temperature control plate. The eutectic stage 71 uses a thermally stable high-performance alloy to ensure structural rigidity and long-term thermal stability. The eutectic stage outer cover 72 effectively isolates heat conduction and heat radiation, reducing heat interference with other precision modules. The aluminum nitride eutectic stage temperature control plate 73 possesses excellent heat conduction performance, achieving rapid and uniform temperature transfer. The temperature control system accurately executes heating, holding, and cooling process parameters, with a temperature control accuracy of ±3℃ and a surface temperature uniformity of ±5℃. This ensures the stable formation of eutectic points on the metal or alloy contact surfaces between the chip and the substrate, guaranteeing eutectic bonding strength and process reliability. During operation, the eutectic zone is equipped with a second eutectic stage device 74, identical to the eutectic stage device 7. This parallel operation mode breaks through capacity bottlenecks. While the eutectic stage device 7 performs the core chip eutectic heating process, the second eutectic stage device 74 simultaneously performs substrate loading or finished product unloading auxiliary processes. The two eutectic stages operate alternately without process waiting time, and their actions do not overlap, resulting in a smooth and efficient process that significantly improves the overall output efficiency of the equipment. In operation, the first sub-bonding device 2 is equipped with at least two independent sub-bonding modules. These modules operate independently and synchronously. One sub-bonding module is dedicated to substrate material picking and loading, while the other is dedicated to finished chip picking and unloading. The two modules operate without conflict or waiting intervals, simultaneously completing substrate loading and finished product unloading, further shortening the process cycle and improving equipment operating efficiency.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision, high-efficiency chip eutectic bonding device, characterized in that: The equipment includes a mounting area; the mounting area includes a main mounting head device (1), a first sub-mounting head device (2), and a second sub-mounting head device (3); the substrate loading device (4) is located on the right side of the equipment; the chip loading device (5) is located on the left side of the equipment; the eutectic region is located in the middle of the equipment; the eutectic region includes a transfer station device (6), a eutectic stage device (7), and a lower camera device (8); the finished product unloading device (9) is located on the front side of the equipment; the first sub-mounting head device (2) takes the substrate from the substrate loading device (4). The first auxiliary bonding device (3) takes the chip from the chip loading device (5) and places it on the transfer station device (6) for initial positioning; the second auxiliary bonding device (3) takes the chip from the transfer station device (6) and, after being detected by the lower camera device (8), mounts it on the substrate of the eutectic stage device (7) for eutectic heating; the first auxiliary bonding device (2) takes the finished chip after eutectic heating and places it on the finished product unloading device (9).

2. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The main mounting surface of each module of the equipment is made of natural marble, with a flatness accuracy of not less than 5µm.

3. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The motion repeatability of the main head assembly (1), the first auxiliary head assembly (2), and the second auxiliary head assembly (3) is ±1µm, and their motion trajectories are consistent in layout design.

4. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The transfer station device (6) consists of a transfer station base (61) and a transfer station adsorption plate (62); the transfer station adsorption plate (62) is made of precision microporous ceramic material; the transfer station adsorption plate (62) is embedded in the transfer station base (61).

5. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The main head device (1) is equipped with a main head camera module (12) on its side wall; the first auxiliary head device (2) is equipped with a first auxiliary head camera module (22) on its side wall; the second auxiliary head device (3) is equipped with a second auxiliary head camera module (32) on its side wall; a lower camera module (82) is provided in the eutectic region; the visual detection accuracy is above ±1µm.

6. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The main head device (1) is equipped with a main head height measuring module (11) on its side wall; the first auxiliary head device (2) is equipped with a first auxiliary head height measuring module (21) on its side wall; the second auxiliary head device (3) is equipped with a second auxiliary head height measuring module (31) on its side wall; the detection accuracy is ±5µm.

7. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The eutectic stage device (7) includes a eutectic stage base (71), a eutectic stage cover (72), and a eutectic stage temperature control plate (73); the eutectic stage temperature control plate (73) is made of aluminum nitride material, with a temperature control accuracy of ±3℃ and a surface temperature uniformity of ±5℃.

8. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The eutectic region is equipped with a second eutectic stage device (74); the second eutectic stage device (74) is configured the same as the eutectic stage device (7); when the eutectic stage device (7) performs eutectic operation, the second eutectic stage device (74) performs substrate loading operation or chip finished product unloading operation.

9. The high-precision, high-efficiency chip eutectic equipment according to claim 1, characterized in that: The first sub-bonding device (2) is equipped with at least two sub-bonding modules, which independently handle the loading and unloading of substrate materials and finished chips.

10. A high-precision, high-efficiency chip eutectic method, applied to the high-precision, high-efficiency chip eutectic equipment according to any one of claims 1-9, characterized in that: The method includes the following steps: Step 1: The first auxiliary bonding device (2) runs above the substrate feeding device (4) to pick up the substrate material, conveys it and places it on the eutectic stage device (7), and the eutectic stage device (7) starts vacuum adsorption to fix the substrate material. Step 2: The second auxiliary bonding device (3) runs above the chip feeding device (5) to pick up the chip material, transfers it and places it on the transfer adsorption plate (62) of the transfer station device (6). The transfer station device (6) starts vacuum adsorption to fix the chip material for initial positioning. Step 3: The main bonding head device (1) runs above the transfer station device (6) to pick up the chip material, transfers it to the lower camera device (8) for position detection, and then accurately places it on the substrate material surface on the eutectic stage device (7) and presses it to hold it. Step 4: The eutectic stage device (7) performs eutectic heating according to the set heating, holding and cooling parameters to complete the chip eutectic process; Step 5: During the eutectic process, the first sub-bonding device (2) simultaneously picks up substrate material from the substrate loading device (4) and places it on the second eutectic stage device (74); the second sub-bonding device (3) simultaneously picks up chip material from the chip loading device (5) and places it on the transfer station device (6); Step 6: After the eutectic process is completed, the main bonding device (1) picks up the next chip material and repeats steps 3 and 4. At the same time, the first auxiliary bonding device (2) picks up the finished chip from the eutectic stage device (7) that has completed the eutectic process, and transfers and places it in the finished product unloading device (9).

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