Continuous bonding apparatus and continuous bonding method

Abstract

A continuous bonding device (100) is a device that continuously bonds a bonding surface of a bonding sheet (S) to an elongated object (L) that is transported in a longitudinal direction. The continuous bonding device (100) includes a winding shaft body (1), a base roller (2), and a pressing mechanism (3) as an example of a bonding mechanism. The winding shaft body (1) is disposed in a short direction of the elongated object (L). The winding shaft body (1) winds the bonding sheet (S) in a manner that an outer side becomes the bonding surface. The base roller (2) guides the elongated object (L) from an opposite side of the winding shaft body (1). The pressing mechanism (3) presses the bonding surface to the elongated object (L) by bringing the winding shaft body (1) close to the elongated object (L). In the elongated object (L), a surface to which the bonding surface is pressed is an opposite surface of a portion guided by the base roller (2).

Description

Technical Field

[0001] The present invention relates to a continuous bonding apparatus and method for continuously bonding the bonding surfaces of bonding sheets to an elongated object being transported along its long side. Background Technology

[0002] As a public announcement concerning a continuous bonding apparatus and a continuous bonding method, there is Japanese Patent Publication No. 03-018585. Hereinafter referred to as Japanese Patent Publication No. 03-018585 as Patent Document 1.

[0003] The apparatus disclosed in Patent Document 1 involves continuously attaching the adhesive surface of an adhesive sheet (film 1) to an elongated object (melamine resin decorative panel 2) that is conveyed along its long side. The adhesive sheet (film 1) is wound in a roll. Summary of the Invention

[0004] [The problem that the invention aims to solve]

[0005] In the device described in Patent Document 1, the adhesive sheet (film 1) is wound with the inner side as the adhesive surface. Therefore, in order to attach the adhesive surface of the adhesive sheet (film 1) to the elongated object (melamine resin decorative panel 2) without defects, an additional group of rollers (pull-out rollers 5 and guide rollers 6, etc.) is required to perform various treatments on the adhesive sheet (film 1).

[0006] As a result, the device described in Patent Document 1 has the problem of becoming structurally complex. In addition, the device described in Patent Document 1 requires manual splicing of a new adhesive sheet (film 1) when the adhesive sheet (film 1) is used up, so there is room for research in terms of safety and speed.

[0007] The present invention was made in view of the aforementioned problems, and its purpose is to provide a continuous bonding device and continuous bonding method that can simplify the structure.

[0008] [Methods for solving the problem]

[0009] The first aspect of the present invention is a continuous bonding apparatus for continuously bonding the bonding surface of a bonding piece to an elongated object conveyed along its long side. The continuous bonding apparatus includes a winding shaft, a base roller, and a bonding mechanism. The winding shaft is arranged along the short side of the elongated object. The winding shaft winds the bonding piece with its outer side serving as the bonding surface. The base roller guides the elongated object from the side opposite to the winding shaft. The bonding mechanism bonds the bonding surface to the elongated object. In the elongated object, the surface with the bonding surface is the opposite side of the portion guided by the base roller.

[0010] The second aspect of the present invention is a continuous bonding method for continuously bonding the bonding surface of a bonding piece to an elongated object conveyed along its long side. The continuous bonding method includes a first step, a second step, and a third step. The first step is a step of preparing a bonding piece wound with its outer side serving as the bonding surface on a winding shaft arranged along the short side of the elongated object. The second step is a step of guiding the elongated object from the side opposite to the winding shaft using base rollers. The third step is a step of bonding the bonding surface to the opposite side of the portion of the elongated object guided by the base rollers using a bonding mechanism.

[0011] [The effects of the invention]

[0012] The continuous bonding apparatus and method for resin sheets of the present invention can simplify the structure. Attached Figure Description

[0013] Figure 1 This is a perspective view of the continuous bonding device in embodiment 1.

[0014] Figure 2 This is a diagram of a continuous connection device viewed from the downstream side to the upstream side.

[0015] Figure 3 This is a schematic diagram of a continuous bonding device in which the winding shaft is driven by rotation.

[0016] Figure 4 This is a schematic diagram of a continuous bonding device in which the winding shaft and base rollers are driven by rotation.

[0017] Figure 5 This is a schematic diagram of a continuous bonding device that adjusts the force applied to the downward pressing bonding piece.

[0018] Figure 6 This is a schematic diagram of a continuous bonding device that adjusts the force applied to the upward pressing bonding piece.

[0019] Figure 7 This is a schematic diagram of the continuous bonding device in embodiment 2, in which the upstream bonding piece is bonded to the elongated object.

[0020] Figure 8 This is a schematic diagram showing the connection of the downstream adhesive piece when the upstream adhesive piece is used up.

[0021] Figure 9 This is a schematic diagram of the downstream adhesive piece being attached to an elongated object.

[0022] Figure 10 This is a schematic diagram showing the connection of the upstream adhesive piece when the downstream adhesive piece is used up.

[0023] Figure 11 This is a schematic diagram of the continuous bonding device in embodiment 3.

[0024] Figure 12 It is a schematic diagram of a continuous bonding device that includes a bonding mechanism that bonds the bonding surfaces without pressing them.

[0025] Figure 13 It is a schematic diagram of a continuous connection device including a winding shaft braking mechanism.

[0026] Figure 14 It is a schematic diagram of a continuous connection device including a winding shaft drive mechanism and a winding shaft braking mechanism.

[0027] Figure 15 This is a diagram of the continuous connection device including the winding shaft braking mechanism, viewed from the downstream side to the upstream side. Detailed Implementation

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are labeled with the same reference numerals and will not be described again.

[0029] Additionally, in the following description, terms such as "up" and "down" may be used to indicate specific positions and directions. However, these terms are used for ease of understanding of the implementation details and are unrelated to the actual direction during implementation.

[0030] <Implementation Form 1>

[0031] The following is for reference Figure 1 This embodiment 1 describes the continuous bonding apparatus 100 and the continuous bonding method. Figure 1 This is a perspective view of the continuous bonding device 100 in embodiment 1.

[0032] like Figure 1 As shown, the continuous bonding device 100 is a device that continuously bonds the bonding surface of the bonding piece S to an elongated object L that is conveyed along its long side. The continuous bonding device 100 includes a winding shaft 1, a base roller 2, and a pressing mechanism 3 (an example of a bonding mechanism).

[0033] The winding shaft 1 is positioned along the short side of the elongated object L. The winding shaft 1 winds the bonding sheet S with the outer side serving as the bonding surface.

[0034] The base roller 2 guides the elongated object L from the side opposite to the winding shaft 1. The pressing mechanism 3 presses the mating surface against the elongated object L by bringing the winding shaft 1 close to the elongated object L. The mating surface pressed in the elongated object L is the opposite side of the portion guided by the base roller 2.

[0035] With this structure, there is no need for a separate group of rollers for various processing of the bonding sheet S. Therefore, the continuous bonding device 100 simplifies the structure.

[0036] The following describes a continuous bonding method. The continuous bonding method is not limited to the method using the continuous bonding device 100 described above.

[0037] The continuous bonding method is a method of continuously bonding the bonding surfaces of the bonding piece S to an elongated object L that is conveyed along its long side. The continuous bonding method includes a first process, a second process, and a third process.

[0038] The first process is to prepare a bonding sheet S to be wound on a winding shaft 1 arranged along the short side of the elongated object L, with the outer side serving as the bonding surface.

[0039] The second process involves guiding the elongated object L from the opposite side of the winding shaft 1 via the base roller 2.

[0040] The third process involves pressing the winding shaft 1 close to the elongated object L using the pressing mechanism 3 (an example of a bonding mechanism), and pressing the bonding surface against the opposite side of the portion of the elongated object L guided by the base roller 2.

[0041] Through the first to third steps, no other roller group is needed for various treatments of the bonding sheet S. Therefore, the continuous bonding method simplifies the structure of the device used.

[0042] The first process can also be a process in which the bonding sheet S, which is wound with the inner side as the bonding surface, is rewound to the winding shaft 1 with the outer side as the bonding surface, by means of a roll-to-roll device or the like.

[0043] Any elongated object L can be conveyed along its long side, provided it has both a long side and a short side. The elongated object L can be, for example, a plate or a strip. The material of the elongated object L is not particularly limited; it can be, for example, resin or glass.

[0044] The adhesive sheet S only needs to have an adhesive surface and be wound around the winding shaft 1. The adhesive sheet S is, for example, a protective sheet or protective film (as an example, a masking film), or a laminated film.

[0045] Depending on the type of elongated object L and the bonding sheet S, the continuous bonding apparatus 100 and continuous bonding method can be applied to various fields. Specifically, the continuous bonding apparatus 100 and continuous bonding method can be applied to extruded sheets. The fields of film forming equipment, stretching equipment, cutting equipment, coating equipment, and roll-to-roll film forming equipment.

[0046] The base roller 2 can be crown-shaped, with a smaller diameter near both ends, to prevent defects (wrinkles or bubbles) from the long object L. The outer surface of the base roller 2 can form a spiral or drum-shaped texture to prevent defects (wrinkles or bubbles) from the long object L.

[0047] The base roller 2 guiding the long object L refers to the following situations: the base roller 2 rotates passively with the long object L being transported; the base roller 2 and the long object L rotate synchronously and are driven; and the long object L is driven by the base roller 2 which is driven by rotation and is transported.

[0048] The surface of the elongated object L to be bonded is preferably perpendicular to the surface passing through the rotation center of the winding shaft 1 and the rotation center of the base roller 2. Thus, the bonding piece S can be bonded to the elongated object L at an appropriate angle.

[0049] In the continuous bonding apparatus 100, a conveying device (not shown) for transporting the elongated object L along its long side is not a necessary structure. That is, a device other than the continuous bonding apparatus 100 may include a conveying device. Of course, the continuous bonding apparatus 100 may also include a conveying device.

[0050] The continuous bonding apparatus 100 may include a cutting device and a winding device (not shown). The cutting device cuts the elongated object L with the bonded bonding strips S. The winding device winds up the elongated object L with the bonded bonding strips S.

[0051] In the following, sometimes the starting side of the long object L being transported is called the upstream side, and the ending side of the long object L being transported is called the downstream side.

[0052] Next, refer to Figure 2 Detailed description of the continuous bonding device 100. Figure 2 This is a diagram of the continuous connection device 100 viewed from the downstream side to the upstream side.

[0053] The continuous bonding device 100 also includes a base roller drive mechanism 20. The base roller drive mechanism 20 drives the base roller 2 to rotate.

[0054] The base roller drive mechanism 20 prevents defects such as wrinkles or bubbles from forming on the elongated object L that has been bonded with the bonding sheet S. Therefore, the continuous bonding device 100 can improve the quality of the elongated object L that has been bonded with the bonding sheet S.

[0055] In particular, when the conveying speed of the elongated object L on the base roller 2 differs from the conveying speed of the elongated object L on the upstream and downstream sides of the base roller 2, the elongated object L that has been attached to the sheet S is prone to defects such as wrinkles or air bubbles. However, such defects can be prevented by the base roller drive mechanism 20.

[0056] Preferably, the base roller drive mechanism 20 drives the base roller 2 to rotate so that the speed at which the bonding piece S adheres to the elongated object L is the same as the speed at which the base roller 2 guides the elongated object L. This further prevents defects such as wrinkles or bubbles.

[0057] The continuous connection device 100 also includes a base portion 4, a movable portion 5, and a support portion 6. The base portion 4 has the movable portion 5 at its lower part. The movable portion 5 has a moving wheel 50 and a moving fixing device 51. The moving wheel 50 moves the base portion 4 by rolling. The moving fixing device 51 fixes the base portion 4 in a certain position so that the base portion 4 will not move by the moving wheel 50.

[0058] The support column 6 is provided on the upper surface of the base 4. The support column 6 has a support column 60 and a synchronization component 61.

[0059] There are two support columns 60. The two support columns 60 are disposed on one end side and the other end side of the winding shaft 1 and the base roller 2. The two support columns 60 have a lifting space 66 within the lifting range of the winding shaft 1. The two support columns 60 rotatably support the base roller 2.

[0060] A base roller drive mechanism 20 is disposed at one end of the base roller 2. The base roller drive mechanism 20 includes, for example, a servo motor 25, a reducer 26, and a coupling 27. The servo motor 25 is powered by a power source (not shown) and drives the input side (servo motor 25 side) of the reducer 26 to rotate. The reducer 26 reduces the rotational drive from the servo motor 25 between its input side (servo motor 25 side) and its output side (coupling 27 side). The coupling 27 connects the output side (coupling 27 side) of the reducer 26 to one end of the base roller 2.

[0061] The pressing mechanism 3 is, for example, two cylinders respectively installed at the upper ends of the two support columns 60. The pressing mechanism 3 has two rods 31 that can extend and retract in the lifting (up and down) direction. The lower ends of the two rods 31 are respectively connected to one end and the other end of the winding shaft 1. In addition, the pressing mechanism 3 is not limited to two cylinders; it can be used to press the contact surface against the elongated object L by the weight of the winding shaft 1.

[0062] The synchronizing component 61 synchronizes the lifting and lowering of the winding shaft 1 at one end and the other end. Therefore, even if there is a slight difference in the extension and retraction of the rods 31 in the two cylinders of the pressing mechanism 3, the synchronizing component 61 ensures that the winding shaft 1 rises and falls in a state parallel to the base roller 2. In this way, the contact surface of the contact piece S can be contacted to the elongated object L with a certain force.

[0063] The following is for reference Figure 3 and Figure 4 This describes the mechanism that the continuous connection device 100 also includes. Figure 3 This is a schematic diagram of a continuous bonding device 100 in which the winding shaft 1 is driven by rotation. Figure 4 This is a schematic diagram of a continuous bonding device 100 in which the winding shaft 1 and the base roller 2 are driven to rotate.

[0064] like Figure 3 As shown, the continuous bonding device 100 also includes a winding shaft drive mechanism 10. The winding shaft drive mechanism 10 drives the winding shaft 1 to rotate.

[0065] By using the winding shaft drive mechanism 10, defects such as wrinkles or bubbles can be prevented from forming on the bonding strips S that have been bonded to the elongated object L. Therefore, the continuous bonding device 100 can improve the quality of the elongated object L with the bonding strips S bonded to it.

[0066] The winding shaft drive mechanism 10 preferably drives the winding shaft 1 to rotate, so that the speed at which the bonding piece S attaches to the elongated object L is the same as the speed at which the base roller 2 guides the elongated object L. This further prevents defects such as wrinkles or bubbles.

[0067] Although not shown, the winding shaft drive mechanism 10, for example, has a servo motor, a reducer and a coupling, similar to the base roller drive mechanism 20.

[0068] like Figure 4 As shown, the continuous bonding device 100 may also include both a winding shaft drive mechanism 10 and a base roller drive mechanism 20.

[0069] The continuous bonding apparatus 100, by simultaneously including a winding shaft drive mechanism 10 and a base roller drive mechanism 20, can prevent defects such as wrinkles or bubbles from forming on the bonding sheet S and the elongated object L. Therefore, the continuous bonding apparatus 100 can further improve the quality of the elongated object L with the bonded bonding sheet S.

[0070] The following is for reference Figure 5 and Figure 6 This describes the continuous bonding device 100 whose pressure is adjusted. Figure 5 This is a schematic diagram of a continuous bonding device 100 that adjusts the force of pressing the bonding piece S downwards. Figure 6This is a schematic diagram of a continuous bonding device 100 that adjusts the force of pressing the bonding piece S upwards.

[0071] like Figure 5 As shown, the continuous bonding device 100 also includes a pressure adjustment unit 7. The pressure adjustment unit 7 adjusts the pressing pressure via the pressing mechanism 3.

[0072] By adjusting the pressing force using the pressing mechanism 3, the bonding surface of the bonding piece S can be bonded to the elongated object L with an appropriate force. Therefore, the continuous bonding device 100 can improve the quality of the elongated object L with the bonding piece S bonded.

[0073] The continuous bonding device 100 also includes a winding amount measuring device 8. The winding amount measuring device 8 measures the amount of the bonding piece S wound on the winding shaft 1. The pressing pressure adjustment unit 7 adjusts the pressing pressure based on the amount measured by the winding amount measuring device 8.

[0074] By adjusting the pressing force based on the amount of the adhesive piece S wound on the winding shaft 1, the adhesive surface of the adhesive piece S can be adhered to the elongated object L with a more appropriate force. Therefore, the continuous bonding device 100 can further improve the quality of the elongated object L with the adhesive piece S attached.

[0075] The winding amount measuring device 8 is, for example, a displacement sensor. The displacement sensor measures the winding diameter T of the bonding piece S wound on the winding shaft 1. The winding diameter T is the distance from the outer surface of the winding shaft 1 to the outer surface of the wound bonding piece S. By measuring the winding diameter T, the amount of bonding piece S wound on the winding shaft 1 is determined. Therefore, the displacement sensor that measures the winding diameter T can be said to measure the amount of bonding piece S wound on the winding shaft 1.

[0076] like Figure 5 As shown, when the winding shaft 1 is above the elongated object L, the force that attaches the bonding surface to the elongated object L is the force obtained by the pressing force of the pressing mechanism 3 plus the weight of the winding shaft 1 and the bonding piece S.

[0077] Therefore, when the amount (weight) of the adhesive piece S wound on the winding shaft 1 is large, its own weight increases, so if the pressing force is not adjusted, the force required to attach the adhesive surface to the long object L will increase. Conversely, when the amount (weight) of the adhesive piece S wound on the winding shaft 1 is small, its own weight decreases, so if the pressing force is not adjusted, the force required to attach the adhesive surface to the long object L will decrease.

[0078] Here, as the adhesive surface of the adhesive piece S is continuously attached to the elongated object L, the amount (weight) of the adhesive piece S wound around the winding shaft 1 will decrease. Therefore, as the adhesive surface of the adhesive piece S is continuously attached to the elongated object L, the force of attaching the adhesive surface to the elongated object L will gradually decrease if the pressing pressure is not adjusted.

[0079] Based on the above, the pressure adjustment unit 7 adjusts the pressing force by pressing mechanism 3 according to the amount (weight) of the bonding piece S wound on the winding shaft 1 so that the force for attaching the bonding surface to the elongated object L remains constant.

[0080] like Figure 6 As shown, when the winding shaft 1 is located below the elongated object L, the force that connects the bonding surface to the elongated object L is obtained by subtracting the weight of the winding shaft 1 and the bonding piece S from the pressing force of the pressing mechanism 3.

[0081] Therefore, when the amount (weight) of the adhesive piece S wound on the winding shaft 1 is large, its own weight increases, so if the pressing force is not adjusted, the force required to attach the adhesive surface to the long object L will decrease. Conversely, when the amount (weight) of the adhesive piece S wound on the winding shaft 1 is small, its own weight decreases, so if the pressing force is not adjusted, the force required to attach the adhesive surface to the long object L will increase.

[0082] Here, as the adhesive surface of the adhesive piece S is continuously attached to the elongated object L, the amount (weight) of the adhesive piece S wound around the winding shaft 1 decreases. Therefore, as the adhesive surface of the adhesive piece S is continuously attached to the elongated object L, the force required to attach the adhesive surface to the elongated object L will gradually increase if the pressing pressure is not adjusted.

[0083] Based on the above, the pressure adjustment unit 7 adjusts the pressing force by pressing mechanism 3 according to the amount (weight) of the bonding piece S wound on the winding shaft 1 so that the force for attaching the bonding surface to the elongated object L remains constant.

[0084] <Implementation Form 2>

[0085] The following is for reference Figures 7-10 The continuous bonding device 200 of Embodiment 2 is described. The continuous bonding device 200 of Embodiment 2 is a device that can automatically connect a new bonding piece S and bond it to the elongated object L even when the wound bonding piece S is used up.

[0086] Figure 7 This is a schematic diagram of the upstream bonding piece S being bonded to the elongated object L in the continuous bonding device 200 of embodiment 2. Figure 8 This is a schematic diagram showing the connection of the upstream adhesive piece S to the downstream adhesive piece S after the upstream adhesive piece S is used up. Figure 9 This is a schematic diagram of the downstream adhesive piece S being attached to the elongated object L. Figure 10 This is a schematic diagram of the upstream adhesive piece S being used up when the downstream adhesive piece S is exhausted.

[0087] like Figures 7-10The continuous bonding device 200 of embodiment 2 shown has a winding shaft 1 having a first winding shaft 11 and a second winding shaft 12. The first winding shaft 11 and the second winding shaft 12 are respectively wound with bonding sheet S.

[0088] The first winding shaft 11 is positioned upstream of the elongated object L in the direction of transport, which is closer to the second winding shaft 12. In other words, the second winding shaft 12 is positioned downstream of the elongated object L in the direction of transport, which is closer to the first winding shaft 11.

[0089] The continuous bonding device 200 also includes a bonding strip splicing mechanism 9. When the bonding strip S of one of the first winding shaft 11 and the second winding shaft 12 is used up, the bonding strip splicing mechanism 9 splices the bonding strip S of the other.

[0090] The splicing mechanism 9 controls the pressing mechanism 3 to move one of the splices S in the first winding shaft 11 and the second winding shaft 12 away from the elongated object L when it is used up, and to move the one to be spliced ​​S closer to the elongated object L when it is to be spliced. However, the actions of moving the one to be used up from the elongated object L and moving the one to be spliced ​​S closer to the elongated object L do not necessarily occur simultaneously.

[0091] With this structure, even if the wound adhesive strip S is used up, a new adhesive strip S can be automatically connected and attached to the elongated object L. Therefore, the continuous bonding device 200 improves safety by automatically connecting new adhesive strips S, and can also accommodate high-speed conveying of the elongated object L.

[0092] The base roller 2 of the continuous connection device 200 has a first base roller 21 and a second base roller 22. The first base roller 21 and the second base roller 22 are respectively arranged on the upstream side and the downstream side at positions corresponding to the first winding shaft 11 and the second winding shaft 12. That is, the first base roller 21 can be pressed by the first winding shaft 11 via the elongated object L. The second base roller 22 can be pressed by the second winding shaft 12 via the elongated object L.

[0093] The following is for reference Figures 7-10 The operation of the continuous bonding device 200 in embodiment 2 is explained in detail.

[0094] First, the winding amount measuring device 8 of Embodiment 1 can also be used, for example, as a machine for determining whether the bonding sheet S has been used up in Embodiment 2. Figure 7As shown, the winding amount measuring device 8 includes a first winding amount measuring device 81 and a second winding amount measuring device 82. The first winding amount measuring device 81 and the second winding amount measuring device 82 correspond to the first winding shaft 11 and the second winding shaft 12, respectively. That is, the first winding amount measuring device 81 measures the amount of the bonding piece S wound on the first winding shaft 11. The second winding amount measuring device 82 measures the amount of the bonding piece S wound on the second winding shaft 12.

[0095] like Figure 7 As shown, under the control of the adhesive strip splicing mechanism 9, the pressing mechanism 3 brings the first winding shaft 11 close to the elongated object L, while preventing the second winding shaft 12 from approaching the elongated object L. Therefore, the adhesive surface of the adhesive strip S wound on the first winding shaft 11 is pressed against the elongated object L.

[0096] The bonding surfaces of the bonding tabs S wound on the first winding shaft 11 are continuously bonded to the elongated object L. During this process, the amount of bonding tabs S wound on the first winding shaft 11 decreases. The amount of bonding tabs S wound on the first winding shaft 11 is measured by the first winding amount measuring device 81.

[0097] like Figure 8 As shown, when the amount of the adhesive strip S wound on the first winding shaft 11 is measured to be 0, that is, when the adhesive strip S wound on the first winding shaft 11 is used up, the adhesive strip S attached to the elongated object L continues from the portion wound on the first winding shaft 11 to the portion wound on the second winding shaft 12. In specific terms, under the control of the adhesive strip connection mechanism 9, the pressing mechanism 3 causes the first winding shaft 11 to move away from the elongated object L, while on the other hand, it causes the second winding shaft 12 to move closer to the elongated object L.

[0098] like Figure 9 As shown, under the control of the adhesive strip splicing mechanism 9, the pressing mechanism 3 brings the second winding shaft 12 closer to the elongated object L, while preventing the first winding shaft 11 from approaching the elongated object L. Therefore, the adhesive surface of the adhesive strip S wound on the second winding shaft 12 is pressed against the elongated object L.

[0099] The bonding surfaces of the bonding tabs S wound on the second winding shaft 12 are continuously bonded to the elongated object L. During this process, the amount of bonding tabs S wound on the second winding shaft 12 decreases. The amount of bonding tabs S wound on the second winding shaft 12 is measured by the second winding amount measuring device 82. Meanwhile, new bonding tabs S are wound onto the first winding shaft 11.

[0100] like Figure 10As shown, when the amount of the adhesive strip S wound on the second winding shaft 12 is measured to be 0 (or close to 0), that is, when the adhesive strip S wound on the second winding shaft 12 is used up (or about to be used up), the adhesive strip S attached to the elongated object L continues from the portion wound on the second winding shaft 12 to the portion wound on the first winding shaft 11. Specifically, under the control of the adhesive strip connection mechanism 9, the pressing mechanism 3 brings the first winding shaft 11 closer to the elongated object L and moves the second winding shaft 12 away from the elongated object L. Then, returning to the description based on... Figure 7 Explanation.

[0101] <Implementation Form 3>

[0102] The following is for reference Figure 11 The continuous bonding device 300 of Embodiment 3 is described. The continuous bonding device 300 of Embodiment 3 is a device for bonding the bonding piece S to both sides (upper surface and lower surface) of the elongated object L. Figure 11 This is a schematic diagram of the continuous bonding device 300 in embodiment 3.

[0103] like Figure 11 As shown, the winding shaft 1 of the continuous bonding device 300 in embodiment 3 has an upper side winding shaft 1U (an example of a one-sided winding shaft) and a lower side winding shaft 1D (an example of a winding shaft on the other side). The upper side winding shaft 1U and the lower side winding shaft 1D are respectively wound with bonding sheet S.

[0104] The upper side winding shaft 1U is positioned above the elongated object L. The lower side winding shaft 1D is positioned below the elongated object L. That is, the upper side winding shaft 1U is positioned facing the upper surface (one example) of the elongated object L. The lower side winding shaft 1D is positioned facing the lower surface (the other example) of the elongated object L.

[0105] With the aforementioned structure, the elongated object L can be bonded with the adhesive strips S on both its upper and lower surfaces. Therefore, the continuous bonding device 300 can maintain or improve the quality of the elongated object L with the adhesive strips S bonded. Depending on the material of the adhesive strips S, the continuous bonding device 300 can add value to the elongated object L with the adhesive strips S bonded.

[0106] The continuous bonding device 300 of embodiment 3 includes an upper surface side structure 200 that continuously bonds the bonding surface of the bonding piece S to the upper surface of the elongated object L, and a lower surface side structure 200D that continuously bonds the bonding surface of the bonding piece S to the lower surface of the elongated object L.

[0107] The upper surface side structure 200 is the same as the continuous bonding device 200 of Embodiment 2. The lower surface side structure 200D is a structure in which the continuous bonding device 200 of Embodiment 2 is arranged symmetrically on the upper and lower sides with the elongated object L as the axis.

[0108] The upper side winding shaft 1U has an upper side first winding shaft 11 and an upper side second winding shaft 12. The upper side first winding shaft 11 and the upper side second winding shaft 12 are the same as the first winding shaft 11 and the second winding shaft 12 in Embodiment 2.

[0109] The lower side winding shaft 1D has a lower side first winding shaft 11D and a lower side second winding shaft 12D. The lower side first winding shaft 11D and the lower side second winding shaft 12D are the same as the structure in Embodiment 2, which symmetrically arranges the first winding shaft 11 and the second winding shaft 12 above and below with the elongated object L as the axis.

[0110] The lower surface side structure 200D also includes a lower side pressing mechanism 3D, a lower side first winding amount measuring device 81D, a lower side second winding amount measuring device 82D, a third base roller 23, a fourth base roller 24, and a lower side connecting piece splicing mechanism 9D.

[0111] The lower side pressing mechanism 3D has the same structure as the pressing mechanism 3 of embodiment 2, which is symmetrically arranged vertically with the elongated object L as the axis. The lower side first winding amount measuring device 81D and the lower side second winding amount measuring device 82D have the same structure as the first winding amount measuring device 81 and the second winding amount measuring device 82 of embodiment 2, which are symmetrically arranged vertically with the elongated object L as the axis. The third base roller 23 and the fourth base roller 24 have the same structure as the first base roller 21 and the second base roller 22 of embodiment 2, which are symmetrically arranged vertically with the elongated object L as the axis. The lower side adhesive piece splicing mechanism 9D controls the lower side pressing mechanism 3D to make one of the adhesive pieces S in the lower side first winding shaft 11D and the lower side second winding shaft 12D, which has been used up, leave the elongated object L, while on the other hand, it makes the one to be spliced ​​with adhesive piece S approach the elongated object L.

[0112] The upper surface side structure 200 operates in the same manner as the continuous bonding device 200 of Embodiment 2. The lower surface side structure 200D operates in the same manner as the structure in Embodiment 2 that symmetrically arranges the continuous bonding device 200 of Embodiment 2 around the elongated object L. Therefore, in addition to having the effects of the continuous bonding device 200 of Embodiment 2, the continuous bonding device 300 of Embodiment 3 can also bond the bonding piece S to the upper and lower surfaces of the elongated object L.

[0113] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, these embodiments are exemplary in all respects and not restrictive. The scope of the invention is defined not by the description but by the claims, and is intended to include all modifications within the scope and meaning of the claims and their equivalents. In the structures described in the embodiments, except for those described as the first and second aspects of the invention in the "Means for Solving the Problem" section, all structures are arbitrary and can be appropriately deleted and modified.

[0114] Furthermore, although the pressing mechanism 3 is described as an example of a bonding mechanism in the described embodiment, it could also be a bonding mechanism different from the pressing mechanism 3, which does not press the bonding surface (bonds it without applying pressure) to the elongated object L. That is, as Figure 12 As shown, the bonding roller 30, as an example of such a bonding mechanism, is the opposite side of the part guided by the base roller 2 in the elongated object L to the bonding surface.

[0115] Furthermore, in embodiments 2 and 3, it is explained that the adhesive strip splicing mechanism 9 (and the lower side adhesive strip splicing mechanism 9D) splices the adhesive strip S of one of the first winding shaft 11 and the second winding shaft 12 when the adhesive strip S is used up. The adhesive strip splicing mechanism 9 (and the lower side adhesive strip splicing mechanism 9D) can also splice the adhesive strip S of another before one adhesive strip S is used up. An example of splicing the adhesive strip S of another before one adhesive strip S is used up is when one adhesive strip S is being replaced. In this case, one adhesive strip S is sometimes cut by the cutting device. The replacement of the adhesive strip S is based on the pattern and characteristics of the adhesive strip S. An example of an adhesive strip S that is cut and replaced in this way is a laminated film.

[0116] Furthermore, although a displacement sensor has been described as one example of the winding amount measuring device 8, the winding amount measuring device 8 only needs to measure the amount of the bonding piece S wound on the winding shaft 1. As another example of the winding amount measuring device 8, there is a weight sensor that measures the weight of the bonding piece S wound on the winding shaft 1.

[0117] Here, refer to Figures 13-15 This section describes an example of a continuous bonding device 100 including a braking mechanism (i.e., a winding shaft braking mechanism 19) for a winding shaft 1. Figure 13 This is a schematic diagram of a continuous bonding device 100 including a winding shaft braking mechanism 19. Figure 14 It is a schematic diagram of a continuous bonding device 100 including a winding shaft drive mechanism 10 and a winding shaft braking mechanism 19. Figure 15 This is a diagram of the continuous connection device 100, including the winding shaft braking mechanism 19, viewed from the downstream side to the upstream side.

[0118] like Figure 13 As shown, the continuous bonding device 100 includes a winding shaft braking mechanism 19 (braking mechanism). The winding shaft braking mechanism 19 brakes the winding shaft 1.

[0119] When the bonding strip S is attached to an elongated object L conveyed along its long side, the winding shaft 1 rotates along with the bonding strip S as the object L is conveyed, but is braked by the winding shaft braking mechanism 19. Thus, the bonding strip S is attached to the elongated object L in a taut state, preventing defects such as wrinkles or bubbles from forming on the elongated object L with the bonding strip S attached. Therefore, the continuous bonding device 100 improves the quality of the elongated object L with the bonding strip S attached.

[0120] The winding shaft braking mechanism 19 is, for example, a powder brake. The winding shaft braking mechanism 19 can be any brake other than a powder brake that brakes the winding shaft 1.

[0121] The winding shaft braking mechanism 19 can brake the winding shaft 1 before the connecting piece S is attached to the long object L, or it can brake the winding shaft 1 after the connecting piece S is attached to the long object L.

[0122] The winding shaft braking mechanism 19 is preferably a mechanism that can adjust the braking torque on the winding shaft 1. The winding shaft braking mechanism 19 is adjusted to a braking torque that will not cause adverse effects (or has a low probability of causing adverse effects) on the elongated object L that has been attached to the connecting piece S.

[0123] like Figure 14 As shown, the continuous connection device 100 may also include a winding shaft drive mechanism 10 and a winding shaft braking mechanism 19. When the winding shaft 1 is driven to rotate, the winding shaft drive mechanism 10 is activated, and when the winding shaft 1 is braked, the winding shaft braking mechanism 19 is activated.

[0124] like Figure 15 As shown, the winding shaft braking mechanism 19 is connected to the other end (and / or one end) of the winding shaft 1. The winding shaft braking mechanism 19 may be configured coaxially with the winding shaft 1, or it may be configured non-coaxially (e.g., via a timing pulley not shown) to avoid interference with other components (not shown).

[0125] Figures 13-15 While the example shown includes a base roller drive mechanism 20 in the continuous bonding device 100, it may also exclude the base roller drive mechanism 20. The winding shaft braking mechanism 19 can be equipped not only in the continuous bonding device 100 of embodiment 1, but also in the continuous bonding device 200 of embodiment 2 and the continuous bonding device 300 of embodiment 3.

[0126] [Industry availability]

[0127] The present invention provides a continuous bonding apparatus and a continuous bonding method, which are industrially applicable.

Claims

1. A continuous bonding apparatus for continuously bonding the bonding surfaces of bonding plates to an elongated object being conveyed along its long side direction, the continuous bonding apparatus comprising: The bonding sheet is wound around a shaft, arranged along the short side of the elongated object, with the outer side serving as the bonding surface; Base rollers guide the elongated object from the side opposite to the winding shaft; as well as The mechanism then attaches the bonding surface to the opposite side of the portion of the elongated object guided by the base roller.

2. The continuous bonding device according to claim 1, wherein, The connecting mechanism is a pressing mechanism. The pressing mechanism presses the bonding surface against the opposite side of the portion of the elongated object guided by the base roller by bringing the winding shaft close to the elongated object.

3. The continuous bonding device according to claim 1 or claim 2, further comprising a base roller drive mechanism for rotatably driving the base roller.

4. The continuous bonding device according to claim 1 or claim 2, further comprising a winding shaft drive mechanism for rotating the winding shaft.

5. The continuous bonding device according to claim 1 or claim 2, further comprising a winding shaft braking mechanism for braking the winding shaft.

6. The continuous bonding device according to claim 4, further comprising a winding shaft braking mechanism for braking the winding shaft.

7. The continuous bonding device according to claim 2, further comprising a pressing pressure adjustment unit for adjusting the pressing pressure via the pressing mechanism.

8. The continuous bonding apparatus according to claim 7, wherein, Includes a winding amount measuring device for measuring the amount of the bonding sheet wound around the winding shaft, and The pressing pressure adjustment unit adjusts the pressing pressure based on the amount measured by the winding amount measuring device.

9. The continuous bonding device according to claim 2, wherein, The winding shaft has a first winding shaft and a second winding shaft on which the bonding piece is respectively wound. The first winding shaft is positioned upstream of the second winding shaft in the direction in which the elongated object is conveyed. It also includes a splice mechanism that splices a splice from a splice of one of the first winding shafts and a splice of the second winding shaft to a splice of the other. The adhesive strip splicing mechanism controls the pressing mechanism to cause one of the adhesive strips to be spliced ​​in the first winding shaft and the second winding shaft to move away from the elongated object, while on the other hand, it causes one of the adhesive strips to be spliced ​​to move closer to the elongated object.

10. The continuous bonding apparatus according to claim 1 or claim 2, wherein, The winding shaft has a winding shaft on one side and a winding shaft on the other side, on which the bonding piece is respectively wound. The one-sided winding shaft is configured to face one side of the elongated object. The other side of the winding shaft is configured to face the other side of the elongated object.

11. A continuous bonding method, wherein the bonding surfaces of bonding pieces are continuously bonded to an elongated object being conveyed along its long side. The continuous bonding method includes, On a winding shaft arranged along the short side of the elongated object, a bonding sheet is prepared to be wound with the outer side becoming the bonding surface. The elongated object is guided from the opposite side of the winding shaft by base rollers; and The bonding surface is bonded to the opposite side of the portion of the elongated object guided by the base roller by a bonding mechanism.

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