Zero blind tube orifice bypass

Abstract

A zero-blind port bypass device includes a first multi-way valve, a second multi-way valve, and a flow restrictor. The first multi-way valve includes a first plurality of valve legs having an inlet port. The second multi-way valve includes a second plurality of valve legs having an outlet port. The first plurality of valve legs and the second plurality of valve legs form at least one unrestricted path between the inlet port and the outlet port. The flow restrictor is pneumatically coupled to the first multi-way valve and the second multi-way valve. The first plurality of valve legs and the second plurality of valve legs form at least one restricted path between the inlet port and the outlet port, and the at least one restricted path passes through a restricted port of the flow restrictor.

Description

[0001] Priority requirements This application claims priority to U.S. Patent Application Serial No. 63 / 561,173, filed March 4, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The topics disclosed herein generally relate to methods, systems, and machine-readable storage media for constructing zero-blind-hole bypasses. Background Technology

[0003] Semiconductor substrate processing systems process semiconductor substrates using techniques including etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), pulsed deposition (PDL), plasma-enhanced pulsed deposition (PEPDL), and resist removal. One type of semiconductor substrate processing apparatus is a plasma processing apparatus using CCP, which includes a vacuum chamber containing electrodes. Radio frequency (RF) power is applied between the electrodes to excite a process gas into plasma, which is used to process the semiconductor substrate in the reaction chamber. Another type of semiconductor substrate processing apparatus is an ICP plasma processing apparatus.

[0004] In semiconductor substrate processing systems, when fluids (such as process gases, purge gases, etc.) are delivered to the processing chamber, flow restriction and "dead leg" areas often occur, which increases the "green-to-green" time and reduces tooling productivity.

[0005] The background description provided herein presents the general context of this disclosure. It should be noted that the information described in this section is intended to provide some background to the subject matter disclosed below and should not be considered prior art. More specifically, the work of the currently designated inventors within the scope described in this background section, and aspects of the specification that could not be determined to be prior art at the time of filing, are neither express nor implied admissions of prior art to this disclosure. Summary of the Invention

[0006] A method, system, and computer program for zero-blind-port bypass in a substrate processing system are disclosed. One general aspect of this disclosure is a zero-blind-port bypass device comprising a first multi-way valve including a first plurality of valve branches. The first plurality of valve branches include an inlet port. The device includes a second multi-way valve having a second plurality of valve branches. The second plurality of valve branches include an outlet port. The first plurality of valve branches and the second plurality of valve branches form at least one unrestricted path between the inlet port and the outlet port. The device includes a flow limiter pneumatically coupled to the first and second multi-way valves. The first plurality of valve branches and the second plurality of valve branches form at least one restricted path between the inlet port and the outlet port, and the at least one restricted path passes through a restricted port of the flow limiter.

[0007] Another general aspect is a system comprising a gas source configured to generate process gas and a vacuum chamber having a processing area. The vacuum chamber is configured to receive process gas for plasma-based processing of a substrate. The system further includes a zero-blind-port bypass pneumatically coupled to the gas source and the vacuum chamber. The zero-blind-port bypass includes a first multi-way valve, a second multi-way valve, and a flow limiter. The first multi-way valve includes a first plurality of valve branches. The first plurality of valve branches include an inlet port pneumatically coupled to the gas source. The second multi-way valve includes a second plurality of valve branches. The second plurality of valve branches include an outlet port pneumatically coupled to the vacuum chamber. The flow limiter is pneumatically coupled to the first and second multi-way valves. The system further includes a controller coupled to the zero-blind-port bypass and the gas source. The controller is used to activate a restricted path of the zero-blind-port bypass during plasma-based processing. The restricted path includes the flow limiter. The controller further allows the process gas to be delivered to the vacuum chamber via the restricted path.

[0008] Another general aspect includes a method for delivering fluid to a vacuum chamber. This method includes activating a restricted path of a zero-blind-tube orifice bypass during plasma-based processing. The restricted path includes a first set of valve branches of the zero-blind-tube orifice bypass and a flow restrictor. The method further includes delivering a process gas from a gas source to the vacuum chamber via the restricted path. The vacuum chamber is pneumatically coupled to the zero-blind-tube orifice bypass. The method further includes supplying purge gas from a gas source to the zero-blind-tube orifice bypass during purging processing. The method further includes delivering the purge gas to the vacuum chamber via an unrestricted path of the zero-blind-tube orifice bypass. The unrestricted path includes a second set of valve branches of the zero-blind-tube orifice bypass.

[0009] An additional general aspect includes a non-transiently machine-readable storage medium containing instructions that, when executed by the machine, cause the machine to perform operations to deliver fluid to a vacuum chamber. The operations include, during plasma-based processing, activating a restricted path of the zero-blind-tube orifice bypass. The restricted path includes a first set of valve branches of the zero-blind-tube orifice bypass and a flow restrictor. This operation further includes delivering a process gas from a gas source to the vacuum chamber via the restricted path. The vacuum chamber is pneumatically coupled to the zero-blind-tube orifice bypass. This operation further includes, during purge processing, supplying purge gas from a gas source to the zero-blind-tube orifice bypass. This operation further includes delivering the purge gas to the vacuum chamber via an unrestricted path of the zero-blind-tube orifice bypass, the unrestricted path including a second set of valve branches of the zero-blind-tube orifice bypass. Attached Figure Description

[0010] The accompanying figures illustrate only exemplary embodiments of the present disclosure and should not be construed as limiting its scope.

[0011] Figure 1 A reactor system for fabricating substrates, having a vacuum chamber (e.g., a deposition chamber), is shown according to some exemplary embodiments.

[0012] Figure 2 According to some exemplary implementations, and Figure 1 A block diagram of a zero-blind-tube orifice bypass module used in conjunction with a vacuum chamber.

[0013] Figure 3A A perspective view of a zero-blind-hole bypass module with two three-way valves and a flow limiter, configured according to some exemplary embodiments.

[0014] Figure 3B According to some exemplary implementations Figure 3A Side view of the zero blind pipe orifice bypass module.

[0015] Figure 4 A perspective view of a zero-blind-hole bypass module with two three-way valves, a flow limiter, and a manifold, configured according to some exemplary embodiments.

[0016] Figure 5 According to some exemplary implementations Figure 4 Side view of the zero blind pipe orifice bypass module.

[0017] Figure 6 This is a block diagram of a zero-blind-port bypass module using a three-way valve located on the opposite side of the manifold, according to some exemplary embodiments.

[0018] Figure 7 This is a flowchart of a method for delivering fluid to a vacuum chamber according to some exemplary embodiments.

[0019] Figure 8 The block diagram illustrates an example of a machine, on which one or more exemplary method implementations may be implemented, or through which one or more exemplary implementations may be controlled. Detailed Implementation

[0020] Exemplary methods, systems, and computer programs are designed to achieve zero blind via bypass in substrate fabrication apparatus. Examples are merely typical of possible variations. Unless explicitly stated otherwise, components and functions are optional and may be combined or subdivided, and the order of operations may also be changed, combined, or subdivided. Numerous specific details are set forth in the following description to provide a thorough understanding of exemplary embodiments. However, it will be apparent to those skilled in the art that this subject matter can be achieved without these specific details.

[0021] As used herein, the term "dead leg" refers to a portion of the connection (e.g., a flow path) between a gas source and a processing chamber that is not used for fluid transport for a pre-configured period but is in proximity to the fluid during transport. A dead leg can also be referred to as a volume in a fluid delivery line that is not flushed during a purging process. The term "plasma-based process" can include deposition processes, etching processes, or multi-step processes (e.g., deposition followed by etching).

[0022] In substrate processing systems, flow restrictors (orifices) are used to stabilize fluid flow rates for the consistent delivery of specific hazardous low vapor pressure semiconductor deposition precursors. This processing flow rate can be approximately 1 standard liter per minute (SLM) or less. To maintain the processing system, gas flow paths (e.g., gas lines) are open to the atmosphere. This necessitates flushing (purge) hazardous substances from the lines before opening them, and then purging moisture and other contaminants after the lines are resealed. Due to orifice limitations in the purging path, purging / flushing times can be excessively long (e.g., 12-24 hours). This significantly increases "green-to-green" times and reduces tooling productivity.

[0023] The disclosed technology can be used to configure a zero-dead-leg orifice bypass module that uses a set of valves (e.g., multi-way valves, such as three-way valves) and at least one gas manifold (e.g., including a flow restrictor). The zero-dead-leg orifice bypass module allows for restricted flow of gases and vapors used in wafer processing, with no "dead-legs" in the flow path. Unflushed volumes (e.g., dead-legs) can accumulate particles or reactants in unflushed areas, which may later be released, contaminating the wafer and causing wafer scrap and productivity loss. However, the disclosed zero-dead-leg orifice bypass module provides efficient flushing by opening the valves, thus offering the ability to perform high-flow flushing / purge. The disclosed technology can provide both zero-dead-leg and high-flow flushing capabilities in a single subsystem, resulting in faster tooling "green-to-green" times and improved tooling productivity.

[0024] For general instructions on using the disclosed zero-blind-hole bypass module for the vacuum chamber, please refer to [link / reference needed]. Figure 1 . Figures 2-7 Other configurations of the zero blind pipe orifice bypass module were discussed. Figure 8 An exemplary machine that can implement one or more example method implementations is discussed.

[0025] Figure 1 A reactor system with a vacuum chamber (e.g., a deposition chamber) for fabricating a substrate is shown according to some exemplary embodiments. Figure 1 As shown, reactor system 100 includes a processing chamber 136 surrounding other components of reactor system 100 and used to contain plasma generated by a capacitor discharge type system. Processing chamber 136 includes a nozzle 108 that operates in conjunction with a grounded heater block 132. A high-frequency (HF) radio-frequency (RF) generator 102 and a low-frequency (LF) radio-frequency (LFRF) generator 104 are connected to a matching network 106 and the nozzle 108. The power and frequency supplied by matching network 106 are sufficient to generate plasma from the process gas supplied to processing chamber 136. In typical processing, the HFRF component is typically between 5 MHz and 60 MHz, for example, 13.56 MHz. In operation with an LF component, the LF component is typically between about 100 kHz and 2 MHz, for example, 430 kHz.

[0026] Within processing chamber 136, base 130 supports a substrate (e.g., wafer 128). Base 130 includes a chuck, fork (not shown), or lift pin (not shown) to hold the wafer 128 in place and move it into and out of processing chamber 136 between operations. The chuck can be an electrostatic chuck, a mechanical chuck, or other various types of chucks used in industry and research.

[0027] Various process gases can be input via inlet 124. Multiple source gas lines (e.g., gas lines 118, gas lines 120) are connected to manifold 122. These gases may or may not be premixed. Corresponding valves and mass flow control (MFC) mechanisms (e.g., valves 110, 116) can be employed to ensure the correct process gas is delivered during the deposition and plasma treatment stages of each operation in the process. In the case where chemical precursors are delivered in liquid form, a liquid flow control mechanism can be employed. Such liquids, during transport, can be vaporized and mixed with the process gases in a manifold heated to a point above the vaporization point of the chemical precursors supplied in liquid form before reaching the processing chamber 136.

[0028] Dispenser 114 is connected to inlet 124. Dispenser 114 dispenses chemicals, such as TMA, zinc, magnesium, or fluorine, into vials 126 coupled to dispenser 114. In one exemplary embodiment, the precursor in vial 126 includes a chemical (e.g., TMA) coated on the inner wall of processing chamber 136. These coatings can prevent diffusion and release from substrate materials (e.g., aluminum), prevent chemical corrosion (e.g., fluorine), provide desired electrical properties, or repair surface damage (e.g., damage caused by in-situ cleaning).

[0029] The process gas can be discharged from the process chamber 136 via outlet 112. A vacuum pump 134 (e.g., a single- or two-stage mechanical dry pump and a turbomolecular pump) can be used to extract the process gas from the process chamber 136 and maintain an appropriate low pressure within the process chamber 136 by using a closed-loop controlled flow-limiting device (not shown) (e.g., a throttle valve or pendulum valve)).

[0030] As described above, the deposition techniques discussed herein can be implemented using multi-station or single-station tools. In some implementations, tools for processing 450mm wafers can be used. In various implementations, the wafer can be indexed after each deposition process, or if the etching chamber or station is also part of the same tool, indexing can be performed after the etching step, or multiple depositions and processes can be performed at a single station before indexing the wafer. In some implementations, the wafer can be indexed after each layer deposition, for example, after the underlayer deposition or after the atomic smoothing layer deposition.

[0031] In some embodiments, apparatus configured to perform the techniques described herein may be provided. According to the disclosed embodiments, suitable apparatus may include hardware for performing various processing operations, and a system controller 138 having instructions for controlling the processing operations. The system controller 138 includes one or more memory devices and one or more processors, which are communicatively connected to various processing control devices (e.g., valves, RF generators, wafer handling systems, etc.) and configured to execute instructions so that the apparatus will perform the techniques according to the disclosed embodiments. A machine-readable medium containing instructions for controlling processing operations according to this disclosure may be coupled to the system controller 138. The system controller 138 may be communicatively connected to various hardware devices (e.g., distributor 114, mass flow controller, valve, RF generator, vacuum pump, etc.) to facilitate control of various processing parameters related to the deposition operations described herein.

[0032] In some implementations, system controller 138 controls all activities of reactor system 100. System controller 138 can execute system control software stored in a mass storage device, loaded into a memory device, and executed on a processor. Additionally, control logic can be hardware-coded in system controller 138. Application-specific integrated circuits (ASICs), programmable logic devices (e.g., field-programmable gate arrays or FPGAs), etc., can be used for these applications. In the following discussion, wherever "software" or "code" is used, equivalent hard-coded logic can be used instead. System control software may include instructions for controlling the timing of dispensing chemicals from vial 126, the timing of gas flow, wafer movement, RF generator startup, etc., as well as instructions for controlling gas mixing, chamber and / or station pressure, chamber and / or station temperature, wafer temperature, target power level, RF power level, substrate base, chuck and / or susceptor position, and other parameters of the specific processes performed by reactor system 100. System control software can be configured in any suitable manner. For example, various processing tool component subroutines or control objects can be written to control the operation of the processing tool components required to perform various processing tasks. The system control software can be coded in any suitable computer-readable programming language.

[0033] System controller 138 may typically include one or more memory devices and one or more processors configured to execute instructions that enable the apparatus to perform technology according to this disclosure. A machine-readable medium containing instructions for controlling processing operations according to the disclosed embodiments may be coupled to system controller 138.

[0034] The methods and apparatus described herein can be used in conjunction with photolithographic patterning tools or processes, such as in the fabrication or processing of semiconductor devices, displays, LEDs, optoelectronic panels, etc. Typically, although not necessarily, these tools / processes will be used or operated together in a common manufacturing facility. Photolithographic patterning of a film typically includes some or all of the following steps, each performed with multiple feasible tools: (1) applying a photoresist to a workpiece (e.g., a substrate or a multilayer stack provided in the disclosed embodiments) using a spin coater or spray coater; (2) curing the photoresist using a hot plate or oven or a UV curing tool; (3) exposing the photoresist to visible light or ultraviolet or X-rays using a tool such as a wafer stepper; (4) developing the photoresist to selectively remove the photoresist and thereby pattern it using a tool such as a wet cleaning station; (5) transferring the photoresist pattern onto an underlying film or workpiece, such as an amorphous carbon underlayer, using a dry or plasma-assisted etching tool; and (6) removing the photoresist using a tool such as an RF or microwave plasma resist stripper.

[0035] In some embodiments, reactor system 100 further includes a zero-blind-hole bypass module (or OBM) 123. In some aspects, OBM 123 may be configured along one or more fluid connections (e.g., process gas and / or purge gas connections) between manifold 122 and treatment chamber 136. Although Figure 1 A single OBM123 is shown, but this disclosure is not limited to this, and additional OBMs may be used at different locations along the entrance 124. Figure 2-7 Other configurations of the OBM123 were discussed.

[0036] Figure 2 According to some exemplary implementations, and Figure 1 A block diagram of a zero-blind-tube orifice bypass module used in conjunction with a vacuum chamber. (Refer to...) Figure 2 , Figure 1 The zero-blind-port bypass module (e.g., OBM 123) includes multiple multi-port valves, such as a first multi-port valve 202 and a second multi-port valve 204. OBM 123 further includes a flow limiter 206.

[0037] In some implementations, the first multi-way valve 202 and the second multi-way valve 204 are three-way valves (e.g., as shown in the original text). Figure 3A-6 (As shown in the various implementation schemes). Although Figure 3A-6 A three-way valve is shown, but this disclosure is not limited thereto; valves with different numbers of ports may also be used.

[0038] Figure 3APerspective view 300 of a zero-blind-hole bypass module (e.g., OBM 123) configured according to some exemplary embodiments, comprising two three-way valves and a flow limiter. (Refer to...) Figure 3A The OBM 123 includes a first multi-way valve 202, a second multi-way valve 204, and a flow limiter 206.

[0039] In some aspects, the first multi-way valve 202 includes valve branches 304, 306, and 308, each valve branch having an opening in fluid communication with an annular body 302. The first multi-way valve 202 also includes a diaphragm 303 (or membrane) configured to open or close the opening of valve branch 306. In this respect, when the diaphragm 303 is closed, fluid can flow between the inlet port 301 of valve branch 304 and valve branch 308 via the annular body 302. When the diaphragm 303 is open, fluid can flow between valve branches 304, 306, and 308 via the annular body 302.

[0040] In some aspects, the second multi-way valve 204 includes valve branches 312, 314, and 316, each valve branch having an opening in fluid connection with an annulus 310. The second multi-way valve 204 also includes a diaphragm 311 (or membrane) configured to open or close the opening of valve branch 314. In this respect, when the diaphragm 311 is closed, fluid can flow through the annulus 310 between valve branches 312, 316, and the outlet port 317. When the diaphragm 311 is open, fluid can flow through the annulus 310 between valve branches 312, 314, and 316.

[0041] Figure 3B According to some exemplary implementations Figure 3A Side view 320 of the zero-blind-pipe bypass module. (Refer to...) Figure 3B The flow limiter 206 may include a restrictor on one of the ports associated with the channel through which the flow limiter passes. For example, the flow limiter 206 includes a restriction portion 319 on the channel 318, the restriction portion 319 being close to the opening of the valve branch 308.

[0042] In some respects, during example operation, diaphragms 303 and 311 are closed. The process gas then flows from the inlet port 301 of valve branch 304 to annulus 302, to valve branch 308, through the restrictor 319 on channel 318, through valve branch 312, through annulus 310, and to the outlet port 317 of valve branch 316.

[0043] In an exemplary cleaning (or flushing) operation (e.g., when a faster cleaning is required), diaphragms 303 and 311 may open. Valve branches 306 and 314 may be connected via independent channels (e.g., as...). Figure 5(As shown). In this respect, the purge gas can flow in an unrestricted path formed between inlet port 301, valve branch 304, annulus 302, valve branches 306 and 314, annulus 310, and outlet port 317 of valve branch 316.

[0044] In this respect, the OBM 123 does not include unflushed volumes in the flow path of the processing operation (i.e., there is no "dead leg" during the flow of the process gas between the inlet and outlet). To perform a flushing or purging operation, two valves are opened (e.g., diaphragms 303 and 311 are opened), allowing unrestricted gas flow from valve branch 306 of the first multi-way valve 202 to valve branch 314 of the second multi-way valve 204. The unrestricted flow rate can be higher than the flow rate through the orifice with the limiting portion 319 (e.g., 30 slm or more). This configuration can significantly reduce flushing / purging time (e.g., to one-third or less of that without the unrestricted path bypass). This configuration also reduces the green-to-green time, thereby increasing tooling productivity.

[0045] In some embodiments, the opening and closing states of diaphragms 303 and 311 can be controlled by system controller 138. Furthermore, system controller 138 can control the degree (e.g., size) of the limiting portion 319.

[0046] Figure 4 Perspective view 400 of OBM 123, configured according to some exemplary embodiments, having two three-way valves (e.g., multi-way valves 202 and 204), a flow restrictor 206, and a manifold 402.

[0047] Figure 5 According to some exemplary implementations Figure 4 Side view 500 of the zero blind pipe orifice bypass module.

[0048] Reference Figure 4 and Figure 5 The flow restrictor 206 may be configured between the first multi-port valve 202 and the manifold 402. The manifold 402 may be configured with passages pneumatically connected to corresponding valve branches of the multi-port valves 202 and 204. For example, the manifold 402 includes passage 502 (e.g., connecting inlet port 501 and valve branch 304), passage 504 (e.g., connecting valve branches 308 and 312), passage 508 (e.g., connecting valve branches 306 and 314), and passage 506 (e.g., connecting valve branch 316 and outlet port 507).

[0049] In some aspects, the flow restrictor 206 includes a limiting portion 319 disposed at valve branch 308. In some embodiments, the flow restrictor 206 may be disposed between the second multiport valve 204 and the manifold 402 (in which case, the limiting portion 319 may be disposed at valve branch 312).

[0050] In some respects, multi-way valves 202 and 204 may be located on the same side of manifold 402 (e.g., as shown in the image). Figure 4 and Figure 5 (As shown). However, this disclosure is not limited to this, and other configuration methods are also possible (e.g., as shown). Figure 6 (As shown).

[0051] Figure 6 Block diagram 600 shows a zero-blind-port bypass module using a three-way valve disposed on opposite sides of a manifold, according to some exemplary embodiments. (Refer to...) Figure 6 In some implementations, multi-way valves 202 and 204 are located on opposite sides of manifold 402.

[0052] Figure 7 This is a flowchart of a method 700 for delivering fluid to a vacuum chamber according to some exemplary embodiments. Method 700 includes operations 702, 704, 706, and 708, which can be controlled by a controller (e.g., Figure 1 The system controller 138) or processor (e.g., Figure 8 The processor 802) executes.

[0053] See Figure 7 In operation 702, a restricted path for zero-blind-hole bypass is initiated during plasma-based processing. For example, Figure 3A-5 The restricted paths of the OBM 123 include the first set of valve branches (e.g., valve branches 304, 308, 312 and 316) and the flow limiter (e.g. flow limiter 206) for the zero blind pipe orifice bypass.

[0054] In operation 704, the process gas is delivered from a gas source (e.g., manifold 122) via a restricted path to a vacuum chamber (e.g., processing chamber 136). The vacuum chamber may be pneumatically coupled to a zero-blind-hole bypass.

[0055] During operation 706, during purging, the supply of purging gas from the gas source to the zero blind pipe orifice bypass is activated.

[0056] In operation 708, purge gas is delivered to the vacuum chamber via an unrestricted path through the zero-blind-hole bypass. For example, the unrestricted path can be enabled by opening diaphragms 303 and 311 and includes a second set of valve branches of the zero-blind-hole bypass (e.g., the unrestricted path may include valve branches 304, 306, 314, and 316).

[0057] Figure 8 The block diagram illustrating an example of machine 800 shows one or more exemplary processing implementations described herein that can be implemented or controlled on or through the machine. In alternative implementations, machine 800 may operate as a standalone device or be connectable (e.g., network-connected) to other machines. In a networked deployment, machine 800 may operate as a server machine, a client machine, or both in a server-client network environment. In one example, machine 800 may be used as a peer machine in a peer-to-peer (P2P) network (or other distributed network) environment. Furthermore, while only a single machine 800 is shown, the term "machine" should also be considered as encompassing any collection of machines that individually or jointly execute one or more sets of instructions to perform any or more of the methods described herein, for example, via cloud computing, Software as a Service (SaaS), or other computer cluster configurations.

[0058] The examples described herein may include logic, components, or mechanisms, or may be operated by logic, components, or mechanisms. A circuit system is a collection of circuits implemented in a tangible entity containing hardware (e.g., simple circuits, gates, logic). Circuit system components can be flexible over time and due to the variability of the basic hardware. A circuit system contains components that can perform a specified operation individually or in combination at runtime. In one example, the hardware of a circuit system may be designed in a fixed and immutable manner to perform a specific operation (e.g., hardwiring). In another example, the hardware of a circuit system may contain variable-connection physical components (e.g., execution units, transistors, simple circuits) including a computer-readable medium that is physically modified (e.g., magnetically, electrically, through the movable arrangement of invariant mass particles) to encode instructions for a specific operation. When connecting physical components, the basic electrical properties of the hardware components are changed (e.g., from an insulator to a conductor, or vice versa). Instructions enable embedded hardware (e.g., execution units or loading mechanisms) to generate components of a circuit system in the hardware via variable connections to perform a specific operation when in operation. Therefore, when the device is in operation, the computer-readable medium is communicatively coupled to other components of the circuit system. In some aspects, any of the physical components can be used in more than one component of more than one circuit system. For example, in operation, an execution unit may be used in a first circuit of a first circuit system at one point in time, and then reused at a different time by a second circuit of the first circuit system, or by a third circuit of the second circuit system.

[0059] Machine (such as computer system) 800 may include a hardware processor 802 (such as a central processing unit (CPU), hardware processor core, or any combination thereof), a graphics processing unit (GPU) 803, main memory 804, and static memory 806, some or all of which may communicate with each other via interconnect (such as a bus) 808. Machine 800 may also include a display device 810, an alphanumeric input device 812 (such as a keyboard), and a user interface (UI) navigation device 814 (such as a mouse). In one example, display device 810, alphanumeric input device 812, and UI navigation device 814 may be a touch screen display. Machine 800 may additionally include a mass storage device (such as a drive unit) 816, a signal generating device 818 (such as a speaker), a network interface device 820, and one or more sensors 821, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. Machine 800 may include an output controller 828 (e.g., serial (e.g., Universal Serial Bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC)) connection) to communicate with or control one or more peripheral devices (e.g., printer, card reader).

[0060] In an exemplary implementation, the hardware processor 802 may perform at least the following operations: Figures 1-7 Regarding the functions of the system controller 138 discussed in this article.

[0061] Mass storage device 816 may include machine-readable medium 822 on which one or more sets of data structures or instructions 824 (e.g., software) may be stored, implemented, or used by any or more of the techniques or functions described herein. Instructions 824 may also reside wholly or at least partially within main memory 804, static memory 806, hardware processor 802, or GPU 803 during execution by machine 800. In one example, one or any combination of hardware processor 802, GPU 803, main memory 804, static memory 806, or mass storage device 816 may constitute the machine-readable medium.

[0062] Although machine-readable medium 822 is shown as a single medium, the term "machine-readable medium" may include a single medium or multiple media (such as a centralized or distributed database and / or associated cache and server) configured to store instructions 824.

[0063] The term "machine-readable medium" can include: any medium capable of storing, encoding, or carrying instructions 824 for use by machine 800 and for causing machine 800 to perform any or more of the techniques of this disclosure; or any medium capable of storing, encoding, or carrying data structures used by or associated with such instructions 824. Examples of non-limiting machine-readable media may include solid-state memory and optical and magnetic media. In one example, a massed machine-readable medium comprises a machine-readable medium 822 having a plurality of particles with constant mass (e.g., rest mass). Therefore, a massed machine-readable medium does not propagate signals instantaneously. Specific examples of massed machine-readable media may include non-volatile memory, such as semiconductor memory devices (e.g., electronically programmable read-only memory (EPROM), electronically eraseable programmable read-only memory (EEPROM)) and flash memory devices; disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0064] Instruction 824 can be further transmitted or received on communication network 826 via network interface device 820 using a transmission medium.

[0065] The aforementioned technologies can be implemented via any number of specifications, configurations, or exemplary deployments of hardware and software. It should be understood that the functional units or capabilities described in this specification may be referred to or labeled as components or modules to more specifically emphasize their implementation independence. Such components can be embodied in any number of software or hardware forms. For example, a component or module may be implemented as a hardware circuit comprising custom-made very large-scale integrated (VLSI) circuitry, or gate arrays, off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. Components or modules may also be implemented in programmable hardware devices, such as field-programmable gate arrays, programmable array logic, programmable logic devices, etc. Components or modules may also be implemented in software for execution by various types of processors. The identified components or modules of executable code may, for example, comprise one or more physical or logical blocks of computer instructions, which may, for example, be organized as objects, programs, or functions. However, the executable files of the identified components or modules do not need to be physically placed together, but may include different instructions stored in different locations that, when logically connected together, comprise the components or modules and implement the stated purpose of the components or modules.

[0066] In practice, executable code components or modules can be single instructions or multiple instructions, and can even be distributed across several different code segments, different programs, and across several memory devices or processing systems. Specifically, certain aspects of the programs (e.g., code rewriting and code analysis) can occur on a different processing system than the processing system in which the code is deployed (e.g., a computer embedded in a sensor or robotic arm) (e.g., a computer in a data center). Similarly, operational data can be identified and described within the components or modules herein, and can be embodied in any suitable form and organized within any suitable type of data structure. Operational data can be collected as a single data set or can be distributed across different locations, including across different storage devices, and can exist at least partially as electronic signals on a system or network. Components or modules can be passive or active, including agents operable to perform desired functions.

[0067] Other descriptions and examples of the disclosed topics Example 1 is a zero-blind-port bypass device, comprising: a first multi-way valve including a first plurality of valve branches, the first plurality of valve branches including an inlet port; a second multi-way valve including a second plurality of valve branches, the second plurality of valve branches including an outlet port, the first plurality of valve branches and the second plurality of valve branches forming at least one unrestricted path between the inlet port and the outlet port; and a flow restrictor pneumatically coupled to the first multi-way valve and the second multi-way valve, the first plurality of valve branches and the second plurality of valve branches forming at least one restricted path between the inlet port and the outlet port, and the at least one restricted path passing through the restricted port of the flow restrictor.

[0068] In Example 2, the subject matter described in Example 1 includes a subject matter having the following characteristics: at least one first valve branch in the first plurality of valve branches and at least one first valve branch in the second plurality of valve branches are shared between the restricted path and the unrestricted path.

[0069] In Example 3, the subject matter described in Example 2 includes a subject matter having the following characteristics: at least one second valve branch in the first plurality of valve branches and at least one second valve branch in the second plurality of valve branches are associated with the unrestricted path, but not with the restricted path.

[0070] In Example 4, the subject matter described in Examples 1-3 further includes a manifold that is pneumatically coupled to the flow restrictor and the second multi-way valve.

[0071] In Example 5, the subject described in Example 4 includes a subject having the following characteristics: the manifold further includes: a first set of channels associated with the unrestricted path; and a second set of channels associated with the restricted path.

[0072] In Example 6, the subject described in Example 5 includes a subject with the following characteristics: one or more channels in the first group of channels are included in the second group of channels.

[0073] In Example 7, the subject matter described in Examples 4-6 includes a subject matter having the following characteristics: the flow limiter and the second multi-way valve are pneumatically coupled to the same surface of the manifold.

[0074] In Example 8, the subject matter described in Examples 4-7 includes a subject matter having the following characteristics: the flow limiter and the second multi-way valve are pneumatically coupled to the opposite surfaces of the manifold.

[0075] In Example 9, the subject matter described in Examples 1-8 includes a subject matter having the following characteristics: the first multi-way valve further includes: a first annular body; and a first diaphragm disposed within the first annular body.

[0076] In Example 10, the subject matter described in Example 9 includes a subject matter having the following characteristics: the second multi-way valve further includes: a second annular body; and a second diaphragm disposed within the second annular body.

[0077] In Example 11, the subject matter described in Example 10 includes a subject matter having the following characteristics: when the first diaphragm and the second diaphragm are in a closed state: the first diaphragm covers at least one of the first plurality of valve branches. The second diaphragm covers at least one of the second plurality of valve branches, causing fluid to flow between the inlet port and the outlet port via the at least one restricted path.

[0078] In Example 12, the subject matter described in Example 11 includes a subject matter having the following characteristics: when the first diaphragm and the second diaphragm are in an open state: the first diaphragm opens a first channel through at least one of the first plurality of valve branches; and the second diaphragm opens a second channel through at least one of the second plurality of valve branches, causing fluid to flow between the inlet port and the outlet port via the unrestricted path, wherein the unrestricted path includes the first channel and the second channel.

[0079] Example 13 is a substrate processing system comprising: a gas source configured to generate a process gas; a vacuum chamber including a processing zone configured to receive the process gas for plasma-based processing of a substrate; a zero-blind-port bypass pneumatically coupled to the gas source and the vacuum chamber, the zero-blind-port bypass including: a first multi-way valve including a first plurality of valve branches, the first plurality of valve branches including an inlet port pneumatically coupled to the gas source; a second multi-way valve including a second plurality of valve branches, the second plurality of valve branches including an outlet port pneumatically coupled to the vacuum chamber; a flow limiter pneumatically coupled to the first multi-way valve and the second multi-way valve; and a controller coupled to the zero-blind-port bypass and the gas source, the controller being configured to: during the plasma-based processing, activate a restricted path of the zero-blind-port bypass, the restricted path including the flow limiter; and cause the process gas to be delivered to the vacuum chamber via the restricted path.

[0080] In Example 14, the subject matter described in Example 13 includes a subject matter having the following characteristics: the first multi-way valve further includes a first annular body and a first diaphragm disposed within the first annular body.

[0081] In Example 15, the subject matter described in Example 14 includes a subject matter having the following characteristics: the second multi-way valve further includes a second annulus and a second diaphragm disposed within the second annulus.

[0082] In Example 16, the subject matter described in Example 15 includes a subject matter having the following characteristics: in order to enable the restricted path; the controller is configured to: configure the first diaphragm and the second diaphragm to a closed state, causing fluid to flow between the inlet port and the outlet port via the restricted path.

[0083] In Example 17, the subject matter described in Example 16 includes a subject matter having the following characteristics: the closed state causes the first diaphragm to cover at least one of the first plurality of valve branches and causes the second diaphragm to cover at least one of the second plurality of valve branches.

[0084] In Example 18, the subject matter described in Examples 16-17 includes a subject matter having the following characteristics: the controller is used to enable cleaning gas to be supplied from the gas source to the zero blind pipe orifice bypass during cleaning processing.

[0085] In Example 19, the subject matter described in Example 18 includes a subject matter having the following characteristics: the controller is configured to: during the cleaning process, configure the first diaphragm and the second diaphragm to be in an open state, causing the cleaning gas to flow between the inlet port and the outlet port via an unrestricted path.

[0086] Example 20 is a method for delivering fluid to a vacuum chamber, the method comprising: during plasma-based processing, activating a restricted path of a zero-blind-tube orifice bypass, the restricted path including a first set of valve branches and a flow restrictor of the zero-blind-tube orifice bypass; causing a process gas to be delivered from a gas source to the vacuum chamber via the restricted path, the vacuum chamber being aerodynamically coupled to the zero-blind-tube orifice bypass; during purging processing, causing a purging gas to be supplied from the gas source to the zero-blind-tube orifice bypass; and causing the purging gas to be delivered to the vacuum chamber via an unrestricted path of the zero-blind-tube orifice bypass, the unrestricted path including a second set of valve branches of the zero-blind-tube orifice bypass.

[0087] In Example 21, the subject matter described in Example 20 further includes configuring at least one diaphragm of the zero blind port bypass to a closed state, causing the process gas to be delivered via the restricted path.

[0088] In Example 22, the subject matter described in Example 21 includes: configuring at least one diaphragm of the zero blind port bypass to an open state, causing the purge gas to be delivered via the unrestricted path.

[0089] Example 23 is a non-transient machine-readable storage medium including instructions that, when executed by a machine, cause the machine to perform operations to deliver fluid to a vacuum chamber. These operations include, during plasma-based processing, activating a restricted path of a zero-blind-tube orifice bypass, the restricted path including a first set of valve branches of the zero-blind-tube orifice bypass and a flow restrictor; delivering process gas from a gas source to the vacuum chamber via the restricted path, the vacuum chamber being aerodynamically coupled to the zero-blind-tube orifice bypass; supplying purge gas from a gas source to the zero-blind-tube orifice bypass during purge processing; and delivering purge gas to the vacuum chamber via an unrestricted path of the zero-blind-tube orifice bypass, the unrestricted path including a second set of valve branches of the zero-blind-tube orifice bypass.

[0090] In Example 24, the subject matter of Example 23 includes further including configuring at least one diaphragm of the zero blind orifice bypass to a closed state, so that the process gas is delivered via a restricted path.

[0091] In Example 25, the subject matter of Example 24 includes further including configuring at least one diaphragm of the zero blind port bypass to an open state, allowing purge gas to be delivered via an unrestricted path.

[0092] Example 26 is at least one machine-readable medium that includes instructions that, when executed by the processing circuitry, cause the processing circuitry to perform operations to implement any of Examples 1-25.

[0093] Example 27 is an apparatus that includes components configured to implement any of Examples 1-25.

[0094] Example 28 is a system that implements any one of Examples 1-25.

[0095] Example 29 is a method that can be used to implement any of Examples 1-25.

[0096] In this specification, multiple instances may implement a component, operation, or structure described as a single instance. While individual operations of one or more methods are depicted and described as separate operations, one or more of these separate operations may be performed simultaneously, and they need not be performed in the order shown. Structures and functions are presented as separate components; for example, configurations may be implemented as combined structures or components. Similarly, structures and functions presented as single components may be implemented as separate components. These and other variations, modifications, additions, and improvements fall within the scope of the subject matter described herein.

[0097] The embodiments described herein are presented in sufficient detail to enable those skilled in the art to implement the disclosed teachings. Other embodiments may be used and derived therefrom, allowing for structural and logical substitutions and changes without departing from the scope of this disclosure. Therefore, this specific embodiment should not be considered limiting, and the scope of the various embodiments is defined only by the full scope of the appended claims and their equivalents.

[0098] The claims may not list every feature disclosed herein, as embodiments may feature a subset of said features. Furthermore, embodiments may include fewer features than those disclosed in a particular example. Therefore, the following claims are incorporated into the detailed description, wherein each claim stands alone as a separate embodiment.

[0099] When used herein, the term "or" may be interpreted in a sense of exclusivity or exclusivity. Furthermore, multiple instances may be provided for use with a single instance of a resource, operation, or structure described herein. Moreover, the boundaries between various resources, operations, modules, tools, and data storage are somewhat arbitrary and specific operations are illustrated within the context of a particular illustrative configuration. Other allocations of functionality are contemplated and may fall within the scope of various embodiments of this disclosure. Generally, in the examples, structures and functions are presented as separate resources, and configurations may be implemented as combined structures or resources. Similarly, structures and functions presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within the scope of embodiments of this disclosure, as presented in the appended claims. Therefore, the specification and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. A zero-blind-hole bypass device, comprising: A first multi-way valve includes a first plurality of valve branches, the first plurality of valve branches including an inlet port; The second multi-way valve includes a second plurality of valve branches, each of which includes an outlet port. The first plurality of valve branches and the second plurality of valve branches form an unrestricted path between the inlet port and the outlet port. as well as A flow restrictor is pneumatically coupled to a first multi-way valve and a second multi-way valve, wherein the first plurality of valve branches and the second plurality of valve branches form a restricted path between the inlet port and the outlet port, and the restricted path passes through the restricted port of the flow restrictor.

2. The zero-blind-port bypass device according to claim 1, wherein at least one first valve branch of the first plurality of valve branches and at least one first valve branch of the second plurality of valve branches are shared between the restricted path and the unrestricted path.

3. The zero-blind-port bypass device according to claim 2, wherein at least one second valve branch in the first plurality of valve branches and at least one second valve branch in the second plurality of valve branches are associated with the unrestricted path and not with the restricted path.

4. The zero-blind-pipe orifice bypass device according to claim 1, further comprising: The manifold is pneumatically coupled to the flow restrictor and the second multi-way valve.

5. The zero-blind-pipe orifice bypass device according to claim 4, wherein the manifold further comprises: The first set of channels is associated with the unrestricted path; as well as The second set of channels is associated with the restricted path.

6. The zero-blind-hole bypass device according to claim 5, wherein one or more channels in the first group of channels are included in the second group of channels.

7. The zero-blind-port bypass device according to claim 4, wherein the flow limiter and the second multi-way valve are pneumatically coupled to the same surface of the manifold.

8. The zero-blind-port bypass device according to claim 4, wherein the flow limiter and the second multi-way valve are pneumatically coupled to the opposite surface of the manifold.

9. The zero-blind-pipe orifice bypass device according to claim 1, wherein the first multi-way valve further comprises: First ring-shaped body; as well as A first diaphragm is disposed within the first annulus.

10. The zero-blind-port bypass device according to claim 9, wherein the second multi-way valve further comprises: Second ring-shaped body; as well as The second diaphragm is disposed within the second annulus.

11. The zero-blind-hole bypass device according to claim 10, wherein when the first diaphragm and the second diaphragm are in the closed state: The first diaphragm covers at least one of the first plurality of valve branches; and The second diaphragm covers at least one of the second plurality of valve branches, causing fluid to flow between the inlet port and the outlet port via the restricted path.

12. The zero-blind-hole bypass device according to claim 11, wherein when the first diaphragm and the second diaphragm are in the open state: The first diaphragm opens a first channel through at least one of the first plurality of valve branches; and The second diaphragm opens a second channel through at least one of the second plurality of valve branches, causing fluid to flow between the inlet port and the outlet port via the unrestricted path, wherein the unrestricted path includes the first channel and the second channel.

13. A substrate processing system comprising: A gas source configured to generate the processing gas; A vacuum chamber, including a processing area, the vacuum chamber being configured to receive the processing gas for plasma-based processing of a substrate; A zero-blind-tube orifice bypass, pneumatically coupled to the gas source and the vacuum chamber, the zero-blind-tube orifice bypass comprising: A first multi-way valve includes a first plurality of valve branches, the first plurality of valve branches including an inlet port pneumatically coupled to the gas source; A second multi-way valve includes a second plurality of valve branches, each of which includes an outlet port pneumatically coupled to the vacuum chamber; and A flow limiter, pneumatically coupled to the first multi-way valve and the second multi-way valve; and A controller, coupled to the zero-blind-pipe orifice bypass and the gas source, is configured to: During the plasma-based processing, a restricted path for the zero-blind-hole bypass is initiated, the restricted path including the current limiter; and This causes the processing gas to be delivered to the vacuum chamber via the restricted path.

14. The substrate processing system of claim 13, wherein the first multi-way valve further comprises a first annular body and a first diaphragm disposed within the first annular body, and wherein the second multi-way valve further comprises a second annular body and a second diaphragm disposed within the second annular body.

15. The substrate processing system of claim 14, wherein, in order to enable the restricted path, the controller is configured to: The first and second diaphragms are configured to be closed, causing fluid to flow between the inlet and outlet ports via the confined path; and During the cleaning process, cleaning gas is supplied from the gas source to the zero blind pipe orifice bypass.

16. The substrate processing system of claim 15, wherein the closed state causes the first diaphragm to cover at least one of the first plurality of valve branches and the second diaphragm to cover at least one of the second plurality of valve branches.

17. The substrate processing system of claim 15, wherein the controller is configured to: During the cleaning process, the first diaphragm and the second diaphragm are configured to be open, causing the cleaning gas to flow between the inlet port and the outlet port via an unrestricted path.

18. A method for delivering fluid to a vacuum chamber, the method comprising: During plasma-based processing, a restricted path for the zero-blind-hole bypass is initiated, the restricted path comprising a first set of valve branches and a flow limiter of the zero-blind-hole bypass; This causes the process gas to be delivered from the gas source to the vacuum chamber via the restricted path, the vacuum chamber being aerodynamically coupled to the zero blind tube orifice bypass; During the cleaning process, cleaning gas can be supplied from the gas source to the zero blind pipe orifice bypass; as well as This causes the purge gas to be delivered to the vacuum chamber via an unrestricted path through the zero blind tube orifice bypass, the unrestricted path including the second set of valve branches of the zero blind tube orifice bypass.

19. The method of claim 18, further comprising: At least one diaphragm of the zero blind port bypass is configured to be closed, causing the process gas to be delivered via the restricted path.

20. The method of claim 19, further comprising: The at least one diaphragm of the zero blind port bypass is configured to be open, causing the purge gas to be delivered via the unrestricted path.

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