Supercapacitor for solder reflow process

Abstract

A supercapacitor is disclosed. The supercapacitor includes a package, first and second electrically conductive members, an electrode assembly, and an electrolyte. The package includes a base having an inner base surface and an outer base surface opposite the inner base surface, a sidewall extending in a direction generally perpendicular to the base and defining a first upper end and a first sidewall inner surface, an interior chamber defined between the inner base surface and the first sidewall inner surface, a lid closing the interior chamber, and wherein the base and the sidewall are formed of a liquid crystal polymer. The first and second electrically conductive members are disposed in the interior chamber and extend from the base. The electrode assembly is positioned within the interior chamber of the package. The electrode assembly includes a first electrode electrically connected to a first lead and a second electrode electrically connected to a second lead, the first and second leads extending from the electrode assembly, wherein the first lead is electrically connected to the first electrically conductive member and the second lead is electrically connected to the second electrically conductive member. The electrolyte is disposed within the interior chamber of the package. The disclosure also discloses a circuit board including the above supercapacitor, and a communication device including the above supercapacitor.

Description

Background Technology

[0001] Energy storage units are widely used to provide power to electronic devices, electromechanical devices, electrochemical devices, and other useful equipment. For example, double-layer supercapacitors typically employ a pair of polarizable electrodes comprising carbon particles (e.g., activated carbon) impregnated with a liquid electrolyte. Large capacitance values ​​can be achieved due to the effective surface area of ​​the particles and the small spacing between the electrodes. However, several challenges remain. For instance, it is generally desirable to attach supercapacitors to circuit boards using a "solder reflow" process, in which solder paste is used to temporarily attach the supercapacitor, and then heated to a relatively high peak temperature (e.g., about 150°C or higher, such as about 200°C or higher, or even about 240°C or higher) to melt the solder paste and connect the capacitor to the board. Unfortunately, most conventional supercapacitors are highly temperature-sensitive, making the solder reflow process difficult to implement.

[0002] Therefore, there is a need for improved supercapacitors that can operate at high temperatures while still maintaining stable electrochemical performance. Summary of the Invention

[0003] According to one embodiment of this disclosure, a supercapacitor is disclosed. The supercapacitor includes a package, a first conductive member and a second conductive member, an electrode assembly, and an electrolyte. The package includes: a base having an inner base surface and an outer base surface opposite to the inner base surface; a sidewall extending in a direction substantially perpendicular to the base and defining a first upper end and an inner surface of the first sidewall; an internal chamber defined between the inner base surface and the inner surface of the first sidewall; and a cap closing the internal chamber; wherein the base and the sidewall are formed of a liquid crystal polymer. The first conductive member and the second conductive member are disposed in the internal chamber and extend from the base. The electrode assembly is positioned within the internal chamber of the package. The electrode assembly includes a first electrode and a second electrode, the first electrode being electrically connected to a first lead and the second electrode being electrically connected to a second lead, the first lead and the second lead extending from the electrode assembly, wherein the first lead is electrically connected to the first conductive member and the second lead is electrically connected to the second conductive member. The electrolyte is disposed within the internal chamber of the package.

[0004] According to another embodiment of this disclosure, a circuit board is disclosed. The circuit board includes the aforementioned supercapacitor.

[0005] According to another embodiment of this disclosure, a communication device is disclosed. The communication device includes the aforementioned supercapacitor.

[0006] According to another embodiment of this disclosure, a supercapacitor is disclosed. The supercapacitor includes a package, a first conductive member and a second conductive member, an electrode assembly, and an electrolyte. The package includes: a base having an inner base surface and an outer base surface opposite to the inner base surface; a sidewall extending in a direction generally perpendicular to the base and defining a first upper end, a second upper end, a first inner sidewall surface, and a second inner sidewall surface; and an internal chamber defined between the inner base surface and the first inner sidewall surface, wherein the first upper end and the first inner sidewall surface are positioned closer to the internal chamber than the second upper end and the second inner sidewall surface. The first and second conductive members are disposed in the internal chamber and extend from the base. The electrode assembly is positioned within the internal chamber of the package. The electrode assembly includes a first electrode and a second electrode, the first electrode being electrically connected to a first lead and the second electrode being electrically connected to a second lead, the first and second leads extending from the electrode assembly, wherein the first lead is electrically connected to the first conductive member and the second lead is electrically connected to the second conductive member. The electrolyte is disposed within the internal chamber of the package.

[0007] According to another embodiment of this disclosure, a circuit board is disclosed. The circuit board includes the aforementioned supercapacitor.

[0008] According to another embodiment of this disclosure, a communication device is disclosed. The communication device includes the aforementioned supercapacitor.

[0009] Other features and aspects of this disclosure are described in more detail below. Attached Figure Description

[0010] For those skilled in the art, the complete and implementable disclosure (including its best mode) is set forth in more detail in the remainder of the specification with reference to the accompanying drawings, in which: Figures 1A to 1C An embodiment of the package according to the present disclosure is shown; Figures 2A to 2D Embodiments of supercapacitors with different package / cap designs according to this disclosure are shown; Figures 2E to 2J An embodiment of a package according to the present disclosure, which can be used to form a supercapacitor with a different package / cap design, is shown, the package including a cap, a base, and sidewalls; Figure 3 An embodiment for forming an electrode assembly that can be used in the supercapacitors disclosed herein is shown; Figure 4 An embodiment of a current collector that can be used in the supercapacitor of this disclosure is shown; Figure 5An embodiment of a current collector / carbonaceous coating structure that can be used in the supercapacitors of this disclosure is shown; and Reference numerals used repeatedly in this specification and drawings are intended to indicate the same or similar features or elements in this disclosure. Detailed Implementation

[0011] Those skilled in the art will understand that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of this disclosure, which are embodied in the exemplary description.

[0012] In general, this disclosure relates to supercapacitors. The supercapacitor includes an electrode assembly, an electrolyte, and a package for housing the electrode assembly and the electrolyte. The inventors have discovered that, as described herein, various benefits can be achieved by providing a supercapacitor, and particularly a package. For example, by providing a supercapacitor with the disclosed package, the supercapacitor can be mounted onto a circuit board (e.g., a printed circuit board) in a more efficient and cost-effective manner. For instance, the conductive components / terminals used in the package of the supercapacitor disclosed herein can be electrically connected and / or physically connected to the circuit board using methods known in the art, rather than requiring the supercapacitor's leads to be electrically connected and / or physically connected to the circuit board. Furthermore, any potential problems with the performance and / or structural integrity of the supercapacitor can be avoided, thereby improving the supercapacitor's lifespan and strength.

[0013] Various embodiments of this disclosure will now be described in more detail.

[0014] Supercapacitor As indicated herein, this disclosure relates to supercapacitors. References Figures 1A to 1C and Figures 2A to 2J These illustrate various embodiments of such supercapacitors and corresponding package designs. Specifically, the supercapacitor 70 includes a package 50 for housing an electrode assembly 72 within an internal chamber 58. Furthermore, the package 50 contains an electrolyte (not shown) within its internal chamber 58. At this point, the electrode assembly 72 and the electrolyte are sealed and held within the package 50.

[0015] Electrode assembly Typically, as indicated above, a supercapacitor includes an electrode assembly comprising a first electrode, a second electrode, and an isolator. For example, the first electrode typically includes a first carbonaceous coating (e.g., activated carbon particles) electrically coupled to a first current collector, while the second electrode typically includes a second carbonaceous coating (e.g., activated carbon particles) electrically coupled to a second current collector. An isolator may also be positioned between the first and second electrodes.

[0016] In forming the electrode assembly, the electrodes and spacers may initially be brought into contact together by folding, winding, or otherwise to form the electrode assembly. An electrolyte may optionally be immersed in the electrodes of the assembly. In one particular embodiment, the electrodes, spacers, and optionally the electrolyte may be wound into an electrode assembly having a "core" configuration. For example, see reference... Figure 3 This illustrates one embodiment of a wound electrode assembly 1100, which includes a first electrode 1102, a second electrode 1104, and a spacer 1106 positioned between electrodes 1102 and 1104. In this particular embodiment, the electrode assembly 1100 also includes another spacer 1108 positioned above the second electrode 1104. In this way, each of the two coated surfaces of the electrodes is separated by spacers, thereby maximizing the surface area and capacitance per unit volume. Although not strictly necessary, in this embodiment, electrodes 1102 and 1104 are offset such that the respective contact edges of electrodes 1102 and 1104 extend beyond the first edge of the first spacer 1106 and the second edge of the second spacer 1108, respectively. In other respects, this can help prevent “short circuits” caused by current flowing between the electrodes. However, it should be understood that other configurations can also be used. For example, in another embodiment, the electrodes, spacers, and optional electrolyte can be configured as an electrode assembly with a laminar structure.

[0017] The supercapacitor also includes a first lead and a second lead, the first lead being electrically connected to a first electrode within the electrode assembly, and the second lead being electrically connected to a second electrode within the electrode assembly. For example, in one embodiment, at least one lead may be located at one end of the electrode assembly, while the second lead may be located at the opposite end of the electrode assembly. In this case, the lead can extend from the opposite end of the electrode assembly. In another embodiment, both leads may be located at the same end of the electrode assembly. In this case, the lead can extend from the same end of the electrode assembly.

[0018] electrode As indicated above, a supercapacitor includes an electrode assembly comprising a first electrode and a second electrode. The electrodes used within this electrode assembly typically contain current collectors. The current collectors may be formed of the same or different materials. For example, in one embodiment, the current collectors of the various electrodes are formed of the same material. In any case, each current collector is typically formed of a substrate comprising a conductive metal, such as aluminum, stainless steel, nickel, silver, palladium, etc., and alloys thereof. Aluminum and aluminum alloys are particularly suitable for use in this disclosure.

[0019] The current collector substrate can be in the form of foil, sheet, plate, mesh, etc. The substrate can also have a relatively small thickness, for example, about 200 micrometers or less, for example, about 150 micrometers or less, for example, about 100 micrometers or less, for example, about 80 micrometers or less, for example, about 50 micrometers or less, for example, about 40 micrometers or less, for example, about 30 micrometers or less. The substrate thickness can be about 1 micrometer or greater, for example, about 5 micrometers or greater, for example, about 10 micrometers or greater, for example, about 20 micrometers or greater.

[0020] While not strictly necessary, the surface of the substrate can be treated. For example, in one embodiment, the surface can be roughened, for instance, by cleaning, etching, sandblasting, etc. In some embodiments, the current collector may comprise a plurality of fibrous whiskers protruding outward from the substrate. Without intending to be theoretically limited, it is thought that these whiskers can effectively increase the surface area of ​​the current collector and also improve the adhesion of the current collector to the respective electrode. This allows for the use of a relatively low binder content in the first and / or second electrodes, which can improve charge transfer and reduce interfacial resistance, resulting in a very low equivalent series resistance (ESR) value. The whiskers are typically formed of a material containing carbon and / or a reaction product of carbon with a conductive metal. If desired, the whiskers may optionally protrude from a seed portion embedded within the substrate. Similar to whiskers, the seed portion may also be formed of a material containing carbon and / or a reaction product of carbon with a conductive metal, such as a carbide of the conductive metal (e.g., aluminum carbide), etc. For example, see reference... Figure 4 This illustrates one embodiment of a current collector comprising a plurality of whiskers 21 protruding outward from a substrate 1. If desired, the whiskers 21 may optionally protrude from a seed portion 3 embedded within the substrate 1. Similar to the whiskers 21, the seed portion 3 may also be formed of a material containing carbon, and / or a reaction product of carbon and a conductive metal, such as a carbide of the conductive metal (e.g., aluminum carbide). Further, Figure 5 An electrode comprising the aforementioned current collector combined with the carbonaceous coating 22 described herein is shown, the current collector having a plurality of whiskers 21 protruding outward from the substrate 1.

[0021] The method of forming such whiskers on the substrate can vary depending on the requirements. In one embodiment, for example, the conductive metal of the substrate reacts with a hydrocarbon compound. Examples of such hydrocarbon compounds may include, for example, alkane compounds such as methane, ethane, propane, n-butane, isobutane, pentane, etc.; olefin compounds such as ethylene, propylene, butene, butadiene, etc.; alkyne compounds such as acetylene; and derivatives or combinations of any of the above compounds. It is generally desirable for the hydrocarbon compound to be in a gaseous form during the reaction. Therefore, it may be desirable to use hydrocarbon compounds that are in a gaseous form when heated, such as methane, ethane, and propane. Although not required, hydrocarbon compounds in the range of about 0.1 parts by weight to about 50 parts by weight are typically used based on 100 parts by weight of the substrate, and in some embodiments, from about 0.5 parts by weight to about 30 parts by weight. To initiate the reaction between the hydrocarbon and the conductive metal, the substrate is typically heated in an environment at temperatures of about 300°C or higher; in some embodiments, about 400°C or higher; in some embodiments, from about 500°C to about 650°C. The heating time depends on the exact temperature chosen, but typically ranges from about 1 hour to about 100 hours. This environment usually contains a relatively small amount of oxygen to minimize the formation of the dielectric film on the substrate surface. For example, the oxygen content of this environment can be about 1% by volume or less.

[0022] In one embodiment, the substrate may also be treated with a conductive coating. For example, to reduce the contact resistance between the current collector substrate and the carbonaceous coating, a conductive coating may be used, if it is not desired to be limited. In this regard, the conductive coating may include a conductive material, such as graphite, graphene, and / or carbon black. The conductive material may be present in the conductive coating in amounts of 50 wt.% or more, such as 55 wt.% or more, such as 60 wt.% or more, such as 65 wt.% or more, such as 70 wt.% or more, such as 75 wt.% or more, such as 80 wt.% or more, such as 85 wt.% or more, such as 90 wt.% or more, such as 95 wt.% or more, such as 97 wt.% or more, such as 98 wt.% or more, such as 99 wt.% or more. In one embodiment, the conductive coating may be applied to only one main surface of the substrate. In another embodiment, the conductive coating may be applied to both main surfaces of the substrate. The thickness of the conductive coating can be 0.1 micrometers or greater, such as 0.2 micrometers or greater, such as 0.3 micrometers or greater, such as 0.5 micrometers or greater, such as 1 micrometer or greater, such as 1.5 micrometers or greater, such as 2 micrometers or greater, such as 2.5 micrometers to 5 micrometers or less, such as 4 micrometers or less, such as 3 micrometers or less, such as 2.5 micrometers or less, such as 1.5 micrometers or less.

[0023] Electrodes used in supercapacitors also comprise carbonaceous coatings or materials coated on the opposite side of the current collector. While each carbonaceous coating or material can be formed of the same or different types of material and can comprise one or more layers, each carbonaceous coating typically comprises at least one layer including active particles. In some embodiments, for example, the activated carbon layer can be positioned directly above the current collector and may optionally be the only layer of the carbonaceous coating. Examples of suitable activated carbon particles may include, for example, coconut shell-based activated carbon; petroleum coke-based activated carbon; pitch-based activated carbon; polyvinylidene chloride activated carbon; phenolic resin-based activated carbon; polyacrylonitrile-based activated carbon; and activated carbon from natural sources such as coal, charcoal, or other natural organic sources.

[0024] In some embodiments, it may be desirable to selectively control certain aspects of activated carbon particles (e.g., particle size distribution, surface area, and pore size distribution) to help improve the ion mobility of certain types of electrolytes after one or more charge-discharge cycles. For example, at least 50% of the volume of particles (D50 size) may have a size ranging from about 0.01 micrometers or larger (e.g., about 0.1 micrometers or larger, about 0.5 micrometers or larger, about 1 micrometer or larger) to about 30 micrometers or smaller (e.g., about 25 micrometers or smaller, about 20 micrometers or smaller, about 15 micrometers or smaller, about 10 micrometers or smaller). At least 90% of the volume of particles (D90 size) may similarly have a size ranging from about 2 micrometers or larger (e.g., about 5 micrometers or larger, about 6 micrometers or larger) to about 40 micrometers or smaller (e.g., about 30 micrometers or smaller, about 20 micrometers or smaller, about 15 micrometers or smaller). The BET surface area may also range from about 900 m². 2 / g or greater (e.g., about 1000 m) 2 / g or greater, for example, about 1100 m 2 / g or greater, for example, about 1200m 2 / g or greater) to approximately 3000 m 2 / g or less (e.g., about 2500 m) 2 / g or less, for example, about 2000 m 2 / g or less, for example, about 1800 m 2 / g or less, for example, about 1500 m 2 / g or less).

[0025] In addition to having specific size and surface area, activated carbon particles may also contain pores with a certain size distribution. For example, the amount of pores smaller than about 2 nanometers (i.e., “micropores”) can provide a pore volume of about 50% (vol.%) or less of the total pore volume, such as about 40 vol.% or less, about 30 vol.% or less, about 20 vol.% or less, about 15 vol.% or less, about 10 vol.% or less, or about 5 vol.% or less. The amount of pores smaller than about 2 nanometers (i.e., “micropores”) can provide a pore volume of 0 vol.% or more of the total pore volume, such as about 0.1 vol.% or more, about 0.5 vol.% or more, or 1 vol.% or more. Similarly, the amount of pores with sizes between about 2 nanometers and about 50 nanometers (i.e., "mesopores") can be about 20 vol.% or more of the total pore volume, for example, about 25 vol.% or more, for example, about 30 vol.% or more, for example, about 35 vol.% or more, for example, about 40 vol.% or more, for example, about 50 vol.% or more. The amount of pores with sizes between about 2 nanometers and about 50 nanometers (i.e., "mesopores") can be about 90 vol.% or less of the total pore volume, for example, about 80 vol.% or less, for example, about 75 vol.% or less, for example, about 65 vol.% or less, for example, about 55 vol.% or less, for example, about 50 vol.% or less. Finally, the amount of pores with sizes larger than about 50 nanometers (i.e., "macros") can be about 1 vol.% or more of the total pore volume, for example, about 5 vol.% or more, for example, about 10 vol.% or more, for example, about 15 vol.% or more. The amount of pores larger than about 50 nanometers (i.e., "macropores") can be about 50 vol.% or less of the total pore volume, for example, about 40 vol.% or less, about 35 vol.% or less, about 25 vol.% or less. The total pore volume of carbon particles can range from about 0.2 cm⁻¹. 3 / g or greater (e.g., about 0.4 cm) 3 / g or greater, for example, about 0.5 cm 3 / g or greater) to about 1.5 cm 3 / g or less (e.g., about 1.3 cm) 3 / g or less, for example, about 1.0 cm 3 / g or smaller, for example, about 0.8cm 3 / g or less). The median pore width can be about 8 nm or less, for example, about 5 nm or less, for example, about 4 nm or less. The median pore width can be about 1 nm or greater, for example, about 2 nm or greater. The pore size and total pore volume can be measured using nitrogen adsorption, and the pore size and total pore volume can be analyzed using the Barrett-Joyner-Halenda (BJH) technique known in the art.

[0026] A unique aspect of this disclosure is that the electrode does not need to contain a large amount of binder conventionally used in supercapacitor electrodes. That is, for every 100 parts of carbon in the carbonaceous coating, the binder may be present in amounts ranging from about 60 parts or less (e.g., about 40 parts or less, about 30 parts or less, about 25 parts or less, about 20 parts or less) to about 1 part or more (e.g., about 5 parts or more). For example, the binder may constitute about 15 wt.% or less of the total weight of the carbonaceous coating, such as about 10 wt.% or less, about 8 wt.% or less, about 5 wt.% or less, or about 4 wt.% or less. The binder may constitute about 0.1 wt.% or more of the total weight of the carbonaceous coating, such as about 0.5 wt.% or more, or about 1 wt.% or more.

[0027] However, in application, any binder from a variety of suitable adhesives can be used in the electrode. For example, in some embodiments, water-insoluble organic binders can be used, such as styrene-butadiene copolymers, polyvinyl acetate homopolymers, vinyl acetate-ethylene copolymers, vinyl acetate-acrylic copolymers, ethylene-vinyl chloride copolymers, ethylene-vinyl chloride-vinyl acetate terpolymers, acrylic-polyvinyl chloride polymers, acrylic polymers, nitrile polymers, fluoropolymers such as polytetrafluoroethylene or polyvinylidene fluoride, polyolefins, and mixtures thereof. Water-soluble organic binders such as polyvinylpyrrolidone, polysaccharides, and their derivatives can also be used. In one particular embodiment, the polysaccharide may be a nonionic cellulose ether, such as alkyl cellulose ethers (e.g., methylcellulose and ethylcellulose); hydroxyalkyl cellulose ethers (e.g., hydroxyethylcellulose, hydroxypropylcellulose, hydroxypropylhydroxybutylcellulose, hydroxyethylhydroxypropylcellulose, hydroxyethylhydroxybutylcellulose, hydroxyethylhydroxypropylhydroxybutylcellulose, etc.); alkylhydroxyalkyl cellulose ethers (e.g., methylhydroxyethylcellulose, methylhydroxypropylcellulose, ethylhydroxyethylcellulose, ethylhydroxypropylcellulose, methylethylhydroxyethylcellulose and methylethylhydroxypropylcellulose); carboxyl cellulose ethers (e.g., carboxymethylcellulose); and protonated salts of any of the above nonionic cellulose ethers (e.g., sodium carboxymethylcellulose, ammonium carboxymethylcellulose).

[0028] If desired, other materials may also be used within the activated carbon layer of the carbonaceous material. For example, in some embodiments, conductive additives may be used to further increase conductivity. Exemplary conductive additives may include, for example, carbon black, graphite (natural or synthetic), graphene, carbon nanotubes, nanowires or nanotubes, metal fibers, graphene, and mixtures thereof. In one embodiment, carbon black is particularly suitable. In another embodiment, carbon nanotubes are particularly suitable. When using conductive additives, the conductive additive typically comprises about 60 parts or less (e.g., about 40 parts or less, about 30 parts or less, about 25 parts or less, about 20 parts or less) to about 1 part or more (e.g., about 5 parts or more) per 100 parts of carbon in the carbonaceous coating. For example, the conductive additive may comprise about 15 wt.% or less of the total weight of the carbonaceous coating, for example, about 10 wt.% or less, about 8 wt.% or less, about 5 wt.% or less, or about 4 wt.% or less. Conductive additives may constitute about 0.1 wt.% or more of the total weight of the carbonaceous coating, for example, about 0.5 wt.% or more, or about 1 wt.% or more. Similarly, activated carbon particles typically constitute 85 wt.% or more of the total weight of the carbonaceous coating, for example, about 90 wt.% or more, or about 95 wt.% or more, or about 97 wt.% or more. Activated carbon particles may constitute less than 100 wt.% of the total weight of the carbonaceous coating, for example, about 99.5 wt.% or less, or about 99 wt.% or less, or about 98 wt.% or less.

[0029] As is well known to those skilled in the art, the specific methods of coating carbonaceous material onto the sides of the current collector can vary, such as printing (e.g., rotary gravure printing), spraying, slot coating, drop coating, dip coating, etc. In this regard, electrodes can be formed by laminating carbonaceous material, comprising a carbon film, onto the current collector. Regardless of the method of application of the carbonaceous material, the resulting electrodes are typically dried, for example, at temperatures of about 100°C or higher, about 200°C or higher in some embodiments, and about 300°C to about 500°C in some embodiments. The electrodes can also be compressed (e.g., calendered) to optimize the volumetric efficiency of the supercapacitor. After any optional compression, the thickness of the individual carbonaceous coatings can typically vary based on the desired electrical performance and operating range of the supercapacitor. However, typically, the coating thickness is from about 20 micrometers to about 200 micrometers, from 30 micrometers to about 150 micrometers, and in some embodiments from about 40 micrometers to about 100 micrometers. The coating can be present on one or both sides of the current collector. In any case, the thickness of the entire electrode (including the current collector and one or more carbonaceous coatings after optional compression) is typically in the range of about 20 micrometers to about 350 micrometers, in some embodiments from about 30 micrometers to about 300 micrometers, and in some embodiments from about 50 micrometers to about 250 micrometers.

[0030] Isolation component As indicated above, the electrode assembly may include an isolator positioned between the first and second electrodes. This isolator electrically insulates one electrode from the other to help prevent short circuits, but still allows ion transport between the two electrodes. In some embodiments, isolators comprising, for example, cellulose fiber materials (e.g., cleanroom paper webs, wet-laid paper webs, etc.), nonwoven fiber materials (e.g., polyolefin nonwoven webs), woven fabrics, membranes (e.g., polyolefin membranes), etc. Cellulose fiber materials are particularly suitable for supercapacitors; cellulose fiber materials include, for example, those comprising natural fibers, synthetic fibers, etc. Specific examples of suitable cellulose fibers for isolators may include, for example, hardwood pulp fibers, softwood pulp fibers, synthetic fibers, regenerated cellulose fibers, etc.

[0031] In one embodiment, the spacer may be a hybrid spacer. For example, the hybrid spacer may include multiple materials. In one embodiment, the hybrid spacer may be a single layer. This single layer may include two or more different materials (e.g., cellulose fiber materials, nonwoven fiber materials (e.g., polymers), etc.). In another embodiment, the hybrid spacer may be a multilayer spacer. In this case, at least two layers of the multilayer may be formed of different materials. For example, one layer of the multilayer may be a cellulose fiber material, while another layer of the multilayer may be a nonwoven fiber material, such as a polymer.

[0032] Regardless of the specific material used, the thickness of the spacer is typically about 150 micrometers or less, for example, about 100 micrometers or less, for example, about 80 micrometers or less, for example, about 50 micrometers or less, for example, about 40 micrometers or less, for example, about 30 micrometers or less. The thickness of the spacer can be about 1 micrometer or greater, for example, about 5 micrometers or greater, for example, about 10 micrometers or greater, for example, about 20 micrometers or greater.

[0033] Non-aqueous electrolytes Additionally, supercapacitors may also include an electrolyte within the package. As indicated herein, the electrolyte comprises solvents and ionic liquids. The electrolyte is typically non-aqueous in nature, and therefore contains at least one non-aqueous solvent. To help extend the operating temperature range of the supercapacitor, it is generally desirable for the non-aqueous solvent to have a relatively high boiling point, such as about 150°C or higher, such as about 200°C or higher, such as about 225°C or higher, such as about 250°C or higher, such as about 275°C or higher. The boiling point may be about 400°C or lower, such as about 375°C or lower, such as about 350°C or lower, such as about 325°C or lower, such as about 300°C or lower, such as about 275°C or lower, such as about 250°C or lower, such as about 225°C or lower.

[0034] As indicated herein, electrolytes include solvents. Particularly suitable high-boiling-point solvents may include, for example, cyclic carbonate solvents such as ethylene carbonate, propylene carbonate, butene carbonate, vinylene carbonate, etc. Propylene carbonate may be particularly suitable due to its high conductivity and decomposition voltage, as well as its ability to be used over a wide temperature range. Of course, other non-aqueous solvents may also be used alone, or in combination with cyclic carbonate solvents. Examples of such solvents may include, for example, open-chain carbonates (e.g., dimethyl carbonate, ethyl methyl carbonate, diethyl carbonate, etc.), aliphatic monocarboxylic acid esters (e.g., methyl acetate, methyl propionate, etc.), lactone solvents (e.g., butyrolactone, valerate, etc.), nitriles (e.g., acetonitrile, glutaronitrile, adiponitrile, methoxyacetonitrile, 3-methoxypropionitrile, etc.), amides (e.g., N,N-dimethylformamide, N,N-diethylacetamide, N-methylpyrrolidone), alkanes (e.g., nitromethane, nitrobenzene, etc.), sulfur compounds (e.g., sulfolane, dimethyl sulfoxide, etc.).

[0035] In one embodiment, the solvent comprises a first sulfur-containing compound and a second sulfur-containing compound. In some embodiments, the solvent may consist of, or substantially consist of, the first sulfur-containing compound and the second sulfur-containing compound. In some embodiments, the solvent may include a third sulfur-containing compound. For example, the sulfur-containing compound may include sulfolane, sulfone, sulfoxide, sulfide, or sulfite. In one embodiment, the sulfur-containing compound may include sulfolane, sulfone, or sulfoxide. In a further embodiment, the sulfur-containing compound may include sulfolane or sulfone.

[0036] In one embodiment, at least one sulfur-containing compound may be sulfolane. Typically, sulfolane may have the following general structure:

[0037] Sulfolane derivatives can include compounds in which one or more hydrogen atoms are replaced by an organic group, which may include a polar group, and more specifically may include oxygen, nitrogen, sulfur, and / or halogen atoms. Oxygen-containing sulfolane derivatives include hydroxysulfolane, sulfolane ethers, and esters; nitrogen-containing sulfolane derivatives include sulfolane amines, nitriles, and nitrosulfolane; sulfur-containing sulfolane derivatives include sulfolane sulfides, sulfoxides, and sulfones.

[0038] Certain sulfolane derivatives include, but are not limited to: hydrocarbon-substituted sulfolane, such as alkyl sulfolane preferably containing no more than about 10 carbon atoms; hydroxysulfolane, such as 3-sulfonyl lanolin, 2-sulfonyl lanolin, 3-methyl-4-sulfonyl lanolin, 3-4-sulfodiol; and sulfonyl ethers, such as methyl-3-sulfonyl ether, propyl-3-sulfonyl ether, allyl-3-sulfonyl ether, butyl-3-sulfonyl ether, crotonyl-3-sulfonyl ether, and isosulfonyl ether. Butyl-3-sulfonyl ether, methyl allyl-3-sulfonyl ether, methyl vinyl carbene-3-sulfonyl ether, pentyl-3-sulfonyl ether, hexyl-3-sulfonyl ether, octyl-3-sulfonyl ether, nonyl-3-sulfonyl ether, glycerol α-γ-diallyl-β-3-sulfonyl ether, tetrahydrofurfuryl-3-sulfonyl ether, 3,3,5-tetramethyl-cyclohexyl-3-sulfonyl ether, m-tolyl-3-sulfonyl ether, the corresponding 2-sulfonyl ether, disulfonyl alkyl ethers; sulfonyl esters, such as 3-sulfonyl acetate, 3-sulfonyl hexanoate, sulfonyl laurate, sulfonyl palmitate, sulfonyl stearate, sulfonyl oleate, sulfonyl propionate, sulfonyl butyrate; N-cyclobutanesulfone, such as 3-sulfonylalanine, N-methyl-3-sulfonylalanine, N-ethyl-3-sulfonylaniline, N,N-dimethyl-3-sulfonylaniline, N-allyl-3-sulfonylaniline, N-butyl-3-sulfonylaniline, N-octyl -3-Sulfoaniline; sulfonyl sulfides, such as ethyl-3-tert-butyl-3-sulfonyl sulfide, isobutyl-3-sulfonyl sulfide, methyl allyl-3-sulfonyl sulfide, di-3-sulfonyl sulfide; sulfonyl sulfones, such as methyl-3-sulfonyl sulfone, ethyl-3-sulfonyl sulfone, propyl-3-sulfonyl sulfone, pentyl-3-sulfonyl sulfone; and sulfonyl halides, such as 3-chloro-sulfonyl halide, 3-4-dichloro-sulfonyl halide, 3-chloro-4-methylcyclobutane sulfone.

[0039] In one embodiment, sulfolane may be simply sulfolane having the aforementioned structure. In this respect, sulfolane may not be a sulfolane derivative.

[0040] In one embodiment, at least one sulfur-containing compound may be a sulfone. For example, a sulfone may have the following general structure:

[0041] Here, R and R' are optionally substituted hydrocarbon moieties. Generally, "hydrocarbon moieties" refer to hydrocarbon substituents that include aliphatic (straight-chain and branched-chain), cyclic (e.g., alicyclic), and aromatic groups. For example, the hydrocarbon moieties can be alkyl or aryl.

[0042] In one embodiment, the hydrocarbon moiety may be unsubstituted. In another embodiment, the hydrocarbon moiety may be substituted. The moiety may include 1 to 5 substituents, and in some embodiments, 1 to 3 or 1 to 2 substituents. Substituents may include, but are not limited to, alkoxy, alkyl, amino, aryl, carboxyl, carboxyl ester, cyano, cycloalkyl, halogen, hydroxyl, nitro, oxo, sulfate, sulfonyl, thiol, etc. However, it should be understood that other substituents may also be used for substitution. Furthermore, it should be understood that such substituents themselves may also include other substituents. In one embodiment, the hydrocarbon moiety may be an alkyl group substituted with an aryl group. Similarly, the hydrocarbon moiety may be an aryl group substituted with an alkyl group.

[0043] In one embodiment, the sulfone may be referred to as an alkyl sulfone or a dialkyl sulfone. For example, both R and R' may be alkyl groups independently. The alkyl group may be a straight-chain, branched, or cyclic monovalent saturated aliphatic hydrocarbon group. The alkyl group may have 1 to 10 carbon atoms, for example, 1 to 6 carbon atoms, for example, 1 to 5 carbon atoms, for example, 1 to 4 carbon atoms, for example, 1 to 3 carbon atoms, for example, 1 to 2 carbon atoms, for example, 1 carbon atom. In one embodiment, the alkyl group may be a methyl group.

[0044] In one embodiment, R and R' can be different. In another embodiment, R and R' can be the same. For example, they can both be alkyl groups. Even further, they can both be methyl groups.

[0045] Sulfons can include, but are not limited to, dimethyl sulfone, ethyl methyl sulfone, dipropyl sulfone, ethyl propyl sulfone, diethyl sulfone, dibutyl sulfone, propyl methyl sulfone, diisopropyl sulfone, isopropyl methyl sulfone, isopropyl ethyl sulfone, and combinations thereof. In this regard, in one embodiment, the sulfonium can be dimethyl sulfone.

[0046] In one embodiment, at least one sulfur-containing compound may be a sulfoxide. Typically, a sulfoxide may have the following general structure:

[0047] Among them, R 1 and R 2 It is the optionally substituted hydrocarbon moiety. Generally, "hydrocarbon moiety" refers to a hydrocarbon substituent that includes aliphatic (straight-chain and branched-chain), cyclic (e.g., alicyclic), and aromatic groups. For example, the hydrocarbon moiety can be alkyl or aryl.

[0048] In one embodiment, the hydrocarbon moiety may be unsubstituted. In another embodiment, the hydrocarbon moiety may be substituted. The moiety may include 1 to 5 substituents, and in some embodiments, 1 to 3 or 1 to 2 substituents. Substituents may include, but are not limited to, alkoxy, alkyl, amino, aryl, carboxyl, carboxyl ester, cyano, cycloalkyl, halogen, hydroxyl, nitro, oxo, sulfate, sulfonyl, thiol, etc. However, it should be understood that other substituents may also be used for substitution. Furthermore, it should be understood that such substituents themselves may also include other substituents. In one embodiment, the hydrocarbon moiety may be an alkyl group substituted with an aryl group. Similarly, the hydrocarbon moiety may be an aryl group substituted with an alkyl group.

[0049] In one embodiment, the sulfoxide may be referred to as alkyl sulfoxide or dialkyl sulfoxide. For example, R 1 and R 2 All can be alkyl groups independently. Alkyl groups can be straight-chain, branched, or cyclic monovalent saturated aliphatic hydrocarbon groups. Alkyl groups can have 1 to 10 carbon atoms, for example 1 to 6 carbon atoms, for example 1 to 5 carbon atoms, for example 1 to 4 carbon atoms, for example 1 to 3 carbon atoms, for example 1 to 2 carbon atoms, for example 1 carbon atom. In one embodiment, the alkyl group can be a methyl group.

[0050] In one embodiment, R 1 and R 2 They can be different. In another embodiment, R 1 and R 2 They can be the same. For example, they can both be alkyl groups. Even further, they can both be methyl groups. In this case, the sulfoxide can be dimethyl sulfoxide.

[0051] In one embodiment, at least one sulfur-containing compound may be a sulfide. Typically, a sulfide is a sulfur compound with the molecular formula S. 2- Inorganic anions, or those containing one or more S atoms. 2- Compounds containing ions.

[0052] Sulfides may include, but are not limited to, dimethyl sulfide, butyl sulfide, dibutyl sulfide, dipropyl sulfide, dioctyl sulfide, dibenzyl sulfide, diphenyl sulfide, vinyl sulfide, ethyl sulfide, methyl phenyl sulfide, ethyl vinyl sulfide, and combinations thereof.

[0053] In one embodiment, at least one sulfur-containing compound may be a sulfite. Typically, sulfites are SO3 containing sulfite ions. 2- Compounds.

[0054] Sulfites may include, but are not limited to, vinyl sulfite, 1,3-propylidene sulfite, 1,2-propanediol sulfite, dimethyl sulfite, vinyl sulfite, trimethylene sulfite, and combinations thereof.

[0055] In addition to sulfur-containing compounds, in some embodiments, the solvent may include other solvents commonly known in the art. These other solvents may include the solvents described above. For example, the solvent may also include, but is not limited to, cyclic carbonate solvents (e.g., ethylene carbonate, propylene carbonate, butene carbonate, vinylene carbonate, etc.), open-chain carbonates (e.g., dimethyl carbonate, ethyl methyl carbonate, diethyl carbonate, etc.), aliphatic monocarboxylic acid esters (e.g., methyl acetate, methyl propionate, etc.), lactone solvents (e.g., butyrolactone, valerate, etc.), nitrile solvents (e.g., acetonitrile, glutaronitrile, adiponitrile, methoxyacetonitrile, 3-methoxypropionitrile, benzyl nitrile, etc.), amide solvents (e.g., N,N-dimethylformamide, N,N-diethylacetamide, N-methylpyrrolidone), and alkanes (e.g., nitromethane, nitrobenzene, etc.).

[0056] The electrolyte also contains at least one ionic liquid that is soluble in the solvent. While the concentration of the ionic liquid can vary, it is generally desirable for the ionic liquid to be present at a relatively high concentration. For example, the ionic liquid may be present in amounts per liter of electrolyte as follows: about 0.5 mol (M) or more, such as about 0.8 M or more, such as about 1.0 M or more, such as about 1.2 M or more, such as about 1.3 M or more, such as about 1.5 M or more. The ionic liquid may be present in amounts as follows: about 3.0 M or less, such as about 2.5 M or less, such as about 2.0 M or less, such as about 1.8 M or less, such as about 1.5 M or less, such as about 1.4 M or less, such as about 1.3 M or less.

[0057] Ionic liquids are typically salts that have a relatively low melting temperature, for example, about 400°C or lower, in some embodiments about 350°C or lower, in some embodiments from about 1°C to about 100°C, and in some embodiments from about 5°C to about 50°C.

[0058] The salt contains cationic species and counterions. The cationic species comprises compounds having at least one heteroatom (e.g., nitrogen or phosphorus) as a "cation center." In this respect, ionic liquids can include organic quaternary ammonium compounds, organic quaternary compounds, or mixtures thereof. Examples of such heteroatomic compounds include, for example, unsubstituted or substituted organic quaternary ammonium compounds, such as ammonium (e.g., trimethylammonium, tetraethylammonium, etc.), pyridinium, pyrazineonium, pyramidinium, pyrazineonium, imidazoonium, pyrazoliumonium, oxazoliumonium, triazoliumonium, thiazoonium, quinolineonium, piperidiniumonium, pyrrolidineonium, quaternary ammonium spirocyclic compounds (in which two or more rings are linked together by spiro atoms (e.g., carbon, heteroatoms, etc.), quaternary ammonium fused ring structures (e.g., quinolineonium, isoquinolineonium, etc.), etc. Organic quaternary ammonium (or phosphonium) compounds can be compounds with only aliphatic chains, alicyclic compounds with both aliphatic chains and aliphatic rings, and spirocyclic compounds with only aliphatic rings. It should be noted that spirocyclic compounds are compounds with the following structure: in this structure, the two rings share a tetrahedral atom.

[0059] For example, in one particular embodiment, the cationic substance can be an N-spirobicyclic compound, such as a symmetrical or asymmetrical N-spirobicyclic compound having a circulating ring. An example of such a compound has the following structure:

[0060] Where m and n are both numbers between 3 and 7, and in some embodiments, m and n are both numbers between 4 and 5 (e.g., pyrrolidineonium or piperidinium).

[0061] Suitable counterions for cationic substances can similarly include halogens (e.g., chloride, bromide, iodide, etc.); sulfate or sulfonate ions (e.g., methyl sulfate, ethyl sulfate, butyl sulfate, hexyl sulfate, octyl sulfate, hydrogen sulfate, methanesulfonate, dodecylbenzenesulfonate, dodecyl sulfate, trifluoromethanesulfonate, heptadecafluorooctanesulfonate, sodium dodecyloxysulfonate, etc.); sulfosuccinate ions; amides (e.g., dicyandiamide); imides (e.g., bis(pentafluoroethylsulfonyl)imide, bis(trifluoromethylsulfonyl)imide, bis(trifluoromethyl)sulfonyl)imide, etc.). Imides, etc.); borate (e.g., tetrafluoroborate, tetracyanoborate, bis[oxalate]borate, bis[salicylic acid]borate, etc.); phosphate or hypophosphite (e.g., hexafluorophosphate, diethylphosphate, bis(pentafluoroethyl)hypophosphite, tris(pentafluoroethyl)-trifluorophosphate, tris(nonafluorobutyl)trifluorophosphate, etc.); antimonate (e.g., hexafluoroantimonate); aluminate (e.g., tetrachloroaluminate); fatty acid carboxylates (e.g., oleate, isostearate, pentadecanoate, etc.); cyanate; acetate; and so on, as well as any combination of the foregoing substances. In some embodiments, the counter ion that can constitute the salt may be PF6. BF4 N(CF3SO3)2 and C(CF3SO3)3 .

[0062] Several examples of suitable ionic liquids may include, for example, spirocyclic (1,1')-bipyrrolidine tetrafluoroborate, triethylmethylammonium tetrafluoroborate, tetraethylammonium tetrafluoroborate, spirocyclic (1,1')-bipyrrolidine, methyltriethylammonium iodide, tetraethylammonium iodide, methyltriethylammonium tetrafluoroborate, tetrabutylammonium tetrafluoroborate, tetraethylammonium hexafluorophosphate, etc., 5-azospiro[4.4]nonane tetrafluoroborate (spiro-(1,1′)-bipyrrolidine:SBP-BF4), 6-azospiro[5.5]undecane tetrafluoroborate, 3-azospiro[2.6]nonane tetrafluoroborate, 1,1-dimethylpyrrolidine tetrafluoroborate, etc. Furthermore, examples of quaternary phosphonium ionic liquids include 5-phosphonospiro[4.4]nonane tetrafluoroborate. In this regard, particularly suitable ionic liquids may include spirocyclic quaternary compounds of tetrafluoroborate, such as spirocyclic quaternary ammonium tetrafluoroborate and / or spirocyclic quaternary phosphonium tetrafluoroborate.

[0063] In one embodiment, the ionic liquid may include a cyclic compound. For example, as indicated above, the ionic liquid may include a spirocyclic compound. However, it should be understood that the ionic liquid may not include a spirocyclic compound, but may include a cyclic compound (e.g., pyrrolidineonium, such as 1,1-dimethylpyrrolidineonium tetrafluoroborate).

[0064] Furthermore, in one embodiment, the electrolyte may include a lithium metal salt. For example, a non-limiting list of suitable lithium metal salts that may be used includes LiCF3SO3, LiN(CF3SO2)2, LiNO3, LiF, LiPF6, LiBF4, LiI, LiBr, LiSCN, LiClO4, LiAlCl4, LiB(C2O4)2, LiB(C6H5)4, LiBF2(C2O4), LiN(SO2F)2, LiPF3(C2F5)3, LiPF4(CF3)2, LiPF4(C2O4), LiPF3(CF3)3, LiSO3CF3, LiAsF6, and mixtures thereof. In a particular embodiment, the lithium metal salt may include LiF.

[0065] In one embodiment, the lithium metal salt may include a lithium metal salt having fluorine atoms. For example, the lithium metal salt may include a fluoride. In particular, the lithium metal salt may include lithium fluoride.

[0066] The electrolytes disclosed herein may have specific melting points. For example, in one embodiment, the electrolyte may be a liquid at room temperature. In this case, the melting point may be -70°C or higher, such as -60°C or higher, such as -50°C or higher, such as -40°C or higher, such as -30°C or higher, such as -20°C or higher, such as -10°C or higher, such as 0°C or higher, such as 10°C or higher, such as 20°C or higher, such as 30°C or higher, such as 40°C or higher, such as 50°C or higher, such as 60°C or higher, such as 70°C or higher, such as 80°C or higher, such as 90°C or higher. The melting point can be 120°C or lower, for example 110°C or lower, for example 100°C or lower, for example 90°C or lower, for example 80°C or lower, for example 70°C or lower, for example 60°C or lower, for example 50°C or lower, for example 40°C or lower, for example 30°C or lower, for example 20°C or lower, for example 10°C or lower, for example 0°C or lower, for example -10°C or lower, for example -20°C or lower.

[0067] In the electrolyte, the solvent can constitute the majority based on the weight of the electrolyte. For example, the solvent can constitute 40 wt.% or more of the electrolyte, such as 45 wt.% or more, 50 wt.% or more, 55 wt.% or more, 60 wt.% or more, 65 wt.% or more, or 70 wt.% or more. The solvent can also constitute less than 100 wt.% of the electrolyte, such as 90 wt.% or less, 85 wt.% or less, 75 wt.% or less, 65 wt.% or less, 55 wt.% or less, or 50 wt.% or less.

[0068] As indicated above, the solvent may include a first sulfur-containing compound and a second sulfur-containing compound. In this respect, the first sulfur-containing compound may be present in the electrolyte in amounts based on the weight of the electrolyte, such as 30 wt.% or more, for example 35 wt.% or more, for example 40 wt.% or more, for example 45 wt.% or more, for example 50 wt.% or more, for example 55 wt.% or more, for example 60 wt.% or more. The first sulfur-containing compound may be present in the electrolyte in amounts based on the weight of the electrolyte, such as 85 wt.% or less, for example 80 wt.% or less, for example 75 wt.% or less, for example 70 wt.% or less, for example 65 wt.% or less, for example 60 wt.% or less, for example 55 wt.% or less, for example 50 wt.% or less, for example 45 wt.% or less.

[0069] The second sulfur-containing compound may be present in the electrolyte in amounts based on the weight of the electrolyte, such as 2 wt.% or more, for example 5 wt.% or more, for example 8 wt.% or more, for example 10 wt.% or more, for example 13 wt.% or more, for example 15 wt.% or more, for example 18 wt.% or more, for example 20 wt.% or more, for example 25 wt.% or more, for example 30 wt.% or more. The second sulfur-containing compound may be present in the electrolyte in amounts based on the weight of the electrolyte, such as 85 wt.% or less, for example 80 wt.% or less, for example 75 wt.% or less, for example 70 wt.% or less, for example 65 wt.% or less, for example 60 wt.% or less, for example 55 wt.% or less, for example 50 wt.% or less, for example 45 wt.% or less, for example 40 wt.% or less, for example 35 wt.% or less, for example 30 wt.% or less, for example 26 wt.% or less, for example 24 wt.% or less, for example 20 wt.% or less, for example 18 wt.% or less, for example 16 wt.% or less, for example 14 wt.% or less, for example 12 wt.% or less.

[0070] The first sulfur-containing compound may constitute the majority of the solvent. For example, the first sulfur-containing compound may be present based on the weight of the solvent in the following amounts: 50 wt.% or more, such as 55 wt.% or more, such as 60 wt.% or more, such as 65 wt.% or more, such as 70 wt.% or more, such as 75 wt.% or more, such as 80 wt.% or more, such as 85 wt.% or more, such as 90 wt.% or more, such as 95 wt.% or more. The first sulfur-containing compound may also be present based on the weight of the solvent in the following amounts: less than 100 wt.%, such as 95 wt.% or less, such as 90 wt.% or less, such as 85 wt.% or less, such as 80 wt.% or less, such as 75 wt.% or less, such as 70 wt.% or less, such as 65 wt.% or less, such as 60 wt.% or less.

[0071] Therefore, the second sulfur-containing compound can constitute a small portion of the solvent. For example, the second sulfur-containing compound can be present based on the weight of the solvent in the following amounts: 50 wt.% or less (e.g., less than 50 wt.%), such as 45 wt.% or less, such as 40 wt.% or less, such as 35 wt.% or less, such as 30 wt.% or less, such as 25 wt.% or less, such as 20 wt.% or less, such as 15 wt.% or less. The second sulfur-containing compound can also be present based on the weight of the solvent in the following amounts: more than 0 wt.%, such as 2 wt.% or more, such as 5 wt.% or more, such as 8 wt.% or more, such as 10 wt.% or more, such as 15 wt.% or more, such as 20 wt.% or more, such as 25 wt.% or more, such as 30 wt.% or more, such as 35 wt.% or more, such as 40 wt.% or more.

[0072] Furthermore, the solvent may include, based on the weight of the solvent, amounts of the first and second sulfur-containing compounds as follows: 80 wt.% or more, for example 85 wt.% or more, for example 90 wt.% or more, for example 93 wt.% or more, for example 95 wt.% or more, for example 96 wt.% or more, for example 97 wt.% or more, for example 98 wt.% or more, for example 99 wt.% or more, for example 99.5 wt.% or more. For example, based on the weight of the solvent, the solvent may include more than 90 wt.% of the first and second sulfur-containing compounds.

[0073] As indicated in this article, electrolytes can be non-aqueous. Therefore, water may not be present. In this respect, water may be present based on the weight of the electrolyte in the following amounts: 1 wt.% or less, for example, 0.8 wt.% or less, for example, 0.6 wt.% or less, for example, 0.5 wt.% or less, for example, 0.4 wt.% or less, for example, 0.3 wt.% or less, for example, 0.2 wt.% or less, for example, 0.1 wt.% or less, for example, 0.09 wt.% or less, for example, 0.08 wt.% or less, for example, 0.07 wt.% or less, for example, 0.06 wt.% or less, for example, 0.05 wt.% or less, for example, 0.04 wt.% or less, for example, 0.03 wt.% or less, for example, 0.02 wt.% or less, for example, 0.01 wt.% or less, for example, 0.009 wt.% or less, for example, 0.008 wt.% or less, for example, 0.007 wt.% or less, for example 0.006 wt.% or less, for example 0.005 wt.% or less.

[0074] Regardless of the number of solvents present in the electrolyte, it should be understood that, based on the combination of solvents present in the electrolyte, the total weight percentage of all solvents should be approximately 100 wt.%.

[0075] Furthermore, ionic liquids may include less electrolyte than solvent. For example, ionic liquids may be present in amounts based on the weight of electrolyte as follows: 10 wt.% or more, such as 15 wt.% or more, such as 20 wt.% or more, such as 25 wt.% or more, such as 30 wt.% or more, such as 35 wt.% or more, such as 40 wt.% or more. Ionic liquids may also be present in amounts based on the weight of electrolyte as follows: 55 wt.% or less, such as 50 wt.% or less, such as 45 wt.% or less, such as 40 wt.% or less, such as 35 wt.% or less, such as 30 wt.% or less.

[0076] Furthermore, if a lithium metal salt is used, it can also include less electrolyte than the solvent. In particular, the metal salt can be present in a smaller amount in the electrolyte. For example, the metal salt may be present based on the weight of the electrolyte in amounts such as 1 wt.% or less, for example, 0.8 wt.% or less, for example, 0.6 wt.% or less, for example, 0.5 wt.% or less, for example, 0.4 wt.% or less, for example, 0.3 wt.% or less, for example, 0.2 wt.% or less, for example, 0.1 wt.% or less, for example, 0.09 wt.% or less, for example, 0.08 wt.% or less, for example, 0.07 wt.% or less, for example, 0.06 wt.% or less, for example, 0.05 wt.% or less, for example, 0.04 wt.% or less, for example, 0.03 wt.% or less, for example, 0.02 wt.% or less, for example, 0.01 wt.% or less, for example, 0.009 wt.% or less, for example, 0.008 wt.% or less, for example, 0.007 wt.% or less, for example 0.006 wt.% or less, for example 0.005 wt.% or less. Metal salts may be present based on the weight of the electrolyte in amounts of: more than 0 wt.%, for example, 0.0001 wt.% or more, for example, 0.0002 wt.% or more, for example, 0.0003 wt.% or more, for example, 0.0004 wt.% or more, for example, 0.0005 wt.% or more, for example, 0.0006 wt.% or more, for example, 0.0007 wt.% or more, for example, 0.0008 wt.% or more, for example, 0.0009 wt.% or more, for example, 0.001 wt.% or more, for example, 0.002 wt.% or more, for example, 0.003 wt.% or more, for example, 0.004 wt.% or more, for example, 0.005 wt.% or more, for example, 0.006 wt.% or more, for example, 0.007 wt.% or more, for example, 0.008 wt.% or more, for example, 0.009 wt.% or more. wt.% or more, for example, 0.01 wt.% or more.

[0077] Package As indicated herein, a supercapacitor includes a package, electrode assemblies, and an electrolyte housed within the package. Reference Figures 1A to 1C and Figures 2A to 2J The package 50 has a cover 82, a base 56, and sidewalls 52 extending in a direction generally perpendicular to the base 56. The base 56 defines, for example, an inner base surface 56a adjacent to an internal chamber 58, and an outer base surface 56b opposite to the inner base surface 56a. The internal chamber 58 is defined between the inner base surface 56a and the sidewalls 52 of the base 56, and the electrode assembly 72 can be positioned within the internal chamber 58.

[0078] As shown in the figure, the sidewall 52 extends in a direction generally perpendicular to the base 56 to define the first upper end 54a. Figure 2A As shown, sidewall 52 may extend to define an upper end. In another embodiment, sidewall 52 may extend in a direction generally perpendicular to base 56 to define one or more upper ends, such as two or more upper ends, for example, two upper ends. Figures 2B to 2J As shown, the sidewall 52 extends in a direction generally perpendicular to the base 56 to define a first upper end 54a and a second upper end 54b. In the direction of extension, the first upper end 54a may not extend to the extent that the second upper end 54b. At this point, the height of the first upper end 54a may be less than the height of the second upper end 54b. Therefore, such a first upper end 54a and a second upper end 54b can provide a stepped structure. Furthermore, this first upper end 54a can be positioned closer to the internal cavity 58 than the second upper end 54b.

[0079] Furthermore, one or more of these upper ends may extend in a direction generally parallel to the inner surface 56a of the base 56. For example, in one embodiment, a first upper end 54a may extend in a direction generally parallel to the inner surface 56a of the base 56. In one embodiment, a second upper end 54b may extend in a direction generally parallel to the inner surface 56a of the base 56. In one embodiment, the corresponding upper end may not extend in a direction generally parallel to the inner surface 56a of the base 56. For example, as... Figures 2E to 2J As shown, the first upper end 54a may not extend in a direction that is substantially parallel to the inner surface 56a of the base. Figures 2E to 2G In the middle, the first upper end 54a extends at an angle from the inner surface 52b of the second sidewall toward the cover 82 (or in a direction away from the base 56). Figures 2H to 2J In the middle, the first upper end 54a extends at an angle from the inner surface 52b of the second sidewall toward the base 56 (or in a direction away from the base 82).

[0080] The height of the sidewall 52 from the inner base surface 56a of the base 56 to the first upper end 54a can be 50% or more of the height of the sidewall 52 from the inner base surface 56a of the base 56 to the second upper end 54b, for example, 55% or more, 60% or more, 65% or more, 70% or more, 75% or more, 80% or more, or 85% or more. The height of the sidewall 52 from the inner base surface 56a of the base 56 to the first upper end 54a can be less than 100% of the height of the sidewall 52 from the inner base surface 56a of the base 56 to the second upper end 54b, for example, 98% or less, 95% or less, 93% or less, 90% or less, 88% or less, 85% or less, 83% or less, 80% or less, 78% or less, or 75% or less. As indicated and for clarity, this height can be defined as the distance from the inner base surface 56a of the base 56 to the corresponding upper end, particularly the edge closest to the corresponding upper end of the internal chamber 58. Alternatively, in other words, the height can be defined as the distance from the inner base surface 56a of the base 56 to the intersection of the corresponding upper end and the corresponding inner surface of the sidewall. For example, the height of the first upper end 54a can be the distance from the inner base surface 56a of the base to the intersection (or point or edge) of the first upper end 54a and the first inner surface 52a of the sidewall. Simultaneously, the height of the first upper end 54a can be the distance (i.e., vertical distance) from the inner base surface 56a of the base to the intersection (or point or edge) of the second upper end 54b and the second inner surface 52b of the sidewall. Regarding these dimensions, it should be understood that the height is measured from the inner base surface 56a in a generally vertical direction, rather than in a diagonal manner (e.g., from the intersection of the inner base surface 56a directly to the second upper end 54b and the inner surface 52b of the second sidewall).

[0081] Furthermore, sidewall 52 may include an inner surface of the sidewall facing the internal cavity 58 of the package 50. For example, as Figure 2A As shown, the sidewall 52 can extend to the first upper end 54a. In this respect, this inner surface of the sidewall 52 can be referred to as the first inner surface 52a of the sidewall 52, because it extends from the base 56, specifically to the first upper end 54a. However, as... Figures 2B to 2J As shown, when the sidewall includes a first upper end 54a and a second upper end 54b, the sidewall may include a first inner sidewall surface 52a and a second inner sidewall surface 52b. For example, the first inner sidewall surface 52a may extend from the inner base surface 56a of the base 56 to the first upper end 54a. Simultaneously, the second inner sidewall surface 52b may extend from the first upper end 54a to the second upper end 54b. Furthermore, this first inner sidewall surface 52a may be positioned closer to the internal chamber 58 than the second inner sidewall surface 52b.

[0082] When referring to the height of the corresponding upper end, the height of the first upper end 54a can refer to the distance from the inner surface 52a of the first sidewall to the inner base surface 56a of the base 56 extending to the first upper end 54a (particularly the edge of the first upper end 54a closest to the internal chamber 58). Similarly, the height of the second upper end 54b can refer to the total distance from the inner surface 52a of the first sidewall to the inner base surface 56a of the base 56 extending to the second upper end 54b (particularly the edge of the second upper end 54b closest to the internal chamber 58). In some embodiments, the height of the second upper end 54b can refer to the total distance from the inner surface 52a of the first sidewall to the inner base surface 56a of the base 56 extending to the first upper end 54a and the inner surface 52b of the second sidewall to the first upper end 54b extending from the first upper end 54a. Regarding the latter embodiment, these can be applied to instances where the first upper end 54a is substantially parallel to the inner base surface 56a.

[0083] Package 50 may also include a cover 82 for closing the internal chamber 58 of package 50. For example, in... Figure 2A In one embodiment shown, a cover 82 may be disposed on a first upper end 54a of the sidewall 52 to seal the electrode assembly 72 and the electrolyte within the internal chamber 58 of the package 50. As shown, in one embodiment, the cover 82 may not contact the inner surface of the sidewall.

[0084] In such Figures 2B to 2JIn other embodiments shown, the package may include a first upper end 54a and a second upper end 54b. A cap 82 may be disposed on the first upper end 54a of the sidewall 52 to seal the electrode assembly 72 and electrolyte within the internal chamber 58 of the package 50. In another embodiment, although not shown, the cap 82 may be disposed on the first upper end 54a and the second upper end 54b of the sidewall 52 to seal the electrode assembly 72 and electrolyte within the internal chamber 58 of the package 50. In one embodiment, not intended to be limiting, the seal or welding of the cap 82 to the sidewall 52 may allow substantial melting or softening of the material of the first upper end 54a to the extent that the first upper end 54a may be angled when the package 50 is sealed (e.g., the cap 82 is sealed to the sidewall 52 of the package 50). In some embodiments, such melting or softening may allow the first upper end 54a to extend in a direction generally parallel to the inner base surface 56a. In this respect, the supercapacitor defined herein can be formed of a package 50, wherein the first upper end 54a extends at an angle or is not substantially parallel to the inner base surface 56a. However, in some embodiments, when the package is sealed, the first upper end 54a may extend in a direction substantially parallel to the inner base surface 56a. However, in some other embodiments, it should be understood that even after sealing, the first upper end 54a will not extend in a direction substantially parallel to the inner base surface 56a.

[0085] In this regard, in one embodiment, the hermetically sealed supercapacitor package 50 may have a first upper end 54a having the same construction as the first upper end 54a used to form the supercapacitor package 50. In another embodiment, the hermetically sealed supercapacitor package 50 may have a first upper end 54a having a different construction than the first upper end 54a of the supercapacitor package 50. In any case, whether hermetically sealed or not, the supercapacitor may have a first upper end 54a as described herein. Furthermore, in one embodiment, one or more upper ends may extend in a direction generally parallel to the inner and / or outer surfaces of the cover 82. For example, in one embodiment, a second upper end 54b may extend in a direction generally parallel to the inner and / or outer surfaces of the cover 82. In another embodiment, a second upper end 54b may extend in a direction generally parallel to the inner surface 56a and / or outer surface 56b of the base 56. Similarly, in one embodiment, a first upper end 54a may extend in a direction generally parallel to the inner and / or outer surfaces of the cover 82. In another embodiment, the first upper end 54a may extend in a direction generally parallel to the inner surface 56a and / or the outer surface 56b of the base 56. In this respect, the first upper end 54a extending in a generally parallel direction may... Figures 2B to 2D As shown in the image.

[0086] However, in one embodiment, the first upper end 54a may not extend in a direction substantially parallel to the inner and / or outer surfaces of the cover 82. Correspondingly, the first upper end 54a may not extend in a direction substantially parallel to the inner base surface 56a and / or outer base surface 56b of the base 56. For example, such embodiments may... Figures 2E to 2J As shown in [the image]. Figures 2E to 2G In this configuration, the first upper end 54a can be angled such that the point starting from the inner surface 52b of the second sidewall (which serves as the contact point with the first upper end 54a) along the height of the first upper end 54a (measured from the inner base surface 56a of the base 56) and extending towards the point ending from the inner base surface 56a of the base 56 increases in height. Figures 2H to 2J In the middle, the first upper end 54a can be angled such that the point starting from the inner surface 52b of the second side wall (which serves as the contact point with the first upper end 54a) along the height of the first upper end 54a (which is measured from the inner base surface 56a of the base 56) and the point ending from the inner base surface 56a of the base 56 is reduced.

[0087] If needed, a sealing member (not shown) can be provided between the cover 82 and the sidewall 52 to help provide a good seal. Specifically, the sealing member can be disposed between the respective upper ends (54a and / or 54b) and the cover 82. In one embodiment, the sealing member can be disposed between the respective inner surfaces of the sidewall (52a and / or 52b) and the cover 82. In a further embodiment, the sealing member can be disposed between the respective upper ends (54a and / or 54b) and the respective inner surfaces of the sidewall (52a and / or 52b), and between the respective upper ends (54a and / or 54b) and the cover 82. For example, in one embodiment, the sealing member may include a glass-metal seal, a Kovar® ring (Goodfellow Cambridge, Ltd.), etc.

[0088] When forming a seal, there may be a certain amount of required contact between the lid and the sidewall. For example, the contact area can be approximately 10 mm² or larger, such as approximately 15 mm² or larger, such as approximately 20 mm² or larger, such as approximately 25 mm² or larger, such as approximately 30 mm² or larger, such as approximately 35 mm² or larger, such as approximately 40 mm² or larger, such as approximately 45 mm² or larger, such as approximately 50 mm² or larger, such as approximately 55 mm² or larger, such as approximately 60 mm² or larger, such as approximately 65 mm² or larger, such as approximately 70 mm² or larger, such as approximately 75 mm² or larger, such as approximately 80 mm² or larger, such as approximately 85 mm² or larger, such as approximately 90 mm² or larger, such as approximately 95 mm² or larger, such as approximately 100 mm² or larger, such as approximately 120 mm² or larger, such as approximately 140 mm² or larger, such as approximately 160 mm² or larger, such as approximately 180 mm² or larger, such as approximately 200 mm² or larger, such as approximately 220 mm² or larger, such as approximately 240 mm² or larger. The contact area between the lid and the sidewall can be approximately 300 mm² or smaller, such as approximately 290 mm² or smaller, such as approximately 270 mm² or smaller, such as approximately 250 mm² or smaller, such as approximately 230 mm² or smaller, such as approximately 210 mm² or smaller, such as approximately 190 mm² or smaller, such as approximately 170 mm² or smaller, such as approximately 150 mm² or smaller, such as approximately 130 mm² or smaller, such as approximately 110 mm² or smaller, such as approximately 100 mm² or smaller, such as approximately 90 mm² or smaller, such as approximately 80 mm² or smaller, such as approximately 70 mm² or smaller, such as approximately 60 mm² or smaller, such as approximately 50 mm² or smaller, such as approximately 40 mm² or smaller, such as approximately 30 mm² or smaller, such as approximately 20 mm² or smaller. For clarity, this contact area can refer to the area of ​​contact or shared between the cap and the sidewall of the package.

[0089] In one embodiment, this contact with the lid may be a contact with the upper end (e.g., a first upper end). This contact may be on the upper end (e.g., the first upper end). In a particular embodiment, this contact with the lid may be only with this upper end (e.g., the first upper end) and / or on this upper end (e.g., the first upper end). In another embodiment, this contact with the lid may be with a second upper end. This contact may be on the upper end (e.g., the second upper end). In a particular embodiment, this contact with the lid may be only with the second upper end and / or on this second upper end.

[0090] In another embodiment, this contact with the lid can be on the inner surface of the sidewall, such as the inner surface of the first sidewall. Alternatively, this contact with the lid can be based on the inner surface of the second sidewall. In another embodiment, this contact with the lid can be based on both the inner surface of the first and second sidewalls.

[0091] In a further embodiment, such contact with the lid may be based on one or more upper ends and one or more inner surfaces of the sidewalls. For example, such contact with the lid may be based on a first upper end and / or a second upper end and a first inner surface of the sidewall and / or a second inner surface of the sidewall. In a particular embodiment, such contact with the lid may be based on a combination of a first inner surface of the sidewall, a second inner surface of the sidewall, and a second upper end.

[0092] When making such contact with the upper end (e.g., the first upper end), the contact area can be approximately 50% or greater of the surface area of ​​the upper end (e.g., the first upper end), for example, approximately 55% or greater, approximately 60% or greater, approximately 65% ​​or greater, approximately 70% or greater, approximately 75% or greater, approximately 80% or greater, approximately 85% or greater, approximately 90% or greater, approximately 95% or greater, approximately 98% or greater, approximately 99% or greater, or approximately 100%. The contact area based on the surface area of ​​the upper end (e.g., the first upper end) can be 100% or less, for example, approximately 99% or less, approximately 98% or less, or approximately 95% or less.

[0093] As indicated herein, the package 50 includes a cover 82. In one embodiment, the cover 82 may have a boss configuration. For example, such a configuration is... Figures 2C to 2D , Figures 2F to 2G and Figures 2I to 2J As shown, the cover further extends into the internal cavity 58 of the package 50, extending beyond the first upper end 54a toward or in the direction of the inner base surface 56a of the base 56. Although in Figures 2C to 2D , Figures 2F to 2G and Figures 2I to 2J The diagram shows a first upper end 54a and a second upper end 54b, but it should be understood that the following configuration can also be used with the cover 82: in this configuration, the sidewall 52 has only the first upper end 54a, as shown below. Figure 2A As shown.

[0094] When the cover 82 extends beyond the first upper end 54a, the cover 82 can contact the inner surface 52a of the first sidewall. In one embodiment, the cover 82 can contact both inner surfaces of the sidewall: the first inner surface 52a and the second inner surface 52b. Additionally, the cover 82 can also contact the first upper end 54a. In another embodiment, the cover 82 can also contact the second upper end 54b. In this case, the cover 82 can contact both the first upper end 54a and the second upper end 54b.

[0095] In a further embodiment, such as Figure 2D , Figure 2G and Figure 2J As shown, the cover 82 may have a cover chamber 88 adjacent to the internal chamber 58 of the package 50. As illustrated, this cover chamber 88 is represented by the area below the bottom surface of the cover 82 and above the dashed line. For example, this cover chamber 88 can be formed by shaping the cover 82 in a specific manner. Furthermore, providing this cover chamber 88 allows for a larger electrode assembly 72, thereby minimizing potential contact with the cover 82. For example, in addition to being disposed within the internal chamber 58 of the package 50, the electrode assembly 72 may extend into the cover chamber 88. Furthermore, a dielectric may be present within the cover chamber 88.

[0096] The height of the sidewall 52 generally prevents the cap 82 from contacting any surface of the electrode assembly 72 disposed within the internal cavity 58 of the package 50. When the cap 82 is placed in the desired position, it can be sealed to the sidewall 52 using known techniques such as welding (e.g., resistance welding, laser welding, etc.), brazing, etc. In one embodiment, ultrasonic welding can be used to seal the cap 82 to the sidewall. As indicated herein, such sealing (welding) can cause the material (e.g., polymer) forming the sidewall 52 of the package 50 to melt or soften. In this respect, in some embodiments, the first upper end 54a does not extend in a direction generally parallel to the respective inner or outer surface of the cap 82 or the respective inner or outer base surface of the base 56 when sealed, and this softening allows the cap 82 to contact the first upper end 54a in such a manner that this subsequently allows the first upper end 54a to extend in a direction generally parallel to the respective inner or outer surface of the cap 82 or the respective inner or outer base surface of the base 56.

[0097] As indicated above, a specific contact area may exist between the lid and the sidewall (particularly the corresponding upper end and / or the inner surface of the sidewall). Within this specific contact area, 40% or more (e.g., 45% or more, 50% or more, 55% or more, 60% or more, 65% or more, 70% or more, 75% or more, 80% or more, 85% or more, 90% or more, 95% or more) of the contact area can, for example, be formed by welding to create a joint. The area of ​​this joint can be 100% or less of the contact area between the lid and the sidewall, e.g., 95% or less, 90% or less, 85% or less, 80% or less, 75% or less, 70% or less, 65% or less, 60% or less, 55% or less.

[0098] In this respect, the joint area can be approximately 10 mm² or larger, for example, approximately 15 mm² or larger, for example, approximately 20 mm² or larger, for example, approximately 25 mm² or larger, for example, approximately 30 mm² or larger, for example, approximately 35 mm² or larger, for example, approximately 40 mm² or larger, for example, approximately 45 mm² or larger, for example, approximately 50 mm² or larger, for example, approximately 55 mm² or larger, for example, approximately 60 mm² or larger, for example, approximately 65 mm² or larger, for example, approximately 70 mm² or larger, for example, approximately 75 mm² or larger, for example, approximately 80 mm² or larger, for example, approximately 85 mm² or larger, for example, approximately 90 mm² or larger, for example, approximately 95 mm² or larger, for example, approximately 100 mm² or larger, for example, approximately 120 mm² or larger, for example, approximately 140 mm² or larger, for example, approximately 160 mm² or larger, for example, approximately 180 mm² or larger, for example, approximately 200 mm² or larger, for example, approximately 220 mm² or larger, for example, approximately 240 mm² or larger. The area of ​​the joint between the lid and the sidewall can be approximately 300 mm² or smaller, such as approximately 290 mm² or smaller, such as approximately 270 mm² or smaller, such as approximately 250 mm² or smaller, such as approximately 230 mm² or smaller, such as approximately 210 mm² or smaller, such as approximately 190 mm² or smaller, such as approximately 170 mm² or smaller, such as approximately 150 mm² or smaller, such as approximately 130 mm² or smaller, such as approximately 110 mm² or smaller, such as approximately 100 mm² or smaller, such as approximately 90 mm² or smaller, such as approximately 80 mm² or smaller, such as approximately 70 mm² or smaller, such as approximately 60 mm² or smaller, such as approximately 50 mm² or smaller, such as approximately 40 mm² or smaller, such as approximately 30 mm² or smaller, such as approximately 20 mm² or smaller. For clarity, this joint area may refer to the area that contacts or is shared between the cap and the sidewall of the package, where the joint is formed, for example, by welding.

[0099] Simultaneously, the sidewalls 52 and base 56 of the package 50 can be formed using any of a variety of different materials. Furthermore, in one embodiment, the cap 82 of the package 50 can be formed using the same material. In this respect, the entire package 50 (sidewalls 52, base 56, and cap 82) can be formed from the same material. These materials can include metals, polymers, ceramics, etc. For example, in one embodiment, the material can include a ceramic material. This ceramic material can be used to form the sidewalls and / or base. Alternatively, this ceramic material can be used to form the cap. The ceramic material can include aluminum nitride, aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, glass, etc., and combinations thereof. In other embodiments, the material can include a metal. This metal can be used to form the sidewalls and / or base. Alternatively, this metal can be used to form the cap. The metal can include tantalum, niobium, aluminum, nickel, hafnium, titanium, copper, silver, steel (e.g., stainless steel), alloys thereof (e.g., conductive oxides), composites thereof (e.g., metals coated with conductive oxides), etc.

[0100] In one particular embodiment, the package or a portion thereof (e.g., base, sidewalls, and / or cap) may be formed of a polymer, particularly a thermoplastic polymer. In one embodiment, the base and sidewalls may be formed of such a polymer. In such an embodiment, the base and sidewalls may be integrally formed using conventional molding techniques (e.g., injection molding, extrusion molding, etc.). In another embodiment, the base, sidewalls, and cap may be formed of such a polymer. The cap may also be formed using conventional molding techniques (e.g., injection molding, extrusion molding, etc.).

[0101] The polymer can be a liquid crystal polymer. Typically, the liquid crystal polymer can be melt-processable, thereby allowing the use of conventional molding processes when forming any portion of the aforementioned package. Such polymers can include liquid crystal polyesters, liquid crystal polyesteramides, liquid crystal polyester carbonates, or mixtures thereof. In one embodiment, such polymers can include liquid crystal polyesters. In another embodiment, such polymers can include liquid crystal polyesteramides.

[0102] Furthermore, the liquid crystal polymer can be an aromatic liquid crystal polymer. For example, the aromatic liquid crystal polymer can be an aromatic liquid crystal polyester, an aromatic liquid crystal polyesteramide, an aromatic liquid crystal polyester carbonate, or a mixture thereof. In one embodiment, such a polymer may include an aromatic liquid crystal polyester. In another embodiment, such a polymer may include an aromatic liquid crystal polyesteramide.

[0103] The liquid crystal polymer may comprise repeating units formed from: one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; one or more aromatic hydroxycarboxylic acids; one or more aromatic amines; one or more aromatic hydroxylamines; one or more aromatic aminocarboxylic acids; or combinations thereof. In one embodiment, the liquid crystal polymer may comprise repeating units formed from: one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; one or more aromatic hydroxycarboxylic acids; or mixtures thereof. In a further embodiment, the liquid crystal polymer may be made from at least two of: one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; and one or more aromatic hydroxycarboxylic acids. In another embodiment, the liquid crystal polymer may be made from all three of: one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; and one or more aromatic hydroxycarboxylic acids.

[0104] For example, the liquid crystal polymer may contain one or more aromatic ester repeating units, typically in an amount of about 50 mol.% or more of the polymer, such as about 60 mol.% or more, about 70 mol.% or more, about 75 mol.% or more, about 80 mol.% or more, about 85 mol.% or more, about 90 mol.% or more, or about 95 mol.% or more. The aromatic ester repeating units may be about 100 mol.% or less of the polymer, such as about 99.9 mol.% or less, about 99.5 mol.% or less, about 99 mol.% or less, about 98 mol.% or less, about 97 mol.% or less, or about 95 mol.% or less.

[0105] The aromatic dihydroxy repeating units present in the polymer can be derived from aromatic dihydroxy compounds. These may include, but are not limited to, hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 4,4′-dihydroxybiphenyl (or 4,4′-biphenol), 3,3′-dihydroxybiphenyl, 3,4′-dihydroxybiphenyl, 4,4′-dihydroxydiphenyl ether, bis(4-hydroxyphenyl)ethane, and mixtures thereof. They may also include alkyl, alkoxy, aryl, and halogen substituents and combinations thereof. In a particular embodiment, the aromatic dihydroxy compound may include hydroquinone, 4,4′-biphenol, or mixtures thereof. When used, repeating units derived from aromatic dihydroxy compounds may constitute about 1 mol.% or more of the polymer, for example, about 2 mol.% or more, for example, about 3 mol.% or more, for example, about 5 mol.% or more, for example, about 8 mol.% or more, for example, about 10 mol.% or more, for example, about 15 mol.% or more, for example, about 20 mol.% or more, for example, about 25 mol.% or more, for example, about 30 mol.% or more, for example, about 35 mol.% or more, for example, about 40 mol.% or more, for example, about 45 mol.% or more. They may constitute about 60 mol.% or less of the polymer, for example, about 50 mol.% or less, for example, about 40 mol.% or less, for example, about 30 mol.% or less, for example, about 25 mol.% or less, for example, about 20 mol.% or less, for example, about 15 mol.% or less. The repeating aromatic dicarboxylic acid unit in the polymer can be derived from an aromatic dicarboxylic acid. These aromatic dicarboxylic acids may include, but are not limited to, terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, diphenyl ether-4,4′-dicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4′-dicarboxybiphenyl, bis(4-carboxyphenyl) ether, bis(4-carboxyphenyl)butane, bis(4-carboxyphenyl)ethane, bis(3-carboxyphenyl) ether, bis(3-carboxyphenyl)ethane, etc., or mixtures thereof. These aromatic dicarboxylic acids may also include alkyl, alkoxy, aryl, and halogen substituents, and combinations thereof. In a particular embodiment, the aromatic dicarboxylic acid may include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, or mixtures thereof. When used, repeating units derived from aromatic dicarboxylic acids may constitute about 5 mol% or more of the polymer, for example, about 10 mol% or more, for example, about 20 mol% or more, for example, about 30 mol% or more, for example, about 40 mol% or more, for example, about 50 mol% or more, for example, about 60 mol% or more. These repeating units may constitute 80 mol% or less of the polymer, for example, about 70 mol% or less, for example, about 60 mol% or less, for example, about 50 mol% or less, for example, about 40 mol% or less, for example, about 30 mol% or less, for example, about 20 mol% or less.

[0106] The repeating aromatic hydroxycarboxylic acid units present in the polymer can be derived from aromatic hydroxycarboxylic acids. These aromatic hydroxycarboxylic acids may include, but are not limited to, 4-hydroxybenzoic acid; 4-hydroxy-4′-biphenylcarboxylic acid; 2-hydroxy-6-naphthoic acid; 2-hydroxy-5-naphthoic acid; 3-hydroxy-2-naphthoic acid; 2-hydroxy-3-naphthoic acid; 4′-hydroxyphenyl-4-benzoic acid; 3′-hydroxyphenyl-4-benzoic acid; 4′-hydroxyphenyl-3-benzoic acid, etc., or mixtures thereof. These aromatic hydroxycarboxylic acids may also include alkyl, alkoxy, aryl, and halogen substituents, and combinations thereof. In a particular embodiment, the aromatic hydroxycarboxylic acid may include 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or mixtures thereof. When used, repeating units derived from hydroxycarboxylic acids may constitute about 10 mol.% or more of the polymer, for example, about 20 mol.% or more, for example, about 30 mol.% or more, for example, about 40 mol.% or more, for example, about 50 mol.% or more, for example, about 60 mol.% or more, for example, about 70 mol.% or more, for example, about 80 mol.% or more. These repeating units may constitute less than 100 mol.% of the polymer, for example, about 95 mol.% or less, for example, about 90 mol.% or less, for example, about 80 mol.% or less, for example, about 70 mol.% or less, for example, about 60 mol.% or less, for example, about 50 mol.% or less, for example, about 40 mol.% or less, for example, about 30 mol.% or less.

[0107] The repeating aromatic amine units present in the polymer can be derived from aromatic amines. These aromatic amines can include, but are not limited to, 4-aminophenol (“AP”), 3-aminophenol, 1,4-phenylenediamine, 1,3-phenylenediamine, and mixtures thereof. Such aromatic amines may also include aromatic diamines. In use, the repeating units derived from aromatic amines can constitute about 0.1 mol% or more of the polymer, for example, about 0.2 mol% or more, for example, about 0.5 mol% or more, for example, about 1 mol% or more, for example, about 2 mol% or more, for example, about 3 mol% or more, for example, about 5 mol% or more, for example, about 8 mol% or more, for example, about 10 mol% or more, for example, about 15 mol% or more, for example, about 20 mol% or more, for example, about 25 mol% or more, for example, about 30 mol% or more, for example, about 35 mol% or more. These repeating units may comprise about 40 mol.% or less of the polymer, for example, about 30 mol.% or less, for example, about 25 mol.% or less, for example, about 20 mol.% or less, for example, about 15 mol.% or less, for example, about 10 mol.% or less, for example, about 8 mol.% or less, for example, about 5 mol.% or less.

[0108] In addition to the above, it should be understood that various other monomeric repeating units can be incorporated into the polymer. For example, in some embodiments, the polymer may contain one or more repeating units derived from non-aromatic monomers, such as aliphatic or alicyclic hydroxycarboxylic acids, dicarboxylic acids, glycols, amides, amines, etc. Such repeating units may be present in the polymer in amounts of: about 20 mol.% or less, for example, about 18 mol.% or less, for example, about 15 mol.% or less, for example, about 12 mol.% or less, for example, about 10 mol.% or less, for example, about 8 mol.% or less, for example, about 6 mol.% or less, for example, about 5 mol.% or less, for example, about 4 mol.% or less, for example, about 3 mol.% or less, for example, about 2 mol.% or less, for example, about 1 mol.% or less. In other embodiments, the polymer may be "fully aromatic" because it lacks repeating units derived from non-aromatic (e.g., aliphatic or cycloaliphatic) monomers.

[0109] The polymer can have a relatively high melting temperature. For example, the melting temperature can be about 250°C or higher, such as about 260°C or higher, such as about 270°C or higher, such as about 280°C or higher, such as about 290°C or higher, such as about 300°C or higher, such as about 310°C or higher, such as about 320°C or higher, such as about 330°C or higher, such as about 340°C or higher, such as about 350°C or higher. The melting temperature can also be about 400°C or lower, such as about 380°C or lower, such as about 360°C or lower, such as about 350°C or lower, such as about 340°C or lower, such as about 320°C or lower, such as about 300°C or lower, such as about 280°C or lower. The melting temperature can be determined using methods known in the art, such as differential scanning calorimetry.

[0110] Simultaneously, once the electrode assembly is fabricated, it can be placed into the internal cavity of the package. (See again) Figures 1A to 1C and Figures 2A to 2J These figures illustrate means by which the electrode assembly 72 can be connected to the package 50. For example, to attach the electrode assembly 72 to the package 50, particularly in a mechanically stable manner, a first conductive member 60 and a second conductive member 62 are disposed within the internal cavity 58 of the package 50. Specifically, the conductive members 60 and 62 may extend through the base 56 of the package 50 and into the internal cavity 58. Specifically, the conductive members 60 and 62 may extend such that they terminate in a plane generally parallel to the base 56. Specifically, such a plane may refer to the lower (or outer) base surface 56b of the base 56, opposite to the upper (or inner) base surface 56a adjacent to the internal cavity 58.

[0111] The supercapacitor and electrode assembly 72 also include a first lead 74 and a second lead 76, respectively, extending outward from the electrode assembly 72. The first lead 74 is electrically connected to the first conductive member 60, and the second lead 76 is electrically connected to the second conductive member 62. In this perspective view, the first lead 74 and the second lead 76 are shown together, and the first conductive member 60 and the second conductive member 62 are shown together. However, it should be understood that each is a separate element within the supercapacitor. As indicated above, the conductive members may terminate along the outer base surface 56b of the base 56. In this respect, the conductive members 60 and 62 may simply extend through the base 56, and in such an embodiment, they may form external terminals 84 and 86 of the supercapacitor, which are used for electrical connections, for example, on a circuit board. Therefore, in one embodiment, the first conductive member 60 and the second conductive member 62 may not be further connected to any other external terminals on the supercapacitor or package 50.

[0112] Alternatively, a separate conductive trace (not shown) may be attached to a first conductive member 60 that extends through the base 56 and either forms a first external terminal 84 or is connected to an additional conductive member serving as the external terminal 84. Similarly, a second conductive member 62 may extend through the base 56 to form an external terminal 86, or a separate conductive trace (not shown) may be attached to a second conductive member 62 that extends through the base 56 and either forms a terminal 86 or is connected to an additional conductive member serving as the terminal 86. When using traces, through-holes (not shown) may be formed within the base 56 to accommodate the traces.

[0113] As indicated, a first conductive member 60 and a second conductive member 62 are disposed within the internal cavity 58 of the package 50. Specifically, conductive members 60 and 62 may extend from the base 56 of the package 50, through the base 56, and into the internal cavity 58. The manner in which the various conductive members are disposed is not limited to this disclosure. For example, in one embodiment, the package 50 may be manufactured with an opening in the base for disposing of the respective conductive member. In this case, the respective conductive member may be inserted into such an opening within the base 56 of the package 50. The respective conductive member may be secured to the base 56 using means known in the art. For example, such means would allow the respective conductive member to remain secured to the base while also preventing and / or minimizing any leakage into and from the package 50. For example, the means may include an adhesive, such as a conductive adhesive.

[0114] In another embodiment, particularly where the package is formed of a polymer such as a liquid crystal polymer, the corresponding conductive member can be overmolded with the polymer. For example, when the package is formed of a polymer, the conductive member can be provided such that it is overmolded with the polymer. Such overmolding techniques are generally known in the art. Furthermore, in one embodiment, an adhesive can be applied to prevent and / or minimize any leakage into and out of the package 50. In one embodiment, such an adhesive can be a conductive adhesive commonly used in the art and industry. In one embodiment, such an adhesive can be provided, and the adhesive contacts the corresponding conductive member adjacent to the outer surface 56b of the base 56.

[0115] The conductive member can be arranged in any shape. Typically, this shape can be elongated, extending into the internal cavity 58 of the package 50. At least one dimension of the conductive member (e.g., width “W” or length “L”) can be from about 0.05 mm or greater (e.g., about 0.1 mm or greater, such as about 0.2 mm or greater, such as about 0.5 mm or greater, such as about 0.8 mm or greater, such as about 1 mm or greater, such as about 1.3 mm or greater, such as about 1.5 mm or greater) to about 3 mm or less (e.g., about 2.8 mm or less, such as about 2.5 mm or less, such as about 2.3 mm or less, such as about 2 mm or less, such as about 1.8 mm or less, such as about 1.5 mm or less, such as about 1.3 mm or less, such as about 1 mm or less, such as about 0.5 mm or less, such as about 0.4 mm or less, such as about 0.2 mm or less, such as about 0.1 mm or less). Conductive components are typically formed of one or more layers of metal, such as nickel, silver, gold, tin, copper, etc. If desired, as is known in the art, the surface of the conductive component can be electroplated with nickel, silver, gold, tin, etc. For example, such electroplating can facilitate the mounting of supercapacitors onto circuit boards.

[0116] like Figure 1A , Figure 1C and Figures 2A to 2J As shown, conductive members 60 and 62 are positioned at the same end of the package 50 and the base 56. In this respect, this configuration can facilitate the housing of electrode assemblies having terminals or leads at the same end of the electrode assembly. However, it should be understood that conductive members 60 and 62 can also be positioned at opposite ends of the package 50 and the base 56. This configuration can facilitate the housing of electrode assemblies having terminals or leads at opposite ends.

[0117] Furthermore, the electrode assembly 72 includes a first lead 74 electrically connected to a first electrode (not shown) and a second lead 76 electrically connected to a second electrode (not shown). Leads 74 and 76 extend outward from the electrode assembly 72, with lead 74 electrically connected to a first conductive member 60 and lead 76 electrically connected to the second conductive member 62.

[0118] like Figures 2A to 2J As shown, leads 74 and 76 extend from the same end of electrode assembly 72. However, in another embodiment, it should be understood that the leads may extend from opposite ends of the electrode assembly. Furthermore, as shown, in one embodiment, leads 74 and 76 may be retained within package 50 and may not extend beyond the internal cavity 58 of package 50. In this respect, leads 74 and 76 may not extend beyond the base 56, sidewall 52, and cap 82 of package 50.

[0119] Furthermore, in one embodiment, portions of the leads may extend from the electrode assembly in such a manner that the main surface of the electrode assembly is generally parallel to the base 56. Of course, it should be understood that this is by no means necessary. For example, in other embodiments, the leads may be disposed on the bottom or top surface of the electrode assembly, such that the leads and / or conductive members are configured to facilitate electrical contact with each other.

[0120] In any case, the attachment of leads 74 and 76 to conductive members 60 and 62 can generally be achieved using any of a variety of known techniques. For example, in some embodiments, welding techniques such as ultrasonic welding, laser welding, resistance welding, etc., can be used. In other embodiments, conductive adhesives can be used to attach the conductive members to the respective leads. For example, in one particular embodiment, leads 74 and 76 are attached to conductive members 60 and 62, respectively, using conductive adhesives.

[0121] When conductive adhesives are used, they typically contain multiple particles formed from conductive materials (e.g., metals). Examples of suitable conductive materials include metals (e.g., nickel, copper, gold, silver, silver-plated copper, silver-plated nickel, etc.), carbon materials (e.g., graphite, nickel-plated carbon, etc.), etc. Conductive adhesives also typically contain a resin material in which the conductive particles are dispersed. While any resin material can be used, it is generally desirable to use a curable thermosetting resin, such as epoxy resin, melamine resin, maleimide resin, polyimide resin, phenolic resin, etc. Epoxy resin is particularly suitable. Examples of suitable epoxy resins include, for example, glycidyl ether type epoxy resins (e.g., bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenolic resins, o-cresol phenolic resins, brominated epoxy resins, and biphenyl type epoxy resins), cyclic aliphatic epoxy resins, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, cresol phenolic resins, naphthalene type epoxy resins, phenol aralkyl type epoxy resins, cyclopentadiene type epoxy resins, heterocyclic epoxy resins, etc. Other suitable conductive adhesive resins are also described in U.S. Patent Application Publication No. 2006 / 0038304 by Osako et al. and U.S. Patent No. 7,554,793 by Chacko. Typically, the resin material comprises about 0.5% wt.% to about 50 wt.% of the dry weight of the adhesive. In some embodiments, the resin material comprises about 1 wt.% to about 25 wt.% of the dry weight of the adhesive, and in some embodiments, the resin material comprises about 2 wt.% to about 20 wt.% of the dry weight of the adhesive. Similarly, on a dry basis, conductive particles typically comprise about 50 wt.% to about 99.5 wt.% of the adhesive. In some embodiments, conductive particles typically comprise about 75 wt.% to about 99 wt.% of the adhesive, and in some embodiments, conductive particles typically comprise about 80 wt.% to about 98 wt.% of the adhesive. The adhesive can be applied using known techniques, such as screen printing, dip coating, electrophoretic coating, electron beam deposition, spraying, rolling, brushing, doctor blade casting, vacuum deposition, coating, etc. In any case, once applied, conductive adhesives can be cured using any of a variety of known techniques, such as thermosetting, photocuring (e.g., ultraviolet radiation, electron beam radiation, infrared radiation, etc.).

[0122] The above embodiments generally refer to the use of a single electrode assembly within the internal cavity of a supercapacitor package. However, it should be understood that the supercapacitor of this disclosure may also include two or more electrode assemblies. For example, in one such embodiment, the supercapacitor may include a stack of two or more electrode assemblies within the internal cavity of the supercapacitor package, the two or more electrode assemblies being identical or different. Such assemblies may be electrically connected in series or in parallel. Furthermore, in one embodiment, such assemblies may be disposed in respective housings, each respective housing containing an electrolyte. When connecting the assemblies, leads may be connected to conductive members, as disclosed herein.

[0123] Performance and Applications The supercapacitors disclosed herein can exhibit the desired performance for a variety of applications. For example, the supercapacitor can have a specific voltage that allows it to be used in a variety of applications. This voltage can be 2 V or higher, such as 2.2 V or higher, such as 2.5 V or higher, such as 2.7 V or higher, such as 3 V or higher. The voltage of the supercapacitor can be 4 V or lower, such as 3.5 V or lower, such as 3.2 V or lower, such as 3 V or lower, such as 2.9 V or lower. For example, in one embodiment, the voltage of the supercapacitor can be 2.7 V or 3.0 V. In one embodiment, the voltage of the supercapacitor can be 2.7 V. In another embodiment, the voltage of the supercapacitor can be 3.0 V.

[0124] Furthermore, supercapacitors can exhibit excellent electrical performance, especially when exposed to high temperatures. For example, such supercapacitors can exhibit capacitances of approximately 5 farads per cubic centimeter (“F / cm³”) or greater, such as approximately 6 F / cm³ or greater, such as approximately 8 F / cm³ or greater, such as approximately 9 F / cm³ or greater, such as approximately 10 F / cm³ or greater, such as approximately 13 F / cm³ or greater, such as approximately 15 F / cm³ or greater, such as approximately 20 F / cm³ or greater. The capacitance can be 100 F / cm³ or less, for example, about 90 F / cm³ or less, for example, about 80 F / cm³ or less, for example, about 70 F / cm³ or less, for example, about 60 F / cm³ or less, for example, about 50 F / cm³ or less, for example, about 40 F / cm³ or less, for example, about 30 F / cm³ or less, for example, about 25 F / cm³ or less, for example, about 20 F / cm³ or less, for example, about 15 F / cm³ or less, for example, about 10 F / cm³ or less. The capacitance can be measured at a voltage of 2.7 V or 2.5 V and a temperature of 65°C, or at a voltage of 2.0 V and a temperature of 85°C.

[0125] Supercapacitors can exhibit capacitances of approximately 6 F or greater, such as approximately 8 F or greater, approximately 10 F or greater, approximately 12 F or greater, approximately 15 F or greater, or approximately 18 F or greater. The capacitance can be 100 F or less, such as approximately 80 F or less, approximately 60 F or less, approximately 40 F or less, approximately 30 F or less, approximately 28 F or less, approximately 25 F or less, approximately 22 F or less, approximately 20 F or less, approximately 18 F or less, approximately 15 F or less, or approximately 12 F or less.

[0126] The supercapacitor can also have a low equivalent series resistance (ESR), for example, about 500 milliohms (mOhms) or less, for example, about 450 mOhms or less, for example, about 400 mOhms or less, for example, about 350 mOhms or less, for example, about 300 mOhms or less, for example, about 275 mOhms or less, for example, about 250 mOhms or less, for example, about 230 mOhms or less, for example, about 200 mOhms or less, for example, about 180 mOhms or less, for example, about 150 mOhms or less, for example, about 130 mOhms or less, for example, about 100 mOhms or less, for example, about 90 mOhms or less, for example, about 80 mOhms or less, for example, about 70 mOhms or less, for example, about 60 mOhms or less, for example, about 50 mOhms or less. The ESR can be 0.01 mohms or greater, for example, about 0.05 mohms or greater, for example, about 0.1 mohms or greater, for example, about 0.2 mohms or greater, for example, about 0.3 mohms or greater, for example, about 0.5 mohms or greater, for example, about 1 mohm or greater, for example, about 2 mohms or greater, for example, about 3 mohms or greater, for example, about 5 mohms or greater, for example, about 8 mohms or greater, for example, about 10 mohms or greater, for example, about 15 mohms or greater, for example, about 20 mohms or greater, for example, about 25 mohms or greater, for example, about 30 mohms or greater, for example, about 35 mohms or greater, for example, about 40 mohms or greater, for example, about 50 mohms or greater, for example, about 60 mohms or greater, for example, about 70 mohms or greater, for example, about 80 mohms or greater, for example, about 100 mohms or greater, for example, about 120 ESR is measured in mohms or greater, for example, about 140 mohms or greater, about 160 mohms or greater, about 180 mohms or greater, or about 200 mohms or greater. ESR can be measured at a voltage of 2.7 V or 2.5 V and a temperature of 65°C, or at a voltage of 2.0 V and a temperature of 85°C.

[0127] As indicated above, the obtained supercapacitors can exhibit a variety of beneficial electrical properties, such as improved capacitance and ESR values. Notably, the supercapacitors can still exhibit excellent electrical performance even when exposed to high temperatures. For example, the supercapacitors can be placed in contact with an environment having temperatures of approximately 65°C, for example, approximately 85°C in some embodiments, from approximately 100°C to approximately 150°C in some embodiments, and approximately 105°C in other embodiments. The capacitance and ESR values ​​can remain stable at such temperatures for extended periods, for example, approximately 100 hours or longer, for example, approximately 200 hours or longer, for example, approximately 300 hours or longer, for example, approximately 500 hours or longer, for example, approximately 800 hours or longer, for example, approximately 1000 hours or longer, for example, approximately 1200 hours or longer, for example, approximately 1500 hours or longer, for example, approximately 2000 hours or longer, for example, approximately 3000 hours or longer, for example, approximately 4000 hours or longer, for example, approximately 5000 hours or longer. The time period can be 10,000 hours or less, such as 8,000 hours or less, such as 6,000 hours or less, such as 5,000 hours or less, such as 4,000 hours or less, such as 3,000 hours or less, such as 2,000 hours or less, such as 1,500 hours or less, such as 1,300 hours or less, such as 1,100 hours or less, such as 1,000 hours or less, such as 800 hours or less, such as 600 hours or less, such as 400 hours or less.

[0128] For example, after being acclimated at 65°C for one or more of the aforementioned time periods (e.g., 100 hours, 200 hours, 300 hours, 500 hours, 800 hours, 1000 hours, 1200 hours, 1500 hours, 2000 hours, 3000 hours, 4000 hours, 5000 hours), the supercapacitor may exhibit a capacitance within 40% of its initial capacitance (e.g., within 30%, 20%, 15%, 10%, or 5%). Similarly, the ESR may be within 60% of the initial ESR (e.g., within 50%, 40%, 30%, 20%, 10%, or 5%). In one embodiment, the aforementioned percentages may also apply when acclimated at 85°C for one or more of the aforementioned time periods.

[0129] Furthermore, in one embodiment, the ratio of the capacitance of the supercapacitor after exposure to a thermal environment (e.g., 65°C or 85°C) for one or more of the aforementioned time periods to the capacitance of the supercapacitor at the initial exposure to the thermal environment is about 0.70 or greater, for example, about 0.75 or greater, for example, about 0.8 or greater, for example, about 0.85 or greater, for example, about 0.9 or greater, for example, about 0.95 or greater. This ratio can be 1.0 or less, for example, about 0.98 or less, for example, about 0.95 or less, for example, about 0.9 or less. Such a high capacitance value can also be maintained under various extreme conditions, such as when voltage is applied and / or in a humid environment.

[0130] In one embodiment, the ratio of the capacitance of the supercapacitor after 1008 hours of exposure to a thermal environment (e.g., 85°C or 105°C) to the capacitance of the supercapacitor at the time of initial exposure to the thermal environment is about 0.75 or greater, for example, about 0.8 or greater, for example, about 0.85 or greater, for example, about 0.9 or greater, for example, about 0.95 or greater. This ratio can be 1 or less, for example, about 0.99 or less, for example, about 0.98 or less, for example, about 0.96 or less, for example, about 0.94 or less, for example, about 0.92 or less, for example, about 0.9 or less, for example, about 0.88 or less, for example, about 0.86 or less, for example, about 0.84 or less, for example, about 0.82 or less.

[0131] Such high capacitance values ​​can be maintained under a variety of extreme conditions (e.g., when voltage is applied and / or in humid environments). For example, the ratio of the capacitance of a supercapacitor after exposure to a thermal environment (e.g., 65°C, 85°C, or 105°C) and after the application of voltage to the initial capacitance of the supercapacitor after exposure to a thermal environment but before the application of said voltage can be about 0.60 or greater, e.g., about 0.65 or greater, e.g., about 0.7 or greater, e.g., about 0.75 or greater, e.g., about 0.8 or greater, e.g., about 0.85 or greater, e.g., about 0.9 or greater, e.g., about 0.95 or greater. This ratio can be 1 or less, e.g., about 0.99 or less, e.g., about 0.98 or less, e.g., about 0.96 or less, e.g., about 0.94 or less, e.g., about 0.92 or less, e.g., about 0.9 or less, e.g., about 0.88 or less, e.g., about 0.86 or less, e.g., about 0.84 or less, e.g., about 0.82 or less. The voltage can be, for example, about 1 volt or higher, in some embodiments about 1.5 volts or higher, and in some embodiments from about 2 volts to about 10 volts (e.g., 2.1 volts). In one embodiment, for example, the ratio described above can be maintained for 1008 hours or longer.

[0132] The supercapacitor can also maintain the aforementioned capacitance value when exposed to high humidity levels (e.g., when placed in contact with an environment of relative humidity of about 40% or higher, in some embodiments when placed in contact with an environment of relative humidity of about 45% or higher, in some embodiments when placed in contact with an environment of relative humidity of about 50% or higher, and in some embodiments when placed in contact with an environment of relative humidity of about 70% or higher (e.g., about 85% to 100%)). Relative humidity can be determined, for example, according to Method A (2007) of ASTM E337-02. For example, the ratio of the capacitance value of the supercapacitor after exposure to a thermal environment (e.g., 65°C, 85°C, or 105°C) and high humidity (e.g., 85%) to the initial capacitance value of the supercapacitor before exposure to the thermal environment but before exposure to high humidity can be about 0.7 or greater, for example, about 0.75 or greater, for example, about 0.8 or greater, for example, about 0.85 or greater, for example, about 0.9 or greater, for example, about 0.95 or greater. The ratio can be 1 or less, for example, about 0.99 or less, for example, about 0.98 or less, for example, about 0.96 or less, for example, about 0.94 or less, for example, about 0.92 or less, for example, about 0.9 or less, for example, about 0.88 or less, for example, about 0.86 or less, for example, about 0.84 or less, for example, about 0.82 or less. In one embodiment, for example, the ratio can be maintained for 1008 hours or longer.

[0133] As described above, the ESR can also remain stable at this temperature for a considerable period of time. For example, in one embodiment, the ratio of the ESR of the supercapacitor after exposure to a thermal environment (e.g., 65°C, 85°C, or 105°C) for one or more of the aforementioned time periods to the ESR of the supercapacitor when it was initially exposed to the thermal environment is about 1.6 or less, for example, about 1.5 or less, for example, about 1.4 or less, for example, about 1.3 or less, for example, about 1.2 or less, for example, about 1.1 or less, for example, about 1.0 or less. This ratio can be about 0.2 or greater, for example, about 0.3 or greater, for example, about 0.4 or greater, for example, about 0.5 or greater, for example, about 0.6 or greater, for example, about 0.7 or greater, for example, about 0.8 or greater, for example, about 0.9 or greater, for example, about 1.0 or greater. It is worth noting that such a low ESR value can also be maintained under a variety of extreme conditions (e.g., as described above, when high voltage is applied and / or in a humid environment).

[0134] It is noteworthy that such low ESR values ​​can be maintained under a variety of extreme conditions (e.g., when high voltage is applied and / or in humid environments, as described above). For example, the ratio of the ESR of a supercapacitor after exposure to a thermal environment (e.g., 65°C, 85°C, or 105°C) to the initial ESR of the supercapacitor when exposed to a thermal environment but before voltage is applied can be about 1.8 or less, for example, about 1.7 or less, for example, about 1.6 or less, for example, about 1.5 or less, for example, about 1.4 or less, for example, about 1.3 or less, for example, about 1.2 or less, for example, about 1.1 or less, for example, about 1 or less, for example, about 0.9 or less, for example, about 0.8 or less, for example, about 0.7 or less, for example, about 0.6 or less, for example, about 0.5 or less. This ratio can be about 0.2 or greater, for example, about 0.3 or greater, for example, about 0.4 or greater, for example, about 0.5 or greater, for example, about 0.6 or greater, for example, about 0.7 or greater, for example, about 0.8 or greater, for example, about 0.9 or greater, for example, about 1 or greater, for example, about 1.1 or greater, for example, about 1.2 or greater, for example, about 1.3 or greater, for example, about 1.4 or greater, for example, about 1.5 or greater. In one embodiment, for example, the ratio described above can be maintained for 1008 hours or longer.

[0135] Supercapacitors can also maintain the ESR values ​​described above when exposed to high humidity levels. For example, the ratio of the ESR of a supercapacitor after exposure to a thermal environment (e.g., 65°C, 85°C, or 105°C) and high humidity (e.g., 85%) to the initial capacitance value of the supercapacitor before exposure to the thermal environment but before exposure to high humidity can be about 1.5 or less, such as about 1.4 or less, such as about 1.2 or less, such as about 1.1 or less, such as about 1 or less, such as about 0.9 or less, such as about 0.8 or less, such as about 0.7 or less, such as about 0.6 or less, such as about 0.5. The ratio can be about 0.2 or greater, for example, about 0.3 or greater, for example, about 0.4 or greater, for example, about 0.5 or greater, for example, about 0.6 or greater, for example, about 0.7 or greater, for example, about 0.8 or greater, for example, about 0.9 or greater, for example, about 1 or greater, for example, about 1.1 or greater, for example, about 1.2 or greater, for example, about 1.3 or greater. In one embodiment, for example, the ratio can be maintained for 1008 hours or longer.

[0136] Supercapacitors can also have relatively low leakage current. Typically, "leakage current" is the amount of current flowing through a capacitor at a given direct current (DC) voltage (e.g., at the rated DC voltage of the supercapacitor). In this respect, when tested at 70°C with an output current of 10 mA / F and a charging voltage of 2.7 V, the maximum leakage current can be 100 mA or less, e.g., 80 mA or less, e.g., 50 mA or less, e.g., 45 mA or less, e.g., 40 mA or less, e.g., 30 mA or less, e.g., 20 mA or less, e.g., 10 mA or less.

[0137] Furthermore, the supercapacitors disclosed herein can be used in a variety of ways for a variety of applications. In one embodiment, the supercapacitor can be mounted on a circuit board (e.g., a printed circuit board). In this respect, the disclosure can also relate to circuit boards including supercapacitors as defined herein. Typically, the circuit board includes a substrate (e.g., an insulating layer) having an upper and lower surface and a plurality of current paths defined therein. Each conductive component of the supercapacitor can be electrically communicated with a predetermined current path of the circuit board. Additionally, any method known in the art (e.g., common soldering techniques) can be used to physically connect the conductive components of the supercapacitor to the circuit board.

[0138] The supercapacitors and circuit boards disclosed herein can be used in a wide range of applications. As an example, these applications can include various communication devices. For instance, they can include Ethernet systems, wireless network routers, fiber optic communication systems, storage devices, mobile devices, computer storage devices (e.g., random access memory (RAM)), etc.

[0139] Test methods Equivalent series resistance (ESR): Equivalent series resistance can be measured using Hiller instruments according to the IEC-62391 (2022) method. The operating frequency is 1 kHz. Multiple temperature and relative humidity levels can be tested. For example, the temperature can be 23°C, 85°C, or 105°C, and the relative humidity can be 25% or 85%.

[0140] Capacitance: Capacitance can be measured using Hiller instruments according to the IEC-62391 (2022) method. Multiple temperature and relative humidity levels can be tested. For example, the temperature can be 23°C, 85°C, or 105°C, and the relative humidity can be 25% or 85%.

[0141] Those skilled in the art can practice these and other modifications and variations of this disclosure without departing from the spirit and scope thereof. Furthermore, it should be understood that aspects of the various embodiments can be interchanged in whole or in part. Moreover, those skilled in the art will understand that the foregoing description is merely illustrative and is not intended to limit the disclosure further described in the appended claims.

Claims

1. A supercapacitor, comprising: Package, the package comprising: A base having an inner base surface and an outer base surface opposite to the inner base surface. A sidewall extending in a direction substantially perpendicular to the base and defining a first upper end and an inner surface of the first sidewall. An internal chamber, the internal chamber being defined between the inner base surface and the inner surface of the first sidewall, and A lid, the lid sealing the internal chamber, The base and the sidewall are formed of liquid crystal polymer. A first conductive member and a second conductive member are disposed in the internal cavity and extend from the base; An electrode assembly positioned within the internal cavity of the package, the electrode assembly including a first electrode and a second electrode, the first electrode electrically connected to a first lead, the second electrode electrically connected to a second lead, the first lead and the second lead extending from the electrode assembly, wherein the first lead is electrically connected to a first conductive member, and the second lead is electrically connected to a second conductive member; and An electrolyte, which is located within the internal cavity of the package.

2. The supercapacitor according to claim 1, wherein, The cover contacts the first upper end and the inner surface of the first side wall.

3. The supercapacitor according to claim 1, wherein, The sidewall further defines a second upper end and a second inner surface of the sidewall, the first upper end being positioned closer to the internal cavity than the second upper end, and the first inner surface of the sidewall being positioned closer to the internal cavity than the second inner surface of the sidewall.

4. The supercapacitor according to claim 1, wherein, The cover contacts the first upper end, the inner surface of the first side wall, and the inner surface of the second side wall.

5. The supercapacitor according to claim 1, wherein, The lid includes a lid chamber adjacent to the inner chamber.

6. The supercapacitor according to claim 1, wherein, The sidewall and the base are integrally formed.

7. The supercapacitor according to claim 1, wherein, The first conductive member and the second conductive member extend through the base to a plane that is substantially parallel to the surface of the outer base.

8. The supercapacitor according to claim 1, wherein, The liquid crystal polymer includes liquid crystal polyester.

9. The supercapacitor according to claim 1, wherein, The liquid crystal polymer is formed from one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; one or more aromatic hydroxycarboxylic acids; or mixtures thereof.

10. The supercapacitor according to claim 1, wherein, The liquid crystal polymer is formed from at least two of the following: one or more aromatic dihydroxy compounds; one or more aromatic dicarboxylic acids; and one or more aromatic hydroxycarboxylic acids.

11. The supercapacitor according to claim 1, wherein, The liquid crystal polymer has a melting temperature of about 250°C or higher to about 400°C or lower, determined using differential scanning calorimetry.

12. The supercapacitor according to claim 1, wherein, The electrode assembly includes a first electrode, a second electrode, and an isolator positioned between the first electrode and the second electrode. The first electrode includes a first current collector electrically coupled to a first carbonaceous coating. The second electrode includes a second current collector electrically coupled to a second carbonaceous coating. Both the first current collector and the second current collector include a substrate, and the substrate includes a conductive metal.

13. The supercapacitor according to claim 12, wherein, The conductive metal is aluminum or an alloy thereof, and / or wherein a plurality of fibrous whiskers protrude outward from the substrate of the first current collector, the substrate of the second current collector, or both.

14. The supercapacitor according to claim 12, wherein, The carbonaceous coating of the first electrode, the second electrode, or a combination thereof comprises activated carbon particles, and (a) wherein at least 50% by volume of the activated carbon particles have a size from about 0.01 micrometers to about 30 micrometers, and / or (b) wherein the activated carbon particles comprise a plurality of pores, wherein the amount of pores with a size of about 2 nanometers or less is about 50% by volume or less of the total pore volume, the amount of pores with a size of about 2 nanometers to about 50 nanometers is about 20% by volume to about 80% by volume of the total pore volume, and the amount of pores with a size of about 50 nanometers or greater is about 1% by volume to about 50% by volume of the total pore volume.

15. The supercapacitor according to claim 1, wherein, The electrolytes include non-aqueous solvents and ionic liquids.

16. The supercapacitor according to claim 15, wherein, The non-aqueous solvent includes a first sulfur-containing compound and a second sulfur-containing compound, wherein the first sulfur-containing compound includes sulfolane or a derivative thereof, and the second sulfur-containing compound includes sulfone.

17. The supercapacitor according to claim 16, wherein, The electrolyte also includes lithium metal salts.

18. The supercapacitor according to claim 16, wherein, The electrolyte has a melting point ranging from -50°C to 100°C.

19. A circuit board comprising a supercapacitor according to claim 1.

20. A communication device comprising the supercapacitor according to claim 1.

21. A supercapacitor, comprising: Package, the package comprising: A base having an inner base surface and an outer base surface opposite to the inner base surface. A sidewall extending in a direction substantially perpendicular to the base, defining a first upper end, a second upper end, an inner surface of the first sidewall, and an inner surface of the second sidewall. An internal chamber is defined between the inner base surface and the inner surface of the first sidewall, wherein the first upper end and the inner surface of the first sidewall are positioned closer to the internal chamber than the second upper end and the inner surface of the second sidewall. The lid, which closes the internal cavity, contacts the first upper end, the inner surface of the first sidewall, and the inner surface of the second sidewall. A first conductive member and a second conductive member are disposed in the internal cavity and extend from the base; An electrode assembly positioned within the internal cavity of the package, the electrode assembly including a first electrode and a second electrode, the first electrode electrically connected to a first lead, the second electrode electrically connected to a second lead, the first lead and the second lead extending from the electrode assembly, wherein the first lead is electrically connected to a first conductive member, and the second lead is electrically connected to a second conductive member; and An electrolyte, which is located within the internal cavity of the package.

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